CN105242424A - Base plate structure - Google Patents
Base plate structure Download PDFInfo
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- CN105242424A CN105242424A CN201410322554.3A CN201410322554A CN105242424A CN 105242424 A CN105242424 A CN 105242424A CN 201410322554 A CN201410322554 A CN 201410322554A CN 105242424 A CN105242424 A CN 105242424A
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- Prior art keywords
- board structure
- substrate
- knitting layer
- joint sheet
- arrangements
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Abstract
A base plate structure comprises a first base plate, a plurality of first bonding pads and a first bonding layer, wherein the first base plate is provided with an element configuration area and a periphery area; the periphery area is adjacently set on the outer periphery of the element configuration area; the first bonding pads are set on the periphery area at interval; a clearance is set between two adjacent first bonding pads; the bonding layer is set on the first base plate and the bonding layer covers the first bonding pads and the clearances; and the bonding layer adjacent to the element configuration area is provided with a plurality of first arc-shaped edges. After the base plate structure is used for a long time, the bonding layer can effectively prevent moisture or oxygen from entering, thus the first bonding pads are avoided from being rusted and the bonding adhesiveness is better.
Description
Technical field
The present invention about a kind of board structure, especially in regard to a kind of board structure that can be electrically connected with a circuit board.
Background technology
Along with the progress of science and technology, flat display apparatus is used in various field widely, such as liquid crystal indicator, because having that build is frivolous, low power consumption and the advantageous characteristic such as radiationless, gradually replace conventional cathode ray tube display device, and be applied in the electronic product of numerous species, such as mobile phone, portable multimedia device, notebook computer or panel computer etc.
Wherein, to control the element on thin film transistor base plate, in order to control signal to be sent to the element be arranged on glass substrate by the control circuit board of outside, general meeting arranges a joint sheet (bondingpads) prior to the edge of thin film transistor base plate, after being coated with one deck conducting resinl again on joint sheet, corresponding hot press is carried out with control circuit board, control signal is made to be sent on thin film transistor base plate by control circuit board, conducting resinl and joint sheet by outside, whereby to the action that element controls.
But, in prior art, conducting resinl for being engaged with control circuit board by joint sheet only covers joint sheet simply, after using for a long time, conducting resinl possibly effectively cannot stop that moisture or oxygen enter and contact joint gasket, cause the corrosion of joint sheet, generation problem in the transmission making control signal, and then cause the fault of equipment.
Summary of the invention
Object of the present invention, for providing a kind of board structure, except can effectively stop moisture or oxygen to enter joint sheet and avoid causing except corrosion, also can have and preferably engage stickability.
Technical scheme of the present invention is to provide a kind of board structure, and this board structure comprises a first substrate, multiple first joint sheet and a knitting layer.First substrate has an element configuring area and a surrounding zone, and surrounding zone is adjacent to the periphery in arrangements of components district.These the first joint sheet intervals are configured at surrounding zone, and have a gap between two these first joint sheets adjacent.Knitting layer is arranged on first substrate, and covers these first joint sheets and these gaps, and the knitting layer of neighbouring element configuring area has multiple first curved edge.
In one embodiment, these first joint sheets configure along an interval, direction.
In one embodiment, these first curved edges correspond respectively between these gaps.
In one embodiment, these the first curved edges breadth extreme in the direction of one of them, is greater than corresponding gap breadth extreme in the direction.
In one embodiment, these first joint sheets have multiple first edges of neighbouring element configuring area, and knitting layer covers these the first edges.
In one embodiment, these first joint sheets have more multiple second edges relative with these the first edges, and knitting layer covers these the second edges.
In one embodiment, the knitting layer away from arrangements of components district has multiple second curved edge.
In one embodiment, board structure also comprises a second substrate, and it is connected with first substrate by knitting layer, and second substrate has multiple second joint sheet, and these second joint sheets are corresponding with these first joint sheets respectively arranges and be electrically connected.
In one embodiment, board structure more comprises multiple drive electrode and multiple sensing electrode, is arranged at arrangements of components district respectively.
In one embodiment, first substrate is a protective substrate or a colored optical filtering substrates or a thin film transistor base plate.
From the above, because of in board structure of the present invention, the surrounding zone of first substrate is adjacent to the periphery in arrangements of components district, and these the first joint sheet intervals are configured at surrounding zone, and has a gap between two these first joint sheets adjacent.In addition, knitting layer is arranged on first substrate, and covers these first joint sheets and these gaps, and the knitting layer of neighbouring element configuring area has multiple first curved edge.Cover these first joint sheets and these gaps by knitting layer, and the knitting layer being adjacent to arrangements of components district has multiple first curved edge, make knitting layer can more intactly protect the first joint sheet.Therefore, compared to prior art, board structure of the present invention is after using for a long time, and knitting layer can stop that moisture or oxygen enter effectively, therefore, except can avoiding the corrosion of the first joint sheet, more can have and preferably engage stickability.
Accompanying drawing explanation
Figure 1A is the schematic top plan view of a kind of board structure of present pre-ferred embodiments.
Figure 1B is the enlarged schematic partial view of the board structure of Figure 1A.
Fig. 1 C is in Figure 1B, the cross-sectional schematic of straight line A-A.
Fig. 2 A is the enlarged schematic partial view of the board structure of another enforcement aspect of the present invention.
Fig. 2 B is in Fig. 2 A, the cross-sectional schematic of straight line B-B.
Main element symbol description
1,1a: board structure
11: first substrate
111: arrangements of components district
112: surrounding zone
12: the first joint sheets
13,13a: knitting layer
131: the first curved edges
132: the second curved edges
14: second substrate
141: the second joint sheets
A-A, B-B: straight line
C: wire
E1: the first edge
E2: the second edge
L1, L2: breadth extreme
X, Y, Z: direction
Embodiment
Hereinafter with reference to correlative type, the board structure according to present pre-ferred embodiments is described, wherein identical element is illustrated with identical reference marks.The diagram just signal of all enforcement aspects of the present invention, does not represent full-size(d) and ratio.
Please refer to shown in Figure 1A to Fig. 1 C, wherein, Figure 1A is the schematic top plan view of a kind of board structure 1 of present pre-ferred embodiments, and Figure 1B is the enlarged schematic partial view of the board structure 1 of Figure 1A, and Fig. 1 C is in Figure 1B, the cross-sectional schematic of straight line A-A.
Board structure 1 comprises a first substrate 11, multiple first joint sheet 12 and knitting layer 13.In addition, the board structure 1 of the present embodiment more comprises a second substrate 14.But, in order to clearly demonstrate the present invention, Figure 1A only shows first substrate 11 and the relativeness of second substrate 14, does not show other elements (these first joint sheets 12, knitting layer 13 and these wires C), and the second substrate 14 of Figure 1B display is represented by dotted lines it.In addition, Figure 1A system is for two second substrates 14.
First substrate 11 has an element configuring area (being commonly called as in face) 111 and a surrounding zone (being commonly called as outside face) 112, and surrounding zone 112 is adjacent to the periphery in arrangements of components district 111.In the present embodiment, arrangements of components district 111 is positioned at the zone line of first substrate 11, and for circuit structure arrange region, 112, surrounding zone is surrounded on the periphery in arrangements of components district 111.Wherein, first substrate 11 can be made by light-permeable material, and its material is such as glass, quartz or analog, plastics, rubber, glass fibre or other macromolecular materials; Or first substrate 11 also can be made by light tight material, and be such as metal-glass fiber composite plate, metal-ceramic composite plate, or printed circuit board (PCB), or other materials, do not limit.Special one carries, and arrangements of components district 111 represents that it is the region that circuit structure or element (device) are arranged, if only the simple place arranging conducting wire in order to conduct electricity not is arrangements of components district 111 of the present invention.For example, as shown in Figure 1A, if when arranging multiple drive electrode and multiple sensing electrode (Tx and the Rx be namely commonly called as) in arrangements of components district 111, first substrate 11 can be made to become substrate that one has touch controllable function.Or in various embodiments, if when arranging the element such as thin film transistor (TFT) or pixel electrode in the arrangements of components district 111 of first substrate 11, then first substrate 11 can become a thin film transistor base plate and be applied to plane and shows on device.
As shown in Figure 1B and Fig. 1 C, these the first joint sheet 12 intervals are configured at surrounding zone 112, and have a gap (gap) between two these first joint sheets 12 adjacent.In the present embodiment, on the surrounding zone 112 of first substrate 11 lower left side, be configured with the first multiple joint sheets 12, and these first joint sheets 12 configure along an X interval, direction, make, between two adjacent first joint sheets 12, all there is a gap.Wherein, the plan view shape of the first joint sheet 12 is for example and without limitation to square, and be for example and without limitation to transparency conducting layer (such as ITO or IZO) and formed, and be electrically connected with the element arranged in arrangements of components district 111 by wire C (material is such as copper).
Knitting layer 13 is such as arranged on first substrate 11 with coating method, and covers these first joint sheets 12 and these gaps completely.Wherein, knitting layer 13 can be for example and without limitation to anisotropic conducting rubber (AnisotropicConductiveFilm, ACF).Anisotropic conducting rubber is synthesized by resin and conducting particles to form, and is mainly used in connection two kinds of different substrate materials and circuit.Anisotropic conducting rubber has upper and lower electrically conducting, but the characteristic of left and right plane insulation, and have excellent damp proof, then, the function such as conduction and insulation.In various embodiments, knitting layer 13 also can be adhesion glue).
In the present embodiment, these first joint sheets 12 have multiple first edge (edge) E1 of neighbouring element configuring area 111, and knitting layer 13 covers these first edges E1 completely.Knitting layer 13 is except covering the gap between these the first edge E1 of these the first joint sheets 12 and these the first joint sheets 12 completely, knitting layer 13 also extends toward the direction in arrangements of components district 111, and the edge being adjacent to the knitting layer 13 in arrangements of components district 111 has multiple first curved edge 131.Wherein, these first curved edges 131 correspond respectively between these gaps.Preferably, these first curved edges 131 and these gaps are corresponding one to one, and the summit of each the first curved edge 131 corresponds respectively to the centre position in a gap." curved edge " of the present invention might not be the edge of circular arc, as long as the summit of the curved edge curvilinear shaped edges outstanding compared with both sides is all the so-called curved edge of the present invention.
In addition, these first curved edges 131 of one of them are greater than the breadth extreme L2 of corresponding gap along direction X along the breadth extreme L1 of direction X.The present embodiment is all greater than the breadth extreme L2 of corresponding gap along direction X with each first curved edge 131 along the breadth extreme L1 of direction X.Certainly, in various embodiments, also the breadth extreme L1 of the first curved edge 131 of part can be greater than the breadth extreme L2 of corresponding gap along direction X, but the breadth extreme L1 of first curved edge 131 of another part is less than or equal to the breadth extreme L2 of corresponding gap along direction X.
Second substrate 14 is connected with first substrate 11 by knitting layer 13.In this, second substrate 14 such as utilizes hot press in first substrate 11.Wherein, second substrate 14 has multiple second joint sheet 141, and these second joint sheets 141 are corresponding with these first joint sheets 12 respectively arranges and be electrically connected.Be oppositely arranged with the first corresponding joint sheet 12 by the second joint sheet 141, and by knitting layer 13, the first joint sheet 12 can be made to be electrically connected with the second joint sheet 141, to carry out the transmission of signal.The second substrate 14 of the present embodiment is for example and without limitation to flexible printed wiring board (FlexiblePrintCircuit, FPC), and the material of the second joint sheet 141 is such as copper.But, in other examples, second substrate 14 also can be the circuit board of other patterns, such as printed circuit board (PCB) (PCB) or Rigid Flex.Therefore, the signal of electricity transmits between first substrate 11 and second substrate 14 by wire C, the first joint sheet 12, knitting layer 13 and the second joint sheet 141.
Hold; be arranged on first substrate 11 by knitting layer 13; and cover these first joint sheets 12 and these gaps completely, and the knitting layer 13 being adjacent to arrangements of components district 111 has multiple first curved edge 131, makes knitting layer 13 more intactly can protect the first joint sheet 12.Therefore, compared to prior art, the board structure 1 of the present embodiment is after using for a long time, knitting layer 13 can stop that moisture or oxygen enter effectively, therefore, except can avoiding the corrosion of the first joint sheet 12, more can have and preferably engage stickability with second substrate 14.
In addition, please refer to shown in Fig. 2 A and Fig. 2 B, wherein, Fig. 2 A is the enlarged schematic partial view of the board structure 1a of another enforcement aspect of the present invention, and Fig. 2 B is in Fig. 2 A, the cross-sectional schematic of straight line B-B.
Be from main different of the board structure 1 of Figure 1A, in board structure 1a, these first joint sheets 12 have the multiple second edge E2s (second edge E2 away from arrangements of components district 111) relative with its these the first edge E1, and these second edges E2 is not positioned at the edge of first substrate 11, but in the region of surrounding zone 112, therefore, knitting layer 13a can toward covering these second edges E2 away from arrangements of components district 111 extends.In addition, the knitting layer 13a away from arrangements of components district 111 has multiple second curved edge 132 (being also positioned at the region of surrounding zone 112).Wherein, the first curved edge 131 and the second curved edge 132 are relative configuration, and its quantity can be identical or not identical.In this, be with identical, and be example one to one.All there is curved edge by the knitting layer 13a of the relative both sides in these the first joint sheets 12, more effectively can stop that moisture or oxygen enter and contacts these the first joint sheets 12.
In addition, the other technologies feature of board structure 1a can refer to the similar elements of board structure 1, repeats no more in this.
One carry, above-mentioned board structure 1 (or 1a) can be applicable on such as contact panel, display panel or touch-control display panel, or also can be applicable on other forms of board structure again.
For contact panel, if during plug-in (Out-Cell) formula contact panel, then first substrate is such as a glass substrate, and the circuit structure arranged in arrangements of components district can be touch control sensing circuit (comprising multiple drive electrode and multiple sensing electrode).Therefore, the board structure and a display panel with touch control sensing circuit can be combined into is a touch-control display panel (can arrange a cover glass (CoverLens) again and protect touch-control display panel).But, in the aspect of OGS formula contact panel, the first substrate itself with touch control sensing circuit is protective substrate, does not need separately to arrange CoverLens.
When the aspect of outer (On-Cell) formula contact panel, first substrate is such as a colored optical filtering substrates, and circuit structure is touch control sensing circuit, and be formed directly on the outer surface of colored optical filtering substrates, and to be combined into thin film transistor base plate be a touch-control display panel (both can a sandwiched liquid crystal layer).
When the aspect of embedded (In-Cell) formula contact panel, first substrate is such as colored optical filtering substrates, and circuit structure is touch control sensing circuit, and can be formed directly in colored optical filtering substrates relative to thin film transistor base plate side on the surface; Or first substrate also can be thin film transistor base plate, and circuit structure is touch control sensing circuit, and can be formed directly at thin film transistor base plate in the face of the side of colored optical filtering substrates on the surface.
In addition, in another embodiment, first substrate is such as thin film transistor base plate, and circuit structure is such as display circuit structure (comprising array architecture of thin film transistor and other elements), therefore, board structure can be applicable to display panel, such as, on liquid crystal display (LCD) panel or Organic Light Emitting Diode (OLED) display panel, to be controlled the circuit component on thin film transistor base plate by second substrate.
In sum, because of in board structure of the present invention, the surrounding zone of first substrate is adjacent to the periphery in arrangements of components district, and these the first joint sheet intervals are configured at surrounding zone, and has a gap between two these first joint sheets adjacent.In addition, knitting layer is arranged on first substrate, and covers these first joint sheets and these gaps, and the knitting layer of neighbouring element configuring area has multiple first curved edge.Cover these first joint sheets and these gaps by knitting layer, and the knitting layer being adjacent to arrangements of components district has multiple first curved edge, make knitting layer can more intactly protect the first joint sheet.Therefore, compared to prior art, board structure of the present invention is after using for a long time, and knitting layer can stop that moisture or oxygen enter effectively, therefore, except can avoiding the corrosion of the first joint sheet, more can have and preferably engage stickability.
The foregoing is only illustrative, but not be restricted person.Anyly do not depart from spirit of the present invention and category, and to its equivalent modifications of carrying out or change, all should be contained in claim.
Claims (10)
1. a board structure, is characterized in that, described board structure comprises:
One first substrate, have an element configuring area and a surrounding zone, this surrounding zone is adjacent to the periphery in this arrangements of components district;
Multiple first joint sheet, interval is configured at this surrounding zone, and has a gap between two adjacent described first joint sheets; And
One knitting layer, is arranged on this first substrate, and covers described first joint sheet and described gap, and this knitting layer in this arrangements of components district contiguous has multiple first curved edge.
2. board structure as claimed in claim 1, it is characterized in that, described first joint sheet configures along an interval, direction.
3. board structure as claimed in claim 2, it is characterized in that, described first curved edge corresponds respectively between described gap.
4. board structure as claimed in claim 3, is characterized in that, the described first curved edge breadth extreme in the direction of one of them, is greater than corresponding this gap breadth extreme in the direction.
5. board structure as claimed in claim 1, is characterized in that, described first joint sheet has multiple first edges in this arrangements of components district contiguous, and this knitting layer covers described first edge.
6. board structure as claimed in claim 5, it is characterized in that, described first joint sheet has more multiple second edges relative with described first edge, and this knitting layer covers described second edge.
7. board structure as claimed in claim 1, it is characterized in that, this knitting layer away from this arrangements of components district has multiple second curved edge.
8. board structure as claimed in claim 1, it is characterized in that, described board structure also comprises:
One second substrate, is connected with this first substrate by this knitting layer, and this second substrate has multiple second joint sheet, and described second joint sheet is corresponding with described first joint sheet respectively arranges and be electrically connected.
9. board structure as claimed in claim 1, it is characterized in that, described board structure also comprises:
Multiple drive electrode and multiple sensing electrode, be arranged at this arrangements of components district respectively.
10. board structure as claimed in claim 1, it is characterized in that, this first substrate is a protective substrate, a colored optical filtering substrates or a thin film transistor base plate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410322554.3A CN105242424B (en) | 2014-07-08 | 2014-07-08 | Board structure |
| CN201910002410.2A CN109521587A (en) | 2014-07-08 | 2014-07-08 | Board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410322554.3A CN105242424B (en) | 2014-07-08 | 2014-07-08 | Board structure |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910002410.2A Division CN109521587A (en) | 2014-07-08 | 2014-07-08 | Board structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105242424A true CN105242424A (en) | 2016-01-13 |
| CN105242424B CN105242424B (en) | 2019-02-12 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910002410.2A Pending CN109521587A (en) | 2014-07-08 | 2014-07-08 | Board structure |
| CN201410322554.3A Active CN105242424B (en) | 2014-07-08 | 2014-07-08 | Board structure |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910002410.2A Pending CN109521587A (en) | 2014-07-08 | 2014-07-08 | Board structure |
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| CN (2) | CN109521587A (en) |
Citations (4)
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| CN101060205A (en) * | 2006-04-18 | 2007-10-24 | Nec液晶技术株式会社 | Flat display panel and connection structure |
| US20080232047A1 (en) * | 2007-03-19 | 2008-09-25 | Epson Imaging Devices Corporation | Mounting structure, electro-optical device, input device, method of manufacturing mounting structure, and electronic apparatus |
| JP2009158766A (en) * | 2007-12-27 | 2009-07-16 | Panasonic Corp | Wiring board and connection method |
| CN204065604U (en) * | 2014-07-08 | 2014-12-31 | 群创光电股份有限公司 | Board structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW486721B (en) * | 2000-08-30 | 2002-05-11 | Acer Display Tech Inc | Plasma display having auxiliary bonding pad |
| JP2007165744A (en) * | 2005-12-16 | 2007-06-28 | Epson Imaging Devices Corp | Semiconductor device, mounting structure, electrooptical device, method of manufacturing semiconductor device, method of manufacturing mounting structure, method of manufacturing electrooptical device, and electronic equipment |
| KR101419229B1 (en) * | 2007-11-28 | 2014-07-15 | 엘지디스플레이 주식회사 | Display device and method of manufacturing the same |
| CN101526676A (en) * | 2008-03-06 | 2009-09-09 | 北京京东方光电科技有限公司 | Pin bonding structure |
| CN102314009A (en) * | 2011-09-09 | 2012-01-11 | 深圳市华星光电技术有限公司 | Liquid crystal display module and liquid crystal display panel |
| CN102364383B (en) * | 2011-10-20 | 2014-05-21 | 深圳市华星光电技术有限公司 | Liquid crystal display panel, flexible circuit board and liquid crystal display device |
| CN103367947A (en) * | 2012-04-10 | 2013-10-23 | 宸鸿科技(厦门)有限公司 | Connection structure |
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2014
- 2014-07-08 CN CN201910002410.2A patent/CN109521587A/en active Pending
- 2014-07-08 CN CN201410322554.3A patent/CN105242424B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101060205A (en) * | 2006-04-18 | 2007-10-24 | Nec液晶技术株式会社 | Flat display panel and connection structure |
| US20080232047A1 (en) * | 2007-03-19 | 2008-09-25 | Epson Imaging Devices Corporation | Mounting structure, electro-optical device, input device, method of manufacturing mounting structure, and electronic apparatus |
| JP2009158766A (en) * | 2007-12-27 | 2009-07-16 | Panasonic Corp | Wiring board and connection method |
| CN204065604U (en) * | 2014-07-08 | 2014-12-31 | 群创光电股份有限公司 | Board structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109521587A (en) | 2019-03-26 |
| CN105242424B (en) | 2019-02-12 |
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