CN105242424A - Substrate structure - Google Patents

Substrate structure Download PDF

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CN105242424A
CN105242424A CN 201410322554 CN201410322554A CN105242424A CN 105242424 A CN105242424 A CN 105242424A CN 201410322554 CN201410322554 CN 201410322554 CN 201410322554 A CN201410322554 A CN 201410322554A CN 105242424 A CN105242424 A CN 105242424A
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substrate
bonding
plurality
substrate structure
edge
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CN 201410322554
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Chinese (zh)
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刘佳秤
张嘉雄
汪安昌
王兆祥
陈扬证
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群创光电股份有限公司
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Abstract

A base plate structure comprises a first base plate, a plurality of first bonding pads and a first bonding layer, wherein the first base plate is provided with an element configuration area and a periphery area; the periphery area is adjacently set on the outer periphery of the element configuration area; the first bonding pads are set on the periphery area at interval; a clearance is set between two adjacent first bonding pads; the bonding layer is set on the first base plate and the bonding layer covers the first bonding pads and the clearances; and the bonding layer adjacent to the element configuration area is provided with a plurality of first arc-shaped edges. After the base plate structure is used for a long time, the bonding layer can effectively prevent moisture or oxygen from entering, thus the first bonding pads are avoided from being rusted and the bonding adhesiveness is better.

Description

基板结构 Substrate structure

技术领域 FIELD

[0001 ] 本发明关于一种基板结构,特别关于一种可与一电路板电连接的基板结构。 [0001] The present invention relates to a substrate structure, and particularly relates to a substrate structure and a circuit board can be connected electrically.

背景技术 Background technique

[0002] 随着科技的进步,平面显示装置已经广泛的被运用在各种领域,例如液晶显示装置,因具有体型轻薄、低功率消耗及无辐射等优越特性,已经渐渐地取代传统阴极射线管显示装置,而应用至许多种类的电子产品中,例如移动电话、可携式多媒体装置、笔记本电脑或平板电脑等等。 [0002] As technology advances, planar devices have been widely used in various fields are displayed, for example, a liquid crystal display device, due to the thin body having superior characteristics, low power consumption and no radiation, have been gradually replacing conventional cathode ray tube a display device, and applied to many kinds of electronic products, such as mobile phones, portable multimedia device, a notebook computer, or a tablet computer.

[0003] 其中,以控制薄膜晶体管基板上的元件为例,为了将控制信号由外部的控制电路板传送至设置于玻璃基板上的元件,一般会先于薄膜晶体管基板的边缘处设置一接合垫(bonding pads),再于接合垫上涂布一层导电胶后,与控制电路板进行对应的热压接合,使控制信号可通过控制电路板、导电胶及接合垫由外部传送至薄膜晶体管基板上,借此对元件进行控制的动作。 [0003] wherein the control element to the thin film transistor substrate, for example, by an external control signal to the control circuit board is transmitted to the element disposed on the glass substrate, generally to a bonding pad provided at an edge of the thin film transistor substrate (bonding pads), and then after the bonding pad coated with a layer of conductive adhesive, and thermocompression bonding the control circuit board corresponding to the control signal through the control circuit board, and the bonding pads by a conductive adhesive to the external transfer thin film transistor substrate , whereby the operation of the controlling element.

[0004] 然而,于现有技术中,用于将接合垫与控制电路板接合的导电胶只简单地覆盖在接合垫上,经过长时间的使用后,导电胶可能无法有效阻挡水分或氧气进入而接触接合垫,造成接合垫的锈蚀,使得控制信号的传递上发生问题,进而造成设备的故障。 [0004] However, in the prior art, the conductive paste for bonding pads and the control circuit board is simply engaged in the bond pads cover, after a long period of use, the conductive adhesive may not effectively block entry of moisture or oxygen engaging the contact pads, causing corrosion engagement pads, so that the problem of transmitting the control signal, thereby causing equipment failure.

发明内容 SUMMARY

[0005] 本发明的目的为提供一种基板结构,除了可有效阻止水分或氧气进入接合垫而避免造成锈蚀之外,还可具有较佳的接合粘着性。 [0005] The object of the present invention is to provide a substrate structure, in addition to effectively prevent moisture or oxygen from entering outside the bonding pads and avoid corrosion, may have a better bonding adhesion.

[0006] 本发明的技术方案是提供一种基板结构,该基板结构包括一第一基板、多个第一接合垫以及一接合层。 [0006] aspect of the present invention is to provide a substrate structure, the substrate structure includes a first substrate, a plurality of first bonding pads and the bonding layer. 第一基板具有一元件配置区及一周边区,周边区邻设于元件配置区的外围。 A substrate having a first element disposed region and a peripheral region, the peripheral region disposed adjacent to the peripheral device region. 这些第一接合垫间隔配置于周边区,且两相邻这些第一接合垫之间具有一间隙。 The first bonding pads arranged at intervals in the peripheral region, and these two neighboring first bonding pad having a gap between. 接合层设置于第一基板上,并覆盖这些第一接合垫及这些间隙,且邻近元件配置区的接合层具有多个第一弧形边缘。 The bonding layer disposed on the first substrate, and a first bonding pad and cover the gaps, and a bonding layer disposed adjacent to the element region having a plurality of first arcuate edge.

[0007] 在一实施例中,这些第一接合垫沿一方向间隔配置。 [0007] In one embodiment, the first bonding pads arranged in a spacing direction.

[0008] 在一实施例中,这些第一弧形边缘分别对应于这些间隙之间。 [0008] In one embodiment, a first arcuate edge which respectively correspond to between the gaps.

[0009] 在一实施例中,其中之一的这些第一弧形边缘沿该方向的最大宽度,大于对应的间隙沿该方向的最大宽度。 [0009] In one embodiment, the maximum width of the arcuate edge of one of a first direction wherein the direction is greater than the maximum width of the gap corresponding to this direction.

[0010] 在一实施例中,这些第一接合垫具有邻近元件配置区的多个第一边缘,且接合层覆盖这些第一边缘。 [0010] In one embodiment, the first bonding pad having a plurality of elements arranged adjacent to a first edge region, and a first bonding layer cover the edge.

[0011] 在一实施例中,这些第一接合垫更具有与这些第一边缘相对的多个第二边缘,且接合层覆盖这些第二边缘。 [0011] In one embodiment, the first bonding pads more of these plurality of first edge opposite a second edge, and a second bonding layer which covers the edge.

[0012] 在一实施例中,远离元件配置区的接合层具有多个第二弧形边缘。 [0012] In one embodiment, the device region remote from the bonding layer having a plurality of second arcuate edge.

[0013] 在一实施例中,基板结构还包括一第二基板,其通过接合层与第一基板连接,第二基板具有多个第二接合垫,且这些第二接合垫分别与这些第一接合垫对应设置并电连接。 [0013] In one embodiment, the substrate structure further includes a second substrate, which is connected to the first substrate by a bonding layer, a second substrate having a plurality of second bonding pads, bonding pads and the second respectively the first bonding pads and electrically connected to the corresponding set.

[0014] 在一实施例中,基板结构更包括多个驱动电极及多个感测电极,分别设置于元件配置区。 [0014] In one embodiment, the substrate structure further comprises a plurality of driving electrodes and a plurality of sensing electrodes are disposed in the device region.

[0015] 在一实施例中,第一基板为一保护基板、或一彩色滤光基板、或一薄膜晶体管基板。 [0015] In one embodiment, the protective substrate is a first substrate, or a color filter substrate, or a thin film transistor substrate.

[0016] 承上所述,因本发明的基板结构中,第一基板的周边区邻设于元件配置区的外围,而这些第一接合垫间隔配置于周边区,且两相邻这些第一接合垫之间具有一间隙。 [0016] on the bearing, due to the substrate structure according to the present invention, the peripheral region of the first substrate is disposed adjacent to the peripheral region of the element configuration, the first bonding pads which are spaced in the peripheral region, and these two adjacent first a gap between the bonding pad. 另外,接合层设置于第一基板上,并覆盖这些第一接合垫及这些间隙,且邻近元件配置区的接合层具有多个第一弧形边缘。 Further, the bonding layer disposed on the first substrate, and a first bonding pad and cover the gaps, and a bonding layer disposed adjacent to the element region having a plurality of first arcuate edge. 通过接合层覆盖这些第一接合垫及这些间隙,且邻近于元件配置区的接合层具有多个第一弧形边缘,使得接合层可较完整地保护第一接合垫。 Through the bonding layer which covers the first bonding pad and the gaps, and adjacent to a plurality of first arcuate edge disposed in the region of the bonding layer element, so that the bonding layer may be more completely protects the first bonding pad. 因此,相较于现有技术,本发明的基板结构经过长时间使用后,接合层可有效地阻挡水分或氧气进入,因此,除了可避免第一接合垫的锈蚀之外,更可具有较佳的接合粘着性。 Thus, compared to the prior art, the substrate structure according to the present invention, after prolonged use, the bonding layer can effectively block moisture or oxygen from entering, thus, can be avoided in addition to the first bonding pads outside corrosion, it may have a more preferred bonding adhesiveness.

附图说明 BRIEF DESCRIPTION

[0017] 图1A为本发明较佳实施例的一种基板结构的俯视示意图。 [0017] FIG 1A is a top schematic view of a substrate structure of the preferred embodiment of the invention.

[0018] 图1B为图1A的基板结构的部分放大示意图。 [0018] FIG. 1B is a partial enlarged view of the substrate structure of FIG. 1A.

[0019] 图1C为图1B中,直线AA的剖视示意图。 [0019] FIG. 1B, FIG 1C, a schematic cross-sectional view of line AA.

[0020] 图2A为本发明另一实施态样的基板结构的部分放大示意图。 [0020] FIG 2A portion of the substrate structure of the present aspect of the invention an enlarged schematic view of another embodiment.

[0021] 图2B为图2A中,直线BB的剖视示意图。 [0021] Figure 2B Figure 2A, a schematic cross-sectional view of line BB.

[0022] 主要元件符号说明 [0022] Main reference numerals DESCRIPTION

[0023] 1、la:基板结构 [0023] 1, la: substrate structure

[0024] 11:第一基板 [0024] 11: first substrate

[0025] 111:元件配置区 [0025] 111: device region

[0026] 112:周边区 [0026] 112: peripheral zone

[0027] 12:第一接合垫 [0027] 12: first bonding pad

[0028] 13、13a:接合层 [0028] 13,13a: bonding layer

[0029] 131:第一弧形边缘 [0029] 131: a first arcuate edge

[0030] 132:第二弧形边缘 [0030] 132: second arcuate edge

[0031] 14:第二基板 [0031] 14: second substrate

[0032] 141:第二接合垫 [0032] 141: second bonding pad

[0033] AA、BB:直线 [0033] AA, BB: straight

[0034] C:导线 [0034] C: wire

[0035] E1:第一边缘 [0035] E1: a first edge

[0036] E2:第二边缘 [0036] E2: second edge

[0037] L1、L2:最大宽度 [0037] L1, L2: maximum width

[0038] X、Y、Z:方向 [0038] X, Y, Z: direction

具体实施方式 detailed description

[0039] 以下将参照相关图式,说明依本发明较佳实施例的基板结构,其中相同的元件将以相同的参照符号加以说明。 [0039] with reference to related drawings will be described a preferred embodiment of the substrate structure under this invention will be described in which the same elements will be designated the same reference numerals. 本发明所有实施态样的图示只是示意,不代表真实尺寸与比例。 All aspects of the illustrated embodiment of the present invention is illustrative only, and do not represent the real size ratio.

[0040] 请参照图1A至图1C所示,其中,图1A为本发明较佳实施例的一种基板结构1的俯视示意图,图1B为图1A的基板结构1的部分放大示意图,而图1C为图1B中,直线AA的剖视示意图。 A substrate structure [0040] Referring to FIGS. 1A to FIG. 1C, wherein FIG. 1A embodiment of the present invention a preferred embodiment is a schematic plan view, FIG. 1B is a partial enlarged view of a substrate structure of FIG 1A, and FIG. 1C to FIG. 1B, a schematic cross-sectional view of line AA.

[0041] 基板结构1包括一第一基板11、多个第一接合垫12以及一接合层13。 [0041] The substrate structure 1 includes a first substrate 11, a first plurality of bonding pads 12 and a bonding layer 13. 另外,本实施例的基板结构1更包括一第二基板14。 Further, the structure of the substrate 1 of the present embodiment further includes a second substrate 14. 不过,为了清楚说明本发明,图1A只显示第一基板11与第二基板14的相对关系,并未显示其他元件(这些第一接合垫12、接合层13及这些导线C),而图1B显示的第二基板14是以虚线表示之。 However, in order to clearly illustrate the present invention, FIG. 1A shows only the relative relationship between the first substrate 11 and second substrate 14, other elements not shown (the first bonding pads 12, bonding layer 13 and the wires C), and FIG. 1B the second substrate 14 is shown in dashed lines of FIG. 此外,图1A系以二个第二基板14为例。 In addition, FIG 1A to two lines of the second substrate 14 as an example.

[0042] 第一基板11具有一元件配置区(俗称面内)111及一周边区(俗称面外)112,周边区112邻设于元件配置区111的外围。 [0042] The first substrate 11 having a device region (commonly known as inner surface) and a peripheral region 111 (commonly known as the outer surface) 112, 112 disposed adjacent to the peripheral region of the peripheral region 111 of the element configuration. 在本实施例中,元件配置区111位于第一基板11的中间区域,并为电路结构设置的区域,周边区112则环绕于元件配置区111的外围。 In the present embodiment, the element region 111 arranged in the middle region of the first substrate 11, and the region is set to a circuit configuration, the peripheral region 112 surrounds the peripheral element region 111 disposed. 其中,第一基板11可为可透光材质所制成,其材料例如是玻璃、石英或类似物、塑料、橡胶、玻璃纤维或其他高分子材料;或者,第一基板11亦可为不透光材质所制成,并例如是金属-玻璃纤维复合板、金属-陶瓷复合板,或印刷电路板,或其他材料,并不限制。 Wherein, the first substrate 11 may be made of transparent material, which material such as glass, quartz or the like, plastic, rubber, glass fibers or other polymer materials; Alternatively, first substrate 11 may also be impervious made of light material, for example, and a metal - plate glass fiber composite, a metal - ceramic composite plate, or a printed circuit board, or other materials, it is not limited. 特别一提的是,元件配置区111是表示其为电路结构或元件(device)设置的区域,若只单纯为了导电而设置导电线路的地方并不是本发明所述的元件配置区111。 Special mention is arranged element region is a region 111 which is provided to the circuit structures or elements (device), if only simply provided to the conductive line where the conductive member is not disposed in the region 111 of the present invention. 举例而言,如图1A所示,若于元件配置区111上设置多个驱动电极及多个感测电极(即俗称的Tx与Rx)时,可使第一基板11成为一具有触控功能的基板。 For example, shown in Figure 1A, if a plurality of driving electrodes and a plurality of sensing electrodes (i.e., commonly known as the Tx and Rx) arranged on the element region 111, can be the first substrate 11 having a touch function substrate. 或者,在不同的实施例中,若于第一基板11的元件配置区111上设置薄膜晶体管或像素电极等元件时,则第一基板11可成为一薄膜晶体管基板而应用于平面显装置上。 Alternatively, in various embodiments, if a thin film transistor or the pixel element electrodes disposed on the element region 111 of the first substrate 11, the first substrate 11 may be a TFT substrate used in flat display devices.

[0043] 如图1B及图1C所示,这些第一接合垫12间隔配置于周边区112,且两相邻这些第一接合垫12之间具有一间隙(gap)。 [0043] FIG. 1B and 1C, the first bonding pad 12 arranged at intervals in the peripheral region 112, and these two neighboring first bonding pad having a gap (GAP) 12. 在本实施例中,于第一基板11左下侧的周边区112上配置有多个的第一接合垫12,且这些第一接合垫12沿一方向X间隔配置,使得两个相邻第一接合垫12之间都具有一个间隙。 In the present embodiment, the peripheral region 11 on the lower left side of the first substrate 112 is configured with a plurality of first bonding pads 12, 12 in a direction X and spaced the first bonding pad, so that the two adjacent first a bond pad having a gap 12 between. 其中,第一接合垫12的俯视形状例如但不限于为四方形,并例如但不限于为透明导电层(例如ΙΤ0或ΙΖ0)所形成,且可通过导线C(材料例如为铜)与元件配置区111内设置的元件电连接。 Wherein a planar shape of the first bonding pad 12 is, for example, but not limited to square, but are not limited to, for example, and formed as a transparent conductive layer (e.g. ΙΤ0 or ΙΖ0), and may be by wires C (for example, a copper material) configuration element electrical elements provided in the area 111 is connected.

[0044] 接合层13例如以涂布方式设置于第一基板11上,并完全覆盖这些第一接合垫12及这些间隙。 [0044] The bonding layer 13 is, for example, a coating disposed on the first substrate 11, and completely covers the first bonding pads 12 and these gaps. 其中,接合层13可例如但不限于为异向性导电胶(Anisotropic ConductiveFilm,ACF)。 Wherein the bonding layer 13 may be, for example, but not limited to the anisotropic conductive adhesive (Anisotropic ConductiveFilm, ACF). 异向性导电胶是由树脂及导电粒子合成而成,主要用于连接二种不同基材与线路。 The anisotropic conductive adhesive is a synthetic resin and the conductive particles are formed, mainly for two different substrates and connected to the line. 异向性导电胶具有上下电气导通,但左右平面绝缘的特性,并且有优良的防湿、接着、导电及绝缘等功能。 The anisotropic conductive adhesive having upper and lower electrically conductive, but the right and left planar insulating properties, and has excellent moisture, then, the conductive and insulating functions. 在不同的实施例中,接合层13亦可为粘着胶)。 In various embodiments, the bonding layer 13 may also be an adhesive gum).

[0045] 在本实施例中,这些第一接合垫12具有邻近元件配置区111的多个第一边缘(edge)El,且接合层13完全覆盖这些第一边缘E1。 [0045] In the present embodiment, the plurality of first bonding pads 12 disposed region 111 having a first element adjacent the edge (edge) El, and the bonding layer 13 completely covers the first edge E1. 接合层13除了完全覆盖住这些第一接合垫12的这些第一边缘E1与这些第一接合垫12之间的间隙之外,接合层13亦往元件配置区111的方向延伸,并且邻近于元件配置区111的接合层13的边缘具有多个第一弧形边缘131。 A first bonding layer 13 in addition to these bonding pads 12 of the first edge E1 to completely cover these gaps 13 also extends between the first bonding pad 12 outside the bonding layer region 111 disposed toward the element, the element and adjacent the bonding layer 111 disposed edge region 13 having a plurality of first arcuate edge 131. 其中,这些第一弧形边缘131分别对应于这些间隙之间。 Wherein the first arcuate edge 131 respectively corresponding to the gaps between. 较佳者,这些第一弧形边缘131与这些间隙是一对一对应,且每一个第一弧形边缘131的顶点分别对应于一个间隙的中间位置。 Preferred are those with a first arcuate edge gaps 131 are one correspondence, and each vertex of a first arcuate edge 131 respectively correspond to the intermediate position of a gap. 本发明所述的“弧形边缘”并不一定为圆弧形的边缘,只要弧形边缘的顶点较两侧突出的曲线形状边缘都是本发明所谓的弧形边缘。 "Curved edge" of the present invention is not necessarily circular arc-shaped edge, as long as the curved shape of the edge than the apex of the arcuate edge project on both sides of the present invention are so-called curved edge.

[0046] 另外,其中之一的这些第一弧形边缘131沿方向X的最大宽度L1,大于对应的间隙沿方向X的最大宽度L2。 [0046] Further, the first arcuate edge 131 in the X direction of one of the maximum width L1 which is greater than the corresponding gap width in the direction X the maximum L2. 本实施例是以每一个第一弧形边缘131沿方向X的最大宽度L1均大于对应的间隙沿方向X的最大宽度L2。 The present embodiment is arcuate edge 131 of each of the first direction X is greater than the maximum width L1 corresponds to the maximum gap width in the direction X L2. 当然,在不同的实施例中,也可以部分的第一弧形边缘131的最大宽度L1大于对应的间隙沿方向X的最大宽度L2,但另一部分的第一弧形边缘131的最大宽度L1小于或等于对应的间隙沿方向X的最大宽度L2。 Of course, in various embodiments, may be part of a first arcuate edge 131 of the maximum width L1 is larger than the gap in the direction X corresponding to the maximum width L2, but the maximum width of the first portion of the other arcuate edge 131 is smaller than L1 or equal to a gap corresponding to the maximum width in the direction X L2.

[0047] 第二基板14通过接合层13与第一基板11连接。 [0047] The second substrate 1413 is connected to the first substrate 11 through the bonding layer. 于此,第二基板14例如利用热压接合于第一基板11。 Thereto, e.g. the second substrate 14 by thermocompression bonded to the first substrate 11. 其中,第二基板14具有多个第二接合垫141,而且这些第二接合垫141分别与这些第一接合垫12对应设置并且电连接。 Wherein the second substrate 14 having a plurality of second bonding pads 141, and the second bonding pads 141 are respectively provided with the first bonding pad 12 and electrically connected to a corresponding. 通过第二接合垫141与对应的第一接合垫12相对设置,并通过接合层13,可使第一接合垫12与第二接合垫141电连接,以进行信号的传递。 Pad 141 corresponding to the second engaging a first bonding pad 12 is disposed opposite to and through the bonding layer 13, a first bonding pad 12 can connected to the second bonding pad 141 electrically, for transmitting a signal. 本实施例的第二基板14例如但不限于为软性印刷电路板(Flexible PrintCircuit,FPC),而第二接合垫141的材料例如为铜。 The second substrate 14 of the present embodiment is, for example, but not limited to the flexible printed circuit board (Flexible PrintCircuit, FPC), and the second bonding pad 141, for example, a copper material. 不过,在其他的实施例中,第二基板14也可为其他型式的电路板,例如印刷电路板(PCB)或软硬结合板。 However, in other embodiments, the second substrate 14 may be other types of circuit boards, such as a printed circuit board (PCB) or rigid-flex board. 因此,电的信号可通过导线C、第一接合垫12、接合层13及第二接合垫141在第一基板11与第二基板14之间进行传送。 Thus, the electrical signals through wires C, Groups bonding pads 12, bonding layer 13 and the second bonding pads 141 are transferred between the first substrate 11 and second substrate 14.

[0048] 承上,通过接合层13设置于第一基板11上,并完全覆盖这些第一接合垫12及这些间隙,且邻近于元件配置区111的接合层13具有多个第一弧形边缘131,使得接合层13可较完整地保护第一接合垫12。 [0048] Deck, through the bonding layer 13 disposed on the first substrate 11, and completely covers the first bonding pad 12 and the gap and disposed adjacent to the bonding layer element region 111 having a plurality of first arcuate edge 13 131, so that the bonding layer 13 may be more completely protects the first bonding pad 12. 因此,相较于现有技术,本实施例的基板结构1经过长时间使用后,接合层13可有效地阻挡水分或氧气进入,因此,除了可避免第一接合垫12的锈蚀之外,更可具有与第二基板14较佳的接合粘着性。 Thus, compared to the prior art, the substrate structure of the present embodiment 1 after extended use, the bonding layer 13 can effectively block moisture or oxygen from entering, and therefore, in addition to avoiding the corrosion of the first bonding pad 12, the more and has better adhesion the second substrate 14 bonded.

[0049] 另外,请参照图2A及图2B所示,其中,图2A为本发明另一实施态样的基板结构la的部分放大示意图,而图2B为图2A中,直线BB的剖视示意图。 [0049] Further, referring to FIG. 2A and FIG. 2B, wherein FIG. 2A according to another embodiment of the aspect of the structure of the substrate portion la is an enlarged schematic view of the invention, and Fig 2B is in Figure 2A, a schematic cross-sectional view of line BB .

[0050] 与图1A的基板结构1主要的不同在于,于基板结构la中,这些第一接合垫12具有与其这些第一边缘E1相对的多个第二边缘E2(第二边缘E2远离元件配置区111),而这些第二边缘E2并未位于第一基板11的边缘,而是在周边区112的区域内,因此,接合层13a可往远离元件配置区111延伸而覆盖这些第二边缘E2。 [0050] with a major difference in that the substrate structure of FIG. 1A, in the substrate structure la in which the first bonding pads 12 having a first edge E1 these therewith a plurality of opposite second edge E2 (second element disposed away from the edge E2 area 111), the second edge E2 which is not located at an edge of the first substrate 11, but in the region of the peripheral region 112, therefore, the bonding layer 13a to be arranged away from the member 111 extends to cover the area of ​​the second edge E2 . 另外,远离元件配置区111的接合层13a具有多个第二弧形边缘132 (亦位于周边区112的区域内)。 Further, the bonding layer 111 away from the device region 13a having a plurality of second arcuate edge 132 (also within the area of ​​the peripheral region 112). 其中,第一弧形边缘131与第二弧形边缘132系相对配置,其数量可相同或不相同。 Wherein the first and second arcuate edges 131 opposed arcuate edge lines 132, which may be the same or different number. 于此,系以相同,并为一对一为例。 This, in the same department, and as one example. 通过于这些第一接合垫12的相对两侧的接合层13a均具有弧形边缘,可更有效地阻挡水分或氧气进入而接触这些第一接合垫12。 By these first bonding pad 12 on opposite sides of the bonding layer 13a has a curved edge, can more effectively block entry of moisture or oxygen contacting the first bonding pad 12.

[0051] 此外,基板结构la的其他技术特征可参照基板结构1的相同元件,于此不再赘述。 [0051] In addition, other features of the substrate structure may refer to the same elements la substrate structure 1, is omitted herein.

[0052] 再一提的是,上述的基板结构1 (或la)可应用于例如触控面板、显示面板、或触控显示面板上,或者也可应用于其他形式的基板结构上。 [0052] A further mentioning that, the above-described substrate structure 1 (or La) may be applied, for example a touch panel, display panel, or a touch panel display, or may be applied to other types of substrate structures.

[0053] 以触控面板为例,若为外挂(Out-Cell)式触控面板时,则第一基板例如为一玻璃基板,且元件配置区内设置的电路结构可为触控感测电路(包含多个驱动电极及多个感测电极)。 [0053] In the touch panel as an example, if the plug is (Out-Cell) type touch panel, for example, the first substrate is a glass substrate, and the circuit configuration of the elements may be arranged in the region set touch sensing circuit (comprising a plurality of drive electrodes and a plurality of sensing electrodes). 因此,可将具有触控感测电路的基板结构与一显示面板结合而成为一触控显示面板(可再设置一保护玻璃(Cover Lens)来保护触控显示面板)。 Thus, the structure may be a substrate having a touch sensing circuit with a display panel incorporated into a touch display panel and (may be further provided a protective glass (Cover Lens) to protect the touch display panel). 不过,在0GS式触控面板的态样中,具有触控感测电路的第一基板本身即为保护基板,并不需另设置Cover Lens。 However, in the aspect of 0GS touch panel having a first substrate of the touch sensing circuit is itself a protective substrate is not subject to set Cover Lens.

[0054] 在外嵌(On-Cell)式触控面板的态样时,第一基板例如为一彩色滤光基板,而电路结构为触控感测电路,并可直接形成于彩色滤光基板的外侧表面上,且与薄膜晶体管基板结合而成为一触控显示面板(两者可夹置一液晶层)。 When [0054] the outer insert (On-Cell) aspect of the touch panel, for example, the first substrate is a color filter substrate, and a circuit configuration of a touch sensing circuit can be directly formed on the color filter substrate on the outer surface, and the substrate in combination with the thin film transistor becomes a touch display panel (both of which may be sandwiched a liquid crystal layer).

[0055] 在内嵌(In-Cell)式触控面板的态样时,第一基板例如为彩色滤光基板,而电路结构为触控感测电路,并可直接形成在彩色滤光基板相对于薄膜晶体管基板的一侧表面上;或者,第一基板也可为薄膜晶体管基板,而电路结构为触控感测电路,并可直接形成在薄膜晶体管基板面对彩色滤光基板的一侧表面上。 [0055] When the embedded aspect (In-Cell) touch panel, for example, the first substrate is a color filter substrate, and a circuit configuration of a touch sensing circuit can be directly formed on the color filter substrate opposite on one surface of the thin film transistor substrate; alternatively, the first substrate may be a thin film transistor substrate, and a circuit configuration of a touch sensing circuit can be directly formed on the thin film transistor substrate facing the color filter substrate side surface on.

[0056] 此外,在又一实施例中,第一基板例如为薄膜晶体管基板,而电路结构例如为显示电路结构(包含薄膜晶体管阵列结构及其他元件),因此,基板结构可应用于显示面板,例如液晶显示0XD)面板或有机发光二极管(0LED)显示面板上,以通过第二基板控制薄膜晶体管基板上的电路元件。 [0056] Further, in yet another embodiment, the first substrate is a thin film transistor substrate, for example, a circuit configuration and a circuit configuration, for example, a display (including a thin film transistor array structure and other components), thus the substrate structure can be applied to the display panel, 0XD such as liquid crystal display) panel or an organic light emitting diode (0LED) display panel, a control circuit element to the thin film transistor substrate by the second substrate.

[0057] 综上所述,因本发明的基板结构中,第一基板的周边区邻设于元件配置区的外围,而这些第一接合垫间隔配置于周边区,且两相邻这些第一接合垫之间具有一间隙。 [0057] In summary, due to the substrate structure according to the present invention, the peripheral region of the first substrate is disposed adjacent to the peripheral region of the element configuration, the first bonding pads which are spaced in the peripheral region, and these two adjacent first a gap between the bonding pad. 另外,接合层设置于第一基板上,并覆盖这些第一接合垫及这些间隙,且邻近元件配置区的接合层具有多个第一弧形边缘。 Further, the bonding layer disposed on the first substrate, and a first bonding pad and cover the gaps, and a bonding layer disposed adjacent to the element region having a plurality of first arcuate edge. 通过接合层覆盖这些第一接合垫及这些间隙,且邻近于元件配置区的接合层具有多个第一弧形边缘,使得接合层可较完整地保护第一接合垫。 Through the bonding layer which covers the first bonding pad and the gaps, and adjacent to a plurality of first arcuate edge disposed in the region of the bonding layer element, so that the bonding layer may be more completely protects the first bonding pad. 因此,相较于现有技术,本发明的基板结构经过长时间使用后,接合层可有效地阻挡水分或氧气进入,因此,除了可避免第一接合垫的锈蚀之外,更可具有较佳的接合粘着性。 Thus, compared to the prior art, the substrate structure according to the present invention, after prolonged use, the bonding layer can effectively block moisture or oxygen from entering, thus, can be avoided in addition to the first bonding pads outside corrosion, it may have a more preferred bonding adhesiveness.

[0058] 以上所述仅为举例性,而非为限制性者。 [0058] The foregoing is only illustrative and not a limiting sense. 任何未脱离本发明的精神与范畴,而对其进行的等效修改或变更,均应包含于权利要求中。 Any without departing from the spirit and scope of the invention, and its equivalent modifications or variations could be made in the claims.

Claims (10)

  1. 1.一种基板结构,其特征在于,所述基板结构包括: 一第一基板,具有一元件配置区及一周边区,该周边区邻设于该元件配置区的外围; 多个第一接合垫,间隔配置于该周边区,且两相邻所述第一接合垫之间具有一间隙;以及一接合层,设置于该第一基板上,并覆盖所述第一接合垫及所述间隙,且邻近该元件配置区的该接合层具有多个第一弧形边缘。 A substrate structure, wherein said substrate structure comprises: a first substrate having an element region and a peripheral region arranged, in the peripheral area disposed adjacent to the peripheral region of the element configuration; a first plurality of engagement pads, spaced in the peripheral region, and a gap between the two neighboring first bonding pads; and a bonding layer disposed on the first substrate, and covering the bonding pad and the first gap and disposed adjacent to the element region of the bonding layer having a first plurality of arcuate edge.
  2. 2.如权利要求1所述的基板结构,其特征在于,所述第一接合垫沿一方向间隔配置。 The substrate structure as claimed in claim 1, wherein said first bonding pads arranged in a spacing direction.
  3. 3.如权利要求2所述的基板结构,其特征在于,所述第一弧形边缘分别对应于所述间隙之间。 The substrate structure according to claim 2, wherein said first arcuate edge respectively corresponding to the gap between.
  4. 4.如权利要求3所述的基板结构,其特征在于,其中之一的所述第一弧形边缘沿该方向的最大宽度,大于对应的该间隙沿该方向的最大宽度。 The substrate structure as claimed in claim 3, wherein one of said arcuate edge, wherein the first direction is along the maximum width, is larger than the maximum width of the gap corresponding to this direction.
  5. 5.如权利要求1所述的基板结构,其特征在于,所述第一接合垫具有邻近该元件配置区的多个第一边缘,且该接合层覆盖所述第一边缘。 The substrate structure according to claim 1, wherein said pad has a plurality of first engaging elements disposed adjacent to the first edge region, and the bonding layer covers the first edge.
  6. 6.如权利要求5所述的基板结构,其特征在于,所述第一接合垫更具有与所述第一边缘相对的多个第二边缘,且该接合层覆盖所述第二边缘。 6. The substrate structure as claimed in claim 5, characterized in that the first bonding pad to the first edge more edge opposite a second plurality, and the bonding layer covers the second edge.
  7. 7.如权利要求1所述的基板结构,其特征在于,远离该元件配置区的该接合层具有多个第二弧形边缘。 7. The substrate structure according to claim 1, wherein the element away from the bonding layer having a region disposed a second plurality of arcuate edge.
  8. 8.如权利要求1所述的基板结构,其特征在于,所述基板结构还包括: 一第二基板,通过该接合层与该第一基板连接,该第二基板具有多个第二接合垫,且所述第二接合垫分别与所述第一接合垫对应设置并电连接。 8. The substrate structure according to claim 1, wherein said substrate structure further comprises: a second substrate, is connected to the first substrate through the bonding layer, the second substrate having a second plurality of bonding pads and said second bonding pads respectively provided corresponding to said first bonding pad and electrically connected.
  9. 9.如权利要求1所述的基板结构,其特征在于,所述基板结构还包括: 多个驱动电极及多个感测电极,分别设置于该元件配置区。 9. The substrate structure according to claim 1, wherein said substrate structure further comprising: a plurality of drive electrodes and a plurality of sensing electrodes arranged respectively disposed on the element region.
  10. 10.如权利要求1所述的基板结构,其特征在于,该第一基板为一保护基板、一彩色滤光基板或一薄膜晶体管基板。 10. The substrate structure according to claim 1, wherein the protective substrate is a first substrate, a color filter substrate or a TFT substrate.
CN 201410322554 2014-07-08 2014-07-08 Substrate structure CN105242424A (en)

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CN101060205A (en) * 2006-04-18 2007-10-24 Nec液晶技术株式会社 Flat display panel and connection structure
US20080232047A1 (en) * 2007-03-19 2008-09-25 Epson Imaging Devices Corporation Mounting structure, electro-optical device, input device, method of manufacturing mounting structure, and electronic apparatus
JP2009158766A (en) * 2007-12-27 2009-07-16 Panasonic Corp Wiring board and connection method
CN204065604U (en) * 2014-07-08 2014-12-31 群创光电股份有限公司 Substrate structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101060205A (en) * 2006-04-18 2007-10-24 Nec液晶技术株式会社 Flat display panel and connection structure
US20080232047A1 (en) * 2007-03-19 2008-09-25 Epson Imaging Devices Corporation Mounting structure, electro-optical device, input device, method of manufacturing mounting structure, and electronic apparatus
JP2009158766A (en) * 2007-12-27 2009-07-16 Panasonic Corp Wiring board and connection method
CN204065604U (en) * 2014-07-08 2014-12-31 群创光电股份有限公司 Substrate structure

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