Touch module and there is the touch control display apparatus of this touch module
Technical field
The present invention relates to a kind of touch module and there is the touch control display apparatus of this touch module.
Background technology
Along with the development of electronic technology, the consumption electronic products such as mobile phone, portable computer, personal digital assistant (PDA), panel computer, media player all adopt touch module as input equipment mostly, have more friendly man-machine interaction mode to make product.
According to the difference of its touch-control principle, touch module comprises electric resistance touch-control module, capacitance touching control module, infrared type touch module and sound wave type touch module etc.At present, widely used touch module comprises the touch module such as resistance-type, condenser type, optical profile type, acoustic wave.Wherein, especially more extensive with the application of capacitance touching control module.Capacitance touching control module because its touch-control sensitivity is good, long service life, not easily by advantages such as outer signals interference, be widely used in various consumption electronic products.
At present, the capacitance touching control module be widely used, such as projecting type capacitor touch module, mostly comprise touch-control sensing region and be positioned at wiring area or the frame region of this touch-control sensing area periphery.This sensing region is provided with the first sensing electrode extended along first direction (as longitudinal direction) and the second sensing electrode extended along second direction (as transverse direction) that are formed by conductive material.This first sensing electrode and the second sensing electrode mutually insulated are arranged.
Described first and second sensing electrodes can use indium tin oxide (Indium Tin Oxides, ITO) to make, and form double-deck ITO structure.The paving mode of the first and second sensing electrodes has two kinds, a kind of bilateral being the first and second sensing electrodes and being laid on substrate respectively, forms DITO(Double Side ITO, DITO) structure.Another kind is the same side that the first and second sensing electrodes are all laid on substrate.Traditional DITO structure uses optical cement (OCA) to be fitted on glass cover-plate (Cover Lens) and display module mostly.
In addition, first the first sensing electrode is formed by light shield etch process, and extends to wiring area and be connected with control circuit (as FPC).Afterwards, the second sensing electrode is formed on the insulation course above the first sensing electrode by light shield etch process.But the first sensing electrode extends the part of insulation course may be etched in the etch process of the second sensing electrode, and affect the transmission of signal.
Summary of the invention
For overcoming the above problems, be necessary to provide a kind of touch module solved the problem.
Touch module provided by the invention, comprise sensing region and be positioned at the wiring area of sensing region periphery, the position of the corresponding sensing region of this touch module is provided with the sensing electrode formed by conductive material, this touch module is to the position of wiring area arranging extension wire, and sensing electrode is connected to this wiring area and is connected with a control circuit by this extension wire.Wherein, etch protection layer is coated with directly at least one extension wire.
Preferably, the width of described etch protection layer is greater than the live width of corresponding extension wire.
Preferably, described sensing electrode comprises the first sensing electrode extended along first direction and the second sensing electrode extended along second direction, and the first sensing electrode is connected to described wiring area and is connected with described control circuit by described extension wire.
Preferably, described extension wire and described first sensing electrode are manufactured from the same material.
Preferably, described extension wire and described first sensing electrode are made in same light shield etch process.
Preferably, described etch protection layer and described second sensing electrode are manufactured from the same material.
Preferably, described etch protection layer and described second sensing electrode are made in same light shield etch process.
Preferably, the live width of described second sensing electrode is greater than the live width of described first sensing electrode.
Preferably, described second sensing electrode comprises many first line segments being positioned at the first sensing electrode both sides and many second line segments crossing with the first sensing electrode, and the live width of this second line segment is less than the live width of the first line segment.
Preferably, the live width of described second line segment equals the live width of the first sensing electrode.
Preferably, the top of described etch protection layer arranges a metal wire, and this metal wire covers described etch protection layer and is connected with described control circuit, by the sensing signal transmission of the first sensing electrode to this control circuit.
Preferably, described second sensing electrode is connected with described control circuit by conductive signal wire, and wherein, described metal wire and this conductive signal wire are manufactured from the same material.
The present invention also provides a kind of touch control display apparatus with above-mentioned touch module.
Compared to prior art; the contact panel of touch control display apparatus of the present invention; the etch protection layer that width is greater than this extension wire live width is set above the extension wire of the first sensing electrode, extension wire is effectively protected in the etch process of the second sensing electrode and not etched.
Accompanying drawing explanation
Fig. 1 is the plane routing structural representation of the touch module that the embodiment of the present invention provides.
Fig. 2 is the hierarchical structure schematic diagram of touch module described in an embodiment along II-II tangent line in Fig. 1.
Fig. 3 is the hierarchical structure schematic diagram of touch module described in an embodiment along III-III tangent line in Fig. 1.
Fig. 4 is the floor map of the first sensing electrode shown in Fig. 1 and the second sensing electrode in a change embodiment.
Fig. 5 is the hierarchical structure schematic diagram with the touch control display apparatus of described touch module that the embodiment of the present invention provides.
Main element symbol description
Touch control display apparatus |
100 |
Glass cover-plate |
10 |
Touch module |
20 |
Optical cement |
30 |
Display module |
40 |
First protective seam |
21 |
First sensing electrode |
22 |
Second protective seam |
23 |
Second sensing electrode |
24 |
3rd protective seam |
25 |
Sensing region |
200 |
Wiring area |
300 |
Control circuit |
400 |
Calmodulin binding domain CaM |
B |
Substrate |
26 |
Light shield layer |
27 |
Extension wire |
221 |
Etch protection layer |
222 |
Metal wire |
223 |
First line segment |
241 |
Second line segment |
242 |
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
As shown in Figure 1, be the plane routing structural representation of the touch module 20 that the embodiment of the present invention provides.This touch module 20 comprises sensing region 200 and is positioned at the wiring area 300 of sensing region periphery.Sensing electrode is equipped with in this sensing region 200.In one embodiment, this sensing electrode comprises many first sensing electrodes 22 and many second sensing electrodes 24 extended along second direction (transverse direction) extended along first direction (longitudinal direction).This wiring area 300 is for laying the conductive signal wire of touch module 20.This wiring area 300 also comprises a combination (Bonding) region B, wherein, a control circuit 400(as flexible circuit, FPC) be arranged within this calmodulin binding domain CaM B.Described first sensing electrode 22 extends to this calmodulin binding domain CaM B and is connected with this control circuit 400, sensing signal to be transferred to this control circuit 400.Described second sensing electrode 24 is connected to this calmodulin binding domain CaM B by conductive signal wire 210, sensing signal to be transferred to this control circuit 400.In the present embodiment, the second sensing electrode 24 and the first sensing electrode 22 are bar shaped, and the live width of the second sensing electrode 24 is greater than the live width of the first sensing electrode 22.In other embodiments, described sensing electrode (comprising the first sensing electrode 22 and the second sensing electrode 24) also can be that other is applicable to structure or the shape of touch module.
As shown in Figure 2, be the hierarchical structure schematic diagram of touch module 20 described in an embodiment along II-II tangent line in Fig. 1.Wherein, this touch module 20 also comprises substrate 26 and is located at the light shield layer 27 above substrate 26.This light shield layer 27 is arranged at one of them surface of substrate 26 and is positioned at the both sides of sensing region.In addition, this touch module 20 also comprises and is cascadingly set on the first protective seam 21 above substrate 26 and light shield layer 27, described first sensing electrode 22, second protective seam 23, described second sensing electrode 24 and the 3rd protective seam 25.This first sensing electrode 22 and the second sensing electrode 24 can be made up of transparent conductive materials such as indium tin oxides (ITO); and this first sensing electrode 22 and the second sensing electrode 24 are layed in the both sides of the second protective seam 23 respectively; use this second protective seam 23 as the substrate of the first sensing electrode 22 and the second sensing electrode 24, form DITO(Double Side ITO) structure.This second protective seam 23 can be made up of dry film (dry film) material, photoresist or ink material etc.First protective seam 21 and the 3rd protective seam 25 can be formed by transparent materials such as transparent resins.In other embodiment, this first protective seam 21, second protective seam 23 and the 3rd protective seam 25 all can be formed by organic material or inorganic material.This substrate 26 can be the transparency carrier or opaque substrate be made up of glass, resin or plastic or other material.
Described light shield layer 27 can be made up of light screening materials such as black resins.Concrete formation method can be: by black resin through rotary coating mode or scrape formula coating method even spread on the transparent substrate, coating thickness is approximately 0.3um ~ 5um, pre-baked through well heater, exposure, development, makes it the light shield layer needed for being formed.
As shown in Figure 3, be the hierarchical structure schematic diagram of touch module 20 described in an embodiment along III-III tangent line in Fig. 1.In this embodiment, this touch module 20 arranges many extension wires 221 in the position of the described calmodulin binding domain CaM B of correspondence, and this extension wire 221 connects described first sensing electrode 22 and extends to described calmodulin binding domain CaM B, is connected with described control circuit 400.Preferably, this extension wire 221 and the first sensing electrode 22 can be one-body molded in same light shield etch process by same conductive.
In addition, the top of every bar extension wire 221 arranges an etch protection layer 222 and covers this extension wire 221.The live width of this etch protection layer 222 is greater than the live width of this extension wire 221.Preferably, this etch protection layer 222 and the second sensing electrode 24 can be formed at same light shield etch process by same conductive, and this etch protection layer 222 and the second sensing electrode 24 are not electrically connected each other.Preferably, the material of this etch protection layer 222 is the transparent conductive materials such as tin indium oxide (ITO).Because this etch protection layer 222 live width is greater than described extension wire 221, in the etch process of the second sensing electrode 24, this etch protection layer 222 can protect this extension wire 221 to make it not etched.
Further; metal wire 223 is provided with directly over this etch protection layer 222; this metal wire 223 covers this etch protection layer 222 but is not connected with described control circuit 400; for strengthening the electric conductivity between etch protection layer 222 and control circuit 400, so that the sensing signal of the first sensing electrode 22 is transferred to this control circuit 400.Preferably, this metal wire 223 can be formed by same conductive with described conductive signal wire 210 in same processing procedure.
As shown in Figure 4, be the floor map of the first sensing electrode 22 in a change embodiment shown in Fig. 1 and the second sensing electrode 24.In this embodiment, this second sensing electrode 24 comprises many first line segments 241 being positioned at the first sensing electrode 22 both sides and many second line segments 242 crossing with the first sensing electrode.First line segment 241 and the second line segment 242 join end to end and form this second sensing electrode 24.The live width of this second line segment 242 is less than the live width of the first line segment 241.Preferably in the present embodiment, the live width of the second line segment 242 equals the live width of the first sensing electrode 22.
As shown in Figure 5, be the hierarchical structure schematic diagram with the touch control display apparatus 100 of described touch module 20 that the embodiment of the present invention provides.In the present embodiment, this touch control display apparatus 100 also comprises glass cover-plate 10 and display module 40.This touch module 20 is sandwiched between this glass cover-plate 10 and display module 40.Preferably, the side (side of corresponding first sensing electrode 22 and the second sensing electrode 24) of this touch module 20 is directly formed on glass cover-plate 10, and opposite side (counterpart substrate 26 side) is bonded together by optical cement 30 and described display module 40.Described optical cement 30 may be, but not limited to, and optical clear tackifier (Optical Clear Adhesive, OCA) or optical clear resin (Optical Clear Resin, OCR) etc. have the tackifier of high transmission rate.Described glass cover-plate 10 can be made up of glass materials such as organic glass (PMMA).In other embodiments, this glass cover-plate 10 also can by plastics, and as polycarbonate (PC), polyimide (PI), or other material such as sapphire is made.
In sum, the double-deck sensing electrode of touch module (DITO sensing electrode structure) can directly be formed on glass cover-plate by the present invention, and does not use tackifier to fit, thus the thickness of saving one deck tackifier is to reduce the integral thickness of touch control display apparatus.In addition, in combination (Bonding) region, the etch protection layer that width is greater than this extension wire live width is set above the extension wire of the first sensing electrode, can in the etch process of the second sensing electrode, protects this extension wire not etched.
Above embodiment is only in order to illustrate technical scheme of the present invention and unrestricted, although with reference to preferred embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that, can modify to technical scheme of the present invention or equivalent replacement, and not depart from the spirit and scope of technical solution of the present invention.