CN105228354A - For the manufacture craft of the core flexible PCB of medical hearing aids - Google Patents
For the manufacture craft of the core flexible PCB of medical hearing aids Download PDFInfo
- Publication number
- CN105228354A CN105228354A CN201510662186.1A CN201510662186A CN105228354A CN 105228354 A CN105228354 A CN 105228354A CN 201510662186 A CN201510662186 A CN 201510662186A CN 105228354 A CN105228354 A CN 105228354A
- Authority
- CN
- China
- Prior art keywords
- circuit
- sensitive surface
- light
- fpc plate
- hearing aids
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Abstract
The invention discloses a kind of manufacture craft of the core flexible PCB for medical hearing aids, comprise the following steps: 1) sawing sheet; 2) pad pasting; 3) LDI; 4) development etching striping; 5) line inspection; 6) microetch; 7) measure; 8) packaging is vacuumized; 9) outgoing laser; 10) IQC inspection; 11) size is measured; 12) microetch; 13) print solder paste; 14) IQC inspection; 15) itemize; 16) entirely examine; 17) FQC; 18) pack.Compared with prior art, the present invention saves the egative film operation in exposure process, saves handling egative film time and cost, and decreases the deviation because egative film harmomegathus causes; Directly circuit is imaged on FPC plate, saves operation, enhance productivity; Directly be imaged on FPC/PCB by circuit, save CAM production process, circuit image resolution is high, and fine wire can reach about 20 μm, is applicable to the making of fine wire.
Description
Technical field
The present invention relates to one for the manufacture craft of the core flexible PCB of medical hearing aids.
Background technology
The core flexible PCB of medical treatment hearing aids is generally provided with 6 circular pad, ensure that symmetry error is 0.02mm after the pad hole of General Requirements 6 circular pad is die-cut, through reality test Yin Feilin and etch tolerance and with nothing left accumulated tolerance, in order to improve the homogeneity of product of flexible PCB, individual FPC plate of general employing moderate dimensions, forms several required flexible circuit panel products through cutting itemize after individual FPC plate makes.The technique that prior art makes flexible circuit panel products mainly comprises following configuration steps: 1) sawing sheet; 2) outgoing laser; 3) LDI (exposure); 4) development etching striping; 5) IQC inspection; 6) microetch; 7) shipment is packed; 8) entirely examine; 9) check; 10) itemize; 11) IQC inspection (supplied materials quality inspection); 12) brush tin cream.
Existing technique has following shortcoming: the harmomegathus value error of product is larger, personnel's contraposition deviation is large, and Graphic transitions when contraposition exposes after etching, when circuit development and etching, the factor such as lateral erosion can affect change in size, cause conforming product rate lower, be therefore necessary to provide a kind of new method to solve the problems referred to above.
Summary of the invention
The object of the present invention is to provide one can reduce Product processing error, improve the manufacture craft of the core flexible PCB for medical hearing aids of conforming product rate.
To achieve these goals, the technical solution adopted in the present invention is as follows:
For a manufacture craft for the core flexible PCB of medical hearing aids, comprise the following steps:
1) sawing sheet: entire volume FPC plate is cut into some individual FPC plates of the same size, individual FPC plate described comprises substrate layer and copper foil layer, described substrate layer and described copper foil layer compound;
2) pad pasting: stick one deck light-sensitive surface on described copper foil layer;
3) LDI: with ultraviolet light in a raster scan manner, directly exposure-processed is carried out to described light-sensitive surface, the circuit shape of needs is transferred on the light-sensitive surface be exposed;
4) development etching striping: the light-sensitive surface without exposure is peeled off, exposes part copper layers of foil to be etched, etch away the described part copper layers of foil exposed and form required circuit; Adopt highly basic to remove exposed light-sensitive surface, expose described circuit;
5) line inspection: check through step 4) after individual FPC plate with or without light-sensitive surface residual phenomena, with or without there is the obvious circuit bad phenomenon of initial line in circuit, circuit is with or without open circuit, short circuit, breach, residual copper, residual film phenomenon;
6) microetch: chemical surface treatment is carried out to described circuit;
7) measure: adopt Quadratic Finite Element to measure size and the harmomegathus value of individual FPC plate;
8) packaging is vacuumized: individual FPC plate of vacuum packaging;
9) outgoing laser: utilize laser drilling machine to get out location hole and circular pad hole on individual FPC plate;
10) IQC inspection: check individual FPC plate outward appearance whether the section of having poor, weigh wounded, skew etc. is bad;
11) size is measured: measure the size in individual FPC plate and location hole and circular pad hole whether in specification limit according to drawing;
12) microetch: the hole wall carbon residue in location hole and circular pad hole when removing individual FPC plate oxide on surface and laser drill;
13) print solder paste: after tin cream being crossed nitrogen furnace, circular pad is formed to tin on described circular pad hole, manually the superfine copper axis on hearing aids is welded in circular pad;
14) IQC inspection: whether inspection welding tin point has skew, measures the thickness of tin by Quadratic Finite Element;
15) itemize: utilize location hole to position, cut waste material limit, carries out itemize process form multiple product to individual FPC plate;
16) entirely examine: desk checking product appearance and welding quality;
17) FQC: product protect inspection product appearance and whether welding quality meets customer requirement;
18) pack: the qualified packing of product, according to PS Package Specification, is put in storage by personnel.
Preferably, step 2) described in light-sensitive surface be circuit image transfer medium, first adopt upper and lower preheating wheel to described light-sensitive surface preheating during pad pasting, the preheat temperature of upper and lower preheating wheel is 25-35 DEG C, upper and lower heat pressing wheel pressing is adopted to make light-sensitive surface be attached on described copper foil layer again, the temperature of upper and lower heat pressing wheel is 70-90 DEG C, and pressure is 3-4 ㎏/cm
2, speed is 1-2m/min.
Preferably, step 4) in adopt developer solution to peel off described light-sensitive surface, described developer solution adopts Na
2cO
3solution, the concentration of described developer solution is 0.8-1.2%, and spray pressure is 0.7-1.3kg/cm
2, temperature is 26-32 DEG C, and washing pressure is 0.8-1.2kg/cm
2, developing powder is 2.0-3.0m/min.
Preferably, step 4) in adopt etching solution etch the described part copper layers of foil exposed, described etching solution employing acidic cupric chloride solutions, in described acidic cupric chloride solutions, the concentration of H+ is 1.0-2.5mol/L, Cu
2+content be 100-180g/L, the temperature of etching solution is 48-52 DEG C, and spray pressure is 1.5-2.5kg/cm
2, washing pressure is 0.8-1.2kg/cm
2, etching speed is 1.0-5.0m/min; Described highly basic adopts NaOH solution.
Preferably, step 13) in the thickness of brush tin cream be 0.14-0.20mm, the nitrogen solubility in nitrogen furnace is 99.99%, and nitrogen machine oxygen content processed is less than or equal to 100ppm.
Compared with prior art, the beneficial effect that the present invention is used for the manufacture craft of the core flexible PCB of medical hearing aids is: save the egative film operation in exposure process, saves handling egative film time and cost, and decreases the deviation because egative film harmomegathus causes; Directly circuit is imaged on FPC plate, saves operation, enhance productivity; Directly be imaged on FPC/PCB by circuit, save CAM production process, circuit image resolution is high, and fine wire can reach about 20um, is applicable to the making of fine wire.
Embodiment
Below in conjunction with specific embodiment, the present invention is described further.
The invention provides a kind of manufacture craft of the core flexible PCB for medical hearing aids, comprise
For a manufacture craft for the core flexible PCB of medical hearing aids, comprise the following steps:
1) sawing sheet: entire volume FPC plate is cut into some individual FPC plates of the same size, individual FPC plate described comprises substrate layer and copper foil layer, described substrate layer and described copper foil layer compound;
2) pad pasting: stick one deck light-sensitive surface on described copper foil layer;
3) LDI: with ultraviolet light in a raster scan manner, directly exposure-processed is carried out to described light-sensitive surface, the circuit shape of needs is transferred on the light-sensitive surface be exposed;
4) development etching striping: the light-sensitive surface without exposure is peeled off, exposes part copper layers of foil to be etched, etch away the described part copper layers of foil exposed and form required circuit; Adopt highly basic to remove exposed light-sensitive surface, expose described circuit;
5) line inspection: check through step 4) after individual FPC plate with or without light-sensitive surface residual phenomena, with or without there is the obvious circuit bad phenomenon of initial line in circuit, circuit is with or without open circuit, short circuit, breach, residual copper, residual film phenomenon;
6) microetch: chemical surface treatment is carried out to described circuit;
7) measure: adopt Quadratic Finite Element to measure size and the harmomegathus value of individual FPC plate;
8) packaging is vacuumized: individual FPC plate of vacuum packaging;
9) outgoing laser: utilize laser drilling machine to get out location hole and circular pad hole on individual FPC plate;
10) IQC inspection: check individual FPC plate outward appearance whether the section of having poor, weigh wounded, skew etc. is bad;
11) size is measured: measure the size in individual FPC plate and location hole and circular pad hole whether in specification limit according to drawing;
12) microetch: the hole wall carbon residue in location hole and circular pad hole when removing individual FPC plate oxide on surface and laser drill;
13) print solder paste: after tin cream being crossed nitrogen furnace, circular pad is formed to tin on described circular pad hole, manually the superfine copper axis on hearing aids is welded in circular pad;
14) IQC inspection: whether inspection welding tin point has skew, measures the thickness of tin by Quadratic Finite Element;
15) itemize: utilize location hole to position, cut waste material limit, carries out itemize process form multiple product to individual FPC plate;
16) entirely examine: desk checking product appearance and welding quality;
17) FQC: product protect inspection product appearance and whether welding quality meets customer requirement;
18) pack: the qualified packing of product, according to PS Package Specification, is put in storage by personnel.
Step 1) in the size of individual FPC plate by specifically needing to determine, the model different size of individual FPC plate needed is not identical yet, in the present embodiment, individual FPC plate is of a size of 172*300mm, will notice that entire volume FPC plate can not produce fold and contaminated in the process cut.
Step 2) described in light-sensitive surface be circuit image transfer medium, first adopt during pad pasting upper and lower preheating wheel give described light-sensitive surface preheating, the preheat temperature of upper and lower preheating wheel is 25-35 DEG C, is convenient to light-sensitive surface sturdy, prevent its produce gauffer; Adopt upper and lower heat pressing wheel pressing to make light-sensitive surface be attached on described copper foil layer again, the temperature of upper and lower heat pressing wheel is 70-90 DEG C, and pressure is 3-4 ㎏/cm
2, speed is 1-2m/min.In the present embodiment, described light-sensitive surface adopts dry film.
Step 3) in the exposure machine that adopts send the ultraviolet that wavelength is 350-410nm, exposure machine process capability can reach 20L/S (um) left and right, and the maximum area of processing PCB plate is 635*812mm.
Step 4) in adopt developer solution to peel off described light-sensitive surface, described developer solution adopts Na
2cO
3solution, the concentration of described developer solution is 0.8-1.2%, and spray pressure is 0.7-1.3kg/cm
2, temperature is 26-32 DEG C, and washing pressure is 0.8-1.2kg/cm
2, developing powder is 2.0-3.0m/min.Realized the transfer of line pattern by development, circuit image is meticulousr.
Step 4) in adopt etching solution etch the described part copper layers of foil exposed, described etching solution employing acidic cupric chloride solutions, in described acidic cupric chloride solutions, the concentration of H+ is 1.0-2.5mol/L, Cu
2+content be 100-180g/L, the temperature of etching solution is 48-52 DEG C, and spray pressure is 1.5-2.5kg/cm
2, washing pressure is 0.8-1.2kg/cm
2, etching speed is 1.0-5.0m/min; Described highly basic adopts NaOH solution.
Step 9) in laser energy be 25 joules, adopt the disposable cutting location hole of laser and circular pad hole, can Product Precision be improved.Laser-marking point increases to 8 by 4 of existing technique, and laser is divided into two sections, and cutting accuracy error is 0.015mm, can improve positioning precision.In addition the minimum-value aperture that laser can cut is 0.3mm, and in the present embodiment, the aperture in circular pad hole is 0.5mm.
Step 13) in the thickness of brush tin cream be 0.14-0.20mm, the nitrogen solubility in nitrogen furnace is 99.99%, and nitrogen machine oxygen content processed is less than or equal to 100ppm.Molten tin can be increased through nitrogen furnace active, reduce circular pad hole surface tension force, prevent it to be oxidized, increase circular pad, the glossiness in face.
Schematically above be described the present invention and execution mode thereof, this description is not restricted.So, if those of ordinary skill in the art enlightens by it, when not departing from the invention aim, designing the frame mode similar to this technical scheme and embodiment without creationary, all should protection scope of the present invention be belonged to.
Claims (5)
1., for a manufacture craft for the core flexible PCB of medical hearing aids, it is characterized in that, comprise the following steps:
1) sawing sheet: entire volume FPC plate is cut into some individual FPC plates of the same size, individual FPC plate described comprises substrate layer and copper foil layer, described substrate layer and described copper foil layer compound;
2) pad pasting: stick one deck light-sensitive surface on described copper foil layer;
3) LDI: with ultraviolet light in a raster scan manner, directly exposure-processed is carried out to described light-sensitive surface, the circuit shape of needs is transferred on the light-sensitive surface be exposed;
4) development etching striping: the light-sensitive surface without exposure is peeled off, exposes part copper layers of foil to be etched, etch away the described part copper layers of foil exposed and form required circuit; Adopt highly basic to remove exposed light-sensitive surface, expose described circuit;
5) line inspection: check through step 4) after individual FPC plate with or without light-sensitive surface residual phenomena, with or without there is the obvious circuit bad phenomenon of initial line in circuit, circuit is with or without open circuit, short circuit, breach, residual copper, residual film phenomenon;
6) microetch: chemical surface treatment is carried out to described circuit;
7) measure: adopt Quadratic Finite Element to measure size and the harmomegathus value of individual FPC plate;
8) packaging is vacuumized: individual FPC plate of vacuum packaging;
9) outgoing laser: utilize laser drilling machine to get out location hole and circular pad hole on individual FPC plate;
10) IQC inspection: check individual FPC plate outward appearance whether the section of having poor, weigh wounded, skew etc. is bad;
11) size is measured: measure the size in individual FPC plate and location hole and circular pad hole whether in specification limit according to drawing;
12) microetch: the hole wall carbon residue in location hole and circular pad hole when removing individual FPC plate oxide on surface and laser drill;
13) print solder paste: after tin cream being crossed nitrogen furnace, circular pad is formed to tin on described circular pad hole, manually the superfine copper axis on hearing aids is welded in circular pad;
14) IQC inspection: whether inspection welding tin point has skew, measures the thickness of tin by Quadratic Finite Element;
15) itemize: utilize location hole to position, cut waste material limit, carries out itemize process form multiple product to individual FPC plate;
16) entirely examine: desk checking product appearance and welding quality;
17) FQC: product protect inspection product appearance and whether welding quality meets customer requirement;
18) pack: the qualified packing of product, according to PS Package Specification, is put in storage by personnel.
2. as claimed in claim 1 for the manufacture craft of the core flexible PCB of medical hearing aids, it is characterized in that, step 2) described in light-sensitive surface be circuit image transfer medium, first adopt upper and lower preheating wheel to described light-sensitive surface preheating during pad pasting, the preheat temperature of upper and lower preheating wheel is 25-35 DEG C, adopt upper and lower heat pressing wheel pressing to make light-sensitive surface be attached on described copper foil layer again, the temperature of upper and lower heat pressing wheel is 70-90 DEG C, and pressure is 3-4 ㎏/cm
2, speed is 1-2m/min.
3., as claimed in claim 1 for the manufacture craft of the core flexible PCB of medical hearing aids, it is characterized in that, step 4) in adopt developer solution to peel off described light-sensitive surface, described developer solution adopts Na
2cO
3solution, the concentration of described developer solution is 0.8-1.2%, and spray pressure is 0.7-1.3kg/cm
2, temperature is 26-32 DEG C, and washing pressure is 0.8-1.2kg/cm
2, developing powder is 2.0-3.0m/min.
4. as claimed in claim 1 for the manufacture craft of the core flexible PCB of medical hearing aids, it is characterized in that, step 4) in adopt etching solution etch the described part copper layers of foil exposed, described etching solution employing acidic cupric chloride solutions, H in described acidic cupric chloride solutions
+concentration be 1.0-2.5mol/L, Cu
2+content be 100-180g/L, the temperature of etching solution is 48-52 DEG C, and spray pressure is 1.5-2.5kg/cm
2, washing pressure is 0.8-1.2kg/cm
2, etching speed is 1.0-5.0m/min; Described highly basic adopts NaOH solution.
5. as claimed in claim 1 for the manufacture craft of the core flexible PCB of medical hearing aids, it is characterized in that, step 13) in the thickness of brush tin cream be 0.14-0.20mm, the nitrogen solubility in nitrogen furnace is 99.99%, and nitrogen machine oxygen content processed is less than or equal to 100ppm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510662186.1A CN105228354A (en) | 2015-10-08 | 2015-10-08 | For the manufacture craft of the core flexible PCB of medical hearing aids |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510662186.1A CN105228354A (en) | 2015-10-08 | 2015-10-08 | For the manufacture craft of the core flexible PCB of medical hearing aids |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105228354A true CN105228354A (en) | 2016-01-06 |
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ID=54996946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510662186.1A Pending CN105228354A (en) | 2015-10-08 | 2015-10-08 | For the manufacture craft of the core flexible PCB of medical hearing aids |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105228354A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006286909A (en) * | 2005-03-31 | 2006-10-19 | Ricoh Microelectronics Co Ltd | Method of manufacturing electronic circuit board and system thereof |
| CN101730389A (en) * | 2008-10-15 | 2010-06-09 | 比亚迪股份有限公司 | Method for manufacturing single-side hollow out flexible circuit board |
| CN204634043U (en) * | 2015-05-27 | 2015-09-09 | 厦门爱耳通电声科技有限公司 | Hearing aids simulation test battery |
-
2015
- 2015-10-08 CN CN201510662186.1A patent/CN105228354A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006286909A (en) * | 2005-03-31 | 2006-10-19 | Ricoh Microelectronics Co Ltd | Method of manufacturing electronic circuit board and system thereof |
| CN101730389A (en) * | 2008-10-15 | 2010-06-09 | 比亚迪股份有限公司 | Method for manufacturing single-side hollow out flexible circuit board |
| CN204634043U (en) * | 2015-05-27 | 2015-09-09 | 厦门爱耳通电声科技有限公司 | Hearing aids simulation test battery |
Non-Patent Citations (1)
| Title |
|---|
| YOU_AN081: "《FPC基础知识》", 《百度文库》 * |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160106 |
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| WD01 | Invention patent application deemed withdrawn after publication |