JP2006286909A - Method of manufacturing electronic circuit board and system thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic circuit board and a system thereof, which can improve manufacturing efficiency, ranging from printing of conductive printing agent to inspection function, for a substrate in which a number of singulated substrates are formed collectively. <P>SOLUTION: This method of manufacturing an electronic circuit board collectively forms a number of singulated substrates, each having an independent circuit pattern, and manufactures an electronic circuit board on which electronic component, including a bare chip component on each of the individual substrate. The method has an inspection process before printing, printing process, printing inspection process, component-mounting process, component-mounting inspection process, and underfil process. In this case, for a specific substrate for which the result of inspection is unacceptable among any one of the plurality of inspection processes other than the function inspection process, the inspections for circuit function will not be executed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic circuit board manufacturing method and system for manufacturing an electronic circuit board such as a printed circuit board.

2. Description of the Related Art In recent years, attention has been paid to a method of directly mounting a bare chip component, which is a bare semiconductor chip before sealing with a resin, on a substrate as a mounting method of a substrate used in electronic devices that are significantly reduced in size and weight. Conventionally, as a method of manufacturing a substrate on which an electronic component including this kind of bare chip component is mounted, a cream solder (conductive printing agent) is printed on a predetermined electrode of the substrate and the cream solder is printed on the substrate. There is known a method of positioning and mounting a bare chip component and a resin exterior component which is other surface mount component at a predetermined position (see, for example, Patent Document 1).
Further, a method for performing a function test for testing the function of the electronic circuit board after mounting the electronic component is known (see, for example, Patent Document 2).

JP 2001-308268 A JP-A-11-214442

  A conventional manufacturing method for printing cream solder or mounting electronic components produces a multi-sided substrate in which a large number of individual substrates each having an independent circuit pattern formed on a single substrate are formed at once. It is conceivable to perform a function test on a large number of individual substrates in the substrate. In this case, if it is attempted to perform a function test on all the individual boards in the board including the individual board that has been rejected by the printing or the mounting of the electronic component, there is a very high possibility that it will eventually be rejected. There is a problem in that the efficiency of substrate manufacture is reduced by the amount of functional inspection for a high individual substrate.

  The present invention has been made in view of the above problems, and is an electronic device capable of improving manufacturing efficiency from printing of a conductive printing agent to functional inspection for a substrate on which a large number of individual substrates are formed in a lump. A circuit board manufacturing method and system thereof are provided.

In order to achieve the above object, the invention of claim 1 manufactures an electronic circuit board in which a large number of individual boards each having an independent circuit pattern are collectively formed and electronic parts including bare chip parts are mounted on each individual board. A method for manufacturing an electronic circuit board, comprising: a pre-printing inspection step of reading and inspecting pre-printing inspection information attached to each individual substrate of the substrate before printing; and a conductive material on a predetermined electrode of each individual substrate of the substrate Printing process that prints all kinds of printing agent at once, printing inspection process that inspects the printing state of each individual substrate on the substrate, and positioning and mounting electronic components at predetermined positions on the substrate on which the printing agent is printed Component mounting step, component mounting inspection step for inspecting the mounting state of electronic components on each individual substrate of the substrate, and resin between the bare chip component and the substrate among the electronic components mounted on the substrate It has an underfill process for filling and a function inspection process for inspecting the circuit function of each individual substrate of the substrate, and a failed inspection result was obtained in any of a plurality of inspection processes other than the function inspection process. The individual board portion is characterized in that the above-described circuit function inspection is not executed.
Further, the invention of claim 2 is the electronic circuit board manufacturing method of claim 1, in which the part of the individual board that has been rejected in the plurality of inspection processes other than the function inspection process is rejected. It is characterized in that at least one of the printing inspection process, the component mounting process, the component mounting inspection process, and the underfill process after the inspection process in which the inspection result is obtained is not executed. .
According to a third aspect of the present invention, there is provided an electronic circuit board manufacturing system for manufacturing an electronic circuit board in which a large number of individual boards each having an independent circuit pattern are formed and electronic parts including bare chip parts are mounted on each individual board. A pre-printing inspection device that reads and inspects pre-printing inspection information attached to each individual substrate of the substrate before printing, and a conductive printing agent on a predetermined electrode of each individual substrate of the substrate at once. A printing apparatus for printing, a printing inspection apparatus for inspecting a printing state of each of the substrates, a component mounting apparatus for positioning and mounting an electronic component at a predetermined position of the substrate on which the printing agent is printed, A component mounting inspection apparatus that inspects the mounting state of electronic components on each individual substrate of the substrate, and an underfill that fills resin between the bare chip component and the substrate among the electronic components mounted on the substrate An inspection information management device comprising: a filling device; and a function inspection device for inspecting a circuit function of each individual substrate of the substrate, and acquiring inspection result information by each inspection device for each individual substrate of the substrate via a communication line And the functional inspection device is based on the inspection information managed by the inspection information management device, and the individual substrate on which an unacceptable inspection result is obtained in any of the plurality of inspections other than the functional inspection. The circuit function inspection is not executed for the portion.
According to a fourth aspect of the present invention, in the electronic circuit board manufacturing system according to the second aspect, the plurality of inspection devices other than the functional inspection device are rejected based on the inspection information managed by the inspection information management device. For the part of the individual substrate from which the inspection result is obtained, after the inspection by the inspection device from which the defect inspection result is obtained, the inspection by the printing inspection device, the mounting of the electronic component by the component mounting device, the component mounting inspection At least one of inspection by the apparatus and filling of the resin by the underfill apparatus is not performed.

  According to the first to fourth aspects of the present invention, a pre-printing inspection process, a printing process, a printing inspection process, a component mounting process, a component mounting inspection process, an underfill process, By performing the function inspection process, a substrate substrate on which a large number of individual substrates on which electronic components are mounted is formed at a time is manufactured. Of these board manufacturing processes, the part of the individual board that has obtained an unsuccessful inspection result in any of a plurality of inspection processes other than the function inspection process is already rejected by not performing the circuit function inspection. It is possible to avoid useless function inspection for individual substrates. Therefore, there is an effect that it is possible to improve the manufacturing efficiency from the printing of the conductive printing agent to the function inspection for the substrate on which a large number of individual substrates are formed at once.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a process diagram showing each processing process in the substrate manufacturing method according to the present embodiment. 2A and 2B are respectively an explanatory view and a plan view of a cross-sectional structure of the electronic circuit board 1 manufactured by the substrate manufacturing method of the present embodiment.
As shown in FIG. 2A, the electronic circuit board 1 includes a surface-mounting resin exterior component (hereinafter referred to as a “resin exterior chip”) 1b as a first electronic component, and a second electronic component. This is a substrate on which a bare chip component for surface mounting (hereinafter simply referred to as “bare chip”) 1c is mounted. The resin exterior chip 1b is a component such as a semiconductor IC sealed with resin, a resistor, and a capacitor, and the bare chip 1c is a bare semiconductor IC chip before being sealed with resin. A resin is filled between the substrate 1 and the bare chip 1c so that the bare chip 1c is stably fixed on the substrate 1. On the other hand, the resin is not filled between the substrate 1 and the resin exterior chip 1b.

  Further, as shown in FIG. 2B, the substrate 1 is a substrate in which a large number (for example, several tens to several hundreds) of individual substrates 100 having a predetermined function and the same shape and circuit specifications are arranged in a lump. It is. The substrate 1 is separated into individual substrates 100 after the resin-coated chip 1b and the bare chip 1c are mounted and subjected to a predetermined function test. Each of the separated individual substrates 100 is used as a circuit module component having a predetermined function.

In the substrate manufacturing method shown in FIG. 1, first, a solder printing step (p1) for printing cream solder as a conductive printing agent on the substrate 1 before mounting the resin-coated chip 1b or the bare chip 1c is performed. The After this solder printing process, the same mounting part 1b is used to mount the resin-coated chip 1b on a predetermined position of the substrate 1, and the bare chip 1c is mounted on the substrate 1 at a predetermined position. And a second mounting step (p3) to be mounted on. Note that the order of the first mounting step and the second mounting step may be reversed.
Next, a reflow process (p4) is performed after the mounting process of the resin exterior chip 1b and the bare chip 1c. Thus, after performing two mounting processes (p2, p3), the frequency | count of a heating with respect to the electronic component on the board | substrate 1 can be reduced by performing a reflow process.
Next, after the reflow step, an underfill treatment step (p5) is performed in which the gap between the substrate 1 and the bare chip 1c is filled with a resin as a filler that fills the gap.
As described above, the exterior chip 1b not subjected to the underfill process and the bare chip 1c subjected to the underfill process can be mixedly mounted on the same substrate 1.

  As mentioned above, according to the electronic circuit board manufacturing method of this embodiment, since the frequency | count of a heating with respect to the electronic component mounted on the board | substrate 1 is reduced, the frequency | count of the heat shock given to these electronic components can be reduced. Moreover, since the reflow process of the resin exterior component 1b and the reflow process of the bare chip 1c, which were conventionally performed individually, are simultaneously performed, the number of processing steps can be reduced and workability can be improved.

  A substrate manufacturing system capable of realizing the electronic circuit board manufacturing method includes a printing apparatus that prints cream solder on predetermined electrodes of the substrate 1 and a component mounting apparatus that positions and mounts components at predetermined positions on the substrate 1. As a mounting device, a reflow device for heating the substrate 1 on which the bare chip 1c and the resin sheathing chip 1b are mounted, and an underfill device for filling the gap between the bare chip 1c and the substrate 1 with resin. it can.

Next, each process of the said board | substrate manufacturing method is demonstrated in detail.
[Solder printing process]
FIG. 3 is a schematic configuration diagram of a printing apparatus used in the solder printing process according to the present embodiment. In this printing apparatus, a cream solder 3 as a conductive printing agent is printed on a substrate 1 using a printing mask 2 which is a stencil mask made of a plastic material. In this printing apparatus, the printing mask 2 mounted on the frame member 2 b is fixed by a fixing member 4. The substrate 1 is held on the stage 5 so that the electrode formation surface on which the electrodes are formed is the upper surface. Driving means for driving the stage 5 is provided on the lower surface of the stage 5. This driving means is configured by using a stepping motor 6 that can rotate forward and backward, and a vertical movement mechanism 7 that includes a ball screw and a nut (not shown) that is rotationally driven by the motor 6. By controlling the rotation of the stepping motor 6, the stage 5 can be driven in the vertical direction, and the substrate 1 can be moved to a printing position in contact with the printing mask 2 or separated from the printing mask 2.

  Above the stage 5 moved to the printing position, a filling means for filling the cream solder 3 in the opening 9 of the printing mask 2 is provided. This filling means, as shown in FIG. 4, is for driving the squeegee 8 as a filling member for imprinting the cream solder 3 into the opening 9 of the printing mask 2, and for driving the squeegee 8 in the left-right direction in the figure by a drive belt or the like. The squeegee drive mechanism (not shown) is used. The printing mask 2 is provided with openings 9 corresponding to electrodes on which resin-coated chips that do not need to be subjected to underfill processing are mounted and electrodes on which second electronic components that are subjected to underfill processing are mounted. It has been. For example, in the case of a micro print pattern, the opening 9 is a rectangular opening having a diameter of about 100 to 200 μm or a circular opening having a similar diameter.

  Here, when the opening 9 of the printing mask 2 is a square opening, the inner wall surface substantially perpendicular to the substrate surface (upper surface) of the opening 9 is in the squeegee movement direction (A direction in the figure). The downstream side surface located on the downstream side is preferably an inclined surface 9a inclined with respect to the squeegee movement direction A. Of the inner wall surface of the opening 9 of the printing mask 2, the upstream side surface located on the upstream side in the squeegee movement direction (A direction in the figure) is also the same with respect to the squeegee movement direction (A direction in the figure). The inclined surface 9b is preferably inclined. For example, as shown in FIG. 4, the inclined surfaces 9a and 9b of the printing mask 2 are inclined by approximately 45 degrees with respect to the squeegee movement direction (A direction in the figure).

  The cream solder used when printing using the fine pattern printing mask 2 is preferably, for example, an solder having an average particle size of 10 μm or less and a flux component content of about 11% by mass.

In the printing apparatus having the above-described configuration, first, the printing mask 2 is fixed by the fixing member 4, and then the motor 6 is rotationally driven to raise the stage 5 holding the substrate 1 and bring it into contact with the printing mask 2. Then, the cream solder 3 is set on the upper surface of the printing mask 2 and the squeegee 8 is moved in the direction of the arrow A, whereby the opening 9 of the printing mask 2 is filled with the cream solder 3 and printed (see FIG. 5A). ).
Next, in a state where the printing mask 2 filled with the cream solder 3 and the substrate 1 are kept in contact with each other, timing of a waiting time set in advance based on the printing conditions is started. Then, in a state where the predetermined waiting time has elapsed and the tacking force (adhesive force) of the cream solder 3 has been increased, the motor 6 is rotationally driven to lower the stage 5 in the direction of arrow B in FIG. The printing mask 2 is separated (see FIG. 5B). By this separation operation, an electrode made of cream solder 3 is formed on the pad electrode 1 a of the substrate 1.

Further, in the printing apparatus of the present embodiment, the inner wall surface on the downstream side in the squeegee movement direction of the opening 9 of the printing mask 2 is an inclined surface 9 a that is inclined with respect to the keyge movement direction. Thereby, the cream solder 3 moved by the squeegee 8 is guided to the inclined surface 9a, and the inner wall surface on the downstream side with respect to the squeegee moving direction of the opening 9 does not become a resistance to movement. Therefore, the cream solder 3 is not filled more than necessary on the inner wall surface on the downstream side in the squeegee movement direction.
Further, the inner wall surface on the upstream side in the squeegee moving direction of the opening 9 of the printing mask 2 is also an inclined surface 9b that is inclined with respect to the squeegee moving direction. As a result, the cream solder 3 moved by the squeegee 8 does not fall in the vicinity of the inner wall surface of the opening 9, and the cream solder 3 is sufficient on the inner wall surface side perpendicular to the squeegee moving direction of the opening 9. There is no problem of not being filled.
As described above, by using the printing mask 2 having the inclined surfaces 9a and 9b, the filling surface (upper surface) 3a of the cream solder filled in the opening 9 is substantially flat as shown in FIG. Can be a surface. In particular, when the cream solder 3 is printed on the microelectrode 1a of 0.1 mm or less, it is effective not to form a surface perpendicular to the squeegee moving direction on the inner wall surface of the mask opening 9 as described above. is there. In the case of a microelectrode, the amount of cream solder printed on the microelectrode is also reduced. As a result of the reduced amount of cream solder, even a slight error in the amount of cream solder on the microelectrode may lead to poor bonding with the electronic component. Therefore, the amount of cream solder on the microelectrode can be made uniform by not forming a surface perpendicular to the squeegee movement direction on the inner wall surface of the printing mask opening 9 as described above. Can be reliably prevented.

[Mounting process]
FIG. 6 is a perspective view showing an example of a schematic configuration of a mounting device 10 as a component mounting device used in a mounting process for mounting the resin-coated chip 1b and the bare chip 1c on the substrate 1. FIG. The mounting apparatus 10 uses a reel cassette 12 as a component holding member for both the resin-coated chip 1b and the bare chip 1c. A plurality of reel cassettes 12 are fixed on the cassette moving table 3 in a continuous manner. In the reel cassette 12, a reel 15 in which a carrier tape is wound around a winding shaft that is a packing container is set. Further, the cassette moving table 13 is moved in the X direction in the figure by a driving mechanism (not shown).

  On the front side of the cassette moving table 13 in the figure, a rotating table 17 that rotates around the rotating suspension column 16 is disposed. On the circular orbit of the turntable 17, a component suction unit 18 that sucks surface mounting electronic components such as the resin outer chip 1b and the bare chip 1c is fixed. The component suction unit 18 includes a suction nozzle 18a for sucking electronic components on the lower end side. The suction nozzle 18a has a nozzle hole on its bottom surface, and sucks an electronic component by sucking gas from the nozzle hole. The suction nozzle 18a sucks an electronic component held on the component supply unit 12a of the reel cassette 12 positioned immediately below the position A when it is moved to the position A in the figure by the rotation of the rotary table 17. Thereby, the electronic component is sucked and held at the tip of the suction nozzle 18a. By moving the cassette moving table 13 in the X direction in the figure, among the plurality of reel cassettes 12, the reel cassette corresponding to the electronic component to be sucked is moved to the suction position (position A in the figure) of the suction nozzle 18a. Let

  Below the rotary table 17 is disposed an XY table 19 that is moved in the X and Y directions in the figure by a drive mechanism (not shown), and the substrate 1 is fixed on the upper surface thereof. A predetermined electrode pattern is formed on the surface of the substrate 1, and a solder paste pattern corresponding to each lead is printed on the electrode pattern in advance by a solder printing process. The electronic parts such as the resin outer chip 1b and the bare chip 1c adsorbed by the adsorption nozzle 18a are moved to a predetermined position on the substrate 1 by the rotation of the rotary table 7 or the movement of the XY table 19, and then the lead Is mounted by being positioned by the suction nozzle 18a so as to be placed on the corresponding solder paste pattern. It is also possible to use a mounting device that adjusts the mounting position by moving only one of the printed circuit board 1 and the suction nozzle 18a.

  FIG. 7 is a perspective view showing an example of the reel cassette 12 in a state where the reel 15 is set. As illustrated, the reel cassette 12 is formed in a flat shape, and a component supply unit 12c is provided on the base 12b. A reel holder 12d is provided on the rear end side of the base 12b, and a reel 15 including a winding shaft and a carrier tape 11 is set therein. In addition, a take-up reel 12e is provided above the component supply unit 12c so as to take up the carrier tape fed from the reel 15 as electronic components are supplied. Note that the reel winding shaft has the character of a packaging container.

  Although not shown in FIG. 7 for the sake of convenience, all reel cassettes 12 in the facility are labeled with cassette serial number barcodes, which are mounting device identification information for individually identifying each. Is affixed.

  As shown in FIG. 8, the carrier tape 11 is provided with recesses 11a for holding the electronic components 1b and 1c at equal intervals, and holds, for example, 2000 electronic components in the recesses 11a in the initial state. Then, as the take-up reel 12e rotates, it moves in the component supply unit 12c, and the recess 11a moves to the component supply unit 12a provided near the tip of the component supply unit 12c. The electronic component in the recess 11a that has moved to the component supply unit 12a is sucked by the suction nozzle 18a of the mount device.

FIG. 9 is a schematic diagram showing a state in which the suction nozzle 18a sucks the electronic components 1b and 1c held in the recess 11a of the carrier tape 11. As shown in FIG. When the recessed part 11a is located in the component supply part 12a, the movement of the carrier tape 11 is stopped. Then, the suction nozzle 18 a of the mounting device 10 moves downward in the figure and comes into contact with the surface 11 b around the concave portion of the carrier tape 11. Here, the depth of the recess 11a is set so that the electronic component does not protrude from the surface 11b around the opening of the carrier tape. Further, the bottom surface of the suction nozzle 18a provided with the nozzle holes is brought into contact with the surface 11b around the opening of the carrier tape. This prevents the electronic component and the suction nozzle 18a from coming into contact with each other, and prevents the electronic component from being damaged by the suction nozzle 18a coming into contact with the electronic component 1b when the suction nozzle 18a is lowered.
When the suction nozzle 18a comes into contact with the surface 11b of the carrier tape 11, the electronic component held in the recess 11a is sucked by the suction nozzle 18a and sucked by the suction nozzle 18a. Since the suction nozzle 18a does not block all the openings of the recess 11a, and the air hole 18b is formed between the suction nozzle 18a and the suction nozzle 18a during the suction operation, the inside of the recess 11a is in a vacuum state. There is no. When the electronic components 1b and 1c are attracted to the suction nozzle 18a, the suction nozzle 18a is raised and positioned and mounted at a predetermined position on the substrate 1 on the turntable 19.

  FIG. 10 is a perspective view showing a schematic configuration of a mounting apparatus 20 according to another configuration example. This mounting device 20 uses a tray 22 as a component holding member for each of the resin-coated chip 1b and the bare chip 1c. As shown in FIG. 10, a plurality of trays 22 are fixed on a tray base 23 via a buffer material 21 such as rubber. A plurality of recesses 22a are formed at equal intervals in the tray 22, and electronic components 1b and 1c are held in the recesses 22a, respectively. Also in the mounting device 20, as in the first mounting device 10, the XY table 29 that holds the substrate 1 and the electronic components 1 b and 1 c held in the concave portion 22 a are adsorbed, and the substrate 1 is predetermined. A suction nozzle 28a disposed at a position, a rotary table 27 for holding the suction nozzle 28a, and the like are provided. Then, the electronic components 1b and 1c held in the recess 22a are sequentially sucked by the suction nozzle 28a and are arranged at predetermined positions on the substrate 1. When the electronic components 1b and 1c are removed from the tray 22, the suction nozzle 28a is moved to the next tray, and a CCD camera (not shown) attached to the suction nozzle 28a is positioned diagonally with one end of the tray 22 and this end. The position of the tray 22 on the tray table 23 is detected by detecting the end. When the position of the tray 22 is detected, the electronic components 1b and 1c held in the concave portion 22a of the tray are again picked up by the nozzle and arranged at a predetermined position on the substrate.

  Also in the mounting device 20, when the electronic components 1b and 1c held in the recess 22a of the tray 22 are attracted to the suction nozzle 28a, as shown in FIG. 10, the opening surface 22b of the tray 22 and the suction nozzle 28a are The electronic parts 1b and 1c and the suction nozzle 28a are prevented from coming into contact with each other. Thereby, also in this mounting apparatus 20, it is prevented that the electronic components 1b and 1c are damaged by contact | abutting with the suction nozzle 28a. When the suction nozzle 28a comes into contact with the opening surface 22b of the tray 22, the tray 22 vibrates due to an impact at the time of contact. The electronic components 1b and 1c held in the recess 22a are aligned so as to be arranged on the substrate 1 in a predetermined direction. However, the vibration of the tray 22 may change the orientation of the electronic components 1b and 1c held in the recess 22a. In particular, in the case of the bare chip 1c having a small size, the direction is easily changed by vibration. When the orientation of the electronic components 1b and 1c held in the recess 22a changes in this way, the electronic components 1b and 1c cannot be arranged on the substrate 1 in the correct orientation. Therefore, the mounting device 20 of this configuration example includes a buffer material 21 between the tray 22 and the tray base 23. Thereby, even if the suction nozzle 28a abuts on the surface of the tray 22, the shock absorbing material 21 absorbs an impact at the time of abutment, so that the vibration of the tray 22 is alleviated. Therefore, the direction of the electronic components 1b and 1c held in the recess 22a is prevented from changing, and the electronic components 1b and 1c are prevented from being arranged on the substrate 1 in the correct direction. In this configuration example, the cushioning material 21 is disposed between the tray 22 and the tray base 23. However, the cushioning material is disposed on the surface of the tray 22, or the tray contact surface of the suction nozzle 28a. A cushioning material may be provided.

  FIG. 12 is a perspective view showing a schematic configuration of a mount device 30 according to still another configuration example. In the mounting device 30, a reel cassette 32 is disposed as a component holding member of the resin-coated chip 1 b that is not subjected to underfill processing on the right side (back side) in FIG. 11. A tray 42 is disposed on the left side (front side) in FIG. 11 as a component holding member of the bare chip 1c to be subjected to underfill processing.

The rotary table 37 is provided with a first suction nozzle 38a that sucks the resin-coated chip 1b held on the reel cassette 32 and a second suction nozzle 48a that sucks the bare chip 1c held on the tray 42. ing. Since the bare chip 1c is smaller than the resin-coated chip 1b, when the resin-coated chip 1b is to be sucked by the suction nozzle 48a designed for sucking the bare chip 1c, a sufficient suction force to hold the resin-coated chip 1b. May not be able to get. In addition, when trying to suck the bare chip 1c with the suction nozzle 38a designed for sucking the resin-coated chip 1b, on the contrary, the suction force is too strong and the bare chip 1c comes into contact with the nozzle with momentum. The bare chip 1c may be damaged. For this reason, the mounting device 30 of this configuration example includes a first suction nozzle 38a for a resin-coated chip and a second suction nozzle 48a for a bare chip.
Here, when mounting the resin-coated chip 1b on the substrate 1 on the XY table 39, the rotary table 37 is rotated and the first suction nozzle 38a is moved to the first suction position (position A in the figure). Move. When the first suction nozzle 38a moves to the first suction position, the nozzle is lowered and brought into contact with the opening surface of the carrier tape 11, and the resin held in the recess when the first suction nozzle 38a is lowered. The exterior chip 1b and the first suction nozzle 38a are prevented from coming into contact with each other. Then, the resin-covered chip 1 b held in the recess is adsorbed by the nozzle and disposed at a predetermined position on the substrate 1.
On the other hand, when mounting the bare chip 1c on the substrate 1 on the XY table 39, the rotary table 37 is rotated, and the second suction nozzle 48a is moved to the second suction position (position B in the figure). Then, the nozzle is lowered and brought into contact with the opening surface of the tray 42, so that the bare chip 1c held in the concave portion and the second suction nozzle 48a do not come into contact with each other when the second suction nozzle 48a is lowered. I am doing so.

  Also, in the case of the mounting device 30 of this configuration example, the buffer material 21 is provided between the tray 42 and the tray base 43 as in the mounting device 20 described above, and the second suction nozzle 48 a is provided on the opening surface of the tray 42. It absorbs the impact force when abutting. Then, the bare chip 1c held in the concave portion is sucked by the suction nozzle 48a and mounted at a predetermined position on the substrate 1.

  In addition, although the mounting apparatus 30 of this structural example uses the reel cassette 32 as a component holding member of the resin exterior chip | tip 1b, and uses the tray 42 as a component holding member of the bare chip 1c, it is not restricted to this. For example, a tray may be used as the component holding member for the resin-coated chip 1b, and a reel cassette may be used as the component holding member for the bare chip 1c. Alternatively, two rotation tables 37 may be provided, one serving as the first rotation table holding the first suction nozzle 38a and the other serving as the second rotation table holding the second suction nozzle 48a. In this way, the disposing step can be speeded up by providing the rotary table separately.

  According to the mounting devices 10, 20, and 30 having the above-described configuration, both the resin exterior chip 1 b and the bare chip 1 c can be performed by the same mounting device 30, thereby reducing the manufacturing time, manufacturing cost, and the like of substrate manufacturing. be able to.

In the mounting devices 10, 20, 30 having the above-described configuration, it is preferable to switch the suction pressure when the suction nozzles 18 a, 28 a, 38 a, 48 a suck parts. Specifically, the adsorption pressure is switched so that the adsorption pressure when the adsorption nozzle adsorbs the bare chip 1c is smaller than the adsorption pressure when the adsorption nozzle adsorbs the resin-coated chip 1b. For example, the adsorption pressure when the adsorption nozzle adsorbs the bare chip 1c is reduced by 80% (20% of the standard pressure) of the adsorption pressure (standard pressure) when the adsorption nozzle adsorbs the resin-coated chip 1b. By switching the suction pressure in this manner, the resin-coated chip 1b can be reliably held by being sucked by the suction nozzle while preventing the bare chip from being damaged by the impact when the bare chip 1c is attracted to the suction nozzle. This is particularly effective when a reel cassette is used as the component holding member.
The adsorption pressure switching means for switching the adsorption pressure can be configured using a controller of each mount device 10, 20, 30 and a suction device such as a suction pump controlled by the controller.

Further, in the mounting devices 10, 20, and 30 having the above-described configuration, each of the suction nozzles has a constant impact force (dynamic load) generated when attaching at least one of the bare chip 1 c and the resin exterior chip 1 b to the substrate. It is preferable to change at least one of the bottom dead center and the moving speed of the suction nozzle when the component is mounted on the substrate. In particular, since the bare chip 1c has a high possibility of being damaged by an impact when being mounted on the substrate, the suction nozzle of the bare chip 1c is mounted so that the impact force (dynamic load) is lower than that of the resin-coated chip 1b. Set at least one of bottom dead center and moving speed. Here, the “bottom dead center” is the position of the lowest point where the suction nozzle is lowered until it comes closest to the substrate.
The bottom dead center and the moving speed of the suction nozzle can be set, for example, as follows. First, a pseudo substrate member having a load cell to which a pressure sensor as force detecting means is attached is set at a position where the substrate is set in the mounting apparatus. With respect to the pseudo substrate member, the suction nozzle that sucks the component is lowered and stopped at a predetermined position. The impact force (dynamic load) at the time of stop is calculated based on the output of the pressure sensor of the load cell. This measurement and calculation are performed by changing the bottom dead center and moving speed of the suction nozzle. Then, the bottom dead center and the moving speed of the suction nozzle are set so that the impact force (dynamic load) is below a certain force. Here, when one unit of the moving step amount when the suction nozzle descends is large, the position of the suction nozzle when the component held by the suction nozzle comes into contact and the pressure sensor of the load cell starts to output is determined. It may be the bottom dead center.
As described above, by reducing the impact force (dynamic load) generated when the above parts are mounted on the board to a predetermined level or less, excessive crushing of the solder can be prevented and stress applied to the parts can be reduced. Can prevent the parts from being damaged. In particular, this is effective when the component to be mounted is a bare chip that is easily damaged.
If the moving speed when the suction nozzle is lowered is large, variation in the stop position of the suction nozzle becomes large and it becomes difficult to control the impact force (dynamic load), while the moving speed when the suction nozzle is lowered is too slow. The mount processing time becomes long. Therefore, it is preferable to control the movement of the suction nozzle so that the suction nozzle is lowered at a higher speed to the vicinity of the substrate and lowered at a lower speed from there to the bottom dead center. Specifically, a standard speed of about several tens of mm / sec until the distance between the bottom surface of the component held by the suction nozzle and the surface of the substrate reaches a preset distance (for example, about 0.2 to 0.4 mm) ( For example, it is moved at a moving speed of about several mm / sec (for example, 2 mm / sec) from the position to the bottom dead center. Thus, by controlling the moving speed of the suction nozzle in two steps, the impact force (dynamic load) generated when the component is mounted on the substrate is suppressed to a predetermined magnitude or less while suppressing an increase in the mounting processing time. It becomes possible. Here, in the case of the resin exterior component 1b in which the component to be mounted is not easily damaged, the mounting speed is given priority, without performing the two-stage control of the moving speed, so that the mounting speed is given priority. You may make it move at a speed | rate (for example, 88 mm / sec).
The setting changing means for changing the setting of at least one of the bottom dead center and the moving speed of the suction nozzle can be configured using the controller of each of the mounting devices 10, 20, 30.

[Underfill process]
FIG. 13 is an explanatory diagram of the underfill processing step. In this underfill processing step, a gap 55 between the substrate 1 and the bare chip 1c generated by the interposition of the bump 1d is filled with a resin 55 as a filler that fills the gap 54. In FIG. 13, the resin 55 is first supplied (applied) to a portion of at least one side of the gap 54 between the substrate 1 and the bare chip 1 c by the dispenser 56. Then, the resin 55 applied on the substrate 1 penetrates into the gap due to capillary action due to the gap 54 between the substrate 1 and the bare chip 1c. Thereby, the resin 55 is filled between the bare chip 1 c and the substrate 1, and the bare chip 1 c can be reliably fixed on the substrate 1. The underfill process is not limited to this and can be variously changed. For example, the substrate 1 may be vibrated using an ultrasonic application device or the like, and the resin 55 may be filled in the gap 54 between the substrate 1 and the bare chip 1c. Thus, by giving vibration to the substrate 1, it is possible to shorten the time until the resin 55 is filled between the bare chip 1 c and the substrate 1.

Next, an entire substrate manufacturing method including the substrate inspection process (inspection apparatus) and its system configuration will be described.
FIG. 14 is a block diagram illustrating a schematic configuration of a substrate manufacturing system including an inspection apparatus. In FIG. 14, the reflow device is not shown.
This board manufacturing system includes a reject mark reading device 210 as a pre-printing inspection device, a printing device 220, a printing inspection device 230, a mounting device 240 (10, 20, 30, 40), and a component mounting inspection device. Visual inspection device 250, underfill device 260, underfill inspection device 270, and function inspection device 280. Each of these various devices is controlled by dedicated controllers 210a to 280a configured by a microcomputer or a personal computer.
The board manufacturing system also includes a board information management server 300 as an inspection information management apparatus that can communicate with the controllers 210a to 280a via the LAN 310 that is a communication line. This board information management server 300 has a database composed of data storage means composed of a hard disk or the like. For example, the board information management server 300 has a data table format as shown in Table 1 for each of a number of individual boards constituting each board. Stores board-related information such as inspection results. “0” in Table 1 indicates a pass result, and “1” indicates a fail result. The substrate is identified by the substrate ID specified by the barcode attached to the substrate.

  The reject mark reading device 210 reads the display of the appearance inspection result obtained in the inspection before printing performed at the time of manufacturing the substrate to be printed. The appearance inspection result is attached to the surface of each individual substrate. As an appearance inspection result given to each individual substrate, for example, a fail mark that is marked on a free area on the surface of the individual substrate only when it is rejected due to, for example, a plating defect or a surface scratch. The rejection mark reading device 210 transmits the result of reading the appearance inspection result together with the data of the result of reading the barcode attached to the substrate to the substrate information management server 300 via the controller 210a and registers the result. .

  The print inspection apparatus 230 includes, for each individual substrate in each substrate, the controller 230a, the inspection point data printed on the individual substrate, and the barcode reading result data attached to the substrate. Via the board information management server 300 and register.

  The mounting device 240 mounts electronic components only on normal individual substrates that have obtained a pass result based on the inspection results for each individual substrate included in the substrate obtained up to the previous step. To be controlled. This control is executed by the controller 240a based on the inspection data up to the previous process stored in the board information management server 300. With this control, it is possible to avoid useless mounting operation of electronic components, and the efficiency of the mounting process is improved. Note that the instruction data to the mounting device 240 that instructs the mounting operation of the electronic component for each individual board is registered in the board information management server 300.

The appearance inspection apparatus 250 uses the bar attached to the substrate to inspect the data of the inspection result of whether or not the correct electronic component is mounted at a predetermined position of the individual substrate for each individual substrate in each substrate. Along with the data of the code reading result, it is transmitted to the board information management server 300 via the controller 250a and registered.
The appearance inspection apparatus 250 has obtained a pass result based on the inspection results (pre-print inspection results and print inspection results) for each individual substrate included in the substrate obtained up to the previous step. You may control so that an external appearance test | inspection is carried out only about a normal separate substrate. In this case, useless appearance inspection operation can be avoided, and the efficiency of the appearance inspection process is improved.

  The underfill device 260 performs underfill on the bare chip only for a normal individual substrate that has obtained a pass result based on the inspection result for each individual substrate included in the substrate obtained up to the previous step. It is preferable to control in such a manner. This control is executed by the controller 260a based on the inspection data up to the previous process stored in the board information management server 300. By this control, useless underfill operation can be avoided, and the efficiency of the underfill process is improved. Note that the instruction data to the underfill device 260 for instructing the underfill operation for each individual board is registered in the board information management server 300.

The underfill inspection device 270 is an inspection result obtained by inspecting whether or not the resin is correctly filled between the bare chip mounted at a predetermined position of the individual substrate and the substrate for each individual substrate in each substrate. The data is transmitted to the board information management server 300 via the controller 270a and registered together with the data of the barcode reading result attached to the board.
In addition, this underfill inspection apparatus 270 is based on the inspection result (pre-printing inspection result, printing inspection result, appearance inspection) for each individual substrate included in the substrate obtained up to the previous process. You may control to perform an underfill inspection only about the obtained normal separate board | substrate. In this case, useless underfill inspection operation can be avoided, and the efficiency of the underfill inspection process is improved.

  Based on the inspection information managed by the board information management server 300, the functional inspection device 280 is one of a plurality of inspections (pre-print inspection, print inspection, appearance inspection, underfill inspection) other than the functional inspection. The controller 280a controls the portion of the individual board from which the failed inspection result is obtained so as not to perform the circuit function inspection.

  As described above, according to the present embodiment, any of a plurality of inspection processes other than the function inspection process among the processes for manufacturing a substrate substrate on which a large number of individual substrates on which electronic components are mounted is formed at one time is rejected. By not performing the inspection of the circuit function for the portion of the individual substrate where the inspection result is obtained, it is possible to avoid useless function inspection for the individual substrate that has already been rejected. Therefore, it is possible to improve the manufacturing efficiency from the cream solder printing to the function inspection of each individual substrate for a substrate on which a large number of individual substrates are formed in a lump.

Process drawing which shows each process process in the board | substrate manufacturing method which concerns on embodiment of this invention. (A) is a top view of the electronic circuit board manufactured with the substrate manufacturing method. (B) is explanatory drawing of the cross-sectional structure of the board | substrate. 1 is a schematic configuration diagram of a printing apparatus used in a printing process. Explanatory drawing of the opening part of the printing mask of the printing apparatus. (A) is explanatory drawing which shows the mode of the cream solder with which the opening part of the printing mask was filled with the printing apparatus. (B) is explanatory drawing which shows the mode of the cream solder in the opening part during the separation | spacing operation | movement in the printing apparatus. The schematic block diagram which shows an example of the mounting apparatus used at a mounting process. The perspective view which shows an example of a reel cassette and the reel set to this. Sectional drawing of a carrier tape. The schematic diagram which a suction nozzle adsorb | sucks the electronic component currently hold | maintained at the recessed part of a carrier tape. The schematic block diagram of the mounting apparatus which concerns on the other structural example. The schematic diagram by which an adsorption nozzle adsorb | sucks the electronic component currently hold | maintained at the recessed part of a tray. Furthermore, the schematic block diagram of the mounting apparatus which concerns on another structural example. The schematic diagram which shows an underfill process process. The block diagram which shows schematic structure of the board | substrate manufacturing system including an inspection apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 1b Resin exterior chip | tip 1c Bare chip | tip 2 Print mask 3 Cream solder 10, 20, 30 Mounting apparatus 100 Individual board | substrate 210 Refusal mark reader 210
DESCRIPTION OF SYMBOLS 220 Printing apparatus 230 Print inspection apparatus 240 Mount apparatus 250 Appearance inspection apparatus 260 Underfill apparatus 270 Underfill inspection apparatus 280 Function inspection apparatus 300 Board | substrate information management server 310 LAN

Claims (4)

An electronic circuit board manufacturing method for manufacturing an electronic circuit board in which a large number of individual boards each having an independent circuit pattern are collectively formed and electronic components including bare chip parts are mounted on each individual board,
A pre-printing inspection process that reads and inspects pre-printing inspection information attached to each individual substrate of the substrate before printing; and
A printing process in which a conductive printing agent is collectively printed on a predetermined electrode of each individual substrate of the substrate;
A printing inspection process for inspecting the printing state of each individual substrate of the substrate;
A component mounting step of positioning and mounting the electronic component at a predetermined position on the substrate on which the printing agent is printed;
A component mounting inspection process for inspecting the mounting state of electronic components on each individual substrate of the substrate;
An underfill step of filling a resin between the bare chip component and the substrate among the electronic components mounted on the substrate;
A function inspection step of inspecting the circuit function of each individual substrate of the substrate,
Electronic circuit board manufacturing characterized in that the inspection of the circuit function is not performed on the part of the individual board that has obtained a failed inspection result in any of a plurality of inspection processes other than the function inspection process. Method. In the electronic circuit board manufacturing method according to claim 1,
For the parts of the individual substrate where the failed inspection results were obtained in a plurality of inspection processes other than the functional inspection process, the printing inspection process and the component mounting after the inspection process where the failed inspection results were obtained An electronic circuit board manufacturing method, wherein at least one of a process, the component mounting inspection process and the underfill process is not executed. An electronic circuit board manufacturing system for manufacturing an electronic circuit board in which a large number of individual boards each having an independent circuit pattern are collectively formed and electronic parts including bare chip parts are mounted on each individual board,
A pre-printing inspection device that reads and inspects pre-printing inspection information attached to each individual substrate of the substrate before printing; and
A printing apparatus that collectively prints a conductive printing agent on a predetermined electrode of each individual substrate of the substrate;
A printing inspection apparatus for inspecting the printing state of each individual substrate of the substrate;
A component mounting apparatus for positioning and mounting an electronic component at a predetermined position on a substrate on which the printing agent is printed;
A component mounting inspection device that inspects the mounting state of electronic components on each individual substrate of the substrate;
An underfill device for filling a resin between the bare chip component and the substrate among the electronic components mounted on the substrate;
A function inspection device for inspecting the circuit function of each individual substrate of the substrate;
An inspection information management device that acquires inspection result information by each inspection device for each individual substrate of the substrate via a communication line,
The functional inspection apparatus is based on the inspection information managed by the inspection information management apparatus, for the portion of the individual substrate where a failure inspection result is obtained in any of the plurality of inspections other than the functional inspection. An electronic circuit board manufacturing system, wherein the inspection of the circuit function is not executed. The electronic circuit board manufacturing system according to claim 2,
Based on the inspection information managed by the inspection information management device, the defect inspection result is obtained for the part of the individual substrate where the inspection results that have been rejected by the plurality of inspection devices other than the functional inspection device are obtained. After the inspection by the inspection device, at least one of inspection by the printing inspection device, mounting of electronic components by the component mounting device, inspection by the component mounting inspection device, and filling of resin by the underfill device is not performed. An electronic circuit board manufacturing system characterized by that.

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