CN105226175A - A kind of LED light source and preparation method thereof - Google Patents
A kind of LED light source and preparation method thereof Download PDFInfo
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- CN105226175A CN105226175A CN201410274139.5A CN201410274139A CN105226175A CN 105226175 A CN105226175 A CN 105226175A CN 201410274139 A CN201410274139 A CN 201410274139A CN 105226175 A CN105226175 A CN 105226175A
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- light source
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Abstract
<b> the present invention relates to a kind of LED light source and preparation method thereof, belong to LED preparing technical field, LED light source of the present invention comprises LED chip, for the composition such as transparency carrier of packaged LED, substrate is provided with the groove preventing blue leakage, arranged by groove and not only reduce light leak rate, and entirety improves the light emission rate of LED light source.</b>
Description
Technical field
the present invention relates to a kind of LED light source and preparation method thereof, belong to LED preparing technical field.
Background technology
the advantages such as LED is high with its luminous efficiency, light source power consumption is few, long service life, security reliability are strong, environmental, energy-conservation, make it more and more favor by consumers in general.On the other hand, under the background that Present Global energy starved worry raises once again, energy savings is the important problem that we will face future, at lighting field, the application of LED luminous product is just attract the sight of common people, and some developed countries expand fierce technology contest around the development of LED in the world.The U.S. is investment 500,000,000 dollars enforcement " National Semiconductor illumination plan " from 2000, and European Union also announces to start similar " rainbow plan " in July, 2000.Under the support that the Department of Science and Technology of China plans in " 863 ", the plan of development semiconductor lighting is proposed first in June, 2003.LED, as a kind of novel green light source product, can be widely used in the fields such as various instruction, display, decoration, backlight, general lighting and urban landscape.
lED and Semiconductor light-emitting diode lamp are a kind of semiconducting solid luminescent devices.It utilizes solid semiconductor LED chip as luminescent material, releases superfluous energy in the semiconductors and cause photo emissions, directly send red, yellow, blue, green, blue or green, orange, purple, white light by charge carrier generation compound.But its brightness of semiconductor issued light excited without fluorescent material is very limited, so we need to apply fluorescent glue on LED chip, LED chip issued light under work illuminating state is ejected to greatest extent, if LED chip issued light under work illuminating state fails to be excited by fluorescent material completely and emits, this phenomenon is called as light leak, the blue light of LED chip will leak, described blue light is not the light of our daily described blueness, and refer to the blue light of wavelength between 435 nanometer to 440 nanometers, the blue light of this wave band has very high energies, crystalline lens can be penetrated to go directly retina.Blue light illumination retina can produce free radical, and these free radicals can cause retinal pigment epithelium to become feeble and die, and epithelial decline can cause photaesthesia cell lack nutrient thus cause vision impairment, and these damages are irreversible.So we do one's utmost to need to find the LED light source that a kind of energy self prevents blue leakage in LED flow of research.
Summary of the invention
the present inventor is that the light quality that goes out improving LED light source prevents blue light from revealing, a kind of preparation method of LED light source is disclosed through numerous experiments, comprise, transparency carrier is chosen, the coating of die bond, lead-in wire, fluorescent glue, when it is characterized in that transparency carrier is chosen, transparency carrier adds groove, by the blue leakage under can effectively preventing LED chip on transparency carrier in working order that arranges of groove.
the preparation method of LED light source of the present invention, the groove of blue leakage that prevents on transparency carrier is arranged at the surrounding of the surrounding of each LED chip or the unit of a few LEDs chip composition or is arranged at the surrounding of whole LED chip group or the both sides of whole LED chip group.
the preparation method of LED light source of the present invention, groove on transparency carrier is not only arranged at the side pasting LED chip, because substrate of the present invention is transparency carrier, LED chip also can penetrate from substrate back through substrate, so our transparency carrier upper and lower surface of the present invention is equipped with groove lighting the light launched under operating state.
the preparation method of LED light source of the present invention, described transparency carrier upper and lower surface is equipped with groove, do not reveal for making blue light, groove location on upper and lower surface staggers, and the degree of depth of upper and lower surface groove and equal the thickness of transparency carrier, or the degree of depth of transparency carrier upper and lower surface groove and be greater than the thickness of transparency carrier.
the preparation method of LED light source of the present invention, described transparency carrier we can be the substrate of various transparent material, preferred glass transparency carrier.
lED light source preparation method of the present invention, the side groove of described transparency carrier corresponding chip position at chip side and the transparency carrier back side can be one or two or more.
lED light source preparation method of the present invention, described fluorescent glue coating, fluorescent glue for encapsulating LED chip of the present invention is not only coated on LED chip, stick the near zone of LED chip and transparency carrier correspondence pastes LED chip place and near zone, and coating extends to groove, and be provided with fluorescent glue in groove.
the present invention on the other hand provides the LED light source utilizing LED light source preparation method of the present invention to prepare, and described LED light source comprises LED chip, transparency carrier etc. for packaging LED chips, transparency carrier is provided with the groove preventing blue leakage.Groove on transparency carrier effectively can prevent the leakage of LED chip blue light under the operating state lighted.
a kind of LED light source of the present invention, all excited by fluorescent material for making every LEDs chip issued light, complete in blue light leakage, the groove of blue leakage that prevents on described transparency carrier is arranged at the surrounding of the surrounding of each LED chip or the unit of a few LEDs chip composition or is arranged at the surrounding of whole LED chip group or the both sides of whole LED chip group.
a kind of LED light source of the present invention, groove on transparency carrier is not only arranged at the side pasting LED chip, because substrate of the present invention is transparency carrier, LED chip also can penetrate from substrate back through substrate, so our transparency carrier upper and lower surface of the present invention is equipped with groove lighting the light launched under operating state.
a kind of LED light source of the present invention, described transparency carrier upper and lower surface is equipped with groove, do not reveal for making blue light, groove location on upper and lower surface staggers, and the degree of depth of upper and lower surface groove and equal the thickness of transparency carrier, or the degree of depth of transparency carrier upper and lower surface groove and be greater than the thickness of transparency carrier.
a kind of LED light source of the present invention, described transparency carrier we can be the substrate of various transparent material, preferred glass transparency carrier.
a kind of LED light source of the present invention, the side groove of described transparency carrier corresponding chip position at chip side and the transparency carrier back side can be one or two or more.
a kind of LED light source of the present invention, fluorescent glue for encapsulating LED chip of the present invention is not only coated on LED chip, stick the near zone of LED chip and transparency carrier correspondence pastes LED chip place and near zone, and coating extends to groove, and be provided with fluorescent glue in groove.
Accompanying drawing explanation
accompanying drawing of the present invention is in order to the present invention is further described, but not the restriction to invention scope of the present invention.
fig. 1, LED light source schematic diagram of the present invention.
fig. 2, LED light source schematic diagram of the present invention.
fig. 3, LED light source schematic diagram of the present invention.
fig. 4, LED light source generalized section of the present invention.
fig. 5, LED light source generalized section of the present invention.
illustrate: 1 for transparency carrier, and 2 is LED chip, 3 is the groove at the transparency carrier back side, and 4 is the groove in transparency carrier front, and 5 is the electrode on transparency carrier.
Embodiment
embodiments of the invention are in order to the present invention is further described, but not the restriction to invention scope of the present invention.
embodiment 1
get LED chip and the transparency carrier for packaging LED chips, around fixing each LED chip the surrounding of the unit of a few LEDs chip composition or be arranged at the surrounding of whole LED chip group or the both sides of whole LED chip group transparency carrier on be provided with the groove preventing blue leakage, groove is arranged at transparency carrier upper and lower surface, and the groove location of upper and lower surface staggers mutually, the degree of depth of upper and lower surface groove and the thickness of>=transparency carrier.LED chip on the transparent substrate after die bond, lead-in wire its fluorescent glue to be not only coated on chip and to extend to the groove of transparency carrier, and be coated with fluorescent glue in groove, the back side of the transparency carrier at the corresponding chip place of pasting also is coated with fluorescent glue, and also extend to back side groove, in groove, be also provided with fluorescent glue.
embodiment 2LED light source light emission rate contrasts
get A, B group LED light source, respectively divide again the LED light source of 3 group's different sizes, each group LED light source 15, A group is reeded LED light source on substrate of the present invention, and as Figure 1-3, Fig. 1 is first group to 3 small components, and Fig. 2 is second group, and Fig. 3 is the 3rd group.The difference of B Zu Ge group and A group is only on groove is arranged, and B group does not have groove to arrange, other Chip scale, quantity, substrate specification, and fluorescent material and coating position etc. thereof are all identical with A group.Through testing each light source igniting, its light emission rate is to such as table 1, LED light source light emission rate contrast table.
table 1, LED light source light emission rate contrast table
comprehensive upper table, the light emission rate of the relative B group of the LED light source that A group is first group first group of LED light source increases 7.28%; The light emission rate of the relative B group of the LED light source that A group is second group second group of LED light source increases 7.31%; The light emission rate of the relative B group of the LED light source that A group is the 3rd group the 3rd group of LED light source increases 6.94%.By the present invention, groove is set on the transparent substrate, effectively can improves the light emission rate of LED light source.
embodiment 3LED light source light leak contrasts
get A, B group LED light source, respectively divide again the LED light source of 3 group's different sizes, each group LED light source 15, A group is reeded LED light source on substrate of the present invention, and as Figure 1-3, Fig. 1 is first group to 3 small components, and Fig. 2 is second group, and Fig. 3 is the 3rd group.The difference of B Zu Ge group and A group is only on groove is arranged, and B group does not have groove to arrange, other Chip scale, quantity, substrate specification, and fluorescent material and coating position etc. thereof are all identical with A group.Through testing each light source igniting, it goes out light leak, carries out record, here only each LED light source whether light leak carries out record calculating probability, light leak amount is not kept a record.Specifically in table 2, LED light source light leak ratio table.
table 2, LED light source light leak contrast table
comprehensive upper table, A group first group, second group all without light leakage phenomena, but it is qualified owing to having a light source to fail in the 3rd group, by testing crew, it is measured, find that this LED light source transparency carrier upper and lower surface groove total height is less than substrate thickness, so there is certain light leakage phenomena, but the light leak amount average of relative each group of B group, this light source light leak amount of A group only 2.3%.And all there is light leakage phenomena in each light source of B group.
Claims (14)
1. a preparation method for LED light source, comprises, and transparency carrier is chosen, the coating of die bond, lead-in wire, fluorescent glue, it is characterized in that arranging the groove preventing blue leakage on the transparent substrate.
2. the preparation method of LED light source according to claim 1, is characterized in that the groove of blue leakage that prevents on described transparency carrier is arranged at the surrounding of the surrounding of each LED chip or the unit of a few LEDs chip composition or is arranged at the surrounding of whole LED chip group or the both sides of whole LED chip group.
3. the preparation method of LED light source according to claim 1, is characterized in that described transparency carrier upper and lower surface is equipped with groove.
4. the preparation method of LED light source according to claim 1, is characterized in that the groove location of described transparency carrier upper and lower surface staggers setting, and the thickness of the degree of depth of upper and lower surface groove and >=transparency carrier.
5. the preparation method of LED light source according to claim 1, is characterized in that described transparency carrier is glass transparent substrate.
6. the LED light source preparation method according to any one of claim 1-5, it is characterized in that the described groove on chip side be one or two or more.
7. the LED light source preparation method according to any one of claim 1-5, it is characterized in that for the fluorescent glue of encapsulated LED light source be coated on LED chip and the corresponding transparency carrier in LED chip place the back side and extend to groove, and be provided with fluorescent glue in groove.
8. LED light source prepared by the LED light source preparation method according to any one of claim 1-7, its feature comprises LED chip, transparency carrier for packaging LED chips at described LED light source, transparency carrier is provided with the groove preventing blue leakage.
9. LED light source according to claim 8, is characterized in that the groove of blue leakage that prevents on described transparency carrier is arranged at the surrounding of the surrounding of each LED chip or the unit of a few LEDs chip composition or is arranged at the surrounding of whole LED chip group or the both sides of whole LED chip group.
10. LED light source according to claim 8, is characterized in that described transparency carrier upper and lower surface is equipped with groove.
11. LED light sources according to claim 10, it is characterized in that described transparency carrier upper and lower surface is equipped with groove, the groove location on upper and lower surface staggers, and the thickness of the degree of depth of upper and lower surface groove and >=transparency carrier.
12. LED light sources according to Claim 8 described in-11 any one, is characterized in that described transparency carrier is glass transparent substrate.
13. LED light sources according to Claim 8 described in-11 any one, it is characterized in that the described groove on chip side be one or two or more.
14. LED light sources according to Claim 8 described in-11 any one, is characterized in that the fluorescent glue coating for encapsulated LED light source extends to groove, and are provided with fluorescent glue in groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410274139.5A CN105226175A (en) | 2014-06-19 | 2014-06-19 | A kind of LED light source and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410274139.5A CN105226175A (en) | 2014-06-19 | 2014-06-19 | A kind of LED light source and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN105226175A true CN105226175A (en) | 2016-01-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410274139.5A Pending CN105226175A (en) | 2014-06-19 | 2014-06-19 | A kind of LED light source and preparation method thereof |
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| Country | Link |
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| CN (1) | CN105226175A (en) |
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- 2014-06-19 CN CN201410274139.5A patent/CN105226175A/en active Pending
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Application publication date: 20160106 |