CN105206902A - UHF, L and Ku band mixed miniature microwave filter group - Google Patents
UHF, L and Ku band mixed miniature microwave filter group Download PDFInfo
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- CN105206902A CN105206902A CN201510553505.5A CN201510553505A CN105206902A CN 105206902 A CN105206902 A CN 105206902A CN 201510553505 A CN201510553505 A CN 201510553505A CN 105206902 A CN105206902 A CN 105206902A
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Abstract
The invention discloses an UHF, L and Ku band mixed miniature microwave filter group which comprises a single-pole three-throw switch chip WKD101A000200 and three microwave filters in different frequency bands, and is realized by adopting the multilayer low-temperature co-firing ceramics technology. The UHF, L and Ku band mixed miniature microwave filter group has the advantages of being easy to debug, light in weight, small in size, high in reliability, good in electrical performance, good in temperature stability, good in electrical performance batch consistency, low in cost and capable of being in large batch production and the like, and is suitable for the occasions and corresponding systems having strict requirements for size, electrical performance, temperature stability and reliability of the corresponding microwave frequency band communication and satellite communication and the like.
Description
Technical field
The present invention relates to a kind of bank of filters, be respectively UHF waveband micro microwave filter, L-waveband miniature microwave filter and Ku wave band miniature filter.
Background technology
In recent years, along with the developing rapidly of microminiaturization of mobile communication, satellite communication and Defensive Avionics System, high-performance, low cost and miniaturization have become the developing direction of microwave current/RF application, all have higher requirement to the performance of microwave filter, size, reliability and cost.The leading indicator describing this component capabilities has: passband operating frequency range, stop band frequency range, pass band insertion loss, stopband attenuation, passband input/output voltage standing-wave ratio, insertion phase shift and delay/frequency characteristic, temperature stability, volume, weight, reliability etc.Be connected by switch by the filter of different frequency, shaping filter group, can expand the scope of application of filter.
LTCC is a kind of Electronic Encapsulating Technology, adopts multi-layer ceramics technology, passive component can be built in medium substrate inside, and also active element can be mounted on substrate surface makes passive/active integrated functional module simultaneously.LTCC technology all shows many merits in cost, integration packaging, wiring live width and distance between centers of tracks, low impedance metal, design diversity and flexibility and high frequency performance etc., has become the mainstream technology of passive integration.The advantages such as it has high q-factor, is convenient to embedded passive device, and thermal diffusivity is good, and reliability is high, high temperature resistant, punching shake, utilize LTCC technology, can well process size little, precision is high, and tight type is good, the microwave device that loss is little.Because LTCC technology has the integrated advantage of 3 D stereo, be widely used for manufacturing various microwave passive components at microwave frequency band, the height realizing passive component is integrated.Based on the stack technology of LTCC technique, can realize three-dimensional integrated, thus size is little, lightweight, performance is excellent, reliability is high, batch production performance consistency is good and the plurality of advantages such as low cost to make various micro microwave filter have, utilize its three-dimensional integrated morphology feature, micro microwave filter group can be realized.
Summary of the invention
The object of the present invention is to provide and a kind ofly realize that volume is little, lightweight, reliability is high by strip lines configuration, excellent electrical property, the micro microwave filter group that easy to use, applied widely, rate of finished products is high, batch consistency is good, cost is low, temperature performance is stable.
The technical scheme realizing the object of the invention is:
a kind of mixing UHF, L and Ku wave band miniature microwave filter group, it comprises SP3T switch chip WKD101A000200 and three microwave filter.First microwave filter comprises surface-pasted 50 ohmage first input end mouths, Part I parallel resonance unit, first zero electric capacity, Part II series resonance unit, the second minimum capacity, Part III parallel resonance unit, the 3rd minimum capacity, Part IV series resonance unit, four-zero point electric capacity and surface-pasted 50 ohmage output ports; Input port is connected with Part I parallel resonance unit, and wherein Part I parallel resonance unit is made up of the first inductance, the first Capacitance parallel connection, and the first electric capacity is set in parallel in the below of the first inductance; First zero electric capacity and Part I parallel resonance units in series ground connection, and first zero electric capacity is set in parallel in the below of the first electric capacity; Part II series resonance unit is connected with input port, and wherein Part II series resonance unit is made up of the second inductance, the second capacitances in series, and the second electric capacity is set in parallel in the below of the second inductance; Second minimum capacity is in parallel with Part II series resonance unit, and the second minimum capacity is set in parallel in the below of the second inductance, with the second electric capacity at same plane; Part III parallel resonance unit is connected with the second electric capacity in Part II series resonance unit, and wherein Part III parallel resonance unit is made up of the 3rd inductance, the 3rd Capacitance parallel connection, and the 3rd electric capacity is set in parallel in the top of the 3rd inductance; 3rd minimum capacity and Part III parallel resonance units in series ground connection, and the 3rd minimum capacity is set in parallel in the top of the 3rd electric capacity; Part IV series resonance unit is connected with the second electric capacity in Part II series resonance unit, and wherein Part IV series resonance unit is made up of the 4th inductance, the 4th capacitances in series, and the 4th electric capacity is set in parallel in the top of the 4th inductance; Four-zero point electric capacity is in parallel with Part IV series resonance unit, and four-zero point electric capacity is set in parallel in the top of the 4th inductance, with the 4th electric capacity at same plane; Output port is connected with the 4th electric capacity; Wherein, described first inductance, the second inductance, the 3rd inductance and the 4th inductance are rectangular coil formula inductance, and the first electric capacity, the second electric capacity, the 3rd electric capacity and the 4th electric capacity are run-in index capacity plate antenna.
Second microwave filter comprises surface-pasted 50 ohmage second input ports, the first input inductance, the 5th resonator, sixth resonator, the 7th resonator, the 8th resonator, the first outputting inductance, the first Z-shaped interstage coupling strip line, surface-pasted 50 ohmage second output port and earth terminals.Wherein, the 5th resonator is formed by the 5th coil and the 5th Capacitance parallel connection, and one end of the 5th coil is connected with one end of the 5th electric capacity, the other end of the 5th coil and the other end of the 5th electric capacity ground connection respectively; Sixth resonator is formed by the 6th coil and the 6th Capacitance parallel connection, and one end of the 6th coil is connected with one end of the 6th electric capacity, the other end of the 6th coil and the other end of the 6th electric capacity ground connection respectively; 7th resonator is formed by the 7th coil and the 7th Capacitance parallel connection, and one end of the 7th coil is connected with one end of the 7th electric capacity, the other end of the 7th coil and the other end of the 7th electric capacity ground connection respectively; 8th resonator is formed by the 8th coil and the 8th Capacitance parallel connection, and one end of the 8th coil is connected with one end of the 8th electric capacity, the other end of the 8th coil and the other end of the 8th electric capacity ground connection respectively; 5th coil, the 6th coil, the 7th coil, the 8th coil are two-layer square spiral coil structure, and the 5th electric capacity, the 6th electric capacity, the 7th electric capacity, the 8th electric capacity are double-level-metal plate structure.Surface-pasted 50 ohmage second input ports are connected with the first left end inputting inductance, the right-hand member of the first input inductance is connected with the 5th electric capacity with the 5th coil, surface-pasted 50 ohmage second output ports are connected with the right-hand member of the first outputting inductance, the left end of the first outputting inductance is connected with the 8th electric capacity with the 8th coil, and the first Z-shaped interstage coupling strip line is positioned on the 5th resonator, sixth resonator, the 7th resonator, the 8th resonator.
3rd microwave filter comprises surface-pasted 50 ohmages the 3rd input port, the second input inductance, first order parallel resonance unit, second level parallel resonance unit, third level parallel resonance unit, fourth stage parallel resonance unit, level V parallel resonance unit, the second outputting inductance, the second Z-shaped interstage coupling strip line, surface-pasted 50 ohmage second output port and earth terminals.Parallel resonance unit at different levels forms by two-layer strip line, ground floor strip line is vertically positioned at above second layer strip line, first order parallel resonance unit is by the first strip line of ground floor, second strip line of the second layer is formed in parallel, second level parallel resonance unit is by the 3rd strip line of ground floor, 4th strip line of the second layer is formed in parallel, third level parallel resonance unit is by the 5th strip line of ground floor, 6th strip line of the second layer is formed in parallel, fourth stage parallel resonance unit is by the 7th strip line of ground floor, 8th strip line of the second layer is formed in parallel, level V parallel resonance unit is by the 9th strip line of ground floor, tenth strip line of the second layer is formed in parallel, wherein, second input inductance left end is connected with surface-pasted 50 ohmages the 3rd input port, second strip line and second of the second layer of first order parallel resonance unit inputs inductance right-hand member and is connected, tenth strip line of the second layer of level V parallel resonance unit is connected with the second outputting inductance left end, second outputting inductance right-hand member is connected with surface-pasted 50 ohmages the 3rd output port, second Z-shaped interstage coupling strip line is positioned at below parallel resonance unit.Pyatyi parallel resonance unit is ground connection respectively, wherein ground floor all strip lines earth terminal is identical, one end ground connection, the other end is opened a way, second layer strip line earth terminal is identical, one end ground connection, and the other end is opened a way, and earth terminal direction is contrary with ground floor earth terminal, the second equal ground connection in Z-shaped interstage coupling strip line two ends.The RFOut1 of SP3T switch chip WKD102A000200 is connected with surface-pasted 50 ohmage first input end mouths, RFOut2 is connected with surface-pasted 50 ohmage second input ports, and RFOut3 is connected with surface-pasted 50 ohmages the 3rd input port.
Compared with prior art, due to the present invention adopt low-loss low-temperature co-burning ceramic material and 3 D stereo integrated, the remarkable advantage brought is: (1) band in smooth; (2) the identical signal waveform of different frequency can be produced; (3) volume is little, lightweight, reliability is high; (4) excellent electrical property; (5) circuit realiration structure is simple, can realize producing in enormous quantities; (6) cost is low.
Accompanying drawing explanation
fig. 1 (a) be a kind of UHF, L and Ku wave band miniature of the present invention microwave filter group contour structures signal
figure.
fig. 1 (b) be the profile of the first microwave filter in a kind of UHF, L and Ku wave band miniature of the present invention microwave filter group and internal structure signal
figure.
fig. 1 (c) be the profile of the second microwave filter in a kind of UHF, L and Ku wave band miniature of the present invention microwave filter group and internal structure signal
figure.
fig. 1 (d) be the profile of the 3rd microwave filter in a kind of UHF, L and Ku wave band miniature of the present invention microwave filter group and internal structure signal
figure.
fig. 2a kind of UHF, L and Ku wave band miniature of the present invention microwave filter group amplitude-versus-frequency curve of output port and stationary wave characteristic curve of input port when connecing the first microwave filter.
fig. 3a kind of UHF, L and Ku wave band miniature of the present invention microwave filter group amplitude-versus-frequency curve of output port and stationary wave characteristic curve of input port when connecing the second microwave filter.
fig. 4a kind of UHF, L and Ku wave band miniature of the present invention microwave filter group amplitude-versus-frequency curve of output port and stationary wave characteristic curve of input port when connecing the 3rd microwave filter.
Embodiment
Below in conjunction with
accompanying drawingthe present invention is described in further detail.
In conjunction with
fig. 1 (a), (b), (c), a kind of UHF, L and Ku wave band miniature of the present invention microwave filter group, the first microwave filter F1 comprises surface-pasted 50 ohmage input port P1, Part I parallel resonance unit L1, C1, first zero electric capacity C11, Part II series resonance unit L2, C2, the second minimum capacity C22, Part III parallel resonance unit L3, C3, the 3rd minimum capacity C33, Part IV series resonance unit L4, C4, four-zero point electric capacity C44 and surface-pasted 50 ohmage output port P2; Input port P1 is connected with Part I parallel resonance unit L1, C1, and wherein Part I parallel resonance unit L1, C1 is composed in parallel by the first inductance L 1, first electric capacity C1, and the first electric capacity C1 is set in parallel in the below of the first inductance L 1; First zero electric capacity C11 connects with Part I parallel resonance unit L1, C1 ground connection, and first zero electric capacity C11 is set in parallel in the below of the first electric capacity C1; Part II series resonance unit L2, C2 are connected with input port P1, and wherein Part II series resonance unit L2, C2 is composed in series by the second inductance L 2, second electric capacity C2, and the second electric capacity C2 is set in parallel in the below of the second inductance L 2; Second minimum capacity C22 is in parallel with Part II series resonance unit L2, C2, and the second minimum capacity C22 is set in parallel in the below of the second inductance L 2, with the second electric capacity C2 at same plane; Part III parallel resonance unit L3, C3 are connected with the second electric capacity C2 in Part II series resonance unit L2, C2, wherein Part III parallel resonance unit L3, C3 is composed in parallel by the 3rd inductance L 3, the 3rd electric capacity C3, and the 3rd electric capacity C3 is set in parallel in the top of the 3rd inductance L 3; 3rd minimum capacity C33 connects with Part III parallel resonance unit L3, C3 ground connection, and the 3rd minimum capacity C33 is set in parallel in the top of the 3rd electric capacity C3; Part IV series resonance unit L4, C4 are connected with the second electric capacity C2 in Part II series resonance unit L2, C2, wherein Part IV series resonance unit L4, C4 is composed in series by the 4th inductance L 4, the 4th electric capacity C4, and the 4th electric capacity C4 is set in parallel in the top of the 4th inductance L 4; Four-zero point electric capacity C44 is in parallel with Part IV series resonance unit L4, C4, and four-zero point electric capacity C44 is set in parallel in the top of the 4th inductance L 4, with the 4th electric capacity C4 at same plane; Output port P2 is connected with the 4th electric capacity C4.Wherein, described first inductance L 1, second inductance L 2, the 3rd inductance L 3 and the 4th inductance L 4 are rectangular coil formula inductance, and the first electric capacity C1, the second electric capacity C2, the 3rd electric capacity C3 and the 4th electric capacity C4 are run-in index capacity plate antenna.
Second microwave filter F2 comprises surface-pasted 50 ohmage second input port P3, the first input inductance L in1, the 5th resonator L5, C5, sixth resonator L6, C6, the 7th resonator L7, C7, the 8th resonator L8, C8, the first outputting inductance Lout2, the first Z-shaped interstage coupling strip line Z1, surface-pasted 50 ohmage second output port P4 and earth terminals.Wherein, the 5th resonator L5, C5 is formed in parallel by the 5th coil L5 and the 5th electric capacity C5, and one end of the 5th coil L5 is connected with one end of the 5th electric capacity C5, the other end of the 5th coil L5 and the other end of the 5th electric capacity C5 ground connection respectively; Sixth resonator L6, C6 are formed in parallel by the 6th coil L6 and the 6th electric capacity C6, and one end of the 6th coil L6 is connected with one end of the 6th electric capacity C6, the other end of the 6th coil L6 and the other end of the 6th electric capacity C6 ground connection respectively; 7th resonator L7, C7 is formed in parallel by the 7th coil L7 and the 7th electric capacity C7, and one end of the 7th coil L7 is connected with one end of the 7th electric capacity C7, the other end of the 7th coil L3 and the other end of the 7th electric capacity C7 ground connection respectively; 8th resonator L8, C8 is formed in parallel by the 8th coil L8 and the 8th electric capacity C8, and one end of the 8th coil L8 is connected with one end of the 8th electric capacity C8, the other end of the 8th coil L8 and the other end of the 8th electric capacity C8 ground connection respectively; 5th coil L5, the 6th coil L6, the 7th coil L7, the 8th coil L8 are two-layer square spiral coil structure, and the 5th electric capacity C5, the 6th electric capacity C6, the 7th electric capacity C7, the 8th electric capacity C8 are double-level-metal plate structure.Surface-pasted 50 ohmage second input port P3 are connected with the first left end inputting inductance L in1, the right-hand member of the first input inductance L in1 is connected with the 5th electric capacity C5 with the 5th coil L5, surface-pasted 50 ohmage second output port P4 are connected with the right-hand member of the first outputting inductance Lout1, the left end of the first outputting inductance Lout1 is connected with the 8th electric capacity C8 with the 8th coil L8, and the second Z-shaped interstage coupling strip line Z2 is positioned on the 5th resonator L5, C5, sixth resonator L6, C6, the 7th resonator L7, C7, the 8th resonator L8, C8.
3rd microwave filter F3 comprises surface-pasted 50 ohmages the 3rd input port P5, second input inductance L in2, first order parallel resonance unit L11, L21, second level parallel resonance unit L12, L22, third level parallel resonance unit L13, L23, fourth stage parallel resonance unit L14, L24, level V parallel resonance unit L15, L25, second outputting inductance Lout2, second Z-shaped interstage coupling strip line Z2, surface-pasted 50 ohmages the 3rd output port P6 and earth terminal.Parallel resonance unit at different levels forms by two-layer strip line, and ground floor strip line is vertically positioned at above second layer strip line, first order parallel resonance unit L11, L21 is by the first strip line L11 of ground floor, second strip line L21 of the second layer, be formed in parallel, second level parallel resonance unit L12, L22 is by the 3rd strip line L12 of ground floor, 4th strip line L22 of the second layer is formed in parallel, third level parallel resonance unit L13, L23 is by the 5th strip line L13 of ground floor, 6th strip line L23 of the second layer, be formed in parallel, fourth stage parallel resonance unit L14, L24 is by the 7th strip line L14 of ground floor, 8th strip line L24 of the second layer is formed in parallel, level V parallel resonance unit L15, L25 is by the 9th strip line L15 of ground floor, tenth strip line L25 of the second layer is formed in parallel, and wherein, the second input inductance L in2 left end is connected with surface-pasted 50 ohmages the 3rd input port P5, first order parallel resonance unit L11, the second strip line L21 and second of the second layer of L21 inputs inductance L in2 right-hand member and is connected, level V parallel resonance unit L12, tenth strip line L25 of the second layer of L25 is connected with the second outputting inductance Lout2 left end, second outputting inductance Lout2 right-hand member is connected with surface-pasted 50 ohmages the 3rd output port P6, and the second Z-shaped interstage coupling strip line Z2 is positioned at below parallel resonance unit.Pyatyi parallel resonance unit is ground connection respectively, wherein ground floor all strip lines earth terminal is identical, one end ground connection, the other end is opened a way, second layer strip line earth terminal is identical, one end ground connection, and the other end is opened a way, and earth terminal direction is contrary with ground floor earth terminal, the second equal ground connection in Z-shaped interstage coupling strip line Z2 two ends.The RFOut1 of SP3T switch chip WKD102A000200 is connected with surface-pasted 50 ohmage first input end mouth P1, RFOut2 is connected with surface-pasted 50 ohmage second input port P3, and RFOut3 is connected with surface-pasted 50 ohmages the 3rd input port P5.
In conjunction with
fig. 1 a, b, c, surface-pasted 50 ohmage input port P1, P3, P5, surface-pasted 50 ohmage output port P2, P4, P6, input inductance L in1, Lin2, outputting inductance Lout1, Lout2, electric capacity C1, C2, C3, C4, C5, C6, C7, C8, minimum capacity C11, C22, C33, C44, coil L1, L2, L3, L4, L5, L6, L7, L8, first order parallel resonance unit L11, L21, second level parallel resonance unit L12, L22, third level parallel resonance unit L13, L23, fourth stage parallel resonance unit L14, L24, level V parallel resonance unit L15, L25, Z-shaped interstage coupling strip line Z1, Z2 and earth terminal all adopt multilayer LTCC technique to realize.
A kind of UHF, L and Ku wave band miniature microwave filter group, owing to being the realization of employing multilayer LTCC technique, its low-temperature co-burning ceramic material and metallic pattern sinter and form at about 900 DEG C of temperature, so have extreme high reliability and temperature stability, because structure adopts, 3 D stereo is integrated to be grounded with multilayer folding structure and outer surface metallic shield and to encapsulate, thus volume is significantly reduced.
WKD102A000200 cake core is the voltage-controlled reflective SP3T switch chip of a filter with low insertion loss, and use the long GaAs pseudomorphic high electron mobility transistor manufacture technics of 0.25 micron of grid to form, this chip is by back metal via through holes ground connection.All chip products are all through 100% radio-frequency measurement.WKD102010040 cake core is 0/-5V power work, insertion loss in DC ~ 20GHz: 2dB, isolation: 50dB, input vswr: 1.4:1, output VSWR: 1.4:1, switching time: 10ns.
In a kind of UHF, L and Ku wave band miniature of the present invention microwave filter, the size of three microwave filters is 3.2mm × 3.2mm × 1.5mm.Its performance can be from
fig. 2,
fig. 3,
fig. 4, find out, the pass band width of the first microwave filter is 80MGHz ~ 140MHz, and input port return loss is better than 9.3dB, and output port insertion loss is better than 5.6dB, and now, another two band filter isolations are roughly the same is respectively 43dB and 44dB.The pass band width of the second microwave filter is 750MHz ~ 1060MHz, and input port return loss is better than 9.2dB, and output port insertion loss is better than 4.8dB, and now, another two band filter isolations are roughly the same is respectively 50dB and 59dB.The pass band width of the 3rd microwave filter is 13.5GHz ~ 16GHz, and input port return loss is better than 11.3dB, and output port insertion loss is better than 4.5dB, and now, another two band filter isolations are roughly the same is respectively 48dB and 50dB.
Claims (3)
1. mix UHF, L and Ku wave band miniature microwave filter group, it is characterized in that: comprise SP3T switch chip WKD101A000200 and three microwave filter, first microwave filter (F1) comprises surface-pasted 50 ohmage input ports (P1), Part I parallel resonance unit (L1, C1), first zero electric capacity (C11), Part II series resonance unit (L2, C2), second minimum capacity (C22), Part III parallel resonance unit (L3, C3), 3rd minimum capacity (C33), Part IV series resonance unit (L4, C4), four-zero point electric capacity (C44) and surface-pasted 50 ohmage output ports (P2),
Input port (P1) is connected with Part I parallel resonance unit (L1, C1), wherein Part I parallel resonance unit (L1, C1) is composed in parallel by the first inductance (L1), the first electric capacity (C1), and the first electric capacity (C1) is set in parallel in the below of the first inductance (L1); First zero electric capacity (C11) is connected with Part I parallel resonance unit (L1, C1) ground connection, and first zero electric capacity (C11) is set in parallel in the below of the first electric capacity (C1); Part II series resonance unit (L2, C2) is connected with input port (P1), wherein Part II series resonance unit (L2, C2) is composed in series by the second inductance (L2), the second electric capacity (C2), and the second electric capacity (C2) is set in parallel in the below of the second inductance (L2); Second minimum capacity (C22) is in parallel with Part II series resonance unit (L2, C2), and the second minimum capacity (C22) is set in parallel in the below of the second inductance (L2), with the second electric capacity (C2) at same plane; Part III parallel resonance unit (L3, C3) is connected with the second electric capacity (C2) in Part II series resonance unit (L2, C2), wherein Part III parallel resonance unit (L3, C3) is composed in parallel by the 3rd inductance (L3), the 3rd electric capacity (C3), and the 3rd electric capacity (C3) is set in parallel in the top of the 3rd inductance (L3); 3rd minimum capacity (C33) is connected with Part III parallel resonance unit (L3, C3) ground connection, and the 3rd minimum capacity (C33) is set in parallel in the top of the 3rd electric capacity (C3); Part IV series resonance unit (L4, C4) is connected with the second electric capacity (C2) in Part II series resonance unit (L2, C2), wherein Part IV series resonance unit (L4, C4) is composed in series by the 4th inductance (L4), the 4th electric capacity (C4), and the 4th electric capacity (C4) is set in parallel in the top of the 4th inductance (L4); Four-zero point electric capacity (C44) is in parallel with Part IV series resonance unit (L4, C4), and four-zero point electric capacity (C44) is set in parallel in the top of the 4th inductance (L4), with the 4th electric capacity (C4) at same plane; Output port (P2) is connected with the 4th electric capacity (C4);
Wherein, described first inductance (L1), the second inductance (L2), the 3rd inductance (L3) and the 4th inductance (L4) are rectangular coil formula inductance, and the first electric capacity (C1), the second electric capacity (C2), the 3rd electric capacity (C3) and the 4th electric capacity (C4) are run-in index capacity plate antenna;
Second microwave filter comprises surface-pasted 50 ohmage second input ports (P3), the first input inductance (Lin1), the 5th resonator (L5, C5), sixth resonator (L6, C6), the 7th resonator (L7, C7), the 8th resonator (L8, C8), the first outputting inductance (Lout1), the first Z-shaped interstage coupling strip line (Z1), surface-pasted 50 ohmage second output port (P4) and earth terminals, wherein, 5th resonator (L5, C5) is formed in parallel by the 5th coil (L5) and the 5th electric capacity (C5), one end of 5th coil (L5) is connected with one end of the 5th electric capacity (C5), the other end of the 5th coil (L5) and the other end of the 5th electric capacity (C5) ground connection respectively, sixth resonator (L6, C6) is formed in parallel by the 6th coil (L6) and the 6th electric capacity (C6), one end of 6th coil (L6) is connected with one end of the 6th electric capacity (C6), the other end of the 6th coil (L6) and the other end of the 6th electric capacity (C6) ground connection respectively, 7th resonator (L7, C7) is formed in parallel by the 7th coil (L7) and the 7th electric capacity (C7), one end of 7th coil (L7) is connected with one end of the 7th electric capacity (C7), the other end of the 7th coil (L7) and the other end of the 7th electric capacity (C7) ground connection respectively, 8th resonator (L8, C8) is formed in parallel by the 8th coil (L8) and the 8th electric capacity (C8), one end of 8th coil (L8) is connected with one end of the 8th electric capacity (C8), the other end of the 8th coil (L8) and the other end of the 8th electric capacity (C8) ground connection respectively, 5th coil (L5), the 6th coil (L6), the 7th coil (L7), the 8th coil (L8) are two-layer square spiral coil structure, and the 5th electric capacity (C5), the 6th electric capacity (C6), the 7th electric capacity (C7), the 8th electric capacity (C8) are double-level-metal plate structure, surface-pasted 50 ohmage second input ports (P3) are connected with the first left end inputting inductance (Lin1), the right-hand member of the first input inductance (Lin1) is connected with the 5th electric capacity (C5) with the 5th coil (L5), surface-pasted 50 ohmage second output ports (P4) are connected with the right-hand member of the first outputting inductance (Lout1), the left end of the first outputting inductance (Lout1) is connected with the 8th electric capacity (C8) with the 8th coil (L8), first Z-shaped interstage coupling strip line (Z1) is positioned at the 5th resonator (L5, C5), sixth resonator (L6, C6), 7th resonator (L7, C7), 8th resonator (L8, C8) on,
3rd microwave filter (F3) comprises surface-pasted 50 ohmages the 3rd input port (P5), second input inductance (Lin2), first order parallel resonance unit (L11, L21), second level parallel resonance unit (L12, L22), third level parallel resonance unit (L13, L23), fourth stage parallel resonance unit (L14, L24), level V parallel resonance unit (L15, L25), second outputting inductance (Lout2), second Z-shaped interstage coupling strip line (Z2), surface-pasted 50 ohmages the 3rd output port (P6) and earth terminal, parallel resonance unit at different levels forms by two-layer strip line, ground floor strip line is vertically positioned at above second layer strip line, first order parallel resonance unit (L11, L21) by first strip line (L11) of ground floor, second strip line (L21) of the second layer is formed in parallel, second level parallel resonance unit (L12, L22) by the 3rd strip line (L12) of ground floor, 4th strip line (L22) of the second layer is formed in parallel, third level parallel resonance unit (L13, L23) by the 5th strip line (L13) of ground floor, 6th strip line (L23) of the second layer is formed in parallel, fourth stage parallel resonance unit (L14, L24) by the 7th strip line (L14) of ground floor, 8th strip line (L24) of the second layer, be formed in parallel, level V parallel resonance unit (L15, L25) by the 9th strip line (L15) of ground floor, tenth strip line (L25) of the second layer is formed in parallel, wherein, second input inductance (Lin2) left end is connected with surface-pasted 50 ohmages the 3rd input port (P5), first order parallel resonance unit (L11, second strip line (L21) and second of the second layer L21) inputs inductance (Lin2) right-hand member and is connected, level V parallel resonance unit (L15, tenth strip line (L25) of the second layer L25) is connected with the second outputting inductance (Lout2) left end, second outputting inductance (Lout2) right-hand member is connected with surface-pasted 50 ohmages the 3rd output port (P6), second Z-shaped interstage coupling strip line (Z2) is positioned at below parallel resonance unit,
Pyatyi parallel resonance unit is ground connection respectively, wherein ground floor all strip lines earth terminal is identical, one end ground connection, the other end is opened a way, second layer strip line earth terminal is identical, one end ground connection, and the other end is opened a way, and earth terminal direction is contrary with ground floor earth terminal, the second equal ground connection in Z-shaped interstage coupling strip line (Z2) two ends; The RFOut1 of SP3T switch chip WKD101A000200 is connected with surface-pasted 50 ohmage first input end mouths (P1), RFOut2 is connected with surface-pasted 50 ohmage second input ports (P3), and RFOut3 is connected with surface-pasted 50 ohmages the 3rd input port (P5).
2. mixing UHF according to claim 1, L and Ku wave band miniature microwave filter group, it is characterized in that: surface-pasted 50 ohmage input port (P1, P3, P5), surface-pasted 50 ohmage output port (P2, P4, P6), input inductance (Lin1, Lin2), outputting inductance (Lout1, Lout2), electric capacity (C1, C2, C3, C4, C5, C6, C7, C8), minimum capacity (C11, C22, C33, C44), coil (L1, L2, L3, L4, L5, L6, L7, L8), first order parallel resonance unit (L11, L21), second level parallel resonance unit (L12, L22), third level parallel resonance unit (L13, L23), fourth stage parallel resonance unit (L14, L24), level V parallel resonance unit (L15, L25), Z-shaped interstage coupling strip line (Z1, Z2) and earth terminal all adopt multilayer LTCC technique to realize.
3. mixing UHF according to claim 1 and 2, L and Ku wave band miniature microwave filter group, it is characterized in that: first input end mouth (P1) directly with the first inductance (L1), first electric capacity (C1) is connected, first output port (P2) directly with the 4th inductance (L4), 4th electric capacity (C4) is connected, second input port (P3) is connected with the 5th electric capacity (C5) and the 5th coil (L5) by the first input inductance (Lin1), second output port (P4) is connected with the 8th electric capacity (C8) and the 8th coil (L8) by the first outputting inductance (Lout1), 3rd input port (P5) is by the second input inductance (Lin2) and first order parallel resonance unit (L11, second strip line (L21) of the second layer L21) connects, 3rd output port (P6) is by the second outputting inductance (Lout2) and level V parallel resonance unit (L15, tenth strip line (L25) of the second layer L25) connects.
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