CN105190873A - 热电组件 - Google Patents
热电组件 Download PDFInfo
- Publication number
- CN105190873A CN105190873A CN201380074714.0A CN201380074714A CN105190873A CN 105190873 A CN105190873 A CN 105190873A CN 201380074714 A CN201380074714 A CN 201380074714A CN 105190873 A CN105190873 A CN 105190873A
- Authority
- CN
- China
- Prior art keywords
- radiator
- fan
- hot side
- thermoelectric components
- cold side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 10
- 239000013598 vector Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 230000004907 flux Effects 0.000 description 13
- 238000001816 cooling Methods 0.000 description 9
- 238000007790 scraping Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000002912 waste gas Substances 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 240000001439 Opuntia Species 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/838,832 | 2013-03-15 | ||
US13/838,832 US9303902B2 (en) | 2013-03-15 | 2013-03-15 | Thermoelectric assembly |
PCT/US2013/074646 WO2014143254A1 (en) | 2013-03-15 | 2013-12-12 | Thermoelectric assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105190873A true CN105190873A (zh) | 2015-12-23 |
CN105190873B CN105190873B (zh) | 2017-09-29 |
Family
ID=51521080
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201380074714.0A Active CN105190873B (zh) | 2013-03-15 | 2013-12-12 | 热电组件 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9303902B2 (zh) |
EP (1) | EP2948981B1 (zh) |
CN (1) | CN105190873B (zh) |
WO (1) | WO2014143254A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111373650A (zh) * | 2017-12-27 | 2020-07-03 | 株式会社Kelk | 热电发电装置 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9360240B2 (en) | 2012-11-09 | 2016-06-07 | Laird Technologies, Inc. | Thermoelectric assembly |
WO2015191509A1 (en) * | 2014-06-09 | 2015-12-17 | Phononic Devices, Inc. | Hybrid fan assembly and active heating pumping system |
DK3012568T3 (en) * | 2014-10-20 | 2018-12-10 | Abb Schweiz Ag | Cooling device and cooled electrical device comprising it |
US11249522B2 (en) * | 2016-06-30 | 2022-02-15 | Intel Corporation | Heat transfer apparatus for a computer environment |
TWI599713B (zh) * | 2016-07-19 | 2017-09-21 | Chuan Sheng Chen | To the semiconductor as the core of the cold and warm cycle machine |
US9797652B1 (en) | 2017-02-23 | 2017-10-24 | Jonathan Wilkerson | System and method for rapid fluid chilling and heating for carbonated and non-carbonated fluids |
DE102018101453A1 (de) * | 2018-01-23 | 2019-07-25 | Borgwarner Ludwigsburg Gmbh | Heizvorrichtung und Verfahren zum Herstellung eines Heizstabes |
US11828497B2 (en) * | 2020-03-10 | 2023-11-28 | B/E Aerospace, Inc. | Chilled liquid recirculation device for galley refrigeration systems |
US11429085B2 (en) * | 2020-05-28 | 2022-08-30 | Dell Products L.P. | Systems and methods for thermal control of an information handling resource using thermoelectric effect |
US11602454B1 (en) * | 2020-10-13 | 2023-03-14 | Hyper Ice, Inc. | Temperature modulation assembly and a multi-layer retention mechanism for a temperature therapy device |
GB2614682B (en) * | 2021-01-29 | 2024-11-06 | Univ Jiangsu | Personal thermal comfort device based on Peltier effect and thermal management method based on Peltier effect |
US11949442B2 (en) * | 2021-06-09 | 2024-04-02 | Siyata Mobile Inc. | Mobile conversion apparatus for docking cellular data devices |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6625990B2 (en) * | 2001-02-09 | 2003-09-30 | Bsst Llc | Thermoelectric power generation systems |
CN1774401A (zh) * | 2003-04-16 | 2006-05-17 | 詹姆斯·J·里迪 | 高效的热电水生成装置 |
US20070068174A1 (en) * | 2005-09-29 | 2007-03-29 | Gamon Plus, Inc. | Cooler with thermoelectric cooling apparatus |
US20070119186A1 (en) * | 2005-11-30 | 2007-05-31 | Kitchens Mark C | Universal thermoelectric module apparatus |
US20110197598A1 (en) * | 2010-02-18 | 2011-08-18 | Cpumate Inc & Golden Sun News Techniques Co., Ltd. | Heat-Dissipating Device For Supplying Cold Airflow |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4463569A (en) * | 1982-09-27 | 1984-08-07 | Mclarty Gerald E | Solid-state heating and cooling apparatus |
US5315830B1 (en) * | 1993-04-14 | 1998-04-07 | Marlow Ind Inc | Modular thermoelectric assembly |
JP3951315B2 (ja) * | 1995-05-26 | 2007-08-01 | 松下電工株式会社 | ペルチェモジュール |
US6058712A (en) * | 1996-07-12 | 2000-05-09 | Thermotek, Inc. | Hybrid air conditioning system and a method therefor |
US6530231B1 (en) * | 2000-09-22 | 2003-03-11 | Te Technology, Inc. | Thermoelectric assembly sealing member and thermoelectric assembly incorporating same |
US6588217B2 (en) | 2000-12-11 | 2003-07-08 | International Business Machines Corporation | Thermoelectric spot coolers for RF and microwave communication integrated circuits |
US6800933B1 (en) | 2001-04-23 | 2004-10-05 | Advanced Micro Devices, Inc. | Integrated circuit cooling device |
KR100493295B1 (ko) * | 2002-02-07 | 2005-06-03 | 엘지전자 주식회사 | 열전모듈을 이용한 공기조화기 |
US20040134200A1 (en) * | 2003-01-13 | 2004-07-15 | Schroeder Jon Murray | Torus semiconductor thermoelectric chiller |
TWI260196B (en) * | 2003-11-14 | 2006-08-11 | Qnx Cooling Systems Inc | Liquid cooling system |
US6946600B1 (en) | 2004-03-01 | 2005-09-20 | Commscope Solutions Properties, Llc. | Cabinet with cross-connect that provides access to rear side of electronic equipment |
US7278270B2 (en) * | 2004-07-01 | 2007-10-09 | The Coleman Company, Inc. | Insulated container with thermoelectric unit |
US20060075758A1 (en) * | 2004-10-07 | 2006-04-13 | Tigerone Development, Llc; | Air-conditioning and heating system utilizing thermo-electric solid state devices |
US7475551B2 (en) * | 2004-12-23 | 2009-01-13 | Nanocoolers, Inc. | System employing temporal integration of thermoelectric action |
TWM287927U (en) * | 2005-07-15 | 2006-02-21 | Chuan-Sheng Chen | Semi-conductor based electrical cooling/heating appliance |
EP1920201A4 (en) * | 2005-08-04 | 2014-07-02 | Eic Solutions Inc | MERCHANDISE TRANSPORT CASE EQUIPPED WITH A THERMOELECTRIC AIR CONDITIONER |
JP2008198928A (ja) | 2007-02-15 | 2008-08-28 | Sony Corp | 冷却構造及びこの構造を内蔵した電子機器 |
DE202007018397U1 (de) * | 2007-04-12 | 2008-07-10 | Rittal Gmbh & Co. Kg | Thermoelektrische Temperiervorrichtung |
US8418477B2 (en) * | 2008-02-12 | 2013-04-16 | Quixotic Systems, Inc. | Solar-thermoelectric air-conditioning in vehicles |
DE102008013850B8 (de) * | 2008-03-12 | 2010-02-11 | Nft Nanofiltertechnik Gmbh | Klimatisierungseinrichtung für in einem Schaltschrank angeordnete elektronische Bauelemente und Anordnung zur Klimatisierung eines Schaltschrankes |
WO2009149207A2 (en) * | 2008-06-03 | 2009-12-10 | Bsst Llc | Thermoelectric heat pump |
US7929294B2 (en) | 2008-09-11 | 2011-04-19 | Commscope Inc. Of North Carolina | Hybrid cooling system for outdoor electronics enclosure |
US8904808B2 (en) * | 2009-07-17 | 2014-12-09 | Sheetak, Inc. | Heat pipes and thermoelectric cooling devices |
JP5656295B2 (ja) * | 2011-04-22 | 2015-01-21 | パナソニックIpマネジメント株式会社 | 熱電変換モジュールとその製造方法 |
-
2013
- 2013-03-15 US US13/838,832 patent/US9303902B2/en active Active
- 2013-12-12 CN CN201380074714.0A patent/CN105190873B/zh active Active
- 2013-12-12 EP EP13877825.3A patent/EP2948981B1/en active Active
- 2013-12-12 WO PCT/US2013/074646 patent/WO2014143254A1/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6625990B2 (en) * | 2001-02-09 | 2003-09-30 | Bsst Llc | Thermoelectric power generation systems |
CN1774401A (zh) * | 2003-04-16 | 2006-05-17 | 詹姆斯·J·里迪 | 高效的热电水生成装置 |
US20070068174A1 (en) * | 2005-09-29 | 2007-03-29 | Gamon Plus, Inc. | Cooler with thermoelectric cooling apparatus |
US20070119186A1 (en) * | 2005-11-30 | 2007-05-31 | Kitchens Mark C | Universal thermoelectric module apparatus |
US20110197598A1 (en) * | 2010-02-18 | 2011-08-18 | Cpumate Inc & Golden Sun News Techniques Co., Ltd. | Heat-Dissipating Device For Supplying Cold Airflow |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111373650A (zh) * | 2017-12-27 | 2020-07-03 | 株式会社Kelk | 热电发电装置 |
Also Published As
Publication number | Publication date |
---|---|
US20140260330A1 (en) | 2014-09-18 |
EP2948981B1 (en) | 2017-10-18 |
EP2948981A4 (en) | 2016-03-23 |
CN105190873B (zh) | 2017-09-29 |
WO2014143254A1 (en) | 2014-09-18 |
US9303902B2 (en) | 2016-04-05 |
EP2948981A1 (en) | 2015-12-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20171109 Address after: Baoan District City, Shenzhen Province, Fuyong, a community of peace in the town of Luther King Park, one of the industrial park, a district of the city of Guangdong Patentee after: Laird Electronic Material (Shenzhen) Co., Ltd. Address before: American Missouri Patentee before: Laird Technologies Inc. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210716 Address after: 518000 No.34 Fuyuan 1st Road, Heping community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Laierde thermal system (Shenzhen) Co.,Ltd. Address before: 518103 Luther King Industrial Park, Fu Fu Garden, Heping community, Fuyong Town, Shenzhen, Guangdong, Baoan District Patentee before: Laide electronic materials (Shenzhen) Co.,Ltd. |
|
CP02 | Change in the address of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: 518000 workshop 201, Dejin Industrial Zone, No. 34, Fuyuan 1st Road, Heping community, Fuhai street, Bao'an District, Shenzhen, Guangdong Province Patentee after: Laierde thermal system (Shenzhen) Co.,Ltd. Address before: 518000 No.34 Fuyuan 1st Road, Heping community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: Laierde thermal system (Shenzhen) Co.,Ltd. |