CN105190845B - 用于cmp抛光头的基板进动机制 - Google Patents

用于cmp抛光头的基板进动机制 Download PDF

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Publication number
CN105190845B
CN105190845B CN201480014938.7A CN201480014938A CN105190845B CN 105190845 B CN105190845 B CN 105190845B CN 201480014938 A CN201480014938 A CN 201480014938A CN 105190845 B CN105190845 B CN 105190845B
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China
Prior art keywords
ring assemblies
coupled
bearing
head assembly
substrate
Prior art date
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CN201480014938.7A
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English (en)
Chinese (zh)
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CN105190845A (zh
Inventor
C·H·陈
G·S·丹达瓦特
J·古鲁萨米
S·C-C·徐
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Applied Materials Inc
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Applied Materials Inc
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Publication of CN105190845A publication Critical patent/CN105190845A/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
CN201480014938.7A 2013-03-14 2014-02-24 用于cmp抛光头的基板进动机制 Active CN105190845B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/827,629 2013-03-14
US13/827,629 US20140273756A1 (en) 2013-03-14 2013-03-14 Substrate precession mechanism for cmp polishing head
PCT/US2014/018069 WO2014158548A1 (en) 2013-03-14 2014-02-24 Substrate precession mechanism for cmp polishing head

Publications (2)

Publication Number Publication Date
CN105190845A CN105190845A (zh) 2015-12-23
CN105190845B true CN105190845B (zh) 2019-02-22

Family

ID=51529186

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480014938.7A Active CN105190845B (zh) 2013-03-14 2014-02-24 用于cmp抛光头的基板进动机制

Country Status (6)

Country Link
US (1) US20140273756A1 (https=)
JP (1) JP6581964B2 (https=)
KR (1) KR102243725B1 (https=)
CN (1) CN105190845B (https=)
TW (1) TWI617393B (https=)
WO (1) WO2014158548A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014163735A1 (en) * 2013-03-13 2014-10-09 Applied Materials, Inc. Reinforcement ring for carrier head
US20140273756A1 (en) * 2013-03-14 2014-09-18 Chih Hung Chen Substrate precession mechanism for cmp polishing head
JP7051332B2 (ja) 2017-08-23 2022-04-11 キヤノン株式会社 有機化合物及び光電変換素子
KR102459832B1 (ko) * 2017-11-22 2022-10-28 주식회사 케이씨텍 캐리어
TWI639486B (zh) * 2018-05-31 2018-11-01 國立清華大學 全向整合式調節裝置
WO2022103583A1 (en) 2020-11-10 2022-05-19 Applied Materials, Inc. Polishing head with local wafer pressure
WO2023229658A1 (en) * 2022-05-27 2023-11-30 Applied Materials, Inc. Clamping retainer for chemical mechanical polishing and method of operation

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010039172A1 (en) * 2000-04-17 2001-11-08 Norio Kimura Polishing apparatus
CN1488470A (zh) * 2002-08-29 2004-04-14 ����Խ��е��ҵ��ʽ���� 抛光机
CN101023511A (zh) * 2004-09-30 2007-08-22 株式会社瑞萨科技 半导体器件的制造方法
CN201168928Y (zh) * 2005-12-28 2008-12-24 应用材料公司 一种用于衬底化学机械抛光装置的载具头及其柔性膜
CN101396805A (zh) * 2006-11-22 2009-04-01 应用材料股份有限公司 具有保持环和夹持环的研磨头

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008229846A (ja) * 1995-10-09 2008-10-02 Ebara Corp ポリッシング装置及び方法並びにトップリング
JP3724869B2 (ja) * 1995-10-09 2005-12-07 株式会社荏原製作所 ポリッシング装置および方法
JPH10156712A (ja) * 1996-11-29 1998-06-16 Oki Electric Ind Co Ltd ウエハ研磨装置
JP2000334655A (ja) * 1999-05-26 2000-12-05 Matsushita Electric Ind Co Ltd Ｃｍｐ加工装置
US6527625B1 (en) * 2000-08-31 2003-03-04 Multi-Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a soft backed polishing head
CN101607381B (zh) * 2000-08-31 2014-04-16 株式会社荏原制作所 化学机械抛光头、设备和方法以及平面化半导体晶片
KR100502362B1 (ko) * 2003-08-05 2005-07-21 두산디앤디 주식회사 컨디셔너 캐리어용 복합운동기구가 구비된 반도체 웨이퍼표면연마장비
US7338569B2 (en) * 2004-09-29 2008-03-04 Agere Systems Inc. Method and system of using offset gage for CMP polishing pad alignment and adjustment
US7699688B2 (en) * 2006-11-22 2010-04-20 Applied Materials, Inc. Carrier ring for carrier head
KR101022277B1 (ko) * 2009-02-25 2011-03-21 그린스펙(주) 실리콘 베어 웨이퍼 연마장치용 캐리어 헤드
JP5303491B2 (ja) * 2010-02-19 2013-10-02 信越半導体株式会社 研磨ヘッド及び研磨装置
US20130288577A1 (en) * 2012-04-27 2013-10-31 Applied Materials, Inc. Methods and apparatus for active substrate precession during chemical mechanical polishing
US20140273756A1 (en) * 2013-03-14 2014-09-18 Chih Hung Chen Substrate precession mechanism for cmp polishing head

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010039172A1 (en) * 2000-04-17 2001-11-08 Norio Kimura Polishing apparatus
CN1488470A (zh) * 2002-08-29 2004-04-14 ����Խ��е��ҵ��ʽ���� 抛光机
CN101023511A (zh) * 2004-09-30 2007-08-22 株式会社瑞萨科技 半导体器件的制造方法
CN201168928Y (zh) * 2005-12-28 2008-12-24 应用材料公司 一种用于衬底化学机械抛光装置的载具头及其柔性膜
CN101396805A (zh) * 2006-11-22 2009-04-01 应用材料股份有限公司 具有保持环和夹持环的研磨头

Also Published As

Publication number Publication date
KR102243725B1 (ko) 2021-04-23
US20140273756A1 (en) 2014-09-18
JP2016515303A (ja) 2016-05-26
JP6581964B2 (ja) 2019-09-25
TW201446417A (zh) 2014-12-16
WO2014158548A1 (en) 2014-10-02
TWI617393B (zh) 2018-03-11
KR20150132842A (ko) 2015-11-26
CN105190845A (zh) 2015-12-23

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