KR102243725B1 - Ｃｍｐ 폴리싱 헤드용 기판 세차 메커니즘 - Google Patents

Ｃｍｐ 폴리싱 헤드용 기판 세차 메커니즘 Download PDF

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Publication number
KR102243725B1
KR102243725B1 KR1020157029484A KR20157029484A KR102243725B1 KR 102243725 B1 KR102243725 B1 KR 102243725B1 KR 1020157029484 A KR1020157029484 A KR 1020157029484A KR 20157029484 A KR20157029484 A KR 20157029484A KR 102243725 B1 KR102243725 B1 KR 102243725B1
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South Korea
Prior art keywords
assembly
retaining ring
substrate
head
ring assembly
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Korean (ko)
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KR20150132842A (ko
Inventor
치 헝 첸
가우탐 샤샹크 단다바테
제이 구루사미
사무엘 추-치앙 수
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어플라이드 머티어리얼스, 인코포레이티드
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Publication of KR20150132842A publication Critical patent/KR20150132842A/ko
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    • H01L21/304—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H01L21/30625—

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020157029484A 2013-03-14 2014-02-24 Ｃｍｐ 폴리싱 헤드용 기판 세차 메커니즘 Active KR102243725B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/827,629 2013-03-14
US13/827,629 US20140273756A1 (en) 2013-03-14 2013-03-14 Substrate precession mechanism for cmp polishing head
PCT/US2014/018069 WO2014158548A1 (en) 2013-03-14 2014-02-24 Substrate precession mechanism for cmp polishing head

Publications (2)

Publication Number Publication Date
KR20150132842A KR20150132842A (ko) 2015-11-26
KR102243725B1 true KR102243725B1 (ko) 2021-04-23

Family

ID=51529186

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157029484A Active KR102243725B1 (ko) 2013-03-14 2014-02-24 Ｃｍｐ 폴리싱 헤드용 기판 세차 메커니즘

Country Status (6)

Country Link
US (1) US20140273756A1 (https=)
JP (1) JP6581964B2 (https=)
KR (1) KR102243725B1 (https=)
CN (1) CN105190845B (https=)
TW (1) TWI617393B (https=)
WO (1) WO2014158548A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014163735A1 (en) * 2013-03-13 2014-10-09 Applied Materials, Inc. Reinforcement ring for carrier head
US20140273756A1 (en) * 2013-03-14 2014-09-18 Chih Hung Chen Substrate precession mechanism for cmp polishing head
JP7051332B2 (ja) 2017-08-23 2022-04-11 キヤノン株式会社 有機化合物及び光電変換素子
KR102459832B1 (ko) * 2017-11-22 2022-10-28 주식회사 케이씨텍 캐리어
TWI639486B (zh) * 2018-05-31 2018-11-01 國立清華大學 全向整合式調節裝置
WO2022103583A1 (en) 2020-11-10 2022-05-19 Applied Materials, Inc. Polishing head with local wafer pressure
WO2023229658A1 (en) * 2022-05-27 2023-11-30 Applied Materials, Inc. Clamping retainer for chemical mechanical polishing and method of operation

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000334655A (ja) 1999-05-26 2000-12-05 Matsushita Electric Ind Co Ltd Ｃｍｐ加工装置
JP2001298006A (ja) * 2000-04-17 2001-10-26 Ebara Corp 研磨装置
JP2008131049A (ja) * 2006-11-22 2008-06-05 Applied Materials Inc キャリアヘッド用キャリアリング

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008229846A (ja) * 1995-10-09 2008-10-02 Ebara Corp ポリッシング装置及び方法並びにトップリング
JP3724869B2 (ja) * 1995-10-09 2005-12-07 株式会社荏原製作所 ポリッシング装置および方法
JPH10156712A (ja) * 1996-11-29 1998-06-16 Oki Electric Ind Co Ltd ウエハ研磨装置
US7198561B2 (en) * 2000-07-25 2007-04-03 Applied Materials, Inc. Flexible membrane for multi-chamber carrier head
US6527625B1 (en) * 2000-08-31 2003-03-04 Multi-Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a soft backed polishing head
CN101607381B (zh) * 2000-08-31 2014-04-16 株式会社荏原制作所 化学机械抛光头、设备和方法以及平面化半导体晶片
JP2004106173A (ja) * 2002-08-29 2004-04-08 Fujikoshi Mach Corp 両面研磨装置
KR100502362B1 (ko) * 2003-08-05 2005-07-21 두산디앤디 주식회사 컨디셔너 캐리어용 복합운동기구가 구비된 반도체 웨이퍼표면연마장비
US7338569B2 (en) * 2004-09-29 2008-03-04 Agere Systems Inc. Method and system of using offset gage for CMP polishing pad alignment and adjustment
US20080076253A1 (en) * 2004-09-30 2008-03-27 Hiroshi Fukada Adhesive Sheet,Semiconductor Device,and Process for Producing Semiconductor Device
US7654888B2 (en) * 2006-11-22 2010-02-02 Applied Materials, Inc. Carrier head with retaining ring and carrier ring
KR101022277B1 (ko) * 2009-02-25 2011-03-21 그린스펙(주) 실리콘 베어 웨이퍼 연마장치용 캐리어 헤드
JP5303491B2 (ja) * 2010-02-19 2013-10-02 信越半導体株式会社 研磨ヘッド及び研磨装置
US20130288577A1 (en) * 2012-04-27 2013-10-31 Applied Materials, Inc. Methods and apparatus for active substrate precession during chemical mechanical polishing
US20140273756A1 (en) * 2013-03-14 2014-09-18 Chih Hung Chen Substrate precession mechanism for cmp polishing head

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000334655A (ja) 1999-05-26 2000-12-05 Matsushita Electric Ind Co Ltd Ｃｍｐ加工装置
JP2001298006A (ja) * 2000-04-17 2001-10-26 Ebara Corp 研磨装置
JP2008131049A (ja) * 2006-11-22 2008-06-05 Applied Materials Inc キャリアヘッド用キャリアリング

Also Published As

Publication number Publication date
US20140273756A1 (en) 2014-09-18
JP2016515303A (ja) 2016-05-26
JP6581964B2 (ja) 2019-09-25
CN105190845B (zh) 2019-02-22
TW201446417A (zh) 2014-12-16
WO2014158548A1 (en) 2014-10-02
TWI617393B (zh) 2018-03-11
KR20150132842A (ko) 2015-11-26
CN105190845A (zh) 2015-12-23

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