CN105188257B - Circuit board and its electronic product and chip recognition methods - Google Patents
Circuit board and its electronic product and chip recognition methods Download PDFInfo
- Publication number
- CN105188257B CN105188257B CN201510548728.2A CN201510548728A CN105188257B CN 105188257 B CN105188257 B CN 105188257B CN 201510548728 A CN201510548728 A CN 201510548728A CN 105188257 B CN105188257 B CN 105188257B
- Authority
- CN
- China
- Prior art keywords
- chip
- circuit board
- pin
- function module
- identification
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title abstract description 16
- 238000003466 welding Methods 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 8
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 238000013461 design Methods 0.000 abstract description 17
- 230000010354 integration Effects 0.000 abstract description 5
- 238000005538 encapsulation Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000012356 Product development Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention is suitable for technical field of electronic products, discloses a kind of circuit board and its electronic product and chip recognition methods.Foregoing circuit plate includes circuit board and multiple chips, is provided with multiple circuit function module areas in circuit board, identification structure is both provided between each chip and each circuit function module area, each chip is connected in corresponding circuit function module area.Above-mentioned electronic product includes foregoing circuit plate.Said chip recognition methods step is：Chip and circuit board are taken out, and watches the shape of pin cross section, then comparison judges whether the shape of welded disc is identical with the shape of pin cross section, identical then to connect pin and welded disc weldering.A kind of circuit board and its electronic product provided by the invention and chip recognition methods, time of board design is short, design efficiency is high, is conducive to carry out high integration, the design of high density circuit board, and then improve the integrated level of electronic product.And chip recognition methods step is simple, and it is accurately, efficient.
Description
Technical field
The invention belongs to technical field of electronic products more particularly to a kind of circuit board and its electronic product and chip identification sides
Method.
Background technology
With smart electronics product rapid development and gradually turn to lightening, high density structures layout designs, thus produce
It can be more and more using the chip of various high integration in product.And the chip of high integration has hundreds and thousands of a pins, these
Chip layout is when on pcb board (Printed Circuit Board, Chinese are printed circuit board), due to chip pin
Shape all, if BGA package (Ball Grid Array Package, Chinese meaning be ball grid array) chip is round
Pin pad, QFN/QFP (QFN：Quad Flat No-lead Package, Chinese meaning are sealed for quad flat non-pin
Dress；QFP：Quad Flat Package, Chinese meaning be small-sized square planar package) encapsulation be drawing for square or rectangular
Foot pad, i.e., same chip reflected pin on pcb board are of the same shape.But when carrying out pcb board design,
Can be there are many kinds of circuit module, and need to remove the functional information for understanding each pin in chip in encapsulation, it needs to know encapsulation
Each pin belongs to that circuit module in chip, is to do that function is used, could go to carry out pcb board layout well and walk
Line designs.
But the way of identification chip is all the specification by the symbolic information in schematic diagram or access chip at present
Book goes to obtain the pin function information of chip package on pcb board.This is for carrying out high integration, highdensity pcb board is designed and
It says it is troublesome thing, the design time of pcb board can be increased, influence the design efficiency of pcb board, and be unfavorable for carrying out highly integrated
Degree, the design of highdensity pcb board.
Invention content
In view of this, the embodiment of the present invention provides a kind of circuit board and its electronic product and chip recognition methods, to solve
The problem of chip pin identification is difficult, and recognition efficiency is low, is conducive to the integrated development of circuit board, and improve electronic product
Integrated level.
The technical scheme is that：A kind of circuit board, multiple chips including circuit board and connection to be packaged are described
Multiple circuit function module areas for being used to install the chip, each chip and each circuit work(are provided in circuit board
The identification structure with identification link information can be respectively provided between block region, each chip is connected to according to the identification structure
In the corresponding circuit function module area.
Specifically, the identification structure includes the pin with identification information and is correspondingly arranged at the circuit function module
In area and the welded disc identical with the pin cross section to be connected, one end of the pin is connected to the chip, another
End is connect with the welded disc.
Specifically, the identification structure includes the pin with identification information and is correspondingly arranged at the circuit function module
In area and the welding hole identical with the pin cross section to be connected, one end of the pin is connected to the chip, another
End is inserted in the welding hole.
Preferably, the level cross-sectionn of the pin is in " circle ".
Preferably, the level cross-sectionn of the pin is in " ellipse ".
Preferably, the level cross-sectionn of the pin is " diamond ".
Preferably, the level cross-sectionn of the pin is in " hexagon ".
Preferably, the level cross-sectionn of the pin is in " octagon ".
The present invention also provides a kind of electronic product, including above-mentioned circuit board.
The present invention also provides a kind of chip recognition methods, the knowledge of chip when being connected for chip and circuit board encapsulation
Not, the chip setting has the pin of connection identification information, is correspondingly arranged in the circuit board transversal with the pin
The identical welded disc in face, the recognition methods include the following steps：The chip and the circuit board are taken out, and is watched described
The shape of pin cross section, then comparison judge whether the shape of the welded disc is identical with the shape of the pin cross section,
It is identical then to connect the pin and welded disc weldering.
A kind of circuit board and its electronic product and chip recognition methods, the circuit board provided by the invention are more due to being provided with
A chip and multiple circuit function module areas for chip, so as to because in each chip and each circuit function module area
Between be respectively provided with the identification structure with identification link information, so it is low to overcome each chip identification installation effectiveness, easily malfunction
The problem of.The identification structure is identified by judgement, can each chip be accurately quickly mounted on corresponding circuit function module
In area, the time of board design is shortened, improves design efficiency, be conducive to carry out high integration, high density circuit board
Design, and then improve the integrated level of electronic product.And chip recognition methods step is simple, and it is accurately, efficient.
Description of the drawings
Fig. 1 is a kind of structure diagram of circuit board provided in an embodiment of the present invention；
Fig. 2 is another structure diagram of circuit board provided in an embodiment of the present invention.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, it is right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
As depicted in figs. 1 and 2, a kind of circuit board provided in an embodiment of the present invention, including circuit board 11 and company to be packaged
The multiple chip (not shown)s connect, by the processing of chip, so as to realize the use function of setting.Due to circuit board
Some achieved function is that different chip common combinations is needed to reach, also, in practical application, circuit
The function more than one to be realized of plate, thus just need different types of chip and according to design code common combination come real
It is existing, thus multiple circuit function module area (not shown)s for chip are provided in circuit board 11, then
Multiple chips is set to realize requirement in each circuit function module area.When circuit chip is connected and is encapsulated, each chip
Installation position is equipped with strict requirements, thus can not mistake the installation site of chip.Although and due to that can realize different functions,
But in actual production, the shape of each chip is essentially identical, it is easy to the problem of installation site mistake occurs.To guarantee
Correct encapsulation chip in the present embodiment, by being respectively provided between each chip and each circuit function module area there is identification to connect
The identification structure (not shown) of information is connect, then each chip is connected to corresponding circuit function according to identification structure is judged
In block region, the accuracy of chip connection encapsulation is ensured that.Traditional circuit board is overcome when carrying out chip package, because
It is to need symbolic information in schematic diagram or consult the specifications of chip correct to encapsulate chip and existing identification is stranded
Difficult, the defects of efficiency is low.In the embodiment of the present invention, structure is identified by setting, is capable of the installation of fast and accurately identification chip
Position so as to shorten the design time of circuit board, improves the design efficiency of circuit board, and is conducive to circuit board and carries out height
Integrated level, highdensity design, practicability are good.
Specifically, as depicted in figs. 1 and 2, in the present embodiment, by the identification structure setting into including having identification information
Pin (not shown) and be correspondingly arranged at weldering in circuit function module area and identical with pin cross section to be connected
Disk 12 is connect, one end of pin is connected to chip, and the other end is connect with welded disc 12.Setting in this way is sealed in actual chips
When load connects, judge whether the shape of welded disc 12 and the cross-sectional shape of chip pin can unanimously know chip by identification
Installation site, identification easily, improve chip pin identification efficiency.When identical, weld and connect with the welded disc 12, it is inconsistent
When, the just not company of weldering.In addition, when actual production manufactures, entire pin can be arranged to the structure with identification information, also may be used
To be that pin only is arranged to the structure with identification information with one end that welded disc 12 is connected, specific set-up mode can root
Factually border production requirement determines, does not limit herein.
Specifically, in other embodiments, can also will identification structure setting into including having the pin of identification information and right
Welding hole (not shown) in circuit function module area and identical with pin cross section to be connected, pin should be arranged on
One end be connected to chip, the other end is inserted in welding hole.In this way, when actually pacifying encapsulation identification, by matching welding hole
Shape and the shape of chip pin cross section whether can unanimously know whether the installation site of chip accurate, and in position standard
When true, pin corresponding inserted is connected in welding hole.Similary recognition efficiency is high, reduces the difficulty of chip identification.
Preferably, as depicted in figs. 1 and 2, according to requirements, the shape that pin can be arranged to its level cross-sectionn is in
" circle " or have in " ellipse " or in " half elliptic " or " diamond " or in " hexagon " or in " octagon " etc. is other
Information is explicitly indicated and easily identifies the shape of differentiation.It, can will be in different circuit function module areas in this way, in board design
Welded disc 12 or welding hole be arranged to different shape, then the pin of chip to be packaged is accordingly arranged to different shapes
Shape when encapsulation connects, carries out shape matching.
The embodiment of the present invention additionally provides a kind of electronic product, including above-mentioned circuit board.Since the circuit board has height
Integrated level, highdensity feature, thus the integrated level of the electronic product with the circuit board is improved, and ensure electronic product
Quality.
The embodiment of the present invention additionally provides a kind of chip recognition methods, core when being connected for chip and the encapsulation of circuit board 11
The identification of piece, pin of the setting with connection identification information on the chip are correspondingly arranged in circuit board 11 transversal with pin
The identical welded disc 12 in face, the recognition methods include the following steps：Chip and circuit board 11 are taken out, and watches pin cross section
Shape, then comparison judge whether the shape of welded disc 12 identical with the shape of pin cross section, when shape match it is identical when,
Then by pin and 12 company of weldering of welded disc, and when mismatching, then do not weld.The recognition methods is simple, efficient, is effectively improved
The efficiency of chip package connection controls the progress of product development with utilization.Meanwhile it according to same recognition principle, can also incite somebody to action
The recognition methods is applied to the identification encapsulation of other large-scale highly integrated chips, has a wide range of application.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
Any modification, equivalent replacement or improvement made within refreshing and principle etc., should all be included in the protection scope of the present invention.
Claims (8)
1. a kind of circuit board, which is characterized in that multiple chips including circuit board and connection to be packaged, in the circuit board
Multiple circuit function module areas for being used to install the chip are provided with, each circuit function module area is used to set multiple cores
Piece is respectively provided between each chip and each circuit function module area so as to fulfill respective circuit function with identification connection
The identification structure of information, each chip are connected to according to the identification structure in the corresponding circuit function module area, from
And so that accurately connection is packaged in circuit board each chip；
The identification structure includes the pin with identification information and is correspondingly arranged in the circuit function module area and with treating
The identical welded disc in the pin cross section of connection, one end of the pin are connected to the chip, the other end and the weldering
Connect disk connection；When carrying out chip package connection, the shape of the welded disc and the cross section of chip pin are judged by identification
Whether shape is consistent, so as to know the installation site of chip；Wherein, the pin is set as entire pin with identification information
Structure or one end that the pin is connected with welded disc is only arranged to the structure with identification information.
2. circuit board as described in claim 1, which is characterized in that it is described identification structure include with identification information pin and
Welding hole in the circuit function module area and identical with the pin cross section to be connected is correspondingly arranged at, it is described to draw
One end of foot is connected to the chip, and the other end is inserted in the welding hole.
3. circuit board as claimed in claim 1 or 2, which is characterized in that the level cross-sectionn of the pin is in " circle ".
4. circuit board as claimed in claim 1 or 2, which is characterized in that the level cross-sectionn of the pin is in " ellipse ".
5. circuit board as claimed in claim 1 or 2, which is characterized in that the level cross-sectionn of the pin is " diamond ".
6. circuit board as claimed in claim 1 or 2, which is characterized in that the level cross-sectionn of the pin is in " hexagon ".
7. circuit board as claimed in claim 1 or 2, which is characterized in that the level cross-sectionn of the pin is in " octagon ".
8. a kind of electronic product, which is characterized in that including circuit board as claimed in any of claims 1 to 7 in one of claims.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510548728.2A CN105188257B (en) | 2015-08-31 | 2015-08-31 | Circuit board and its electronic product and chip recognition methods |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510548728.2A CN105188257B (en) | 2015-08-31 | 2015-08-31 | Circuit board and its electronic product and chip recognition methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105188257A CN105188257A (en) | 2015-12-23 |
| CN105188257B true CN105188257B (en) | 2018-06-19 |
Family
ID=54910027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510548728.2A Expired - Fee Related CN105188257B (en) | 2015-08-31 | 2015-08-31 | Circuit board and its electronic product and chip recognition methods |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105188257B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5630270A (en) * | 1994-03-03 | 1997-05-20 | Alcatel Network Systems, Inc. | Circuit board identification method |
| CN1396799A (en) * | 2001-07-11 | 2003-02-12 | 三星电子株式会社 | Printed circuit board with improved pad structure |
| CN101005063A (en) * | 2006-01-18 | 2007-07-25 | 三星电子株式会社 | Semiconductor chip package attached electronic device and integrated circuit module having the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2833965B2 (en) * | 1993-07-27 | 1998-12-09 | 日本電気株式会社 | Pad for IC lead |
| JPH09312452A (en) * | 1996-05-23 | 1997-12-02 | Nec Eng Ltd | Substrate with lsi pin identification number |
| JP2001068820A (en) * | 1999-08-27 | 2001-03-16 | Diamond Electric Mfg Co Ltd | Ic lead mark |
-
2015
- 2015-08-31 CN CN201510548728.2A patent/CN105188257B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5630270A (en) * | 1994-03-03 | 1997-05-20 | Alcatel Network Systems, Inc. | Circuit board identification method |
| CN1396799A (en) * | 2001-07-11 | 2003-02-12 | 三星电子株式会社 | Printed circuit board with improved pad structure |
| CN101005063A (en) * | 2006-01-18 | 2007-07-25 | 三星电子株式会社 | Semiconductor chip package attached electronic device and integrated circuit module having the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105188257A (en) | 2015-12-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101341414B (en) | Connection verification technique | |
| CN100588979C (en) | Testing method for integrated circuit high temperature dynamic aging and testing device thereof | |
| US6469369B1 (en) | Leadframe having a mold inflow groove and method for making | |
| JP4104740B2 (en) | Probe card for testing semiconductor devices | |
| CN108878306A (en) | A kind of multistation IC fuses trim test macro and its method for repairing and regulating | |
| CN105188257B (en) | Circuit board and its electronic product and chip recognition methods | |
| CN205562750U (en) | Test board | |
| CN104167403B (en) | Lead frame for multi-pin encapsulation | |
| CN208240624U (en) | Semiconductor assembly and test device | |
| CN208655575U (en) | A kind of multistation IC fuses trim test macro | |
| CN210605679U (en) | PCBA online burning device | |
| CN203536411U (en) | Semiconductor packaging structure | |
| KR100564564B1 (en) | Test socket for connecting a contact pad in both side of Chip On Board type package | |
| CN105633058A (en) | Device identification structure and manufacturing method thereof | |
| US20060284635A1 (en) | Re-routing method and the circuit thereof | |
| JP3130639U (en) | Semiconductor package structure | |
| US9548263B2 (en) | Semiconductor device package for debugging and related fabrication methods | |
| CN206020466U (en) | A kind of chip testing connecting plate | |
| CN104103532A (en) | Multi-substrate three-dimensional chip packaging method | |
| CN210805761U (en) | Semiconductor chip | |
| CN209979798U (en) | Test fixture | |
| KR100689218B1 (en) | ball grid array package | |
| CN102569108B (en) | Tool for mounting solder ball | |
| US20070296070A1 (en) | Semiconductor package having functional and auxiliary leads, and process for fabricating it | |
| CN207587727U (en) | A kind of multichip carrier lead frame |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523841 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180619 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |