CN105185865B - 太阳能电池的后加工设备 - Google Patents
太阳能电池的后加工设备 Download PDFInfo
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- CN105185865B CN105185865B CN201510481460.5A CN201510481460A CN105185865B CN 105185865 B CN105185865 B CN 105185865B CN 201510481460 A CN201510481460 A CN 201510481460A CN 105185865 B CN105185865 B CN 105185865B
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- 239000004065 semiconductor Substances 0.000 claims abstract description 286
- 239000000758 substrate Substances 0.000 claims abstract description 265
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- 238000000034 method Methods 0.000 claims description 239
- 238000001816 cooling Methods 0.000 claims description 94
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- 238000012545 processing Methods 0.000 claims description 25
- 238000002360 preparation method Methods 0.000 claims description 15
- 238000010276 construction Methods 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 description 152
- 229910052739 hydrogen Inorganic materials 0.000 description 152
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 104
- 239000010410 layer Substances 0.000 description 76
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- 239000007789 gas Substances 0.000 description 24
- 239000013078 crystal Substances 0.000 description 23
- 230000000694 effects Effects 0.000 description 20
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 17
- 229910052796 boron Inorganic materials 0.000 description 17
- 230000008859 change Effects 0.000 description 14
- 230000007246 mechanism Effects 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- 229910052710 silicon Inorganic materials 0.000 description 12
- 239000010703 silicon Substances 0.000 description 12
- 238000009792 diffusion process Methods 0.000 description 11
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- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 7
- 229920005591 polysilicon Polymers 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 5
- 229910052738 indium Inorganic materials 0.000 description 5
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 5
- 238000002310 reflectometry Methods 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
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- 230000005693 optoelectronics Effects 0.000 description 4
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- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 3
- -1 Hydrogen compound Chemical class 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 229910052787 antimony Inorganic materials 0.000 description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 3
- 229910052785 arsenic Inorganic materials 0.000 description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 229910052797 bismuth Inorganic materials 0.000 description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
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- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 238000011112 process operation Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910004012 SiCx Inorganic materials 0.000 description 2
- 229910004205 SiNX Inorganic materials 0.000 description 2
- 229910020286 SiOxNy Inorganic materials 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
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- 238000007639 printing Methods 0.000 description 2
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- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
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- 230000000052 comparative effect Effects 0.000 description 1
- 239000002322 conducting polymer Substances 0.000 description 1
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- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
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- 229910003460 diamond Inorganic materials 0.000 description 1
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- 239000002003 electrode paste Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000069 prophylactic effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/024—Arrangements for cooling, heating, ventilating or temperature compensation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
- H01L31/1864—Annealing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0033—Heating devices using lamps
- H05B3/0038—Heating devices using lamps for industrial applications
- H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
Claims (19)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2014-0073575 | 2014-06-17 | ||
KR1020140073575A KR20150144585A (ko) | 2014-06-17 | 2014-06-17 | 태양 전지의 후처리 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105185865A CN105185865A (zh) | 2015-12-23 |
CN105185865B true CN105185865B (zh) | 2017-06-23 |
Family
ID=53432932
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510481460.5A Active CN105185865B (zh) | 2014-06-17 | 2015-06-17 | 太阳能电池的后加工设备 |
Country Status (5)
Country | Link |
---|---|
US (2) | US10109511B2 (zh) |
EP (1) | EP2958153B1 (zh) |
JP (1) | JP6139600B2 (zh) |
KR (1) | KR20150144585A (zh) |
CN (1) | CN105185865B (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160005915A1 (en) * | 2014-07-03 | 2016-01-07 | Sino-American Silicon Products Inc. | Method and apparatus for inhibiting light-induced degradation of photovoltaic device |
US9780252B2 (en) * | 2014-10-17 | 2017-10-03 | Tp Solar, Inc. | Method and apparatus for reduction of solar cell LID |
US10443941B2 (en) | 2015-05-20 | 2019-10-15 | Illinois Tool Works Inc. | Light annealing in a cooling chamber of a firing furnace |
KR102591880B1 (ko) * | 2015-12-18 | 2023-10-24 | 상라오 징코 솔라 테크놀러지 디벨롭먼트 컴퍼니, 리미티드 | 태양 전지의 제조 방법 |
JP6430468B2 (ja) | 2015-12-18 | 2018-11-28 | エルジー エレクトロニクス インコーポレイティド | 太陽電池の製造方法 |
KR101821394B1 (ko) * | 2016-01-14 | 2018-01-23 | 엘지전자 주식회사 | 태양전지 |
CN108604619A (zh) * | 2016-02-22 | 2018-09-28 | 应用材料意大利有限公司 | 用于处理太阳能电池基板的设备、用于处理太阳能电池基板的系统和用于处理太阳能电池基板的方法 |
WO2017163498A1 (ja) * | 2016-03-23 | 2017-09-28 | 三菱電機株式会社 | 太陽電池、および、太陽電池の製造方法 |
TW201742259A (zh) * | 2016-05-16 | 2017-12-01 | 昱晶能源科技股份有限公司 | 氫化太陽能電池之方法及其裝置 |
CN107393971A (zh) * | 2016-05-16 | 2017-11-24 | 昱晶能源科技股份有限公司 | 回复太阳能电池模块的效率的方法及其可携式装置 |
KR101912772B1 (ko) * | 2016-12-26 | 2019-01-14 | 주식회사 한화 | 광기전력 소자 제조 장치 및 제조 방법 |
CN106887475B (zh) * | 2017-03-03 | 2019-07-05 | 广东爱旭科技股份有限公司 | P型perc双面太阳能电池及其组件、系统和制备方法 |
CN107425080B (zh) * | 2017-03-03 | 2019-11-15 | 广东爱康太阳能科技有限公司 | P型perc双面太阳能电池及其组件、系统和制备方法 |
US11588071B2 (en) * | 2018-10-24 | 2023-02-21 | Newsouth Innovations Pty Limited | Method for improving the performance of a heterojunction solar cell |
DE102019111061A1 (de) * | 2019-04-29 | 2020-10-29 | Meyer Burger (Germany) Gmbh | Herstellungsverfahren von Silizium-Heterojunction-Solarzellen mit Stabilisierungsschritt und Fertigungslinienabschnitt für den Stabilisierungsschritt |
CA3178341A1 (en) | 2020-07-10 | 2022-01-13 | Adare Pharmaceuticals, Inc. | Swellable oral pharmaceutical compositions |
DE102021004175B3 (de) * | 2021-08-13 | 2022-12-01 | Singulus Technologies Aktiengesellschaft | Abstandsvorrichtung für Heizsystem zum Aufheizen von großflächigen Substraten, Heizsystem und Aufheizverfahren |
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JPS5750427A (en) * | 1980-09-12 | 1982-03-24 | Ushio Inc | Annealing device and annealing method |
US20010031229A1 (en) * | 1998-10-20 | 2001-10-18 | Spjut Reed E. | UV-enhanced, in-line, infrared phosphorous diffusion furnace |
WO2000070666A1 (fr) * | 1999-05-14 | 2000-11-23 | Tokyo Electron Limited | Technique de traitement et dispositif correspondant |
US6594446B2 (en) | 2000-12-04 | 2003-07-15 | Vortek Industries Ltd. | Heat-treating methods and systems |
KR100492606B1 (ko) | 2002-12-30 | 2005-06-03 | 엘지전자 주식회사 | 무전극 조명기기의 배광 장치 |
US7220936B2 (en) * | 2004-07-30 | 2007-05-22 | Ut-Battelle, Llc | Pulse thermal processing of functional materials using directed plasma arc |
US7102141B2 (en) | 2004-09-28 | 2006-09-05 | Intel Corporation | Flash lamp annealing apparatus to generate electromagnetic radiation having selective wavelengths |
JP2006185974A (ja) * | 2004-12-27 | 2006-07-13 | Kyocera Corp | 焼成炉、及びこれを用いた被処理体の焼成方法、並びに太陽電池素子の製造方法 |
EP1886339A4 (en) * | 2005-06-03 | 2008-08-27 | Csg Solar Ag | METHOD AND DEVICE FOR HYDROGENATING THIN FILM SILICON ON GLASS |
KR100748529B1 (ko) | 2005-09-23 | 2007-08-13 | 엘지전자 주식회사 | 무전극 조명기기의 고온 운전형 무전극 전구 및 이를구비한 무전극 조명기기 |
DE102006047472A1 (de) * | 2006-10-05 | 2008-04-10 | Fhr Anlagenbau Gmbh | Verfahren und Vorrichtung zur oberflächennahen Behandlung von flächigen Substraten |
US8410712B2 (en) | 2008-07-09 | 2013-04-02 | Ncc Nano, Llc | Method and apparatus for curing thin films on low-temperature substrates at high speeds |
KR101002661B1 (ko) * | 2008-08-12 | 2010-12-20 | 삼성모바일디스플레이주식회사 | 인라인 열처리 설비 및 이를 사용한 기판 열처리 방법 |
KR101055037B1 (ko) | 2010-01-18 | 2011-08-05 | 엘지이노텍 주식회사 | 라이트 유닛 및 이를 구비한 디스플레이 장치 |
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-
2014
- 2014-06-17 KR KR1020140073575A patent/KR20150144585A/ko active Application Filing
-
2015
- 2015-06-16 US US14/741,286 patent/US10109511B2/en active Active
- 2015-06-16 EP EP15001779.6A patent/EP2958153B1/en active Active
- 2015-06-17 CN CN201510481460.5A patent/CN105185865B/zh active Active
- 2015-06-17 JP JP2015122140A patent/JP6139600B2/ja active Active
-
2018
- 2018-09-28 US US16/146,958 patent/US20190035655A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
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US10109511B2 (en) | 2018-10-23 |
JP2016005003A (ja) | 2016-01-12 |
US20190035655A1 (en) | 2019-01-31 |
US20150364351A1 (en) | 2015-12-17 |
EP2958153A1 (en) | 2015-12-23 |
CN105185865A (zh) | 2015-12-23 |
JP6139600B2 (ja) | 2017-05-31 |
KR20150144585A (ko) | 2015-12-28 |
EP2958153B1 (en) | 2019-08-07 |
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