CN105161423A - 一种背沟道刻蚀型氧化物薄膜晶体管的制备方法 - Google Patents
一种背沟道刻蚀型氧化物薄膜晶体管的制备方法 Download PDFInfo
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- CN105161423A CN105161423A CN201510578744.6A CN201510578744A CN105161423A CN 105161423 A CN105161423 A CN 105161423A CN 201510578744 A CN201510578744 A CN 201510578744A CN 105161423 A CN105161423 A CN 105161423A
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- film transistor
- oxide
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- 239000010409 thin film Substances 0.000 title claims abstract description 64
- 238000004519 manufacturing process Methods 0.000 title abstract description 11
- 238000005530 etching Methods 0.000 title abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 65
- 238000006056 electrooxidation reaction Methods 0.000 claims abstract description 35
- 238000004544 sputter deposition Methods 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 238000009413 insulation Methods 0.000 claims abstract description 19
- 239000011265 semifinished product Substances 0.000 claims abstract description 12
- 239000010408 film Substances 0.000 claims description 56
- 238000002360 preparation method Methods 0.000 claims description 40
- 239000011248 coating agent Substances 0.000 claims description 34
- 238000000576 coating method Methods 0.000 claims description 34
- 230000003647 oxidation Effects 0.000 claims description 23
- 238000007254 oxidation reaction Methods 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 239000004020 conductor Substances 0.000 claims description 19
- 230000008569 process Effects 0.000 claims description 16
- 238000001039 wet etching Methods 0.000 claims description 16
- 239000003792 electrolyte Substances 0.000 claims description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 11
- 229910052760 oxygen Inorganic materials 0.000 claims description 11
- 239000001301 oxygen Substances 0.000 claims description 11
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 239000002131 composite material Substances 0.000 claims description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 9
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid group Chemical group C(CC(O)(C(=O)O)CC(=O)O)(=O)O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 230000004888 barrier function Effects 0.000 claims description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 5
- 238000000137 annealing Methods 0.000 claims description 5
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical group O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims description 5
- 239000011135 tin Substances 0.000 claims description 5
- 239000011701 zinc Substances 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 229910001362 Ta alloys Inorganic materials 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 150000001450 anions Chemical class 0.000 claims description 3
- NGPGDYLVALNKEG-UHFFFAOYSA-N azanium;azane;2,3,4-trihydroxy-4-oxobutanoate Chemical compound [NH4+].[NH4+].[O-]C(=O)C(O)C(O)C([O-])=O NGPGDYLVALNKEG-UHFFFAOYSA-N 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 3
- 238000002161 passivation Methods 0.000 claims description 2
- 230000007547 defect Effects 0.000 abstract description 2
- 238000000059 patterning Methods 0.000 abstract 3
- 230000001590 oxidative effect Effects 0.000 abstract 2
- 238000005516 engineering process Methods 0.000 description 9
- 230000008878 coupling Effects 0.000 description 7
- 238000010168 coupling process Methods 0.000 description 7
- 238000005859 coupling reaction Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000008151 electrolyte solution Substances 0.000 description 6
- 230000005855 radiation Effects 0.000 description 5
- 230000005518 electrochemistry Effects 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910001936 tantalum oxide Inorganic materials 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000583 Nd alloy Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- VVTQWTOTJWCYQT-UHFFFAOYSA-N alumane;neodymium Chemical compound [AlH3].[Nd] VVTQWTOTJWCYQT-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000002848 electrochemical method Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- KYKLWYKWCAYAJY-UHFFFAOYSA-N oxotin;zinc Chemical compound [Zn].[Sn]=O KYKLWYKWCAYAJY-UHFFFAOYSA-N 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4908—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66969—Multistep manufacturing processes of devices having semiconductor bodies not comprising group 14 or group 13/15 materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
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CN201510578744.6A CN105161423B (zh) | 2015-09-13 | 2015-09-13 | 一种背沟道刻蚀型氧化物薄膜晶体管的制备方法 |
Applications Claiming Priority (1)
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CN201510578744.6A CN105161423B (zh) | 2015-09-13 | 2015-09-13 | 一种背沟道刻蚀型氧化物薄膜晶体管的制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN105161423A true CN105161423A (zh) | 2015-12-16 |
CN105161423B CN105161423B (zh) | 2018-03-06 |
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CN201510578744.6A Active CN105161423B (zh) | 2015-09-13 | 2015-09-13 | 一种背沟道刻蚀型氧化物薄膜晶体管的制备方法 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105529275A (zh) * | 2016-02-03 | 2016-04-27 | 京东方科技集团股份有限公司 | 薄膜晶体管及其制造方法 |
CN105655389A (zh) * | 2016-01-15 | 2016-06-08 | 京东方科技集团股份有限公司 | 有源层、薄膜晶体管、阵列基板、显示装置及制备方法 |
CN109461660A (zh) * | 2018-11-14 | 2019-03-12 | 合肥鑫晟光电科技有限公司 | 一种金属氧化物薄膜及其制备方法、薄膜晶体管和阵列基板 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5899709A (en) * | 1992-04-07 | 1999-05-04 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming a semiconductor device using anodic oxidation |
JP2000022004A (ja) * | 1997-08-29 | 2000-01-21 | Semiconductor Energy Lab Co Ltd | 不揮発性メモリおよび半導体装置 |
CN102522429A (zh) * | 2011-12-28 | 2012-06-27 | 华南理工大学 | 一种基于金属氧化物的薄膜晶体管及其制备方法和应用 |
CN104282576A (zh) * | 2014-10-21 | 2015-01-14 | 北京大学深圳研究生院 | 一种金属氧化物薄膜晶体管制作方法 |
-
2015
- 2015-09-13 CN CN201510578744.6A patent/CN105161423B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5899709A (en) * | 1992-04-07 | 1999-05-04 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming a semiconductor device using anodic oxidation |
JP2000022004A (ja) * | 1997-08-29 | 2000-01-21 | Semiconductor Energy Lab Co Ltd | 不揮発性メモリおよび半導体装置 |
CN102522429A (zh) * | 2011-12-28 | 2012-06-27 | 华南理工大学 | 一种基于金属氧化物的薄膜晶体管及其制备方法和应用 |
CN104282576A (zh) * | 2014-10-21 | 2015-01-14 | 北京大学深圳研究生院 | 一种金属氧化物薄膜晶体管制作方法 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105655389A (zh) * | 2016-01-15 | 2016-06-08 | 京东方科技集团股份有限公司 | 有源层、薄膜晶体管、阵列基板、显示装置及制备方法 |
WO2017121243A1 (en) * | 2016-01-15 | 2017-07-20 | Boe Technology Group Co., Ltd. | Active layer, thin film transistor, array substrate, and display apparatus and fabrication methods |
CN105655389B (zh) * | 2016-01-15 | 2018-05-11 | 京东方科技集团股份有限公司 | 有源层、薄膜晶体管、阵列基板、显示装置及制备方法 |
EP3403281A4 (en) * | 2016-01-15 | 2019-11-20 | Boe Technology Group Co. Ltd. | ACTIVE LAYER, THIN-LAYER TRANSISTOR, ARRAY SUBSTRATE AND DISPLAY DEVICE AND MANUFACTURING METHOD |
CN105529275A (zh) * | 2016-02-03 | 2016-04-27 | 京东方科技集团股份有限公司 | 薄膜晶体管及其制造方法 |
WO2017133114A1 (zh) * | 2016-02-03 | 2017-08-10 | 京东方科技集团股份有限公司 | 薄膜晶体管及其制造方法 |
EP3413335A4 (en) * | 2016-02-03 | 2019-09-11 | BOE Technology Group Co., Ltd. | THIN-LAYER TRANSISTOR AND MANUFACTURING METHOD THEREFOR |
US10439070B2 (en) | 2016-02-03 | 2019-10-08 | Boe Technology Group Co., Ltd. | Thin-film transistor (TFT) and manufacturing method thereof |
CN109461660A (zh) * | 2018-11-14 | 2019-03-12 | 合肥鑫晟光电科技有限公司 | 一种金属氧化物薄膜及其制备方法、薄膜晶体管和阵列基板 |
US10923347B2 (en) | 2018-11-14 | 2021-02-16 | Hefei Xinsheng Optoelectronics Technology Co., Ltd. | Metal oxide film and manufacturing method thereof, thin film transistor and array substrate |
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Publication number | Publication date |
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CN105161423B (zh) | 2018-03-06 |
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Effective date of registration: 20191226 Address after: 510641 Tianhe District, Guangdong, No. five road, No. 381, Patentee after: Wang Lei Address before: 510640 Tianhe District, Guangdong, No. five road, No. 381, Patentee before: South China University of Technology |
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Effective date of registration: 20200224 Address after: 510640 Tianhe District, Guangdong, No. five road, No. 381, Co-patentee after: Guangzhou South China University of Technology Asset Management Co.,Ltd. Patentee after: Wang Lei Address before: 510641 Tianhe District, Guangdong, No. five road, No. 381, Patentee before: Wang Lei |