CN105159856B - Signal transmitting apparatus and terminal - Google Patents
Signal transmitting apparatus and terminal Download PDFInfo
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- CN105159856B CN105159856B CN201510524478.9A CN201510524478A CN105159856B CN 105159856 B CN105159856 B CN 105159856B CN 201510524478 A CN201510524478 A CN 201510524478A CN 105159856 B CN105159856 B CN 105159856B
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Abstract
The disclosure is directed to a kind of signal transmitting apparatus and terminals, belong to application of electronic technology field.The signal transmitting apparatus includes: signal processing chip, power management chip and general-purpose serial bus USB connector, and signal processing chip is connected with USB connector by two data signal lines；Power management chip is connected with two data signal lines respectively by two voltage signal lines, adjusting unit is in series on any voltage signal wire, the signal transmission that unit is used for the blocking voltage signal wire when voltage signal line transmits high-frequency signal is adjusted, the signal transmission of conducting voltage signal wire when voltage signal line transmits low frequency signal.The disclosure solves that the signal quality transmitted on data signal line is poor, the lower problem of the accuracy of signal transmission, has reached the signal quality for improving and transmitting on data signal line, the effect of the accuracy of promotion signal transmission, and the disclosure is used for the transmission of signal.
Description
Technical field
This disclosure relates to application of electronic technology field, in particular to a kind of signal transmitting apparatus and terminal.
Background technique
Signal processing chip and power management chip are provided on mobile terminal, and the signal processing chip passes through two letters
Number line and universal serial bus (English: Universal Serial Bus；Referred to as: USB) connector is connected, and carries out signal
Transmission.Power management chip can acquire the voltage on two signal wires, and according to the voltage of acquisition on the mobile terminal
Power supply be managed.
In the related technology, power management chip is integrated on the signal processing chip, and signal processing chip can pass through two
The transmission of signal is carried out between root data signal line and USB connector, power management chip can directly acquire and signal processing
The voltage on two data signal lines that chip is connected.With the development of electronic technology, more and more manufacturers can produce
Without the independent power management chip being integrated on signal processing chip, at this point, the power management chip passes through voltage signal
Line is separately connected with two data signal lines, carries out the acquisition of voltage on two data signal lines.
Summary of the invention
Present disclose provides a kind of signal transmitting apparatus and terminals.The technical solution is as follows:
According to the disclosure in a first aspect, providing a kind of signal transmitting apparatus, the signal transmitting apparatus includes: signal
Chip, power management chip and general-purpose serial bus USB connector are handled,
The signal processing chip is connected with the USB connector by two data signal lines；
The power management chip is connected with two data signal lines respectively by two voltage signal lines, any
Adjusting unit is in series on the voltage signal line, the adjusting unit is used for when the voltage signal line transmits high-frequency signal
It blocks the signal of the voltage signal line to transmit, the letter of the voltage signal line is connected when voltage signal line transmits low frequency signal
Number transmission.
Optionally, the adjusting unit is magnetic bead group, and each magnetic bead group includes at least one magnetic bead.
Optionally, the inductance parameters of any magnetic bead group are 1000 Ω.
Optionally, the magnetic bead group is a magnetic bead；
Or, the magnetic bead group is made of the magnetic bead of at least two serial or parallel connections.
Optionally, the signal transmitting apparatus further include: signal substrate,
The side of the signal substrate is formed with data-signal layer, and the data-signal layer includes two data-signals
The sectional area of line, any data signal line is greater than 600 μm2。
Optionally, any data signal line is greater than 25 μm at a distance from reference planes, is arranged in the reference planes
There is the return flow path of the signal of two data signal lines.
Optionally, the signal transmitting apparatus further include: the first shielding board and secondary shielding substrate, first shielding
Substrate, the signal substrate, the secondary shielding substrate are sequentially overlapped,
First shielding board is formed with the first additional signal layer far from the side of the signal substrate, is formed with described
First screen layer is formed on first shielding board of the first additional signal layer；
The secondary shielding substrate is formed with the second additional signal layer far from the side of the signal substrate, is formed with described
Secondary shielding layer is formed on the secondary shielding substrate of second additional signal layer；
Between first shielding board and the data-signal layer and the secondary shielding substrate and the signal base
Between plate, it is each formed with bonding glue-line；
The first screen layer is believed close to the surface of the data-signal layer and the secondary shielding layer close to the data
The surface of number floor is the reference planes.
Optionally, the characteristic impedance of any data signal line is equal to 90 Ω.
According to the second aspect of the disclosure, a kind of terminal is provided, the terminal includes that signal described in first aspect passes
Defeated device.
Technical solution provided by the present disclosure can include the following benefits:
Present disclose provides a kind of signal transmitting apparatus and terminal, due in the signal transmitting apparatus, with power management
Adjusting unit is in series on the voltage signal line that chip is connected, and the adjusting unit is used in voltage signal line transmission high frequency letter
Number when blocking voltage signal wire signal transmission, voltage signal line transmit low frequency signal when conducting voltage signal wire signal pass
It is defeated.When the signal processing chip and the USB connector transmit high-frequency signal by the data signal line, which can
The signal of blocking voltage signal wire transmits, so that do not influenced by voltage signal line when data signal line transmits high-frequency signal,
So improving the signal quality transmitted on data signal line, the accuracy of signal transmission is improved.
It should be understood that the above general description and the following detailed description are merely exemplary, this can not be limited
It is open.
Detailed description of the invention
In order to illustrate more clearly of embodiment of the disclosure, attached drawing needed in embodiment description will be made below
Simply introduce, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present disclosure, common for this field
For technical staff, without creative efforts, it is also possible to obtain other drawings based on these drawings.
Fig. 1-1 is the structural schematic diagram according to a kind of signal transmitting apparatus shown in the relevant technologies；
Fig. 1-2 is the partial cutaway schematic according to a kind of signal transmitting apparatus shown in the relevant technologies；
Fig. 1-3 is to be intended to according to a kind of diagram shown in the relevant technologies；
Fig. 2-1 is the structural schematic diagram according to the first signal transmitting apparatus shown in an exemplary embodiment；
Fig. 2-2 is the structural schematic diagram according to second of signal transmitting apparatus shown in an exemplary embodiment；
Fig. 2-3 is the inductance parameters schematic diagram according to a kind of magnetic bead shown in an exemplary embodiment；
Fig. 3-1 is the structural schematic diagram according to the third signal transmitting apparatus shown in an exemplary embodiment；
Fig. 3-2 is a kind of schematic partial cross-sectional view of signal transmitting apparatus shown according to an exemplary embodiment；
Fig. 3-3 is the partial structural diagram according to a kind of signal transmitting apparatus shown in the relevant technologies；
Fig. 3-4 is the structural schematic diagram according to the 4th kind of signal transmitting apparatus shown in an exemplary embodiment；
Fig. 4-1 is the structural schematic diagram according to the 5th kind of signal transmitting apparatus shown in an exemplary embodiment；
Fig. 4-2 is the schematic partial cross-sectional view of another signal transmitting apparatus shown according to an exemplary embodiment；
Fig. 4-3 is the structural schematic diagram according to the 6th kind of signal transmitting apparatus shown in an exemplary embodiment；
Fig. 5-1 is the structural schematic diagram according to the 7th kind of signal transmitting apparatus shown in an exemplary embodiment；
Fig. 5-2 is the schematic partial cross-sectional view according to another signal transmitting apparatus shown in an exemplary embodiment；
Fig. 6-1 is the structural schematic diagram according to the 8th kind of signal transmitting apparatus shown in an exemplary embodiment；
Fig. 6-2 is the schematic partial cross-sectional view according to another signal transmitting apparatus shown in an exemplary embodiment；
Fig. 7-1 is the structural schematic diagram according to the 9th kind of signal transmitting apparatus shown in an exemplary embodiment；
Fig. 7-2 is the schematic partial cross-sectional view according to a kind of signal transmitting apparatus shown in another exemplary embodiment；
Fig. 7-3 is the structural schematic diagram according to the tenth kind of signal transmitting apparatus shown in an exemplary embodiment；
Fig. 8-1 is according to the tenth a kind of structural schematic diagram of signal transmitting apparatus shown in an exemplary embodiment；
Fig. 8-2 is the schematic partial cross-sectional view according to another signal transmitting apparatus shown in another exemplary embodiment；
Fig. 8-3 is that a kind of diagram shown according to an exemplary embodiment is intended to.
The drawings herein are incorporated into the specification and forms part of this specification, and shows and meets implementation of the invention
Example, and be used to explain the principle of the present invention together with specification.
Specific embodiment
In order to keep the purposes, technical schemes and advantages of the disclosure clearer, below in conjunction with attached drawing to the disclosure make into
It is described in detail to one step, it is clear that described embodiment is only disclosure some embodiments, rather than whole implementation
Example.It is obtained by those of ordinary skill in the art without making creative efforts based on the embodiment in the disclosure
All other embodiment belongs to the range of disclosure protection.
Fig. 1-1 is the structural schematic diagram according to a kind of signal transmitting apparatus shown in the relevant technologies, as Figure 1-1, should
Signal transmitting apparatus 0 may include: signal processing chip 01, power management chip 02 and USB connector 03, exemplary, the letter
Number transmitting device 0 can be located in mobile terminal (being not shown in Fig. 1-1), and power supply (figure is also provided on the mobile terminal
It is not shown in 1-1).
Signal processing chip 01 can be connected by data signal line A1, data signal line A2 with USB connector 03, with
The USB connector 03 carries out the transmission of signal, and data signal line A1 and data signal line A2 can be differential data signals line.Electricity
Source control chip 02 is separately connected by voltage signal line B1, voltage signal line B2 and data signal line A1, data signal line A2,
Carry out the acquisition of voltage on data signal line A1, data signal line A2.Optionally, one end of voltage signal line B1 and power management
Chip 02 is connected, and the other end of voltage signal line B1 is connected with data signal line A1, and power management chip 02 can pass through
Voltage signal line B1 acquires the voltage on data signal line A1；One end of voltage signal line B2 is connected with power management chip 02
It connects, the other end of voltage signal line B2 is connected with data signal line A2, and power management chip 02 can pass through voltage signal line
B2 acquires the voltage on data signal line A2.The power management chip 02 is collecting data signal line A1 and data signal line A2
On voltage after, power supply can be managed according to collected voltage.
Fig. 1-2 is the partial cutaway schematic according to a kind of signal transmitting apparatus shown in the relevant technologies, such as Fig. 1-2 institute
Show, data signal line A1 and data signal line A2 are bar signal line, and the width of data signal line A1 and data signal line A2
Degree is equal to 50 μm (microns), and the thickness of data signal line A1 and data signal line A2 are equal to 12 μm, i.e. data signal line A1
600 μm of product of 50 μm and 12 μm are equal to the sectional area of data signal line A22(square micron).The signal transmitting apparatus 0
It can also include: signal substrate 04, data signal line A1 and data signal line A2 can be formed in the side of signal substrate 04,
The other side of the signal substrate 04 could be formed with ground stratum reticulare 042, and data signal line A1 sum number can be set on ground stratum reticulare 042
According to the return flow path of the signal of signal wire A2, which is reference planes M close to the surface of the signal substrate 04, and is counted
It is 25 μm, i.e. data signal line A1 or data letter at a distance from the ground stratum reticulare 042 according to signal wire A1 or data signal line A2
Number line A2 is 25 μm at a distance from reference planes M.
In the related technology, by carrying out the test of eye figure to the signal on data signal line, to judge on data signal line
Whether signal quality meets the requirements.It is exemplary, the corresponding eye of signal transmitted on data signal line can be obtained by oscillograph
Figure, and the corresponding eye figure of the signal transmitted on data signal line is compared with standard eye pattern mask, if the data signal line
The corresponding eye figure of the signal of upper transmission is located at outside the standard eye pattern mask, it is determined that the matter of the signal transmitted on the data signal line
Amount meets the requirements；If the corresponding eye figure of the signal transmitted on the data signal line is simultaneously not located at outside the standard eye pattern mask, really
The quality of the signal transmitted on the fixed data signal line is undesirable.It should be noted that oscillograph can by conducting wire with
Data signal line connection obtains the corresponding eye figure of signal transmitted on data signal line, and the eye figure shown on the oscillograph can
The voltage reflected on the tie point of the conducting wire and data signal line changes with time situation.
It is exemplary, pass through data signal line A1 and data signal line A2 in the signal processing chip 01 and USB connector 03
During carrying out signal transmission, due to being connected to voltage signal line B1 on data signal line A1, on data signal line A2
It is connected to voltage signal line B2, the signal transmitted on data signal line A1 is caused to be possible to be transmitted to voltage signal line B1,
The signal transmitted on data signal line A2 is possible to be transmitted to voltage signal line B2, so that signal transmission errors.In logarithm it is believed that
When the signal transmitted on number line A1 and data signal line A2 carries out the test of eye figure, the data signal line A1 that is obtained by oscillograph and
The eye figure that signal is transmitted on data signal line A2 is not located at outside standard eye pattern mask.Fig. 1-3 is according to one shown in the relevant technologies
Kind of eye diagram is intended to, as shown in Figure 1-3, in signal transmitting apparatus in the related technology, the quality transmitted on data signal line compared with
The corresponding eye figure P of signal of difference, is not located at outside standard eye figure Q.It can be seen that in signal transmitting apparatus in the related technology
The signal quality transmitted on data signal line is poor, and the accuracy that data signal line transmits signal is lower.
Fig. 2-1 is the structural schematic diagram according to the first signal transmitting apparatus 1 shown in an exemplary embodiment, such as Fig. 2-
Shown in 1, which may include: signal processing chip 11, power management chip 12 and USB connector 13.
The signal processing chip 11 can be connected with USB connector 13 by data signal line C1 and data signal line C2
It connects；Power management chip 12 can by voltage signal line D1 and voltage signal line D2 respectively with data signal line C1 sum number it is believed that
Number line C2 is connected, and it is single that adjusting can be in series on any voltage signal wire in the voltage signal line D1 and voltage signal line D2
First E, adjusting unit E can be used for the signal transmission of the blocking voltage signal wire when voltage signal line transmits high-frequency signal,
The signal transmission of conducting voltage signal wire when voltage signal line transmits low frequency signal.
In conclusion being connected in the signal transmitting apparatus provided due to the embodiment of the present disclosure with power management chip
Adjusting unit is in series on voltage signal line, and the adjusting unit is used for the blocking voltage when voltage signal line transmits high-frequency signal
The signal of signal wire transmits, the signal transmission of conducting voltage signal wire when voltage signal line transmits low frequency signal.When the signal
When handling chip and the USB connector by data signal line transmission high-frequency signal, which being capable of blocking voltage letter
The signal transmission of number line, so that do not influenced by voltage signal line when data signal line transmits high-frequency signal, so, it improves
The signal quality transmitted on data signal line improves the accuracy of signal transmission.
Exemplary, one end of voltage signal line D1 is connected with power management chip 12, the other end of voltage signal line D1
It is connected with data signal line C1, power management chip 12 can acquire the electricity on data signal line C1 by voltage signal line D1
Pressure；One end of voltage signal line D2 can be connected with power management chip 12, and the other end and data of voltage signal line D2 is believed
Number line C2 is connected, and power management chip 12 can pass through voltage signal line D2 and acquire voltage on data signal line C2.It is optional
, the adjusting unit E in Fig. 2-1 can be magnetic bead group, and each magnetic bead group may include at least one magnetic bead, i.e., the electric signal passes
Magnetic bead group there are two can be set in defeated device 1, exemplary, the inductance parameters of any one magnetic bead group can be the 1000 (Europe Ω
Nurse).
On the one hand, magnetic bead group can be a magnetic bead, at this point, the inductance parameters of a magnetic bead can be 1000 Ω, figure
2-2 is the structural schematic diagram according to second of signal transmitting apparatus 1 shown in an exemplary embodiment, as shown in Fig. 2-2, the tune
Saving unit can be magnetic bead group, and each magnetic bead group may include a magnetic bead e, i.e. the voltage signal line D1 and voltage signal line D2
Upper difference can connect a magnetic bead e.Fig. 2-3 is to be shown according to a kind of inductance parameters of magnetic bead shown in an exemplary embodiment
Be intended to, as Figure 2-3, when the frequency f of the signal on magnetic bead is lower, the resistance R of the magnetic bead is smaller, the inductance Z of magnetic bead compared with
Small, as the frequency f higher of the signal on magnetic bead, the resistance R of the magnetic bead is larger, and the inductance Z of magnetic bead is larger.I.e. when on the magnetic bead
Signal frequency be low frequency when, the resistance of the magnetic bead is smaller, voltage signal line be access, when the frequency of the signal on magnetic bead is
When high frequency, the resistance of the magnetic bead is larger, and voltage signal line is equivalent to open circuit.It should be noted that the unit of resistance R can be
The unit of Ω, frequency f can be MHz (megahertz).Optionally, when the frequency of the signal transmitted on data signal line is 480MHz
When, the transmission rate of signal can be 480Mbps on the data signal line, at this point, the resistance of the magnetic bead is greater than 1000 Ω, i.e. magnetic
The resistance of pearl is larger, which is equivalent to open circuit, and the signal quality transmitted on the data signal line is preferable, signal transmission
Accuracy it is higher.
On the other hand, magnetic bead group can be made of the magnetic bead of at least two serial or parallel connections, at this point, at least two series connection
Or the inductance parameters of the magnetic bead group of magnetic bead composition in parallel are 1000 Ω.Exemplary, which can be by two concatenated magnetic
Pearl composition, which can also be made of two magnetic beads in parallel, and exemplary, which can also be two concatenated magnetic
The pearl magnetic bead in parallel with two is connected in series, i.e., the magnetic bead group can be combined in any way by multiple magnetic beads, so that should
The inductance parameters of magnetic bead group are 1000 Ω.
In the signal transmitting apparatus that the embodiment of the present disclosure provides, since data signal line is connected with voltage signal line, because
This, the frequency that signal is transmitted on the data signal line and voltage signal line is equal, when the signal transmitted on the data signal line
When frequency is lower, the signal transmission of the voltage signal line can be connected in the concatenated unit that adjusts on the voltage signal line, with the electricity
The power management chip that is connected of pressure signal wire can acquire the voltage on data signal line by voltage signal line, and according to adopting
The voltage of collection is managed the power supply in terminal.When the frequency of the signal transmitted on the data signal line is higher, the voltage
The concatenated signal transmission for adjusting unit and capableing of blocking voltage signal wire, the power supply being connected with the voltage signal line on signal wire
Managing chip can not acquire the voltage on data signal line by voltage signal line, at this point, the signal processing chip can pass through
The data signal line and the USB connector carry out the transmission of signal.And the signal due to being transmitted on the data signal line at this time
Frequency is higher, and therefore, the efficiency of the fast speed of the signal transmitted on data signal line at this time, signal transmission is higher.
It should be noted that in the signal transmitting apparatus 1 that the embodiment of the present disclosure provides, the spy of any one data signal line
Property impedance can be equal to 90 Ω, i.e. the characteristic impedance of data signal line C1 and data signal line C2 are equal to 90 Ω, when any
When the characteristic impedance of one data signal wire is equal to 90 Ω, the quality of the signal transmitted on the data signal line is preferable.Optionally,
The characteristic impedance of the voltage signal line D1 and voltage signal line D2 can also be equal to 90 Ω.
In conclusion being connected in the signal transmitting apparatus provided due to the embodiment of the present disclosure with power management chip
Adjusting unit is in series on voltage signal line, and the adjusting unit is used for the blocking voltage when voltage signal line transmits high-frequency signal
The signal of signal wire transmits, the signal transmission of conducting voltage signal wire when voltage signal line transmits low frequency signal.When the signal
When handling chip and the USB connector by data signal line transmission high-frequency signal, which being capable of blocking voltage letter
The signal transmission of number line, so that do not influenced by voltage signal line when data signal line transmits high-frequency signal, so, it improves
The signal quality transmitted on data signal line improves the accuracy of signal transmission.
Fig. 3-1 is the structural schematic diagram according to the third signal transmitting apparatus 1 shown in an exemplary embodiment, such as Fig. 3-
Shown in 1, which may include: signal substrate 14, signal processing chip 11 and USB connector 13.
Exemplary, the side of the signal substrate 14 could be formed with data-signal layer, which may include two
Root data signal line, which is respectively data signal line C1 and data signal line C2；Signal processing chip 11
Can be connected with USB connector 13 by two data signal lines, any one radical in two data signal lines it is believed that
The sectional area S of number line is greater than 600 μm2, sectional area S i.e. this two of any one data signal line in two data signal lines
The area S in the section of any one data signal line in data signal line.
In conclusion in the signal transmitting apparatus provided due to the embodiment of the present disclosure, the number of the side formation of signal substrate
It include two data signal lines according to signals layer, and the sectional area of any one data signal line in two data signal lines is big
In 600 μm2, i.e. the sectional area of the data signal line sectional area that is greater than data signal line in the related technology.Due to data-signal
The size of the sectional area of the size and data signal line of the resistance of line is inversely proportional, therefore the resistance of the data signal line is less than correlation
The resistance of data signal line in technology, the voltage on the data signal line obtained using oscillograph is become larger, so that data-signal
The slope of the corresponding eye figure of the signal transmitted on line increases, and the eye figure of signal is transmitted on the data signal line obtained by oscillograph
It is close to outside standard eye pattern mask, so, the signal quality transmitted on data signal line is improved, the standard of signal transmission is improved
True property.
Optionally, Fig. 3-2 is a kind of partial cross section's signal of signal transmitting apparatus shown according to an exemplary embodiment
Figure, as shown in figure 3-2, data signal line C1 and data signal line C2 all can be bar signal line, data signal line C1
50 μm can be equal to the width U of any one data signal line in data signal line C2, any one data signal line
Thickness V can be greater than 12 μm, and exemplary, the thickness V of any one data signal line can be 18 μm.When the data signal line is
When bar signal line, sectional area the multiplying for the width U of the data signal line and thickness V of data signal line of the data signal line
Product.In the related technology, the width of data signal line is equal to 50 μm, and the thickness of data signal line is equal to 12 μm, i.e., in the related technology
The sectional area of data signal line is equal to 600 μm2.In the signal transmitting apparatus that the embodiment of the present disclosure provides, due to data signal line
Width it is equal with the width of data signal line in the related technology, and the thickness of data signal line greater than data in the related technology believe
The thickness of number line, therefore in the signal transmitting apparatus that provides of the embodiment of the present disclosure, the sectional area of data signal line is greater than related skill
The sectional area of data signal line in art.It should be noted that data-signal in the signal transmitting apparatus that the embodiment of the present disclosure provides
The material of line can be identical as the material of data signal line in the related technology, in the signal transmitting apparatus that the embodiment of the present disclosure provides
The length of data signal line can be with the equal length of data signal line in the related technology.
Further, the calculation formula of the resistance of data signal line is R=ρ L/S, wherein R is the electricity of data signal line
Resistance, ρ are the resistivity that the material of data signal line is made, and L is the length of the data signal line, and S is cutting for the data signal line
Area.As can be seen from the above formula that the size of the sectional area of the size and data signal line of the resistance of the data signal line at
Inverse ratio.The sectional area of data signal line is greater than data in the related technology in the signal transmitting apparatus provided due to the embodiment of the present disclosure
The sectional area of signal wire, and the embodiment of the present disclosure provide signal transmitting apparatus in data signal line material in the related technology
The material of data signal line is identical, the length to related skill of data signal line in the signal transmitting apparatus that the embodiment of the present disclosure provides
The equal length of data signal line in art, therefore, the data signal line in signal transmitting apparatus that the embodiment of the present disclosure provides
Resistance is less than the resistance of data signal line in the related technology.
Exemplary, Fig. 3-3 is the partial structural diagram according to a kind of signal transmitting apparatus 1 shown in the relevant technologies, such as
Shown in Fig. 3-3, signal processing chip 01, data signal line A1 and USB connector 03 are sequentially connected in series, signal processing chip 01, number
It is sequentially connected in series according to signal wire A2, USB connector 03.Electric current is from signal processing chip 01 along data signal line A1 and data-signal
Line A2 flows to USB connector 03.If the resistance of signal processing chip 01 is 4 Ω, the resistance of data signal line A1 is 3 Ω, USB
The resistance of connector 03 is 3 Ω, loads the voltage at signal processing chip 01, data signal line A1,03 both ends of USB connector and is
10 volts, then data signal line A1 and the voltage at the both ends data signal line A2 are 7 volts.It is provided due to the embodiment of the present disclosure
In signal transmitting apparatus 1, the resistance of data signal line C1 and data signal line C2 are respectively less than data signal line in the related technology
The resistance of A1 and data signal line A2, therefore, the voltage at data signal line C1 and the both ends data signal line C2 are all larger than 7 volts.
It is exemplary, if the resistance of data signal line C1 and data signal line C2 in the signal transmitting apparatus 1 that the embodiment of the present disclosure provides
It is 1 Ω, and the resistance of signal processing chip 11 is 4 Ω, the resistance of USE connector 13 is 3 Ω, is loaded in the signal processing core
The voltage at 13 both ends of piece 11 and USB connector is 10 volts, then the voltage of data signal line C1 and the both ends data signal line C2
It is 8.75 volts, greater than 7 volts of data signal line A1 in the related technology and the voltage at the both ends data signal line A2.Using oscillography
The voltage on the data signal line that device obtains becomes larger, so that the slope of the corresponding eye figure of the signal transmitted on data signal line increases
Greatly, the eye figure that signal is transmitted on the data signal line obtained by oscillograph is close to outside standard eye pattern mask, so, it improves
The signal quality transmitted on data signal line improves the accuracy of signal transmission.
Optionally, as shown in figure 3-2, which can also include: the first shielding board 15 and secondary shielding
Substrate 16.Exemplary, first shielding board 15, signal substrate 14, secondary shielding substrate 16 can be sequentially overlapped, and the signal
Side on substrate 14 close to the first shielding board 15 is formed with data-signal layer, and the other side of signal substrate 14 is formed with earth mat
Layer 142, optionally, the other side of the signal substrate is also formed with other structures (being not shown in Fig. 3-2), and the other structures with
The thickness of ground stratum reticulare is equal.First shielding board 15 could be formed with the first additional signal layer far from the side of signal substrate 14
151, being formed on the first shielding board 15 of the first additional signal layer 151 could be formed with first screen layer 152.Secondary shielding
Substrate 16 could be formed with the second additional signal layer 161 far from the side of signal substrate 14, be formed with the second additional signal layer 161
Secondary shielding substrate 16 on could be formed with secondary shielding layer 162.Optionally, first shielding board 15 and data-signal layer
Between and secondary shielding substrate 16 and ground stratum reticulare 142 between, could be formed with bonding glue-line 17.It should be noted that ground
The surface of the close signal substrate 14 can be the reference planes M of data signal line C1 and data signal line C2 on stratum reticulare 142.It should
The return flow path of the signal transmitted on data signal line C1 and data signal line C2 can be set on reference planes M, i.e., from
The signal that signal processing chip 11 generates can be transmitted to the USB connector 13 along data signal line C1 and data signal line C2,
And the signal that the signal processing chip 11 generates is transmitted to the signal by the return flow path of signal by the USB connector 13
Manage chip 11.
Exemplary, the thickness of first shielding board 15, signal substrate 14 and secondary shielding substrate 16 all can be 25 μm,
The thickness of the first additional signal layer 151, the second additional signal layer 161 and ground stratum reticulare 142 all can be 12 μm, the data-signal
The thickness of line can be 18 μm, and the thickness of the bonding glue-line 17 can be 15 μm.Due in the embodiment of the present disclosure, data signal line
Reference planes M be ground stratum reticulare 142 on close to signal substrate surface, therefore, between the data-signal layer and reference planes M
Distance is equal to 25 μm of thickness of the signal substrate 14.
Fig. 3-4 is the structural schematic diagram according to the 4th kind of signal transmitting apparatus 1 shown in an exemplary embodiment, such as Fig. 3-
Shown in 4, which can also include: power management chip 12 and power supply board H, and the side of power supply board H can
To be formed with voltage signal layer, which may include: voltage signal line D1 and voltage signal line D2, the power management
Chip 12 can be connected by two voltage signal lines with two data signal lines.It is exemplary, one end of voltage signal line D1
It can be connected with power management chip 12, the other end of voltage signal line D1 can be connected with data signal line C1, power supply
Managing chip 12 can acquire the voltage on data signal line C1 by voltage signal line D1；One end of voltage signal line D2 can be with
It is connected with power management chip 12, the other end of voltage signal line D2 can be connected with data signal line C2, power management
Chip 12 can acquire the voltage on data signal line C2 by voltage signal line D2.
It should be noted that in the signal transmitting apparatus 1 that the embodiment of the present disclosure provides, the spy of any one data signal line
Property impedance can be equal to 90 Ω, i.e. the characteristic impedance of data signal line C1 and data signal line C2 are equal to 90 Ω, when any
When the characteristic impedance of one data signal wire is equal to 90 Ω, the quality of the signal transmitted on the data signal line is preferable.Optionally,
The characteristic impedance of the voltage signal line D1 and voltage signal line D2 can also be equal to 90 Ω.
In conclusion in the signal transmitting apparatus provided due to the embodiment of the present disclosure, the number of the side formation of signal substrate
It include two data signal lines according to signals layer, and the sectional area of any one data signal line in two data signal lines is big
In 600 μm2, i.e. the sectional area of the data signal line sectional area that is greater than data signal line in the related technology.Due to data-signal
The size of the sectional area of the size and data signal line of the resistance of line is inversely proportional, therefore the resistance of the data signal line is less than correlation
The resistance of data signal line in technology, the voltage on the data signal line obtained using oscillograph is become larger, so that data-signal
The slope of the corresponding eye figure of the signal transmitted on line increases, and the eye figure of signal is transmitted on the data signal line obtained by oscillograph
It is close to outside standard eye pattern mask, so, the signal quality transmitted on data signal line is improved, the standard of signal transmission is improved
True property.
Fig. 4-1 is the structural schematic diagram according to the 5th kind of signal transmitting apparatus 1 shown in an exemplary embodiment, such as Fig. 4-
Shown in 1, which may include: signal substrate 14, signal processing chip 11 and USB connector 13.
Exemplary, the side of the signal substrate 14 could be formed with data-signal layer, which may include two
Root data signal line, which is respectively data signal line C1 and data signal line C2；Signal processing chip 11
Can be connected with USB connector 13 by two data signal lines, and any one radical in two data signal lines it is believed that
Number line is greater than 25 μm at a distance from reference planes M, it should be noted that two radicals can be set on reference planes M it is believed that
The return flow path of the signal of number line.
In conclusion in the signal transmitting apparatus provided due to the embodiment of the present disclosure, the two of the side formation of signal substrate
In root data signal line, any one data signal line is greater than 25 μm, i.e. data signal line and reference at a distance from reference planes
The distance of plane is greater than in the related technology that data signal line is at a distance from reference planes, and data signal line is formed with reference planes
The size of capacitor be inversely proportional at a distance from data signal line and reference planes, compared to the relevant technologies, the embodiment of the present disclosure is mentioned
The capacitor that data signal line and reference planes are formed in the signal transmitting apparatus of confession is smaller, and the charging time of capacitor is smaller, that is, counts
According to the fast speed that the voltage at signal wire both ends becomes larger, so that the slope of the corresponding eye figure of the signal transmitted on data signal line increases
Greatly, the eye figure that signal is transmitted on the data signal line obtained by oscillograph is close to outside standard eye pattern mask, so, it improves
The signal quality transmitted on data signal line improves the accuracy of signal transmission.
Exemplary, the signal that signal processing chip 11 generates can be transmitted to along data signal line C1 and data signal line C2
The USB connector 13, and the signal that the signal processing chip 11 generates is passed through by the USB connector 13 and is set in the reference planes
The return flow path for the signal set is transmitted to the signal processing chip 11.
In the related technology, the side of signal substrate is formed with data-signal layer, and data-signal layer may include two radical evidences
Signal wire, the other side of signal substrate could be formed with ground stratum reticulare, and the ground stratum reticulare is reference close to the surface of the signal substrate
Plane, optionally, the other side of the signal substrate are also formed with other structures, and the thickness phase of the other structures and ground stratum reticulare
Deng.First shielding board, signal substrate, secondary shielding substrate can be sequentially overlapped, and the data-signal layer is formed in signal base
Close to the side of the first shielding board on plate.First shielding board could be formed with the first additional letter far from the side of signal substrate
Number floor, being formed on the first shielding board of the first additional signal layer could be formed with first screen layer.Secondary shielding substrate is remote
Side from signal substrate could be formed with the second additional signal layer, be formed on the secondary shielding substrate of the second additional signal layer
It could be formed with secondary shielding layer.Optionally, between first shielding board and data-signal layer and secondary shielding substrate with
Between ground stratum reticulare, bonding glue-line could be formed with.It is exemplary, first shielding board, signal substrate and secondary shielding substrate
Thickness all can be 25 μm, the first additional signal layer, the second additional signal layer, stratum reticulare and data signals layer thickness it is equal
It can be 12 μm, the thickness of the bonding glue-line can be 15 μm.Since in the related technology, the reference planes of data signal line are ground
Close to the surface of signal substrate on stratum reticulare, therefore, the distance between the data-signal layer and reference planes are equal to the signal substrate
25 μm of thickness.
Optionally, Fig. 4-2 is that the partial cross section of another signal transmitting apparatus 1 shown according to an exemplary embodiment shows
It is intended to, as shown in the Fig. 4-2, which can also include: the first shielding board 15 and secondary shielding substrate 16, and
First shielding board 15, signal substrate 14, secondary shielding substrate 16 are sequentially overlapped.First shielding board 15 is far from signal substrate
14 side is formed with the first additional signal layer 151, is formed on the first shielding board 15 of the first additional signal layer 151 and is formed
There is first screen layer 152；Secondary shielding substrate 16 is formed with the second additional signal layer 161, shape far from the side of signal substrate 14
At being formed with secondary shielding layer 162 on the secondary shielding substrate 16 for having the second additional signal layer 161；First shielding board 15 and number
Glue-line 17 is bonded according to being each formed between signals layer and between secondary shielding substrate 16 and signal substrate 14；First screen layer
152 close to data-signal layer surface and secondary shielding layer 162 close to the surface of data-signal layer be reference planes M.That is this public affairs
It opens in embodiment, simultaneously earth mat layer is not formed in the other side of the signal substrate 14, and the other side of the signal substrate is only simply formed with
The other structures 143 equal with the thickness of ground stratum reticulare.
It is exemplary, the thickness of each substrate in above-mentioned first shielding board 15, signal substrate 14 and secondary shielding substrate 16
Degree all can be 25 μm, and the thickness of the bonding glue-line 17 can be equal to 25 μm, the additional letter of the first additional signal layer 151, second
The thickness of number floor 161 and data-signal floor all can be 12 μm, and the thickness of the other structures 143 equal with the thickness of ground stratum reticulare can
Be equal to 12 μm, at this point, when reference planes M be first screen layer 152 close to the surface of data-signal layer when, reference planes M
With at a distance from data signal line C1, data signal line C2 be 62 μm, when reference planes M be secondary shielding layer 162 close to data believe
It is 99 μm at a distance from reference planes M and data signal line C1, data signal line C2 when the surface of number floor.It is possible thereby to see
Out in the embodiment of the present disclosure, data signal line is all larger than data signal line in the related technology at a distance from reference planes and with reference to flat
25 μm of the distance in face.
Fig. 4-3 is the structural schematic diagram according to the 6th kind of signal transmitting apparatus 1 shown in an exemplary embodiment, such as Fig. 3-
Shown in 4, which can also include: power management chip 12 and power supply board H, and the side of power supply board H can
To be formed with voltage signal layer, which may include: voltage signal line D1 and voltage signal line D2, the power management
Chip 12 can be connected by two voltage signal lines with two data signal lines.It is exemplary, one end of voltage signal line D1
It can be connected with power management chip 12, the other end of voltage signal line D1 can be connected with data signal line C1, power supply
Managing chip 12 can acquire the voltage on data signal line C1 by voltage signal line D1；One end of voltage signal line D2 can be with
It is connected with power management chip 12, the other end of voltage signal line D2 can be connected with data signal line C2, power management
Chip 12 can acquire the voltage on data signal line C2 by voltage signal line D2.
Further, the calculation formula for the capacitor that data signal line is formed with the conductive layer where reference planes is C=ε * ε
0*S/d, wherein C is the capacitor of the conductive layer formation where data signal line and reference planes, and ε is relative dielectric constant, and ε 0 is
Permittivity of vacuum, S are the positive area of data signal line and reference planes, and d is between data signal line and reference planes
Distance, as can be seen from the above formula that, the size and data signal line and ginseng of the capacitor of data signal line and reference planes formation
The distance for examining plane is inversely proportional.In the signal transmitting apparatus provided due to the embodiment of the present disclosure, the side of the signal substrate is formed
Two data signal lines in, any one data signal line at a distance from reference planes be greater than 25 μm, i.e., data signal line with
The distance of reference planes is greater than in the related technology that data signal line is at a distance from reference planes, and 0 and of ε, ε in the embodiment of the present disclosure
The value of S is equal with the value of ε, ε 0 and S in the related technology, and therefore, compared to the relevant technologies, the signal that the embodiment of the present disclosure provides is passed
The capacitor that data signal line and reference planes are formed in defeated device is smaller, and the charging time of capacitor is smaller, i.e. data signal line two
The fast speed that the voltage at end becomes larger, so that the slope of the corresponding eye figure of the signal transmitted on data signal line increases, by showing
The eye figure that signal is transmitted on the data signal line that wave device obtains is close to outside standard eye pattern mask, so, improve data-signal
The signal quality transmitted on line improves the accuracy of signal transmission.
It should be noted that in the signal transmitting apparatus 1 that the embodiment of the present disclosure provides, the spy of any one data signal line
Property impedance can be equal to 90 Ω, i.e. the characteristic impedance of data signal line C1 and data signal line C2 are equal to 90 Ω, when any
When the characteristic impedance of one data signal wire is equal to 90 Ω, the quality of the signal transmitted on the data signal line is preferable.Optionally,
The characteristic impedance of the voltage signal line D1 and voltage signal line D2 can also be equal to 90 Ω.
In conclusion in the signal transmitting apparatus provided due to the embodiment of the present disclosure, the number of the side formation of signal substrate
Include two data signal lines, and any one data signal line and reference planes in two data signal lines according to signals layer
Distance be greater than 25 μm, i.e. data signal line is greater than data signal line and reference planes in the related technology at a distance from reference planes
Distance, and the size of capacitor that is formed with reference planes of data signal line at a distance from data signal line and reference planes at anti-
Than, therefore, data signal line and reference planes shape in the signal transmitting apparatus provided compared to the relevant technologies, the embodiment of the present disclosure
At capacitor smaller capacitive charging time it is smaller, i.e. the fast speed that the voltage at data signal line both ends becomes larger, so that data
The slope of the corresponding eye figure of the signal transmitted on signal wire increases, and signal is transmitted on the data signal line obtained by oscillograph
Eye figure is close to outside standard eye pattern mask, so, the signal quality transmitted on data signal line is improved, signal transmission is improved
Accuracy.
Fig. 5-1 is the structural schematic diagram according to the 7th kind of signal transmitting apparatus 1 shown in an exemplary embodiment, such as Fig. 5-
Shown in 1, which may include: signal processing chip 11, power management chip 12, USB connector 13 and signal
Substrate 14.
The side of the signal substrate 14 could be formed with data-signal layer, which may include data signal line
C1 and data signal line C2；The signal processing chip 11 and USB connector 13 can pass through data signal line C1 and data-signal
Line C2 is connected；Power management chip 12 can by voltage signal line D1 and voltage signal line D2 respectively with data signal line C1
It is connected with data signal line C2, can connects on any voltage signal wire in the voltage signal line D1 and voltage signal line D2
Have and adjust unit E, adjusting unit E can be used for the signal of the blocking voltage signal wire when voltage signal line transmits high-frequency signal
Transmission, the signal transmission of conducting voltage signal wire when voltage signal line transmits low frequency signal.Appoint in two data signal lines
Anticipate a data signal line sectional area be greater than 600 μm2, the section of any one data signal line in two data signal lines
Product is the area in the section of any one data signal line in two data signal lines.
Exemplary, one end of voltage signal line D1 is connected with power management chip 12, the other end of voltage signal line D1
It is connected with data signal line C1, power management chip 12 can acquire the electricity on data signal line C1 by voltage signal line D1
Pressure；One end of voltage signal line D2 can be connected with power management chip 12, and the other end and data of voltage signal line D2 is believed
Number line C2 is connected, and power management chip 12 can pass through voltage signal line D2 and acquire voltage on data signal line C2.It is optional
, adjusting unit E can be magnetic bead group, and each magnetic bead group may include at least one magnetic bead, i.e., in the electric signal transmission device 1
Magnetic bead group there are two can be set, exemplary, the inductance parameters of any one magnetic bead group can be 1000 Ω (ohm).
On the one hand, magnetic bead group can be a magnetic bead, at this point, the inductance parameters of a magnetic bead can be 1000 Ω, it should
Adjusting unit can be magnetic bead group, and each magnetic bead group may include a magnetic bead, i.e. the voltage signal line D1 and voltage signal line
Can connect a magnetic bead respectively on D2.Fig. 2-3 is the inductance parameters according to a kind of magnetic bead shown in an exemplary embodiment
Schematic diagram, as Figure 2-3, when the frequency f of the signal on magnetic bead is lower, the resistance R of the magnetic bead is smaller, the inductance Z of magnetic bead
Smaller, as the frequency f higher of the signal on magnetic bead, the resistance R of the magnetic bead is larger, and the inductance Z of magnetic bead is larger.I.e. when the magnetic bead
On signal frequency be low frequency when, the resistance of the magnetic bead is smaller, voltage signal line be access, when the frequency of the signal on magnetic bead
When for high frequency, the resistance of the magnetic bead is larger, and voltage signal line is equivalent to open circuit.It should be noted that the unit of resistance R can be
The unit of Ω, frequency f can be MHz (megahertz).Optionally, when the frequency of the signal transmitted on data signal line is 480MHz
When, the transmission rate of signal can be 480Mbps on the data signal line, at this point, the resistance of the magnetic bead is greater than 1000 Ω, i.e. magnetic
The resistance of pearl is larger, which is equivalent to open circuit, and the signal quality transmitted on the data signal line is preferable, signal transmission
Accuracy it is higher.
On the other hand, magnetic bead group can be made of the magnetic bead of at least two serial or parallel connections, at this point, at least two series connection
Or the inductance parameters of the magnetic bead group of magnetic bead composition in parallel are 1000 Ω.Exemplary, which can be by two concatenated magnetic
Pearl composition, the magnetic bead group can also be made of two magnetic beads in parallel, which can also be two concatenated magnetic beads and two
The magnetic bead of a parallel connection is connected in series, i.e., the magnetic bead group can be combined in any way by multiple magnetic beads, so that the magnetic bead group
Inductance parameters be 1000 Ω.
In the signal transmitting apparatus that the embodiment of the present disclosure provides, since data signal line is connected with voltage signal line, because
This, the frequency that signal is transmitted on the data signal line and voltage signal line is equal, when the signal transmitted on the data signal line
When frequency is lower, the signal transmission of the voltage signal line can be connected in the concatenated unit that adjusts on the voltage signal line, with the electricity
The power management chip that is connected of pressure signal wire can acquire the voltage on data signal line by voltage signal line, and according to adopting
The voltage of collection is managed the power supply in terminal.When the frequency of the signal transmitted on the data signal line is higher, the voltage
The concatenated signal transmission for adjusting unit and capableing of blocking voltage signal wire, the power supply being connected with the voltage signal line on signal wire
Managing chip can not acquire the voltage on data signal line by voltage signal line, at this point, the signal processing chip can pass through
The data signal line and the USB connector carry out the transmission of signal.And the signal due to being transmitted on the data signal line at this time
Frequency is higher, and therefore, the efficiency of the fast speed of the signal transmitted on data signal line at this time, signal transmission is higher.
Optionally, Fig. 5-2 is to be shown according to the partial cross section of another signal transmitting apparatus 1 shown in an exemplary embodiment
Be intended to, as shown in Fig. 5-2, data signal line C1 and data signal line C2 all can be bar signal line, the data signal line
The width U of any one data signal line in C1 and data signal line C2 can be equal to 50 μm, any one data signal line
Thickness V can be greater than 12 μm, exemplary, the thickness V of any one data signal line can be 18 μm.When the data signal line
When for bar signal line, the sectional area of the data signal line is the width U of data signal line and the thickness V of data signal line multiplying
Product.In the related technology, the width of data signal line is equal to 50 μm, and the thickness of data signal line is equal to 12 μm, i.e., in the related technology
The sectional area of data signal line is equal to 600 μm2.In the signal transmitting apparatus that the embodiment of the present disclosure provides, due to data signal line
Width it is equal with the width of data signal line in the related technology, and the thickness of data signal line greater than data in the related technology believe
The thickness of number line, therefore in the signal transmitting apparatus that provides of the embodiment of the present disclosure, the sectional area of data signal line is greater than related skill
The sectional area of data signal line in art.It should be noted that data-signal in the signal transmitting apparatus that the embodiment of the present disclosure provides
The material of line can be identical as the material of data signal line in the related technology, in the signal transmitting apparatus that the embodiment of the present disclosure provides
The length of data signal line can be with the equal length of data signal line in the related technology.
Further, the calculation formula of the resistance of data signal line is R=ρ L/S, and wherein R is the resistance of data signal line,
ρ is the resistivity that the material of data signal line is made, and L is the length of the data signal line, and S is the section of the data signal line
Product.As can be seen from the above formula that the size of the sectional area of the size and data signal line of the resistance of the data signal line is at anti-
Than.The sectional area of data signal line is believed greater than data in the related technology in the signal transmitting apparatus provided due to the embodiment of the present disclosure
The sectional area of number line, and in the signal transmitting apparatus that provides of the embodiment of the present disclosure material of data signal line with count in the related technology
It is identical according to the material of signal wire, the length and the relevant technologies of data signal line in the signal transmitting apparatus that the embodiment of the present disclosure provides
The equal length of middle data signal line, therefore, the electricity for the data signal line in signal transmitting apparatus that the embodiment of the present disclosure provides
Resistance is less than the resistance of data signal line in the related technology.
Exemplary, Fig. 3-3 is the partial structural diagram according to a kind of signal transmitting apparatus 1 shown in the relevant technologies, such as
Shown in Fig. 3-3, signal processing chip 01, data signal line A1 and USB connector 03 are sequentially connected in series, signal processing chip 01, number
It is sequentially connected in series according to signal wire A2, USB connector 03.Electric current is from signal processing chip 01 along data signal line A1 and data-signal
Line A2 flows to USB connector 03.If the resistance of signal processing chip 01 is 4 Ω, the resistance of data signal line A1 is 3 Ω, USB
The resistance of connector 03 is 3 Ω, loads the voltage at signal processing chip 01, data signal line A1,03 both ends of USB connector and is
10 volts, then data signal line A1 and the voltage at the both ends data signal line A2 are 7 volts.It is provided due to the embodiment of the present disclosure
In signal transmitting apparatus 1, the resistance of data signal line C1 and data signal line C2 are respectively less than data signal line in the related technology
The resistance of A1 and data signal line A2, therefore, the voltage at data signal line C1 and the both ends data signal line C2 are all larger than 7 volts.
It is exemplary, if the resistance of data signal line C1 and data signal line C2 in the signal transmitting apparatus 1 that the embodiment of the present disclosure provides
It is 1 Ω, and the resistance of signal processing chip 11 is 4 Ω, the resistance of USE connector 13 is 3 Ω, is loaded in the signal processing core
The voltage at 13 both ends of piece 11 and USB connector is 10 volts, then the voltage of data signal line C1 and the both ends data signal line C2
It is 8.75 volts, greater than 7 volts of data signal line A1 in the related technology and the voltage at the both ends data signal line A2.Using oscillography
The voltage on the data signal line that device obtains becomes larger, so that the slope of the corresponding eye figure of the signal transmitted on data signal line increases
Greatly, the eye figure that signal is transmitted on the data signal line obtained by oscillograph is close to outside standard eye pattern mask, so, it improves
The signal quality transmitted on data signal line improves the accuracy of signal transmission.
Optionally, as shown in Fig. 5-2, which can also include: the first shielding board 15 and secondary shielding
Substrate 16.Exemplary, first shielding board 15, signal substrate 14, secondary shielding substrate 16 can be sequentially overlapped, and the signal
Side on substrate 14 close to the first shielding board 15 is formed with data-signal layer, and the other side of signal substrate 14 is formed with earth mat
Layer 142, optionally, the other side of the signal substrate is also formed with other structures (being not shown in Fig. 5-2), and the other structures with
The thickness of ground stratum reticulare is equal.First shielding board 15 could be formed with the first additional signal layer far from the side of signal substrate 14
151, being formed on the first shielding board 15 of the first additional signal layer 151 could be formed with first screen layer 152.Secondary shielding
Substrate 16 could be formed with the second additional signal layer 161 far from the side of signal substrate 14, be formed with the second additional signal layer 161
Secondary shielding substrate 16 on could be formed with secondary shielding layer 162.Optionally, first shielding board 15 and data-signal layer
Between and secondary shielding substrate 16 and ground stratum reticulare 142 between, could be formed with bonding glue-line 17.It should be noted that ground
The surface of the close signal substrate 14 can be the reference planes M of data signal line C1 and data signal line C2 on stratum reticulare 142.It should
The return flow path of the signal transmitted on data signal line C1 and data signal line C2 can be set on reference planes M, i.e., from
The signal that signal processing chip 11 generates can be transmitted to the USB connector 13 along data signal line C1 and data signal line C2,
And the signal that the signal processing chip 11 generates is transmitted to the signal by the return flow path of signal by the USB connector 13
Manage chip 11.
Exemplary, the thickness of first shielding board 15, signal substrate 14 and secondary shielding substrate 16 all can be 25 μm,
The thickness of the first additional signal layer 151, the second additional signal layer 161 and ground stratum reticulare 142 all can be 12 μm, the data-signal
The thickness of line can be 18 μm, and the thickness of the bonding glue-line 17 can be 15 μm.Due in the embodiment of the present disclosure, data signal line
Reference planes M be ground stratum reticulare 142 on close to signal substrate surface, therefore, between the data-signal layer and reference planes M
Distance is equal to 25 μm of thickness of the signal substrate 14.
As shown in fig. 5-1, which can also include: power supply board H, and the side of power supply board H can be with
It is formed with voltage signal layer, which may include: voltage signal line D1 and voltage signal line D2, the power management core
Piece 12 can be connected by two voltage signal lines with two data signal lines.Exemplary, one end of voltage signal line D1 can
To be connected with power management chip 12, the other end of voltage signal line D1 can be connected with data signal line C1, power supply pipe
Managing chip 12 can be by the voltage on voltage signal line D1 acquisition data signal line C1；One end of voltage signal line D2 can be with
Power management chip 12 is connected, and the other end of voltage signal line D2 can be connected with data signal line C2, power management core
Piece 12 can acquire the voltage on data signal line C2 by voltage signal line D2.
It should be noted that in the signal transmitting apparatus 1 that the embodiment of the present disclosure provides, the spy of any one data signal line
Property impedance can be equal to 90 Ω, i.e. the characteristic impedance of data signal line C1 and data signal line C2 are equal to 90 Ω, when any
When the characteristic impedance of one data signal wire is equal to 90 Ω, the quality of the signal transmitted on the data signal line is preferable.Optionally,
The characteristic impedance of the voltage signal line D1 and voltage signal line D2 can also be equal to 90 Ω.
In conclusion due to the embodiment of the present disclosure provide signal transmitting apparatus in, on the one hand, when signal processing chip with
When the USB connector transmits high-frequency signal by the data signal line, which is capable of the signal of blocking voltage signal wire
Transmission, so that not influenced by voltage signal line when data signal line transmits high-frequency signal；On the other hand, two radicals it is believed that
The sectional area of any one data signal line in number line is greater than the sectional area of data signal line in the related technology, so that the data
The resistance of signal wire is less than the resistance of data signal line in the related technology, the electricity on the data signal line obtained using oscillograph
Buckling is big, so that the slope of the corresponding eye figure of the signal transmitted on data signal line increases；The data letter obtained by oscillograph
The eye figure that signal is transmitted on number line is close to outside standard eye pattern mask, so, improve the signal matter transmitted on data signal line
Amount improves the accuracy of signal transmission.
Fig. 6-1 is the structural schematic diagram according to the 8th kind of signal transmitting apparatus 1 shown in an exemplary embodiment, such as Fig. 6-
Shown in 1, which may include: signal processing chip 11, power management chip 12, USB connector 13 and signal
Substrate 14.
Exemplary, the side of the signal substrate 14 could be formed with data-signal layer, which may include two
Root data signal line, which is respectively data signal line C1 and data signal line C2；The signal processing chip
11 can be connected with USB connector 13 by data signal line C1 and data signal line C2；Power management chip 12 can lead to
Overvoltage signal line D1 and voltage signal line D2 are connected with data signal line C1 and data signal line C2 respectively, the voltage signal
It can be in series on any voltage signal wire in line D1 and voltage signal line D2 and adjust unit E, adjusting unit E can be used for
The signal transmission of blocking voltage signal wire when voltage signal line transmits high-frequency signal, when voltage signal line transmits low frequency signal
The signal of conducting voltage signal wire transmits.Any one data signal line and reference planes (Fig. 6-1 in two data signal lines
In be not shown) distance be greater than 25 μm, it should be noted that the letter of two data signal lines can be set in the reference planes
Number return flow path.
Exemplary, one end of voltage signal line D1 is connected with power management chip 12, the other end of voltage signal line D1
It is connected with data signal line C1, power management chip 12 can acquire the electricity on data signal line C1 by voltage signal line D1
Pressure；One end of voltage signal line D2 can be connected with power management chip 12, and the other end and data of voltage signal line D2 is believed
Number line C2 is connected, and power management chip 12 can pass through voltage signal line D2 and acquire voltage on data signal line C2.It is optional
, adjusting unit E can be magnetic bead group, and each magnetic bead group may include at least one magnetic bead, i.e., in the electric signal transmission device 1
Magnetic bead group there are two can be set, exemplary, the inductance parameters of any one magnetic bead group can be 1000 Ω (ohm).
On the one hand, magnetic bead group can be a magnetic bead, at this point, the inductance parameters of a magnetic bead can be 1000 Ω, it should
Adjusting unit can be magnetic bead group, and each magnetic bead group may include a magnetic bead, i.e. the voltage signal line D1 and voltage signal line
Can connect a magnetic bead respectively on D2.Fig. 2-3 is the inductance parameters according to a kind of magnetic bead shown in an exemplary embodiment
Schematic diagram, as Figure 2-3, when the frequency f of the signal on magnetic bead is lower, the resistance R of the magnetic bead is smaller, the inductance Z of magnetic bead
Smaller, as the frequency f higher of the signal on magnetic bead, the resistance R of the magnetic bead is larger, and the inductance Z of magnetic bead is larger.I.e. when the magnetic bead
On signal frequency be low frequency when, the resistance of the magnetic bead is smaller, voltage signal line be access, when the frequency of the signal on magnetic bead
When for high frequency, the resistance of the magnetic bead is larger, and voltage signal line is equivalent to open circuit.It should be noted that the unit of resistance R can be
The unit of Ω, frequency f can be MHz (megahertz).Optionally, when the frequency of the signal transmitted on data signal line is 480MHz
When, the transmission rate of signal can be 480Mbps on the data signal line, at this point, the resistance of the magnetic bead is greater than 1000 Ω, i.e. magnetic
The resistance of pearl is larger, which is equivalent to open circuit, and the signal quality transmitted on the data signal line is preferable, signal transmission
Accuracy it is higher.
On the other hand, magnetic bead group can be made of the magnetic bead of at least two serial or parallel connections, at this point, at least two series connection
Or the inductance parameters of the magnetic bead group of magnetic bead composition in parallel are 1000 Ω.Exemplary, which can be by two concatenated magnetic
Pearl composition, which can also be made of two magnetic beads in parallel, and exemplary, which can also be two concatenated magnetic
The pearl magnetic bead in parallel with two is connected in series, i.e., the magnetic bead group can be combined in any way by multiple magnetic beads, so that should
The inductance parameters of magnetic bead group are 1000 Ω.
In the signal transmitting apparatus that the embodiment of the present disclosure provides, since data signal line is connected with voltage signal line, because
This, the frequency that signal is transmitted on the data signal line and voltage signal line is equal, when the signal transmitted on the data signal line
When frequency is lower, the signal transmission of the voltage signal line can be connected in the concatenated unit that adjusts on the voltage signal line, with the electricity
The power management chip that is connected of pressure signal wire can acquire the voltage on data signal line by voltage signal line, and according to adopting
The voltage of collection is managed the power supply in terminal.When the frequency of the signal transmitted on the data signal line is higher, the voltage
The concatenated signal transmission for adjusting unit and capableing of blocking voltage signal wire, the power supply being connected with the voltage signal line on signal wire
Managing chip can not acquire the voltage on data signal line by voltage signal line, at this point, the signal processing chip can pass through
The data signal line and the USB connector carry out the transmission of signal.And the signal due to being transmitted on the data signal line at this time
Frequency is higher, and therefore, the efficiency of the fast speed of the signal transmitted on data signal line at this time, signal transmission is higher.
Exemplary, the signal that signal processing chip 11 generates can be transmitted to along data signal line C1 and data signal line C2
The USB connector 13, and the signal for being generated the signal processing chip 11 by the USB connector 13 in plane by reference to being arranged
The return flow path of signal be transmitted to the signal processing chip 11.
In the related technology, the side of signal substrate is formed with data-signal layer, and data-signal layer may include two radical evidences
Signal wire, the other side of signal substrate could be formed with ground stratum reticulare, and the ground stratum reticulare is reference close to the surface of the signal substrate
Plane, optionally, the other side of the signal substrate are also formed with other structures, and the thickness phase of the other structures and ground stratum reticulare
Deng.First shielding board, signal substrate, secondary shielding substrate can be sequentially overlapped, and the data-signal layer is formed in signal base
Close to the side of the first shielding board on plate.First shielding board could be formed with the first additional letter far from the side of signal substrate
Number floor, being formed on the first shielding board of the first additional signal layer could be formed with first screen layer.Secondary shielding substrate is remote
Side from signal substrate could be formed with the second additional signal layer, be formed on the secondary shielding substrate of the second additional signal layer
It could be formed with secondary shielding layer.Optionally, between first shielding board and data-signal layer and secondary shielding substrate with
Between ground stratum reticulare, bonding glue-line could be formed with.It is exemplary, first shielding board, signal substrate and secondary shielding substrate
Thickness all can be 25 μm, the first additional signal layer, the second additional signal layer, stratum reticulare and data signals layer thickness it is equal
It can be 12 μm, the thickness of the bonding glue-line can be 15 μm.Since in the related technology, the reference planes of data signal line are ground
Close to the surface of signal substrate on stratum reticulare, therefore, the distance between the data-signal layer and reference planes are equal to the signal substrate
25 μm of thickness.
Optionally, Fig. 6-2 is to be shown according to the partial cross section of another signal transmitting apparatus 1 shown in an exemplary embodiment
It is intended to, as in fig. 6-2, which can also include: the first shielding board 15 and secondary shielding substrate 16, and
First shielding board 15, signal substrate 14, secondary shielding substrate 16 are sequentially overlapped.First shielding board 15 is far from signal substrate
14 side is formed with the first additional signal layer 151, is formed on the first shielding board 15 of the first additional signal layer 151 and is formed
There is first screen layer 152；Secondary shielding substrate 16 is formed with the second additional signal layer 161, shape far from the side of signal substrate 14
At being formed with secondary shielding layer 162 on the secondary shielding substrate 16 for having the second additional signal layer 161；First shielding board 15 and number
Glue-line 17 is bonded according to being each formed between signals layer and between secondary shielding substrate 16 and signal substrate 14；First screen layer
152 close to data-signal layer surface and secondary shielding layer 162 close to the surface of data-signal layer be reference planes M.That is this public affairs
It opens in embodiment, simultaneously earth mat layer is not formed in the other side of the signal substrate 14, and the other side of the signal substrate is only simply formed with
The other structures 143 equal with the thickness of ground stratum reticulare.
Optionally, the thickness of each substrate in above-mentioned first shielding board 15, signal substrate 14 and secondary shielding substrate 16
Degree all can be 25 μm, and the thickness of the bonding glue-line 17 can be equal to 25 μm, the additional letter of the first additional signal layer 151, second
Number floor 161, data-signal floor, the other structures 143 equal with the ground thickness of stratum reticulare thickness all can be 12 μm, at this point, working as
Reference planes M be first screen layer 152 close to the surface of data-signal layer when, reference planes M and data signal line C1, data
The distance of signal wire C2 be 62 μm, when reference planes M be secondary shielding layer 162 close to the surface of data-signal layer when, the reference
It is 99 μm at a distance from plane M and data signal line C1, data signal line C2.It can be seen that in the embodiment of the present disclosure, number
According to be all larger than at a distance from signal wire and reference planes in the related technology data signal line 25 μm at a distance from reference planes.
Further, the calculation formula for the capacitor that data signal line is formed with the conductive layer where reference planes is C=ε * ε
0*S/d, wherein C is the capacitor of the conductive layer formation where data signal line and reference planes, and ε is relative dielectric constant, and ε 0 is
Permittivity of vacuum, S are the positive area of data signal line and reference planes, and d is between data signal line and reference planes
Distance, as can be seen from the above formula that, the size and data signal line and ginseng of the capacitor of data signal line and reference planes formation
The distance for examining plane is inversely proportional.In the signal transmitting apparatus provided due to the embodiment of the present disclosure, the side of the signal substrate is formed
Two data signal lines in, any one data signal line at a distance from reference planes be greater than 25 μm, i.e., data signal line with
The distance of reference planes is greater than in the related technology that data signal line is at a distance from reference planes, and 0 and of ε, ε in the embodiment of the present disclosure
The value of S is equal with the value of ε, ε 0 and S in the related technology, and therefore, compared to the relevant technologies, the signal that the embodiment of the present disclosure provides is passed
The capacitor that data signal line and reference planes are formed in defeated device is smaller, and the charging time of capacitor is smaller, i.e. data signal line two
The fast speed that the voltage at end becomes larger, so that the slope of the corresponding eye figure of the signal transmitted on data signal line increases, by showing
The eye figure that signal is transmitted on the data signal line that wave device obtains is close to outside standard eye pattern mask, so, improve data-signal
The signal quality transmitted on line improves the accuracy of signal transmission.
As in Figure 6-1, which can also include: power supply board H, and the side of power supply board H can be with
It is formed with voltage signal layer, which may include: voltage signal line D1 and voltage signal line D2, the power management core
Piece 12 can be connected by two voltage signal lines with two data signal lines.Exemplary, one end of voltage signal line D1 can
To be connected with power management chip 12, the other end of voltage signal line D1 can be connected with data signal line C1, power supply pipe
Managing chip 12 can be by the voltage on voltage signal line D1 acquisition data signal line C1；One end of voltage signal line D2 can be with
Power management chip 12 is connected, and the other end of voltage signal line D2 can be connected with data signal line C2, power management core
Piece 12 can acquire the voltage on data signal line C2 by voltage signal line D2.
It should be noted that in the signal transmitting apparatus 1 that the embodiment of the present disclosure provides, the spy of any one data signal line
Property impedance can be equal to 90 Ω, i.e. the characteristic impedance of data signal line C1 and data signal line C2 are equal to 90 Ω, when any
When the characteristic impedance of one data signal wire is equal to 90 Ω, the quality of the signal transmitted on the data signal line is preferable.Optionally,
The characteristic impedance of the voltage signal line D1 and voltage signal line D2 can also be equal to 90 Ω.
In conclusion in the signal transmitting apparatus provided due to the embodiment of the present disclosure, on the one hand, in two data signal lines
Any one data signal line at a distance from reference planes be greater than in the related technology data signal line at a distance from reference planes,
Therefore, the capacitor smaller capacitive that data signal line and reference planes are formed in the signal transmitting apparatus that the embodiment of the present disclosure provides
Charging time is smaller, i.e. the fast speed that the voltage at data signal line both ends becomes larger, so that the signal transmitted on data signal line
The slope of corresponding eye figure increases；On the other hand, when signal processing chip is transmitted with the USB connector by the data signal line
When high-frequency signal, which is capable of the signal transmission of blocking voltage signal wire, so that in data signal line transmission high frequency letter
Number when, do not influenced by voltage signal line, so, the eye figure of signal is transmitted on the data signal line obtained by oscillograph to mark
It is close outside quasi- eye pattern mask, so, the signal quality transmitted on data signal line is improved, the accurate of signal transmission is improved
Property.
Fig. 7-1 is the structural schematic diagram according to the 9th kind of signal transmitting apparatus 1 shown in an exemplary embodiment, such as Fig. 7-
Shown in 1, which may include: signal processing chip 11, USB connector 13 and signal substrate 14.
Exemplary, the side of the signal substrate 14 could be formed with data-signal layer, which may include two
Root data signal line, which is respectively data signal line C1 and data signal line C2；Signal processing chip 11
Can be connected with USB connector 13 by two data signal lines, any one radical in two data signal lines it is believed that
The sectional area S of number line is greater than 600 μm2, sectional area S i.e. this two of any one data signal line in two data signal lines
The area S in the section of any one data signal line in data signal line.Any one radical evidence in two data signal lines
Signal wire is greater than 25 μm at a distance from reference planes M, it should be noted that two radical evidences can be set on reference planes M
The return flow path of the signal of signal wire.
Optionally, Fig. 7-2 is to be shown according to a kind of partial cross section of signal transmitting apparatus 1 shown in another exemplary embodiment
Be intended to, as shown in Fig. 7-2, data signal line C1 and data signal line C2 all can be bar signal line, the data signal line
The width U of any one data signal line in C1 and data signal line C2 can be equal to 50 μm, any one data signal line
Thickness V can be greater than 12 μm, exemplary, the thickness V of any one data signal line can be 18 μm.When the data signal line
When for bar signal line, the sectional area of the data signal line is the width U of data signal line and the thickness V of data signal line multiplying
Product.In the related technology, the width of data signal line is equal to 50 μm, and the thickness of data signal line is equal to 12 μm, i.e., in the related technology
The sectional area of data signal line is equal to 600 μm2.In the signal transmitting apparatus that the embodiment of the present disclosure provides, due to data signal line
Width it is equal with the width of data signal line in the related technology, and the thickness of data signal line greater than data in the related technology believe
The thickness of number line, therefore in the signal transmitting apparatus that provides of the embodiment of the present disclosure, the sectional area of data signal line is greater than related skill
The sectional area of data signal line in art.It should be noted that data-signal in the signal transmitting apparatus that the embodiment of the present disclosure provides
The material of line can be identical as the material of data signal line in the related technology, in the signal transmitting apparatus that the embodiment of the present disclosure provides
The length of data signal line can be with the equal length of data signal line in the related technology.
Further, the calculation formula of the resistance of data signal line is R=ρ L/S, and wherein R is the resistance of data signal line,
ρ is the resistivity that the material of data signal line is made, and L is the length of the data signal line, and S is the section of the data signal line
Product.As can be seen from the above formula that the size of the sectional area of the size and data signal line of the resistance of the data signal line is at anti-
Than.The sectional area of data signal line is believed greater than data in the related technology in the signal transmitting apparatus provided due to the embodiment of the present disclosure
The sectional area of number line, and in the signal transmitting apparatus that provides of the embodiment of the present disclosure material of data signal line with count in the related technology
It is identical according to the material of signal wire, the length and the relevant technologies of data signal line in the signal transmitting apparatus that the embodiment of the present disclosure provides
The equal length of middle data signal line, therefore, the electricity for the data signal line in signal transmitting apparatus that the embodiment of the present disclosure provides
Resistance is less than the resistance of data signal line in the related technology.
Exemplary, Fig. 3-3 is the partial structural diagram according to a kind of signal transmitting apparatus 1 shown in the relevant technologies, such as
Shown in Fig. 3-3, signal processing chip 01, data signal line A1 and USB connector 03 are sequentially connected in series, signal processing chip 01, number
It is sequentially connected in series according to signal wire A2, USB connector 03.Electric current is from signal processing chip 01 along data signal line A1 and data-signal
Line A2 flows to USB connector 03.If the resistance of signal processing chip 01 is 4 Ω, the resistance of data signal line A1 is 3 Ω, USB
The resistance of connector 03 is 3 Ω, loads the voltage at signal processing chip 01, data signal line A1,03 both ends of USB connector and is
10 volts, then data signal line A1 and the voltage at the both ends data signal line A2 are 7 volts.It is provided due to the embodiment of the present disclosure
In signal transmitting apparatus 1, the resistance of data signal line C1 and data signal line C2 are respectively less than data signal line in the related technology
The resistance of A1 and data signal line A2, therefore, the voltage at data signal line C1 and the both ends data signal line C2 are all larger than 7 volts.
It is exemplary, if the resistance of data signal line C1 and data signal line C2 in the signal transmitting apparatus 1 that the embodiment of the present disclosure provides
It is 1 Ω, and the resistance of signal processing chip 11 is 4 Ω, the resistance of USE connector 13 is 3 Ω, is loaded in the signal processing core
The voltage at 13 both ends of piece 11 and USB connector is 10 volts, then the voltage of data signal line C1 and the both ends data signal line C2
It is 8.75 volts, greater than 7 volts of data signal line A1 in the related technology and the voltage at the both ends data signal line A2.Using oscillography
The voltage on the data signal line that device obtains becomes larger, so that the slope of the corresponding eye figure of the signal transmitted on data signal line increases
Greatly, the eye figure that signal is transmitted on the data signal line obtained by oscillograph is close to outside standard eye pattern mask, so, it improves
The signal quality transmitted on data signal line improves the accuracy of signal transmission.
Exemplary, the signal that signal processing chip 11 generates can be transmitted to along data signal line C1 and data signal line C2
The USB connector 13, and the signal that the signal processing chip 11 generates is passed through by the USB connector 13 and is set in the reference planes
The return flow path for the signal set is transmitted to the signal processing chip 11.
In the related technology, the side of signal substrate is formed with data-signal layer, and data-signal layer may include two radical evidences
Signal wire, the other side of signal substrate could be formed with ground stratum reticulare, and the ground stratum reticulare is reference close to the surface of the signal substrate
Plane, optionally, the other side of the signal substrate are also formed with other structures, and the thickness phase of the other structures and ground stratum reticulare
Deng.First shielding board, signal substrate, secondary shielding substrate can be sequentially overlapped, and the data-signal layer is formed in signal base
Close to the side of the first shielding board on plate.First shielding board could be formed with the first additional letter far from the side of signal substrate
Number floor, being formed on the first shielding board of the first additional signal layer could be formed with first screen layer.Secondary shielding substrate is remote
Side from signal substrate could be formed with the second additional signal layer, be formed on the secondary shielding substrate of the second additional signal layer
It could be formed with secondary shielding layer.Optionally, between first shielding board and data-signal layer and secondary shielding substrate with
Between ground stratum reticulare, bonding glue-line could be formed with.It is exemplary, first shielding board, signal substrate and secondary shielding substrate
Thickness all can be 25 μm, the first additional signal layer, the second additional signal layer, stratum reticulare and data signals layer thickness it is equal
It can be 12 μm, the thickness of the bonding glue-line can be 15 μm.Since in the related technology, the reference planes of data signal line are ground
Close to the surface of signal substrate on stratum reticulare, therefore, the distance between the data-signal layer and reference planes are equal to the signal substrate
25 μm of thickness.
Further, the calculation formula for the capacitor that data signal line is formed with the conductive layer where reference planes is C=ε * ε
0*S/d, wherein C is the capacitor of the conductive layer formation where data signal line and reference planes, and ε is relative dielectric constant, and ε 0 is
Permittivity of vacuum, S are the positive area of data signal line and reference planes, and d is between data signal line and reference planes
Distance, as can be seen from the above formula that, the size and data signal line and ginseng of the capacitor of data signal line and reference planes formation
The distance for examining plane is inversely proportional.In the signal transmitting apparatus provided due to the embodiment of the present disclosure, the side of the signal substrate is formed
Two data signal lines in, any one data signal line at a distance from reference planes be greater than 25 μm, i.e., data signal line with
The distance of reference planes is greater than in the related technology that data signal line is at a distance from reference planes, and 0 and of ε, ε in the embodiment of the present disclosure
The value of S is equal with the value of ε, ε 0 and S in the related technology, and therefore, compared to the relevant technologies, the signal that the embodiment of the present disclosure provides is passed
The capacitor that data signal line and reference planes are formed in defeated device is smaller, and the charging time of capacitor is smaller, i.e. data signal line two
The fast speed that the voltage at end becomes larger, so that the slope of the corresponding eye figure of the signal transmitted on data signal line increases, by showing
The eye figure that signal is transmitted on the data signal line that wave device obtains is close to outside standard eye pattern mask, so, improve data-signal
The signal quality transmitted on line improves the accuracy of signal transmission.
As shown in Fig. 7-2, which can also include: the first shielding board 15 and secondary shielding substrate 16,
And first shielding board 15, signal substrate 14, secondary shielding substrate 16 are sequentially overlapped.First shielding board 15 is far from signal base
The side of plate 14 is formed with the first additional signal layer 151, is formed with shape on the first shielding board 15 of the first additional signal layer 151
At there is first screen layer 152；Secondary shielding substrate 16 is formed with the second additional signal layer 161 far from the side of signal substrate 14,
It is formed on the secondary shielding substrate 16 of the second additional signal layer 161 and is formed with secondary shielding layer 162；First shielding board 15 with
Between data-signal layer and between secondary shielding substrate 16 and signal substrate 14, it is each formed with bonding glue-line 17；First shielding
Layer 152 is reference planes M close to the surface of data-signal layer close to the surface of data-signal layer and secondary shielding layer 162.I.e. originally
In open embodiment, simultaneously earth mat layer is not formed in the other side of the signal substrate 14, and the other side of the signal substrate is only formed
There are the other structures 143 equal with the ground thickness of stratum reticulare.
It is exemplary, the thickness of each substrate in above-mentioned first shielding board 15, signal substrate 14 and secondary shielding substrate 16
Degree all can be 25 μm, and the thickness of the bonding glue-line 17 can be equal to 25 μm, the additional letter of the first additional signal layer 151, second
Number floor 161, the other structures 143 equal with the ground thickness of stratum reticulare thickness all can be 12 μm, the thickness of the data-signal layer
Can be 18 μm, at this point, when reference planes M be first screen layer 152 close to the surface of data-signal layer when, reference planes M
With at a distance from data signal line C1, data signal line C2 be 62 μm, when reference planes M be secondary shielding layer 162 close to data believe
It is 99 μm at a distance from reference planes M and data signal line C1, data signal line C2 when the surface of number floor.It is possible thereby to see
Out in the embodiment of the present disclosure, data signal line is all larger than data signal line in the related technology at a distance from reference planes and with reference to flat
25 μm of the distance in face.
Fig. 7-3 is the structural schematic diagram according to the tenth kind of signal transmitting apparatus 1 shown in an exemplary embodiment, such as Fig. 7-
Shown in 3, which can also include: power management chip 12 and power supply board H, and the side of power supply board H can
To be formed with voltage signal layer, which may include: voltage signal line D1 and voltage signal line D2, the power management
Chip 12 can be connected by two voltage signal lines with two data signal lines.It is exemplary, one end of voltage signal line D1
It can be connected with power management chip 12, the other end of voltage signal line D1 can be connected with data signal line C1, power supply
Managing chip 12 can acquire the voltage on data signal line C1 by voltage signal line D1；One end of voltage signal line D2 can be with
It is connected with power management chip 12, the other end of voltage signal line D2 can be connected with data signal line C2, power management
Chip 12 can acquire the voltage on data signal line C2 by voltage signal line D2.
It should be noted that in the signal transmitting apparatus 1 that the embodiment of the present disclosure provides, the spy of any one data signal line
Property impedance can be equal to 90 Ω, i.e. the characteristic impedance of data signal line C1 and data signal line C2 are equal to 90 Ω, when any
When the characteristic impedance of one data signal wire is equal to 90 Ω, the quality of the signal transmitted on the data signal line is preferable.Optionally,
The characteristic impedance of the voltage signal line D1 and voltage signal line D2 can also be equal to 90 Ω.
In conclusion in the signal transmitting apparatus provided due to the embodiment of the present disclosure, on the one hand, in two data signal lines
Any one data signal line at a distance from reference planes be greater than in the related technology data signal line at a distance from reference planes,
Therefore, the capacitor smaller capacitive that data signal line and reference planes are formed in the signal transmitting apparatus that the embodiment of the present disclosure provides
Charging time is smaller, and on the other hand, the sectional area of any one data signal line in two data signal lines is greater than related skill
The sectional area of data signal line in art.The voltage on the data signal line obtained using oscillograph is become larger.On data signal line
The slope of the corresponding eye figure of the signal of transmission increases, and the eye figure of signal is transmitted on the data signal line obtained by oscillograph to mark
Close outside quasi- eye pattern mask, the eye figure that signal is transmitted on the data signal line obtained by oscillograph is leaned on to outside standard eye pattern mask
Closely, so, the signal quality transmitted on data signal line is improved, improves the accuracy of signal transmission.
Fig. 8-1 is such as to be schemed according to the tenth a kind of structural schematic diagram of signal transmitting apparatus 1 shown in an exemplary embodiment
Shown in 8-1, which may include: signal processing chip 11, power management chip 12, USB connector 13 and letter
Number substrate 14.
Exemplary, the side of the signal substrate 14 could be formed with data-signal layer, which may include two
Root data signal line, which is respectively data signal line C1 and data signal line C2；Signal processing chip 11
Can be connected with USB connector 13 by two data signal lines, any one radical in two data signal lines it is believed that
The sectional area of number line is greater than 600 μm2, the area in sectional area, that is, data signal line section of data signal line.Two radicals it is believed that
Any one data signal line in number line is greater than 25 μm at a distance from reference planes (being not shown in Fig. 8-1), needs to illustrate
It is that the return flow path of the signal of two data signal lines can be set in the reference planes.
Power management chip 12 can by voltage signal line D1 and voltage signal line D2 respectively with data signal line C1 and
Data signal line C2 is connected, and can be in series on any voltage signal wire in the voltage signal line D1 and voltage signal line D2
Unit E is adjusted, the signal that adjusting unit E can be used for the blocking voltage signal wire when voltage signal line transmits high-frequency signal passes
It is defeated, the signal transmission of conducting voltage signal wire when voltage signal line transmits low frequency signal.
Optionally, the adjusting unit E in Fig. 8-1 can be magnetic bead group, and each magnetic bead group may include at least one magnetic bead,
It can be set in the electric signal transmission device 1 there are two magnetic bead group, exemplary, the inductance parameters of any one magnetic bead group can be with
For 1000 Ω (ohm).
On the one hand, magnetic bead group can be a magnetic bead, at this point, the inductance parameters of a magnetic bead can be 1000 Ω, it should
Adjusting unit can be magnetic bead group, and each magnetic bead group may include a magnetic bead, i.e. the voltage signal line D1 and voltage signal line
Can connect a magnetic bead respectively on D2.Fig. 2-3 is the inductance parameters according to a kind of magnetic bead shown in an exemplary embodiment
Schematic diagram, as Figure 2-3, when the frequency f of the signal on magnetic bead is lower, the resistance R of the magnetic bead is smaller, the inductance Z of magnetic bead
Smaller, as the frequency f higher of the signal on magnetic bead, the resistance R of the magnetic bead is larger, and the inductance Z of magnetic bead is larger.I.e. when the magnetic bead
On signal frequency be low frequency when, the resistance of the magnetic bead is smaller, voltage signal line be access, when the frequency of the signal on magnetic bead
When for high frequency, the resistance of the magnetic bead is larger, and voltage signal line is equivalent to open circuit.It should be noted that the unit of resistance R can be
The unit of Ω, frequency f can be MHz.Optionally, when the frequency of the signal transmitted on data signal line is 480MHz, the number
It can be 480Mbps according to the transmission rate of signal on signal wire, at this point, the resistance of the magnetic bead is greater than 1000 Ω, the i.e. electricity of magnetic bead
Hinder larger, which is equivalent to open circuit, and the signal quality transmitted on the data signal line is preferable, signal transmission it is accurate
Property is higher.
On the other hand, magnetic bead group can be made of the magnetic bead of at least two serial or parallel connections, at this point, at least two series connection
Or the inductance parameters of the magnetic bead group of magnetic bead composition in parallel are 1000 Ω.Exemplary, which can be by two concatenated magnetic
Pearl composition, which can also be made of two magnetic beads in parallel, and exemplary, which can also be two concatenated magnetic
The pearl magnetic bead in parallel with two is connected in series, i.e., the magnetic bead group can be combined in any way by multiple magnetic beads, so that should
The inductance parameters of magnetic bead group are 1000 Ω.
It is exemplary, in the signal transmitting apparatus that the embodiment of the present disclosure provides, due to data signal line and voltage signal line phase
Connection, therefore, the frequency that signal is transmitted on the data signal line and voltage signal line are equal, when what is transmitted on the data signal line
When the frequency of signal is lower, the signal transmission of the voltage signal line can be connected in the concatenated unit that adjusts on the voltage signal line,
The power management chip being connected with the voltage signal line can acquire the voltage on data signal line by voltage signal line, and
The power supply in terminal is managed according to the voltage of acquisition.When the frequency of the signal transmitted on the data signal line is higher,
The concatenated signal transmission for adjusting unit and capableing of blocking voltage signal wire, is connected with the voltage signal line on the voltage signal line
Power management chip can not by voltage signal line acquire data signal line on voltage, at this point, the signal processing chip can
To carry out the transmission of signal by the data signal line and the USB connector.And due to transmitting on the data signal line at this time
The frequency of signal is higher, and therefore, the efficiency of the fast speed of the signal transmitted on data signal line at this time, signal transmission is higher.
Optionally, Fig. 8-2 is the partial cross section according to another signal transmitting apparatus 1 shown in another exemplary embodiment
Schematic diagram, as shown in Fig. 8-2, data signal line C1 and data signal line C2 all can be bar signal line, the data-signal
The width U of any one data signal line in line C1 and data signal line C2 can be equal to 50 μm, any one data-signal
The thickness V of line can be greater than 12 μm, and exemplary, the thickness V of any one data signal line can be 18 μm.When the data-signal
When line is bar signal line, the sectional area of the data signal line is the width U of data signal line and the thickness V of data signal line
Product.In the related technology, the width of data signal line is equal to 50 μm, and the thickness of data signal line is equal to 12 μm, i.e. the relevant technologies
The sectional area of middle data signal line is equal to 600 μm2.In the signal transmitting apparatus that the embodiment of the present disclosure provides, due to data-signal
The width of line is equal with the width of data signal line in the related technology, and the thickness of data signal line is greater than data in the related technology
The thickness of signal wire, therefore in the signal transmitting apparatus of embodiment of the present disclosure offer, the sectional area of data signal line is greater than correlation
The sectional area of data signal line in technology.It should be noted that data letter in the signal transmitting apparatus that the embodiment of the present disclosure provides
The material of number line can be identical as the material of data signal line in the related technology, the signal transmitting apparatus that the embodiment of the present disclosure provides
The length of middle data signal line can be with the equal length of data signal line in the related technology.
Further, the calculation formula of the resistance of data signal line is R=ρ L/S, and wherein R is the resistance of data signal line,
ρ is the resistivity that the material of data signal line is made, and L is the length of the data signal line, and S is the section of the data signal line
Product.As can be seen from the above formula that the size of the sectional area of the size and data signal line of the resistance of the data signal line is at anti-
Than.The sectional area of data signal line is believed greater than data in the related technology in the signal transmitting apparatus provided due to the embodiment of the present disclosure
The sectional area of number line, and in the signal transmitting apparatus that provides of the embodiment of the present disclosure material of data signal line with count in the related technology
It is identical according to the material of signal wire, the length and the relevant technologies of data signal line in the signal transmitting apparatus that the embodiment of the present disclosure provides
The equal length of middle data signal line, therefore, the electricity for the data signal line in signal transmitting apparatus that the embodiment of the present disclosure provides
Resistance is less than the resistance of data signal line in the related technology.
Exemplary, Fig. 3-3 is the partial structural diagram according to a kind of signal transmitting apparatus 1 shown in the relevant technologies, such as
Shown in Fig. 3-3, signal processing chip 01, data signal line A1 and USB connector 03 are sequentially connected in series, signal processing chip 01, number
It is sequentially connected in series according to signal wire A2, USB connector 03.Electric current is from signal processing chip 01 along data signal line A1 and data-signal
Line A2 flows to USB connector 03.If the resistance of signal processing chip 01 is 4 Ω, the resistance of data signal line A1 is 3 Ω, USB
The resistance of connector 03 is 3 Ω, loads the voltage at signal processing chip 01, data signal line A1,03 both ends of USB connector and is
10 volts, then data signal line A1 and the voltage at the both ends data signal line A2 are 7 volts.It is provided due to the embodiment of the present disclosure
In signal transmitting apparatus 1, the resistance of data signal line C1 and data signal line C2 are respectively less than data signal line in the related technology
The resistance of A1 and data signal line A2, therefore, the voltage at data signal line C1 and the both ends data signal line C2 are all larger than 7 volts.
It is exemplary, if the resistance of data signal line C1 and data signal line C2 in the signal transmitting apparatus 1 that the embodiment of the present disclosure provides
It is 1 Ω, and the resistance of signal processing chip 11 is 4 Ω, the resistance of USE connector 13 is 3 Ω, is loaded in the signal processing core
The voltage at 13 both ends of piece 11 and USB connector is 10 volts, then the voltage of data signal line C1 and the both ends data signal line C2
It is 8.75 volts, greater than 7 volts of data signal line A1 in the related technology and the voltage at the both ends data signal line A2.Using oscillography
The voltage on the data signal line that device obtains becomes larger, so that the slope of the corresponding eye figure of the signal transmitted on data signal line increases
Greatly, the eye figure that signal is transmitted on the data signal line obtained by oscillograph is close to outside standard eye pattern mask, so, it improves
The signal quality transmitted on data signal line improves the accuracy of signal transmission.
Exemplary, the signal that signal processing chip 11 generates can be transmitted to along data signal line C1 and data signal line C2
The USB connector 13, and the signal that the signal processing chip 11 generates is passed through by the USB connector 13 and is set in the reference planes
The return flow path for the signal set is transmitted to the signal processing chip 11.
In the related technology, the side of signal substrate is formed with data-signal layer, and data-signal layer may include two radical evidences
Signal wire, the other side of signal substrate could be formed with ground stratum reticulare, and the ground stratum reticulare is reference close to the surface of the signal substrate
Plane, optionally, the other side of the signal substrate are also formed with other structures, and the thickness phase of the other structures and ground stratum reticulare
Deng.First shielding board, signal substrate, secondary shielding substrate can be sequentially overlapped, and the data-signal layer is formed in signal base
Close to the side of the first shielding board on plate.First shielding board could be formed with the first additional letter far from the side of signal substrate
Number floor, being formed on the first shielding board of the first additional signal layer could be formed with first screen layer.Secondary shielding substrate is remote
Side from signal substrate could be formed with the second additional signal layer, be formed on the secondary shielding substrate of the second additional signal layer
It could be formed with secondary shielding layer.Optionally, between first shielding board and data-signal layer and secondary shielding substrate with
Between ground stratum reticulare, bonding glue-line could be formed with.It is exemplary, first shielding board, signal substrate and secondary shielding substrate
Thickness all can be 25 μm, the first additional signal layer, the second additional signal layer, stratum reticulare and data signals layer thickness it is equal
It can be 12 μm, the thickness of the bonding glue-line can be 15 μm.Since in the related technology, the reference planes of data signal line are ground
Close to the surface of signal substrate on stratum reticulare, therefore, the distance between the data-signal layer and reference planes are equal to the signal substrate
25 μm of thickness.
Further, the calculation formula for the capacitor that data signal line is formed with the conductive layer where reference planes is C=ε * ε
0*S/d, wherein C is the capacitor of the conductive layer formation where data signal line and reference planes, and ε is relative dielectric constant, and ε 0 is
Permittivity of vacuum, S are the positive area of data signal line and reference planes, and d is between data signal line and reference planes
Distance, as can be seen from the above formula that, the size and data signal line and ginseng of the capacitor of data signal line and reference planes formation
The distance for examining plane is inversely proportional.In the signal transmitting apparatus provided due to the embodiment of the present disclosure, the side of the signal substrate is formed
Two data signal lines in, any one data signal line at a distance from reference planes be greater than 25 μm, i.e., data signal line with
The distance of reference planes is greater than in the related technology that data signal line is at a distance from reference planes, and 0 and of ε, ε in the embodiment of the present disclosure
The value of S is equal with the value of ε, ε 0 and S in the related technology, and therefore, compared to the relevant technologies, the signal that the embodiment of the present disclosure provides is passed
The capacitor that data signal line and reference planes are formed in defeated device is smaller, and the charging time of capacitor is smaller, i.e. data signal line two
The fast speed that the voltage at end becomes larger, so that the slope of the corresponding eye figure of the signal transmitted on data signal line increases, by showing
The eye figure that signal is transmitted on the data signal line that wave device obtains is close to outside standard eye pattern mask, so, improve data-signal
The signal quality transmitted on line improves the accuracy of signal transmission.
As shown in Fig. 8-2, which can also include: the first shielding board 15 and secondary shielding substrate 16,
And first shielding board 15, signal substrate 14, secondary shielding substrate 16 are sequentially overlapped.First shielding board 15 is far from signal base
The side of plate 14 is formed with the first additional signal layer 151, is formed with shape on the first shielding board 15 of the first additional signal layer 151
At there is first screen layer 152；Secondary shielding substrate 16 is formed with the second additional signal layer 161 far from the side of signal substrate 14,
It is formed on the secondary shielding substrate 16 of the second additional signal layer 161 and is formed with secondary shielding layer 162；First shielding board 15 with
Between data-signal layer and between secondary shielding substrate 16 and signal substrate 14, it is each formed with bonding glue-line 17；First shielding
Layer 152 is reference planes M close to the surface of data-signal layer close to the surface of data-signal layer and secondary shielding layer 162.I.e. originally
In open embodiment, simultaneously earth mat layer is not formed in the other side of the signal substrate 14, and the other side of the signal substrate is only formed
There are the other structures 143 equal with the ground thickness of stratum reticulare.
In a first aspect, each substrate in above-mentioned first shielding board 15, signal substrate 14 and secondary shielding substrate 16
Thickness all can be 25 μm, and the thickness of the bonding glue-line 17 can be equal to 25 μm, and the first additional signal layer 151, second is additional
The thickness of signals layer 161 and data-signal layer all can be 18 μm, the thickness of the other structures 143 equal with the thickness of ground stratum reticulare
Can be 12 μm, at this point, when reference planes M be first screen layer 152 close to the surface of data-signal layer when, reference planes M
With at a distance from data signal line C1, data signal line C2 be 68 μm, when reference planes M be secondary shielding layer 162 close to data believe
It is 105 μm at a distance from reference planes M and data signal line C1, data signal line C2 when the surface of number floor.It is possible thereby to see
Out in the embodiment of the present disclosure, data signal line is all larger than data signal line in the related technology at a distance from reference planes and with reference to flat
25 μm of the distance in face.
Second aspect, each substrate in above-mentioned first shielding board 15, signal substrate 14 and secondary shielding substrate 16
Thickness can also be 25 μm, and the thickness for bonding glue-line 17 can also be 15 μm, the additional letter of the first additional signal layer 151, second
Number floor 161, the other structures 143 equal with the ground thickness of stratum reticulare thickness all can be 12 μm, the thickness of data-signal layer can
Think 18 μm, at this point, when reference planes M be first screen layer 152 close to the surface of data-signal layer when, reference planes M with
Data signal line C1, data signal line C2 distance be 52 μm, when reference planes M be secondary shielding layer 162 close to data-signal
It is 89 μm at a distance from reference planes M and data signal line C1, data signal line C2 when the surface of layer.It can be seen that
In the embodiment of the present disclosure, data signal line is all larger than data signal line in the related technology and reference planes at a distance from reference planes
25 μm of distance.
The third aspect, each substrate in above-mentioned first shielding board 15, signal substrate 14 and secondary shielding substrate 16
Thickness all can be 25 μm, and the thickness of the bonding glue-line 17 can be equal to 15 μm, and the first additional signal layer 151, second is additional
The thickness of signals layer 161 and data-signal layer all can be 18 μm, the thickness of the other structures 143 equal with the thickness of ground stratum reticulare
Can be 12 μm, at this point, when reference planes M be first screen layer 152 close to the surface of data-signal layer when, reference planes M
With at a distance from data signal line C1, data signal line C2 be 58 μm, when reference planes M be secondary shielding layer 162 close to data believe
It is 95 μm at a distance from reference planes M and data signal line C1, data signal line C2 when the surface of number floor.It is possible thereby to see
Out in the embodiment of the present disclosure, data signal line is all larger than data signal line in the related technology at a distance from reference planes and with reference to flat
25 μm of the distance in face.
Fourth aspect, each substrate in above-mentioned first shielding board 15, signal substrate 14 and secondary shielding substrate 16
Thickness all can be 25 μm, and the thickness of the bonding glue-line 17 can be equal to 25 μm, and the first additional signal layer 151, second is additional
Signals layer 161, all can be 12 μm with the thickness of the equal other structures 143 of the ground thickness of stratum reticulare, the thickness of data-signal layer
Can be 18 μm, at this point, when reference planes M be first screen layer 152 close to the surface of data-signal layer when, reference planes M
With at a distance from data signal line C1, data signal line C2 be 62 μm, when reference planes M be secondary shielding layer 162 close to data believe
It is 99 μm at a distance from reference planes M and data signal line C1, data signal line C2 when the surface of number floor.It is possible thereby to see
Out in the embodiment of the present disclosure, data signal line is all larger than data signal line in the related technology at a distance from reference planes and with reference to flat
25 μm of the distance in face.
As shown in Fig. 8-1, which can also include: power supply board H, and the side of power supply board H can be with
It is formed with voltage signal layer, which may include: voltage signal line D1 and voltage signal line D2, the power management core
Piece 12 can be connected by two voltage signal lines with two data signal lines.Exemplary, one end of voltage signal line D1 can
To be connected with power management chip 12, the other end of voltage signal line D1 can be connected with data signal line C1, power supply pipe
Managing chip 12 can be by the voltage on voltage signal line D1 acquisition data signal line C1；One end of voltage signal line D2 can be with
Power management chip 12 is connected, and the other end of voltage signal line D2 can be connected with data signal line C2, power management core
Piece 12 can acquire the voltage on data signal line C2 by voltage signal line D2.
It should be noted that in the signal transmitting apparatus 1 that the embodiment of the present disclosure provides, the spy of any one data signal line
Property impedance can be equal to 90 Ω, i.e. the characteristic impedance of data signal line C1 and data signal line C2 are equal to 90 Ω, when any
When the characteristic impedance of one data signal wire is equal to 90 Ω, the quality of the signal transmitted on the data signal line is preferable.Optionally,
The characteristic impedance of the voltage signal line D1 and voltage signal line D2 can also be equal to 90 Ω.Exemplary, Fig. 8-3 is according to an example
Property implement a kind of diagram exemplifying and be intended to, it is several in the signal transmitting apparatus that the embodiment of the present disclosure provides as shown in Fig. 8-3
According to the corresponding eye figure P1 of the preferable signal of the quality transmitted on signal wire, it is located at outside standard eye figure Q.It can be seen that the disclosure
The signal quality transmitted on the data signal line in signal transmitting apparatus that embodiment provides is preferable, data signal line transmission letter
Number accuracy it is higher.
In conclusion in the signal transmitting apparatus provided due to the embodiment of the present disclosure, in a first aspect, working as signal processing chip
When transmitting high-frequency signal by the data signal line with the USB connector, which is capable of the letter of blocking voltage signal wire
Number transmission so that data signal line transmit high-frequency signal when, do not influenced by voltage signal line；Second aspect, two radical evidences
Any one data signal line in signal wire is greater than data signal line in the related technology at a distance from reference planes and with reference to flat
The distance in face, therefore, the capacitor that data signal line and reference planes are formed in the signal transmitting apparatus that the embodiment of the present disclosure provides
The charging time of smaller capacitive is smaller, the third aspect, the section of any one data signal line in two data signal lines
Product is greater than the sectional area of data signal line in the related technology.The voltage on the data signal line obtained using oscillograph is become larger.
The slope of the corresponding eye figure of the signal transmitted on data signal line increases, and transmits and believes on the data signal line obtained by oscillograph
Number eye figure it is close to outside standard eye pattern mask, the eye figure of signal is transmitted on the data signal line obtained by oscillograph to standard
It is close outside eye pattern mask, so, the signal quality transmitted on data signal line is improved, the accuracy of signal transmission is improved.
The embodiment of the present disclosure provides a kind of terminal, which may include such as Fig. 2-1, Fig. 3-1, Fig. 4-1, Fig. 5-1, figure
Signal transmitting apparatus 1 shown in 6-1, Fig. 7-1 or Fig. 8-1.Exemplary, which can be wide for mobile phone, computer, number
Broadcast terminal, messaging devices, game console, tablet device, Medical Devices, body-building equipment or personal digital assistant.
In conclusion due in the signal transmitting apparatus in the terminal of embodiment of the present disclosure offer, with power management chip
Adjusting unit is in series on the voltage signal line being connected, and the adjusting unit is used for when voltage signal line transmits high-frequency signal
The signal of blocking voltage signal wire transmits, the signal transmission of conducting voltage signal wire when voltage signal line transmits low frequency signal.
When the signal processing chip and the USB connector transmit high-frequency signal by the data signal line, which can hinder
The signal transmission of power-off pressure signal wire, so that not influenced by voltage signal line, institute when data signal line transmits high-frequency signal
To improve the signal quality transmitted on data signal line, improve the accuracy of signal transmission.
Those skilled in the art after considering the specification and implementing the invention disclosed here, will readily occur to its of the disclosure
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or
Person's adaptive change follows the general principles of this disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.The description and examples are only to be considered as illustrative, and the true scope and spirit of the disclosure are by following
Claim is pointed out.
It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present disclosure is only limited by the accompanying claims.
Claims (8)
1. a kind of signal transmitting apparatus, which is characterized in that the signal transmitting apparatus includes: signal processing chip, power management
Chip, general-purpose serial bus USB connector and signal substrate；
The signal processing chip is connected with the USB connector by two data signal lines；
The power management chip is connected with two data signal lines respectively by two voltage signal lines, every voltage
Signal wire is equal with the frequency of signal is transmitted on the data signal line that the every voltage signal line connects, any voltage letter
It is in series with adjusting unit on number line, when transmitting high-frequency signal on the data signal line of voltage signal line connection, the tune
Section unit is transmitted for blocking the signal of the voltage signal line to transmit when on the data signal line of voltage signal line connection
When low frequency signal, the signal transmission for adjusting unit and being used to be connected the voltage signal line；
The side of the signal substrate is formed with data-signal layer, and the data-signal layer includes two data signal lines,
The sectional area of any data signal line is greater than 600 μm2。
2. signal transmitting apparatus according to claim 1, which is characterized in that
The adjusting unit is magnetic bead group, and each magnetic bead group includes at least one magnetic bead.
3. signal transmitting apparatus according to claim 2, which is characterized in that
The inductance parameters of any magnetic bead group are 1000 Ω.
4. signal transmitting apparatus according to claim 2 or 3, which is characterized in that
The magnetic bead group is a magnetic bead；
Or, the magnetic bead group is made of the magnetic bead of at least two serial or parallel connections.
5. signal transmitting apparatus according to claim 1, which is characterized in that
Any data signal line is greater than 25 μm at a distance from reference planes, is provided with two radical in the reference planes
According to the return flow path of the signal of signal wire.
6. signal transmitting apparatus according to claim 5, which is characterized in that the signal transmitting apparatus further include: first
Shielding board and secondary shielding substrate, first shielding board, the signal substrate, the secondary shielding substrate are successively folded
Add,
First shielding board is formed with the first additional signal layer far from the side of the signal substrate, is formed with described first
First screen layer is formed on first shielding board of additional signal layer；
The secondary shielding substrate is formed with the second additional signal layer far from the side of the signal substrate, is formed with described second
Secondary shielding layer is formed on the secondary shielding substrate of additional signal layer；
Between first shielding board and the data-signal layer and the secondary shielding substrate and the signal substrate it
Between, it is each formed with bonding glue-line；
The first screen layer is close to the surface of the data-signal layer and the secondary shielding layer close to the data-signal layer
Surface be the reference planes.
7. signal transmitting apparatus according to claim 1, which is characterized in that
The characteristic impedance of any data signal line is equal to 90 Ω.
8. a kind of terminal, which is characterized in that the terminal includes the signal transmitting apparatus as described in claim 1 to 7 is any.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510524478.9A CN105159856B (en) | 2015-08-24 | 2015-08-24 | Signal transmitting apparatus and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510524478.9A CN105159856B (en) | 2015-08-24 | 2015-08-24 | Signal transmitting apparatus and terminal |
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| Publication Number | Publication Date |
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| CN105159856A CN105159856A (en) | 2015-12-16 |
| CN105159856B true CN105159856B (en) | 2019-03-29 |
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| CN201510524478.9A Active CN105159856B (en) | 2015-08-24 | 2015-08-24 | Signal transmitting apparatus and terminal |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116780461A (en) * | 2022-09-28 | 2023-09-19 | 荣耀终端有限公司 | USB interface protection circuit and terminal equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101252814A (en) * | 2004-01-29 | 2008-08-27 | 三洋电机株式会社 | Wiring substrate |
| CN201508549U (en) * | 2009-09-02 | 2010-06-16 | 中兴通讯股份有限公司 | Device and system for controlling on-off of USB (universal serial bus) interface |
| CN104135148A (en) * | 2014-07-17 | 2014-11-05 | 青岛歌尔声学科技有限公司 | USB (Universal Serial Bus) interface circuit |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2773792Y (en) * | 2005-01-19 | 2006-04-19 | 四川长虹电器股份有限公司 | Data transmission device |
| CN104218330A (en) * | 2013-06-05 | 2014-12-17 | 中兴通讯股份有限公司 | Antenna |
| CN203520878U (en) * | 2013-09-27 | 2014-04-02 | 深圳市江波龙电子有限公司 | Multifunctional U disk |
| CN108535594A (en) * | 2014-01-28 | 2018-09-14 | 广东欧珀移动通信有限公司 | Interface grafting abnormal detection circuit and method |
| CN204289925U (en) * | 2014-12-23 | 2015-04-22 | 马明忠 | There is the data wire of quick-charge function |
-
2015
- 2015-08-24 CN CN201510524478.9A patent/CN105159856B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101252814A (en) * | 2004-01-29 | 2008-08-27 | 三洋电机株式会社 | Wiring substrate |
| CN201508549U (en) * | 2009-09-02 | 2010-06-16 | 中兴通讯股份有限公司 | Device and system for controlling on-off of USB (universal serial bus) interface |
| CN104135148A (en) * | 2014-07-17 | 2014-11-05 | 青岛歌尔声学科技有限公司 | USB (Universal Serial Bus) interface circuit |
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