CN105119634B

CN105119634B - Signal transmitting apparatus and terminal

Info

Publication number: CN105119634B
Application number: CN201510524491.4A
Authority: CN
Inventors: 赵青晖; 郝宁; 解霏
Original assignee: Xiaomi Inc
Current assignee: Xiaomi Inc
Priority date: 2015-08-24
Filing date: 2015-08-24
Publication date: 2017-11-21
Anticipated expiration: 2035-08-24
Also published as: CN105119634A

Abstract

The disclosure is directed to a kind of signal transmitting apparatus and terminal, belong to application of electronic technology field.The signal transmitting apparatus includes：Signal substrate, signal processing chip and general-purpose serial bus USB connector, the side of signal substrate include two single data signal wires formed with data-signal layer, data-signal layer；Signal processing chip is connected with USB connector by two single data signal wires, and the sectional area of any data signal wire is more than 600 μm².The disclosure solves the problem of signal quality transmitted on data signal line is poor, and the accuracy of signal transmission is relatively low, has reached the signal quality for improving and being transmitted on data signal line, the effect of the accuracy of promotion signal transmission, and the disclosure is used for the transmission of signal.

Description

Signal transmitting apparatus and terminal

Technical field

This disclosure relates to application of electronic technology field, more particularly to a kind of signal transmitting apparatus and terminal.

Background technology

Signal processing chip and power management chip are provided with mobile terminal, and the signal processing chip passes through two letters Number line and USB (English：Universal Serial Bus；Referred to as：USB) connector is connected, and carries out signal Transmission.Power management chip can gather the voltage on two signal wires, and according to the voltage of collection on the mobile terminal Power supply be managed.

In correlation technique, power management chip is integrated on the signal processing chip, and signal processing chip can pass through two The transmission of signal is carried out between single data signal wire and USB connector, power management chip can directly gather and signal transacting The voltage on two single data signal wires that chip is connected.With the development of electronic technology, increasing manufacturer can produce The independent power management chip that need not be integrated on signal processing chip, now, the power management chip passes through voltage signal Line is connected respectively with two single data signal wires, carries out the collection of voltage on two single data signal wires.

The content of the invention

Present disclose provides a kind of signal transmitting apparatus and terminal.The technical scheme is as follows：

According to the first aspect of the disclosure, there is provided a kind of signal transmitting apparatus, the signal transmitting apparatus include：

Signal substrate, signal processing chip and general-purpose serial bus USB connector,

The side of the signal substrate includes two single data signal wires formed with data-signal layer, the data-signal layer；

The signal processing chip is connected with the USB connector by the two single datas signal wire, any described The sectional area of data signal line is more than 600 μm²。

Optionally, the data signal line is bar signal line, and the width of any data signal line is equal to 50 μm, appointed The thickness of one data signal line is more than 12 μm.

Optionally, the thickness of any data signal line is 18 μm.

Optionally, the distance of any data signal line and reference planes is more than 25 μm, is set in the reference planes There is the return flow path of the signal of the two single datas signal wire.

Optionally, the signal transmitting apparatus also includes：First shielding board and secondary shielding substrate, first shielding Substrate, the signal substrate, the secondary shielding substrate are sequentially overlapped,

The side of first shielding board away from the signal substrate is formed with the first additional signal layer, formed with described Formed with first screen layer on first shielding board of the first additional signal layer；

The side of the secondary shielding substrate away from the signal substrate is formed with the second additional signal layer, formed with described Formed with secondary shielding layer on the secondary shielding substrate of second additional signal layer；

Between first shielding board and the data-signal layer, and the secondary shielding substrate and the signal base Between plate, it is each formed with bonding glue-line；

The first screen layer is believed close to the surface of the data-signal layer and the secondary shielding layer close to the data The surface of number floor is the reference planes.

Optionally, the signal transmitting apparatus also includes：First shielding board and secondary shielding substrate,

First shielding board, the signal substrate, the secondary shielding substrate are sequentially overlapped, on the signal substrate Close to the side of first shielding board formed with the data-signal layer, the opposite side of the signal substrate is formed with earth mat Layer；

Between first shielding board and the data-signal layer, and the secondary shielding substrate and described ground stratum reticulare Between, it is each formed with bonding glue-line.

Optionally, the signal transmitting apparatus also includes：Power management chip and power supply board,

The side of the power supply board includes formed with voltage signal layer, the voltage signal layer：Two voltage signal lines, The power management chip is connected by two voltage signal lines with the two single datas signal wire.

Optionally, the characteristic impedance of any data signal line is equal to 90 Ω.

According to the second aspect of the disclosure, there is provided a kind of terminal, the terminal include signal as described in relation to the first aspect Transmitting device.

The technical scheme that the disclosure provides can include the following benefits：

Present disclose provides a kind of signal transmitting apparatus and terminal, due to the two single data signal in the signal transmitting apparatus The sectional area of any one single data signal wire in line is more than 600 μm², i.e. the sectional area of the data signal line is more than correlation technique The sectional area of middle data signal line.Due to the resistance of data signal line size and data signal line sectional area size into anti- Than, therefore the resistance of the data signal line is less than the resistance of data signal line in correlation technique, the number obtained using oscillograph Become big according to the voltage on signal wire so that the slope increase of eye pattern corresponding to the signal transmitted on data signal line, pass through oscillography The eye pattern of transmission signal is close to outside standard eye pattern mask on the data signal line that device obtains, so, improve data signal line The signal quality of upper transmission, improve the accuracy of signal transmission.

It should be appreciated that the general description and following detailed description of the above are only exemplary, this can not be limited It is open.

Brief description of the drawings

In order to illustrate more clearly of embodiment of the disclosure, the required accompanying drawing used is made in being described below to embodiment Simply introduce, it should be apparent that, drawings in the following description are only some embodiments of the present disclosure, common for this area For technical staff, on the premise of not paying creative work, other accompanying drawings can also be obtained according to these accompanying drawings.

Fig. 1-1 is a kind of structural representation of signal transmitting apparatus according to correlation technique；

Fig. 1-2 is a kind of partial cutaway schematic of signal transmitting apparatus according to correlation technique；

Fig. 1-3 is a kind of eye pattern schematic diagram according to correlation technique；

Fig. 2-1 is the structural representation of the first signal transmitting apparatus according to an exemplary embodiment；

Fig. 2-2 is the structural representation of second of signal transmitting apparatus according to an exemplary embodiment；

Fig. 2-3 is a kind of inductance parameters schematic diagram of magnetic bead according to an exemplary embodiment；

Fig. 3-1 is the structural representation of the third signal transmitting apparatus according to an exemplary embodiment；

Fig. 3-2 is a kind of schematic partial cross-sectional view of signal transmitting apparatus according to an exemplary embodiment；

Fig. 3-3 is a kind of partial structural diagram of signal transmitting apparatus according to correlation technique；

Fig. 3-4 is the structural representation of the 4th kind of signal transmitting apparatus according to an exemplary embodiment；

Fig. 4-1 is the structural representation of the 5th kind of signal transmitting apparatus according to an exemplary embodiment；

Fig. 4-2 is the schematic partial cross-sectional view of another signal transmitting apparatus according to an exemplary embodiment；

Fig. 4-3 is the structural representation of the 6th kind of signal transmitting apparatus according to an exemplary embodiment；

Fig. 5-1 is the structural representation of the 7th kind of signal transmitting apparatus according to an exemplary embodiment；

Fig. 5-2 is the schematic partial cross-sectional view of another signal transmitting apparatus according to an exemplary embodiment；

Fig. 6-1 is the structural representation of the 8th kind of signal transmitting apparatus according to an exemplary embodiment；

Fig. 6-2 is the schematic partial cross-sectional view of another signal transmitting apparatus according to an exemplary embodiment；

Fig. 7-1 is the structural representation of the 9th kind of signal transmitting apparatus according to an exemplary embodiment；

Fig. 7-2 is a kind of schematic partial cross-sectional view of signal transmitting apparatus according to another exemplary embodiment；

Fig. 7-3 is the structural representation of the tenth kind of signal transmitting apparatus according to an exemplary embodiment；

Fig. 8-1 is the tenth a kind of structural representation of signal transmitting apparatus according to an exemplary embodiment；

Fig. 8-2 is the schematic partial cross-sectional view of another signal transmitting apparatus according to another exemplary embodiment；

Fig. 8-3 is a kind of eye pattern schematic diagram according to an exemplary embodiment.

Accompanying drawing herein is merged in specification and forms the part of this specification, shows the implementation for meeting the present invention Example, and for explaining principle of the invention together with specification.

Embodiment

In order that the purpose, technical scheme and advantage of the disclosure are clearer, the disclosure is made below in conjunction with accompanying drawing into One step it is described in detail, it is clear that described embodiment is only disclosure some embodiments, rather than whole implementation Example.Based on the embodiment in the disclosure, what those of ordinary skill in the art were obtained under the premise of creative work is not made All other embodiment, belong to the scope of disclosure protection.

Fig. 1-1 is a kind of structural representation of signal transmitting apparatus according to correlation technique, as Figure 1-1, should Signal transmitting apparatus 0 can include：Signal processing chip 01, power management chip 02 and USB connector 03, example, the letter Number transmitting device 0 can be located in mobile terminal (not shown in Fig. 1-1), and power supply (figure is also provided with the mobile terminal Not shown in 1-1).

Signal processing chip 01 can be connected by data signal line A1, data signal line A2 with USB connector 03, with The USB connector 03 carries out the transmission of signal, and data signal line A1 and data signal line A2 can be differential data signals line.Electricity Source control chip 02 is connected respectively by voltage signal line B1, voltage signal line B2 with data signal line A1, data signal line A2, Carry out the collection of voltage on data signal line A1, data signal line A2.Optionally, voltage signal line B1 one end and power management Chip 02 is connected, and the voltage signal line B1 other end is connected with data signal line A1, and power management chip 02 can pass through Voltage on voltage signal line B1 gathered data signal wires A1；Voltage signal line B2 one end is connected with power management chip 02 Connect, the voltage signal line B2 other end is connected with data signal line A2, and power management chip 02 can pass through voltage signal line Voltage on B2 gathered data signal wires A2.The power management chip 02 is collecting data signal line A1 and data signal line A2 On voltage after, power supply can be managed according to the voltage collected.

Fig. 1-2 is a kind of partial cutaway schematic of signal transmitting apparatus according to correlation technique, such as Fig. 1-2 institutes Show, data signal line A1 and data signal line A2 are bar signal line, and data signal line A1 and data signal line A2 width Degree is equal to 50 μm (microns), and data signal line A1 and data signal line A2 thickness are equal to 12 μm, i.e. data signal line A1 600 μm of the product of 50 μm and 12 μm is equal to data signal line A2 sectional area²(square micron).The signal transmitting apparatus 0 It can also include：Signal substrate 04, data signal line A1 and data signal line A2 can be formed at the side of signal substrate 04, The opposite side of the signal substrate 04 could be formed with ground stratum reticulare 042, and data signal line A1 sums can be provided with ground stratum reticulare 042 According to the return flow path of signal wire A2 signal, the ground stratum reticulare 042 is reference planes M close to the surface of the signal substrate 04, and number Distance according to signal wire A1 or data signal line A2 and the ground stratum reticulare 042 is 25 μm, i.e. data signal line A1 or data letter Number line A2 and reference planes M distance is 25 μm.

In correlation technique, by carrying out eye pattern test to the signal on data signal line, to judge on data signal line Whether signal quality meets the requirements.Example, eye corresponding to the signal transmitted on data signal line can be obtained by oscillograph Figure, and by eye pattern corresponding to the signal transmitted on data signal line compared with standard eye pattern mask, if the data signal line Eye pattern corresponding to the signal of upper transmission is located at outside the standard eye pattern mask, it is determined that the matter of the signal transmitted on the data signal line Amount meets the requirements；If eye pattern corresponding to the signal transmitted on the data signal line is simultaneously not located at outside the standard eye pattern mask, really The quality of the signal transmitted on the fixed data signal line is undesirable.It should be noted that oscillograph can by wire with Data signal line connects, and obtains eye pattern corresponding to the signal transmitted on data signal line, the eye pattern shown on the oscillograph can The voltage reflected on the tie point of the wire and data signal line changes with time situation.

Example, pass through data signal line A1 and data signal line A2 in the signal processing chip 01 and USB connector 03 During carrying out signal transmission, due to being connected to voltage signal line B1 on data signal line A1, on data signal line A2 Voltage signal line B2 is connected to, the signal for causing to transmit on data signal line A1 is possible to transmit to voltage signal line B1, The signal transmitted on data signal line A2 is possible to transmit to voltage signal line B2 so that signal transmission errors.In logarithm it is believed that When the signal transmitted on number line A1 and data signal line A2 carries out eye pattern test, the data signal line A1 that is obtained by oscillograph and The eye pattern of transmission signal is not located at outside standard eye pattern mask on data signal line A2.Fig. 1-3 is one according to correlation technique Kind of eye pattern schematic diagram, as Figure 1-3, in the signal transmitting apparatus in correlation technique, the quality transmitted on data signal line compared with Eye pattern P corresponding to the signal of difference, is not located at outside standard eye pattern Q.As can be seen here, in the signal transmitting apparatus in correlation technique The signal quality transmitted on data signal line is poor, and the accuracy of data signal line transmission signal is relatively low.

Fig. 2-1 is the structural representation of the first signal transmitting apparatus 1 according to an exemplary embodiment, as Fig. 2- Shown in 1, the signal transmitting apparatus 1 can include：Signal processing chip 11, power management chip 12 and USB connector 13.

The signal processing chip 11 can be connected with USB connector 13 by data signal line C1 and data signal line C2 Connect；Power management chip 12 can by voltage signal line D1 and voltage signal line D2 respectively with data signal line C1 sums it is believed that Number line C2 is connected, and it is single that regulation can be in series with any voltage signal wire in the voltage signal line D1 and voltage signal line D2 First E, adjustment unit E can be used for the signal transmission of the blocking voltage signal wire when voltage signal line transmits high-frequency signal, The signal transmission of conducting voltage signal wire when voltage signal line transmits low frequency signal.

In summary, in the signal transmitting apparatus provided due to the embodiment of the present disclosure, it is connected with power management chip Adjustment unit is in series with voltage signal line, and the adjustment unit is used for the blocking voltage when voltage signal line transmits high-frequency signal The signal transmission of signal wire, the signal transmission of conducting voltage signal wire when voltage signal line transmits low frequency signal.When the signal When process chip transmits high-frequency signal with the USB connector by the data signal line, the adjustment unit being capable of blocking voltage letter The signal transmission of number line so that when data signal line transmits high-frequency signal, do not influenceed by voltage signal line, so, improve The signal quality transmitted on data signal line, improve the accuracy of signal transmission.

Example, voltage signal line D1 one end is connected with power management chip 12, the voltage signal line D1 other end It is connected with data signal line C1, power management chip 12 can pass through the electricity on voltage signal line D1 gathered data signal wires C1 Pressure；Voltage signal line D2 one end can be connected with power management chip 12, and voltage signal line the D2 other end and data are believed Number line C2 is connected, and power management chip 12 can pass through the voltage on voltage signal line D2 gathered data signal wires C2.It is optional , the adjustment unit E in Fig. 2-1 can be magnetic bead group, and each magnetic bead group can include at least one magnetic bead, i.e. the electric signal passes Two magnetic bead groups can be provided with defeated device 1, example, the inductance parameters of any one magnetic bead group can be 1000 Ω (Europe Nurse).

On the one hand, magnetic bead group can be a magnetic bead, and now, the inductance parameters of a magnetic bead can be 1000 Ω, figure 2-2 is the structural representation of second of signal transmitting apparatus 1 according to an exemplary embodiment, as shown in Fig. 2-2, the tune It can be magnetic bead group to save unit, and each magnetic bead group can include a magnetic bead e, i.e. the voltage signal line D1 and voltage signal line D2 Upper difference can connect a magnetic bead e.Fig. 2-3 is that a kind of inductance parameters of magnetic bead according to an exemplary embodiment show Be intended to, as Figure 2-3, when the frequency f of the signal on magnetic bead is relatively low, the resistance R of the magnetic bead is smaller, the inductance Z of magnetic bead compared with Small, when the frequency f of the signal on magnetic bead is higher, the resistance R of the magnetic bead is larger, and the inductance Z of magnetic bead is larger.I.e. when on the magnetic bead The frequency of signal when being low frequency, the resistance of the magnetic bead is smaller, and voltage signal line is path, when the frequency of the signal on magnetic bead is During high frequency, the resistance of the magnetic bead is larger, and voltage signal line is equivalent to open circuit.It should be noted that resistance R unit can be Ω, frequency f unit can be MHz (megahertz).Optionally, when the frequency of the signal transmitted on data signal line is 480MHz When, the transmission rate of signal can be 480Mbps on the data signal line, and now, the resistance of the magnetic bead is more than 1000 Ω, i.e. magnetic The resistance of pearl is larger, and for the voltage signal line equivalent to open circuit, the signal quality transmitted on the data signal line is preferable, signal transmission Accuracy it is higher.

On the other hand, magnetic bead group can be made up of the magnetic bead of at least two serial or parallel connections, now, at least two series connection Or the inductance parameters of the magnetic bead group of magnetic bead composition in parallel are 1000 Ω.Example, the magnetic bead group can be by the magnetic of two series connection Pearl is formed, and the magnetic bead group can also be made up of two magnetic beads in parallel, example, and the magnetic bead group can also be the magnetic of two series connection The pearl magnetic bead in parallel with two is in series, i.e., the magnetic bead group can be combined in any way by multiple magnetic beads so that should The inductance parameters of magnetic bead group are 1000 Ω.

In the signal transmitting apparatus that the embodiment of the present disclosure provides, because data signal line is connected with voltage signal line, because This, the frequency of transmission signal is equal on the data signal line and voltage signal line, when the signal transmitted on the data signal line When frequency is relatively low, the adjustment unit connected on the voltage signal line can turn on the signal transmission of the voltage signal line, with the electricity The power management chip that is connected of pressure signal wire can be by the voltage on voltage signal line gathered data signal wire, and according to adopting The voltage of collection is managed to the power supply in terminal.When the frequency of the signal transmitted on the data signal line is higher, the voltage The adjustment unit connected on signal wire is capable of the signal transmission of blocking voltage signal wire, the power supply being connected with the voltage signal line Managing chip can not be by the voltage on voltage signal line gathered data signal wire, and now, the signal processing chip can pass through The data signal line carries out the transmission of signal with the USB connector.And the signal due to now being transmitted on the data signal line Frequency is higher, therefore, the speed of the signal now transmitted on data signal line, signal transmission efficiency it is higher.

It should be noted that in the signal transmitting apparatus 1 that the embodiment of the present disclosure provides, the spy of any one single data signal wire Property impedance can be equal to 90 Ω, i.e. the characteristic impedance of data signal line C1 and data signal line C2 are equal to 90 Ω, when any When the characteristic impedance of a data signal wire is equal to 90 Ω, the quality of the signal transmitted on the data signal line is preferable.Optionally, The voltage signal line D1 and voltage signal line D2 characteristic impedance can also be equal to 90 Ω.

Fig. 3-1 is the structural representation of the third signal transmitting apparatus 1 according to an exemplary embodiment, as Fig. 3- Shown in 1, the signal transmitting apparatus 1 can include：Signal substrate 14, signal processing chip 11 and USB connector 13.

Example, the side of the signal substrate 14 could be formed with data-signal layer, and the data-signal layer can include two Single data signal wire, the two single datas signal wire is respectively data signal line C1 and data signal line C2；Signal processing chip 11 Can be connected with USB connector 13 by the two single datas signal wire, any one radical in the two single datas signal wire it is believed that The sectional area S of number line is more than 600 μm², the sectional area S of any one single data signal wire is this two in the two single datas signal wire The area S in the section of any one single data signal wire in data signal line.

In summary, in the signal transmitting apparatus provided due to the embodiment of the present disclosure, the number of the side formation of signal substrate Include two single data signal wires according to signals layer, and the sectional area of any one single data signal wire in the two single datas signal wire is big In 600 μm², i.e., the sectional area of the data signal line be more than correlation technique in data signal line sectional area.Due to data-signal The size of the resistance of line and the size of the sectional area of data signal line are inversely proportional, therefore the resistance of the data signal line is less than correlation The resistance of data signal line in technology, the voltage on the data signal line obtained using oscillograph become big so that data-signal The slope increase of eye pattern corresponding to the signal transmitted on line, pass through the eye pattern of transmission signal on the data signal line of oscillograph acquisition It is close to outside standard eye pattern mask, so, the signal quality transmitted on data signal line is improved, improves the standard of signal transmission True property.

Optionally, Fig. 3-2 is a kind of partial cross section's signal of signal transmitting apparatus according to an exemplary embodiment Figure, as shown in figure 3-2, data signal line C1 and data signal line C2 can be bar signal line, data signal line C1 It can be equal to 50 μm with the width U of any one single data signal wire in data signal line C2, any one single data signal wire Thickness V can be more than 12 μm, example, and the thickness V of any one single data signal wire can be 18 μm.When the data signal line is During bar signal line, the sectional area of the data signal line multiplies for the width U of data signal line and the thickness V of data signal line Product.In correlation technique, the width of data signal line is equal to 50 μm, and the thickness of data signal line is equal to 12 μm, i.e., in correlation technique The sectional area of data signal line is equal to 600 μm².In the signal transmitting apparatus that the embodiment of the present disclosure provides, due to data signal line Width it is equal with the width of data signal line in correlation technique, and the thickness of data signal line be more than correlation technique in data believe The thickness of number line, therefore in the signal transmitting apparatus that provides of the embodiment of the present disclosure, the sectional area of data signal line is more than related skill The sectional area of data during operation signal wire.It should be noted that data-signal in the signal transmitting apparatus that the embodiment of the present disclosure provides The material of line can be identical with the material of data signal line in correlation technique, in the signal transmitting apparatus that the embodiment of the present disclosure provides The length of data signal line can be with the equal length of data signal line in correlation technique.

Further, the calculation formula of the resistance of data signal line is R=ρ L/S, wherein, R is the electricity of data signal line Resistance, ρ are the resistivity for the material that data signal line is made, and L is the length of the data signal line, and S is cutting for the data signal line Area.From above-mentioned formula as can be seen that the size of the sectional area of the size of the resistance of the data signal line and data signal line into Inverse ratio.The sectional area of data signal line is more than data in correlation technique in the signal transmitting apparatus provided due to the embodiment of the present disclosure The sectional area of signal wire, and in the signal transmitting apparatus of embodiment of the present disclosure offer in the material and correlation technique of data signal line The material of data signal line is identical, the length of data signal line and related skill in the signal transmitting apparatus that the embodiment of the present disclosure provides The equal length of data during operation signal wire, therefore, the data signal line in the signal transmitting apparatus that the embodiment of the present disclosure provides Resistance is less than the resistance of data signal line in correlation technique.

Example, Fig. 3-3 is a kind of partial structural diagram of signal transmitting apparatus 1 according to correlation technique, such as Shown in Fig. 3-3, signal processing chip 01, data signal line A1 and USB connector 03 are sequentially connected in series, signal processing chip 01, number It is sequentially connected in series according to signal wire A2, USB connector 03.Electric current is from signal processing chip 01 along data signal line A1 and data-signal Line A2 flows to USB connector 03.If the resistance of signal processing chip 01 is 4 Ω, data signal line A1 resistance is 3 Ω, USB The resistance of connector 03 is 3 Ω, is carried in signal processing chip 01, data signal line A1, the voltage at the both ends of USB connector 03 and is 10 volts, then data signal line A1 and the voltage at data signal line A2 both ends are 7 volts.There is provided due to the embodiment of the present disclosure In signal transmitting apparatus 1, data signal line C1 and data signal line C2 resistance are respectively less than data signal line in correlation technique A1 and data signal line A2 resistance, therefore, the voltage at data signal line C1 and data signal line C2 both ends are all higher than 7 volts. Example, if the resistance of the data signal line C1 and data signal line C2 in the signal transmitting apparatus 1 that the embodiment of the present disclosure provides It is 1 Ω, and the resistance of signal processing chip 11 is 4 Ω, the resistance of USE connectors 13 is 3 Ω, is carried in the signal transacting core Piece 11 and the voltage at the both ends of USB connector 13 are 10 volts, then data signal line C1 and the voltage at data signal line C2 both ends For 8.75 volts, more than 7 volts of data signal line A1 in correlation technique and the voltage at data signal line A2 both ends.Using oscillography The voltage on the data signal line that device obtains becomes big so that the slope of eye pattern corresponding to the signal transmitted on data signal line increases Greatly, the eye pattern of transmission signal is close to outside standard eye pattern mask on the data signal line obtained by oscillograph, so, improve The signal quality transmitted on data signal line, improve the accuracy of signal transmission.

Optionally, as shown in figure 3-2, the signal transmitting apparatus 1 can also include：First shielding board 15 and secondary shielding Substrate 16.Example, first shielding board 15, signal substrate 14, secondary shielding substrate 16 can be sequentially overlapped, and the signal Close to the side of the first shielding board 15 formed with data-signal layer on substrate 14, the opposite side of signal substrate 14 is formed with earth mat Layer 142, optionally, the opposite side of the signal substrate are also formed with other structures (not shown in Fig. 3-2), and the other structures with The thickness of ground stratum reticulare is equal.The side of first shielding board 15 away from signal substrate 14 could be formed with the first additional signal layer 151, first screen layer 152 is could be formed with the first shielding board 15 formed with the first additional signal layer 151.Secondary shielding Side of the substrate 16 away from signal substrate 14 could be formed with the second additional signal layer 161, formed with the second additional signal layer 161 Secondary shielding substrate 16 on could be formed with secondary shielding layer 162.Optionally, first shielding board 15 and data-signal layer Between, and between secondary shielding substrate 16 and ground stratum reticulare 142, could be formed with bonding glue-line 17.It should be noted that ground The surface of the close signal substrate 14 can be data signal line C1 and data signal line C2 reference planes M on stratum reticulare 142.Should The return flow path of the signal transmitted on data signal line C1 and data signal line C2 can be provided with reference planes M, i.e., from The signal that signal processing chip 11 generates can be transmitted to the USB connector 13 along data signal line C1 and data signal line C2, And the signal that the signal processing chip 11 generates is transmitted to the signal by the return flow path of signal by the USB connector 13 Manage chip 11.

Example, the thickness of first shielding board 15, signal substrate 14 and secondary shielding substrate 16 can be 25 μm, The thickness of the first additional signal layer 151, the second additional signal layer 161 and ground stratum reticulare 142 can be 12 μm, the data-signal The thickness of line can be 18 μm, and the thickness of the bonding glue-line 17 can be 15 μm.Due in the embodiment of the present disclosure, data signal line Reference planes M be ground stratum reticulare 142 on close to signal substrate surface, therefore, between the data-signal layer and reference planes M Distance is equal to 25 μm of the thickness of the signal substrate 14.

Fig. 3-4 is the structural representation of the 4th kind of signal transmitting apparatus 1 according to an exemplary embodiment, as Fig. 3- Shown in 4, the signal transmitting apparatus 1 can also include：Power management chip 12 and power supply board H, power supply board H side can Can include formed with voltage signal layer, the voltage signal layer：Voltage signal line D1 and voltage signal line D2, the power management Chip 12 can be connected by two voltage signal lines with two single data signal wires.Example, voltage signal line D1 one end It can be connected with power management chip 12, the voltage signal line D1 other end can be connected with data signal line C1, power supply Managing chip 12 can pass through the voltage on voltage signal line D1 gathered data signal wires C1；Voltage signal line D2 one end can be with It is connected with power management chip 12, the voltage signal line D2 other end can be connected with data signal line C2, power management Chip 12 can pass through the voltage on voltage signal line D2 gathered data signal wires C2.

Fig. 4-1 is the structural representation of the 5th kind of signal transmitting apparatus 1 according to an exemplary embodiment, as Fig. 4- Shown in 1, the signal transmitting apparatus 1 can include：Signal substrate 14, signal processing chip 11 and USB connector 13.

Example, the side of the signal substrate 14 could be formed with data-signal layer, and the data-signal layer can include two Single data signal wire, the two single datas signal wire is respectively data signal line C1 and data signal line C2；Signal processing chip 11 Can be connected with USB connector 13 by two single data signal wires, and any one radical in two single data signal wires it is believed that Number line and reference planes M distance are more than 25 μm, it is necessary to explanation, can be provided with two radicals on reference planes M it is believed that The return flow path of the signal of number line.

In summary, in the signal transmitting apparatus provided due to the embodiment of the present disclosure, the two of the side formation of signal substrate In single data signal wire, the distance of any one single data signal wire and reference planes is more than 25 μm, i.e. data signal line and reference The distance of plane is more than the distance of data signal line and reference planes in correlation technique, and data signal line is formed with reference planes The distance of size and data signal line and reference planes of electric capacity be inversely proportional, compared to correlation technique, the embodiment of the present disclosure carries Data signal line and the electric capacity that reference planes are formed are smaller in the signal transmitting apparatus of confession, and the charging interval of electric capacity is smaller, that is, count Become big speed according to the voltage at signal wire both ends so that the slope of eye pattern corresponding to the signal transmitted on data signal line increases Greatly, the eye pattern of transmission signal is close to outside standard eye pattern mask on the data signal line obtained by oscillograph, so, improve The signal quality transmitted on data signal line, improve the accuracy of signal transmission.

Example, signal processing chip 11 generate signal can be transmitted along data signal line C1 and data signal line C2 to The USB connector 13, and by the USB connector 13 by the signal that the signal processing chip 11 generates by being set in the reference planes The return flow path for the signal put is transmitted to the signal processing chip 11.

In correlation technique, the side of signal substrate can include two single datas formed with data-signal layer, data-signal layer Signal wire, the opposite side of signal substrate could be formed with ground stratum reticulare, and the ground stratum reticulare is reference close to the surface of the signal substrate Plane, optionally, the opposite side of the signal substrate are also formed with other structures, and the other structures and the thickness phase of ground stratum reticulare Deng.First shielding board, signal substrate, secondary shielding substrate can be sequentially overlapped, and the data-signal layer is formed at signal base Close to the side of the first shielding board on plate.Side of first shielding board away from signal substrate could be formed with the first additional letter Number floor, first screen layer is could be formed with the first shielding board formed with the first additional signal layer.Secondary shielding substrate is remote Side from signal substrate could be formed with the second additional signal layer, on the secondary shielding substrate formed with the second additional signal layer It could be formed with secondary shielding layer.Optionally, between first shielding board and data-signal layer, and secondary shielding substrate with Between ground stratum reticulare, bonding glue-line could be formed with.Example, first shielding board, signal substrate and secondary shielding substrate Thickness can be 25 μm, the first additional signal layer, the second additional signal layer, stratum reticulare and data signals layer thickness it is equal It can be 12 μm, the thickness of the bonding glue-line can be 15 μm.Because in correlation technique, the reference planes of data signal line are ground Close to the surface of signal substrate on stratum reticulare, therefore, the distance between the data-signal layer and reference planes are equal to the signal substrate 25 μm of thickness.

Optionally, Fig. 4-2 is that the partial cross section of another signal transmitting apparatus 1 according to an exemplary embodiment shows It is intended to, as shown in the Fig. 4-2, the signal transmitting apparatus 1 can also include：First shielding board 15 and secondary shielding substrate 16, and First shielding board 15, signal substrate 14, secondary shielding substrate 16 are sequentially overlapped.First shielding board 15 is away from signal substrate 14 side is formed formed with the first additional signal layer 151 on the first shielding board 15 formed with the first additional signal layer 151 There is first screen layer 152；Side of the secondary shielding substrate 16 away from signal substrate 14 is formed with the second additional signal layer 161, shape Formed with secondary shielding layer 162 on into the secondary shielding substrate 16 for having the second additional signal layer 161；First shielding board 15 and number According between signals layer, and between secondary shielding substrate 16 and signal substrate 14, it is each formed with bonding glue-line 17；First screen layer 152 close to the surface of data-signal layer and secondary shielding layer 162 be reference planes M close to the surface of data-signal layer.That is this public affairs Open in embodiment, the opposite side of the signal substrate 14 is simultaneously formed without earth mat layer, and the opposite side of the signal substrate is only simply formed with The other structures 143 equal with the thickness of ground stratum reticulare.

Example, the thickness of each substrate in above-mentioned first shielding board 15, signal substrate 14 and secondary shielding substrate 16 Degree can be 25 μm, and the thickness of the bonding glue-line 17 can be equal to 25 μm, the additional letter of the first additional signal layer 151, second The thickness of number floor 161 and data-signal floor can be 12 μm, and the thickness of the other structures 143 equal with the thickness of ground stratum reticulare can With equal to 12 μm, now, when reference planes M be first screen layer 152 close to the surface of data-signal layer when, reference planes M Distance with data signal line C1, data signal line C2 is 62 μm, when reference planes M is that secondary shielding layer 162 is believed close to data During the surface of number floor, reference planes M and data signal line C1, data signal line C2 distance are 99 μm.It is possible thereby to see Go out in the embodiment of the present disclosure, the distance of data signal line and reference planes is all higher than data signal line in correlation technique and put down with reference 25 μm of the distance in face.

Fig. 4-3 is the structural representation of the 6th kind of signal transmitting apparatus 1 according to an exemplary embodiment, as Fig. 3- Shown in 4, the signal transmitting apparatus 1 can also include：Power management chip 12 and power supply board H, power supply board H side can Can include formed with voltage signal layer, the voltage signal layer：Voltage signal line D1 and voltage signal line D2, the power management Chip 12 can be connected by two voltage signal lines with two single data signal wires.Example, voltage signal line D1 one end It can be connected with power management chip 12, the voltage signal line D1 other end can be connected with data signal line C1, power supply Managing chip 12 can pass through the voltage on voltage signal line D1 gathered data signal wires C1；Voltage signal line D2 one end can be with It is connected with power management chip 12, the voltage signal line D2 other end can be connected with data signal line C2, power management Chip 12 can pass through the voltage on voltage signal line D2 gathered data signal wires C2.

Further, the calculation formula for the electric capacity that data signal line is formed with the conductive layer where reference planes is C=ε * ε 0*S/d, wherein C are the electric capacity that data signal line is formed with the conductive layer where reference planes, and ε is relative dielectric constant, and ε 0 is Permittivity of vacuum, S are the facing area of data signal line and reference planes, and d is between data signal line and reference planes Distance, from above-mentioned formula as can be seen that the size for the electric capacity that data signal line is formed with reference planes and data signal line and ginseng The distance for examining plane is inversely proportional.In the signal transmitting apparatus provided due to the embodiment of the present disclosure, the side of the signal substrate is formed Two single data signal wires in, the distances of any one single data signal wire and reference planes is more than 25 μm, i.e., data signal line with The distance of reference planes is more than the distance of data signal line and reference planes in correlation technique, and the and of ε, ε 0 in the embodiment of the present disclosure S value is equal with ε, ε in correlation technique 0 and S value, and therefore, compared to correlation technique, the signal that the embodiment of the present disclosure provides passes Data signal line and the electric capacity that reference planes are formed are smaller in defeated device, and the charging interval of electric capacity is smaller, i.e. data signal line two The voltage at end becomes big speed so that the slope increase of eye pattern corresponding to the signal transmitted on data signal line, by showing The eye pattern of transmission signal is close to outside standard eye pattern mask on the data signal line that ripple device obtains, so, improve data-signal The signal quality transmitted on line, improve the accuracy of signal transmission.

In summary, in the signal transmitting apparatus provided due to the embodiment of the present disclosure, the number of the side formation of signal substrate Include two single data signal wires, and any one single data signal wire and reference planes in the two single datas signal wire according to signals layer Distance be more than 25 μm, i.e., the distance of data signal line and reference planes be more than correlation technique in data signal line and reference planes Distance, and the size of electric capacity that is formed with reference planes of data signal line and the distance of data signal line and reference planes are into anti- Than, therefore, data signal line and reference planes shape in the signal transmitting apparatus provided compared to correlation technique, the embodiment of the present disclosure Into electric capacity smaller capacitive charging interval it is smaller, i.e., the voltage at data signal line both ends becomes big speed so that data The slope increase of eye pattern corresponding to the signal transmitted on signal wire, pass through transmission signal on the data signal line of oscillograph acquisition Eye pattern is close to outside standard eye pattern mask, so, the signal quality transmitted on data signal line is improved, improves signal transmission Accuracy.

Fig. 5-1 is the structural representation of the 7th kind of signal transmitting apparatus 1 according to an exemplary embodiment, as Fig. 5- Shown in 1, the signal transmitting apparatus 1 can include：Signal processing chip 11, power management chip 12, USB connector 13 and signal Substrate 14.

The side of the signal substrate 14 could be formed with data-signal layer, and the data-signal layer can include data signal line C1 and data signal line C2；The signal processing chip 11 can pass through data signal line C1 and data-signal with USB connector 13 Line C2 is connected；Power management chip 12 can by voltage signal line D1 and voltage signal line D2 respectively with data signal line C1 It is connected with data signal line C2, can be connected on any voltage signal wire in the voltage signal line D1 and voltage signal line D2 There is adjustment unit E, adjustment unit E can be used for the signal of the blocking voltage signal wire when voltage signal line transmits high-frequency signal Transmission, the signal transmission of conducting voltage signal wire when voltage signal line transmits low frequency signal.Appoint in the two single datas signal wire Anticipate a single data signal wire sectional area be more than 600 μm², the section of any one single data signal wire in the two single datas signal wire Product is the area in the section of any one single data signal wire in the two single datas signal wire.

Example, voltage signal line D1 one end is connected with power management chip 12, the voltage signal line D1 other end It is connected with data signal line C1, power management chip 12 can pass through the electricity on voltage signal line D1 gathered data signal wires C1 Pressure；Voltage signal line D2 one end can be connected with power management chip 12, and voltage signal line the D2 other end and data are believed Number line C2 is connected, and power management chip 12 can pass through the voltage on voltage signal line D2 gathered data signal wires C2.It is optional , adjustment unit E can be magnetic bead group, and each magnetic bead group can include at least one magnetic bead, i.e., in the electric signal transmission device 1 Two magnetic bead groups can be provided with, example, the inductance parameters of any one magnetic bead group can be 1000 Ω (ohm).

On the one hand, magnetic bead group can be a magnetic bead, and now, the inductance parameters of a magnetic bead can be 1000 Ω, should Adjustment unit can be magnetic bead group, and each magnetic bead group can include a magnetic bead, i.e. the voltage signal line D1 and voltage signal line Can connect a magnetic bead respectively on D2.Fig. 2-3 is a kind of inductance parameters of magnetic bead according to an exemplary embodiment Schematic diagram, as Figure 2-3, when the frequency f of the signal on magnetic bead is relatively low, the resistance R of the magnetic bead is smaller, the inductance Z of magnetic bead Smaller, when the frequency f of the signal on magnetic bead is higher, the resistance R of the magnetic bead is larger, and the inductance Z of magnetic bead is larger.I.e. when the magnetic bead On the frequency of signal when being low frequency, the resistance of the magnetic bead is smaller, and voltage signal line is path, when the frequency of the signal on magnetic bead For high frequency when, the resistance of the magnetic bead is larger, and voltage signal line is equivalent to open circuit.It should be noted that resistance R unit can be Ω, frequency f unit can be MHz (megahertz).Optionally, when the frequency of the signal transmitted on data signal line is 480MHz When, the transmission rate of signal can be 480Mbps on the data signal line, and now, the resistance of the magnetic bead is more than 1000 Ω, i.e. magnetic The resistance of pearl is larger, and for the voltage signal line equivalent to open circuit, the signal quality transmitted on the data signal line is preferable, signal transmission Accuracy it is higher.

On the other hand, magnetic bead group can be made up of the magnetic bead of at least two serial or parallel connections, now, at least two series connection Or the inductance parameters of the magnetic bead group of magnetic bead composition in parallel are 1000 Ω.Example, the magnetic bead group can be by the magnetic of two series connection Pearl is formed, and the magnetic bead group can also be made up of two magnetic beads in parallel, and the magnetic bead group can also be the magnetic bead and two of two series connection Individual magnetic bead in parallel is in series, i.e., the magnetic bead group can be combined in any way by multiple magnetic beads so that the magnetic bead group Inductance parameters be 1000 Ω.

Optionally, Fig. 5-2 is that the partial cross section of another signal transmitting apparatus 1 according to an exemplary embodiment shows It is intended to, as shown in Fig. 5-2, data signal line C1 and data signal line C2 can be bar signal line, the data signal line The width U of any one single data signal wire in C1 and data signal line C2 can be equal to 50 μm, any one single data signal wire Thickness V can be more than 12 μm, example, the thickness V of any one single data signal wire can be 18 μm.When the data signal line For bar signal line when, the sectional area of the data signal line multiplies for the width U of data signal line and the thickness V of data signal line Product.In correlation technique, the width of data signal line is equal to 50 μm, and the thickness of data signal line is equal to 12 μm, i.e., in correlation technique The sectional area of data signal line is equal to 600 μm².In the signal transmitting apparatus that the embodiment of the present disclosure provides, due to data signal line Width it is equal with the width of data signal line in correlation technique, and the thickness of data signal line be more than correlation technique in data believe The thickness of number line, therefore in the signal transmitting apparatus that provides of the embodiment of the present disclosure, the sectional area of data signal line is more than related skill The sectional area of data during operation signal wire.It should be noted that data-signal in the signal transmitting apparatus that the embodiment of the present disclosure provides The material of line can be identical with the material of data signal line in correlation technique, in the signal transmitting apparatus that the embodiment of the present disclosure provides The length of data signal line can be with the equal length of data signal line in correlation technique.

Further, the calculation formula of the resistance of data signal line is R=ρ L/S, and wherein R is the resistance of data signal line, ρ is the resistivity for the material that data signal line is made, and L is the length of the data signal line, and S is the section of the data signal line Product.From above-mentioned formula as can be seen that the size of the sectional area of the size of the resistance of the data signal line and data signal line is into anti- Than.The sectional area of data signal line is more than data in correlation technique and believed in the signal transmitting apparatus provided due to the embodiment of the present disclosure The sectional area of number line, and number in the material of data signal line and correlation technique in the signal transmitting apparatus that provides of the embodiment of the present disclosure It is identical according to the material of signal wire, the length and correlation technique of data signal line in the signal transmitting apparatus that the embodiment of the present disclosure provides The equal length of middle data signal line, therefore, the electricity of the data signal line in the signal transmitting apparatus that the embodiment of the present disclosure provides Resistance is less than the resistance of data signal line in correlation technique.

Optionally, as shown in Fig. 5-2, the signal transmitting apparatus 1 can also include：First shielding board 15 and secondary shielding Substrate 16.Example, first shielding board 15, signal substrate 14, secondary shielding substrate 16 can be sequentially overlapped, and the signal Close to the side of the first shielding board 15 formed with data-signal layer on substrate 14, the opposite side of signal substrate 14 is formed with earth mat Layer 142, optionally, the opposite side of the signal substrate are also formed with other structures (not shown in Fig. 5-2), and the other structures with The thickness of ground stratum reticulare is equal.The side of first shielding board 15 away from signal substrate 14 could be formed with the first additional signal layer 151, first screen layer 152 is could be formed with the first shielding board 15 formed with the first additional signal layer 151.Secondary shielding Side of the substrate 16 away from signal substrate 14 could be formed with the second additional signal layer 161, formed with the second additional signal layer 161 Secondary shielding substrate 16 on could be formed with secondary shielding layer 162.Optionally, first shielding board 15 and data-signal layer Between, and between secondary shielding substrate 16 and ground stratum reticulare 142, could be formed with bonding glue-line 17.It should be noted that ground The surface of the close signal substrate 14 can be data signal line C1 and data signal line C2 reference planes M on stratum reticulare 142.Should The return flow path of the signal transmitted on data signal line C1 and data signal line C2 can be provided with reference planes M, i.e., from The signal that signal processing chip 11 generates can be transmitted to the USB connector 13 along data signal line C1 and data signal line C2, And the signal that the signal processing chip 11 generates is transmitted to the signal by the return flow path of signal by the USB connector 13 Manage chip 11.

As shown in fig. 5-1, the signal transmitting apparatus 1 can also include：Power supply board H, the power supply board H side can be with Formed with voltage signal layer, the voltage signal layer can include：Voltage signal line D1 and voltage signal line D2, the power management core Piece 12 can be connected by two voltage signal lines with two single data signal wires.Example, voltage signal line D1 one end can To be connected with power management chip 12, the voltage signal line D1 other end can be connected with data signal line C1, power supply pipe Reason chip 12 can pass through the voltage on voltage signal line D1 gathered data signal wires C1；Voltage signal line D2 one end can be with Power management chip 12 is connected, and the voltage signal line D2 other end can be connected with data signal line C2, power management core Piece 12 can pass through the voltage on voltage signal line D2 gathered data signal wires C2.

In summary, due to the embodiment of the present disclosure provide signal transmitting apparatus in, on the one hand, when signal processing chip with When the USB connector transmits high-frequency signal by the data signal line, the adjustment unit is capable of the signal of blocking voltage signal wire Transmission so that when data signal line transmits high-frequency signal, do not influenceed by voltage signal line；On the other hand, two radicals it is believed that The sectional area of any one single data signal wire in number line is more than the sectional area of data signal line in correlation technique so that the data The resistance of signal wire is less than the resistance of data signal line in correlation technique, the electricity on the data signal line obtained using oscillograph Buckling is big so that the slope increase of eye pattern corresponding to the signal transmitted on data signal line；The data obtained by oscillograph are believed The eye pattern of transmission signal is close to outside standard eye pattern mask on number line, so, improve the signal matter transmitted on data signal line Amount, improve the accuracy of signal transmission.

Fig. 6-1 is the structural representation of the 8th kind of signal transmitting apparatus 1 according to an exemplary embodiment, as Fig. 6- Shown in 1, the signal transmitting apparatus 1 can include：Signal processing chip 11, power management chip 12, USB connector 13 and signal Substrate 14.

Example, the side of the signal substrate 14 could be formed with data-signal layer, and the data-signal layer can include two Single data signal wire, the two single datas signal wire is respectively data signal line C1 and data signal line C2；The signal processing chip 11 can be connected with USB connector 13 by data signal line C1 and data signal line C2；Power management chip 12 can lead to Overvoltage signal line D1 and voltage signal line D2 are connected with data signal line C1 and data signal line C2 respectively, the voltage signal Adjustment unit E can be in series with any voltage signal wire in line D1 and voltage signal line D2, adjustment unit E can be used for The signal transmission of blocking voltage signal wire when voltage signal line transmits high-frequency signal, when voltage signal line transmits low frequency signal The signal transmission of conducting voltage signal wire.Any one single data signal wire and reference planes (Fig. 6-1 in two single data signal wires Not shown in) distance be more than 25 μm, it is necessary to explanation, the letter of two single data signal wires can be provided with the reference planes Number return flow path.

Example, signal processing chip 11 generate signal can be transmitted along data signal line C1 and data signal line C2 to The USB connector 13, and the signal for being generated the signal processing chip 11 by the USB connector 13 in plane by reference to setting The return flow path of signal transmit to the signal processing chip 11.

Optionally, Fig. 6-2 is that the partial cross section of another signal transmitting apparatus 1 according to an exemplary embodiment shows It is intended to, as in fig. 6-2, the signal transmitting apparatus 1 can also include：First shielding board 15 and secondary shielding substrate 16, and First shielding board 15, signal substrate 14, secondary shielding substrate 16 are sequentially overlapped.First shielding board 15 is away from signal substrate 14 side is formed formed with the first additional signal layer 151 on the first shielding board 15 formed with the first additional signal layer 151 There is first screen layer 152；Side of the secondary shielding substrate 16 away from signal substrate 14 is formed with the second additional signal layer 161, shape Formed with secondary shielding layer 162 on into the secondary shielding substrate 16 for having the second additional signal layer 161；First shielding board 15 and number According between signals layer, and between secondary shielding substrate 16 and signal substrate 14, it is each formed with bonding glue-line 17；First screen layer 152 close to the surface of data-signal layer and secondary shielding layer 162 be reference planes M close to the surface of data-signal layer.That is this public affairs Open in embodiment, the opposite side of the signal substrate 14 is simultaneously formed without earth mat layer, and the opposite side of the signal substrate is only simply formed with The other structures 143 equal with the thickness of ground stratum reticulare.

Optionally, the thickness of each substrate in above-mentioned first shielding board 15, signal substrate 14 and secondary shielding substrate 16 Degree can be 25 μm, and the thickness of the bonding glue-line 17 can be equal to 25 μm, the additional letter of the first additional signal layer 151, second Number floor 161, data-signal floor, the thickness of the other structures 143 equal with the thickness of ground stratum reticulare can be 12 μm, now, when Reference planes M be first screen layer 152 close to the surface of data-signal layer when, reference planes M and data signal line C1, data Signal wire C2 distance be 62 μm, when reference planes M be secondary shielding layer 162 close to the surface of data-signal layer when, the reference Plane M and data signal line C1, data signal line C2 distance are 99 μm.It can be seen that in the embodiment of the present disclosure, number 25 μm of the distance of data signal line and reference planes in correlation technique is all higher than according to the distance of signal wire and reference planes.

As in Figure 6-1, the signal transmitting apparatus 1 can also include：Power supply board H, the power supply board H side can be with Formed with voltage signal layer, the voltage signal layer can include：Voltage signal line D1 and voltage signal line D2, the power management core Piece 12 can be connected by two voltage signal lines with two single data signal wires.Example, voltage signal line D1 one end can To be connected with power management chip 12, the voltage signal line D1 other end can be connected with data signal line C1, power supply pipe Reason chip 12 can pass through the voltage on voltage signal line D1 gathered data signal wires C1；Voltage signal line D2 one end can be with Power management chip 12 is connected, and the voltage signal line D2 other end can be connected with data signal line C2, power management core Piece 12 can pass through the voltage on voltage signal line D2 gathered data signal wires C2.

In summary, in the signal transmitting apparatus provided due to the embodiment of the present disclosure, on the one hand, in two single data signal wires Any one single data signal wire and reference planes distance be more than correlation technique in the distance of data signal line and reference planes, Therefore, the electric capacity smaller capacitive that data signal line is formed with reference planes in the signal transmitting apparatus that the embodiment of the present disclosure provides Charging interval is smaller, i.e., the voltage at data signal line both ends becomes big speed so that the signal transmitted on data signal line The slope increase of corresponding eye pattern；On the other hand, when signal processing chip is transmitted with the USB connector by the data signal line During high-frequency signal, the adjustment unit is capable of the signal transmission of blocking voltage signal wire so that in data signal line transmission high frequency letter Number when, do not influenceed by voltage signal line, so, the eye pattern of transmission signal is to mark on the data signal line obtained by oscillograph It is close outside quasi- eye pattern mask, so, the signal quality transmitted on data signal line is improved, improves the accurate of signal transmission Property.

Fig. 7-1 is the structural representation of the 9th kind of signal transmitting apparatus 1 according to an exemplary embodiment, as Fig. 7- Shown in 1, the signal transmitting apparatus 1 can include：Signal processing chip 11, USB connector 13 and signal substrate 14.

Example, the side of the signal substrate 14 could be formed with data-signal layer, and the data-signal layer can include two Single data signal wire, the two single datas signal wire is respectively data signal line C1 and data signal line C2；Signal processing chip 11 Can be connected with USB connector 13 by the two single datas signal wire, any one radical in the two single datas signal wire it is believed that The sectional area S of number line is more than 600 μm², the sectional area S of any one single data signal wire is this two in the two single datas signal wire The area S in the section of any one single data signal wire in data signal line.Any one single data in two single data signal wires Signal wire and reference planes M distance are more than 25 μm, it is necessary to explanation, and two single datas can be provided with reference planes M The return flow path of the signal of signal wire.

Optionally, Fig. 7-2 is that a kind of partial cross section of signal transmitting apparatus 1 according to another exemplary embodiment shows It is intended to, as shown in Fig. 7-2, data signal line C1 and data signal line C2 can be bar signal line, the data signal line The width U of any one single data signal wire in C1 and data signal line C2 can be equal to 50 μm, any one single data signal wire Thickness V can be more than 12 μm, example, the thickness V of any one single data signal wire can be 18 μm.When the data signal line For bar signal line when, the sectional area of the data signal line multiplies for the width U of data signal line and the thickness V of data signal line Product.In correlation technique, the width of data signal line is equal to 50 μm, and the thickness of data signal line is equal to 12 μm, i.e., in correlation technique The sectional area of data signal line is equal to 600 μm².In the signal transmitting apparatus that the embodiment of the present disclosure provides, due to data signal line Width it is equal with the width of data signal line in correlation technique, and the thickness of data signal line be more than correlation technique in data believe The thickness of number line, therefore in the signal transmitting apparatus that provides of the embodiment of the present disclosure, the sectional area of data signal line is more than related skill The sectional area of data during operation signal wire.It should be noted that data-signal in the signal transmitting apparatus that the embodiment of the present disclosure provides The material of line can be identical with the material of data signal line in correlation technique, in the signal transmitting apparatus that the embodiment of the present disclosure provides The length of data signal line can be with the equal length of data signal line in correlation technique.

As shown in Fig. 7-2, the signal transmitting apparatus 1 can also include：First shielding board 15 and secondary shielding substrate 16, And first shielding board 15, signal substrate 14, secondary shielding substrate 16 are sequentially overlapped.First shielding board 15 is away from signal base The side of plate 14 is formed with the first additional signal layer 151, shape on the first shielding board 15 formed with the first additional signal layer 151 Into there is first screen layer 152；Side of the secondary shielding substrate 16 away from signal substrate 14 formed with the second additional signal layer 161, Formed with secondary shielding layer 162 on secondary shielding substrate 16 formed with the second additional signal layer 161；First shielding board 15 with Between data-signal layer, and between secondary shielding substrate 16 and signal substrate 14, it is each formed with bonding glue-line 17；First shielding Layer 152 is reference planes M close to the surface of data-signal layer close to the surface of data-signal layer and secondary shielding layer 162.I.e. originally In open embodiment, the opposite side of the signal substrate 14 is simultaneously formed without earth mat layer, and the opposite side of the signal substrate is only formed There are the other structures 143 equal with the thickness of ground stratum reticulare.

Example, the thickness of each substrate in above-mentioned first shielding board 15, signal substrate 14 and secondary shielding substrate 16 Degree can be 25 μm, and the thickness of the bonding glue-line 17 can be equal to 25 μm, the additional letter of the first additional signal layer 151, second Number floor 161, the thickness of the other structures 143 equal with the thickness of ground stratum reticulare can be 12 μm, the thickness of the data-signal layer Can be 18 μm, now, when reference planes M be first screen layer 152 close to the surface of data-signal layer when, reference planes M Distance with data signal line C1, data signal line C2 is 62 μm, when reference planes M is that secondary shielding layer 162 is believed close to data During the surface of number floor, reference planes M and data signal line C1, data signal line C2 distance are 99 μm.It is possible thereby to see Go out in the embodiment of the present disclosure, the distance of data signal line and reference planes is all higher than data signal line in correlation technique and put down with reference 25 μm of the distance in face.

Fig. 7-3 is the structural representation of the tenth kind of signal transmitting apparatus 1 according to an exemplary embodiment, as Fig. 7- Shown in 3, the signal transmitting apparatus 1 can also include：Power management chip 12 and power supply board H, power supply board H side can Can include formed with voltage signal layer, the voltage signal layer：Voltage signal line D1 and voltage signal line D2, the power management Chip 12 can be connected by two voltage signal lines with two single data signal wires.Example, voltage signal line D1 one end It can be connected with power management chip 12, the voltage signal line D1 other end can be connected with data signal line C1, power supply Managing chip 12 can pass through the voltage on voltage signal line D1 gathered data signal wires C1；Voltage signal line D2 one end can be with It is connected with power management chip 12, the voltage signal line D2 other end can be connected with data signal line C2, power management Chip 12 can pass through the voltage on voltage signal line D2 gathered data signal wires C2.

In summary, in the signal transmitting apparatus provided due to the embodiment of the present disclosure, on the one hand, in two single data signal wires Any one single data signal wire and reference planes distance be more than correlation technique in the distance of data signal line and reference planes, Therefore, the electric capacity smaller capacitive that data signal line is formed with reference planes in the signal transmitting apparatus that the embodiment of the present disclosure provides Charging interval is smaller, and on the other hand, the sectional area of any one single data signal wire in two single data signal wires is more than related skill The sectional area of data during operation signal wire.The voltage on the data signal line obtained using oscillograph becomes big.On data signal line The slope increase of eye pattern corresponding to the signal of transmission, the eye pattern of transmission signal is to mark on the data signal line obtained by oscillograph Close outside quasi- eye pattern mask, the eye pattern of transmission signal leans on to outside standard eye pattern mask on the data signal line obtained by oscillograph Closely, so, the signal quality transmitted on data signal line is improved, improves the accuracy of signal transmission.

Fig. 8-1 is the tenth a kind of structural representation of signal transmitting apparatus 1 according to an exemplary embodiment, is such as schemed Shown in 8-1, the signal transmitting apparatus 1 can include：Signal processing chip 11, power management chip 12, USB connector 13 and letter Number substrate 14.

Example, the side of the signal substrate 14 could be formed with data-signal layer, and the data-signal layer can include two Single data signal wire, the two single datas signal wire is respectively data signal line C1 and data signal line C2；Signal processing chip 11 Can be connected with USB connector 13 by the two single datas signal wire, any one radical in the two single datas signal wire it is believed that The sectional area of number line is more than 600 μm², the sectional area of data signal line is the area in the section of data signal line.Two radicals it is believed that The distance of any one single data signal wire and reference planes (not shown in Fig. 8-1) in number line is more than 25 μm, it is necessary to explanation It is that the return flow path of the signal of two single data signal wires can be provided with the reference planes.

Power management chip 12 can by voltage signal line D1 and voltage signal line D2 respectively with data signal line C1 and Data signal line C2 is connected, and can be in series with any voltage signal wire in the voltage signal line D1 and voltage signal line D2 The signal that adjustment unit E, adjustment unit E can be used for the blocking voltage signal wire when voltage signal line transmits high-frequency signal passes It is defeated, the signal transmission of conducting voltage signal wire when voltage signal line transmits low frequency signal.

Optionally, the adjustment unit E in Fig. 8-1 can be magnetic bead group, and each magnetic bead group can include at least one magnetic bead, Two magnetic bead groups can be provided with the electric signal transmission device 1, example, the inductance parameters of any one magnetic bead group can be with For 1000 Ω (ohm).

On the one hand, magnetic bead group can be a magnetic bead, and now, the inductance parameters of a magnetic bead can be 1000 Ω, should Adjustment unit can be magnetic bead group, and each magnetic bead group can include a magnetic bead, i.e. the voltage signal line D1 and voltage signal line Can connect a magnetic bead respectively on D2.Fig. 2-3 is a kind of inductance parameters of magnetic bead according to an exemplary embodiment Schematic diagram, as Figure 2-3, when the frequency f of the signal on magnetic bead is relatively low, the resistance R of the magnetic bead is smaller, the inductance Z of magnetic bead Smaller, when the frequency f of the signal on magnetic bead is higher, the resistance R of the magnetic bead is larger, and the inductance Z of magnetic bead is larger.I.e. when the magnetic bead On the frequency of signal when being low frequency, the resistance of the magnetic bead is smaller, and voltage signal line is path, when the frequency of the signal on magnetic bead For high frequency when, the resistance of the magnetic bead is larger, and voltage signal line is equivalent to open circuit.It should be noted that resistance R unit can be Ω, frequency f unit can be MHz.Optionally, when the frequency of the signal transmitted on data signal line is 480MHz, the number Transmission rate according to signal on signal wire can be 480Mbps, and now, the resistance of the magnetic bead is more than 1000 Ω, i.e. magnetic bead electricity Hinder larger, for the voltage signal line equivalent to open circuit, the signal quality transmitted on the data signal line is preferable, signal transmission it is accurate Property is higher.

Example, in the signal transmitting apparatus that the embodiment of the present disclosure provides, due to data signal line and voltage signal line phase Connection, therefore, the frequency of transmission signal is equal on the data signal line and voltage signal line, when what is transmitted on the data signal line When the frequency of signal is relatively low, the adjustment unit connected on the voltage signal line can turn on the signal transmission of the voltage signal line, The power management chip being connected with the voltage signal line can by the voltage on voltage signal line gathered data signal wire, and The power supply in terminal is managed according to the voltage of collection.When the frequency of the signal transmitted on the data signal line is higher, The adjustment unit connected on the voltage signal line is capable of the signal transmission of blocking voltage signal wire, is connected with the voltage signal line Power management chip can not be by the voltage on voltage signal line gathered data signal wire, now, the signal processing chip can To carry out the transmission of signal by the data signal line and the USB connector.And due to now being transmitted on the data signal line The frequency of signal is higher, therefore, the speed of the signal now transmitted on data signal line, signal transmission efficiency it is higher.

Optionally, Fig. 8-2 is the partial cross section of another signal transmitting apparatus 1 according to another exemplary embodiment Schematic diagram, as shown in Fig. 8-2, data signal line C1 and data signal line C2 can be bar signal line, the data-signal The width U of any one single data signal wire in line C1 and data signal line C2 can be equal to 50 μm, any one single data signal The thickness V of line can be more than 12 μm, example, and the thickness V of any one single data signal wire can be 18 μm.When the data-signal When line is bar signal line, the sectional area of the data signal line is the width U of data signal line and the thickness V of data signal line Product.In correlation technique, the width of data signal line is equal to 50 μm, and the thickness of data signal line is equal to 12 μm, i.e. correlation technique The sectional area of middle data signal line is equal to 600 μm².In the signal transmitting apparatus that the embodiment of the present disclosure provides, due to data-signal The width of line is equal with the width of data signal line in correlation technique, and the thickness of data signal line is more than data in correlation technique The thickness of signal wire, therefore in the signal transmitting apparatus of embodiment of the present disclosure offer, the sectional area of data signal line is more than correlation The sectional area of data signal line in technology.It should be noted that data are believed in the signal transmitting apparatus that the embodiment of the present disclosure provides The material of number line can be identical with the material of data signal line in correlation technique, the signal transmitting apparatus that the embodiment of the present disclosure provides The length of middle data signal line can be with the equal length of data signal line in correlation technique.

As shown in Fig. 8-2, the signal transmitting apparatus 1 can also include：First shielding board 15 and secondary shielding substrate 16, And first shielding board 15, signal substrate 14, secondary shielding substrate 16 are sequentially overlapped.First shielding board 15 is away from signal base The side of plate 14 is formed with the first additional signal layer 151, shape on the first shielding board 15 formed with the first additional signal layer 151 Into there is first screen layer 152；Side of the secondary shielding substrate 16 away from signal substrate 14 formed with the second additional signal layer 161, Formed with secondary shielding layer 162 on secondary shielding substrate 16 formed with the second additional signal layer 161；First shielding board 15 with Between data-signal layer, and between secondary shielding substrate 16 and signal substrate 14, it is each formed with bonding glue-line 17；First shielding Layer 152 is reference planes M close to the surface of data-signal layer close to the surface of data-signal layer and secondary shielding layer 162.I.e. originally In open embodiment, the opposite side of the signal substrate 14 is simultaneously formed without earth mat layer, and the opposite side of the signal substrate is only formed There are the other structures 143 equal with the thickness of ground stratum reticulare.

In a first aspect, each substrate in above-mentioned first shielding board 15, signal substrate 14 and secondary shielding substrate 16 Thickness can be 25 μm, and the thickness of the bonding glue-line 17 can be equal to 25 μm, and the first additional signal layer 151, second is additional The thickness of signals layer 161 and data-signal layer can be 18 μm, the thickness of the other structures 143 equal with the thickness of ground stratum reticulare Can be 12 μm, now, when reference planes M be first screen layer 152 close to the surface of data-signal layer when, reference planes M Distance with data signal line C1, data signal line C2 is 68 μm, when reference planes M is that secondary shielding layer 162 is believed close to data During the surface of number floor, reference planes M and data signal line C1, data signal line C2 distance are 105 μm.It is possible thereby to see Go out in the embodiment of the present disclosure, the distance of data signal line and reference planes is all higher than data signal line in correlation technique and put down with reference 25 μm of the distance in face.

Second aspect, each substrate in above-mentioned first shielding board 15, signal substrate 14 and secondary shielding substrate 16 Thickness can also be 25 μm, and the thickness for bonding glue-line 17 can also be 15 μm, the additional letter of the first additional signal layer 151, second Number floor 161, the thickness of the other structures 143 equal with the thickness of ground stratum reticulare can be 12 μm, and the thickness of data-signal layer can Think 18 μm, now, when reference planes M be first screen layer 152 close to the surface of data-signal layer when, reference planes M with Data signal line C1, data signal line C2 distance be 52 μm, when reference planes M be secondary shielding layer 162 close to data-signal During the surface of layer, reference planes M and data signal line C1, data signal line C2 distance are 89 μm.It can be seen that In the embodiment of the present disclosure, the distance of data signal line and reference planes is all higher than data signal line and reference planes in correlation technique 25 μm of distance.

The third aspect, each substrate in above-mentioned first shielding board 15, signal substrate 14 and secondary shielding substrate 16 Thickness can be 25 μm, and the thickness of the bonding glue-line 17 can be equal to 15 μm, and the first additional signal layer 151, second is additional The thickness of signals layer 161 and data-signal layer can be 18 μm, the thickness of the other structures 143 equal with the thickness of ground stratum reticulare Can be 12 μm, now, when reference planes M be first screen layer 152 close to the surface of data-signal layer when, reference planes M Distance with data signal line C1, data signal line C2 is 58 μm, when reference planes M is that secondary shielding layer 162 is believed close to data During the surface of number floor, reference planes M and data signal line C1, data signal line C2 distance are 95 μm.It is possible thereby to see Go out in the embodiment of the present disclosure, the distance of data signal line and reference planes is all higher than data signal line in correlation technique and put down with reference 25 μm of the distance in face.

Fourth aspect, each substrate in above-mentioned first shielding board 15, signal substrate 14 and secondary shielding substrate 16 Thickness can be 25 μm, and the thickness of the bonding glue-line 17 can be equal to 25 μm, and the first additional signal layer 151, second is additional Signals layer 161, the thickness of the other structures 143 equal with the thickness of ground stratum reticulare can be 12 μm, the thickness of data-signal layer Can be 18 μm, now, when reference planes M be first screen layer 152 close to the surface of data-signal layer when, reference planes M Distance with data signal line C1, data signal line C2 is 62 μm, when reference planes M is that secondary shielding layer 162 is believed close to data During the surface of number floor, reference planes M and data signal line C1, data signal line C2 distance are 99 μm.It is possible thereby to see Go out in the embodiment of the present disclosure, the distance of data signal line and reference planes is all higher than data signal line in correlation technique and put down with reference 25 μm of the distance in face.

As shown in Fig. 8-1, the signal transmitting apparatus 1 can also include：Power supply board H, the power supply board H side can be with Formed with voltage signal layer, the voltage signal layer can include：Voltage signal line D1 and voltage signal line D2, the power management core Piece 12 can be connected by two voltage signal lines with two single data signal wires.Example, voltage signal line D1 one end can To be connected with power management chip 12, the voltage signal line D1 other end can be connected with data signal line C1, power supply pipe Reason chip 12 can pass through the voltage on voltage signal line D1 gathered data signal wires C1；Voltage signal line D2 one end can be with Power management chip 12 is connected, and the voltage signal line D2 other end can be connected with data signal line C2, power management core Piece 12 can pass through the voltage on voltage signal line D2 gathered data signal wires C2.

It should be noted that in the signal transmitting apparatus 1 that the embodiment of the present disclosure provides, the spy of any one single data signal wire Property impedance can be equal to 90 Ω, i.e. the characteristic impedance of data signal line C1 and data signal line C2 are equal to 90 Ω, when any When the characteristic impedance of a data signal wire is equal to 90 Ω, the quality of the signal transmitted on the data signal line is preferable.Optionally, The voltage signal line D1 and voltage signal line D2 characteristic impedance can also be equal to 90 Ω.Example, Fig. 8-3 is according to an example Property implement a kind of eye pattern schematic diagram for exemplifying, as shown in Fig. 8-3, in the signal transmitting apparatus that the embodiment of the present disclosure provides, number According to eye pattern P1 corresponding to the preferable signal of the quality transmitted on signal wire, outside standard eye pattern Q.As can be seen here, the disclosure The signal quality transmitted on data signal line in the signal transmitting apparatus that embodiment provides is preferable, data signal line transmission letter Number accuracy it is higher.

In summary, in the signal transmitting apparatus provided due to the embodiment of the present disclosure, in a first aspect, working as signal processing chip When transmitting high-frequency signal by the data signal line with the USB connector, the adjustment unit is capable of the letter of blocking voltage signal wire Number transmission so that data signal line transmit high-frequency signal when, do not influenceed by voltage signal line；Second aspect, two single datas It is flat that the distance of any one single data signal wire and reference planes in signal wire is more than data signal line and reference in correlation technique The distance in face, therefore, the electric capacity that data signal line is formed with reference planes in the signal transmitting apparatus that the embodiment of the present disclosure provides The charging interval of smaller capacitive is smaller, the third aspect, the section of any one single data signal wire in the two single datas signal wire Product is more than the sectional area of data signal line in correlation technique.The voltage on the data signal line obtained using oscillograph becomes big. The slope increase of eye pattern corresponding to the signal transmitted on data signal line, believed by being transmitted on the data signal line of oscillograph acquisition Number eye pattern it is close to outside standard eye pattern mask, the eye pattern of transmission signal is to standard on the data signal line obtained by oscillograph It is close outside eye pattern mask, so, the signal quality transmitted on data signal line is improved, improves the accuracy of signal transmission.

The embodiment of the present disclosure provides a kind of terminal, and the terminal can be included such as Fig. 2-1, Fig. 3-1, Fig. 4-1, Fig. 5-1, figure Signal transmitting apparatus 1 shown in 6-1, Fig. 7-1 or Fig. 8-1.Example, the terminal can be wide for mobile phone, computer, numeral Broadcast terminal, messaging devices, game console, tablet device, Medical Devices, body-building equipment or personal digital assistant.

In summary, in the signal transmitting apparatus in the terminal provided due to the embodiment of the present disclosure, with power management chip Adjustment unit is in series with the voltage signal line being connected, and the adjustment unit is used for when voltage signal line transmits high-frequency signal The signal transmission of blocking voltage signal wire, the signal transmission of conducting voltage signal wire when voltage signal line transmits low frequency signal. When the signal processing chip and the USB connector transmit high-frequency signal by the data signal line, the adjustment unit can hinder The signal transmission of power-off pressure signal wire so that when data signal line transmits high-frequency signal, do not influenceed by voltage signal line, institute To improve the signal quality transmitted on data signal line, improve the accuracy of signal transmission.

Those skilled in the art will readily occur to the disclosure its after considering specification and putting into practice invention disclosed herein Its embodiment.The application is intended to any modification, purposes or the adaptations of the disclosure, these modifications, purposes or Person's adaptations follow the general principle of the disclosure and including the undocumented common knowledges in the art of the disclosure Or conventional techniques.Description and embodiments are considered only as exemplary, and the true scope of the disclosure and spirit are by following Claim is pointed out.

It should be appreciated that the precision architecture that the disclosure is not limited to be described above and is shown in the drawings, and And various modifications and changes can be being carried out without departing from the scope.The scope of the present disclosure is only limited by appended claim.

Claims

1. a kind of signal transmitting apparatus, it is characterised in that the signal transmitting apparatus includes：

Signal substrate, the first shielding board, signal processing chip and general-purpose serial bus USB connector,

The signal substrate includes close to the side of first shielding board formed with data-signal layer, the data-signal layer Two single data signal wires；

The signal processing chip is connected with the USB connector by the two single datas signal wire, any data The sectional area of signal wire is more than 600 μm²；

The side of first shielding board away from the signal substrate is formed with the first additional signal layer, formed with described first Formed with first screen layer on first shielding board of additional signal layer, first shielding board and the data-signal layer it Between formed with bonding glue-line, the first screen layer is reference planes close to the surface of the data-signal layer.

2. signal transmitting apparatus according to claim 1, it is characterised in that

The data signal line is bar signal line, and the width of any data signal line is equal to 50 μm, any data The thickness of signal wire is more than 12 μm.

3. signal transmitting apparatus according to claim 2, it is characterised in that

The thickness of any data signal line is 18 μm.

4. signal transmitting apparatus according to claim 1, it is characterised in that

The distance of any data signal line and reference planes is more than 25 μm, and two radical is provided with the reference planes According to the return flow path of the signal of signal wire.

5. signal transmitting apparatus according to claim 4, it is characterised in that the signal transmitting apparatus also includes：Second Shielding board, first shielding board, the signal substrate, the secondary shielding substrate are sequentially overlapped,

The side of the secondary shielding substrate away from the signal substrate is formed with the second additional signal layer, formed with described second Formed with secondary shielding layer on the secondary shielding substrate of additional signal layer；

Formed with bonding glue-line between the secondary shielding substrate and the signal substrate；

The first screen layer is close to the surface of the data-signal layer and the secondary shielding layer close to the data-signal layer Surface be the reference planes.

6. signal transmitting apparatus according to claim 1, it is characterised in that the signal transmitting apparatus also includes：Second Shielding board,

First shielding board, the signal substrate, the secondary shielding substrate are sequentially overlapped, and the signal substrate is away from institute The side of the first shielding board is stated formed with ground stratum reticulare；

Formed with bonding glue-line between the secondary shielding substrate and described ground stratum reticulare.

7. signal transmitting apparatus according to claim 1, it is characterised in that the signal transmitting apparatus also includes：Power supply Managing chip and power supply board,

The side of the power supply board includes formed with voltage signal layer, the voltage signal layer：Two voltage signal lines, it is described Power management chip is connected by two voltage signal lines with the two single datas signal wire.

8. signal transmitting apparatus according to claim 1, it is characterised in that

The characteristic impedance of any data signal line is equal to 90 Ω.

9. a kind of terminal, it is characterised in that the terminal includes the signal transmitting apparatus as described in claim 1 to 8 is any.