CN105159856A

CN105159856A - Signal transmission apparatus and terminal

Info

Publication number: CN105159856A
Application number: CN201510524478.9A
Authority: CN
Inventors: 赵青晖; 杨大伟; 郝宁
Original assignee: Xiaomi Inc
Current assignee: Beijing Xiaomi Technology Co Ltd; Xiaomi Inc
Priority date: 2015-08-24
Filing date: 2015-08-24
Publication date: 2015-12-16
Anticipated expiration: 2035-08-24
Also published as: CN105159856B

Abstract

The present disclosure relates to a signal transmission apparatus and a terminal, and belongs to the field of electronic technology applications. The signal transmission apparatus comprises a signal processing chip, a power management chip and a universal serial bus (USB) connector. The signal processing chip is connected to the USB connector by means of two data signal lines; and the power management chip is connected to the two data signal lines by means of two voltage signal lines; and any one voltage signal line is connected in series to an adjustment unit; the adjustment unit is used for blocking signal transmission of the voltage signal line when the voltage signal line transmits a high-frequency signal and conducting signal transmission of the voltage signal line when the voltage signal line transmits a low-frequency signal. According to the signal transmission apparatus and the terminal provided by the present disclosure, the problems of relatively low quality of signals transmitted on the data signal line and relatively low accuracy of signal transmission are solved, and the effects of improving the quality of the signals transmitted on the data signal line and improving the accuracy of signal transmission are achieved; and the apparatus and the terminal are used for signal transmission.

Description

Signal transmitting apparatus and terminal

Technical field

The disclosure relates to application of electronic technology field, particularly a kind of signal transmitting apparatus and terminal.

Background technology

Mobile terminal is provided with signal processing chip and power management chip, and this signal processing chip is by two signal wires and USB (universal serial bus) (English: UniversalSerialBus; Be called for short: USB) connector is connected, and carries out the transmission of signal.Power management chip can gather the voltage on these two signal wires, and manages the power supply on this mobile terminal according to the voltage gathered.

In correlation technique, power management chip is integrated on this signal processing chip, signal processing chip can by carrying out the transmission of signal between two single data signal wires and USB connector, power management chip directly can gather the voltage on the two single data signal wires that are connected with signal processing chip.Along with the development of electronic technology, increasing manufacturer can produce the independently power management chip without the need to being integrated on signal processing chip, now, this power management chip is connected with two single data signal wires respectively by voltage signal line, carries out the collection of voltage on two single data signal wires.

Summary of the invention

Present disclose provides a kind of signal transmitting apparatus and terminal.Described technical scheme is as follows:

According to first aspect of the present disclosure, provide a kind of signal transmitting apparatus, described signal transmitting apparatus comprises: signal processing chip, power management chip and general-purpose serial bus USB connector,

Described signal processing chip is connected by two single data signal wires with described USB connector;

Described power management chip is connected with described two single data signal wires respectively by two voltage signal lines, arbitrary described voltage signal line is in series with regulon, described regulon is used for the Signal transmissions blocking described voltage signal line when described voltage signal line transmitting high-frequency signal, the Signal transmissions of voltage signal line described in conducting when voltage signal line transmission low frequency signal.

Optionally, described regulon is magnetic bead group, and each described magnetic bead group comprises at least one magnetic bead.

Optionally, the inductance parameters of arbitrary described magnetic bead group is 1000 Ω.

Optionally, described magnetic bead group is a magnetic bead;

Or described magnetic bead group is made up of the magnetic bead of at least two serial or parallel connections.

Optionally, described signal transmitting apparatus also comprises: signal substrate,

The side of described signal substrate is formed with data-signal layer, and described data-signal layer comprises described two single data signal wires, and the sectional area of arbitrary described data signal line is greater than 600 μm ².

Optionally, the distance of arbitrary described data signal line and reference planes is greater than 25 μm, described reference planes is provided with the return flow path of the signal of described two single data signal wires.

Optionally, described signal transmitting apparatus also comprises: the first shielding board and secondary shielding substrate, and described first shielding board, described signal substrate, described secondary shielding substrate superpose successively,

Described first shielding board is formed with the first additional signal layer away from the side of described signal substrate, and the first shielding board being formed with described first additional signal layer is formed with the first screen layer;

Described secondary shielding substrate is formed with the second additional signal layer away from the side of described signal substrate, and the secondary shielding substrate being formed with described second additional signal layer is formed with secondary shielding layer;

Between described first shielding board and described data-signal layer, and between described secondary shielding substrate and described signal substrate, be all formed with bonding glue-line;

Described first screen layer is described reference planes near the surface of described data-signal layer and described secondary shielding layer near the surface of described data-signal layer.

Optionally, the characteristic impedance of arbitrary described data signal line equals 90 Ω.

According to second aspect of the present disclosure, provide a kind of terminal, described terminal comprises the signal transmitting apparatus described in first aspect.

The technical scheme that the disclosure provides can comprise following beneficial effect:

Present disclose provides a kind of signal transmitting apparatus and terminal, due in this signal transmitting apparatus, the voltage signal line be connected with power management chip is in series with regulon, and this regulon is used for the Signal transmissions of the blocking voltage signal wire when voltage signal line transmitting high-frequency signal, the Signal transmissions of forward voltage signal wire when voltage signal line transmission low frequency signal.When this signal processing chip and this USB connector are by this data signal line transmitting high-frequency signal, this regulon can the Signal transmissions of blocking voltage signal wire, make when data signal line transmitting high-frequency signal, not by the impact of voltage signal wire, so, improve the signal quality that data signal line transmits, improve the accuracy of Signal transmissions.

Should be understood that, it is only exemplary that above general description and details hereinafter describe, and can not limit the disclosure.

Accompanying drawing explanation

In order to be illustrated more clearly in embodiment of the present disclosure, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only embodiments more of the present disclosure, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.

Fig. 1-1 is the structural representation of a kind of signal transmitting apparatus according to correlation technique;

Fig. 1-2 is the partial cutaway schematic of a kind of signal transmitting apparatus according to correlation technique;

Fig. 1-3 is a kind of eye pattern schematic diagram according to correlation technique;

Fig. 2-1 is the structural representation of the first signal transmitting apparatus according to an exemplary embodiment;

Fig. 2-2 is the structural representation of the second signal transmitting apparatus according to an exemplary embodiment;

Fig. 2-3 is the inductance parameters schematic diagram of a kind of magnetic bead according to an exemplary embodiment;

Fig. 3-1 is the structural representation of the third signal transmitting apparatus according to an exemplary embodiment;

Fig. 3-2 is the schematic partial cross-sectional view of a kind of signal transmitting apparatus according to an exemplary embodiment;

Fig. 3-3 is the partial structurtes schematic diagram of a kind of signal transmitting apparatus according to correlation technique;

Fig. 3-4 is the structural representation of the 4th kind of signal transmitting apparatus according to an exemplary embodiment;

Fig. 4-1 is the structural representation of the 5th kind of signal transmitting apparatus according to an exemplary embodiment;

Fig. 4-2 is the schematic partial cross-sectional view of the another kind of signal transmitting apparatus according to an exemplary embodiment;

Fig. 4-3 is the structural representation of the 6th kind of signal transmitting apparatus according to an exemplary embodiment;

Fig. 5-1 is the structural representation of the 7th kind of signal transmitting apparatus according to an exemplary embodiment;

Fig. 5-2 is the schematic partial cross-sectional view of another signal transmitting apparatus according to an exemplary embodiment;

Fig. 6-1 is the structural representation of the 8th kind of signal transmitting apparatus according to an exemplary embodiment;

Fig. 6-2 is the schematic partial cross-sectional view of another signal transmitting apparatus according to an exemplary embodiment;

Fig. 7-1 is the structural representation of the 9th kind of signal transmitting apparatus according to an exemplary embodiment;

Fig. 7-2 is the schematic partial cross-sectional view of a kind of signal transmitting apparatus according to another exemplary embodiment;

Fig. 7-3 is the structural representation of the tenth kind of signal transmitting apparatus according to an exemplary embodiment;

Fig. 8-1 is the structural representation of the 11 kind of signal transmitting apparatus according to an exemplary embodiment;

Fig. 8-2 is the schematic partial cross-sectional view of the another kind of signal transmitting apparatus according to another exemplary embodiment;

Fig. 8-3 is a kind of eye pattern schematic diagram according to an exemplary embodiment.

Accompanying drawing to be herein merged in instructions and to form the part of this instructions, shows embodiment according to the invention, and is used from instructions one and explains principle of the present invention.

Embodiment

In order to make object of the present disclosure, technical scheme and advantage clearly, be described in further detail the disclosure below in conjunction with accompanying drawing, obviously, described embodiment is only a part of embodiment of the disclosure, instead of whole embodiments.Based on the embodiment in the disclosure, those of ordinary skill in the art are not making other embodiments all obtained under creative work prerequisite, all belong to the scope of disclosure protection.

Fig. 1-1 is the structural representation of a kind of signal transmitting apparatus according to correlation technique, as Figure 1-1, this signal transmitting apparatus 0 can comprise: signal processing chip 01, power management chip 02 and USB connector 03, example, this signal transmitting apparatus 0 can be arranged in mobile terminal (Fig. 1-1 is not shown), this mobile terminal can also be provided with power supply (not shown in Fig. 1-1).

Signal processing chip 01 can be connected with USB connector 03 by data signal line A1, data signal line A2, carries out the transmission of signal with this USB connector 03, and data signal line A1 and data signal line A2 can be differential data signals line.Power management chip 02 is connected with data signal line A1, data signal line A2 respectively by voltage signal line B1, voltage signal line B2, carries out the collection of voltage on data signal line A1, data signal line A2.Optionally, one end of voltage signal line B1 is connected with power management chip 02, and the other end of voltage signal line B1 is connected with data signal line A1, and power management chip 02 can by the voltage on voltage signal line B1 image data signal wire A1; One end of voltage signal line B2 is connected with power management chip 02, and the other end of voltage signal line B2 is connected with data signal line A2, and power management chip 02 can by the voltage on voltage signal line B2 image data signal wire A2.This power management chip 02, after collecting the voltage on data signal line A1 and data signal line A2, can manage power supply according to the voltage collected.

Fig. 1-2 is the partial cutaway schematic of a kind of signal transmitting apparatus according to correlation technique, as shown in Figure 1-2, data signal line A1 and data signal line A2 is bar signal line, and the width of data signal line A1 and data signal line A2 is equal to 50 μm (microns), the thickness of data signal line A1 and data signal line A2 is equal to 12 μm, namely the sectional area of data signal line A1 and data signal line A2 be equal to 50 μm with the product 600 μm of 12 μm ²(square micron).This signal transmitting apparatus 0 can also comprise: signal substrate 04, this data signal line A1 and data signal line A2 can be formed at the side of signal substrate 04, the opposite side of this signal substrate 04 can be formed with ground stratum reticulare 042, ground stratum reticulare 042 can be provided with the return flow path of the signal of data signal line A1 and data signal line A2, this ground stratum reticulare 042 is reference planes M near the surface of this signal substrate 04, and the distance of data signal line A1 or data signal line A2 and this ground stratum reticulare 042 is 25 μm, namely the distance of this data signal line A1 or data signal line A2 and this reference planes M is 25 μm.

In correlation technique, by carrying out eye pattern test to the signal on data signal line, judge whether the signal quality on data signal line meets the requirements.Example, eye pattern corresponding to signal that data signal line transmits can be obtained by oscillograph, and eye pattern corresponding for the signal that data signal line transmits and standard eye pattern mask are compared, if the eye pattern that the signal that this data signal line transmits is corresponding is positioned at outside this standard eye pattern mask, then determine the satisfactory quality of the signal that this data signal line transmits; If the eye pattern that the signal that this data signal line transmits is corresponding is not positioned at outside this standard eye pattern mask, then determine that the quality of the signal that this data signal line transmits is undesirable.It should be noted that, oscillograph can be connected with data signal line by wire, the eye pattern that the signal that acquisition data signal line transmits is corresponding, the eye pattern that this oscillograph shows can reflect the voltage situation over time on the tie point of this wire and data signal line.

Example, undertaken in the process of Signal transmissions with USB connector 03 by data signal line A1 and data signal line A2 at this signal processing chip 01, owing to being connected to voltage signal line B1 on data signal line A1, data signal line A2 is connected to voltage signal line B2, the signal of transmission on this data signal line A1 is caused likely to transfer to this voltage signal line B1, on data signal line A2, the signal of transmission likely transfers to voltage signal line B2, makes signal transmission errors.When carrying out eye pattern test to the signal that data signal line A1 and data signal line A2 transmit, on the data signal line A1 obtained by oscillograph and data signal line A2, the eye pattern of signal transmission is not positioned at outside standard eye pattern mask.Fig. 1-3 is a kind of eye pattern schematic diagram according to correlation technique, and as Figure 1-3, in the signal transmitting apparatus in correlation technique, the eye pattern P that the second-rate signal that data signal line transmits is corresponding, is not positioned at outside this standard eye pattern Q.As can be seen here, the signal quality that the data signal line in the signal transmitting apparatus in correlation technique transmits is poor, and the accuracy of data signal line signal transmission is lower.

Fig. 2-1 is the structural representation of the first signal transmitting apparatus 1 according to an exemplary embodiment, and as shown in Fig. 2-1, this signal transmitting apparatus 1 can comprise: signal processing chip 11, power management chip 12 and USB connector 13.

This signal processing chip 11 can be connected with data signal line C2 by data signal line C1 with USB connector 13; Power management chip 12 can be connected with data signal line C2 with data signal line C1 with voltage signal line D2 respectively by voltage signal line D1, arbitrary voltage signal line in this voltage signal line D1 and voltage signal line D2 can be in series with regulon E, this regulon E may be used for the Signal transmissions of the blocking voltage signal wire when voltage signal line transmitting high-frequency signal, the Signal transmissions of forward voltage signal wire when voltage signal line transmission low frequency signal.

In sum, due in the signal transmitting apparatus that disclosure embodiment provides, the voltage signal line be connected with power management chip is in series with regulon, and this regulon is used for the Signal transmissions of the blocking voltage signal wire when voltage signal line transmitting high-frequency signal, the Signal transmissions of forward voltage signal wire when voltage signal line transmission low frequency signal.When this signal processing chip and this USB connector are by this data signal line transmitting high-frequency signal, this regulon can the Signal transmissions of blocking voltage signal wire, make when data signal line transmitting high-frequency signal, not by the impact of voltage signal wire, so, improve the signal quality that data signal line transmits, improve the accuracy of Signal transmissions.

Example, one end of voltage signal line D1 is connected with power management chip 12, and the other end of voltage signal line D1 is connected with data signal line C1, and power management chip 12 can by the voltage on voltage signal line D1 image data signal wire C1; One end of voltage signal line D2 can be connected with power management chip 12, and the other end of voltage signal line D2 is connected with data signal line C2, and power management chip 12 can by the voltage on voltage signal line D2 image data signal wire C2.Optionally, regulon E in Fig. 2-1 can be magnetic bead group, and each magnetic bead group can comprise at least one magnetic bead, namely can be provided with two magnetic bead groups in this electric signal transmission device 1, example, the inductance parameters of any one magnetic bead group can be 1000 Ω (ohm).

On the one hand, magnetic bead group can be a magnetic bead, now, the inductance parameters of this magnetic bead can be 1000 Ω, Fig. 2-2 is the structural representation of the second signal transmitting apparatus 1 according to an exemplary embodiment, and as shown in Fig. 2-2, this regulon can be magnetic bead group, each magnetic bead group can comprise a magnetic bead e, and namely this voltage signal line D1 and voltage signal line D2 can connect respectively a magnetic bead e.Fig. 2-3 is the inductance parameters schematic diagram of a kind of magnetic bead according to an exemplary embodiment, as Figure 2-3, when the frequency f of the signal on magnetic bead is lower, the resistance R of this magnetic bead is less, the inductance Z of magnetic bead is less, when the frequency f of the signal on magnetic bead is higher, the resistance R of this magnetic bead is comparatively large, and the inductance Z of magnetic bead is larger.Namely when the frequency of the signal on this magnetic bead is low frequency, the resistance of this magnetic bead is less, and voltage signal line is path, and when the frequency of the signal on magnetic bead is high frequency, the resistance of this magnetic bead is comparatively large, and voltage signal line is equivalent to open circuit.It should be noted that, the unit of resistance R can be Ω, and the unit of frequency f can be MHz (megahertz).Optionally, when the frequency of the signal that data signal line transmits is 480MHz, on this data signal line, the transfer rate of signal can be 480Mbps, now, the resistance of this magnetic bead is greater than 1000 Ω, and namely the resistance of magnetic bead is comparatively large, and this voltage signal line is equivalent to open circuit, the signal quality that this data signal line transmits is better, and the accuracy of Signal transmissions is higher.

On the other hand, magnetic bead group can be made up of the magnetic bead of at least two serial or parallel connections, and now, the inductance parameters of the magnetic bead group of the magnetic bead composition of these at least two serial or parallel connections is 1000 Ω.Example, this magnetic bead group can be made up of the magnetic bead of two series connection, this magnetic bead group also can be made up of two magnetic beads in parallel, example, this magnetic bead group can also be that the magnetic bead magnetic bead in parallel with two of two series connection is in series, namely this magnetic bead group by multiple magnetic bead, can combine in any way, makes the inductance parameters of this magnetic bead group be 1000 Ω.

In the signal transmitting apparatus that disclosure embodiment provides, because data signal line is connected with voltage signal line, therefore, on this data signal line and voltage signal line, the frequency of signal transmission is equal, when the frequency of the signal that this data signal line transmits is lower, the regulon that this voltage signal line is connected can the Signal transmissions of this voltage signal line of conducting, the power management chip be connected with this voltage signal line by the voltage on voltage signal line image data signal wire, and can manage the power supply in terminal according to the voltage gathered.When the frequency of the signal that this data signal line transmits is higher, the regulon that this voltage signal line is connected can the Signal transmissions of blocking voltage signal wire, the power management chip be connected with this voltage signal line cannot by the voltage on voltage signal line image data signal wire, now, this signal processing chip can carry out the transmission of signal by this data signal line and this USB connector.And due to the frequency of the signal that now this data signal line transmits higher, therefore, the speed of the signal now data signal line transmitted, the efficiency of Signal transmissions is higher.

It should be noted that, in the signal transmitting apparatus 1 that disclosure embodiment provides, the characteristic impedance of any single data signal wire can equal 90 Ω, namely the characteristic impedance of this data signal line C1 and data signal line C2 is equal to 90 Ω, when the characteristic impedance of any data signal line equals 90 Ω, the quality of the signal that this data signal line transmits is better.Optionally, the characteristic impedance of this voltage signal line D1 and voltage signal line D2 also can equal 90 Ω.

Fig. 3-1 is the structural representation of the third signal transmitting apparatus 1 according to an exemplary embodiment, and as shown in figure 3-1, this signal transmitting apparatus 1 can comprise: signal substrate 14, signal processing chip 11 and USB connector 13.

Example, the side of this signal substrate 14 can be formed with data-signal layer, and this data-signal layer can comprise two single data signal wires, and this two single data signal wire is respectively data signal line C1 and data signal line C2; Signal processing chip 11 can be connected by this two single data signal wire with USB connector 13, and in this two single data signal wire, the sectional area S of any single data signal wire is greater than 600 μm ², the area S in the cross section of any single data signal wire in this two single data signal wire in the sectional area S of any single data signal wire i.e. this two single data signal wire.

In sum, due in the signal transmitting apparatus that disclosure embodiment provides, the data-signal layer that the side of signal substrate is formed comprises two single data signal wires, and the sectional area of any single data signal wire in this two single data signal wire is greater than 600 μm ², namely the sectional area of this data signal line is greater than the sectional area of data signal line in correlation technique.Because the size of the size of the resistance of data signal line and the sectional area of data signal line is inversely proportional to, therefore the resistance of this data signal line is less than the resistance of data signal line in correlation technique, voltage on this data signal line adopting oscillograph to obtain becomes large, the slope of the eye pattern making signal that data signal line transmits corresponding increases, on the data signal line obtained by oscillograph, the eye pattern of signal transmission is close outside standard eye pattern mask, so, improve the signal quality that data signal line transmits, improve the accuracy of Signal transmissions.

Optionally, Fig. 3-2 is the schematic partial cross-sectional view of a kind of signal transmitting apparatus according to an exemplary embodiment, as shown in figure 3-2, this data signal line C1 and data signal line C2 can be all bar signal line, the width U of any single data signal wire in this data signal line C1 and data signal line C2 can equal 50 μm, the thickness V of any single data signal wire can be greater than 12 μm, example, and the thickness V of any single data signal wire can be 18 μm.When this data signal line is bar signal line, the sectional area of this data signal line is the product of the width U of data signal line and the thickness V of data signal line.In correlation technique, the width of data signal line equals 50 μm, and the thickness of data signal line equals 12 μm, and namely in correlation technique, the sectional area of data signal line equals 600 μm ².In the signal transmitting apparatus that disclosure embodiment provides, because the width of data signal line is equal with the width of data signal line in correlation technique, and the thickness of data signal line is greater than the thickness of data signal line in correlation technique, therefore, in the signal transmitting apparatus that disclosure embodiment provides, the sectional area of data signal line is greater than the sectional area of data signal line in correlation technique.It should be noted that, in the signal transmitting apparatus that disclosure embodiment provides, the material of data signal line can be identical with the material of data signal line in correlation technique, and in the signal transmitting apparatus that disclosure embodiment provides, the length of data signal line can be equal with the length of data signal line in correlation technique.

Further, the computing formula of the resistance of data signal line is R=ρ L/S, and wherein, R is the resistance of data signal line, and ρ is the resistivity of the material making data signal line, and L is the length of this data signal line, and S is the sectional area of this data signal line.As can be seen from above-mentioned formula, the size of the size of the resistance of this data signal line and the sectional area of data signal line is inversely proportional to.Because in the signal transmitting apparatus that disclosure embodiment provides, the sectional area of data signal line is greater than the sectional area of data signal line in correlation technique, and the material of data signal line is identical with the material of data signal line in correlation technique in the signal transmitting apparatus that provides of disclosure embodiment, in the signal transmitting apparatus that disclosure embodiment provides, the length of data signal line is equal with the length of data signal line in correlation technique, therefore, the resistance of the data signal line in the signal transmitting apparatus that provides of disclosure embodiment is less than the resistance of data signal line in correlation technique.

Example, Fig. 3-3 is the partial structurtes schematic diagram of a kind of signal transmitting apparatus 1 according to correlation technique, as shown in Fig. 3-3, signal processing chip 01, data signal line A1 and USB connector 03 are connected successively, and signal processing chip 01, data signal line A2, USB connector 03 are connected successively.Electric current flows to USB connector 03 along data signal line A1 and data signal line A2 from signal processing chip 01.If the resistance of signal processing chip 01 is 4 Ω, the resistance of data signal line A1 is 3 Ω, the resistance of USB connector 03 is 3 Ω, be carried in signal processing chip 01, data signal line A1, USB connector 03 two ends voltage be 10 volts, then the voltage at data signal line A1 and data signal line A2 two ends is 7 volts.Due in the signal transmitting apparatus 1 that disclosure embodiment provides, the resistance of this data signal line C1 and data signal line C2 is all less than the resistance of data signal line A1 and data signal line A2 in correlation technique, therefore, the voltage at data signal line C1 and data signal line C2 two ends is all greater than 7 volts.Example, if the data signal line C1 in the signal transmitting apparatus 1 that disclosure embodiment provides and the resistance of data signal line C2 are 1 Ω, and the resistance of signal processing chip 11 is 4 Ω, the resistance of USE connector 13 is 3 Ω, the voltage being carried in this signal processing chip 11 and USB connector 13 two ends is 10 volts, then the voltage at this data signal line C1 and data signal line C2 two ends is 8.75 volts, is greater than the voltage 7 volts at this data signal line A1 and data signal line A2 two ends in correlation technique.Voltage on this data signal line adopting oscillograph to obtain becomes large, the slope of the eye pattern making signal that data signal line transmits corresponding increases, on the data signal line obtained by oscillograph, the eye pattern of signal transmission is close outside standard eye pattern mask, so, improve the signal quality that data signal line transmits, improve the accuracy of Signal transmissions.

Optionally, as shown in figure 3-2, this signal transmitting apparatus 1 can also comprise: the first shielding board 15 and secondary shielding substrate 16.Example, this first shielding board 15, signal substrate 14, secondary shielding substrate 16 can superpose successively, and the side near the first shielding board 15 on this signal substrate 14 is formed with data-signal layer, the opposite side of signal substrate 14 is formed with ground stratum reticulare 142, optionally, the opposite side of this signal substrate is also formed with other structures (not shown in Fig. 3-2), and these other structures are equal with the thickness of ground stratum reticulare.This first shielding board 15 can be formed with the first additional signal layer 151 away from the side of signal substrate 14, and the first shielding board 15 being formed with the first additional signal layer 151 can be formed with the first screen layer 152.Secondary shielding substrate 16 can be formed with the second additional signal layer 161 away from the side of signal substrate 14, and the secondary shielding substrate 16 being formed with the second additional signal layer 161 can be formed with secondary shielding layer 162.Optionally, between this first shielding board 15 and data-signal layer, and between secondary shielding substrate 16 and ground stratum reticulare 142, all can be formed with bonding glue-line 17.It should be noted that, ground stratum reticulare 142 can be the reference planes M of data signal line C1 and data signal line C2 near the surface of this signal substrate 14.This reference planes M can be provided with the return flow path of the signal of transmission on this data signal line C1 and data signal line C2, namely the signal generated from signal processing chip 11 can transfer to this USB connector 13 along data signal line C1 and data signal line C2, and the signal generated by this signal processing chip 11 by this USB connector 13 transfers to this signal processing chip 11 by the return flow path of signal.

Example, the thickness of this first shielding board 15, signal substrate 14 and secondary shielding substrate 16 all can be 25 μm, the thickness of this first additional signal layer 151, second additional signal layer 161 and ground stratum reticulare 142 all can be 12 μm, the thickness of this data signal line can be 18 μm, and the thickness of this bonding glue-line 17 can be 15 μm.Due in disclosure embodiment, the reference planes M of data signal line is that therefore, the distance between this data-signal layer and reference planes M equals the thickness 25 μm of this signal substrate 14 near the surface of signal substrate on ground stratum reticulare 142.

Fig. 3-4 is the structural representation of the 4th kind of signal transmitting apparatus 1 according to an exemplary embodiment, as shown in Figure 3-4, this signal transmitting apparatus 1 can also comprise: power management chip 12 and power supply board H, the side of this power supply board H can be formed with voltage signal layer, this voltage signal layer can comprise: voltage signal line D1 and voltage signal line D2, and this power management chip 12 can be connected with two single data signal wires by two voltage signal lines.Example, one end of voltage signal line D1 can be connected with power management chip 12, and the other end of voltage signal line D1 can be connected with data signal line C1, and power management chip 12 can by the voltage on voltage signal line D1 image data signal wire C1; One end of voltage signal line D2 can be connected with power management chip 12, and the other end of voltage signal line D2 can be connected with data signal line C2, and power management chip 12 can by the voltage on voltage signal line D2 image data signal wire C2.

Fig. 4-1 is the structural representation of the 5th kind of signal transmitting apparatus 1 according to an exemplary embodiment, and as shown in Fig. 4-1, this signal transmitting apparatus 1 can comprise: signal substrate 14, signal processing chip 11 and USB connector 13.

Example, the side of this signal substrate 14 can be formed with data-signal layer, and this data-signal layer can comprise two single data signal wires, and this two single data signal wire is respectively data signal line C1 and data signal line C2; Signal processing chip 11 can be connected by two single data signal wires with USB connector 13, and the distance of any single data signal wire in two single data signal wires and reference planes M is greater than 25 μm, it should be noted that, this reference planes M can be provided with the return flow path of the signal of two single data signal wires.

In sum, due in the signal transmitting apparatus that disclosure embodiment provides, in two single data signal wires of the side formation of signal substrate, the distance of any single data signal wire and reference planes is greater than 25 μm, namely the distance of data signal line and reference planes is greater than the distance of data signal line and reference planes in correlation technique, and the size of electric capacity that formed of data signal line and reference planes and the distance of data signal line and reference planes are inversely proportional to, compared to correlation technique, the electric capacity that in the signal transmitting apparatus that disclosure embodiment provides, data signal line and reference planes are formed is less, the duration of charging of electric capacity is less, namely the voltage at data signal line two ends becomes large speed, the slope of the eye pattern making signal that data signal line transmits corresponding increases, on the data signal line obtained by oscillograph, the eye pattern of signal transmission is close outside standard eye pattern mask, so, improve the signal quality that data signal line transmits, improve the accuracy of Signal transmissions.

Example, the signal that signal processing chip 11 generates can transfer to this USB connector 13 along data signal line C1 and data signal line C2, and the signal generated by this signal processing chip 11 by this USB connector 13 transfers to this signal processing chip 11 by the return flow path of the signal that these reference planes are arranged.

In correlation technique, the side of signal substrate is formed with data-signal layer, data-signal layer can comprise two single data signal wires, the opposite side of signal substrate can be formed with ground stratum reticulare, and this ground stratum reticulare is reference planes near the surface of this signal substrate, optionally, the opposite side of this signal substrate is also formed with other structures, and these other structures are equal with the thickness of ground stratum reticulare.First shielding board, signal substrate, secondary shielding substrate can superpose successively, and this data-signal layer is formed at the side near the first shielding board on signal substrate.First shielding board can be formed with the first additional signal layer away from the side of signal substrate, and the first shielding board being formed with the first additional signal layer can be formed with the first screen layer.Secondary shielding substrate can be formed with the second additional signal layer away from the side of signal substrate, and the secondary shielding substrate being formed with the second additional signal layer can be formed with secondary shielding layer.Optionally, between this first shielding board and data-signal layer, and between secondary shielding substrate and ground stratum reticulare, all can be formed with bonding glue-line.Example, the thickness of this first shielding board, signal substrate and secondary shielding substrate all can be 25 μm, this the first additional signal layer, the second additional signal layer, the thickness of stratum reticulare and data-signal layer all can be 12 μm, the thickness of this bonding glue-line can be 15 μm.Due in correlation technique, the reference planes of data signal line are that therefore, the distance between these data-signal layer and reference planes equals the thickness 25 μm of this signal substrate near the surface of signal substrate on ground stratum reticulare.

Optionally, Fig. 4-2 is the schematic partial cross-sectional view of the another kind of signal transmitting apparatus 1 according to an exemplary embodiment, as shown in the Fig. 4-2, this signal transmitting apparatus 1 can also comprise: the first shielding board 15 and secondary shielding substrate 16, and this first shielding board 15, signal substrate 14, secondary shielding substrate 16 superpose successively.First shielding board 15 is formed with the first additional signal layer 151 away from the side of signal substrate 14, and the first shielding board 15 being formed with the first additional signal layer 151 is formed with the first screen layer 152; Secondary shielding substrate 16 is formed with the second additional signal layer 161 away from the side of signal substrate 14, and the secondary shielding substrate 16 being formed with the second additional signal layer 161 is formed with secondary shielding layer 162; Between first shielding board 15 and data-signal layer, and between secondary shielding substrate 16 and signal substrate 14, be all formed with bonding glue-line 17; First screen layer 152 is reference planes M near the surface of data-signal layer and secondary shielding layer 162 near the surface of data-signal layer.Namely, in disclosure embodiment, the opposite side of this signal substrate 14 is not formed with ground stratum reticulare, and the opposite side of this signal substrate is only formed with other structures 143 equal with the thickness of ground stratum reticulare.

Example, above-mentioned first shielding board 15, the thickness of each substrate in signal substrate 14 and secondary shielding substrate 16 all can be 25 μm, the thickness of this bonding glue-line 17 can equal 25 μm, this the first additional signal layer 151, the thickness of the second additional signal layer 161 and data-signal layer all can be 12 μm, the thickness of other structures 143 equal with the thickness of ground stratum reticulare can equal 12 μm, now, when reference planes M is the first screen layer 152 near data-signal layer surperficial, this reference planes M and data signal line C1, the distance of data signal line C2 is 62 μm, when reference planes M is secondary shielding layer 162 near data-signal layer surperficial, this reference planes M and data signal line C1, the distance of data signal line C2 is 99 μm.This shows in disclosure embodiment, the distance of data signal line and reference planes is all greater than the distance 25 μm of data signal line and reference planes in correlation technique.

Fig. 4-3 is the structural representation of the 6th kind of signal transmitting apparatus 1 according to an exemplary embodiment, as shown in Figure 3-4, this signal transmitting apparatus 1 can also comprise: power management chip 12 and power supply board H, the side of this power supply board H can be formed with voltage signal layer, this voltage signal layer can comprise: voltage signal line D1 and voltage signal line D2, and this power management chip 12 can be connected with two single data signal wires by two voltage signal lines.Example, one end of voltage signal line D1 can be connected with power management chip 12, and the other end of voltage signal line D1 can be connected with data signal line C1, and power management chip 12 can by the voltage on voltage signal line D1 image data signal wire C1; One end of voltage signal line D2 can be connected with power management chip 12, and the other end of voltage signal line D2 can be connected with data signal line C2, and power management chip 12 can by the voltage on voltage signal line D2 image data signal wire C2.

Further, the computing formula of the electric capacity that the conductive layer at data signal line and reference planes place is formed is C=ε * ε 0*S/d, wherein C is the electric capacity that the conductive layer at data signal line and reference planes place is formed, ε is relative dielectric constant, ε 0 is permittivity of vacuum, S is that the right opposite of data signal line and reference planes amasss, d is the distance between data signal line and reference planes, as can be seen from above-mentioned formula, the size of the electric capacity that data signal line and reference planes are formed and the distance of data signal line and reference planes are inversely proportional to.Due in the signal transmitting apparatus that disclosure embodiment provides, in two single data signal wires of the side formation of this signal substrate, the distance of any single data signal wire and reference planes is greater than 25 μm, namely the distance of data signal line and reference planes is greater than the distance of data signal line and reference planes in correlation technique, and ε in disclosure embodiment, ε in the value of ε 0 and S and correlation technique, the value of ε 0 and S is equal, therefore, compared to correlation technique, the electric capacity that in the signal transmitting apparatus that disclosure embodiment provides, data signal line and reference planes are formed is less, the duration of charging of electric capacity is less, namely the voltage at data signal line two ends becomes large speed, the slope of the eye pattern making signal that data signal line transmits corresponding increases, on the data signal line obtained by oscillograph, the eye pattern of signal transmission is close outside standard eye pattern mask, so, improve the signal quality that data signal line transmits, improve the accuracy of Signal transmissions.

In sum, due in the signal transmitting apparatus that disclosure embodiment provides, the data-signal layer that the side of signal substrate is formed comprises two single data signal wires, and the distance of any single data signal wire in this two single data signal wire and reference planes is greater than 25 μm, namely the distance of data signal line and reference planes is greater than the distance of data signal line and reference planes in correlation technique, and the size of electric capacity that formed of data signal line and reference planes and the distance of data signal line and reference planes are inversely proportional to, therefore, compared to correlation technique, in the signal transmitting apparatus that disclosure embodiment provides, the duration of charging of the electric capacity smaller capacitive that data signal line and reference planes are formed is less, namely the voltage at data signal line two ends becomes large speed, the slope of the eye pattern making signal that data signal line transmits corresponding increases, on the data signal line obtained by oscillograph, the eye pattern of signal transmission is close outside standard eye pattern mask, so, improve the signal quality that data signal line transmits, improve the accuracy of Signal transmissions.

Fig. 5-1 is the structural representation of the 7th kind of signal transmitting apparatus 1 according to an exemplary embodiment, and as shown in fig. 5-1, this signal transmitting apparatus 1 can comprise: signal processing chip 11, power management chip 12, USB connector 13 and signal substrate 14.

The side of this signal substrate 14 can be formed with data-signal layer, and this data-signal layer can comprise data signal line C1 and data signal line C2; This signal processing chip 11 can be connected with data signal line C2 by data signal line C1 with USB connector 13; Power management chip 12 can be connected with data signal line C2 with data signal line C1 with voltage signal line D2 respectively by voltage signal line D1, arbitrary voltage signal line in this voltage signal line D1 and voltage signal line D2 can be in series with regulon E, this regulon E may be used for the Signal transmissions of the blocking voltage signal wire when voltage signal line transmitting high-frequency signal, the Signal transmissions of forward voltage signal wire when voltage signal line transmission low frequency signal.In this two single data signal wire, the sectional area of any single data signal wire is greater than 600 μm ², the area in the cross section of any single data signal wire in this two single data signal wire in the sectional area of any single data signal wire i.e. this two single data signal wire.

Example, one end of voltage signal line D1 is connected with power management chip 12, and the other end of voltage signal line D1 is connected with data signal line C1, and power management chip 12 can by the voltage on voltage signal line D1 image data signal wire C1; One end of voltage signal line D2 can be connected with power management chip 12, and the other end of voltage signal line D2 is connected with data signal line C2, and power management chip 12 can by the voltage on voltage signal line D2 image data signal wire C2.Optionally, regulon E can be magnetic bead group, and each magnetic bead group can comprise at least one magnetic bead, namely can be provided with two magnetic bead groups in this electric signal transmission device 1, example, the inductance parameters of any one magnetic bead group can be 1000 Ω (ohm).

On the one hand, magnetic bead group can be a magnetic bead, now, the inductance parameters of this magnetic bead can be 1000 Ω, this regulon can be magnetic bead group, and each magnetic bead group can comprise a magnetic bead, a magnetic bead of namely this voltage signal line D1 and voltage signal line D2 can connecting respectively.Fig. 2-3 is the inductance parameters schematic diagram of a kind of magnetic bead according to an exemplary embodiment, as Figure 2-3, when the frequency f of the signal on magnetic bead is lower, the resistance R of this magnetic bead is less, the inductance Z of magnetic bead is less, when the frequency f of the signal on magnetic bead is higher, the resistance R of this magnetic bead is comparatively large, and the inductance Z of magnetic bead is larger.Namely when the frequency of the signal on this magnetic bead is low frequency, the resistance of this magnetic bead is less, and voltage signal line is path, and when the frequency of the signal on magnetic bead is high frequency, the resistance of this magnetic bead is comparatively large, and voltage signal line is equivalent to open circuit.It should be noted that, the unit of resistance R can be Ω, and the unit of frequency f can be MHz (megahertz).Optionally, when the frequency of the signal that data signal line transmits is 480MHz, on this data signal line, the transfer rate of signal can be 480Mbps, now, the resistance of this magnetic bead is greater than 1000 Ω, and namely the resistance of magnetic bead is comparatively large, and this voltage signal line is equivalent to open circuit, the signal quality that this data signal line transmits is better, and the accuracy of Signal transmissions is higher.

On the other hand, magnetic bead group can be made up of the magnetic bead of at least two serial or parallel connections, and now, the inductance parameters of the magnetic bead group of the magnetic bead composition of these at least two serial or parallel connections is 1000 Ω.Example, this magnetic bead group can be made up of the magnetic bead of two series connection, this magnetic bead group also can be made up of two magnetic beads in parallel, this magnetic bead group can also be that the magnetic bead magnetic bead in parallel with two of two series connection is in series, namely this magnetic bead group can by multiple magnetic bead, combine in any way, make the inductance parameters of this magnetic bead group be 1000 Ω.

Optionally, Fig. 5-2 is the schematic partial cross-sectional view of another signal transmitting apparatus 1 according to an exemplary embodiment, as shown in Fig. 5-2, this data signal line C1 and data signal line C2 can be all bar signal line, the width U of any single data signal wire in this data signal line C1 and data signal line C2 can equal 50 μm, the thickness V of any single data signal wire can be greater than 12 μm, example, and the thickness V of any single data signal wire can be 18 μm.When this data signal line is bar signal line, the sectional area of this data signal line is the product of the width U of data signal line and the thickness V of data signal line.In correlation technique, the width of data signal line equals 50 μm, and the thickness of data signal line equals 12 μm, and namely in correlation technique, the sectional area of data signal line equals 600 μm ².In the signal transmitting apparatus that disclosure embodiment provides, because the width of data signal line is equal with the width of data signal line in correlation technique, and the thickness of data signal line is greater than the thickness of data signal line in correlation technique, therefore, in the signal transmitting apparatus that disclosure embodiment provides, the sectional area of data signal line is greater than the sectional area of data signal line in correlation technique.It should be noted that, in the signal transmitting apparatus that disclosure embodiment provides, the material of data signal line can be identical with the material of data signal line in correlation technique, and in the signal transmitting apparatus that disclosure embodiment provides, the length of data signal line can be equal with the length of data signal line in correlation technique.

Further, the computing formula of the resistance of data signal line is R=ρ L/S, and wherein R is the resistance of data signal line, and ρ is the resistivity of the material making data signal line, and L is the length of this data signal line, and S is the sectional area of this data signal line.As can be seen from above-mentioned formula, the size of the size of the resistance of this data signal line and the sectional area of data signal line is inversely proportional to.Because in the signal transmitting apparatus that disclosure embodiment provides, the sectional area of data signal line is greater than the sectional area of data signal line in correlation technique, and the material of data signal line is identical with the material of data signal line in correlation technique in the signal transmitting apparatus that provides of disclosure embodiment, in the signal transmitting apparatus that disclosure embodiment provides, the length of data signal line is equal with the length of data signal line in correlation technique, therefore, the resistance of the data signal line in the signal transmitting apparatus that provides of disclosure embodiment is less than the resistance of data signal line in correlation technique.

Optionally, as shown in Fig. 5-2, this signal transmitting apparatus 1 can also comprise: the first shielding board 15 and secondary shielding substrate 16.Example, this first shielding board 15, signal substrate 14, secondary shielding substrate 16 can superpose successively, and the side near the first shielding board 15 on this signal substrate 14 is formed with data-signal layer, the opposite side of signal substrate 14 is formed with ground stratum reticulare 142, optionally, the opposite side of this signal substrate is also formed with other structures (not shown in Fig. 5-2), and these other structures are equal with the thickness of ground stratum reticulare.This first shielding board 15 can be formed with the first additional signal layer 151 away from the side of signal substrate 14, and the first shielding board 15 being formed with the first additional signal layer 151 can be formed with the first screen layer 152.Secondary shielding substrate 16 can be formed with the second additional signal layer 161 away from the side of signal substrate 14, and the secondary shielding substrate 16 being formed with the second additional signal layer 161 can be formed with secondary shielding layer 162.Optionally, between this first shielding board 15 and data-signal layer, and between secondary shielding substrate 16 and ground stratum reticulare 142, all can be formed with bonding glue-line 17.It should be noted that, ground stratum reticulare 142 can be the reference planes M of data signal line C1 and data signal line C2 near the surface of this signal substrate 14.This reference planes M can be provided with the return flow path of the signal of transmission on this data signal line C1 and data signal line C2, namely the signal generated from signal processing chip 11 can transfer to this USB connector 13 along data signal line C1 and data signal line C2, and the signal generated by this signal processing chip 11 by this USB connector 13 transfers to this signal processing chip 11 by the return flow path of signal.

As shown in fig. 5-1, this signal transmitting apparatus 1 can also comprise: power supply board H, the side of this power supply board H can be formed with voltage signal layer, this voltage signal layer can comprise: voltage signal line D1 and voltage signal line D2, and this power management chip 12 can be connected with two single data signal wires by two voltage signal lines.Example, one end of voltage signal line D1 can be connected with power management chip 12, and the other end of voltage signal line D1 can be connected with data signal line C1, and power management chip 12 can by the voltage on voltage signal line D1 image data signal wire C1; One end of voltage signal line D2 can be connected with power management chip 12, and the other end of voltage signal line D2 can be connected with data signal line C2, and power management chip 12 can by the voltage on voltage signal line D2 image data signal wire C2.

In sum, due in the signal transmitting apparatus that disclosure embodiment provides, on the one hand, when signal processing chip and this USB connector are by this data signal line transmitting high-frequency signal, this regulon can the Signal transmissions of blocking voltage signal wire, make when data signal line transmitting high-frequency signal, not by the impact of voltage signal wire; On the other hand, the sectional area of any single data signal wire in two single data signal wires is greater than the sectional area of data signal line in correlation technique, the resistance of this data signal line is made to be less than the resistance of data signal line in correlation technique, voltage on this data signal line adopting oscillograph to obtain becomes large, and the slope of the eye pattern making signal that data signal line transmits corresponding increases; On the data signal line obtained by oscillograph, the eye pattern of signal transmission is close outside standard eye pattern mask, so, improve the signal quality that data signal line transmits, improve the accuracy of Signal transmissions.

Fig. 6-1 is the structural representation of the 8th kind of signal transmitting apparatus 1 according to an exemplary embodiment, and as in Figure 6-1, this signal transmitting apparatus 1 can comprise: signal processing chip 11, power management chip 12, USB connector 13 and signal substrate 14.

Example, the side of this signal substrate 14 can be formed with data-signal layer, and this data-signal layer can comprise two single data signal wires, and this two single data signal wire is respectively data signal line C1 and data signal line C2; This signal processing chip 11 can be connected with data signal line C2 by data signal line C1 with USB connector 13; Power management chip 12 can be connected with data signal line C2 with data signal line C1 with voltage signal line D2 respectively by voltage signal line D1, arbitrary voltage signal line in this voltage signal line D1 and voltage signal line D2 can be in series with regulon E, this regulon E may be used for the Signal transmissions of the blocking voltage signal wire when voltage signal line transmitting high-frequency signal, the Signal transmissions of forward voltage signal wire when voltage signal line transmission low frequency signal.Any single data signal wire in two single data signal wires and the distance of reference planes (not shown in Fig. 6-1) are greater than 25 μm, it should be noted that, these reference planes can be provided with the return flow path of the signal of two single data signal wires.

Example, the signal that signal processing chip 11 generates can transfer to this USB connector 13 along data signal line C1 and data signal line C2, and the signal generated by this signal processing chip 11 by this USB connector 13 transfers to this signal processing chip 11 by reference to the return flow path of the signal that plane is arranged.

Optionally, Fig. 6-2 is the schematic partial cross-sectional view of another signal transmitting apparatus 1 according to an exemplary embodiment, as in fig. 6-2, this signal transmitting apparatus 1 can also comprise: the first shielding board 15 and secondary shielding substrate 16, and this first shielding board 15, signal substrate 14, secondary shielding substrate 16 superpose successively.First shielding board 15 is formed with the first additional signal layer 151 away from the side of signal substrate 14, and the first shielding board 15 being formed with the first additional signal layer 151 is formed with the first screen layer 152; Secondary shielding substrate 16 is formed with the second additional signal layer 161 away from the side of signal substrate 14, and the secondary shielding substrate 16 being formed with the second additional signal layer 161 is formed with secondary shielding layer 162; Between first shielding board 15 and data-signal layer, and between secondary shielding substrate 16 and signal substrate 14, be all formed with bonding glue-line 17; First screen layer 152 is reference planes M near the surface of data-signal layer and secondary shielding layer 162 near the surface of data-signal layer.Namely, in disclosure embodiment, the opposite side of this signal substrate 14 is not formed with ground stratum reticulare, and the opposite side of this signal substrate is only formed with other structures 143 equal with the thickness of ground stratum reticulare.

Optionally, above-mentioned first shielding board 15, the thickness of each substrate in signal substrate 14 and secondary shielding substrate 16 all can be 25 μm, the thickness of this bonding glue-line 17 can equal 25 μm, this the first additional signal layer 151, second additional signal layer 161, data-signal layer, the thickness of other structures 143 equal with the thickness of ground stratum reticulare all can be 12 μm, now, when reference planes M is the first screen layer 152 near data-signal layer surperficial, this reference planes M and data signal line C1, the distance of data signal line C2 is 62 μm, when reference planes M is secondary shielding layer 162 near data-signal layer surperficial, this reference planes M and data signal line C1, the distance of data signal line C2 is 99 μm.This shows in disclosure embodiment, the distance of data signal line and reference planes is all greater than the distance 25 μm of data signal line and reference planes in correlation technique.

As in Figure 6-1, this signal transmitting apparatus 1 can also comprise: power supply board H, the side of this power supply board H can be formed with voltage signal layer, this voltage signal layer can comprise: voltage signal line D1 and voltage signal line D2, and this power management chip 12 can be connected with two single data signal wires by two voltage signal lines.Example, one end of voltage signal line D1 can be connected with power management chip 12, and the other end of voltage signal line D1 can be connected with data signal line C1, and power management chip 12 can by the voltage on voltage signal line D1 image data signal wire C1; One end of voltage signal line D2 can be connected with power management chip 12, and the other end of voltage signal line D2 can be connected with data signal line C2, and power management chip 12 can by the voltage on voltage signal line D2 image data signal wire C2.

In sum, due in the signal transmitting apparatus that disclosure embodiment provides, on the one hand, any single data signal wire in two single data signal wires and the distance of reference planes are greater than the distance of data signal line and reference planes in correlation technique, therefore, in the signal transmitting apparatus that disclosure embodiment provides, the duration of charging of the electric capacity smaller capacitive that data signal line and reference planes are formed is less, namely the voltage at data signal line two ends becomes large speed, and the slope of the eye pattern making signal that data signal line transmits corresponding increases; On the other hand, when signal processing chip and this USB connector are by this data signal line transmitting high-frequency signal, this regulon can the Signal transmissions of blocking voltage signal wire, make when data signal line transmitting high-frequency signal, not by the impact of voltage signal wire, so, on the data signal line obtained by oscillograph, the eye pattern of signal transmission is close outside standard eye pattern mask, so, improve the signal quality that data signal line transmits, improve the accuracy of Signal transmissions.

Fig. 7-1 is the structural representation of the 9th kind of signal transmitting apparatus 1 according to an exemplary embodiment, and as shown in Fig. 7-1, this signal transmitting apparatus 1 can comprise: signal processing chip 11, USB connector 13 and signal substrate 14.

Example, the side of this signal substrate 14 can be formed with data-signal layer, and this data-signal layer can comprise two single data signal wires, and this two single data signal wire is respectively data signal line C1 and data signal line C2; Signal processing chip 11 can be connected by this two single data signal wire with USB connector 13, and in this two single data signal wire, the sectional area S of any single data signal wire is greater than 600 μm ², the area S in the cross section of any single data signal wire in this two single data signal wire in the sectional area S of any single data signal wire i.e. this two single data signal wire.Any single data signal wire in two single data signal wires and the distance of reference planes M are greater than 25 μm, it should be noted that, this reference planes M can be provided with the return flow path of the signal of two single data signal wires.

Optionally, Fig. 7-2 is the schematic partial cross-sectional view of a kind of signal transmitting apparatus 1 according to another exemplary embodiment, as shown in Fig. 7-2, this data signal line C1 and data signal line C2 can be all bar signal line, the width U of any single data signal wire in this data signal line C1 and data signal line C2 can equal 50 μm, the thickness V of any single data signal wire can be greater than 12 μm, example, and the thickness V of any single data signal wire can be 18 μm.When this data signal line is bar signal line, the sectional area of this data signal line is the product of the width U of data signal line and the thickness V of data signal line.In correlation technique, the width of data signal line equals 50 μm, and the thickness of data signal line equals 12 μm, and namely in correlation technique, the sectional area of data signal line equals 600 μm ².In the signal transmitting apparatus that disclosure embodiment provides, because the width of data signal line is equal with the width of data signal line in correlation technique, and the thickness of data signal line is greater than the thickness of data signal line in correlation technique, therefore, in the signal transmitting apparatus that disclosure embodiment provides, the sectional area of data signal line is greater than the sectional area of data signal line in correlation technique.It should be noted that, in the signal transmitting apparatus that disclosure embodiment provides, the material of data signal line can be identical with the material of data signal line in correlation technique, and in the signal transmitting apparatus that disclosure embodiment provides, the length of data signal line can be equal with the length of data signal line in correlation technique.

As shown in Fig. 7-2, this signal transmitting apparatus 1 can also comprise: the first shielding board 15 and secondary shielding substrate 16, and this first shielding board 15, signal substrate 14, secondary shielding substrate 16 superpose successively.First shielding board 15 is formed with the first additional signal layer 151 away from the side of signal substrate 14, and the first shielding board 15 being formed with the first additional signal layer 151 is formed with the first screen layer 152; Secondary shielding substrate 16 is formed with the second additional signal layer 161 away from the side of signal substrate 14, and the secondary shielding substrate 16 being formed with the second additional signal layer 161 is formed with secondary shielding layer 162; Between first shielding board 15 and data-signal layer, and between secondary shielding substrate 16 and signal substrate 14, be all formed with bonding glue-line 17; First screen layer 152 is reference planes M near the surface of data-signal layer and secondary shielding layer 162 near the surface of data-signal layer.Namely, in disclosure embodiment, the opposite side of this signal substrate 14 is not formed with ground stratum reticulare, and the opposite side of this signal substrate is only formed with other structures 143 equal with the thickness of ground stratum reticulare.

Example, above-mentioned first shielding board 15, the thickness of each substrate in signal substrate 14 and secondary shielding substrate 16 all can be 25 μm, the thickness of this bonding glue-line 17 can equal 25 μm, this the first additional signal layer 151, second additional signal layer 161, the thickness of other structures 143 equal with the thickness of ground stratum reticulare all can be 12 μm, the thickness of this data-signal layer can be 18 μm, now, when reference planes M is the first screen layer 152 near data-signal layer surperficial, this reference planes M and data signal line C1, the distance of data signal line C2 is 62 μm, when reference planes M is secondary shielding layer 162 near data-signal layer surperficial, this reference planes M and data signal line C1, the distance of data signal line C2 is 99 μm.This shows in disclosure embodiment, the distance of data signal line and reference planes is all greater than the distance 25 μm of data signal line and reference planes in correlation technique.

Fig. 7-3 is the structural representation of the tenth kind of signal transmitting apparatus 1 according to an exemplary embodiment, as shown in Fig. 7-3, this signal transmitting apparatus 1 can also comprise: power management chip 12 and power supply board H, the side of this power supply board H can be formed with voltage signal layer, this voltage signal layer can comprise: voltage signal line D1 and voltage signal line D2, and this power management chip 12 can be connected with two single data signal wires by two voltage signal lines.Example, one end of voltage signal line D1 can be connected with power management chip 12, and the other end of voltage signal line D1 can be connected with data signal line C1, and power management chip 12 can by the voltage on voltage signal line D1 image data signal wire C1; One end of voltage signal line D2 can be connected with power management chip 12, and the other end of voltage signal line D2 can be connected with data signal line C2, and power management chip 12 can by the voltage on voltage signal line D2 image data signal wire C2.

In sum, due in the signal transmitting apparatus that disclosure embodiment provides, on the one hand, any single data signal wire in two single data signal wires and the distance of reference planes are greater than the distance of data signal line and reference planes in correlation technique, therefore, in the signal transmitting apparatus that disclosure embodiment provides, the duration of charging of the electric capacity smaller capacitive that data signal line and reference planes are formed is less, on the other hand, the sectional area of any single data signal wire in two single data signal wires is greater than the sectional area of data signal line in correlation technique.Voltage on this data signal line adopting oscillograph to obtain becomes large.The slope of the eye pattern that the signal that data signal line transmits is corresponding increases, on the data signal line obtained by oscillograph, the eye pattern of signal transmission is close outside standard eye pattern mask, on the data signal line obtained by oscillograph, the eye pattern of signal transmission is close outside standard eye pattern mask, so, improve the signal quality that data signal line transmits, improve the accuracy of Signal transmissions.

Fig. 8-1 is the structural representation of the 11 kind of signal transmitting apparatus 1 according to an exemplary embodiment, and as shown in Fig. 8-1, this signal transmitting apparatus 1 can comprise: signal processing chip 11, power management chip 12, USB connector 13 and signal substrate 14.

Example, the side of this signal substrate 14 can be formed with data-signal layer, and this data-signal layer can comprise two single data signal wires, and this two single data signal wire is respectively data signal line C1 and data signal line C2; Signal processing chip 11 can be connected by this two single data signal wire with USB connector 13, and in this two single data signal wire, the sectional area of any single data signal wire is greater than 600 μm ², the area in the sectional area of data signal line and the cross section of data signal line.Any single data signal wire in two single data signal wires and the distance of reference planes (not shown in Fig. 8-1) are greater than 25 μm, it should be noted that, these reference planes can be provided with the return flow path of the signal of two single data signal wires.

Power management chip 12 can be connected with data signal line C2 with data signal line C1 with voltage signal line D2 respectively by voltage signal line D1, arbitrary voltage signal line in this voltage signal line D1 and voltage signal line D2 can be in series with regulon E, this regulon E may be used for the Signal transmissions of the blocking voltage signal wire when voltage signal line transmitting high-frequency signal, the Signal transmissions of forward voltage signal wire when voltage signal line transmission low frequency signal.

Optionally, regulon E in Fig. 8-1 can be magnetic bead group, and each magnetic bead group can comprise at least one magnetic bead, namely can be provided with two magnetic bead groups in this electric signal transmission device 1, example, the inductance parameters of any one magnetic bead group can be 1000 Ω (ohm).

On the one hand, magnetic bead group can be a magnetic bead, now, the inductance parameters of this magnetic bead can be 1000 Ω, this regulon can be magnetic bead group, and each magnetic bead group can comprise a magnetic bead, a magnetic bead of namely this voltage signal line D1 and voltage signal line D2 can connecting respectively.Fig. 2-3 is the inductance parameters schematic diagram of a kind of magnetic bead according to an exemplary embodiment, as Figure 2-3, when the frequency f of the signal on magnetic bead is lower, the resistance R of this magnetic bead is less, the inductance Z of magnetic bead is less, when the frequency f of the signal on magnetic bead is higher, the resistance R of this magnetic bead is comparatively large, and the inductance Z of magnetic bead is larger.Namely when the frequency of the signal on this magnetic bead is low frequency, the resistance of this magnetic bead is less, and voltage signal line is path, and when the frequency of the signal on magnetic bead is high frequency, the resistance of this magnetic bead is comparatively large, and voltage signal line is equivalent to open circuit.It should be noted that, the unit of resistance R can be Ω, and the unit of frequency f can be MHz.Optionally, when the frequency of the signal that data signal line transmits is 480MHz, on this data signal line, the transfer rate of signal can be 480Mbps, now, the resistance of this magnetic bead is greater than 1000 Ω, and namely the resistance of magnetic bead is comparatively large, and this voltage signal line is equivalent to open circuit, the signal quality that this data signal line transmits is better, and the accuracy of Signal transmissions is higher.

On the other hand, magnetic bead group can be made up of the magnetic bead of at least two serial or parallel connections, and now, the inductance parameters of the magnetic bead group of the magnetic bead composition of these at least two serial or parallel connections is 1000 Ω.Example, this magnetic bead group can be made up of the magnetic bead of two series connection, this magnetic bead group also can be made up of two magnetic beads in parallel, example, this magnetic bead group can also be that the magnetic bead magnetic bead in parallel with two of two series connection is in series, namely this magnetic bead group can be combined in any way by multiple magnetic bead, makes the inductance parameters of this magnetic bead group be 1000 Ω.

Example, in the signal transmitting apparatus that disclosure embodiment provides, because data signal line is connected with voltage signal line, therefore, on this data signal line and voltage signal line, the frequency of signal transmission is equal, when the frequency of the signal that this data signal line transmits is lower, the regulon that this voltage signal line is connected can the Signal transmissions of this voltage signal line of conducting, the power management chip be connected with this voltage signal line by the voltage on voltage signal line image data signal wire, and can manage the power supply in terminal according to the voltage gathered.When the frequency of the signal that this data signal line transmits is higher, the regulon that this voltage signal line is connected can the Signal transmissions of blocking voltage signal wire, the power management chip be connected with this voltage signal line cannot by the voltage on voltage signal line image data signal wire, now, this signal processing chip can carry out the transmission of signal by this data signal line and this USB connector.And due to the frequency of the signal that now this data signal line transmits higher, therefore, the speed of the signal now data signal line transmitted, the efficiency of Signal transmissions is higher.

Optionally, Fig. 8-2 is the schematic partial cross-sectional view of the another kind of signal transmitting apparatus 1 according to another exemplary embodiment, as shown in Fig. 8-2, this data signal line C1 and data signal line C2 can be all bar signal line, the width U of any single data signal wire in this data signal line C1 and data signal line C2 can equal 50 μm, the thickness V of any single data signal wire can be greater than 12 μm, example, and the thickness V of any single data signal wire can be 18 μm.When this data signal line is bar signal line, the sectional area of this data signal line is the product of the width U of data signal line and the thickness V of data signal line.In correlation technique, the width of data signal line equals 50 μm, and the thickness of data signal line equals 12 μm, and namely in correlation technique, the sectional area of data signal line equals 600 μm ².In the signal transmitting apparatus that disclosure embodiment provides, because the width of data signal line is equal with the width of data signal line in correlation technique, and the thickness of data signal line is greater than the thickness of data signal line in correlation technique, therefore, in the signal transmitting apparatus that disclosure embodiment provides, the sectional area of data signal line is greater than the sectional area of data signal line in correlation technique.It should be noted that, in the signal transmitting apparatus that disclosure embodiment provides, the material of data signal line can be identical with the material of data signal line in correlation technique, and in the signal transmitting apparatus that disclosure embodiment provides, the length of data signal line can be equal with the length of data signal line in correlation technique.

As shown in Fig. 8-2, this signal transmitting apparatus 1 can also comprise: the first shielding board 15 and secondary shielding substrate 16, and this first shielding board 15, signal substrate 14, secondary shielding substrate 16 superpose successively.First shielding board 15 is formed with the first additional signal layer 151 away from the side of signal substrate 14, and the first shielding board 15 being formed with the first additional signal layer 151 is formed with the first screen layer 152; Secondary shielding substrate 16 is formed with the second additional signal layer 161 away from the side of signal substrate 14, and the secondary shielding substrate 16 being formed with the second additional signal layer 161 is formed with secondary shielding layer 162; Between first shielding board 15 and data-signal layer, and between secondary shielding substrate 16 and signal substrate 14, be all formed with bonding glue-line 17; First screen layer 152 is reference planes M near the surface of data-signal layer and secondary shielding layer 162 near the surface of data-signal layer.Namely, in disclosure embodiment, the opposite side of this signal substrate 14 is not formed with ground stratum reticulare, and the opposite side of this signal substrate is only formed with other structures 143 equal with the thickness of ground stratum reticulare.

First aspect, above-mentioned first shielding board 15, the thickness of each substrate in signal substrate 14 and secondary shielding substrate 16 all can be 25 μm, the thickness of this bonding glue-line 17 can equal 25 μm, this the first additional signal layer 151, the thickness of the second additional signal layer 161 and data-signal layer all can be 18 μm, the thickness of other structures 143 equal with the thickness of ground stratum reticulare can be 12 μm, now, when reference planes M is the first screen layer 152 near data-signal layer surperficial, this reference planes M and data signal line C1, the distance of data signal line C2 is 68 μm, when reference planes M is secondary shielding layer 162 near data-signal layer surperficial, this reference planes M and data signal line C1, the distance of data signal line C2 is 105 μm.This shows in disclosure embodiment, the distance of data signal line and reference planes is all greater than the distance 25 μm of data signal line and reference planes in correlation technique.

Second aspect, above-mentioned first shielding board 15, the thickness of each substrate in signal substrate 14 and secondary shielding substrate 16 can also be 25 μm, the thickness of bonding glue-line 17 can also be 15 μm, this the first additional signal layer 151, second additional signal layer 161, the thickness of other structures 143 equal with the thickness of ground stratum reticulare all can be 12 μm, the thickness of data-signal layer can be 18 μm, now, when reference planes M is the first screen layer 152 near data-signal layer surperficial, this reference planes M and data signal line C1, the distance of data signal line C2 is 52 μm, when reference planes M is secondary shielding layer 162 near data-signal layer surperficial, this reference planes M and data signal line C1, the distance of data signal line C2 is 89 μm.This shows in disclosure embodiment, the distance of data signal line and reference planes is all greater than the distance 25 μm of data signal line and reference planes in correlation technique.

The third aspect, above-mentioned first shielding board 15, the thickness of each substrate in signal substrate 14 and secondary shielding substrate 16 all can be 25 μm, the thickness of this bonding glue-line 17 can equal 15 μm, this the first additional signal layer 151, the thickness of the second additional signal layer 161 and data-signal layer all can be 18 μm, the thickness of other structures 143 equal with the thickness of ground stratum reticulare can be 12 μm, now, when reference planes M is the first screen layer 152 near data-signal layer surperficial, this reference planes M and data signal line C1, the distance of data signal line C2 is 58 μm, when reference planes M is secondary shielding layer 162 near data-signal layer surperficial, this reference planes M and data signal line C1, the distance of data signal line C2 is 95 μm.This shows in disclosure embodiment, the distance of data signal line and reference planes is all greater than the distance 25 μm of data signal line and reference planes in correlation technique.

Fourth aspect, above-mentioned first shielding board 15, the thickness of each substrate in signal substrate 14 and secondary shielding substrate 16 all can be 25 μm, the thickness of this bonding glue-line 17 can equal 25 μm, this the first additional signal layer 151, second additional signal layer 161, the thickness of other structures 143 equal with the thickness of ground stratum reticulare all can be 12 μm, the thickness of data-signal layer can be 18 μm, now, when reference planes M is the first screen layer 152 near data-signal layer surperficial, this reference planes M and data signal line C1, the distance of data signal line C2 is 62 μm, when reference planes M is secondary shielding layer 162 near data-signal layer surperficial, this reference planes M and data signal line C1, the distance of data signal line C2 is 99 μm.This shows in disclosure embodiment, the distance of data signal line and reference planes is all greater than the distance 25 μm of data signal line and reference planes in correlation technique.

As shown in Fig. 8-1, this signal transmitting apparatus 1 can also comprise: power supply board H, the side of this power supply board H can be formed with voltage signal layer, this voltage signal layer can comprise: voltage signal line D1 and voltage signal line D2, and this power management chip 12 can be connected with two single data signal wires by two voltage signal lines.Example, one end of voltage signal line D1 can be connected with power management chip 12, and the other end of voltage signal line D1 can be connected with data signal line C1, and power management chip 12 can by the voltage on voltage signal line D1 image data signal wire C1; One end of voltage signal line D2 can be connected with power management chip 12, and the other end of voltage signal line D2 can be connected with data signal line C2, and power management chip 12 can by the voltage on voltage signal line D2 image data signal wire C2.

It should be noted that, in the signal transmitting apparatus 1 that disclosure embodiment provides, the characteristic impedance of any single data signal wire can equal 90 Ω, namely the characteristic impedance of this data signal line C1 and data signal line C2 is equal to 90 Ω, when the characteristic impedance of any data signal line equals 90 Ω, the quality of the signal that this data signal line transmits is better.Optionally, the characteristic impedance of this voltage signal line D1 and voltage signal line D2 also can equal 90 Ω.Example, Fig. 8-3 is a kind of eye pattern schematic diagram according to an exemplary embodiment, as shown in Fig. 8-3, in the signal transmitting apparatus that disclosure embodiment provides, the eye pattern P1 that the good signal of the quality that data signal line transmits is corresponding, is positioned at outside this standard eye pattern Q.As can be seen here, the signal quality that the data signal line in the signal transmitting apparatus that disclosure embodiment provides transmits is better, and the accuracy of this data signal line signal transmission is higher.

In sum, due in the signal transmitting apparatus that disclosure embodiment provides, first aspect, when signal processing chip and this USB connector are by this data signal line transmitting high-frequency signal, this regulon can the Signal transmissions of blocking voltage signal wire, make when data signal line transmitting high-frequency signal, not by the impact of voltage signal wire; Second aspect, any single data signal wire in two single data signal wires and the distance of reference planes are greater than the distance of data signal line and reference planes in correlation technique, therefore, in the signal transmitting apparatus that disclosure embodiment provides, the duration of charging of the electric capacity smaller capacitive that data signal line and reference planes are formed is less, the third aspect, the sectional area of any single data signal wire in this two single data signal wire is greater than the sectional area of data signal line in correlation technique.Voltage on this data signal line adopting oscillograph to obtain becomes large.The slope of the eye pattern that the signal that data signal line transmits is corresponding increases, on the data signal line obtained by oscillograph, the eye pattern of signal transmission is close outside standard eye pattern mask, on the data signal line obtained by oscillograph, the eye pattern of signal transmission is close outside standard eye pattern mask, so, improve the signal quality that data signal line transmits, improve the accuracy of Signal transmissions.

Disclosure embodiment provides a kind of terminal, and this terminal can comprise the signal transmitting apparatus 1 as shown in Fig. 2-1, Fig. 3-1, Fig. 4-1, Fig. 5-1, Fig. 6-1, Fig. 7-1 or Fig. 8-1.Example, this terminal can be mobile phone, computing machine, digital broadcast terminal, messaging devices, game console, tablet device, Medical Devices, body-building equipment or personal digital assistant.

In sum, due in the signal transmitting apparatus in the terminal that disclosure embodiment provides, the voltage signal line be connected with power management chip is in series with regulon, and this regulon is used for the Signal transmissions of the blocking voltage signal wire when voltage signal line transmitting high-frequency signal, the Signal transmissions of forward voltage signal wire when voltage signal line transmission low frequency signal.When this signal processing chip and this USB connector are by this data signal line transmitting high-frequency signal, this regulon can the Signal transmissions of blocking voltage signal wire, make when data signal line transmitting high-frequency signal, not by the impact of voltage signal wire, so, improve the signal quality that data signal line transmits, improve the accuracy of Signal transmissions.

Those skilled in the art, at consideration instructions and after putting into practice invention disclosed herein, will easily expect other embodiment of the present disclosure.The application is intended to contain any modification of the present disclosure, purposes or adaptations, and these modification, purposes or adaptations are followed general principle of the present disclosure and comprised the undocumented common practise in the art of the disclosure or conventional techniques means.Instructions and embodiment are only regarded as exemplary, and true scope of the present disclosure and spirit are pointed out by claim below.

Should be understood that, the disclosure is not limited to precision architecture described above and illustrated in the accompanying drawings, and can carry out various amendment and change not departing from its scope.The scope of the present disclosure is only limited by appended claim.

Claims

1. a signal transmitting apparatus, is characterized in that, described signal transmitting apparatus comprises: signal processing chip, power management chip and general-purpose serial bus USB connector,

2. signal transmitting apparatus according to claim 1, is characterized in that,

Described regulon is magnetic bead group, and each described magnetic bead group comprises at least one magnetic bead.

3. signal transmitting apparatus according to claim 2, is characterized in that,

The inductance parameters of arbitrary described magnetic bead group is 1000 Ω.

4. the signal transmitting apparatus according to Claims 2 or 3, is characterized in that,

Described magnetic bead group is a magnetic bead;

5. signal transmitting apparatus according to claim 1, is characterized in that, described signal transmitting apparatus also comprises: signal substrate,

6. signal transmitting apparatus according to claim 5, is characterized in that,

The distance of arbitrary described data signal line and reference planes is greater than 25 μm, described reference planes is provided with the return flow path of the signal of described two single data signal wires.

7. signal transmitting apparatus according to claim 6, is characterized in that, described signal transmitting apparatus also comprises: the first shielding board and secondary shielding substrate, and described first shielding board, described signal substrate, described secondary shielding substrate superpose successively,

8. signal transmitting apparatus according to claim 1, is characterized in that,

The characteristic impedance of arbitrary described data signal line equals 90 Ω.

9. a terminal, is characterized in that, described terminal comprise as arbitrary in claim 1 to 8 as described in signal transmitting apparatus.