CN105097826A - Goa单元及其制作方法、显示基板、显示装置 - Google Patents
Goa单元及其制作方法、显示基板、显示装置 Download PDFInfo
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Abstract
本发明提供了一种GOA单元及其制作方法、显示基板、显示装置,通过在GOA单元电容结构处设置位于基板之上的第一金属层;位于所述第一金属层之上的绝缘层,所述绝缘层经过减薄处理工艺后具有第一厚度,所述第一厚度小于所述显示基板中与所述绝缘层同层设置的其他图层的厚度;位于所述绝缘层之上的第二金属层。从而使电容两极之间的绝缘层具有较小的厚度,可在确保GOA电路中电容数值大小不变的情况下,使构成电容两极的金属图案面积减小,近而可减小GOA电路的面积,实现了平板显示产品的边框进一步减小的目的。
Description
技术领域
本发明涉及显示技术领域,具体涉及一种GOA单元及其制作方法、显示基板、显示装置。
背景技术
随着薄膜场效应晶体管液晶显示(TFT-LCDDisplay)技术的发展和工业技术的进步,液晶显示器件生产成本降低、制造工艺的日益完善,薄膜晶体管阵列基板显示器(TFT-LCD)已经取代了阴极射线管显示成为平板显示领域的主流技术。
目前,对于薄膜晶体管阵列基板显示器(TFT-LCD),其周边芯片有集成到玻璃基板上的趋势,即将外围的芯片省略,直接在玻璃基板上制作驱动电路。目前的技术中,栅极驱动信号是通过外部的柔性线路板上的芯片,输出给玻璃基本上的栅电极,柔性电路板在玻璃基板工艺完成后通过热压连接在一起。而栅极驱动集成的技术(GOA技术)则不需要柔性线路板,而是直接将驱动线路做在玻璃基板上,这样既节约了成本,也减小了边框尺寸。
目前,常见的GOA(GatedriverOnArray)电路可由多个TFT(薄膜晶体管)和电容C组成,现有技术中还存在多种不同的GOA电路,在此不一一描述,但所有的GOA电路中必然都存在电容C。
而现有技术GOA电路中的电容结构一般包括依次排列的第一金属层、绝缘层和第二金属层,第一金属层与第二金属层相平行,并具有相对的部分,形成电容结构。
随着目前窄边框显示设备越来越流行,需要更窄边框的显示器。所以就需要将GOA(GatedriverOnArray)电路做的越来越小,从而节约非显示区域的面积,实现窄边框设计。但是,由于各种负载的要求,使GOA电路中的薄膜晶体管宽度无法降低,同时,由于电容需要抑制栅极信号的输出噪声以及拉低上拉节点PU电位的作用,这对电容的大小起到了一定的限制作用,因此需要构成电容结构的整个第一金属层与第二金属层占用很大的面积(在电容结构处于,平行设置的第一金属层和第二金属层之间还设置有绝缘层),从而限制了GOA电路的宽度,使平板显示产品无法实现更窄的边框设计。
发明内容
本发明提供一种GOA单元及其制作方法、显示基板、显示装置,可实现了平板显示产品的边框进一步减小的目的。
本发明提供方案如下:
一种GOA单元,设置于一显示基板中,所述GOA单元包括电容结构,所述电容结构包括:
位于基板之上的第一金属层;
位于所述第一金属层之上的绝缘层,所述绝缘层经过减薄处理工艺后具有第一厚度,所述第一厚度小于所述显示基板中与所述绝缘层同层设置的其他图层的厚度;
位于所述绝缘层之上的第二金属层。
优选的,所述电容结构还包括:
位于所述第二金属层之上的钝化层;
位于所述钝化层之上的连接电极层,所述连接电极层图案用于连接所述第二金属层与显示基板中的栅线,所述连接电极层图案通过形成于所述钝化层中的过孔,与所述第二金属层电连接。
优选的,所述第一金属层与所述显示基板的栅极金属层同层设置;
所述绝缘层与所述显示基板的栅绝缘层同层设置;
所述第二金属层与所述显示基板的像素电极层同层设置。
优选的,所述绝缘层的厚度为所述栅绝缘层厚度的一半。
本发明实施例提供了一种GOA单元制作方法,所述GOA单元形成于一显示基板中,所述GOA单元包括电容结构,所述方法包括:
在显示基板所述电容结构所在位置处,制作第一金属层图案;
在所述第一金属层之上,制作绝缘层图案,所述绝缘层图案经过减薄处理工艺后具有第一厚度,所述第一厚度小于显示基板中与所述绝缘层同层设置的其他图层的厚度;
在所述绝缘层之上,制作第二金属层图案。
优选的,所述在所述第一金属层之上制作绝缘层图案的过程包括:
在显示基板制作源漏电极层图案的过程中,利用制作源漏电极层图案的掩模板,对所述绝缘层进行减薄处理工艺。
优选的,所述绝缘层的厚度为与所述绝缘层同层设置的显示基板中栅绝缘层厚度的一半。
优选的,所述方法还包括:
在所述第二金属层之上,制作钝化层图案;
在所述钝化层之上,制作连接电极层图案,所述连接电极层图案用于连接所述第二金属层与显示基板中的栅线,所述连接电极层图案通过形成于所述钝化层中的过孔,与所述第二金属层电连接。
本发明实施例还提供了一种显示基板,其具体可包括上述本发明实施例提供的GOA单元。
本发明实施例还提供了一种显示装置,其具体可以包括上述本发明实施例提供的显示基板。
从以上所述可以看出,本发明提供的GOA单元及其制作方法、显示基板、显示装置,通过在GOA单元电容结构中设置位于基板之上的第一金属层;位于所述第一金属层之上的绝缘层,所述绝缘层经过减薄处理工艺后具有第一厚度,所述第一厚度小于所述显示基板中与所述绝缘层同层设置的其他图层的厚度;位于所述绝缘层之上的第二金属层。从而使电容两极之间的绝缘层具有较小的厚度,可在确保GOA电路中电容数值大小不变的情况下,使构成电容两极的金属图案面积减小,近而可减小GOA电路的面积,实现了平板显示产品的边框进一步减小的目的。
附图说明
图1为本发明实施例提供的GOA单元结构示意图一;
图2为本发明实施例提供的GOA单元结构示意图二;
图3为本发明实施例提供的GOA单元结构示意图三;
图4为本发明实施例提供的GOA单元制作方法流程示意图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚,下面将结合本发明实施例的附图,对本发明实施例的技术方案进行清楚、完整地描述。显然,所描述的实施例是本发明的一部分实施例,而不是全部的实施例。基于所描述的本发明的实施例,本领域普通技术人员所获得的所有其他实施例,都属于本发明保护的范围。
除非另作定义,此处使用的技术术语或者科学术语应当为本发明所属领域内具有一般技能的人士所理解的通常意义。本发明专利申请说明书以及权利要求书中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性,而只是用来区分不同的组成部分。同样,“一个”或者“一”等类似词语也不表示数量限制,而是表示存在至少一个。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接,而是可以包括电性的连接,不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系,当被描述对象的绝对位置改变后,则该相对位置关系也相应地改变。
本发明实施例提供了一种GOA单元,设置于一显示基板中,该GOA单元具体可包括TFT结构10区域和电容结构20区域等。
如图1所示,该电容结构20具体可以包括:
形成于基板1之上的第一金属层21;
位于第一金属层21之上的绝缘层22,该绝缘层22经过减薄处理工艺后具有第一厚度,第一厚度小于该显示基板中与绝缘层2同层设置的其他图层的厚度;
位于绝缘层22之上的第二金属层23。
在GOA单元制作过程了,为了减少制作步骤,电容结构20处的绝缘层22通常与TFT结构10处的某一图层同步制作,例如栅绝缘层12,而为了确保TFT结构10处图层的功能作用(例如栅绝缘层11的绝缘作用),在构图时,需要使TFT结构10处的图层具有一定的厚度,使得与该图层同步制作的电容结构20处的绝缘层22也具有的较大的厚度,这就增大了两金属层之间的介质损耗,为了保证电容值,必须加大金属层的面积,从而导致无法缩小GOA电路的面积。
本发明实施例中,电容两极(即第一金属层21和第二金属层23)之间的绝缘层22(即绝缘介质)通过减薄处理后,其厚度相对较薄,从而可在确保GOA电路中电容数值大小不变的情况下,使构成电容两极的金属图案面积减小,近而可减小GOA电路的面积(最终可体现在GOA电路的长度和/或宽度变小),实现了平板显示产品的边框进一步减小的目的。
本发明实施例中所涉及的绝缘层22减薄处理过程,可在绝缘层22(即栅绝缘层12)图案形成过程中实现;也可以在第二金属层23形成之前,利用刻蚀液对已经形成的绝缘层22进行减薄处理;还可以在绝缘层22图案形成之后,在TFT结构10的有源层(Active)13和/或源漏金属层(SD)14图案形成过程中实现,即利用有源层13、源漏金属层14的掩模板(MASK),通过半色调(HalfTone)技术工艺实现。当然,也可以通过其他成熟、可靠的工艺在适当GOA单元制作步骤中实现。
经过减薄处理后的绝缘层22的厚度,可基于GOA单元所需电容的容值,以及基于实现需要所限定的第一金属层21和第二金属层23的面积(宽度)确定。在一具体实施例中,绝缘层22的厚度具体可为与其同步制作的图层例如栅绝缘层12的厚度的一半。
本发明实施例所涉及的第一金属层21,具体可与TFT结构处的栅极金属层11图案同层设置且同步制作。
本发明实施例所涉及的第二金属层23,具体可为TFT结构中像素电极,即第二金属层23可为像素电极的一部分。
如图2所示,本发明实施例所提供的GOA单元在电容结构20区域中还可以设置有钝化层6(PVX),以及设置于钝化层6之上的连接电极24,该连接电极24图案通过形成于钝化层6中的过孔61,与第二金属层23连接,以使像素电极23与栅线(附图未示出)电连接。
由于连接电极24与第二金属层23连接,因此,其也可以作为第二金属层23的一部分,以起到电容一极的作用。
另外,该连接电极24还可以与同样位于钝化层6之上的公共电极(附图未示出)电连接,即该连接电极24可作为一部分公共电极存在。
本发明实施例所提供的GOA单元的一个完整结构示意图可如图3所示,这里需要说明的是,图3所示GOA单元中的TFT结构10仅为示例性说明,在具体实现时,TFT结构10也可以为其他结构。
本发明实施例还提供了一种GOA单元制作方法,用于制作上述本发明实施例通过的GOA单元。
如图4所示,该方法具体可以包括:
在基板1的电容结构20所在位置处,制作第一金属层21图案;
在第一金属层21之上,制作绝缘层22图案,绝缘层22图案经过减薄处理工艺后具有第一厚度,所述第一厚度小于显示基板中与绝缘层22同层设置的其他图层的厚度;
在绝缘层22之上,制作第二金属层23图案。
下面为制作图3所示GOA单元为例,对本发明实施例提供的GOA单元的具体结构及其制作方法进行详细的说明。
1、形成栅极层图案,具体可以包括TFT结构中的栅极11以及电容结构中的第一金属层21。
本发明实施例中,并不限制图案的制作工艺,可采用任意成熟的工艺制备相应的图层图案,例如薄膜沉积、掩膜曝光、刻蚀、剥离等制作工艺。
2、形成第一绝缘层图案,具体可以包括TFT结构10处的栅绝缘层12以及电容结构20处的绝缘层22。
在本发明的其他实施例中,步骤1、2可以合并为一个步骤,即在一次制备工艺中,实现栅极层和第一绝缘层图案的制备,在此不再赘述。
3、形成有源层13图案。
4、形成源漏金属层14图案,并实现绝缘层22的减薄处理。
该步骤中,可以利用源漏金属层14的掩模板(MASK),通过半色调(HalfTone)技术工艺,对绝缘层22进行曝光刻蚀,以实现对绝缘层22的减薄处理。
由于Mask的保护,在源漏金属层14下面的栅绝缘层12完全不会被刻蚀掉,而在沟道的地方虽然没有Mask掩盖,但是由于沟道处的有源层14的材料可为二氧化硅,所以也不会被刻蚀掉,即除了源漏电极以及沟道所在位置处,第一绝缘层即电容结构20中的绝缘层22的厚度都会被刻蚀掉相应的厚度,例如一半厚度,但是由于沟道处的栅绝缘层12的厚度没有发生变化,所以在这个过程中不会对TFT的特性照成影响,如果沟道处的栅绝缘层12的厚度变小,会增加TFT的Ioff电流,进而不能形成很好的开光的性能,由于在TFT结构10处的栅绝缘层12的厚度仍然是保持原来的特性,所以显示面板(Panel)的负载(load),TFT的栅源电容(Cgs),TFT的栅漏(Cgd)等参数的大小也不会受到影响。
5、形成第二绝缘层15图案。
这里需要说明的是,第二绝缘层15薄膜沉积之后,需要刻蚀掉电容结构处的第二绝缘层15的第二绝缘层15。并且源漏金属层14所在位置处的第二绝缘层15形成有过孔71,以便于后续形成的像素电极23与源漏金属层14图案电连接。
6、形成像素电极23图案。
7、形成钝化层6图案。
其中,位于像素电极23的钝化层6中形成有过孔72
8、形成连接电极24。
该连接电极24图案通过过孔72与像素电极23电连接,以使像素电极23与栅线(附图未示出)电连接。
利用上述本发明实施例提供的GOA单元制作方法而形成的GOA单元中,由于电容结构位置处10的绝缘层22的厚度较小,从而可在确保GOA电路中电容数值大小不变的情况下,使构成电容两极的金属图案面积减小,实现了平板显示产品的边框进一步减小的目的。
本发明实施例还提供了一种显示基板,该显示基板中,具体可以包括上述本发明实施例通过的GOA单元。
本发明实施例还提供了一种显示装置,该显示制作具体可以包括上述本发明实施例提供的显示基板。
以上所述仅是本发明的实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以作出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。
Claims (10)
1.一种GOA单元,设置于一显示基板中,所述GOA单元包括电容结构,其特征在于,所述电容结构包括:
位于基板之上的第一金属层;
位于所述第一金属层之上的绝缘层,所述绝缘层经过减薄处理工艺后具有第一厚度,所述第一厚度小于所述显示基板中与所述绝缘层同层设置的其他图层的厚度;
位于所述绝缘层之上的第二金属层。
2.如权利要求1所述的GOA单元,其特征在于,所述电容结构还包括:
位于所述第二金属层之上的钝化层;
位于所述钝化层之上的连接电极层,所述连接电极层图案用于连接所述第二金属层与显示基板中的栅线,所述连接电极层图案通过形成于所述钝化层中的过孔,与所述第二金属层电连接。
3.如权利要求1所述的GOA单元,其特征在于,所述第一金属层与所述显示基板的栅极金属层同层设置;
所述绝缘层与所述显示基板的栅绝缘层同层设置;
所述第二金属层与所述显示基板的像素电极层同层设置。
4.如权利要求3所述的GOA单元,其特征在于,所述绝缘层的厚度为所述栅绝缘层厚度的一半。
5.一种GOA单元制作方法,所述GOA单元形成于一显示基板中,所述GOA单元包括电容结构,其特征在于,所述方法包括:
在显示基板所述电容结构所在位置处,制作第一金属层图案;
在所述第一金属层之上,制作绝缘层图案,所述绝缘层图案经过减薄处理工艺后具有第一厚度,所述第一厚度小于显示基板中与所述绝缘层同层设置的其他图层的厚度;
在所述绝缘层之上,制作第二金属层图案。
6.如权利要求1所述的方法,其特征在于,所述在所述第一金属层之上制作绝缘层图案的过程包括:
在显示基板制作源漏电极层图案的过程中,利用制作源漏电极层图案的掩模板,对所述绝缘层进行减薄处理工艺。
7.如权利要求5或6所述的方法,其特征在于,所述绝缘层的厚度为与所述绝缘层同层设置的显示基板中栅绝缘层厚度的一半。
8.如权利要求5所述的方法,其特征在于,还包括:
在所述第二金属层之上,制作钝化层图案;
在所述钝化层之上,制作连接电极层图案,所述连接电极层图案用于连接所述第二金属层与显示基板中的栅线,所述连接电极层图案通过形成于所述钝化层中的过孔,与所述第二金属层电连接。
9.一种显示基板,其特征在于,包括权利要求1至4任一项所述GOA单元。
10.一种显示装置,其特征在于,包括权利要求9所述的显示基板。
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