CN105090786A - Illuminating device - Google Patents
Illuminating device Download PDFInfo
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- CN105090786A CN105090786A CN201510466403.XA CN201510466403A CN105090786A CN 105090786 A CN105090786 A CN 105090786A CN 201510466403 A CN201510466403 A CN 201510466403A CN 105090786 A CN105090786 A CN 105090786A
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- heat
- lighting device
- cover body
- lamp
- parts
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses an illuminating device. The illuminating device comprises a light transmitting cover, a radiating cover, a lamp cap, a lamp board, multiple LED sub light sources and a bent pipe, wherein the light transmitting cover is an arc structure; the end part of the light transmitting cover extends and is bent to form a slide part; the radiating cover comprises a mounting plate and a cover body; the cover body is an arc structure; the two ends of the cover body are respectively connected with the two side edges of the mounting plate; the edges of the side edges of the mounting plate extend and are bent to form bent parts; the bent parts and the end parts of the cover body are encircled to form a chute; the slide part slides in the chute; the multiple LED sub light sources are arranged on one side surface, far from the mounting plate, of the lamp board in sequence at intervals; the bent pipe is arranged in the lamp board, and is a hollow mechanism; a heat exchange flowing medium is filled in the bent pipe; and the bent pipe has a liquid inlet and a liquid outlet. As the illuminating device is provided with the radiating cover, the bent pipe and the lamp board, the LED sub light sources are mounted on the lamp board, and the radiating cover, the bent pipe and the lamp board are cooperated for radiating, the LED lamp tube radiating performance can be greatly improved.
Description
Technical field
The present invention relates to lighting technical field, particularly relate to a kind of lighting device.
Background technology
Electric energy conversion directly can be become visible ray by LED (LightEmittingDiode, light emitting diode) efficiently, and has the service life reaching tens thousand of hours ~ 100,000 hours.Adopt LED to be that the light fixture of light source is called LED lamp, it is called as the most frequently used lighting with the advantage such as of fine quality, durable, energy-conservation.Along with the develop rapidly in recent years of LED lamp technology, LED lamp product replaces original fluorescent lighting fixture substantially.
At present, the drawback that LED lamp self exists is, LED lamp light efficiency is comparatively large by the impact of the junction temperature of LED lamp, and higher junction temperature of chip will cause light efficiency to occur obviously declining, and can have influence on the service life of LED lamp.Because LED is when luminescence, the temperature of himself can constantly raise, and in the illumination work continued, if the heat that LED produces can not exhale in time, will cause the damage of LED, affect the service life of LED.Therefore, the heat dissipation problem solving LED is most important for the performance promoting LED.
Such as, Chinese Patent Application No. is the patent of 201220413753.1, disclose a kind of heat radiating LED lamp, its lampshade specifically openly comprising lamp holder, heat loss through convection lamp body and match with heat loss through convection lamp body, LED lamp panel is provided with in described heat loss through convection lamp body, described LED lamp panel is provided with LED, described heat loss through convection lamp body be provided with convection cavity and all communicate with convection cavity to head piece and convective tank.Invention structure is simple, cost is lower, and by arranging heat loss through convection lamp body structure, heat dispersion is greatly enhanced.
Such as, Chinese Patent Application No. is the patent of 201410360995.2, discloses a kind of lamp tube heat radiator of LED, and it specifically openly comprises a body and two fans; Body arranges support portion, installation portion and some heat sink strips; Installation portion is arranged at the side of support portion, for fixedly mounting outside LED; Each heat sink strip is arranged at the opposite side of support portion respectively; Support portion also offers some row louvres; The both sides of each row louvre are respectively a heat sink strip; Installation portion is arranged cavity portion, heating column and some thermal holes; Body two ends fixedly mount a fan respectively, for blowing in the middle part of body.Fan in the lamp tube heat radiator of above-mentioned LED is blown in the middle part of body, the air-flow formed blows to LED, and flow in space between cavity portion and heat sink strip, thus by the form of convection current, the heat in the space accumulated in lampshade, in cavity portion and between heat sink strip is taken away timely, avoid the accumulation that heat is a large amount of for a long time, cause the electronic devices and components in LED to burn out, extend its service life.
Such as, Chinese Patent Application No. is the patent of 201210332183.8, disclose a kind of Efficient LED lamp radiator, it specifically openly comprises radiator body, described radiator body is linked into an integrated entity by red copper heating column and Duo Gen and the fin outwards dispersing layout forms, and red copper heating column adopts hot pressing mode to be fixed on fin central authorities, wherein, the surface of fin is curved surface, is provided with heat radiation gap between fin.The invention has the beneficial effects as follows: adopt the heat conduction of copper post, strengthen the ability that heat energy is derived, solve existing thermal chokes problem, spreader surface complementary surface design simultaneously, add and air contact surfaces, improve the heat dispersion of radiator, reduce the light decay of LED, extend the life-span of LED, and there is structure feature simple, easy to use.
But lighting device disclosed in above-mentioned patent still exists the poor problem of heat dispersion, when especially adopting the LED of relatively high power as light source, its heating problem is obvious all the more.
Summary of the invention
Based on this, be necessary the lighting device that a kind of good heat dispersion performance is provided.
A kind of lighting device, comprising:
Diffuser, described diffuser is arcuate structure, and the end of described diffuser extends and is bent to form sliding part;
Heat dissipating housing, described heat dissipating housing comprises installing plate and cover body, described cover body is arcuate structure, the two ends of described cover body are connected with the dual-side of described installing plate respectively, the side edge of described installing plate extends and is bent to form kink, the end of described kink and described cover body surrounds sliding tray, and described sliding part slides and is arranged in described sliding tray;
Lamp holder, described lamp holder is connected with the end of described installing plate;
Lamp plate, described lamp plate fits in the side of described installing plate away from described cover body;
Multiple LED sub-light source, multiple described LED sub-light source is arranged at intervals at the side of described lamp plate away from described installing plate successively; And
Folds pipe, described folds pipe is arranged in described lamp plate, and described folds pipe is hollow mechanism, and described folds pipe inside is filled with heat exchange liquid, and described folds pipe has inlet and liquid outlet.
Wherein in an embodiment, described folds pipe is round tubular structure.
Wherein in an embodiment, described folds pipe is fold-line-shaped structure.
Wherein in an embodiment, described folds pipe is helicoidal structure.
Wherein in an embodiment, the diameter of described folds pipe is 1mm ~ 1.5mm.
Wherein in an embodiment, the diameter of described folds pipe is 1.2mm ~ 1.4mm.
Wherein in an embodiment, the diameter of described folds pipe is 1.3mm.
LED sub-light source by arranging heat dissipating housing, folds pipe and lamp plate, and is installed on lamp plate by above-mentioned lighting device, and the collaborative heat radiation of heat dissipating housing, folds pipe and lamp plate, can greatly improve LED lamp tube heat dispersion.
Accompanying drawing explanation
Fig. 1 is the structural representation of the lighting device of an embodiment of the present invention;
Fig. 2 is the structural representation of another angle of the lighting device shown in Fig. 1;
Fig. 3 is the structural representation of another angle of the lighting device shown in Fig. 1;
Fig. 4 is the structural representation of the lighting device of another embodiment of the present invention;
Fig. 5 is the structural representation of the lighting device of another embodiment of the present invention;
Fig. 6 is the structural representation of the lighting device of another embodiment of the present invention;
Fig. 7 is the structural representation of the lighting device of another embodiment of the present invention;
Fig. 8 is the partial structurtes schematic diagram of the lighting device of another embodiment of the present invention.
Detailed description of the invention
For the ease of understanding invention, below with reference to relevant drawings, invention is described more fully.The better embodiment of invention is given in accompanying drawing.But invention can realize in many different forms, is not limited to embodiment described herein.On the contrary, provide the object of these embodiments be make to disclosure of an invention content understanding more thorough comprehensively.
It should be noted that, when element is called as " being fixed on " another element, directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may there is centering elements simultaneously.Term as used herein " vertical ", " level ", "left", "right" and similar statement just for illustrative purposes, do not represent it is unique embodiment.
Unless otherwise defined, all technology used herein are identical with the implication that the those skilled in the art belonging to invention understand usually with scientific terminology.The object of term just in order to describe concrete embodiment used in the description of invention herein, is not intended to be restriction invention.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
Such as, a kind of lighting device, comprising: diffuser, and described diffuser is arcuate structure, and the end of described diffuser extends and is bent to form sliding part; Heat dissipating housing, described heat dissipating housing comprises installing plate and cover body, described cover body is arcuate structure, the two ends of described cover body are connected with the dual-side of described installing plate respectively, the side edge of described installing plate extends and is bent to form kink, the end of described kink and described cover body surrounds sliding tray, and described sliding part slides and is arranged in described sliding tray; Lamp holder, described lamp holder is connected with the end of described installing plate; Lamp plate, described lamp plate fits in the side of described installing plate away from described cover body; Multiple LED sub-light source, multiple described LED sub-light source is arranged at intervals at the side of described lamp plate away from described installing plate successively; And folds pipe, described folds pipe is arranged in described lamp plate, and described folds pipe is hollow mechanism, and described folds pipe inside is filled with heat exchange liquid, and described folds pipe has inlet and liquid outlet.
In order to understand above-mentioned lighting device further, another example is, a kind of lighting device, and it comprises the lighting device described in above-mentioned any embodiment.
See also Fig. 1 and Fig. 3, lighting device 10 comprises: diffuser 100, heat dissipating housing 200, lamp holder 300, lamp plate 400 and multiple LED sub-light source 500.Diffuser 100 is arranged at heat dissipating housing 200, and lamp holder 300 is arranged at the end of heat dissipating housing 200, and lamp plate 400 is arranged at heat dissipating housing 200, and multiple LED sub-light source 500 is arranged at lamp plate 400.
Refer to Fig. 3, diffuser 100 is arcuate structure, and the end of diffuser 100 extends and is bent to form sliding part 110.Diffuser 100 for playing atomizing to light, thus can make the light that sends from lighting device 10 softer, to protect human eye health, and then makes illuminating effect more even.
Refer to Fig. 3, heat dissipating housing 200 comprises installing plate 210 and cover body 220, cover body 210 is arcuate structure, the two ends of cover body 210 are connected with the dual-side of installing plate 210 respectively, the side edge of installing plate 210 extends and is bent to form kink 211, kink 211 surrounds sliding tray 212 with the end of cover body 220, and sliding part 110 slides and is arranged in sliding tray 212.Like this, only need the sliding part 110 of diffuser 100 be slipped in sliding tray 212, diffuser 100 and heat dissipating housing 200 can be fitted together, in like manner, when diffuser 100 is dismantled from heat dissipating housing 200 by needs, the sliding part 110 of diffuser 100 is skidded off sliding tray 212 outer, assembly and disassembly operation is more simple and convenient.
See also Fig. 2 and Fig. 3, lamp holder 300 is connected with the end of installing plate 210.Such as, described lamp holder is for lamp socket mounted externally; And for example, described lamp holder is provided with contact pin, and described contact pin is used for being electrically connected with the lamp socket of outside, provides power supply to give the normal work of described LED sub-light source.
Refer to Fig. 3, lamp plate 400 fits in the side of installing plate 210 away from cover body 220.Such as, the thickness of described lamp plate is 1.5cm ~ 2cm; And for example, the thickness of described lamp plate is 1.6cm ~ 1.8cm; And for example, the thickness of described lamp plate is 1.7cm.
Refer to Fig. 3, multiple LED sub-light source 500 is arranged at intervals at the side of lamp plate 400 away from installing plate 210 successively.Such as, described LED sub-light source is LED chip; And for example, described LED sub-light source is LED; And for example, described LED sub-light source is LED spotlight.Such as, described lighting device also comprises circuit unit, and described circuit unit and described LED sub-light source are electrically connected.
It should be noted that, when LED sub-light source 500 works, the luminous heat produced can be passed to lamp plate 400, afterwards, installing plate 210 is passed to again by lamp plate 400, finally, be passed to cover body 220 by installing plate 210 again, in the process that heat transmits, lamp plate 400, installing plate 210 and cover body 220 all can to dissipated heats in air dielectric.Like this, can heat dissipation path be optimized, and can cooling surface area be increased.
In order to the light making described lighting device send is softer, such as, described lighting device also comprises multiple OLED sub-light source, multiple OLED sub-light source is arranged at intervals at the side of lamp plate away from installing plate successively, LED sub-light source and OLED sub-light source are arranged alternately, so, utilize the composite effect of OLED sub-light source and LED sub-light source, the light that described lighting device can be made to send is softer.
Such as, OLED sub-light source comprises the anode transparent glass substrate, ITO conductive anode, NPB hole transmission layer, the NPB luminescent layer mixing MQA, the Alq (Alq that superpose setting successively
3) electron transfer layer, Al conductive cathode and negative electrode transparent glass substrate, wherein, the fluorescence matrix of the luminescent layer of OLED sub-light source is NPB.
The voltage difference of 2V ~ 10V is applied between conductive anode and conductive cathode, the hole of anode and the electronics of negative electrode can be made to be transferred to EL respectively by hole and electron transfer layer, produce power exciton when hole and electronics meet in luminescent layer, thus excite the light emitting molecule in EL to send green glow.Certainly, the glow color of each OLED sub-light source is not limited to green glow, and that is, fluorescent dopants is not limited to MQA, can also adjust fluorescent dopants according to actual needs, only need change the material of luminescent layer doping.Such as, fluorescent dopants also comprises pyrene, rubrene DCM or its mixture, and so, the glow color that OLED sub-light source is corresponding is respectively blue light, gold-tinted or orange red light.So, multiple OLED sub-light source can be made to have multiple different glow color respectively.
In order to improve the uniformity of described OLED light source module light, such as, described OLED sub-light source is the flaky texture with rectangle plane; And for example, described OLED sub-light source is the flaky texture with rectangle cambered surface; And for example, multiple described OLED sub-light source is set in parallel in described reflectance coating, so, can improve the uniformity of described OLED light source module light.
In order to improve the heat dispersion of described lighting device further, such as, refer to Fig. 4, described lighting device also comprises radiating cylinder body 600, it is outside that radiating cylinder body 600 is arranged at cover body 220, the inner vacuum of radiating cylinder body 600 is arranged, the inside of radiating cylinder body 600 is filled with heat dissipating fluid 610, the radiating cylinder body 600 arranged by inner vacuum, evaporation and the degree of condensation of heat dissipating fluid 610 can be strengthened, thus more heats can be taken away from cover body 220, so, the heat dispersion of described lighting device can be improved further.
In order to improve the heat dispersion of described lighting device further, such as, described heat-dissipating cylinder has arcuate cross-section; And for example, described heat-dissipating cylinder inside arranges multiple radiating area; And for example, adjacent described radiating area is interconnected, and so, can improve the heat dispersion of described lighting device further.
In order to increase the efficiently radiates heat area of described lighting device further, thus the heat dispersion of described lighting device can be improved, such as, refer to Fig. 5, described lighting device also comprises radiating piece 700, radiating piece 700 comprises heat-removal bar 710, heat sink 720 and radiation tooth 730, the first end of heat-removal bar 710 is arranged at the outside of described cover body 220, second end of heat-removal bar 710 is connected with heat sink 720, radiation tooth 730 is arranged at the side of heat sink 720 away from heat-removal bar 710, so, the efficiently radiates heat area of described lighting device can be increased further, thus the heat dispersion of described lighting device can be improved.
In order to increase the efficiently radiates heat area of described lighting device further, such as, multiple described radiation tooth is set; And for example, three described radiation tooths are set; And for example, three described radiation tooths are arranged at intervals at the side of described heat sink away from described heat-removal bar successively; And for example, described heat-removal bar is circular rod-shaped configuration; And for example, described heat-removal bar is hollow-core construction; And for example, multiple described radiating piece is set; And for example, the distance between two adjacent described radiating pieces is equal, so, can increase the efficiently radiates heat area of described lighting device further.
In order to improve the heat dispersion of described lighting device further, such as, refer to Fig. 6, installing plate 210 is provided with heat radiation oil reservoir 211 away from a side of cover body 220, and lamp plate 400 is fitted with heat radiation oil reservoir 211, by arranging heat radiation oil reservoir 211, can lamp plate 400 be passed on installing plate 210 rapidly, and then be delivered on cover body 220 again, so, the heat dispersion of described lighting device can be improved further.Such as, the thickness of described heat radiation oil reservoir is 0.2cm ~ 0.5cm; And for example, the thickness of described heat radiation oil reservoir is 0.3cm ~ 0.4cm; And for example, the thickness of described heat radiation oil reservoir is 0.35cm.
In order to strengthen air circulation degree, thus the heat dispersion of described lighting device can be improved, such as, refer to Fig. 7, lamp plate 400 is provided with air vent 410, and one end of air vent 410 is communicated with the inner space of diffuser 100, the other end of air vent 410 is communicated with installing plate 210, so, air circulation degree can be strengthened, thus the heat dispersion of described lighting device can be improved.
In order to strengthen air circulation degree further, thus the heat dispersion of described lighting device can be improved, such as, multiple described air vent is set; And for example, the rectangular array distribution of multiple described air vents is in described lamp plate; And for example, described air vent is circular cavernous structure.
In order to improve the heat dispersion of described lighting device further, such as, refer to Fig. 8, described lighting device also comprises folds pipe 800, folds pipe 800 is arranged in lamp plate 400, folds pipe 800 is hollow mechanism, folds pipe 800 inside is filled with heat exchange liquid, folds pipe 800 has inlet 810 and liquid outlet 820, heat exchange liquid is flowed into by inlet 810, and is flowed out by liquid outlet 820, so, the heat that lamp plate 400 absorbs from LED sub-light source and OLED sub-light source can be taken away rapidly, thus the heat dispersion of described lighting device can be improved further.Such as, described folds pipe is round tubular structure.Described folds pipe is fold-line-shaped structure; And for example, described folds pipe is helicoidal structure.Wherein in an embodiment, the diameter of described folds pipe is 1mm ~ 1.5mm; And for example, the diameter of described folds pipe is 1.2mm ~ 1.4mm; And for example, the diameter of described folds pipe is 1.3mm.
LED sub-light source 500 by arranging the heat dissipating housing 200 and lamp plate 400 that mutually support, and is installed on lamp plate 400 by above-mentioned lighting device, and heat dissipating housing 200 and the collaborative heat radiation of lamp plate 400, greatly can improve the heat dispersion of above-mentioned lighting device.
In order to improve the heat dispersion of described lighting device further, such as, described heat dissipating housing, described lamp plate, described heat-dissipating cylinder and described radiating piece all adopt NEW TYPE OF COMPOSITE heat radiation reasonable offer to obtain, and described NEW TYPE OF COMPOSITE heat radiation alloy comprises the heat-sink shell, heat-conducting layer and the heat dissipating layer that superpose setting successively; And for example, described heat-sink shell, described heat-conducting layer or different setting identical with the material of described heat dissipating layer; And for example, described LED sub-light source and OLED sub-light source are arranged at described heat-sink shell; And for example, the heat-conductive characteristic of described heat-sink shell, described heat-conducting layer and described heat dissipating layer successively decreases successively, define heat-conductive characteristic gradient, thus optimize the heat dissipation path of described NEW TYPE OF COMPOSITE heat radiation alloy further, drastically increase the heat dispersion of described heat dissipating housing, described lamp plate, described heat-dissipating cylinder and described radiating piece, and then improve the heat dispersion of described lighting device, so, the radiating requirements of the large described lighting device of caloric value can be met.
Such as, the lighting device of an embodiment of the present invention, wherein, and the described heat-sink shell of described NEW TYPE OF COMPOSITE heat radiation alloy, it comprises each component of following mass parts:
Copper 90 parts ~ 92 parts, 2 parts ~ 4.5 parts, aluminium, 1 part ~ 2.5 parts, magnesium, 0.5 part ~ 0.8 part, nickel, iron 0.1 part ~ 0.3 part, vanadium 1.5 parts ~ 4.5 parts, 0.1 part ~ 0.4 part, manganese, titanium 0.5 part ~ 0.8 part, chromium 0.5 part ~ 0.8 part, vanadium 0.5 part ~ 0.8 part, silicon 0.8 part ~ 15 parts and 0.5 part ~ 2 parts Graphenes.
First, what the copper (Cu) that above-mentioned heat-sink shell contains 90 parts ~ 92 parts can make heat-sink shell has the energy that absorbs heat preferably.When the mass parts of copper is 90 parts ~ 92 parts, the coefficient of heat conduction of heat-sink shell can reach more than 365W/mK, rapidly the heat that LED sub-light source and OLED sub-light source produce can be siphoned away, and then be dispersed in the structure of heat-sink shell entirety with making even heat, to prevent heat from accumulating on LED sub-light source and the contact position between OLED sub-light source and heat-sink shell, cause the generation of hot-spot phenomenon.And the density of heat-sink shell is less than the density of fine copper, effectively can alleviate the weight of heat-sink shell like this, be more conducive to manufacture is installed, also greatly reduce cost simultaneously.Wherein, the coefficient of heat conduction is defined as: per unit length, every K, can transmit the energy of how many W, unit is W/mK, and wherein " W " refers to thermal power unit, and " m " represents long measure rice, and " K " is absolute temperature units, the larger explanation heat absorption capacity of this numerical value is better.In addition, by adding the Graphene of 0.5 part ~ 2 parts, can effectively improve its coefficient of heat conduction, and then improving the heat absorption capacity of described heat-sink shell.
Secondly, heat-sink shell contain mass parts be 2 parts ~ 4.5 parts aluminium, the nickel of 1 part ~ 2.5 parts, 0.5 part ~ 0.8 part, magnesium, the iron of 0.1 part ~ 0.3 part, the vanadium of 1.5 parts ~ 4.5 parts, the manganese of 0.1 part ~ 0.4 part, the titanium of 0.5 part ~ 0.8 part, the chromium of 0.5 part ~ 0.8 part and the vanadium of vanadium 0.5 part ~ 0.8 part.Relative to fine copper material, the ductility of heat-sink shell, toughness, intensity and resistance to elevated temperatures improve all greatly, and not easy-sintering; Like this, when LED sub-light source and OLED sub-light source are installed on heat-sink shell, the high temperature that just can prevent LED sub-light source and OLED sub-light source from producing causes damage to heat-sink shell, further, having good ductility, toughness and intensity also can prevent heat-sink shell be subject to excessive stresses when installing described LED sub-light source and OLED sub-light source and cause distortion.Wherein, heat-sink shell contains the nickel (Ni) that mass parts is 0.5 part ~ 0.8 part, can improve the resistance to elevated temperatures of heat-sink shell.And for example, it is that the vanadium (V) of 1.5 parts ~ 4.5 parts can suppress heat-sink shell grain growth that heat-sink shell contains mass parts, obtains more tiny grain structure, to reduce the fragility of heat-sink shell, improve the mechanical property of heat-sink shell entirety, to improve toughness and intensity.And for example, heat-sink shell contains the titanium (Ti) that mass parts is 0.5 part ~ 0.8 part, can make the crystal grain miniaturization of heat-sink shell, to improve the ductility of heat-sink shell.
Finally, heat-sink shell also comprises the silicon (Si) that mass parts is 0.8 part ~ 15 parts, when heat-sink shell contains appropriate silicon, under the prerequisite not affecting heat-sink shell heat absorption capacity, can effectively promote hardness and the abrasion resistance of heat-sink shell.But, through repeatedly theory analysis and the discovery of experiment evidence, when the quality of silicon in heat-sink shell is too many, such as, when mass percent is more than more than 15 parts, the appearance distribution black particles of heat-sink shell can be made, and ductility reduces, and is unfavorable for the producing shaped of heat-sink shell.
Such as, the lighting device of an embodiment of the present invention, wherein, and the described heat-conducting layer of described NEW TYPE OF COMPOSITE heat radiation alloy, it comprises each component of following mass parts:
Copper 60 parts ~ 65 parts, 55 parts ~ 60 parts, aluminium, 0.8 part ~ 1.2 parts, magnesium, 0.2 part ~ 0.5 part, manganese, titanium 0.05 part ~ 0.3 part, chromium 0.05 part ~ 0.1 part, vanadium 0.05 part ~ 0.3 part, silicon 0.3 part ~ 0.5 part and 0.1 part ~ 0.3 part Graphene.
First, it is the copper of 60 parts ~ 65 parts and the aluminium of 55 parts ~ 60 parts that above-mentioned heat-conducting layer contains mass parts, the coefficient of heat conduction of heat-conducting layer can be made to remain on 320W/mK ~ 345W/mK, to ensure that the heat that the described LED sub-light source absorbed by heat-sink shell and OLED sub-light source produce can be passed to heat dissipating layer by heat-conducting layer rapidly, and then prevent heat from piling up on heat-conducting layer, cause hot-spot phenomenon to produce.Relative to prior art, merely adopt price costly and the larger copper of quality, above-mentioned heat-conducting layer both can ensure fast the heat of heat-sink shell to be passed to heat dissipating layer, there is again lighter weight, be convenient to install cast, advantage that price is cheaper.Meanwhile, relative to prior art, merely adopt the aluminium alloy that radiating effect is poor, above-mentioned heat-conducting layer has better heat transfer property.
Secondly, by adding the Graphene of 0.1 part ~ 0.3 part, greatly can improve the heat conductivility of described heat-conducting layer, better the heat passed over from heat-sink shell being passed to heat dissipating layer.
Finally, heat-conducting layer contains the silicon that mass parts is the magnesium of 0.8 part ~ 1.2 parts, the manganese of 0.2 part ~ 0.5 part, the titanium of 0.05 part ~ 0.3 part, the chromium of 0.05 part ~ 0.1 part, the vanadium of 0.05 part ~ 0.3 part and 0.3 part ~ 0.5 part, thus improve mechanical performance and the resistance to elevated temperatures of heat-conducting layer, as, mechanical performance is including, but not limited to yield strength, tensile strength.Such as, heat-conducting layer contains the magnesium that mass parts is 0.8 part ~ 1.2 parts, heat-conducting layer yield strength and tensile strength can be given to a certain extent, because NEW TYPE OF COMPOSITE dispels the heat alloy in the fabrication process, need one-body molded for overall to heat-sink shell, heat-conducting layer and heat dissipating layer punching press, this just needs heat dissipating layer to have stronger yield strength, is subject to excessive punching press stress and produces non-reversible deformation, and then guarantee the proper heat reduction performance of NEW TYPE OF COMPOSITE heat radiation alloy to prevent heat dissipating layer in process.When the relative mass of magnesium is too low, e.g., when mass parts is less than 0.8 part, fully can not guarantee that the yield strength of heat-conducting layer meets the demands, but, when the relative mass of magnesium is too high, such as, when mass parts is greater than 1.2 parts, the ductility of heat-conducting layer and heat conductivility can be made again to decline rapidly.Such as, heat-conducting layer contains the iron that mass parts is 0.2 part ~ 0.8 part, can give the higher resistance to elevated temperatures of heat-conducting layer and high temperature resistant mechanical performance, is beneficial to the processing casting of heat-conducting layer.
Such as, the lighting device of an embodiment of the present invention, wherein, and the described heat dissipating layer of described NEW TYPE OF COMPOSITE heat radiation alloy, it comprises each component of following mass parts:
88 parts ~ 93 parts, aluminium, silicon 5.5 parts ~ 10.5 parts, 0.3 part ~ 0.7 part, magnesium, copper 0.05 part ~ 0.3 part, iron 0.2 part ~ 0.8 part, 0.2 part ~ 0.5 part, manganese, titanium 0.05 part ~ 0.3 part, chromium 0.05 part ~ 0.1 part, vanadium 0.05 part ~ 0.3 part and 5 parts ~ 15 parts Graphenes.
First, above-mentioned heat dissipating layer contains the aluminium that mass parts is 88 parts ~ 93 parts, the coefficient of heat conduction of heat dissipating layer can be made to remain on 200W/mK ~ 220W/mK, the heat produced when LED sub-light source and OLED sub-light source is after heat-sink shell and the heat radiation of heat-conducting layer part, when remaining heat passes to heat dissipating layer by heat-conducting layer again, heat dissipating layer can guarantee these remaining heats to be fallen apart by consistent, and then prevents heat from piling up on heat dissipating layer, causes hot-spot phenomenon.
Secondly, by adding the Graphene of 5 parts ~ 15 parts, effectively can improve the heat dispersion of described heat dissipating layer, and then the heat come from described heat-conducting layer transmission can be lost in extraneous air dielectric rapidly.
Finally, heat dissipating layer contains the vanadium that mass parts is the silicon of 5.5 parts ~ 10.5 parts, the magnesium of 0.3 part ~ 0.7 part, the copper of 0.05 part ~ 0.3 part, the iron of 0.2 part ~ 0.8 part, the manganese of 0.2 part ~ 0.5 part, the titanium of 0.05 part ~ 0.3 part, the chromium of 0.05 part ~ 0.1 part and 0.05 part ~ 0.3 part, greatly can improve the heat dispersion of heat dissipating layer.Such as, it is the silicon of 5.5 parts ~ 10.5 parts and the copper of 0.05 part ~ 0.3 part that heat dissipating layer contains mass parts, can guarantee that heat dissipating layer has the advantage of good mechanical properties and lighter weight, simultaneously, the heat-conductive characteristic of heat dissipating layer can also be improved further, guarantee that heat dissipating layer can fall apart by via the after-heat consistent after heat-sink shell and heat-conducting layer transmission further, and then prevent heat from piling up on heat dissipating layer, cause hot-spot phenomenon.
In order to improve the tensile strength of described heat dissipating layer further, such as, described heat dissipating layer also comprises the lead (Pb) that mass parts is 0.8 part ~ 1.2 parts, the lead containing 0.8 part ~ 1.2 parts when heat dissipating layer can improve the tensile strength of heat dissipating layer, like this, can prevent from striking out radiating fin when to be cast by heat dissipating layer, namely during laminated structure, pull stress owing to being subject to excessive punching press and rupturing.
In order to improve the high temperature oxidation resistance of described heat dissipating layer further, such as, described heat dissipating layer also comprises the niobium (Nb) that mass parts is 0.05 part ~ 0.08 part, find through many experiments evidence and theory analysis, when the mass parts of niobium is greater than 0.05 part, greatly can improves the antioxygenic property of heat dissipating layer, be appreciated that, heat dissipating layer as in LED street lamp radiator with the parts that contacting external air area is maximum, its to high temperature oxidation resistance require higher.But when the mass parts of niobium is greater than 0.08 part, the magnetic of heat dissipating layer can be caused sharply to increase, the miscellaneous part in meeting illumination apparatus has an impact.
In order to improve the heat dispersion of described heat dissipating layer further, such as, heat dissipating layer also comprises the germanium (Ge) that mass parts is 0.05 part ~ 0.2 part, when the mass parts of germanium is greater than 0.05 part, beyond thought effect can be played to the raising of the heat dispersion of heat dissipating layer, but, when the quality accounting of germanium is too much, such as, when the mass parts of germanium is greater than 0.2 part, the brittleness of heat dissipating layer can be made again to increase.
Above-mentioned NEW TYPE OF COMPOSITE heat radiation alloy arranges described heat-sink shell, described heat-conducting layer and described heat dissipating layer by superposing successively, and the heat-conductive characteristic of described heat-sink shell, described heat-conducting layer and described heat dissipating layer successively decreases successively, define heat-conductive characteristic gradient, compared to fine copper material, under the prerequisite guaranteeing heat dispersion, weight greatly reduces; A large amount of aluminium alloy existed on market, heat dispersion greatly strengthens.
It should be noted that, other embodiments of the present invention also comprise, and the technical characteristic in the various embodiments described above be combined with each other formed, the lighting device that can implement.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this description is recorded.
The above embodiment only have expressed several embodiments of invention, and it describes comparatively concrete and detailed, but can not therefore be construed as limiting the scope of the patent.It should be pointed out that for the person of ordinary skill of the art, under the prerequisite not departing from inventive concept, can also make some distortion and improvement, these all belong to the protection domain of invention.Therefore, the protection domain of patent of invention should be as the criterion with claims.
Claims (7)
1. a lighting device, is characterized in that, comprising:
Diffuser, described diffuser is arcuate structure, and the end of described diffuser extends and is bent to form sliding part;
Heat dissipating housing, described heat dissipating housing comprises installing plate and cover body, described cover body is arcuate structure, the two ends of described cover body are connected with the dual-side of described installing plate respectively, the side edge of described installing plate extends and is bent to form kink, the end of described kink and described cover body surrounds sliding tray, and described sliding part slides and is arranged in described sliding tray;
Lamp holder, described lamp holder is connected with the end of described installing plate;
Lamp plate, described lamp plate fits in the side of described installing plate away from described cover body;
Multiple LED sub-light source, multiple described LED sub-light source is arranged at intervals at the side of described lamp plate away from described installing plate successively; And
Folds pipe, described folds pipe is arranged in described lamp plate, and described folds pipe is hollow mechanism, and described folds pipe inside is filled with heat exchange liquid, and described folds pipe has inlet and liquid outlet.
2. lighting device according to claim 1, is characterized in that, described folds pipe is round tubular structure.
3. lighting device according to claim 1, is characterized in that, described folds pipe is fold-line-shaped structure.
4. lighting device according to claim 1, is characterized in that, described folds pipe is helicoidal structure.
5. lighting device according to claim 1, is characterized in that, the diameter of described folds pipe is 1mm ~ 1.5mm.
6. lighting device according to claim 5, is characterized in that, the diameter of described folds pipe is 1.2mm ~ 1.4mm.
7. lighting device according to claim 6, is characterized in that, the diameter of described folds pipe is 1.3mm.
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