CN105082660A - Aluminum alloy plating part and preparation method thereof and electronic device - Google Patents
Aluminum alloy plating part and preparation method thereof and electronic device Download PDFInfo
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- CN105082660A CN105082660A CN201510468351.XA CN201510468351A CN105082660A CN 105082660 A CN105082660 A CN 105082660A CN 201510468351 A CN201510468351 A CN 201510468351A CN 105082660 A CN105082660 A CN 105082660A
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- alloy plating
- aluminium alloy
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- thin film
- plating piece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/103—Metal fibres
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- Laminated Bodies (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
The invention discloses an aluminum alloy plating part. The aluminum alloy plating part sequentially comprises an aluminum alloy base material, a metal coating and an organic thin film layer from inside to outside. The organic thin film layer is a fluoroalkyl silane containing thin film. The organic thin film, namely, the fluoroalkyl silane containing thin film, is arranged on the surface of the aluminum alloy plating part with the metal coating, and the aluminum alloy plating part has the fingerprint-resistant and smudge-resistant effects while the original gloss and metal texture are not changed. The invention further discloses a preparation method of the aluminum alloy plating part. The fluoroalkyl silane containing thin film is plated on the surface of the aluminum alloy plating part on which the metal coating is plated, and the aluminum alloy plating part which has the fingerprint-resistant and smudge-resistant effects is prepared. The invention further discloses an electronic device. As the electronic device internally comprises the aluminum alloy plating part, good user experience is achieved.
Description
Technical field
The present invention relates to electronic applications, be specifically related to a kind of aluminium alloy plating piece and preparation method thereof, and comprise the electronic installation of this aluminium alloy plating piece.
Background technology
Aluminium alloy has that quality is light, perfect heat-dissipating, various special shape can be squeezed out, be applicable to multiple use, meet multiple needs, the easy plurality of advantages such as processing, the application in fields such as communication, electronics, communications and transportation, building and Aero-Space is widely.The normal die-casting technique that adopts carrys out obtained shaping aluminium alloy at present, chemical plating or electric plating method is adopted to process aluminium alloy sandblasting part surface after aluminium alloy sandblasting again, but the aluminium alloy after sandblasting, copper facing, nickel plating due to its dumb light sand face uneven, easily shelter evil people and countenance evil practices, especially easily leave fingerprint in aluminum alloy surface after finger touch, affect attractive in appearance.
Summary of the invention
One object of the present invention is to provide a kind of aluminium alloy plating piece, makes aluminium alloy plating piece have resistance to fingerprint, anti-dirty effect while not changing original gloss and metal-like.
Another object of the present invention is the preparation method providing a kind of above-mentioned aluminium alloy plating piece, with the obtained aluminium alloy plating piece with resistance to fingerprint, anti-dirty effect.
Another object of the present invention is to provide a kind of electronic installation, and this electronic installation comprises above-mentioned aluminium alloy plating piece.
For reaching this object, the present invention by the following technical solutions:
There is provided a kind of aluminium alloy plating piece, described aluminium alloy plating piece comprises aluminum alloy base material, the coat of metal, organic thin film layer from inside to outside successively, and described organic thin film layer is fluorine containing silane film.
A kind of preparation method of above-mentioned aluminium alloy plating piece is also provided, comprises the following steps:
The aluminium alloy plating piece surface of mode after metal cladding of S100, employing Vacuum Deposition is coated with described organic thin film layer.
Also provide a kind of electronic installation, this electronic installation comprises above-mentioned aluminium alloy plating piece.
Beneficial effect of the present invention: the present invention is by arranging organic thin film layer again on the aluminium alloy plating piece surface being provided with the coat of metal---fluorine containing silane film, can make aluminium alloy plating piece have resistance to fingerprint, anti-dirty effect while not changing original gloss and metal-like.Present invention also offers a kind of preparation method of this aluminium alloy plating piece, be coated with fluorine containing silane film by the mode of Vacuum Deposition on the aluminium alloy plating piece surface of metal cladding, the obtained aluminium alloy plating piece with resistance to fingerprint, anti-dirty effect.Present invention also offers a kind of electronic installation, in this electronic installation, because comprising above-mentioned aluminium alloy plating piece, there is good Consumer's Experience.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme of the embodiment of the present invention, be briefly described to the accompanying drawing used required in the embodiment of the present invention below.Apparently, below described accompanying drawing be only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the aluminium alloy plating piece described in one embodiment of the invention.
Fig. 2 is the structural representation of the aluminium alloy plating piece described in another embodiment of the present invention.
Fig. 3 is the structural representation of the aluminium alloy plating piece described in another embodiment of the present invention.
Fig. 4 is the structural representation of the aluminium alloy plating piece described in another embodiment of the present invention.
Fig. 5 is the structural representation of the coat of metal described in another embodiment of the present invention.
Fig. 6 is the preparation flow schematic diagram of the aluminium alloy plating piece described in the embodiment of the present invention.
In Fig. 1 ~ 5:
10, aluminum alloy base material; 20, the coat of metal; 21, nickel dam; 22, layers of copper; 23, layers of chrome; 30, organic thin film layer; 40, metal oxide layer; 50, nonmetal oxide layer; 60, steel wire pile layer.
Detailed description of the invention
Technical scheme of the present invention is further illustrated by specific embodiment below in conjunction with Fig. 1 ~ 6.
Fig. 1 is the structural representation of the aluminium alloy plating piece of the embodiment of the present invention.
As shown in Figure 1, a kind of aluminium alloy plating piece, comprises aluminum alloy base material 10, the coat of metal 20, organic thin film layer 30 from inside to outside successively, and organic thin film layer 30 is fluorine containing silane film.In the present embodiment, aluminum alloy base material 10 refers to the aluminium alloy sandblasting part obtained after die cast, sandblasting, certainly, the present embodiment is not limited to aluminium alloy plating piece, also can be other alloy plating pieces such as magnesium alloy, titanium alloy, magnadures etc., as long as fluorine containing silane film can be arranged on its surface all can adopt alloy plating piece structure of the present invention through die cast.The coat of metal 20 is the surfaces being coated on aluminum alloy base material 10 by the mode of plating.In fluorine containing silane and polymer thereof; the singly-bound bond energy that the singly-bound bond energy that fluorine atom and other elements are formed is formed than carbon atom and other elements is all large; and bond distance is shorter; simultaneously due to physical barrier effect; the carbochain of fluoride compound is subject to the protection of fluorine atom around; other atoms not easily invade; carbon-carbon bond also just becomes more firm; make fluorine containing silane and compound thereof not only hydrophobic but also oil resistant, and then make fluorine containing silane and polymer thereof have the advantages such as heat resistance is high, chemical stability is high, surface free energy is low.The present embodiment is by arranging organic thin film layer 30 on the surface of the aluminium alloy plating piece being coated with metal level, the aluminium alloy plating piece being coated with this organic thin film layer 30 is made to have resistance to fingerprint, anti-dirty effect, to increase the smooth feel of aluminium alloy plating piece, aluminium alloy plating piece also maintains original glossiness and metal-like simultaneously.The thickness of the organic thin film layer 30 in the present embodiment is 10 ~ 40nm.
Fig. 2 is the structural representation of the aluminium alloy plating piece of another embodiment of the present invention.
As shown in Figure 2, as another embodiment of the present invention, between the coat of metal 20 and organic thin film layer 30, be coated with metal oxide layer 40, for improving the adhesive force of organic thin film layer 30 on aluminium alloy plating piece.
As preferred embodiment scheme, metal oxide layer 40 is alumina layer.Aluminium oxide, also known as alundum (Al2O3), is commonly referred to " alumina ", is a kind of white-amorphous powder, water insoluble, is commonly called as alumina.Aluminium oxide in the present embodiment can be coated with one deck alumina layer by the mode of Vacuum Deposition on the surface of the aluminium alloy plating piece of metal cladding, alumina layer, between the coat of metal 20 and organic thin film layer 30, can improve the adhesive force of organic thin film layer 30 further.The thickness of the alumina layer in the present embodiment is 10 ~ 30nm.
Fig. 3 is the structural representation of the aluminium alloy plating piece of another embodiment of the present invention.
As shown in Figure 3, as another embodiment of the present invention, between the coat of metal 20 and metal oxide layer 40, be coated with nonmetal oxide layer 50.Now metal oxide layer 40 is as the undertaking layer between nonmetal oxide layer 50 and the coat of metal 20, can improve the adhesive force between nonmetal oxide layer 50 and the coat of metal 20; Nonmetal oxide layer 50 is for improving the adhesive force between metal oxide layer 40 and organic thin film layer 30.
As preferred embodiment, nonmetal oxide layer 50 is silicon oxide layer.Silica is again silica (chemical formula: SiO
2), be a kind of acidic oxide, be synthetic material's amorphous white mobility powder, there is various specific area and wide size distribution.This product is a kind of white, loose, amorphous, nontoxic, tasteless, odorless, free of contamination nonmetal oxide.Silica in silicon oxide layer can provide Si-O key, with Al
2o
3combine closely, prevent metal penetration in the coat of metal 20 in organic thin film layer 30, in order to avoid the quality of organic thin film layer 30 is affected, the adhesive force of organic thin film layer 30 can also be increased simultaneously.Aluminium oxide in alumina layer, then as the undertaking layer between silicon oxide layer and the coat of metal 20, promotes the adhesive force of silicon oxide layer.The thickness of the silicon oxide layer in the present embodiment is 10 ~ 30nm.
Fig. 4 is the structural representation of the aluminium alloy plating piece of another embodiment of the present invention.
As shown in Figure 4, organic thin film layer 30 outside is also coated with steel wire pile layer 60.Steel wool has another name called steel wool, also can be iron and steel velvet, become velvet shape, by the band shape of the many fibrous one fixed widthes of continuous print, fiber general point of 8 models from coarse to fine: 4#, 3#, 2#, 1#, 0#, 00#, 000#, 0000#, also have thinner 00000# model.The present embodiment, by being also coated with steel wire pile layer 60 in organic thin film layer 30 outside, can improve the abrasion resistance properties of organic thin film layer 30, extends the service life of organic thin film layer 30.
Fig. 5 is the structural representation of the aluminium alloy plating piece of another embodiment of the present invention.
As shown in Figure 5, the coat of metal 20 is for being successively set on nickel dam 21, layers of copper 22 and the layers of chrome 23 on described aluminum alloy base material 10.Wherein layers of copper 22 can be sour layers of copper, for the filling aluminum alloy base material 10 i.e. rough surface of aluminium alloy sandblasting part; Nickel dam 21 can be electroless nickel layer, may also be half light nickel dam, can play a protective role to aluminum alloy base material 10, is generally first at the aluminum alloy base material 10 plated surface nickel dam 21 through pre-treatment, and then acid coppering layer.Certainly, the present embodiment also can be coated with one deck composite deposite again in the coat of metal 20, such as nickel phosphorous layer.
The following examples are the preparation method to above-mentioned aluminium alloy plating piece be specifically described.
Present embodiments provide a kind of preparation method of above-mentioned aluminium alloy plating piece, this preparation method comprises the following steps:
The aluminium alloy plating piece plated surface organic thin film layer 30 of mode after being coated with metal level of S100, employing Vacuum Deposition.
Vacuum Deposition mainly comprises vacuum evaporation, sputtering plating and ion plating several types, they are all adopt under vacuum, by distill or the mode such as sputtering at the various metal of plastic surface deposition and nonmetal film, very thin overlay coating can be obtained by such mode, there is the outstanding advantages that the fast adhesive force of speed is good simultaneously.Be coated with in the present embodiment alumina layer, organic thin film layer adopt be vacuum evaporation, be coated with silicon oxide layer adopt be vacuum sputtering, these two kinds of vacuum plating methods are prior art, do not repeat them here.
In the present embodiment, aluminum alloy base material is coated with metal level and comprises and be coated with nickel dam, layers of copper, layers of chrome, the plating method of nickel dam, layers of copper, layers of chrome is prior art, does not repeat them here.
In this embodiment, the aluminium alloy plating piece after metal cladding is coated with organic thin film layer 30 under following process conditions:
The thickness of the organic thin film layer 30 be coated with under these process conditions is 10 ~ 40nm.Organic thin film layer 30 makes aluminium alloy plating piece have resistance to fingerprint, anti-dirty effect, and add the smooth feel of aluminium alloy plating piece, aluminium alloy plating piece also maintains original glossiness and metal-like simultaneously.
The invention provides another embodiment, this embodiment is improved on the basis of above-described embodiment.Particularly, after being coated with metal level, be coated with organic thin film layer before further comprising the steps of:
S100 ", adopt the aluminium alloy plating piece plated surface oxygenerating aluminium lamination of mode after being coated with metal level of Vacuum Deposition.
Particularly, the process conditions of Vacuum Deposition alumina layer are as follows:
After being coated with alumina layer, then be coated with the aluminium alloy plating piece plated surface organic thin film layer 30 of alumina layer, the process conditions being coated with organic thin film layer 30 are identical with a upper embodiment, do not repeat them here.The thickness of the alumina layer be coated with under these process conditions is 10 ~ 30nm, and the thickness of organic thin film layer 30 is 10 ~ 40nm.This alumina layer, between the coat of metal 20 and organic thin film layer 30, can improve the adhesive force of organic thin film layer 30 further.
The present embodiment improves again on the basis of a upper embodiment, namely after being coated with alumina layer, be coated with organic thin film layer before further comprising the steps of:
The mode of S100 ', employing Vacuum Deposition is being coated with the aluminium alloy plating piece plated surface oxygenerating silicon layer of alumina layer.
Particularly, the process conditions of Vacuum Deposition silicon oxide layer are as follows:
The present embodiment is first coated with alumina layer at the aluminium alloy plating piece surface vacuum being coated with metal level 20, then silicon oxide layer is coated with at the aluminium alloy plating piece surface vacuum being coated with alumina layer, finally be coated with organic thin film layer 30 at the aluminium alloy plating piece surface vacuum being coated with silica layer, the process conditions of Vacuum Deposition oxygenerating aluminium lamination, organic thin film layer 30 are all identical with a upper embodiment, do not repeat them here.The thickness of the silicon oxide layer be coated with under these process conditions is 10 ~ 30nm, and the thickness of alumina layer is 10 ~ 30nm, and the thickness of organic thin film layer 30 is 10 ~ 40m.Silica in silicon oxide layer can provide Si-O key, with Al
2o
3combine closely, prevent metal penetration in metal level 20 in organic thin film layer 30, prevent the quality of organic thin film layer 30 to be affected, the adhesive force of organic thin film layer 30 can also be increased simultaneously.Aluminium oxide in alumina layer then as the undertaking layer between silicon oxide layer and metal level 20, for promoting the adhesive force of silicon oxide layer.
Fig. 6 is the preparation flow of the aluminium alloy plating piece described in the embodiment of the present invention.
As shown in Figure 6, the present embodiment is further improved on the basis of a upper embodiment, is namely being coated with the aluminium alloy plating piece outside cladding steel velvet layer 60 of organic thin film layer 30.The present embodiment is first coated with alumina layer at the aluminium alloy plating piece surface vacuum being coated with metal level 20, then silicon oxide layer is coated with at the aluminium alloy plating piece surface vacuum being coated with alumina layer, then organic thin film layer 30 is coated with at the aluminium alloy plating piece surface vacuum being coated with silica layer, finally be coated with the aluminium alloy plating piece outside cladding steel velvet layer 60 of organic thin film layer 30, the process conditions of Vacuum Deposition oxygenerating aluminium lamination, silicon oxide layer, organic thin film layer 30 are all identical with a upper embodiment, do not repeat them here.The present embodiment, by steel wire pile layer 60 being coated on the outside of the aluminium alloy plating piece being coated with organic thin film layer 30, can play a protective role to organic thin film layer 30, improves the mar proof of organic thin film layer 30.
The present invention can obtain the aluminium alloy plating piece with good resistance to fingerprint and anti-dirty effect by said method, make this aluminium alloy plating piece have smooth feel, but also maintain the original glossiness of aluminium alloy plating piece and metal-like.
Concrete preparation method for aluminium alloy plating piece is further illustrated technical scheme of the present invention below.
Embodiment 1
Successively according to aluminium alloy plating piece plated surface oxygenerating aluminium lamination, silicon oxide layer, the fluorine containing silane thin layer of process conditions as described in Table 1 after nickel plating, copper facing, chromium plating, finally be coated with the aluminium alloy plating piece outside cladding steel velvet layer of layers of chrome/alumina layer/silicon oxide layer/fluorine containing silane thin layer, obtained aluminium alloy plating piece of the present invention.
Embodiment 2
The preparation method of the aluminium alloy plating piece of the present embodiment is except process conditions are for except described in table 1, and other are all identical with embodiment 1.
Embodiment 3
The preparation method of the aluminium alloy plating piece of the present embodiment is except process conditions are for except described in table 1, and other are all identical with embodiment 1.
Table 1
The aluminium alloy plating piece prepared according to the method for above-described embodiment all has smooth feel, all can not on aluminium alloy plating piece leave fingerprint after touching with hand, illustrates that aluminium alloy plating piece of the present invention has good resistance to fingerprint, anti-dirty effect.
As the electronic installation of another embodiment of the present invention, this electronic installation comprises above-mentioned aluminium alloy plating piece.Above-mentioned aluminium alloy plating piece can use as the shell of electronic installation, such as phone housing, panel computer shell, e-book shell or MP3, MP4 shell etc., this aluminium alloy plating piece is used as the shell of electronic installation, because it has smooth feel and resistance to fingerprint, prevents dirty effect and has good Consumer's Experience.
Above content is only preferred embodiment of the present invention, and for those of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, this description should not be construed as limitation of the present invention.
Claims (10)
1. an aluminium alloy plating piece, is characterized in that, described aluminium alloy plating piece comprises aluminum alloy base material, the coat of metal, organic thin film layer from inside to outside successively, and described organic thin film layer is fluorine containing silane film.
2. aluminium alloy plating piece according to claim 1, is characterized in that, is coated with metal oxide layer between the described coat of metal and described organic thin film layer;
Preferably, described metal oxide layer is alumina layer.
3. aluminium alloy plating piece according to claim 2, is characterized in that, is coated with nonmetal oxide layer between the described coat of metal and described metal oxide layer;
Preferably, described nonmetal oxide layer is silicon oxide layer.
4. aluminium alloy plating piece according to claim 3, is characterized in that, described organic thin film layer outside is also coated with steel wire pile layer.
5. the aluminium alloy plating piece according to any one of Claims 1-4, is characterized in that, the described coat of metal is the nickel dam, layers of copper and the layers of chrome that are successively set on described aluminum alloy base material.
6. a preparation method for the aluminium alloy plating piece described in any one of claim 1 to 5, is characterized in that, comprise the following steps:
The aluminium alloy plating piece surface of mode after being coated with metal level of S100, employing Vacuum Deposition is coated with described organic thin film layer.
7. preparation method according to claim 6, is characterized in that, after being coated with described metal level, be coated with described organic thin film layer before further comprising the steps of:
S100 ", adopt the aluminium alloy plating piece plated surface oxygenerating aluminium lamination of mode after being coated with metal level of Vacuum Deposition.
8. preparation method according to claim 7, is characterized in that, after being coated with described alumina layer, be coated with described organic thin film layer before further comprising the steps of:
The mode of S100 ', employing Vacuum Deposition is being coated with the aluminium alloy plating piece plated surface oxygenerating silicon layer of described alumina layer.
9. preparation method according to claim 8, is characterized in that, further comprising the steps of after being coated with described organic thin film layer:
S200, at the aluminium alloy plating piece being coated with described organic thin film layer outside cladding steel velvet layer.
10. an electronic installation, is characterized in that, described electronic installation comprises the aluminium alloy plating piece described in any one of claim 1 to 5.
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Cited By (5)
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CN105779943A (en) * | 2016-05-05 | 2016-07-20 | 厦门建霖工业有限公司 | Method of preparing hydrophobic membrane through physical vapor deposition of fluoroalkyl silane |
CN106435504A (en) * | 2016-12-02 | 2017-02-22 | 赫得纳米科技(昆山)有限公司 | Method for plating fingerprint resisting film on surface of aluminum alloy |
CN107142510A (en) * | 2017-05-03 | 2017-09-08 | 深圳天珑无线科技有限公司 | The surface treatment method and its aluminum or aluminum alloy workpiece of a kind of aluminum or aluminum alloy |
CN107665015A (en) * | 2017-10-09 | 2018-02-06 | 河南工学院 | Notebook computer, notebook computer casing and its manufacture method |
CN108546917A (en) * | 2018-03-22 | 2018-09-18 | 江苏蔚联机械股份有限公司 | A kind of surface treatment method of aluminium alloy |
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CN108546917A (en) * | 2018-03-22 | 2018-09-18 | 江苏蔚联机械股份有限公司 | A kind of surface treatment method of aluminium alloy |
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