CN105081333B - 石墨‑金属导热复合材料及其制备方法 - Google Patents
石墨‑金属导热复合材料及其制备方法 Download PDFInfo
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- CN105081333B CN105081333B CN201410215665.4A CN201410215665A CN105081333B CN 105081333 B CN105081333 B CN 105081333B CN 201410215665 A CN201410215665 A CN 201410215665A CN 105081333 B CN105081333 B CN 105081333B
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 90
- 239000002131 composite material Substances 0.000 title claims abstract description 76
- 229910002804 graphite Inorganic materials 0.000 title claims abstract description 76
- 239000010439 graphite Substances 0.000 title claims abstract description 76
- 238000002360 preparation method Methods 0.000 title claims abstract description 43
- 229910052751 metal Inorganic materials 0.000 title claims description 14
- 239000002184 metal Substances 0.000 title claims description 14
- 239000002245 particle Substances 0.000 claims abstract description 34
- 239000011159 matrix material Substances 0.000 claims abstract description 33
- 239000002905 metal composite material Substances 0.000 claims abstract description 29
- 241000446313 Lamella Species 0.000 claims abstract description 17
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 17
- 239000011651 chromium Substances 0.000 claims abstract description 17
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 7
- 229910052580 B4C Inorganic materials 0.000 claims abstract description 6
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 6
- 229910003470 tongbaite Inorganic materials 0.000 claims abstract description 6
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 5
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 5
- QIJNJJZPYXGIQM-UHFFFAOYSA-N 1lambda4,2lambda4-dimolybdacyclopropa-1,2,3-triene Chemical compound [Mo]=C=[Mo] QIJNJJZPYXGIQM-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910039444 MoC Inorganic materials 0.000 claims abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 37
- 229910052782 aluminium Inorganic materials 0.000 claims description 35
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 20
- 238000005245 sintering Methods 0.000 claims description 18
- 238000006243 chemical reaction Methods 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 16
- 238000009715 pressure infiltration Methods 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000011780 sodium chloride Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 8
- 150000003839 salts Chemical class 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- WDIHJSXYQDMJHN-UHFFFAOYSA-L barium chloride Chemical compound [Cl-].[Cl-].[Ba+2] WDIHJSXYQDMJHN-UHFFFAOYSA-L 0.000 claims description 5
- 229910001626 barium chloride Inorganic materials 0.000 claims description 5
- GVEHJMMRQRRJPM-UHFFFAOYSA-N chromium(2+);methanidylidynechromium Chemical compound [Cr+2].[Cr]#[C-].[Cr]#[C-] GVEHJMMRQRRJPM-UHFFFAOYSA-N 0.000 claims description 5
- 230000004044 response Effects 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000001110 calcium chloride Substances 0.000 claims description 2
- 229910001628 calcium chloride Inorganic materials 0.000 claims description 2
- 238000003763 carbonization Methods 0.000 claims description 2
- 238000009833 condensation Methods 0.000 claims description 2
- 230000005494 condensation Effects 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 claims 1
- 239000011365 complex material Substances 0.000 abstract description 2
- UFGZSIPAQKLCGR-UHFFFAOYSA-N chromium carbide Chemical compound [Cr]#C[Cr]C#[Cr] UFGZSIPAQKLCGR-UHFFFAOYSA-N 0.000 abstract 1
- 239000011812 mixed powder Substances 0.000 description 39
- 239000004411 aluminium Substances 0.000 description 31
- 239000007770 graphite material Substances 0.000 description 26
- 238000000034 method Methods 0.000 description 17
- 229910052796 boron Inorganic materials 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- 238000007731 hot pressing Methods 0.000 description 14
- 239000008367 deionised water Substances 0.000 description 11
- 229910021641 deionized water Inorganic materials 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 239000000843 powder Substances 0.000 description 9
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 8
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- 238000004626 scanning electron microscopy Methods 0.000 description 6
- 238000002791 soaking Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 238000001228 spectrum Methods 0.000 description 5
- 229910016384 Al4C3 Inorganic materials 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000006460 hydrolysis reaction Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000010792 warming Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006557 surface reaction Methods 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 241001282153 Scopelogadus mizolepis Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Powder Metallurgy (AREA)
Abstract
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CN106077607A (zh) * | 2016-06-15 | 2016-11-09 | 苏州洪河金属制品有限公司 | 一种用于发动机的复合散热材料及其制备方法 |
CN106636989B (zh) * | 2017-01-09 | 2018-07-10 | 中国科学院宁波材料技术与工程研究所 | 一种高强度、高导热石墨-铜复合材料的制备方法 |
CN107140983A (zh) * | 2017-06-29 | 2017-09-08 | 邱成峰 | 一种可连续生产的高导热碳膜制作方法 |
CN111804919B (zh) * | 2019-04-10 | 2022-06-17 | 中国科学院宁波材料技术与工程研究所 | 高导热石墨-金属复合材料及其制备方法 |
CN111302336A (zh) * | 2020-02-24 | 2020-06-19 | 北京科技大学 | 一种鳞片石墨原位反应包覆碳化铬的方法 |
CN111799621B (zh) * | 2020-06-28 | 2023-02-28 | 东风博泽汽车系统有限公司 | 一种耐高电流电机碳刷复合材料 |
CN112108654A (zh) * | 2020-09-23 | 2020-12-22 | 长飞光纤光缆股份有限公司 | 一种高导热复合材料的制备方法及石墨-铝金属复合材料 |
CN116836001A (zh) * | 2023-07-11 | 2023-10-03 | 合肥工业大学 | 一种Cr7C3陶瓷相改性鳞片石墨的方法 |
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JP2575286B2 (ja) * | 1994-02-04 | 1997-01-22 | 川崎重工業株式会社 | 熱遮蔽材料 |
JP3351778B2 (ja) * | 1999-06-11 | 2002-12-03 | 日本政策投資銀行 | 炭素基金属複合材料板状成形体および製造方法 |
AT7807U1 (de) * | 2004-09-06 | 2005-09-26 | Plansee Ag | Werkstoffverbund |
US9390999B2 (en) * | 2005-03-23 | 2016-07-12 | Noriaki Kawamura | Metal substrate/metal impregnated carbon composite material structure and method for manufacturing said structure |
TW201117952A (en) * | 2009-11-20 | 2011-06-01 | Tian-De Lan | Composite heat dissipation substrate |
CN102344780B (zh) * | 2010-08-05 | 2015-06-17 | 碳元科技股份有限公司 | 一种复合散热石墨材料及制造方法 |
CN201785338U (zh) * | 2010-08-05 | 2011-04-06 | 徐世中 | 一种复合散热石墨材料 |
CN102514297A (zh) * | 2011-12-15 | 2012-06-27 | 烟台德邦科技有限公司 | 一种金属包覆石墨散热复合材料及其制备方法 |
CN202601606U (zh) * | 2012-05-29 | 2012-12-12 | 昆山汉品电子有限公司 | 复合导热片 |
CN202911224U (zh) * | 2012-07-26 | 2013-05-01 | 苏州沛德导热材料有限公司 | 一种石墨复合金属材料 |
CN103112854B (zh) * | 2013-01-31 | 2015-04-08 | 黑龙江大学 | 一步法合成碳化物/多孔石墨碳纳米复合物的方法 |
CN103101246A (zh) * | 2013-02-26 | 2013-05-15 | 赵骁 | 泡沫碳/金属基光热复合材料及其制备方法 |
CN203567284U (zh) * | 2013-09-11 | 2014-04-30 | 天津天佑润德新材料科技有限公司 | 低收缩率、高导电率的复合金属材料 |
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Inventor after: Ma Hongbing Inventor after: Bai Hua Inventor after: Jiang Nan Inventor after: Li Jin Inventor after: Wang Dong Inventor after: Zou Huanghui Inventor after: Yang Ke Inventor after: Chu Wubo Inventor before: Ma Hongbing Inventor before: Bai Hua Inventor before: Jiang Nan Inventor before: Wang Dong Inventor before: Zou Huanghui Inventor before: Yang Ke Inventor before: Chu Wubo |
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Effective date of registration: 20191129 Address after: West Street in the official Zhejiang city of Ningbo province Zhenhai District 315201 Village No. 1818 Patentee after: Ningbo Saimo Technology Co.,Ltd. Address before: No. 519 Road, 315201 Zhejiang Zhuang Zhenhai District of city of Ningbo Province Co-patentee before: JIANGXI COPPER TECHNOLOGY RESEARCH INSTITUTE Co.,Ltd. Patentee before: NINGBO INSTITUTE OF MATERIALS TECHNOLOGY & ENGINEERING, CHINESE ACADEMY OF SCIENCES |
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Denomination of invention: Graphite-metal heat conduction composite material and preparation method thereof Effective date of registration: 20191216 Granted publication date: 20170808 Pledgee: Jiangxi Copper Group Finance Co.,Ltd. Pledgor: Ningbo Saimo Technology Co.,Ltd. Registration number: Y2019330000291 |
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