CN105067034B - A kind of graphene/silicon array intelligent Temperature Humidity Sensor - Google Patents
A kind of graphene/silicon array intelligent Temperature Humidity Sensor Download PDFInfo
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Abstract
本发明公开了一种石墨烯/硅阵列式智能温湿度传感器,所述的湿度传感器包括电源模块,阵列式温湿度传感器模块,电流检测模块,A/D转换模块,微处理器模块,输入模块,输出模块。所述的阵列式温湿度传感器模块包括n型硅基体、二氧化硅绝缘层、2×2阵列硅窗口、石墨烯、顶电极和底电极。本发明的智能温湿度传感器基于石墨烯/硅肖特基结构,该石墨烯/硅肖特基结与传统金属/半导体肖特基结有着明显差异,具有多子传输速度快,反应灵敏等特点。本发明的温湿度传感器采用独特的阵列式结构可运用于智能手机,智能可穿戴,智能家居等设备所需的传感器当中。The invention discloses a graphene/silicon array type intelligent temperature and humidity sensor. The humidity sensor includes a power supply module, an array type temperature and humidity sensor module, a current detection module, an A/D conversion module, a microprocessor module, and an input module , the output module. The arrayed temperature and humidity sensor module includes an n-type silicon substrate, a silicon dioxide insulating layer, a 2×2 array of silicon windows, graphene, a top electrode and a bottom electrode. The intelligent temperature and humidity sensor of the present invention is based on the graphene/silicon Schottky structure. The graphene/silicon Schottky junction is significantly different from the traditional metal/semiconductor Schottky junction, and has the characteristics of fast multi-substance transmission and sensitive response. . The temperature and humidity sensor of the present invention adopts a unique array structure and can be used in sensors required by devices such as smart phones, smart wearables, and smart homes.
Description
技术领域technical field
本发明属于石墨烯新型多参数智能传感器应用领域,具体涉及一种石墨烯/硅阵列式智能温湿度传感器。The invention belongs to the application field of graphene novel multi-parameter intelligent sensors, in particular to a graphene/silicon array type intelligent temperature and humidity sensor.
背景技术Background technique
温度与湿度是人类生存环境下的两大主要参数。大气环境的温度可用摄氏温度,华氏温度或绝对温度来衡量;湿度通常可用绝对湿度,相对湿度,比湿度来衡量。湿度依赖于温度条件,所以湿度传感器通常也会测试温度,形成集成式温湿度传感器。温湿度传感器用来测量一定温度条件下的温度值和相对湿度值。这类传感器对工业生产控制,生物医药制品、农业自动化等方面具有极大影响。Temperature and humidity are the two main parameters in the human living environment. The temperature of the atmospheric environment can be measured in Celsius, Fahrenheit or absolute temperature; humidity can usually be measured in absolute humidity, relative humidity, and specific humidity. Humidity depends on temperature conditions, so humidity sensors usually also test temperature, forming an integrated temperature and humidity sensor. The temperature and humidity sensor is used to measure the temperature value and relative humidity value under certain temperature conditions. This type of sensor has a great impact on industrial production control, biomedical products, and agricultural automation.
湿度测量始终是世界计量领域中著名的难题之一,究其原因是湿度与温度是一个相关函数,温度的变化显著地影响着湿度的测量结果。湿度的测量涉及相当复杂的物理-化学理论分析和方程计算。常见的湿度测量方法有:动态法(双压法、双温法、分流法),静态法(饱和盐法、硫酸法),露点法,干湿球法和电子式传感器法。Humidity measurement has always been one of the famous problems in the field of metrology in the world. The reason is that humidity and temperature are a correlation function, and changes in temperature significantly affect the measurement results of humidity. The measurement of humidity involves quite complicated physical-chemical theoretical analysis and equation calculation. Common humidity measurement methods are: dynamic method (dual pressure method, dual temperature method, shunt method), static method (saturated salt method, sulfuric acid method), dew point method, wet and dry bulb method and electronic sensor method.
传统的动态法对测试系统和环境的洁净度要求高,而静态法测量的精度较差,电子式传感器利用半导体技术能够较好的运用于电子信息技术和工业中,产业需求大,本发明的石墨烯阵列式温湿度传感器属于电子式传感器法,该方法同时测试温度和湿度,提高了传感器的灵敏度和精度。The traditional dynamic method has high requirements on the cleanliness of the test system and the environment, while the measurement accuracy of the static method is poor. Electronic sensors can be better used in electronic information technology and industry by using semiconductor technology, and the industry demand is large. The present invention The graphene array temperature and humidity sensor belongs to the electronic sensor method. This method measures temperature and humidity at the same time, which improves the sensitivity and accuracy of the sensor.
发明内容Contents of the invention
本发明的目的在于针对现有技术的不足,提供一种灵敏度和精度高,且可集成使用的石墨烯/硅阵列式智能温湿度传感器。The object of the present invention is to provide a graphene/silicon array intelligent temperature and humidity sensor with high sensitivity and precision, which can be used in an integrated manner.
本发明的石墨烯/硅阵列式智能温湿度传感器,包括电源模块,阵列式温湿度传感器模块,电流检测模块,A/D转换模块,微处理器模块,输入模块和输出模块;The graphene/silicon array type intelligent temperature and humidity sensor of the present invention includes a power supply module, an array type temperature and humidity sensor module, a current detection module, an A/D conversion module, a microprocessor module, an input module and an output module;
输入模块用于信号输入以给微处理器模块提供信号控制,电流检测模块检测阵列式温湿度传感器模块中的电流,并通过A/D转换模块将信号传递给微处理器模块,微处理器模块处理后通过输出模块输出温度和湿度,电源模块给各模块供电。The input module is used for signal input to provide signal control to the microprocessor module, the current detection module detects the current in the array temperature and humidity sensor module, and transmits the signal to the microprocessor module through the A/D conversion module, and the microprocessor module After processing, the temperature and humidity are output through the output module, and the power module supplies power to each module.
所述的输入模块可以为按键、触摸屏、蓝牙或者网络通信接口。The input module can be a button, a touch screen, bluetooth or a network communication interface.
所述的输出模块可以是液晶显示屏、触摸屏、蓝牙或网络通信接口。The output module can be a liquid crystal display screen, a touch screen, bluetooth or a network communication interface.
所述的阵列式温湿度传感器模块包括n型硅基体和覆盖于n型硅基体上表面的二氧化硅隔离层,在二氧化硅隔离层上阵列式地开有2×2个硅窗口,在每个硅窗口周围的二氧化硅隔离层的上表面覆盖一个顶电极,在每个硅窗口及相应顶电极上表面覆盖有石墨烯,每个硅窗口上石墨烯的边界小于顶电极的边界,在n型硅基体下表面设置底电极,形成2×2阵列式器件;The arrayed temperature and humidity sensor module includes an n-type silicon substrate and a silicon dioxide isolation layer covering the upper surface of the n-type silicon substrate, and 2×2 silicon windows are opened in an array on the silicon dioxide isolation layer. The upper surface of the silicon dioxide isolation layer around each silicon window is covered with a top electrode, and the upper surface of each silicon window and the corresponding top electrode is covered with graphene, and the boundary of the graphene on each silicon window is smaller than the boundary of the top electrode, A bottom electrode is arranged on the lower surface of the n-type silicon substrate to form a 2×2 array device;
在上述的2×2阵列式器件中一个对角的两个单元采用封闭式真空封装结构,避免空气和光照影响器件,此部分作为测温单元,另一对角的两个单元采用开放式封装结构,作为湿度测试单元。所述的电流检测模块分别检测上述四个单元的电流信号。In the above-mentioned 2×2 array device, the two units at one diagonal adopt a closed vacuum packaging structure to avoid the influence of air and light on the device. This part is used as a temperature measurement unit, and the two units at the other diagonal adopt an open package. structure, as a humidity test unit. The current detecting module respectively detects the current signals of the above four units.
所述的n型硅基体的电阻率为1~10 Ω·cm,厚度为300~500 μm。The n-type silicon substrate has a resistivity of 1-10 Ω·cm and a thickness of 300-500 μm.
所述的石墨烯为单层石墨烯或还原氧化石墨烯,所述的还原氧化石墨烯厚度为1-50nm。The graphene is single-layer graphene or reduced graphene oxide, and the thickness of the reduced graphene oxide is 1-50nm.
本发明的有益效果是:本发明的智能温湿度传感器基于石墨烯/硅肖特基结构,该石墨烯/硅肖特基结与传统金属/半导体肖特基结有着明显差异,除了具有多子传输速度快,反应灵敏外还由于石墨烯的高透明,高导电,高导热,高机械强度而适用于超常规条件下的各种应用。本发明的温湿度传感器采用独特的阵列式结构可同时获得温度和相对湿度,并输出。可运用于智能手机,智能可穿戴,智能家居等设备所需的传感器当中。该阵列式结构提高了灵敏度和重复性,能快速简便测量环境温度与湿度,甚至能检测人体的温湿度而用于智能医疗诊断,健康小助手等领域。The beneficial effects of the present invention are: the intelligent temperature and humidity sensor of the present invention is based on the graphene/silicon Schottky structure, and the graphene/silicon Schottky junction is significantly different from the traditional metal/semiconductor Schottky junction, except that it has many The transmission speed is fast, the response is sensitive, and graphene is suitable for various applications under unconventional conditions due to its high transparency, high electrical conductivity, high thermal conductivity, and high mechanical strength. The temperature and humidity sensor of the present invention adopts a unique array structure to simultaneously obtain and output temperature and relative humidity. It can be used in sensors required by smart phones, smart wearables, smart homes and other devices. The array structure improves the sensitivity and repeatability, can quickly and easily measure the ambient temperature and humidity, and can even detect the temperature and humidity of the human body for intelligent medical diagnosis, health assistants and other fields.
附图说明Description of drawings
图1为本发明石墨烯/硅阵列式智能温湿度传感器的结构示意图;Fig. 1 is the structural representation of graphene/silicon array type intelligent temperature and humidity sensor of the present invention;
图2为本发明中阵列式温湿度传感器模块的结构示意图;Fig. 2 is the structural representation of array type temperature and humidity sensor module in the present invention;
图3为阵列式温湿度传感器模块的截面示意图;3 is a schematic cross-sectional view of an arrayed temperature and humidity sensor module;
图中,电源模块(1),输入模块(2),微处理器模块(3),电流检测模块(4),阵列式温湿度传感器模块(5),A/D转换模块(6),输出模块(7); n型硅基体(51)、二氧化硅隔离层(52)、硅窗口(53)、石墨烯(54)、顶电极(55)和底电极(56)。In the figure, power supply module (1), input module (2), microprocessor module (3), current detection module (4), array type temperature and humidity sensor module (5), A/D conversion module (6), output Module (7); n-type silicon substrate (51), silicon dioxide isolation layer (52), silicon window (53), graphene (54), top electrode (55) and bottom electrode (56).
具体实施方式detailed description
下面结合附图对本发明做进一步说明。The present invention will be further described below in conjunction with the accompanying drawings.
参照图1和图2,本发明石墨烯/硅阵列式智能温湿度传感器,包括电源模块1,阵列式温湿度传感器模块5,电流检测模块4,A/D转换模块6,微处理器模块3,输入模块2和输出模块7;Referring to Fig. 1 and Fig. 2, the graphene/silicon array type intelligent temperature and humidity sensor of the present invention comprises a power supply module 1, an array type temperature and humidity sensor module 5, a current detection module 4, an A/D conversion module 6, and a microprocessor module 3 , input module 2 and output module 7;
输入模块2用于信号输入以给微处理器模块3提供信号控制,电流检测模块4检测阵列式温湿度传感器模块5中的电流,并通过A/D转换模块6将信号传递给微处理器模块3,微处理器模块3通过输出模块7输出温度和湿度,电源模块1给各模块供电。The input module 2 is used for signal input to provide signal control to the microprocessor module 3, and the current detection module 4 detects the current in the array type temperature and humidity sensor module 5, and passes the signal to the microprocessor module through the A/D conversion module 6 3. The microprocessor module 3 outputs temperature and humidity through the output module 7, and the power supply module 1 supplies power to each module.
所述的输入模块2可以为按键、触摸屏、蓝牙或者网络通信接口。The input module 2 can be a button, a touch screen, bluetooth or a network communication interface.
所述的输出模块7可以是液晶显示屏、触摸屏、蓝牙或网络通信接口。The output module 7 can be a liquid crystal display, a touch screen, bluetooth or a network communication interface.
如图2、3所示,所述的阵列式温湿度传感器模块5包括n型硅基体51和覆盖于n型硅基体上表面的二氧化硅隔离层52,在二氧化硅隔离层52上阵列式地开有2×2个硅窗口53,在每个硅窗口周围的二氧化硅隔离层的上表面覆盖一个顶电极55,在每个硅窗口及相应顶电极上表面覆盖有石墨烯54,每个硅窗口上石墨烯的边界小于顶电极的边界,在n型硅基体下表面设置底电极56,形成2×2阵列式器件;所述的n型硅基体的电阻率为1~10 Ω·cm,厚度为300~500 μm。所述的石墨烯为单层石墨烯或还原氧化石墨烯,所述的还原氧化石墨烯厚度为1-50nm。As shown in Figures 2 and 3, the arrayed temperature and humidity sensor module 5 includes an n-type silicon substrate 51 and a silicon dioxide isolation layer 52 covering the upper surface of the n-type silicon substrate, and the array is formed on the silicon dioxide isolation layer 52. There are 2×2 silicon windows 53 in a formula, and a top electrode 55 is covered on the upper surface of the silicon dioxide isolation layer around each silicon window, and graphene 54 is covered on the upper surface of each silicon window and the corresponding top electrode, The boundary of graphene on each silicon window is smaller than the boundary of the top electrode, and a bottom electrode 56 is arranged on the lower surface of the n-type silicon substrate to form a 2×2 array device; the resistivity of the n-type silicon substrate is 1 to 10 Ω cm, with a thickness of 300-500 μm. The graphene is single-layer graphene or reduced graphene oxide, and the thickness of the reduced graphene oxide is 1-50nm.
在上述的2×2阵列式器件中一个对角的两个单元采用封闭式真空封装结构,作为测温单元,另一对角的两个单元采用开放式封装结构,作为湿度测试单元;所述的电流检测模块4分别检测上述四个单元的电流信号。In the above-mentioned 2×2 array device, the two units at one diagonal adopt a closed vacuum packaging structure as a temperature measurement unit, and the two units at the other diagonal adopt an open packaging structure as a humidity testing unit; The current detection module 4 respectively detects the current signals of the above four units.
微处理器模块的测试信号先控制电流检测模块测试2×2阵列式器件中位于对角位置的两个单元组A中的电流,取A的电流平均值即可转换为温度值,然后控制测试2×2阵列式器件中另一对位于对角位置的两个单元B中的电流,将A中的温度值考虑到温湿度电流方程中,其中,温湿度电流方程:The test signal of the microprocessor module first controls the current detection module to test the current in the two unit groups A located in the diagonal position in the 2×2 array device, and takes the average value of the current of A to convert it into a temperature value, and then controls the test In the 2×2 array device, the current in another pair of two units B located at the diagonal position, taking the temperature value in A into the temperature and humidity current equation, among them, the temperature and humidity current equation:
中的a为温度系数,T代表绝对温度,b为湿度系数,RH为相对湿度,ln 为自然对数函数,I为B中电流值。方程中的a, b值均可通过校准拟合求出。即可计算出相对湿度值。In a is the temperature coefficient, T is the absolute temperature, b is the humidity coefficient, RH is the relative humidity, ln is the natural logarithmic function, and I is the current value in B. The values of a and b in the equation can be obtained by calibration and fitting. The relative humidity value can be calculated.
上述的石墨烯/硅阵列式智能温湿度传感器的电源模块1提供5V电压供给所有模块电源,阵列式温湿度传感器工作于-5V,输入模块输入控制信号给微处理器模块,开启、关闭,测量、置零整个智能传感器系统,电流检测模块测试阵列式温湿度传感器的电流,并通过A/D转换模块信号传递给微处理器模块,最终在输出模块显示出温度和湿度。The power supply module 1 of the above-mentioned graphene/silicon array type intelligent temperature and humidity sensor provides 5V voltage to supply power to all modules, the array type temperature and humidity sensor works at -5V, and the input module inputs control signals to the microprocessor module to turn on, off, and measure , Zeroing the entire intelligent sensor system, the current detection module tests the current of the array temperature and humidity sensor, and transmits the signal to the microprocessor module through the A/D conversion module, and finally displays the temperature and humidity on the output module.
制备上述石墨烯/硅阵列式智能温湿度传感器的核心传感器模块的的方法,包括以下步骤:The method for preparing the core sensor module of the above-mentioned graphene/silicon array type intelligent temperature and humidity sensor comprises the following steps:
(1)购买的商业标准4英寸低掺n型单抛氧化硅片(300 nm SiO2,电阻率约为1~10Ω•cm,硅部分的厚度为~500 μm),通过丙酮溶液、异丙醇分别超声3-5分钟,后用去离子水超声5min并用高纯氮吹干净的,然后在硅片上通过光刻工艺(一次光刻)定义出电极图案,然后采用电子束蒸发技术,生长厚度约为5 nm的铬黏附层,再用热蒸发技术生长60 nm的金电极(顶电极),该金电极的宽度为10~50μm,接着进行剥离和清洗工艺;(1) The purchased commercial standard 4-inch low-doped n-type single-throw silicon oxide wafer (300 nm SiO2, the resistivity is about 1~10Ω•cm, the thickness of the silicon part is ~500 μm), through acetone solution, isopropanol Sonicate for 3-5 minutes respectively, then use deionized water to sonicate for 5 minutes and blow it clean with high-purity nitrogen, then define the electrode pattern on the silicon wafer through photolithography (one-time photolithography), and then use electron beam evaporation technology to grow thickness A chromium adhesion layer of about 5 nm, and then a 60 nm gold electrode (top electrode) is grown by thermal evaporation technology. The width of the gold electrode is 10-50 μm, followed by stripping and cleaning processes;
(3)通过光刻工艺(二次光刻)定义硅窗口图案,并用标准缓冲氧化刻蚀剂BOE溶液(NH4F:HF = 6:1),通过湿法刻蚀去除的二氧化硅(刻蚀时间4分钟),裸露出硅表面,该硅窗口为边长100~500 μm 的圆孔;(3) Define silicon window pattern by photolithography process (second photolithography), and use standard buffered oxidation etchant BOE solution (NH 4 F:HF = 6:1), silicon dioxide removed by wet etching ( The etching time is 4 minutes), and the silicon surface is exposed, and the silicon window is a circular hole with a side length of 100-500 μm;
(4)转移石墨烯至硅窗口和电极上。转移方法:将铜箔上长有单层石墨烯的表面均匀旋涂一层光刻胶(PR-26)和聚甲基丙烯酸甲酯(PMMA)薄膜(厚度约为1μm),然后放入刻蚀溶液(由CuSO4、HCl和水组成,CuSO4:HCl:H2O=10g: 50ml: 50ml)中4小时腐蚀去除铜箔,留下由 PMMA/PR 支撑的单层石墨烯;将 PMMA/PR 支撑的单层石墨烯用去离子水清洗(漂浮在去粒子水里5分钟,并更换两次去离子水)后转移平铺到二氧化硅隔离层,顶电极,硅窗口内侧壁、顶电极上表面;等待2~4小时后用丙酮和异丙醇去除PMMA和光刻胶,分别清洗5分钟,并用高纯氮吹洗干净;(4) Transfer graphene onto silicon windows and electrodes. Transfer method: evenly spin-coat a layer of photoresist (PR-26) and polymethyl methacrylate (PMMA) film (thickness is about 1 μm) on the surface of copper foil with single-layer graphene, and then put it into the engraved Etching solution (composed of CuSO 4 , HCl and water, CuSO 4 : HCl: H 2 O=10g: 50ml: 50ml) for 4 hours to remove the copper foil, leaving a single layer of graphene supported by PMMA/PR; the PMMA /PR-supported single-layer graphene was cleaned with deionized water (floating in deionized water for 5 minutes, and deionized water was replaced twice), then transferred and tiled to the silica spacer, top electrode, inner wall of the silicon window, The upper surface of the top electrode; after waiting for 2 to 4 hours, remove PMMA and photoresist with acetone and isopropanol, clean them for 5 minutes respectively, and blow them with high-purity nitrogen;
(6)通过光刻工艺(三次光刻)定义石墨烯的区域面积,使其光刻胶覆盖整个金属电极区域,通过氧等离子体反应离子刻蚀技术(Oxygen plasma ICP-RIE),其功率和刻蚀时间分别为 75 W, 3 min,刻蚀掉光刻胶外的多余的石墨烯,刻蚀完成后,用丙酮和异丙醇清洗并去除残余的光刻胶;(6) Define the area of graphene through photolithography (three photolithography), so that the photoresist covers the entire metal electrode area, and through oxygen plasma reactive ion etching technology (Oxygen plasma ICP-RIE), its power and The etching time is 75 W, 3 min, etch away the excess graphene outside the photoresist, after the etching is completed, clean with acetone and isopropanol to remove the residual photoresist;
(8)在n型硅基体底部涂覆镓铟共晶合金,并用导电铜箔胶带粘接金线至镓铟合金上,引出金线制备底电极;在上表面的金电极上通过引线键合技术将金线引出完成上电极制备。(8) Coat the bottom of the n-type silicon substrate with a gallium-indium eutectic alloy, and use conductive copper foil tape to bond the gold wire to the gallium-indium alloy, and lead out the gold wire to prepare the bottom electrode; wire bonding on the gold electrode on the upper surface The technology leads out the gold wire to complete the preparation of the upper electrode.
石墨烯/硅阵列式智能温湿度传感器中的电源模块1,输入模块2,微处理器模块3,电流检测模块4,A/D转换模块6,输出模块7均可以使用其他厂商生产的现成模块。The power module 1, input module 2, microprocessor module 3, current detection module 4, A/D conversion module 6, and output module 7 in the graphene/silicon array intelligent temperature and humidity sensor can all use off-the-shelf modules produced by other manufacturers .
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005249722A (en) * | 2004-03-08 | 2005-09-15 | Denso Corp | Semiconductor type gas sensor |
| CN201795814U (en) * | 2010-08-25 | 2011-04-13 | 南京信息工程大学 | An integrated temperature and humidity monitoring device |
| CN202109934U (en) * | 2011-06-23 | 2012-01-11 | 长春工业大学 | A high-precision temperature and humidity transmitter with wireless communication function |
| CN102589615A (en) * | 2012-02-02 | 2012-07-18 | 高鹤 | Current type temperature and humidity sensor |
| CN102798416A (en) * | 2012-09-04 | 2012-11-28 | 扬州鑫鸿电子有限公司 | Monitoring system for power environment in machine room |
| CN104300027A (en) * | 2014-08-08 | 2015-01-21 | 浙江大学 | Graphene/silicon dioxide/ silicon based avalanche photodetector and preparation method thereof |
| CN104390720A (en) * | 2014-12-03 | 2015-03-04 | 东南大学 | Graphene oxide based capacitive temperature sensor and production method thereof |
| CN104697661A (en) * | 2015-01-04 | 2015-06-10 | 东南大学 | Three-dimensional integrated capacitance type temperature and humidity sensor based on oxidized graphene and preparation method thereof |
-
2015
- 2015-07-24 CN CN201510442058.6A patent/CN105067034B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005249722A (en) * | 2004-03-08 | 2005-09-15 | Denso Corp | Semiconductor type gas sensor |
| CN201795814U (en) * | 2010-08-25 | 2011-04-13 | 南京信息工程大学 | An integrated temperature and humidity monitoring device |
| CN202109934U (en) * | 2011-06-23 | 2012-01-11 | 长春工业大学 | A high-precision temperature and humidity transmitter with wireless communication function |
| CN102589615A (en) * | 2012-02-02 | 2012-07-18 | 高鹤 | Current type temperature and humidity sensor |
| CN102798416A (en) * | 2012-09-04 | 2012-11-28 | 扬州鑫鸿电子有限公司 | Monitoring system for power environment in machine room |
| CN104300027A (en) * | 2014-08-08 | 2015-01-21 | 浙江大学 | Graphene/silicon dioxide/ silicon based avalanche photodetector and preparation method thereof |
| CN104390720A (en) * | 2014-12-03 | 2015-03-04 | 东南大学 | Graphene oxide based capacitive temperature sensor and production method thereof |
| CN104697661A (en) * | 2015-01-04 | 2015-06-10 | 东南大学 | Three-dimensional integrated capacitance type temperature and humidity sensor based on oxidized graphene and preparation method thereof |
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