CN105059608B - A kind of FPC encapsulating process - Google Patents

A kind of FPC encapsulating process Download PDF

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Publication number
CN105059608B
CN105059608B CN201510448819.9A CN201510448819A CN105059608B CN 105059608 B CN105059608 B CN 105059608B CN 201510448819 A CN201510448819 A CN 201510448819A CN 105059608 B CN105059608 B CN 105059608B
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CN
China
Prior art keywords
cover layer
fpc
pad pasting
die
encapsulating
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CN201510448819.9A
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Chinese (zh)
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CN105059608A (en
Inventor
王伟
倪沁心
王曼媛
丁惠英
梁添贵
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Guangdong Huaheng Intelligent Technology Co Ltd
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Guangdong Huaheng Intelligent Technology Co Ltd
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Priority to CN201510448819.9A priority Critical patent/CN105059608B/en
Publication of CN105059608A publication Critical patent/CN105059608A/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B41/00Supplying or feeding container-forming sheets or wrapping material
    • B65B41/12Feeding webs from rolls
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B33/00Packaging articles by applying removable, e.g. strippable, coatings
    • B65B33/02Packaging small articles, e.g. spare parts for machines or engines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B61/00Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages
    • B65B61/02Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for perforating, scoring, slitting, or applying code or date marks on material prior to packaging

Abstract

The present invention relates to flexible circuit board production process technical field, more particularly to a kind of FPC encapsulating process, comprise the following steps:A:Cover layer carries out feeding by roller, and is sent to drilling machine;B:Cover layer, which enters in drilling machine, beats positioning hole, has beaten and die-cutting machine is sent to after positioning hole;C:Die-cutting machine carries out windowing task to cover layer using multiple die heads, and each die head can independently carry out X-axis, Y-axis motion and rotary motion;E:Pad pasting is carried out to FPC plates in into automatic film applicator, the present invention can shorten the production cycle, the artificial operation of substitution improves production efficiency and pad pasting precision.

Description

A kind of FPC encapsulating process
Technical field
The present invention relates to flexible circuit board production process technical field, more particularly to a kind of FPC encapsulating process.
Background technology
At present, it is domestic(FPC)FPC manufacture the application of industry cover layer flexible printed circuit coating earliest and The use of most technology is that adhesive identical with copper foil plate is coated with the identical film of copper-clad laminate basilar memebrane, becomes Semi-cured state coheres film.
Cover layer will carry out windowing processing, and environment temperature and humidity influence larger to cover layer subsequent technique, so needing Shorten the time that cover layer is fetched into from refrigeration storehouse between use as early as possible.
Removing has variously-shaped hole on the cover layer after release liners, completely the film without skeleton, is particularly difficult to operation, Will be with the location overlap on circuit to good also relatively difficult using positioning hole, to carry out contraposition folded using artificial for most of factory The terminal pad and terminal of cover layer window aperture and line pattern are accurately positioned, are fixed after confirmation by layer, operator, this Sample not only inefficiency, and the it cannot be guaranteed that precision of pad pasting.
The content of the invention
The purpose of the present invention is to solve the shortcomings of the prior art providing a kind of FPC encapsulating process, the present invention can contract Short production cycle, the artificial operation of substitution, improves production efficiency and pad pasting precision.
The present invention is achieved through the following technical solutions, a kind of FPC encapsulating process, comprises the following steps:
A:Cover layer carries out feeding by roller, and is sent to drilling machine;
B:Cover layer, which enters in drilling machine, beats positioning hole, has beaten and die-cutting machine is sent to after positioning hole;
C:Die-cutting machine carries out windowing task using multiple die heads to cover layer, and each die head can independently carry out X Axle, Y-axis motion and rotary motion;
E:Pad pasting is carried out to FPC plates in into automatic film applicator.
Preferably, being located between step C and step E also includes step D, step D:Including carrying out sub-material to cover layer Feeding-distribution device, cover layer is cut into from coiled strip to be needed size sheet stock and is smoothed.
Preferably, the step B is specially:Mould is provided with drilling machine, sets mould to be positioned with cover layer, then enter Row drilling.
Preferably, the step E is specially:
a:FPC plate feedings, FPC plates deliver to pad pasting station;
b:Cover layer delivers to progress dyestripping in automatic film tearing mechanism;
c:Coating materials after dyestripping is sent to pad pasting station;
d:Before pad pasting, using the position for including the positioning of CCD vision alignments, correction cover layer and FPC plates;
e:After the correspondence position for adjusting cover layer and FPC plates, pad pasting is carried out.
Preferably, the automatic film applicator includes substrate, the upper end of the substrate is provided with pad pasting station, the pad pasting The left and right sides of station is provided with several FPC plate feed mechanisms, and the upper end of the substrate is additionally provided with cover layer feed mechanism, The cover layer feed mechanism is located at the front end or rear end of pad pasting station.
Preferably, being additionally provided with automatic film tearing mechanism between the cover layer feed mechanism and pad pasting station.
Preferably, the pad pasting station includes the lower sucker that can be moved along X-direction and can moved along Y direction Upper sucker, the lower sucker is provided with vision alignment detent mechanism.
Preferably, the vision alignment detent mechanism is camera.
Preferably, the FPC plates feed mechanism includes the FPC plate mounting tables for being used to place FPC plates, the FPC plates are put Put and be provided with above platform for FPC plates to be pinched to the manipulator on lower sucker.
Beneficial effects of the present invention:A kind of FPC encapsulating process, comprises the following steps:A:Cover layer is carried out by roller Feeding, and it is sent to drilling machine;B:Cover layer, which enters in drilling machine, beats positioning hole, has beaten and die-cutting machine is sent to after positioning hole;C: Die-cutting machine carries out windowing task to cover layer using multiple die heads, and each die head can independently carry out X-axis, Y-axis motion And rotary motion;E:Pad pasting is carried out to FPC plates in into automatic film applicator, the present invention can shorten the production cycle, replace people Work is operated, and improves production efficiency and pad pasting precision.
Brief description of the drawings
Fig. 1 is the structural representation of present invention process flow.
Fig. 2 is the dimensional structure diagram of automatic film applicator of the present invention.
Fig. 3 is the top view of automatic film applicator of the present invention.
Fig. 4 is the front view of automatic film applicator of the present invention.
Reference is:
1-roller
2-drilling machine, 3-die-cutting machine
4-automatic film applicator, 41-substrate
42-pad pasting station 421-lower sucker
422-upper sucker, 423-camera
431-FPC plate mounting tables
432-manipulator, 44-cover layer feed mechanism
45-automatic film tearing mechanism, 5-feeding-distribution device.
Embodiment
1 the present invention is described further to accompanying drawing 4, and embodiment below in conjunction with the accompanying drawings.
As shown in figure 1, a kind of FPC encapsulating process, comprises the following steps:A:Cover layer carries out feeding by roller 1, and It is sent to drilling machine 2;B:Cover layer, which enters in drilling machine 2, beats positioning hole, has beaten after positioning hole and has been sent to die-cutting machine 3;C:Cross cutting Machine 3 using multiple die heads to cover layer carry out windowing task, each die head can independently carry out X-axis, Y-axis motion and Rotary motion;E:Pad pasting is carried out to FPC plates in into automatic film applicator 4.
The present embodiment can shorten the production cycle, the artificial operation of substitution, improve production efficiency and pad pasting precision.
In the present embodiment, step D, step D are also included between step C and step E:Including carrying out sub-material to cover layer Feeding-distribution device 5, cover layer is cut into from coiled strip to be needed size sheet stock and is smoothed.
In the present embodiment, the step B is specially:Mould is provided with drilling machine 3, sets mould to be positioned with cover layer, Drilled again.
In the present embodiment, the step E is specially:a:FPC plate feedings, FPC plates deliver to pad pasting station;b:Cover layer is sent Dyestripping is carried out in automatic film tearing mechanism 45;c:Coating materials after dyestripping is sent to pad pasting station 42;d:Before pad pasting, adopt Positioned with CCD vision alignments are included, the position of correction cover layer and FPC plates;e:Adjust the correspondence position of cover layer and FPC plates Afterwards, pad pasting is carried out.
As shown in Figures 2 to 4, the automatic film applicator 4 includes substrate 41, and the upper end of the substrate 41 is provided with pad pasting work Position 42, the left and right sides of the pad pasting station 42 is provided with several FPC plate feed mechanisms, and the upper end of the substrate 41 is also set up There is cover layer feed mechanism 44, the cover layer feed mechanism 44 is located at the front end or rear end of pad pasting station 42.
In the present embodiment, automatic film tearing mechanism is additionally provided between the cover layer feed mechanism 44 and pad pasting station 42 45, automatic film tearing mechanism 45 includes dyestripping plate, and what cover layer feed mechanism 44 carried out feeding is the coating materials for being pasted with adhesive tape, When adhesive tape passes through the outer end of dyestripping plate, coating materials is torn, and the coating materials being torn is located at the pad pasting station 42 of pad pasting component Interior, by pad pasting station, 42 are attached to coating materials on FPC plates, and the adhesive tape waste material torn carries out subsequent treatment by reclaiming.
In the present embodiment, the pad pasting station 42 includes the lower sucker 421 that can be moved along X-direction and can be along Y-axis The upper sucker 422 of direction movement, the lower sucker 421 is provided with vision alignment detent mechanism, using sucker technique, can be applicable In different size, the basement membrane of different size and unlike material, interchangeability is good, saves the time, improves production efficiency, at utmost On guarantee pad pasting effect.
In the present embodiment, the vision alignment detent mechanism is camera 423.
In the present embodiment, the FPC plates feed mechanism includes the FPC plates mounting table 431 for being used to place FPC plates, the FPC The top of plate mounting table 431 is provided with for FPC plates to be pinched to the manipulator 432 on lower sucker 421.
Above content is only presently preferred embodiments of the present invention, for one of ordinary skill in the art, according to the present invention's Thought, will change in specific embodiments and applications, and this specification content should not be construed as to the present invention Limitation.

Claims (5)

1. a kind of FPC encapsulating process, it is characterised in that comprise the following steps:
A:Cover layer passes through roller(1)Feeding is carried out, and is sent to drilling machine(2);
B:Cover layer enters drilling machine(2)It is interior to beat positioning hole, beat and die-cutting machine is sent to after positioning hole(3);
C:Die-cutting machine(3)Windowing task is carried out to cover layer using multiple die heads, each die head can independently carry out X Axle, Y-axis motion and rotary motion;
E:Into automatic film applicator(4)It is interior that pad pasting is carried out to FPC plates;
The step E is specially:
a:FPC plate feedings, FPC plates deliver to pad pasting station;
b:Cover layer delivers to automatic film tearing mechanism(45)Interior carry out dyestripping;
c:Coating materials after dyestripping is sent to pad pasting station(42);
d:Before pad pasting, using the position for including the positioning of CCD vision alignments, correction cover layer and FPC plates;
e:After the correspondence position for adjusting cover layer and FPC plates, pad pasting is carried out;
The automatic film applicator(4)Including substrate(41), the substrate(41)Upper end be provided with pad pasting station(42), the patch Film station(42)The left and right sides be provided with several FPC plate feed mechanisms, the substrate(41)Upper end be additionally provided with covering Film feed mechanism(44), the cover layer feed mechanism(44)Positioned at pad pasting station(42)Front end or rear end;
Also include step D, step D between step C and step E:Feeding-distribution device including carrying out sub-material to cover layer(5), Cover layer is cut into from coiled strip to be needed size sheet stock and is smoothed;
The pad pasting station(42)Including the lower sucker that can be moved along X-direction(421)With can be moved along Y direction it is upper Sucker(422), the lower sucker(421)It is provided with vision alignment detent mechanism.
2. a kind of FPC according to claim 1 encapsulating process, it is characterised in that:The step B is specially:Drilling machine (3)Mould is inside provided with, sets mould to be positioned with cover layer, then drilled.
3. a kind of FPC according to claim 1 encapsulating process, it is characterised in that:The cover layer feed mechanism(44) With pad pasting station(42)Between be additionally provided with automatic film tearing mechanism(45).
4. a kind of FPC according to claim 1 encapsulating process, it is characterised in that:The vision alignment detent mechanism is Camera(423).
5. a kind of FPC according to claim 1 encapsulating process, it is characterised in that:The FPC plates feed mechanism includes using In the FPC plate mounting tables for placing FPC plates(431), the FPC plates mounting table(431)Top be provided with for FPC plates to be pinched To lower sucker(421)On manipulator(432).
CN201510448819.9A 2015-07-28 2015-07-28 A kind of FPC encapsulating process Active CN105059608B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510448819.9A CN105059608B (en) 2015-07-28 2015-07-28 A kind of FPC encapsulating process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510448819.9A CN105059608B (en) 2015-07-28 2015-07-28 A kind of FPC encapsulating process

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CN105059608B true CN105059608B (en) 2017-09-19

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106793512A (en) * 2016-12-23 2017-05-31 东莞康源电子有限公司 The quick laminating apparatus of flex plate cover layer
CN108423404B (en) * 2018-04-03 2019-12-20 长沙正友精密自动化技术有限公司 FPC detects balance machine
CN112678249A (en) * 2020-12-27 2021-04-20 苏州鑫河镜业有限公司 Slicing and film pasting all-in-one machine for lenses and working method thereof

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KR101086571B1 (en) * 2011-01-20 2011-11-23 우영관 Member plate press and packaging machine
CN202098569U (en) * 2011-06-01 2012-01-04 何忠亮 Automatic laminator
CN103220886B (en) * 2013-04-09 2015-10-21 阳程(佛山)科技有限公司 A kind of flexible PCB lamination patch machine and processing technology thereof
CN103224055B (en) * 2013-04-15 2016-02-24 奈电软性科技电子(珠海)有限公司 A kind of FPC steel disc production machine
CN203356858U (en) * 2013-07-23 2013-12-25 东莞市铭丰包装品制造有限公司 Numerical control laser die-cutting machine
JP2015042718A (en) * 2013-08-26 2015-03-05 住友電気工業株式会社 Production method of porous polyimide film, porous polyimide film, composite film, wiring board, and multilayer wiring board
CN103582317B (en) * 2013-10-16 2016-07-06 镇江华印电路板有限公司 Flexible printed wiring board leakage stannum semicircle orifice manufacture method
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CN204431897U (en) * 2015-01-09 2015-07-01 昆山鑫正源金属制品有限公司 A kind of FPC steps and draws automatic attaching tool

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