CN105059608A - FPC encapsulating process - Google Patents
FPC encapsulating process Download PDFInfo
- Publication number
- CN105059608A CN105059608A CN201510448819.9A CN201510448819A CN105059608A CN 105059608 A CN105059608 A CN 105059608A CN 201510448819 A CN201510448819 A CN 201510448819A CN 105059608 A CN105059608 A CN 105059608A
- Authority
- CN
- China
- Prior art keywords
- fpc
- coverlay
- pad pasting
- encapsulating process
- fpc plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B41/00—Supplying or feeding container-forming sheets or wrapping material
- B65B41/12—Feeding webs from rolls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B33/00—Packaging articles by applying removable, e.g. strippable, coatings
- B65B33/02—Packaging small articles, e.g. spare parts for machines or engines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B61/00—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages
- B65B61/02—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for perforating, scoring, slitting, or applying code or date marks on material prior to packaging
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention relates to the technical field of flexible circuit board production, and in particular to an FPC encapsulating process. The FPC encapsulating process includes the following steps that A, a covering film is fed through a roller and conveyed to a drilling machine; B, the covering film enters the drilling machine so that a positioning hole can be punched, and the covering film is then conveyed to a die cutting machine after the positioning hole is punched; C, windowing work is conducted on the covering film by a plurality of die cutting heads by means of the die cutting machine, and all the die cutting heads can independently move in the X axis and the Y axis and can rotate; and E, the covering film enters an automatic film sticking machine so as to be stuck to a FPC board. By means of the FPC encapsulating process, the production cycle can be shortened, manual operation is replaced, and the production efficiency and the film sticking accuracy are improved.
Description
Technical field
The present invention relates to flexible circuit board production process technical field, particularly relate to the encapsulating process of a kind of FPC.
Background technology
At present, domestic (FPC) FPC is manufactured industry coverlay flexible printed circuit overplate and is applied the earliest and use maximum technology to be coated with adhesive identical with copper foil plate on the identical film of copper-clad laminate basilar memebrane, and what become semi-cured state coheres film.
Coverlay will carry out processing of windowing, and ambient temperature and humidity are comparatively large on the impact of coverlay subsequent technique, so need to shorten as early as possible coverlay to be fetched into time between use from refrigeration storehouse.
Remove the hole coverlay after parting paper having various shape, there is no the film of skeleton completely, be difficult to operation especially, utilize knock hole also more difficult to getting well with the location overlap on circuit, major part factory adopts and manually carries out contraposition lamination, and the terminal pad of coverlay window aperture and line pattern and terminal are accurately located by operator, are fixed after confirmation, so not only inefficiency, and the precision that can not ensure pad pasting.
Summary of the invention
The object of the invention is to the encapsulating process providing a kind of FPC for the deficiencies in the prior art, the present invention can shorten the production cycle, replaces manual operation, enhances productivity and pad pasting precision.
The present invention is achieved through the following technical solutions, and the encapsulating process of a kind of FPC, comprises the following steps:
A: coverlay carries out feeding by roller, and is sent to driller;
B: coverlay enters in driller and beats knock hole, is sent to mould cutting machine after having beaten knock hole;
C: mould cutting machine adopts multiple cross cutting head to carry out windowing task to coverlay, each cross cutting head all independently can carry out X-axis, Y-axis motion and rotary motion;
E: enter in automatic film applicator and pad pasting is carried out to FPC plate.
As preferably, between step C and step e, also comprise step D, step D: comprise distributing device coverlay being carried out to sub-material, being cut into from coiled strip by coverlay needs size sheet stock and smooths.
As preferably, described step B is specially: be provided with mould in driller, arranges mould and coverlay is located, then holes.
As preferably, described step e is specially:
A:FPC plate material loading, pad pasting station delivered to by FPC plate;
B: coverlay is delivered in automatic film tearing mechanism and carried out dyestripping;
C: the coating materials after dyestripping is sent to pad pasting station;
D: before pad pasting, adopts and draws together CCD vision alignment location, correct the position of coverlay and FPC plate;
E: after adjusting the correspondence position of coverlay and FPC plate, carries out pad pasting.
As preferably, described automatic film applicator comprises substrate, the upper end of described substrate is provided with pad pasting station, the left and right sides of described pad pasting station is provided with several FPC plate feed mechanisms, the upper end of described substrate is also provided with coverlay feed mechanism, and described coverlay feed mechanism is positioned at front end or the rear end of pad pasting station.
As preferably, between described coverlay feed mechanism and pad pasting station, be also provided with automatic film tearing mechanism.
As preferably, described pad pasting station comprises can along the lower sucker of X-direction movement and can along the upper sucker of Y direction movement, and described lower sucker is provided with vision alignment detent mechanism.
As preferably, described vision alignment detent mechanism is camera.
As preferably, described FPC plate feed mechanism comprises the FPC plate mounting table for placing FPC plate, and the top of described FPC plate mounting table is provided with the manipulator for being delivered to by FPC plate holder on lower sucker.
Beneficial effect of the present invention: the encapsulating process of a kind of FPC, comprises the following steps: A: coverlay carries out feeding by roller, and is sent to driller; B: coverlay enters in driller and beats knock hole, is sent to mould cutting machine after having beaten knock hole; C: mould cutting machine adopts multiple cross cutting head to carry out windowing task to coverlay, each cross cutting head all independently can carry out X-axis, Y-axis motion and rotary motion; E: enter in automatic film applicator and carry out pad pasting to FPC plate, the present invention can shorten the production cycle, replaces manual operation, enhances productivity and pad pasting precision.
Accompanying drawing explanation
Fig. 1 is the structural representation of present invention process flow process.
Fig. 2 is the perspective view of automatic film applicator of the present invention.
Fig. 3 is the birds-eye view of automatic film applicator of the present invention.
Fig. 4 is the front view of automatic film applicator of the present invention.
Reference numeral is:
1-roller
2-driller, 3-mould cutting machine
4-automatic film applicator, 41-substrate
42-pad pasting station, 421-lower sucker
422-upper sucker 423-camera
431-FPC plate mounting table
432-manipulator, 44-coverlay feed mechanism
45-automatic film tearing mechanism, 5-distributing device.
Detailed description of the invention
Below in conjunction with accompanying drawing 1 to accompanying drawing 4, and detailed description of the invention is described further the present invention.
As shown in Figure 1, the encapsulating process of a kind of FPC, comprises the following steps: A: coverlay carries out feeding by roller 1, and is sent to driller 2; B: coverlay enters in driller 2 and beats knock hole, is sent to mould cutting machine 3 after having beaten knock hole; C: mould cutting machine 3 adopts multiple cross cutting head to carry out windowing task to coverlay, each cross cutting head all independently can carry out X-axis, Y-axis motion and rotary motion; E: enter in automatic film applicator 4 and pad pasting is carried out to FPC plate.
The present embodiment can shorten the production cycle, replaces manual operation, enhances productivity and pad pasting precision.
In the present embodiment, between step C and step e, also comprise step D, step D: comprise the distributing device 5 coverlay being carried out to sub-material, being cut into from coiled strip by coverlay needs size sheet stock and smooths.
In the present embodiment, described step B is specially: be provided with mould in driller 3, arranges mould and coverlay is located, then holes.
In the present embodiment, described step e is specially: a:FPC plate material loading, and pad pasting station delivered to by FPC plate; B: coverlay is delivered in automatic film tearing mechanism 45 and carried out dyestripping; C: the coating materials after dyestripping is sent to pad pasting station 42; D: before pad pasting, adopts and draws together CCD vision alignment location, correct the position of coverlay and FPC plate; E: after adjusting the correspondence position of coverlay and FPC plate, carries out pad pasting.
As shown in Figures 2 to 4, described automatic film applicator 4 comprises substrate 41, the upper end of described substrate 41 is provided with pad pasting station 42, the left and right sides of described pad pasting station 42 is provided with several FPC plate feed mechanisms, the upper end of described substrate 41 is also provided with coverlay feed mechanism 44, and described coverlay feed mechanism 44 is positioned at front end or the rear end of pad pasting station 42.
In the present embodiment, automatic film tearing mechanism 45 is also provided with between described coverlay feed mechanism 44 and pad pasting station 42, automatic film tearing mechanism 45 includes dyestripping plate, what coverlay feed mechanism 44 carried out material loading is the coating materials being pasted with adhesive tape, when adhesive tape is through the outer end of dyestripping plate, coating materials is torn, and the coating materials be torn is positioned at the pad pasting station 42 of pad pasting assembly, be attached on FPC plate by coating materials by pad pasting station 42, the adhesive tape waste material torn carries out subsequent treatment by recovery.
In the present embodiment, described pad pasting station 42 comprises can along the lower sucker 421 of X-direction movement and can along the upper sucker 422 of Y direction movement, described lower sucker 421 is provided with vision alignment detent mechanism, adopt sucker technique, go for different size, the basement membrane of different size and unlike material, interchangeability is good, save time, enhance productivity, ensure pad pasting effect to the full extent.
In the present embodiment, described vision alignment detent mechanism is camera 423.
In the present embodiment, described FPC plate feed mechanism comprises the FPC plate mounting table 431 for placing FPC plate, and the top of described FPC plate mounting table 431 is provided with the manipulator 432 for being delivered to by FPC plate holder on lower sucker 421.
Above content is only preferred embodiment of the present invention, and for those of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, this description should not be construed as limitation of the present invention.
Claims (9)
1. an encapsulating process of FPC, is characterized in that comprising the following steps:
A: coverlay carries out feeding by roller (1), and is sent to driller (2);
B: coverlay enters in driller (2) and beats knock hole, is sent to mould cutting machine (3) after having beaten knock hole;
C: mould cutting machine (3) adopts multiple cross cutting head to carry out windowing task to coverlay, each cross cutting head all independently can carry out X-axis, Y-axis motion and rotary motion;
E: enter in automatic film applicator (4) and pad pasting is carried out to FPC plate.
2. the encapsulating process of a kind of FPC according to claim 1, it is characterized in that: between step C and step e, also comprise step D, step D: comprise the distributing device (5) coverlay being carried out to sub-material, being cut into from coiled strip by coverlay needs size sheet stock and smooths.
3. the encapsulating process of a kind of FPC according to claim 1, is characterized in that: described step B is specially: driller is provided with mould in (3), arranges mould and coverlay is located, then holes.
4. the encapsulating process of a kind of FPC according to claim 1, is characterized in that described step e is specially:
A:FPC plate material loading, pad pasting station delivered to by FPC plate;
B: coverlay is delivered in automatic film tearing mechanism (45) and carried out dyestripping;
C: the coating materials after dyestripping is sent to pad pasting station (42);
D: before pad pasting, adopts and draws together CCD vision alignment location, correct the position of coverlay and FPC plate;
E: after adjusting the correspondence position of coverlay and FPC plate, carries out pad pasting.
5. the encapsulating process of a kind of FPC according to claim 1, it is characterized in that: described automatic film applicator (4) comprises substrate (41), the upper end of described substrate (41) is provided with pad pasting station (42), the left and right sides of described pad pasting station (42) is provided with several FPC plate feed mechanisms, the upper end of described substrate (41) is also provided with coverlay feed mechanism (44), and described coverlay feed mechanism (44) is positioned at front end or the rear end of pad pasting station (42).
6. the encapsulating process of a kind of FPC according to claim 5, is characterized in that: be also provided with automatic film tearing mechanism (45) between described coverlay feed mechanism (44) and pad pasting station (42).
7. the encapsulating process of a kind of FPC according to claim 5, it is characterized in that: described pad pasting station (42) comprises can along the lower sucker (421) of X-direction movement and can along the upper sucker (422) of Y direction movement, and described lower sucker (421) is provided with vision alignment detent mechanism.
8. the encapsulating process of a kind of FPC according to claim 7, is characterized in that: described vision alignment detent mechanism is camera (423).
9. the encapsulating process of a kind of FPC according to claim 5, it is characterized in that: described FPC plate feed mechanism comprises the FPC plate mounting table (431) for placing FPC plate, the top of described FPC plate mounting table (431) is provided with the manipulator (432) for being delivered to by FPC plate holder on lower sucker (421).
Priority Applications (1)
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CN201510448819.9A CN105059608B (en) | 2015-07-28 | 2015-07-28 | A kind of FPC encapsulating process |
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CN201510448819.9A CN105059608B (en) | 2015-07-28 | 2015-07-28 | A kind of FPC encapsulating process |
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CN105059608A true CN105059608A (en) | 2015-11-18 |
CN105059608B CN105059608B (en) | 2017-09-19 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106793512A (en) * | 2016-12-23 | 2017-05-31 | 东莞康源电子有限公司 | The quick laminating apparatus of flex plate cover layer |
CN108423404A (en) * | 2018-04-03 | 2018-08-21 | 长沙正友精密自动化技术有限公司 | A kind of FPC detections circulating plate machine |
CN108502279A (en) * | 2018-04-12 | 2018-09-07 | 广东华恒智能科技有限公司 | A kind of cover film punching patch all-in-one machine |
CN112678249A (en) * | 2020-12-27 | 2021-04-20 | 苏州鑫河镜业有限公司 | Slicing and film pasting all-in-one machine for lenses and working method thereof |
CN114599221A (en) * | 2022-03-04 | 2022-06-07 | 盐城维信电子有限公司 | Automatic electrical measuring equipment |
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CN204431897U (en) * | 2015-01-09 | 2015-07-01 | 昆山鑫正源金属制品有限公司 | A kind of FPC steps and draws automatic attaching tool |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106793512A (en) * | 2016-12-23 | 2017-05-31 | 东莞康源电子有限公司 | The quick laminating apparatus of flex plate cover layer |
CN108423404A (en) * | 2018-04-03 | 2018-08-21 | 长沙正友精密自动化技术有限公司 | A kind of FPC detections circulating plate machine |
CN108423404B (en) * | 2018-04-03 | 2019-12-20 | 长沙正友精密自动化技术有限公司 | FPC detects balance machine |
CN108502279A (en) * | 2018-04-12 | 2018-09-07 | 广东华恒智能科技有限公司 | A kind of cover film punching patch all-in-one machine |
CN112678249A (en) * | 2020-12-27 | 2021-04-20 | 苏州鑫河镜业有限公司 | Slicing and film pasting all-in-one machine for lenses and working method thereof |
CN114599221A (en) * | 2022-03-04 | 2022-06-07 | 盐城维信电子有限公司 | Automatic electrical measuring equipment |
CN114599221B (en) * | 2022-03-04 | 2024-03-12 | 盐城维信电子有限公司 | Automatic electrical measurement equipment |
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