CN105050338B - Internal layer carries the press fit of circuit boards structure and its manufacture method of insert - Google Patents
Internal layer carries the press fit of circuit boards structure and its manufacture method of insert Download PDFInfo
- Publication number
- CN105050338B CN105050338B CN201510391670.5A CN201510391670A CN105050338B CN 105050338 B CN105050338 B CN 105050338B CN 201510391670 A CN201510391670 A CN 201510391670A CN 105050338 B CN105050338 B CN 105050338B
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- China
- Prior art keywords
- slot
- insert
- supporting part
- internal layer
- core material
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention provides the press fit of circuit boards structure and its manufacture method that a kind of internal layer carries insert.Press fit of circuit boards structure includes the first steel plate, the first copper foil, the first PP pieces, core material, the 2nd PP pieces, the second copper foil and the second steel plate from top to bottom set gradually；Through slot, the bottom of through slot are provided with supporting part on core material, supporting part is connected with core material, and support zone is in through slot；Insert is placed with through slot, insert is supported on supporting part.The present invention just fills insert to core material in bonding processes, reuses vacuum press pressing, and this flow is to complete the pressing of sheet material, also completes inlaying for internal layer.Therefore, not only processing is simple, easy, and production cost is low, is adapted to produce in enormous quantities.
Description
Technical field
The present invention relates to circuit board manufacturing area, more particularly to a kind of internal layer with insert press fit of circuit boards structure and
Its manufacture method.
Background technology
In PCB industries, general internal layer has the plate of pressing insert, when manufacturing, can all be coated on the surface of insert
One layer of glue-line, it is therefore an objective to improve insert and PCB adhesion.But such a technique productions are pressed, low production efficiency, cost increases
Add, and poor operability, it can not produce in enormous quantities.
The content of the invention
It is existing to solve the invention provides the press fit of circuit boards structure and its manufacture method that a kind of internal layer carries insert
High processing costs, low production efficiency in technology, the problem of can not producing in batches.
To solve the above problems, as one aspect of the present invention, there is provided a kind of internal layer carries the circuit board of insert
Pressing structure, including from top to bottom set gradually the first steel plate, the first copper foil, the first PP pieces, core material, the 2nd PP pieces,
Second copper foil and the second steel plate；Formed with through slot on core material, the bottom of through slot is provided with supporting part, supporting part with it is interior
Layer core plate connection, and support zone is in through slot；Insert is placed with through slot, insert is supported on supporting part.
Preferably, through slot has circular outline, and supporting part is set along circular diameter.
Present invention also offers a kind of manufacture method of press fit of circuit boards structure of internal layer with insert, including：Step
1, make inner core plates：Through slot is formed in inner core plates, wherein, the bottom of through slot is provided with supporting part, supporting part and internal layer
Core plate connects, and support zone is in through slot；Step 2, insert is placed in through slot and is supported on supporting part；Step
Rapid 3, by the first steel plate, the first copper foil, the first PP pieces, core material, the 2nd PP pieces, the second copper foil and the second steel plate from top to bottom
Set gradually, so as to form the press fit of circuit boards structure that internal layer carries insert.
Preferably, through slot be milling into.
Preferably, through slot is formed in inner core plates includes two parts, a part be will in through slot except supporting part with
Into groove, another part is to carry out controlled depth milling to the part corresponding to supporting part in through slot for outer part milling.
Preferably, through slot has circular outline, and supporting part is set along circular diameter.
By adopting the above-described technical solution, therefore, it need not inlayed using the press fit of circuit boards structure in the present invention
The bottom of thing coats one layer of glue-line, to improve the adhesion of insert and PCB, it is only necessary to insert is placed in through slot, this
Sample, it is only necessary to insert can be maintained at by supporting part in through slot.It can be seen that the present invention in bonding processes just inlaying
Thing is filled to core material, reuses vacuum press pressing, and this flow is to complete the pressing of sheet material, also completes internal layer
Inlay.Therefore, not only processing is simple, easy, and production cost is low, is adapted to produce in enormous quantities.
Brief description of the drawings
Fig. 1 schematically shows the structural representation of press fit of circuit boards structure of the internal layer with insert in the present invention
Figure；
Fig. 2 schematically shows the top view of core material.
Reference in figure：1st, the first steel plate；2nd, the first copper foil；3rd, the first PP pieces；4th, core material；5th, the 2nd PP pieces；
6th, the second copper foil；7th, the second steel plate；8th, through slot；9th, supporting part；10th, insert；11st, groove.
Embodiment
Embodiments of the invention are described in detail below in conjunction with accompanying drawing, but the present invention can be defined by the claims
Implement with the multitude of different ways of covering.
Fig. 1 to Fig. 2 is refer to, the invention provides the press fit of circuit boards structure that a kind of internal layer carries insert, including by
The first steel plate 1, the first copper foil 2, the first PP pieces 3, core material 4, the 2nd PP pieces 5, the and of the second copper foil 6 up to set gradually down
Second steel plate 7；Through slot 8, the bottom of through slot 8 are provided with supporting part 9, supporting part 9 and internal layer core on core material 4
Plate 4 connects, and supporting part 9 is located in through slot 8；Insert 10 is placed with through slot 8, insert 10 is supported on supporting part 9
On.Preferably, through slot 8 has circular outline, and diameter of the supporting part 9 along circle is set.
By adopting the above-described technical solution, therefore, it need not inlayed using the press fit of circuit boards structure in the present invention
The bottom of thing 10 coats one layer of glue-line, to improve the adhesion of insert and PCB, it is only necessary to which insert 10 is placed in into through slot 8
It is interior, so, it is only necessary to insert 10 can be maintained at by supporting part 9 in through slot 8.It can be seen that the present invention is in bonding processes
In just insert is filled to core material 4, reuse vacuum press pressing, this flow is to complete the pressing of sheet material,
Complete inlaying for internal layer.Therefore, not only processing is simple, easy, and production cost is low, is adapted to produce in enormous quantities.
Present invention also offers a kind of manufacture method of press fit of circuit boards structure of internal layer with insert, including：Step
1, make inner core plates：Through slot 8 is formed in inner core plates, wherein, the bottom of through slot 8 is provided with supporting part 9, supporting part 9 with
Core material 4 connects, and supporting part 9 is located in through slot 8；Step 2, insert 10 is placed in through slot 8 and is supported on
On supporting part 9；Step 3, by the first steel plate 1, the first copper foil 2, the first PP pieces 3, core material 4, the 2nd PP pieces 5, the second copper foil 6
From top to bottom set gradually with the second steel plate 7, so as to form the press fit of circuit boards structure that internal layer carries insert.
Preferably, through slot 8 be milling into.
Preferably, through slot 8 is formed in inner core plates includes two parts, and a part is will to remove supporting part 9 in through slot 8
Into groove 11, another part is to carry out controlled depth milling to the part corresponding to supporting part 9 in through slot 8 for part milling in addition.
In the present embodiment, the control deep trouth that one " rib " connects is arranged at the bottom of through slot 8, all elsewhere except rib region
Effect is worn in milling." rib " act as support insert, prevents insert from being come off from through slot 8.
Preferably, through slot 8 has circular outline, and diameter of the supporting part 9 along circle is set.
Method in the present invention has the characteristics of flow is simple, workable, and production cost is low, can be mass-produced.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included in the scope of the protection.
Claims (6)
1. a kind of internal layer carries the press fit of circuit boards structure of insert, it is characterised in that including from top to bottom set gradually the
One steel plate (1), the first copper foil (2), the first PP pieces (3), core material (4), the 2nd PP pieces (5), the second copper foil (6) and the second steel
Plate (7)；
Formed with through slot (8) on the core material (4), the bottom of the through slot (8) is provided with supporting part (9), described
Supporting part (9) is connected with the core material (4), and the supporting part (9) is located in the through slot (8)；The through slot
(8) insert (10) is placed with, the insert (10) is supported on the supporting part (9).
2. internal layer according to claim 1 carries the press fit of circuit boards structure of insert, it is characterised in that the through slot
(8) there is circular outline, the supporting part (9) is set along the circular diameter.
A kind of 3. manufacture method of press fit of circuit boards structure of internal layer with insert, it is characterised in that including：
Step 1, inner core plates are made：Through slot (8) is formed in inner core plates, wherein, the bottom of the through slot (8) is provided with branch
Support part (9), the supporting part (9) are connected with the core material (4), and the supporting part (9) is located at the through slot (8)
It is interior；
Step 2, insert (10) is placed in the through slot (8) and is supported on the supporting part (9)；
Step 3, by the first steel plate (1), the first copper foil (2), the first PP pieces (3), the core material (4), the 2nd PP pieces (5),
Second copper foil (6) and the second steel plate (7) are from top to bottom set gradually, so as to form the press fit of circuit boards knot that internal layer carries insert
Structure.
4. according to the method for claim 3, it is characterised in that the through slot (8) be milling into.
5. according to the method for claim 3, it is characterised in that forming through slot (8) in inner core plates includes two parts,
A part is that another part is to institute into groove (11) by the part milling in the through slot (8) in addition to the supporting part (9)
The part corresponding to supporting part (9) stated in through slot (8) carries out controlled depth milling.
6. according to the method for claim 3, it is characterised in that the through slot (8) has circular outline, the branch
Support part (9) is set along the circular diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510391670.5A CN105050338B (en) | 2015-07-07 | 2015-07-07 | Internal layer carries the press fit of circuit boards structure and its manufacture method of insert |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510391670.5A CN105050338B (en) | 2015-07-07 | 2015-07-07 | Internal layer carries the press fit of circuit boards structure and its manufacture method of insert |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105050338A CN105050338A (en) | 2015-11-11 |
| CN105050338B true CN105050338B (en) | 2017-12-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510391670.5A Active CN105050338B (en) | 2015-07-07 | 2015-07-07 | Internal layer carries the press fit of circuit boards structure and its manufacture method of insert |
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| CN (1) | CN105050338B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102123560A (en) * | 2011-03-01 | 2011-07-13 | 梅州博敏电子有限公司 | Embedded strong-current high-power PCB (Printed Circuit Board) and manufacturing method thereof |
| CN204090281U (en) * | 2014-07-31 | 2015-01-07 | 开平依利安达电子第三有限公司 | A kind of PCB |
| CN204180377U (en) * | 2014-08-29 | 2015-02-25 | 广州美维电子有限公司 | The pressing structure of cavity circuit plate |
| CN204810690U (en) * | 2015-07-07 | 2015-11-25 | 深圳市迅捷兴电路技术有限公司 | Circuit plate voltage stay knot that inlayer has mosaic constructs |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100736635B1 (en) * | 2006-02-09 | 2007-07-06 | 삼성전기주식회사 | Bare chip embedded pcb and method of the same |
-
2015
- 2015-07-07 CN CN201510391670.5A patent/CN105050338B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102123560A (en) * | 2011-03-01 | 2011-07-13 | 梅州博敏电子有限公司 | Embedded strong-current high-power PCB (Printed Circuit Board) and manufacturing method thereof |
| CN204090281U (en) * | 2014-07-31 | 2015-01-07 | 开平依利安达电子第三有限公司 | A kind of PCB |
| CN204180377U (en) * | 2014-08-29 | 2015-02-25 | 广州美维电子有限公司 | The pressing structure of cavity circuit plate |
| CN204810690U (en) * | 2015-07-07 | 2015-11-25 | 深圳市迅捷兴电路技术有限公司 | Circuit plate voltage stay knot that inlayer has mosaic constructs |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105050338A (en) | 2015-11-11 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: Baoan District manhole Street sand Shenzhen city 518000 four Guangdong province Dongbao Industrial Zone No. H building, the first floor of building G, Room 203, floor two floor Applicant after: Shenzhen City Xing Xing Polytron Technologies Inc Address before: Baoan District manhole Street sand Shenzhen city Guangdong province 518000 Industrial Zone No. four Dongbao building H Applicant before: Shenzhen Xunjiexing Circuit Tech Co., Ltd. |
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| COR | Change of bibliographic data | ||
| CB03 | Change of inventor or designer information |
Inventor after: Ma Zhuo Inventor after: Hu Xianjin Inventor after: Liu Yangyang Inventor after: Wang Yixiong Inventor before: Ma Zhuo Inventor before: Liu Yangyang Inventor before: Wang Yixiong |
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| CB03 | Change of inventor or designer information | ||
| GR01 | Patent grant |