CN105050329A - Lumped-parameter micro-strip isolator and circulator thick film production process - Google Patents
Lumped-parameter micro-strip isolator and circulator thick film production process Download PDFInfo
- Publication number
- CN105050329A CN105050329A CN201510371058.1A CN201510371058A CN105050329A CN 105050329 A CN105050329 A CN 105050329A CN 201510371058 A CN201510371058 A CN 201510371058A CN 105050329 A CN105050329 A CN 105050329A
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- China
- Prior art keywords
- web plate
- circuit
- thick film
- film production
- lumped
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/32—Non-reciprocal transmission devices
- H01P1/36—Isolators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/32—Non-reciprocal transmission devices
- H01P1/38—Circulators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Reversible Transmitting Devices (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
The invention discloses a lumped-parameter micro-strip isolator and circulator thick film production process comprising the following steps: S1, making screen boards, including a bottom circuit screen board, a glass insulation screen board and a top circuit screen board; S2, printing metal slurry on a rotating substrate according to the circuit of the bottom circuit screen board, and carrying out sintering; S3, printing insulating slurry resistant to high temperature and high voltage on the rotating substrate according to the glass insulation screen board, and carrying out sintering; and S4, printing metal slurry on the rotating substrate according to the circuit of the top circuit screen board, and carrying out sintering. The production process is simple. The adhesion is good, and the quality reliability is high. A step-by-step making method is adopted. Maintenance is easy.
Description
Technical field
The present invention relates to a kind of lumped parameter microstrip isolator, belt thick film production technology.
Background technology
Isolator, circulator solve the series of technical such as the isolation of radar equipment inter-stage, impedance and antenna duplexer, and improve the tactical qualities of radar system, is indispensable essential elements in TR assembly.Traditional lumped parameter microstrip isolator, circulator circuit many employings film production process, namely adopt the sputtering of vacuum metal slurry and the technique such as photoetching, etching to make, be characterized in that precision is high, but its cost be high.Be illustrated in figure 1 lumped parameter microstrip isolator, circulator that traditional handicraft is produced, bridging part many employings gold wire bonding, comparatively large to the technique for sticking difficulty of pottery and gyromagnet, and pottery needs center drilling with the adhesive surface of gyromagnet, avoids extruding spun gold, both bond area is decreased like this, and in operation, under external force, easily cause the type of spun gold to become and short circuit, reliability is general.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide a kind of lumped parameter microstrip isolator, circulator thick film production technology, this production technology is simple, and bonding reliability is good, and reliability is high, adopts substep manufacture method, easy to maintenance.
The object of the invention is to be achieved through the following technical solutions: lumped parameter microstrip isolator, thick film production technology of going in ring, it comprises the steps:
S1: make web plate, makes bottom circuit web plate, glass insulation web plate and layer circuit web plate;
S2: be printed on rotary substrate with the circuit of metal pulp by bottom circuit web plate, and sinter;
S3: press glass insulation screen printing on rotary substrate with the insulation slurry that is high temperature resistant, high pressure of insulation, and sinter;
S4: be printed on rotary substrate with the circuit of metal pulp by top layer circuit web plate, and sinter.
Metal pulp in described step S2 and step S4 is gold paste or silver slurry.
Sintering parameter in described step S2 is 850 DEG C, 1h.
Sintering parameter in described step S3 is 850 DEG C, 1h.
Sintering parameter in described step S4 is 850 DEG C, 1h.
The invention has the beneficial effects as follows: the invention provides a kind of lumped parameter microstrip isolator, circulator thick film production technology, this production technology is simple, and cementability is good, and reliability is high, adopts substep manufacture method, easy to maintenance.
Accompanying drawing explanation
Fig. 1 is lumped parameter microstrip isolator, the circulator that traditional handicraft is produced;
Fig. 2 is thick-film technique flow chart;
Fig. 3 is that bottom circuit network hardens composition
Fig. 4 is glass insulation mesh-plate structure figure
Fig. 5 is that top layer circuit network hardens composition.
Embodiment
Below in conjunction with accompanying drawing, technical scheme of the present invention is described in further detail, but protection scope of the present invention is not limited to the following stated.
As shown in Figure 2, lumped parameter microstrip isolator, thick film production technology of going in ring, it comprises the steps:
S1: make web plate, makes bottom circuit web plate, glass insulation web plate and top layer circuit web plate;
S2: be printed on rotary substrate with the circuit of metal pulp by bottom circuit web plate, and sinter;
S3: press glass insulation screen printing on rotary substrate with the insulation paste that is high temperature resistant, high pressure of insulation, and sinter;
S4: be printed on rotary substrate with the circuit of metal pulp by top layer circuit web plate, and sinter.
Metal pulp in described step S2 and step S4 is gold paste or silver slurry.
Sintering parameter in described step S2 is 850 DEG C, 1h.
Sintering parameter in described step S3 is 850 DEG C, 1h.
Sintering parameter in described step S4 is 850 DEG C, 1h.
Web plate is as shown in Figure 3 bottom circuit web plate, and it mainly prints main circuit, and web plate adopts the metal material web plate of 325 order numbers to make.
Web plate is as shown in Figure 4 glass insulation web plate, and it mainly prints insulating barrier, and web plate adopts the metal material web plate of 325 order numbers to make;
Web plate is as shown in Figure 5 top layer circuit web plate, and it mainly prints bridgt circuit, and web plate adopts the metal material web plate of 325 order numbers to make.
Claims (5)
1. lumped parameter microstrip isolator, thick film production technology of going in ring, is characterized in that: it comprises the steps:
S1: make web plate, makes bottom circuit web plate, glass insulation web plate and top layer circuit web plate;
S2: be printed on rotary substrate with the circuit of metal pulp by bottom circuit web plate, and sinter;
S3: press glass insulation screen printing on rotary substrate with the insulation paste that is high temperature resistant, high pressure of insulation, and sinter;
S4: be printed on rotary substrate with the circuit of metal pulp by top layer circuit web plate, and sinter.
2. lumped parameter microstrip isolator according to claim 1, thick film production technology of going in ring, is characterized in that: the metal pulp in described step S2 and step S4 is gold paste or silver slurry.
3. lumped parameter microstrip isolator according to claim 1, thick film production technology of going in ring, is characterized in that: the sintering parameter in described step S2 is 850 DEG C, 1h.
4. lumped parameter microstrip isolator according to claim 1, thick film production technology of going in ring, is characterized in that: the sintering parameter in described step S3 is 850 DEG C, 1h.
5. lumped parameter microstrip isolator according to claim 1, thick film production technology of going in ring, is characterized in that: the sintering parameter in described step S4 is 850 DEG C, 1h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510371058.1A CN105050329B (en) | 2015-06-30 | 2015-06-30 | Lumped parameter microstrip isolator, circulator thick film production technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510371058.1A CN105050329B (en) | 2015-06-30 | 2015-06-30 | Lumped parameter microstrip isolator, circulator thick film production technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105050329A true CN105050329A (en) | 2015-11-11 |
| CN105050329B CN105050329B (en) | 2017-10-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510371058.1A Active CN105050329B (en) | 2015-06-30 | 2015-06-30 | Lumped parameter microstrip isolator, circulator thick film production technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105050329B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455298A (en) * | 2016-10-31 | 2017-02-22 | 成都八九九科技有限公司 | Microwave circuit composite substrate with built-in magnetic disk |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1098561A (en) * | 1993-03-31 | 1995-02-08 | Tdk株式会社 | Multi-Layer Microwave Circulator |
| JPH08330811A (en) * | 1995-06-05 | 1996-12-13 | Hitachi Metals Ltd | Concentrated constant-type circulator |
| JPH09326603A (en) * | 1996-06-03 | 1997-12-16 | Tdk Corp | Isolator |
| CN1497770A (en) * | 2002-10-22 | 2004-05-19 | 阿尔卑斯电气株式会社 | Small nonreciprocal circuit element of high productivity |
| CN102544663A (en) * | 2012-01-13 | 2012-07-04 | 彭龙 | LTCC (Low Temperature Co-Fired Ceramic) laminated micro-strip ferrite circulator |
| CN203503655U (en) * | 2013-10-16 | 2014-03-26 | 锦州辽晶电子科技有限公司 | Four-passage isolation type firing circuit |
-
2015
- 2015-06-30 CN CN201510371058.1A patent/CN105050329B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1098561A (en) * | 1993-03-31 | 1995-02-08 | Tdk株式会社 | Multi-Layer Microwave Circulator |
| JPH08330811A (en) * | 1995-06-05 | 1996-12-13 | Hitachi Metals Ltd | Concentrated constant-type circulator |
| JPH09326603A (en) * | 1996-06-03 | 1997-12-16 | Tdk Corp | Isolator |
| CN1497770A (en) * | 2002-10-22 | 2004-05-19 | 阿尔卑斯电气株式会社 | Small nonreciprocal circuit element of high productivity |
| CN102544663A (en) * | 2012-01-13 | 2012-07-04 | 彭龙 | LTCC (Low Temperature Co-Fired Ceramic) laminated micro-strip ferrite circulator |
| CN203503655U (en) * | 2013-10-16 | 2014-03-26 | 锦州辽晶电子科技有限公司 | Four-passage isolation type firing circuit |
Non-Patent Citations (1)
| Title |
|---|
| 陈恒: "微带环形器的优化设计和工艺研究", 《中国优秀硕士学位论文全文数据库 信息科技辑》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455298A (en) * | 2016-10-31 | 2017-02-22 | 成都八九九科技有限公司 | Microwave circuit composite substrate with built-in magnetic disk |
| CN106455298B (en) * | 2016-10-31 | 2023-08-04 | 成都八九九科技股份有限公司 | Microwave circuit composite substrate with built-in magnetic sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105050329B (en) | 2017-10-03 |
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Address after: Pixian 610000 Sichuan city of Chengdu province Chengdu modern industrial port area Patentee after: Chengdu 899 Technology Co.,Ltd. Address before: Pixian 610000 Sichuan city of Chengdu province Chengdu modern industrial port area Patentee before: CHENGDU 899 SCIENCE AND TECHNOLOGY Co.,Ltd. |
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Address after: No. 818, wangcong East Road, Chengdu modern industrial port, Pidu District, Chengdu, Sichuan 610000 Patentee after: Chengdu 899 Technology Co.,Ltd. Address before: Pixian 610000 Sichuan city of Chengdu province Chengdu modern industrial port area Patentee before: Chengdu 899 Technology Co.,Ltd. |
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