CN106455298B - Microwave circuit composite substrate with built-in magnetic sheet - Google Patents

Microwave circuit composite substrate with built-in magnetic sheet Download PDF

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Publication number
CN106455298B
CN106455298B CN201610930749.5A CN201610930749A CN106455298B CN 106455298 B CN106455298 B CN 106455298B CN 201610930749 A CN201610930749 A CN 201610930749A CN 106455298 B CN106455298 B CN 106455298B
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layer
metal sheet
dielectric layer
magnetic sheet
metal
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CN201610930749.5A
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CN106455298A (en
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满吉令
郭永强
杨继芳
段树彬
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Chengdu 899 Technology Co ltd
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Chengdu 899 Technology Co ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233Filters, inductors or a magnetic substance
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08Magnetic details
    • H05K2201/083Magnetic materials

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Reversible Transmitting Devices (AREA)

Abstract

The invention discloses a microwave circuit composite substrate with built-in magnetic sheets, which comprises a composite board and magnetic sheets (1) built-in the composite board, wherein the composite board consists of a metal sheet (2), a dielectric layer (3) and a PP layer (5), the PP layer (5) is arranged between the metal sheet (2) and the dielectric layer (3), the upper surface and the lower surface of the dielectric layer (3) are respectively provided with a metal layer (4), the metal sheet (2) is compounded on the upper surface of the PP layer (5) through a bonding layer (6), and the PP layer (5) is compounded on the upper part of the dielectric layer (3) through the bonding layer (6). The beneficial effects of the invention are as follows: the size of the substrate is greatly reduced, the nonreciprocal transmission device and the nonreciprocal transmission device can be integrated in one microwave circuit composite substrate, the electrical performance and reliability are improved, and circulators and isolators of different types are derived.

Description

Microwave circuit composite substrate with built-in magnetic sheet
Technical Field
The invention relates to the technical field of radio frequency microwaves, in particular to a microwave circuit composite substrate with built-in magnetic sheets.
Background
Currently, existing microwave substrates, whether LTCC substrates or PCB substrates, can only integrate reciprocal transmission devices, such as filters, inductors, capacitors, etc., within the substrate, and do not integrate non-reciprocal transmission devices, such as isolators and circulators, within the substrate. Because the isolator and the circulator are important devices which form the microwave integrated module, the circulator and the isolator can only be installed outside when the microwave integrated module is designed and manufactured, so that the volume of the module is increased. In addition, the branch lines of the circulator and the isolator are large, so that the whole microwave integrated module is large in size.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide the microwave circuit composite substrate with built-in magnetic sheets, wherein the size of the substrate is greatly reduced, the nonreciprocal transmission device and the reciprocal transmission device can be integrated in one microwave circuit composite substrate, the electrical performance and the reliability are improved, and the circulators and isolators of different types are derived.
The aim of the invention is achieved by the following technical scheme: the composite substrate comprises a composite board and magnetic sheets arranged in the composite board, wherein the composite board consists of a metal sheet, a dielectric layer and a PP layer, the PP layer is arranged between the metal sheet and the dielectric layer, the upper surface and the lower surface of the dielectric layer are respectively laid with a metal layer, the metal sheet is compounded on the upper surface of the PP layer through a bonding layer, and the PP layer is compounded on the upper part of the dielectric layer through the bonding layer.
The composite board is composed of a metal sheet, at least two dielectric layers and a PP layer, wherein the PP layer is arranged between every two adjacent dielectric layers, the PP layer and the metal sheet are sequentially arranged on the upper surface of the dielectric layer at the top, and an adhesive layer is arranged at the contact part between the dielectric layer and the PP layer.
The magnetic sheet is any one of gyromagnetic ferrite, permanent magnetic ferrite, soft magnetic ferrite and rare earth magnet.
The dielectric layer is a polytetrafluoroethylene layer.
The metal sheet is copper plate, aluminum plate or iron plate.
The invention has the following advantages: the metal layer of the invention can be etched into annular circuits with different shapes, the annular circuits and the magnetic sheets form an annular device, and the reciprocal transmission devices can be etched on the metal layer, so that the annular device and the isolator with the nonreciprocal transmission characteristics can be integrated with reciprocal transmission devices such as a filter, a power divider, a capacitor, an inductor and the like to form a microwave transmission substrate, and the volume of a microwave circuit system is greatly reduced; the system and the whole machine have the advantages that the electrical performance and reliability of the system and the whole machine are improved, the design difficulties such as signal crosstalk and signal interconnection of each module are solved, the size of a microwave product is greatly reduced, and the integration density, the electrical performance and the reliability of the microwave integrated module are improved. (2) The circulator and the isolator with different types can be derived through the microwave circuit composite substrate, and the application range is very wide.
Drawings
FIG. 1 is a schematic diagram of a first embodiment of the present invention;
FIG. 2 is a schematic diagram of a second embodiment of the present invention;
in the figure, 1-magnetic sheet, 2-metal sheet, 3-dielectric layer, 4-metal layer, 5-PP layer, 6-adhesive layer.
Detailed Description
The invention is further described below with reference to the accompanying drawings, the scope of the invention not being limited to the following:
embodiment one: as shown in figure 1, a microwave circuit composite substrate with built-in magnetic sheets comprises a composite board and the magnetic sheets 1 built-in the composite board, wherein the magnetic sheets 1 are embedded into a PP layer 5, the composite board is composed of a metal sheet 2, a dielectric layer 3 and the PP layer 5, the PP layer 5 is arranged between the metal sheet 2 and the dielectric layer 3, the metal layers 4 are laid on the upper surface and the lower surface of the dielectric layer 3, the metal sheet 2 is compounded on the upper surface of the PP layer 5 through a bonding layer 6, and the PP layer 5 is compounded on the upper part of the dielectric layer 3 through the bonding layer 6.
The magnetic sheet 1 is any one of gyromagnetic ferrite, permanent magnetic ferrite, soft magnetic ferrite and rare earth magnet. The dielectric layer 3 is a polytetrafluoroethylene layer. The metal sheet 2 is a copper plate, an aluminum plate or an iron plate. The bonding layer 6 is double-sided adhesive tape.
The working principle of the invention is as follows: the metal layer 4 is etched into an annular circuit according to design requirements, a reserved signal port is formed in the annular circuit along the annular direction, and the annular circuit and the magnetic sheet 1 form an annular device. When the circulator works, the magnet is arranged on the metal sheet 2, and electromagnetic waves are introduced into one signal port, and the electromagnetic waves can only be transmitted from the next signal port along the annular direction because the magnet magnetizes the magnetic sheet 1 to generate electromagnetic wave deflection. When a load is connected to any one of the signal ports, the isolator can be fabricated. In addition, a filter, a power divider, a capacitor, an inductor and other reciprocal transmission devices can be etched on the metal layer 4. Therefore, the circulator and the isolator with the nonreciprocal transmission characteristics are integrated with the filter, the power divider, the capacitor, the inductor and other nonreciprocal transmission devices to form the microwave transmission substrate, the circulator or the isolator is not required to be installed outside, the product volume is greatly reduced, and the product quality is improved. The integrated microwave transmission substrate can be used as an independent microwave multifunctional module to be directly applied to a whole machine, and also can be used as a microwave active module substrate, and active components are attached to the surface of the integrated microwave transmission substrate to form a microwave unit with a specific function. The passive multifunctional component and the active microwave unit manufactured by the composite substrate have higher integration level.
Embodiment two: as shown in fig. 2, the difference between the present embodiment and the first embodiment is that: the composite board comprises a metal sheet 2, at least two dielectric layers 3 and a PP layer 5, wherein the PP layer 5 is arranged between every two adjacent dielectric layers 3, the PP layer 5 and the metal sheet 2 are sequentially arranged on the upper surface of the dielectric layer 3 positioned at the top, and an adhesive layer 6 is arranged at the contact position between the dielectric layer 3 and the PP layer 5.
The foregoing is merely a preferred embodiment of the invention, and it is to be understood that the invention is not limited to the form disclosed herein but is not to be construed as excluding other embodiments, but is capable of numerous other combinations, modifications and environments and is capable of modifications within the scope of the inventive concept, either as taught or as a matter of routine skill or knowledge in the relevant art. And that modifications and variations which do not depart from the spirit and scope of the invention are intended to be within the scope of the appended claims.

Claims (3)

1. A microwave circuit composite substrate with built-in magnetic sheet is characterized in that: the composite board comprises a composite board and a magnetic sheet (1) arranged in the composite board, wherein the composite board consists of a metal sheet (2), a dielectric layer (3) and a PP layer (5), the PP layer (5) is arranged between the metal sheet (2) and the dielectric layer (3), the upper surface and the lower surface of the dielectric layer (3) are respectively provided with a metal layer (4), the metal sheet (2) is compounded on the upper surface of the PP layer (5) through a bonding layer (6), and the PP layer (5) is compounded on the upper part of the dielectric layer (3) through the bonding layer (6); the composite board consists of a metal sheet (2), at least two dielectric layers (3) and a PP layer (5), wherein the PP layer (5) is arranged between every two adjacent dielectric layers (3), the PP layer (5) and the metal sheet (2) are sequentially arranged on the upper surface of the dielectric layer (3) positioned at the top, and an adhesive layer (6) is arranged at the contact position between the dielectric layer (3) and the PP layer (5); the magnetic sheet (1) is any one of gyromagnetic ferrite, permanent magnetic ferrite, soft magnetic ferrite and rare earth magnet; etching the metal layer (4) into an annular circuit, forming a reserved signal port on the annular circuit along the annular direction, and forming an annular device by the annular circuit and the magnetic sheet (1); when the circulator works, a magnet is arranged on the metal sheet (2) and simultaneously electromagnetic waves are led into one signal port, the magnet magnetizes the magnetic sheet (1) to generate electromagnetic wave deflection, the electromagnetic waves are transmitted from the next signal port along the annular direction, and the isolator is manufactured when any signal port is connected with a load; and etching a reciprocal transmission device on the metal layer (4), wherein the reciprocal transmission device comprises a filter, a power divider, a capacitor and an inductor, and the circulator and the isolator with the nonreciprocal transmission characteristic are integrated with the filter, the power divider, the capacitor and the inductor to form a microwave transmission substrate without externally installing the circulator or the isolator.
2. The microwave circuit composite substrate with built-in magnetic sheet according to claim 1, wherein: the dielectric layer (3) is a polytetrafluoroethylene layer.
3. The microwave circuit composite substrate with built-in magnetic sheet according to claim 1, wherein: the metal sheet (2) is a copper plate, an aluminum plate or an iron plate.
CN201610930749.5A 2016-10-31 2016-10-31 Microwave circuit composite substrate with built-in magnetic sheet Active CN106455298B (en)

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CN106455298B true CN106455298B (en) 2023-08-04

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Publication number Priority date Publication date Assignee Title
CN115224010B (en) * 2022-09-15 2022-12-02 河北美泰电子科技有限公司 Radio frequency micro-system of integrated gyromagnetic device

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CN205320364U (en) * 2015-11-13 2016-06-15 唐水 PCB (Printed circuit board) structure
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