CN105050329B - Lumped parameter microstrip isolator, circulator thick film production technology - Google Patents

Lumped parameter microstrip isolator, circulator thick film production technology Download PDF

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Publication number
CN105050329B
CN105050329B CN201510371058.1A CN201510371058A CN105050329B CN 105050329 B CN105050329 B CN 105050329B CN 201510371058 A CN201510371058 A CN 201510371058A CN 105050329 B CN105050329 B CN 105050329B
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China
Prior art keywords
web plate
circulator
thick film
production technology
circuit
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Application number
CN201510371058.1A
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Chinese (zh)
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CN105050329A (en
Inventor
满吉令
陈湖月
梁超
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Chengdu 899 Technology Co ltd
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CHENGDU 899 SCIENCE AND TECHNOLOGY Co Ltd
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Priority to CN201510371058.1A priority Critical patent/CN105050329B/en
Publication of CN105050329A publication Critical patent/CN105050329A/en
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/32—Non-reciprocal transmission devices
    • H01P1/36—Isolators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/32—Non-reciprocal transmission devices
    • H01P1/38—Circulators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity

Abstract

The invention discloses a kind of lumped parameter microstrip isolator, circulator thick film production technology, it comprises the following steps：S1：Web plate is made, bottom circuit web plate, glass insulation web plate and top layer circuit web plate is made；S2：It is printed on rotary substrate, and is sintered by the circuit of bottom circuit web plate with metal pulp；S3：Glass insulation screen printing is pressed on rotary substrate with the insulation paste of the high temperature resistant of insulation, high pressure, and is sintered；S4：It is printed on rotary substrate, and is sintered by the circuit of top layer circuit web plate with metal pulp.The simple production process, and cementability is good, reliability is high, easy to maintenance using substep preparation method.

Description

Lumped parameter microstrip isolator, circulator thick film production technology
Technical field
The present invention relates to a kind of lumped parameter microstrip isolator, circulator thick film production technology.
Background technology
Isolator, circulator solve the series of technical such as isolation, impedance and antenna duplexer between radar equipment level, carry The high tactical qualities of radar system, are indispensable essential elements in TR components.Traditional lumped parameter microstrip isolator, Film production process being used circulator circuit, i.e., starching the techniques such as sputtering and photoetching, etching using vacuum metal is made, its feature more It is that precision is high, but its cost is high.It is conventionally produced lumped parameter microstrip isolator, circulator, bridge joint as shown in Figure 1 During part uses gold wire bonding, and the technique for sticking difficulty to ceramics and gyromagnet is larger, and the ceramic adhesive surface with gyromagnet needs Heart perforate, it is to avoid extruding spun gold, so both reduces bond area, and in operation, under external force, easily cause gold The type of silk becomes and short circuit, and reliability is general,.
The content of the invention
It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of lumped parameter microstrip isolator, circulator Thick film production technology, the simple production process, and bonding reliability is good, reliability is high, using substep preparation method, maintenance It is convenient.
The purpose of the present invention is achieved through the following technical solutions：Lumped parameter microstrip isolator, circulator thick film Production technology, it comprises the following steps：
S1：Web plate is made, bottom circuit web plate, glass insulation web plate and layer circuit web plate is made；
S2：It is printed on rotary substrate, and is sintered by the circuit of bottom circuit web plate with metal pulp；
S3：Glass insulation screen printing is pressed on rotary substrate with the insulation slurry of the high temperature resistant of insulation, high pressure, and is burnt Knot；
S4：It is printed on rotary substrate, and is sintered by the circuit of top layer circuit web plate with metal pulp.
Metal pulp in described step S2 and step S4 is gold paste or silver paste.
Sintering parameter in described step S2 is 850 DEG C, 1h.
Sintering parameter in described step S3 is 850 DEG C, 1h.
Sintering parameter in described step S4 is 850 DEG C, 1h.
The beneficial effects of the invention are as follows：Produced the invention provides a kind of lumped parameter microstrip isolator, circulator thick film Technique, the simple production process, and cementability is good, reliability is high, easy to maintenance using substep preparation method.
Brief description of the drawings
Fig. 1 is conventionally produced lumped parameter microstrip isolator, circulator；
Fig. 2 is thick-film technique flow chart；
Fig. 3 is the hardened composition of bottom circuit network
Fig. 4 is glass insulation mesh-plate structure figure
Fig. 5 is the hardened composition of top layer circuit network.
Embodiment
Technical scheme is described in further detail below in conjunction with the accompanying drawings, but protection scope of the present invention is not limited to It is as described below.
As shown in Fig. 2 lumped parameter microstrip isolator, circulator thick film production technology, it comprises the following steps：
S1：Web plate is made, bottom circuit web plate, glass insulation web plate and top layer circuit web plate is made；
S2：It is printed on rotary substrate, and is sintered by the circuit of bottom circuit web plate with metal pulp；
S3：Glass insulation screen printing is pressed on rotary substrate with the insulation paste of the high temperature resistant of insulation, high pressure, and is carried out Sintering；
S4：It is printed on rotary substrate, and is sintered by the circuit of top layer circuit web plate with metal pulp.
Metal pulp in described step S2 and step S4 is gold paste or silver paste.
Sintering parameter in described step S2 is 850 DEG C, 1h.
Sintering parameter in described step S3 is 850 DEG C, 1h.
Sintering parameter in described step S4 is 850 DEG C, 1h.
Web plate as shown in Figure 3 is bottom circuit web plate, and it mainly prints main circuit, and web plate uses the metal of 325 mesh numbers Material web plate is made.
Web plate as shown in Figure 4 is glass insulation web plate, and it mainly prints insulating barrier, and web plate uses the metal of 325 mesh numbers Material web plate is made；
Web plate as shown in Figure 5 is top layer circuit web plate, and it mainly prints bridgt circuit, and web plate uses the gold of 325 mesh numbers Category material web plate is made.

Claims (5)

1. lumped parameter microstrip isolator, circulator thick film production technology, it is characterised in that：It comprises the following steps：
S1：Web plate is made, bottom circuit web plate, glass insulation web plate and top layer circuit web plate is made；
S2：It is printed on rotary substrate, and is sintered by the circuit of bottom circuit web plate with metal pulp；
S3：Glass insulation screen printing is pressed on rotary substrate with the insulation paste of the high temperature resistant of insulation, high pressure, and is burnt Knot；
S4：It is printed on rotary substrate, and is sintered by the circuit of top layer circuit web plate with metal pulp.
2. lumped parameter microstrip isolator according to claim 1, circulator thick film production technology, it is characterised in that：Institute Metal pulp in the step S2 and step S4 that state is gold paste or silver paste.
3. lumped parameter microstrip isolator according to claim 1, circulator thick film production technology, it is characterised in that：Institute Sintering parameter in the step S2 stated is 850 DEG C, 1h.
4. lumped parameter microstrip isolator according to claim 1, circulator thick film production technology, it is characterised in that：Institute Sintering parameter in the step S3 stated is 850 DEG C, 1h.
5. lumped parameter microstrip isolator according to claim 1, circulator thick film production technology, it is characterised in that：Institute Sintering parameter in the step S4 stated is 850 DEG C, 1h.
CN201510371058.1A 2015-06-30 2015-06-30 Lumped parameter microstrip isolator, circulator thick film production technology Active CN105050329B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510371058.1A CN105050329B (en) 2015-06-30 2015-06-30 Lumped parameter microstrip isolator, circulator thick film production technology

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510371058.1A CN105050329B (en) 2015-06-30 2015-06-30 Lumped parameter microstrip isolator, circulator thick film production technology

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CN105050329A CN105050329A (en) 2015-11-11
CN105050329B true CN105050329B (en) 2017-10-03

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106455298B (en) * 2016-10-31 2023-08-04 成都八九九科技股份有限公司 Microwave circuit composite substrate with built-in magnetic sheet

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1098561A (en) * 1993-03-31 1995-02-08 Tdk株式会社 Multi-Layer Microwave Circulator
CN1497770A (en) * 2002-10-22 2004-05-19 阿尔卑斯电气株式会社 Small nonreciprocal circuit element of high productivity
CN102544663A (en) * 2012-01-13 2012-07-04 彭龙 LTCC (Low Temperature Co-Fired Ceramic) laminated micro-strip ferrite circulator
CN203503655U (en) * 2013-10-16 2014-03-26 锦州辽晶电子科技有限公司 Four-passage isolation type firing circuit

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08330811A (en) * 1995-06-05 1996-12-13 Hitachi Metals Ltd Concentrated constant-type circulator
JPH09326603A (en) * 1996-06-03 1997-12-16 Tdk Corp Isolator

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1098561A (en) * 1993-03-31 1995-02-08 Tdk株式会社 Multi-Layer Microwave Circulator
CN1497770A (en) * 2002-10-22 2004-05-19 阿尔卑斯电气株式会社 Small nonreciprocal circuit element of high productivity
CN102544663A (en) * 2012-01-13 2012-07-04 彭龙 LTCC (Low Temperature Co-Fired Ceramic) laminated micro-strip ferrite circulator
CN203503655U (en) * 2013-10-16 2014-03-26 锦州辽晶电子科技有限公司 Four-passage isolation type firing circuit

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
微带环形器的优化设计和工艺研究;陈恒;《中国优秀硕士学位论文全文数据库 信息科技辑》;20100515;全文 *

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Address after: Pixian 610000 Sichuan city of Chengdu province Chengdu modern industrial port area

Patentee after: Chengdu 899 Technology Co.,Ltd.

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Patentee before: CHENGDU 899 SCIENCE AND TECHNOLOGY Co.,Ltd.

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Address after: No. 818, wangcong East Road, Chengdu modern industrial port, Pidu District, Chengdu, Sichuan 610000

Patentee after: Chengdu 899 Technology Co.,Ltd.

Address before: Pixian 610000 Sichuan city of Chengdu province Chengdu modern industrial port area

Patentee before: Chengdu 899 Technology Co.,Ltd.