CN105027581A - Piezoelectric actuator, and piezoelectric vibration device, portable terminal, acoustic generator, acoustic generation device, and electronic device provided therewith - Google Patents
Piezoelectric actuator, and piezoelectric vibration device, portable terminal, acoustic generator, acoustic generation device, and electronic device provided therewith Download PDFInfo
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- CN105027581A CN105027581A CN201480010150.9A CN201480010150A CN105027581A CN 105027581 A CN105027581 A CN 105027581A CN 201480010150 A CN201480010150 A CN 201480010150A CN 105027581 A CN105027581 A CN 105027581A
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/15—Transducers incorporated in visual displaying devices, e.g. televisions, computer displays, laptops
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
Abstract
[Problem] To provide a piezoelectric actuator which is free of disconnection even when a through-hole conductor of a flexible circuit board is arranged at a junction and which also realizes the downsizing of a piezoelectric actuator, and a piezoelectric vibration device, portable terminal, acoustic generator, acoustic generation device, and electronic device provided with the piezoelectric actuator. [Solution] A piezoelectric actuator (1) is provided with: a piezoelectric element (11) having a plate-shaped layered body (14) in which an internal electrode (12) and a piezoelectric layer (13) are stacked, and a surface electrode (15) electrically connected with the internal electrode (12) on one principal surface of the layered body (14); a flexible circuit board (2) having a wiring conductor (22) electrically connected with the surface electrode (15); and a conductive joining member (3) for electrically connecting the surface electrode (15) and the wiring conductor (22), the flexible circuit board (2) having a through-hole conductor (24) in an area in which the flexible circuit board (2) overlaps with the piezoelectric element (11), and an area for the junction of the flexible circuit board (2) and the piezoelectric element (11) by the conductive joining member (3) being provided at a position around the through-hole conductor (24) and set apart from the through-hole conductor (24) in a plan view.
Description
Technical field
The present invention relates to and be a kind ofly suitable for the piezo-activator of piezoelectric vibrating device, portable terminal etc. and possess piezoelectric vibrating device, portable terminal, sound generator, sound generating apparatus, the electronic equipment of this piezo-activator.
Background technology
Known following piezo-activator: the piezo-activator using the piezoelectric element of bimorph (bimorph) type, this piezoelectric element forms surface electrode on the surface of the duplexer being laminated with more internal electrode and piezoelectric body layer and obtains (with reference to patent documentation 1); Utilize conductive bonding material piezoelectric element and flexible base, board to be engaged, carry out the piezo-activator (with reference to patent documentation 2) be electrically connected with the wiring conductor of the surface electrode and flexible base, board that make piezoelectric element.
Patent documentation 1: No. 2002-10393, Japanese Unexamined Patent Publication
Patent documentation 2: Japanese Unexamined Patent Publication 6-14396 publication
Summary of the invention
The problem that invention will solve
Due to the relation of the configuration between the surface electrode of piezoelectric element and the wiring conductor being arranged on flexible base, board, sometimes via conductors is set on flexible substrates and cabling is carried out to wiring conductor.Now, if in order to the miniaturization realizing piezo-activator, in the region overlapping with piezoelectric element of flexible base, board, configure via conductors and this overlapping region entirety is engaged, then because heating when engaging is pressurizeed the stress produced, likely making via conductors break.On the other hand, if in order to prevent the broken string of via conductors, via conductors is configured in the outside in the region overlapping with piezoelectric element of flexible base, board, then the overall dimension change existed due to flexible base, board makes the problem that the size of piezo-activator becomes large greatly.
The present invention proposes in view of the foregoing, its object is to the piezoelectric vibrating device, portable terminal, sound generator, sound generating apparatus, the electronic equipment that a kind of piezo-activator are provided and possess this piezo-activator, even if configure via conductors in the region overlapping with piezoelectric element of flexible base, board, also can not produce broken string, and achieve the miniaturization of piezo-activator.
For solving the means of problem
The feature of piezo-activator of the present invention is to possess: piezoelectric element, and it has surface electrode internal electrode and piezoelectric body layer being carried out the stacked and duplexer of the tabular obtained and be electrically connected with described internal electrode on an interarea of this duplexer; Flexible base, board, it has the wiring conductor be electrically connected with described surface electrode; And conductive bonding material, described surface electrode and described wiring conductor are electrically connected by it, described flexible base, board has via conductors in the region overlapping with described piezoelectric element, when overlooking, the position be separated with this via conductors around described via conductors, is provided with the described flexible base, board of described conductive bonding material and the engaging zones of described piezoelectric element.
In addition, the feature of piezoelectric vibrating device of the present invention is the oscillating plate that has above-mentioned piezo-activator and engage with another interarea described in described duplexer.
In addition, the feature of portable terminal of the present invention is to have: above-mentioned piezo-activator, electronic circuit, display and housing, and another interarea of described duplexer engages with described display or described housing.
In addition, the feature of sound generator of the present invention is to have: piezo-activator; Described piezo-activator is installed, the oscillating plate vibrated by the vibration of this piezo-activator; And be arranged on the framework of peripheral part of this oscillating plate.
In addition, the feature of sound generating apparatus of the present invention is to possess: described sound generator and hold the housing of this sound generator.
In addition, the feature of electronic equipment of the present invention is to possess tut generator, the electronic circuit be connected with this sound generator and the housing holding this electronic circuit and described sound generator, has the function of sounding from described sound generator.
Invention effect
According to the present invention, the broken string of the via conductors of flexible printed circuit board can be prevented, the piezo-activator of high reliability can be obtained.In addition, the miniaturization of flexible base, board can be realized, consequently, piezo-activator can be carried out miniaturization.In addition, possess the piezoelectric vibrating device of the present invention of above-mentioned piezo-activator, portable terminal, sound generator, sound generating apparatus and electronic equipment and can realize high reliability and miniaturization.
Accompanying drawing explanation
Fig. 1 (a) is the exploded perspective view of an example of the execution mode representing piezo-activator of the present invention, and Fig. 1 (b) is the figure of an example of the wiring pattern of the lower face side representing the flexible base, board 2 shown in Fig. 1 (a).
Fig. 2 (a) is that the A-A line place shown in Fig. 1 (a) is blocked and the general profile chart obtained, and Fig. 2 (b) is that the B-B line place shown in Fig. 1 (a) is blocked and the general profile chart obtained.
Fig. 3 is the figure of other examples of the wiring pattern of the lower face side representing the flexible base, board 2 shown in Fig. 1 (b).
Fig. 4 (a) is the exploded perspective view of other examples of the execution mode representing piezo-activator of the present invention, and Fig. 4 (b) is the figure of an example of the wiring pattern of the lower face side representing the flexible base, board 2 shown in Fig. 4 (a).
Fig. 5 (a) is the exploded perspective view of other examples of the execution mode representing piezo-activator of the present invention, and Fig. 5 (b) is the figure of an example of the wiring pattern of the lower face side representing the flexible base, board 2 shown in Fig. 5 (a).
Fig. 6 (a) and Fig. 6 (b) is the approximate three-dimensional map of the distortion of the formation pattern of the conductive bonding material represented in piezo-activator of the present invention.
Fig. 7 is the outline longitudinal section of other examples of the execution mode representing piezo-activator of the present invention.
Fig. 8 is the outline longitudinal section of other examples of the execution mode representing piezo-activator of the present invention.
Fig. 9 is the approximate three-dimensional map of the execution mode schematically showing piezoelectric vibrating device of the present invention.
Figure 10 is the approximate three-dimensional map of the execution mode schematically showing portable terminal of the present invention.
Figure 11 represents that the A-A line place shown in Figure 10 is blocked and the general profile chart obtained.
Figure 12 represents that the B-B line place shown in Figure 10 is blocked and the general profile chart obtained.
Figure 13 (a) is the schematic vertical view of the schematic configuration of the execution mode representing sound generator of the present invention, Figure 13 (b) is the general profile chart of the example blocked at the A-A line place of Figure 13 (a), and Figure 13 (c) is the general profile chart of other examples blocked at the A-A line place of Figure 13 (a).
Figure 14 is the figure of the structure involved by execution mode representing sound generating apparatus of the present invention.
Figure 15 is the figure of the structure involved by execution mode representing electronic equipment of the present invention.
Embodiment
One example of the execution mode of the piezo-activator that present invention will be described in detail with reference to the accompanying.
Fig. 1 (a) is the exploded perspective view of an example of the execution mode representing piezo-activator of the present invention, and Fig. 1 (b) is the figure of an example of the wiring pattern of the lower face side representing the flexible base, board 2 shown in Fig. 1 (a).In addition, Fig. 2 (a) is that the A-A line place shown in Fig. 1 (a) is blocked and the general profile chart obtained, and Fig. 2 (b) is that the B-B line place shown in Fig. 1 (a) is blocked and the general profile chart obtained.
The piezo-activator 1 of the present embodiment shown in Fig. 1 and Fig. 2 possesses: piezoelectric element 11, and it has the surface electrode 15 internal electrode 12 and piezoelectric body layer 13 being carried out the stacked and duplexer 14 of the tabular obtained and be electrically connected with internal electrode 12 on an interarea of duplexer 14; Flexible base, board 2, it has the wiring conductor 22 be electrically connected with surface electrode 15; And conductive bonding material 3, surface electrode 15 and wiring conductor 22 are electrically connected by it, flexible base, board 2 has via conductors 24 in the region overlapping with piezoelectric element 11, when overlooking, the position be separated with this via conductors 24 around via conductors 24, be provided with based on conductive bonding material 3, the engaging zones 30 of flexible base, board 2 and piezoelectric element 11.
The piezo-activator 1 of this example has piezoelectric element 11, and an interarea of the piezoelectric element 11 of this example is the rectangular shape with length direction and Width.The duplexer 14 forming piezoelectric element 11 is undertaken stacked by internal electrode 12 and piezoelectric body layer 13, is formed as tabular and obtains.Further, piezo-activator 1 has multiple internal electrode 12 active portion overlapping in the stacking direction and not active portion in addition, such as, be formed as strip.Be when being installed on the piezo-activator in the display of portable terminal or housing at piezo-activator, as the length of duplexer 14, such as, be preferably 18mm ~ 28mm, be more preferably 22mm ~ 25mm.The width of duplexer 14 is such as preferably 1mm ~ 6mm, is more preferably 3mm ~ 4mm.The thickness of duplexer 14 is such as preferably 0.2mm ~ 1.0mm, is more preferably 0.4mm ~ 0.8mm.
The internal electrode 12 forming duplexer 14 is formed by firing with the pottery forming piezoelectric body layer 13 simultaneously, comprises the 1st internal electrode and the 2nd internal electrode.Internal electrode 12 is alternately laminated and clamp piezoelectric body layer 3 from upper and lower with piezoelectric body layer 13, according to lamination order configuration the 1st internal electrode and the 2nd internal electrode, thus applies driving voltage to the piezoelectric body layer 13 clamped between which.Form material as it, such as, can use using the silver lower with the reactivity of piezoelectric ceramic, silver-palladium alloy as the conductor of principal component, or use the conductor comprising copper, platinum etc., but also can contain ceramic component or glass ingredient in these conductors.
In the example shown in Fig. 1 and Fig. 2, the 1st internal electrode is differently from each other derived respectively with the end of the 2nd internal electrode on a pair relative side of duplexer 14.When piezo-activator in the display being installed on portable terminal or housing, as the length of internal electrode 12, such as, be preferably 17mm ~ 25mm, be more preferably 21mm ~ 24mm.The width of internal electrode 12 is such as preferably 1mm ~ 5mm, is more preferably 2mm ~ 4mm.The thickness of internal electrode 12 is such as preferably 0.1 μm ~ 5 μm.
The piezoelectric body layer 13 forming duplexer 14 is formed by the pottery with piezoelectric property, as this pottery, such as, can use by lead titanate-zirconate (PbZrO
3-PbTiO
3) perofskite type oxide, the lithium niobate (LiNbO that form
3), lithium tantalate (LiTaO
3) etc.In order to utilize low-voltage to drive, the thickness of 1 layer of piezoelectric body layer 13 is such as preferably set to 0.01 ~ 0.1mm.In addition, in order to obtain large flexural vibrations, preferably there is the piezoelectric constant d31 of more than 200pm/V.
On an interarea of duplexer 14, be provided with the surface electrode 15 be electrically connected with internal electrode 12.The surface electrode 15 of the mode shown in Fig. 1 is made up of the 2nd surface electrode 152 of large-area 1st surface electrode 151 and small size and the 3rd surface electrode 153.Such as, 1st surface electrode 151 is electrically connected with the internal electrode 12 as the 1st internal electrode, 2nd surface electrode 152 such as be arranged on an interarea side, be electrically connected as the internal electrode 12 of the 2nd internal electrode, the 3rd surface electrode 153 such as be arranged on another interarea side, be electrically connected as the internal electrode 12 of the 2nd internal electrode.Be when being installed on the piezo-activator in the display of portable terminal or housing at piezo-activator, the length of the 1st surface electrode 151 is such as preferably 17mm ~ 23mm, is more preferably 19mm ~ 21mm.The width of the 1st surface electrode 151 is such as preferably 1mm ~ 5mm, is more preferably 2mm ~ 4mm.The length of the 2nd surface electrode 152 and the 3rd surface electrode 153 is such as preferably set to 1mm ~ 3mm.The width of the 2nd surface electrode 152 and the 3rd surface electrode 153 is such as preferably set to 0.5mm ~ 1.5mm.
In addition, piezo-activator 1 has the flexible base, board 2 engaged with surface electrode 15 electricity.Specifically, flexible base, board 2 is such as provided with wiring conductor 22 and via conductors 25 as wiring on resinous basement membrane 21, surface is provided with coverlay 23 thereon, and lower surface, in region except the region overlapping with piezoelectric element 11 and near zone thereof, be provided with coverlay 23.At this, the via conductors 25 shown in figure is the structures arranging conductor layer and obtain in the inner wall surface in the hole running through basement membrane 21.This via conductors 25 is arranged in the region overlapping with piezoelectric element 11 of flexible base, board 2.In addition, the wiring conductor 22 be electrically connected with the 1st surface electrode 151 of piezoelectric element 11 from the lower surface of basement membrane 21 via the upper surface cabling of via conductors 25 to basement membrane 21.On the other hand, the wiring conductor 22 be electrically connected with the 2nd surface electrode 152 of piezoelectric element 11 and the wiring conductor 22 be electrically connected with the 3rd surface electrode 153 are arranged on the lower surface of basement membrane 21.As noted above, by by wiring conductor 22 separating up and down at basement membrane 21, thus the width of flexible base, board 2 can be reduced, piezo-activator 1 can be reduced.As via conductors, be not limited to the via conductors shown in figure, as long as the via conductors being filled with conductor in the inside in hole and obtaining.In addition, upper and lower wiring conductor 22 can be overlapping when top perspective, but considers that thickness can be thickening, can be also nonoverlapping as shown in the figure.In addition, from an example of wiring pattern during top view flexible base, board 2 shown in Fig. 1 (a), an example of wiring pattern when observing flexible base, board 2 shown in Fig. 1 (b) from below.
At this, the end of the wiring conductor 22 engaged with surface electrode 15 is good with wide cut, in addition, as shown in Figure 3, preferably end is made to become comb teeth-shaped in the end of the wiring conductor 22 of wide cut by arranging the operations such as slit, thus, conductive bonding material 3 and wiring conductor 22 carry out three-dimensional and engage, and the bond strength of flexible base, board 2 and piezoelectric element 11 improves.In addition, the flowing preventing conductive bonding material 3 can also be contributed to.
In addition, as long as the coverlay 23 be arranged on the lower surface of flexible base, board 2 be arranged on the lower surface of flexible base, board 2, except wiring conductor 22 with the engaging zones of surface electrode 15 except region in, by not arranging coverlay 23 in the region overlapping with piezoelectric element 11 and near zone thereof, thus the impact that produced by the thickness of coverlay 23 can not be subject to, be electrically connected reliably.This flexible base, board 2 such as engages with piezoelectric element 11 an end, engages with external circuit (connector) in another end.
Further, a part for flexible base, board 2 is engaged by the interarea of conductive bonding material 3 with the duplexer 14 forming piezoelectric element 11, and wiring conductor 22 is electrically connected with surface electrode 15 by conductive bonding material 3.At this, as described later, position when overlooking around via conductors 25, that be separated with this via conductors 25, is provided with the engaging zones 30 of flexible base, board 2 and piezoelectric element 11.
In addition, the number of via conductors 25 does not limit, but in order to suppress broken string and reduce conducting resistance, preferably arranges multiple as shown in the figure.In addition, the pattern of wiring conductor 22 does not also limit, but such as by arranging wiring conductor 22 around the peristome of via conductors 25, thus obtains and being firmly electrically connected of via conductors 25, because of but preferably.
As conductive bonding material 3, use conductive adhesive, solder etc., but preferably use conductive adhesive.This is because, by such as using following conductive adhesive, thus can reduce by the stress of vibration generation compared with solder, namely, this conductive adhesive is in the resin binders 32 such as allyl resin, epoxy resin, silicones, polyurethane resin or synthetic rubber, disperses the conducting particles 31 be such as made up of gold, copper, nickel or gold-plated resin balls etc. to obtain.It is further preferred that use anisotropic conductive material in conductive adhesive.Anisotropic conductive material is made up of the resin binder 32 of the conducting particles 31 and performance adhesive effect that play electric conjugation, is connected with surface electrode 15 and wiring conductor 22 by a conducting particles 31.That is, each conducting particles 31 between surface electrode 15 and wiring conductor 22 connects with surface electrode 15 and wiring conductor 22.This anisotropic conductive material keeps conducting in a thickness direction, in face, direction (with the direction, face of a main surface parallel of duplexer 14) keeps insulating, even if therefore surface electrode 15 pattern pitch of the wiring pattern pitch of flexible base, board 2 and piezoelectric element 11 is established narrower, also can not there is electric short circuit, engaging zones 30 can be reduced.In addition, in the example depicted in figure 1, the structure using anisotropic conductive material as conductive bonding material 3 is shown.
In addition, although not shown, piezo-activator 1 also can possess reinforcement plate, and this reinforcement plate is arranged on the region at least overlapping with piezoelectric element 11 from top view of flexible base, board 2.Reinforcement plate is for strengthening the region overlapping with piezoelectric element 11 of flexible base, board 2, be such as the metals such as resin, stainless steel, aluminium and their alloy such as glass epoxy (FR-4), composite material (CEM-3), Polyetherimide, polyimides, polyester, such as, thickness be set to 50 ~ 200 μm.
And, in the present invention, as previously mentioned, flexible base, board 2 has via conductors 25 in the region overlapping with piezoelectric element 11, position when overlooking around via conductors 25, that be separated with this via conductors 25, is provided with that be made up of conductive bonding material 3, flexible base, board 2 and piezoelectric element 11 engaging zones 30.
At this, engaging zones 30 refer to the surface of the piezoelectric element 11 of the surface comprising surface electrode 15 (upper surface) and comprise wiring conductor 22 surface (lower surface) flexible base, board 2 surface between, the region that is filled with conductive bonding material 3.In addition, be also included in the situation that the area that in this engaging zones 30, conductive bonding material 3 contacts with flexible base, board 2 is different with the area contacted with piezoelectric element 11, the cross section of such as conductive bonding material 3 is trapezoidal situation.In this case, the region that conductive bonding material 3 contacts with flexible base, board 2 is separated with via conductors 25, and this mode is also contained in the present invention.In addition, as the position be separated, the state being such as separated 200 ~ 600 μm with the peristome (via conductors 25) of through hole is good.In addition, as described later, as long as with not easily to the degree installation space of via conductors 25 stress application.
By adopting this structure, between the via conductors 25 and piezoelectric element 11 of flexible base, board 2, produce space (gap).Therefore, all not easily to the structure of via conductors 25 stress application when becoming when flexible base, board 2 engages with piezoelectric element 11 and use, the broken string of via conductors 25 can be prevented.
In addition, by producing space (gap) between the via conductors 25 and piezoelectric element 11 of flexible base, board 2, thus make flexible base, board 2 easily follow the distortion of piezoelectric element 11, not easily hinder the distortion of piezoelectric element 11, therefore, it is possible to efficiency makes piezoelectric element 11 vibrate well, improve the acoustic pressure of portable terminal, sound generator.
At this, as shown in Figure 4, multiple tomb is preferably provided with in the engaging zones 30 of conductive bonding material 3.
By adopting this structure, the thickness of the engaging zones 30 of conductive bonding material 3 can not too increase, and realizes homogenizing, thus improves the bond strength of flexible base, board 2 and piezoelectric element 11.
In addition, piezoelectric element 11 is self-heating due to vibration, and the temperature of the engaging zones 30 be therefore made up of conductive bonding material 3 likely rises, and bond strength declines.Therefore, if Continuous Drive piezoelectric element 11, then conductive bonding material 3 is likely peeled off, reliability decrease.To this, by reducing bonding area, the volume of conductive bonding material 3, thus increase the surface area of the conductive bonding material 3 contacted with environment (air) and improve radiating effect, therefore, it is possible to suppress the stripping of conductive bonding material 3, reliability during Continuous Drive can be improved.
In addition, the bonding area of conductive bonding material 3 diminishes, and the quality of conductive bonding material 3 also can diminish, and therefore the vibration of piezoelectric element 11 not easily decays, and piezoelectric element 11 efficiency can be made to vibrate well.Therefore, it is possible to efficiency encourages oscillating plate well, improve the acoustic pressure of portable terminal, sound generator.
Particularly, an interarea of preferred duplexer 14 is rectangular shapes, and the engaging zones 30 of conductive bonding material 3 is separated setting on the length direction of an interarea of this piezoelectric element 11.The mode that piezoelectric element 11 mainly moves up and down with the end of length direction carries out flexural vibrations, therefore according to this structure, the engaging zones 30 of conductive bonding material 3 separates in the longitudinal direction, thus the vibration of piezoelectric element 11 more not easily decays, in addition, efficiency piezoelectric element 11 flexural vibrations can be made better.
As concrete structure, as shown in Figure 4, following structure can be enumerated, namely, an interarea of duplexer 14 is rectangular shapes, surface electrode 15 comprises the 1st surface electrode 151, 2nd surface electrode 152 and the 3rd surface electrode 153, 2nd surface electrode 152 and the 3rd surface electrode 153 are separated from each other setting on the Width of a described interarea, 1st surface electrode 151 is separated setting with the 2nd surface electrode 152 and the 3rd surface electrode 153 on the length direction of a described interarea, engaging zones 30 comprises the 1st engaging zones 301, 2nd engaging zones 302 and the 3rd engaging zones 303, 1st engaging zones 301 is arranged on the 1st surface electrode 151, 2nd engaging zones 302 is arranged on the 2nd surface electrode 152, 3rd engaging zones 303 is arranged on the 3rd surface electrode 153.
Now, the wiring conductor 22 of flexible base, board 2 comprise the 1st wiring conductor 221 that is connected with via conductors 25 and with unconnected 2nd wiring conductor 222 of via conductors 25 and the 3rd wiring conductor 223,1st surface electrode 151 is connected with the 1st wiring conductor 221 by the 1st engaging zones 301,2nd surface electrode 152 is connected with the 2nd wiring conductor 222 by the 2nd engaging zones 302, and the 3rd surface electrode 153 is connected with the 3rd wiring conductor 223 by the 3rd engaging zones 303.
On the other hand, as shown in Figure 5, it can also be following structure, namely, an interarea of duplexer 14 is rectangular shapes, surface electrode 15 comprises the 1st surface electrode 151, 2nd surface electrode 152 and the 3rd surface electrode 153, 2nd surface electrode 152 and the 3rd surface electrode 153 are separated from each other setting on the Width of a described interarea, 1st surface electrode 151 is separated setting with the 2nd surface electrode 152 and the 3rd surface electrode 153 on the length direction of a described interarea, engaging zones 30 comprises the 1st engaging zones 301 and the 2nd engaging zones 302, 1st engaging zones 301 is arranged on the 1st surface electrode 151, 2nd engaging zones 302 crosses over setting on the 2nd surface electrode 152 and on the 3rd surface electrode 153.
Now, become following structure, namely, the wiring conductor 22 of flexible base, board 2 comprises the 1st wiring conductor 221 and 2nd wiring conductor 222 unconnected with via conductors 25 that are connected with via conductors 25,1st surface electrode 151 is connected with the 1st wiring conductor 221 by the 1st engaging zones 301, and the 2nd surface electrode 152 and the 3rd surface electrode 153 are connected with the 2nd wiring conductor 222 by the 2nd engaging zones 302.
In addition, structure preferably following in effect, namely, as shown in Fig. 6 (a), an interarea of duplexer 14 is rectangular shapes, engaging zones 30 (the 1st engaging zones 301 and the 2nd engaging zones 302) extends on the Width of a described interarea, has band shape when top perspective.Specifically, following example shown in Fig. 6 (a), namely, 1st surface electrode 151 configures in the direction of the width with band shape extend 3 row conductive bonding materials 3, and from the 2nd surface electrode 152 to the 3rd surface electrode 153 configure in the direction of the width with band shape extend 3 row conductive bonding materials 3.According to this structure, for the flexural vibrations that the end primarily of length direction moves up and down, the vibration of piezoelectric element 11 more not easily decays, and can efficiency make piezoelectric element 11 vibrate better.
In addition, also can be following structure, namely, as shown in Fig. 6 (b), an interarea of duplexer 14 is rectangular shapes, and multiple described engaging zones 30 (the 1st engaging zones 301 and the 2nd engaging zones 302) is separated with compartment of terrain spread configuration on the Width of a described interarea.Specifically, following example shown in Fig. 6 (b), that is, the 1st surface electrode 151 configures be separated with in the direction of the width compartment of terrain arrangement 3 conductive bonding materials 3, and from the 2nd surface electrode 152 to the 3rd surface electrode 153 configure 3 conductive bonding materials 3.According to this structure, for the flexural vibrations of Width, the vibration of piezoelectric element 11 more not easily decays, and can efficiency make piezoelectric element 11 vibrate better.
In addition, when having region that expose piezoelectric body layer 13, that do not arrange surface electrode between the 1st surface electrode 151 and the 2nd surface electrode 152 and the 3rd surface electrode 153, preferred via conductors 25 is positioned at directly over this region.That is, preferably when top perspective, in the region overlapping with via conductors 25 of an interarea, the surface of piezoelectric body layer 13 is exposed.Owing to the region that flexible base, board 2 is overlapping with piezoelectric element 11 can be established less, and by utilize conductive bonding material 3, wiring conductor 22 and the electric coupling area between the 1st surface electrode 151, the 2nd surface electrode 152 and the 3rd surface electrode 153 guarantee larger, and the space (gap) between via conductors 25 and piezoelectric element 11 can be guaranteed fully, therefore flexible base, board 2 more easily follows the distortion of piezoelectric element 11, more not easily hinders the distortion of piezoelectric element 11.Therefore, it is possible to efficiency makes piezoelectric element 11 vibrate better, improve the acoustic pressure of portable terminal, sound generator.
In addition, 1st surface electrode 151 of piezoelectric element 11, the 1st surface electrode 152 and the 3rd surface electrode 153 generate heat due to vibration, if so via conductors 25 is positioned at directly over the 1st surface electrode 151, the 1st surface electrode 152 and the 3rd surface electrode 153, then this thermal capacitance is easily transmitted to via conductors 25.Therefore, if carry out Continuous Drive, then due to the thermal expansion difference between via conductors 25 and basement membrane 21, via conductors 25 likely breaks, reliability decrease.Thus, by exposing the surface of piezoelectric body layer 13 in the region overlapping with via conductors 25 when top perspective at an interarea, thus not being vulnerable to the impact of the heating produced by Continuous Drive, suppressing the broken string of via conductors 25, improving reliability.
Due to the vibration of piezoelectric element 11, flexible base, board 2 also can be out of shape, therefore the via conductors 25 be electrically connected with the 1st surface electrode 151 likely contacts with the surface electrode (the 2nd surface electrode 152 and the 3rd surface electrode 153) of other sides, pole and is short-circuited, reliably eliminating this one side of this possibility, to have between the 1st surface electrode 151 and the 2nd surface electrode 152 and the 3rd surface electrode 153 and expose piezoelectric body layer 13, when the region of surface electrode is not set, directly over this region, or it is effective for configuring via conductors 25 directly over the 1st surface electrode 151.
In addition, as shown in Figure 7, preferably by extended for conductive bonding material 3 region of stretching out from piezoelectric element 11 to flexible base, board 2.By adopting this structure, utilize the conductive bonding material 3 stretched out, such as adopt methods such as forming meniscus (meniscus) and increase the bonding area between conductive bonding material 3 and piezoelectric element 11, the bonding area between conductive bonding material 3 and flexible base, board 2, thus improving the bond strength of flexible base, board 2 further.In addition, also have the wiring conductor 22 exposed is covered and the effect protected.
In addition, as shown in Figure 8, the side towards piezoelectric element 11 of via conductors 25 is preferably covered by coverlay 23.By adopting this structure, reliably preventing conductive bonding material 3 from entering through hole 24, the stress produced by the cure shrinkage of this conductive bonding material 3 etc. can not be produced, thus the broken string of via conductors 25 can be prevented.
Below, the manufacture method of the piezo-activator 1 of present embodiment is described.
First, the ceramic green sheet (green sheet) as piezoelectric body layer 13 is made.Specifically, the mixing of the calcined powder of piezoelectric ceramic, adhesive and plasticizer is made ceramic size, and above-mentioned adhesive is made up of organic polymers such as propylene class, butyral classes.Then, by using the band such as scraper (doctorblade) method, stack (calender roller) the method method of forming, thus this ceramic size is used to make ceramic green sheet.As piezoelectric ceramic, as long as have the material of piezoelectric property, such as, can use by lead titanate-zirconate (PbZrO
3-PbTiO
3) perofskite type oxide that forms.In addition, as plasticizer, dibutyl phthalate (DBP), dioctyl phthalate (DOP) etc. can be used.
Then, the conductive paste as internal electrode 12 is made.Specifically, by adhesive and plasticizer being carried out interpolation mixing in the metal dust of silver-palladium alloy, thus conductive paste is made.On above-mentioned ceramic green sheet, use silk screen print method, according to the pattern of internal electrode 12, this conductive paste is coated with.In addition, by the stacked polylith of ceramic green sheet being printed with this conductive paste, after carrying out de-glutinous process with the temperature of regulation, fire with the temperature of 900 ~ 1200 DEG C, face lapping mill etc. is used to implement milled processed to become the shape of regulation, thus making duplexer 14, this duplexer 14 possesses alternately laminated internal electrode 12 and piezoelectric body layer 13.
Duplexer 14 is not limited by the duplexer that above-mentioned manufacture method makes, as long as can make the duplexer 14 internal electrode 12 and piezoelectric body layer 13 laminated multi-layer obtained, can be made by any manufacture method.
Then, conductive paste is carried out printing drying according to the pattern of surface electrode 15 on the interarea and side of duplexer 14 by silk screen print method etc. after, baking process is carried out with the temperature of 650 ~ 750 DEG C, form surface electrode 15, above-mentioned conductive paste is in the material that obtains of the electroconductive particle of principal component and glass being mixed with silver, adds adhesive, plasticizer and solvent and the conductive paste of the argentiferous made and glass.
In addition, when surface electrode 15 and internal electrode 12 are electrically connected, both can form the passage running through piezoelectric body layer 13 and connect, also can form side electrode in the side of duplexer 14, can be made by any manufacture method.
Flexible base, board 2 such as be arranged with multiple basement membrane 21 sheet material (basement membrane with many in flakes material), on polyimide film, use adhesive to paste Copper Foil as wiring conductor 22 on the two sides of basement membrane 21.Then, the conductive pattern of wiring conductor 22 is formed by photoetching method.Now, also the end of the wiring conductor 22 of the engaging zones with piezoelectric element 11 can be set to the shape of comb teeth-shaped.
Then, in the region that flexible base, board 2 is overlapping with piezoelectric element 11, utilize Drilling operation to form the through hole of via conductors 25.Then, by utilizing plating copper facing simultaneously on wiring conductor 22 and through hole inwall, thus make via conductors 25, and via conductors 25 is engaged with wiring conductor 22.In order to carry out insulating and protect wiring conductor 22, Thermocurable adhesive is utilized to be pasted onto the two sides of basement membrane 21 polyimide film as coverlay 23.In addition, for the via conductors 25 that formed in the engaging zones of piezoelectric element 11, in order to cover, also can paste coverlay 23.
With on the engaging zones of piezoelectric element 11 and for carrying out that the wiring conductor 22 that is connected carries out nickel plating with the mainboard of portable terminal etc., gold-plated after, as required, utilize hot setting adhesive paste in the position of regulation as reinforcement plate 26, thickness is the polyimides sheet material (reinforcement plate with many in flakes material) of 150 μm, utilizing metal die pressure processing to get through shape into expecting, thus flexible base, board 2 can be made.
Then, as conductive bonding material 3, such as, use conductive adhesive, flexible base, board 2 is carried out being connected and fixed (joint) with duplexer 14.First, at the assigned position place of duplexer 14, use the method coating such as silk screen printing, some glue (dispense) to form conductivity and engage slurry.Now, in the position be separated with the position arranging via conductors 25 of flexible base, board 2, coating forms conductive bonding material 3.The shape of the conductive bonding material 3 be coated with is such as in engaging zones, be divided into be separated with via conductors 25 two, the shape etc. of the surrounding that surrounds via conductors 25, as long as make via conductors 25 all not contact when engaging with after engaging with conductive bonding material 3, it can be arbitrary shape.In addition, conductive adhesive also can be formed in the coating of flexible base, board 2 side.
Then, by making conductive adhesive slurry be cured under the state abutted with flexible base, board 2, thus flexible base, board 2 and piezoelectric element 11 are connected and fixed.
When the resin forming conductive adhesive is made up of thermoplastic resin, after the coating of the assigned position place of duplexer 14 or flexible base, board 2 defines conductive adhesive, under the state making duplexer 14 abut with flexible base, board 2 via conductive adhesive, carry out heating pressurize, thus make the softening flowing of thermoplastic resin, then normal temperature is reverted to, thus thermoplastic resin is solidified again, flexible base, board 2 and duplexer 14 are connected and fixed.Now, the compressing tablet carrying out heating pressurization is set to the shape of the through hole avoiding flexible base, board 2, directly heating pressurization is not carried out to via conductors 25.But it is possible to reliably carry out heating pressurization to the conductive bonding material 3 that coating is formed.
In addition, when using anisotropic conductive material as conductive bonding material, needing to control amount of pressurization, the conducting particles adjoined is not contacted.
In addition, in order to be formed conductive bonding material 3 from the extended structure to the region that flexible base, board 2 stretches out from piezoelectric element 11 of engaging zones 30, can after the assigned position place of duplexer 14 or flexible base, board 2 be coated with conductive bonding materials 3 such as forming anisotropic conductive material redundantly, duplexer 14 and flexible base, board 2 are crimped, thus conductive bonding material 3 is extended.Now, the thickness of coating is preferably set to more than 30 μm.
Particularly, extend in the mode of the side around to piezoelectric element 11 to make conductive bonding material 3, or extend in the mode of the side around to flexible base, board 2, or cover the wiring conductor 22 exposed from coverlay 23, can be coated with at these positions much more especially.
In addition, employing conductive bonding material 3 is extended on the bearing of trend of flexible base, board 2, or extend from the top of an end side of piezoelectric element 11 structure time, can be coated with at these positions equally much more especially.
As shown in Figure 9, the piezoelectric vibrating device of present embodiment has piezo-activator 1 and oscillating plate 81, this oscillating plate 81 with comprise in piezo-activator 1, another interarea of the duplexer 14 that forms piezoelectric element 11 engages.In addition, the flexible base, board 2 engaged with an interarea of the duplexer 14 forming piezoelectric element 11 omits in fig .9.
Oscillating plate 81 is such as the thin plate of rectangular shape.Oscillating plate 81 can suitably use the rigidity such as allyl resin, glass and the larger material of elasticity to be formed.In addition, the thickness of oscillating plate 81 is such as set as 0.4mm ~ 1.5mm.
Oscillating plate 81 is engaged by attachment 82 another interarea with the duplexer 14 forming piezoelectric element 11.By attachment 82, both whole of another interarea can be engaged with oscillating plate 81, also roughly whole face can be engaged.
Attachment 82 have membranaceous shape.In addition, attachment 82 are formed by more soft than oscillating plate 81, more yielding material, and compared with oscillating plate 81, the modulus of elasticity such as Young's modulus, rigidity modulus, bulk modulus, rigidity are less.That is, can being out of shape when attachment 82 make oscillating plate 81 vibrate in the driving by piezo-activator 1 (piezoelectric element 11), when being applied with identical power, being out of shape larger than oscillating plate 81.And, on an interarea (interarea of the side ,+z direction of figure) of attachment 82, the adhesion of globality ground has another interarea (interarea of the side ,-z direction of figure) of duplexer 14, on another interarea (interarea of the side ,-z direction of figure) of attachment 82, adhesion has an interarea (interarea of the side ,+z direction of figure) of oscillating plate 81.
By utilizing deformable attachment 82 duplexer 14 and oscillating plate 81 to be engaged, thus when delivering vibration from piezo-activator 1 (piezoelectric element 11), deformable attachment 82 are out of shape larger than oscillating plate 81.
Now, the vibration of deformable attachment 82 to the phase reversal reflected from oscillating plate 81 can be utilized to relax, piezo-activator 1 (piezoelectric element 11) thus can be made not transmit stronger vibration by the impact ground of ambient vibration to oscillating plate 81.
Wherein, attachment 82 are formed at least partially by utilizing viscoelastic body, thus the stronger vibration from piezo-activator 1 (piezoelectric element 11) can be transmitted to oscillating plate 81, on the other hand, can absorb the more weak vibration of reflecting from oscillating plate 81 by attachment 82, be preferred in this.Such as, the two sides that can be used in the base material be made up of nonwoven fabrics etc. is attached with in the two-sided tape of sticker, structure and comprises the attachment with flexible adhesive, as their thickness, such as, can use 10 μm ~ 2000 μm.
Attachment 82 both can be single parts, also can be the complexs be made up of some parts.As this attachment 82, the two sides that such as suitably can be used in the base material be made up of nonwoven fabrics etc. is attached with the two-sided tape of sticker, as the various elastic adhesives etc. with flexible adhesive.In addition, the thickness of attachment 82 more preferably greater than the amplitude of the flexural vibrations of piezo-activator 1 (piezoelectric element 11), if but blocked up, vibration decays, and is thus such as set as 0.1mm ~ 0.6mm.But, in piezoelectric vibrating device of the present invention, the material not circumscribed of attachment 82, attachment 82 also can by than oscillating plate 81 more firmly, more on-deformable material forms.In addition, in some cases, can also be the structure without attachment 82.
The piezoelectric vibrating device possessing this example of this structure plays a role as following piezoelectric vibrating device, that is, making piezo-activator 1 (piezoelectric element 11) flexural vibrations by applying the signal of telecommunication, making oscillating plate 81 vibrate thus.In addition, also can be supported by the circumference etc. of not illustrated support component to another end (end ,-y direction of figure) on the length direction of oscillating plate 81, oscillating plate 81.
In addition, the piezoelectric vibrating device of this example is bonded to oscillating plate 81 on another smooth interarea of piezoelectric element 11.Thereby, it is possible to formed duplexer 14 piezoelectric vibrating device with oscillating plate 81 firm engagement.
The piezoelectric vibrating device of this example uses high reliability and small-sized piezo-activator 1 is formed, therefore, it is possible to form high reliability and small-sized piezoelectric vibrating device.
As shown in Figure 10 ~ Figure 12, the portable terminal of present embodiment has piezo-activator 1, electronic circuit (not illustrating), display 91 and housing 92, and another interarea forming the duplexer 14 of piezoelectric element 11 engages with housing 92.In addition, Figure 10 is the approximate three-dimensional map schematically showing portable terminal of the present invention, and Figure 11 is that the A-A line place shown in Figure 10 is blocked and the general profile chart obtained, and Figure 12 is that the B-B line place shown in Figure 10 is blocked and the general profile chart obtained.The flexible base, board engaged with an interarea of duplexer 14 omits in Figure 11 and Figure 12.
At this, deformable attachment are preferably used to be engaged with housing 92 by duplexer 14.That is, in Figure 11 and Figure 12, attachment 82 are deformable attachment.
By utilizing deformable attachment 82 duplexer 14 and housing 92 to be engaged, thus when delivering vibration from piezo-activator 1 (piezoelectric element 11), deformable attachment 82 are out of shape larger than oscillating plate 92.
Now, the vibration of deformable attachment 82 to the phase reversal reflected from housing 92 can be utilized to relax, piezo-activator 1 (piezoelectric element 11) thus can be made not transmit stronger vibration by the impact ground of ambient vibration to housing 92.
Wherein, attachment 82 are formed at least partially by utilizing viscoelastic body, thus the stronger vibration from piezo-activator 1 (piezoelectric element 11) can be transmitted to housing 92, on the other hand, can absorb the more weak vibration of reflecting from housing 92 by attachment 82, be preferred in this.Such as, the two sides that can be used in the base material be made up of nonwoven fabrics etc. is attached with in the two-sided tape of sticker, structure and comprises the attachment with flexible adhesive, as their thickness, such as, can use 10 μm ~ 2000 μm.
Further, in this example, duplexer 14 is arranged on the panel as a part for housing 92, and a part for this housing 92 plays a role as oscillating plate 922, and this housing 92 is lids of display 91.
In addition, in this example, illustrate that duplexer 14 engages with housing 92, but duplexer 14 also can engage with display 91.
Housing 92 has: the housing body 921 of being carried out the box like of opening by a face; And inaccessible oscillating plate 922 is carried out to the opening of housing body 921.This housing 92 (housing body 921 and oscillating plate 922) can suitably use the material such as rigidity and the larger synthetic resin of modulus of elasticity to be formed.
The circumference of oscillating plate 922 can be arranged in housing body 921 quiveringly by grafting material 93.Grafting material 93 is formed by more soft than oscillating plate 922, more yielding material, and compared with oscillating plate 922, the modulus of elasticity such as Young's modulus, rigidity modulus, bulk modulus, rigidity are less.That is, grafting material 93 can be out of shape, and when being applied with identical power, is out of shape larger than oscillating plate 922.
Grafting material 93 both can be single parts, also can be the complex be made up of some parts.As this grafting material 93, the two sides that such as suitably can be used in the base material be made up of nonwoven fabrics etc. is attached with the two-sided tape etc. of sticker.The thickness of grafting material 93 is set due to blocked up and make vibration attenuation, such as, can not be set as 0.1mm ~ 0.6mm.But, in portable terminal of the present invention, the material not circumscribed of grafting material 93, grafting material 93 also can by than oscillating plate 922 more firmly, more on-deformable material forms.In addition, in some cases, can also be the structure without grafting material 93.
As electronic circuit (not illustrating), such as, can illustrate circuit, telecommunication circuit etc. that the image information that display 91 is shown, the voice messaging that transmitted by portable terminal are processed.Both can have at least one in these circuit, also can comprise whole circuit.In addition, can also be the circuit with other functions.In addition, also multiple electronic circuit can be had.In addition, electronic circuit and piezo-activator 1 utilize not illustrated connecting wiring to be connected.
Display 91 is display unit of the function with displays image information, the display that such as can suitably use liquid crystal display and OLED display etc. known.In addition, display 91 also can have the such input unit of touch panel.In addition, the lid (oscillating plate 922) of display 91 also can have the such input unit of touch panel.In addition, display 91 part that is overall, display 91 also can play a role as oscillating plate.
The portable terminal of this example uses high reliability and small-sized piezo-activator 1 is formed, therefore, it is possible to form high reliability and small-sized portable terminal.
In addition, the feature of the portable terminal of present embodiment is, makes display 91 or housing 92 produce vibration, and this vibration transmits acoustic information by the cartilage of ear or air transmitted.The portable terminal of this example can make oscillating plate (display 91 or housing 92) directly or contact with ear via other objects, transmits acoustic information by the cartilage transmitting vibrations to ear.That is, oscillating plate (display 91 or housing 92) can be made to contact with ear directly or indirectly, transmit acoustic information by the cartilage transmitting vibrations to ear.Such as, also clearly can transmit acoustic information, even if the portable terminal that hard of hearing person also can identify voice can be obtained time thus, noisy around.In addition, the object between oscillating plate (display 91 or housing 92) and ear both can be such as the lid of portable terminal, also can be head phone, earphone, as long as can the object of transmitting vibrations, can be any object.In addition, also can be by the sound produced from oscillating plate (display 91 or housing 92) is propagated in atmosphere, thus transmit the portable terminal of acoustic information.In addition, can also be the portable terminal being transmitted acoustic information by number of ways.
The portable terminal of this example uses high reliability and small-sized piezo-activator 1 is formed, therefore, it is possible to have high reliability and be midget plant, transmits high-quality acoustic information.
In addition, the sound generator 10 of present embodiment possesses as shown in figure 13: above-mentioned piezo-activator 1; Above-mentioned piezo-activator 1 is installed, the oscillating plate 20 vibrated together with piezo-activator 1 by the vibration of piezo-activator 1; And be arranged on the place at least partially of peripheral part of oscillating plate 20, as the framework 30 of the supporter supported oscillating plate 20.
Piezo-activator 1 is applying by accepting voltage and vibrates, thus to the exciter that oscillating plate 20 encourages.The interarea of piezo-activator 1 and the interarea of oscillating plate 20 utilize epoxylite etc. adhesive to engage, and by carrying out flexural vibrations by piezo-activator 1, thus can provide certain vibration by piezo-activator 1 pair of oscillating plate 20 and sound.
Its circumference is fixed in framework 30 by oscillating plate 20 under the state being subject to tension force, is vibrated together with piezo-activator 1 by the vibration of piezo-element actuator 1.This oscillating plate 20 can use the various material such as resin, metal to be formed, such as, thickness can be utilized to be that the resin molding such as polyethylene, polyimides, polypropylene of 10 ~ 200 μm forms oscillating plate 20.Resin molding is the material that modulus of elasticity and mechanical q-value are lower compared with metallic plate etc., therefore by utilizing resin molding to form oscillating plate 20, thus oscillating plate 20 flexural vibrations can be made with larger amplitude, make the width of the resonance peak in the frequency characteristic of acoustic pressure wider, highly lower, the difference between resonance peak and drop-out value (dip) can be reduced.
Framework 30 plays a role to the supporter that oscillating plate 20 supports as the circumference at oscillating plate 20, such as, the various material of metal, the resins etc. such as stainless steel can be used to be formed.This framework 30 both can be made up of a members of frame (upper ledge parts 301) as Suo Shi Figure 13 (b), also can be made up of two members of frame (upper ledge parts 301 and lower frame parts 302) as Suo Shi Figure 13 (c).In the case, by by two members of frame clamping vibration plates 20, thus the tension force of oscillating plate 20 can be made comparatively stable.In addition, upper ledge parts 301 and the respective thickness of lower frame parts 302 are such as set to 100 ~ 5000 μm.
In the sound generator 10 of this example, as shown in Figure 13 (b) and Figure 13 (c), preferably also there is resin bed 40, to arrange this resin bed 40 to the mode covered to (such as the periphery of piezo-activator 1) at least partially on oscillating plate 20 surface from piezo-activator 1.As resin bed 40, such as, propylene resin can be used.By burying piezo-activator 1 (piezoelectric element 11) in this resin bed 40 underground, thus the damper effect of appropriateness can be produced, thus can suppress covibration, the peak value in the frequency characteristic of acoustic pressure, drop-out value are suppressed less.In addition, as shown in Figure 13 (b) and Figure 13 (c), also resin bed 40 can be formed as the height identical with upper ledge parts 301.
The sound generator 10 of this example uses high reliability and small-sized piezo-activator 1 is formed, therefore, it is possible to form high reliability and small-sized sound generator.
Then, an example of the execution mode of sound generating apparatus of the present invention is described.
Sound generating apparatus 80 is the such sound-producing devices of so-called loud speaker, as shown in figure 14, such as, possesses sound generator 10 and holds the housing 70 of sound generator 10.Housing 70 makes the sound sent by sound generator 10 carry out sympathetic response in inside, and radiates this sound from the not illustrated outward opening portion being formed at housing 70.By having this housing 70, thus the acoustic pressure in such as low-frequency band can be improved.
This sound generating apparatus 80, except can being used alone as loud speaker, as described later, can also suitably be assembled in portable terminal, thin screen TV or flat terminal etc.In addition, can also to be assembled into as refrigerator, microwave oven, dust catcher, washing machine etc. current thinks little of in the household appliances of tonequality.
Sound generating apparatus 80 of the present invention uses high reliability and small-sized sound generator 10, therefore obtains high reliability and small-sized sound generating apparatus.
Then, use Figure 15 that the electronic equipment being equipped with sound generator is described.Figure 15 is the figure of the structure of the electronic equipment 50 represented involved by execution mode.In addition, the structural element needed in explanation is only shown in figure, omits the record about general structure key element.
As shown in figure 15, the electronic equipment 50 of this example possesses: sound generator 10, the electronic circuit 60 be connected with sound generator 10 and the housing 70 holding electronic circuit 60 and sound generator 10, have the function of sounding from sound generator 10.
Electronic equipment 50 possesses electronic circuit 60.Electronic circuit 60 is such as made up of controller 50a, receiving and transmitting part 50b, press key input section 50c and microphone input part 50d.Electronic circuit 60 is connected with sound generator 10, has the function exporting voice signal to sound generator 10.Sound generator 10 produces sound based on the voice signal inputted from electronic circuit 60.
In addition, electronic equipment 50 possesses display part 50e, antenna 50f and sound generator 10.In addition, electronic equipment 50 possesses the housing 70 held above-mentioned each equipment.In addition, in fig .15, illustrate the state accommodating whole each equipment such as controller 50a in a housing 70, but not the accommodation mode of each equipment is limited.In the present embodiment, be contained in a housing 70 to major general's electronic circuit 60 and sound generator 10.
Controller 50a is the control part of electronic equipment 50.Receiving and transmitting part 50b, based on the control of controller 50a, carries out the transmitting-receiving etc. of data by antenna 50f.Press key input section 50c is the input equipment of electronic equipment 50, accepts the key-input operation of operator.Microphone input part 50d is the input equipment of electronic equipment 50 equally, accepts the phonetic entry operation etc. of operator.Display part 50e is the display translation equipment of electronic equipment 50, and the output of display information is carried out in the control based on controller 50a.
Further, sound generator 10 carries out action as the audio output device in electronic equipment 50.In addition, sound generator 10 is connected with the controller 50a of electronic circuit 60, and the voltage accepting to be controlled by controller 50a applies and sounds.
In addition, in fig .15, suppose that electronic equipment 50 is that portable terminal installation is illustrated, but have nothing to do with the kind of electronic equipment 50, also go for the various civil equipment with vocal function.Such as, certainly may be used for thin screen TV, automobile audio apparatus etc., also may be used for the product with vocal function, the various products such as such as dust catcher, washing machine, refrigerator, microwave oven.
This electronic equipment 50 uses high reliability and small-sized piezo-activator 1 is formed, therefore, it is possible to form high reliability and small-sized electronic equipment.
As mentioned above, adopt the structure comprising sound generator 10, this sound generator 10 employs high reliability and small-sized piezo-activator 1, therefore, it is possible to have IMAGE, drives long-term and stably.In addition, by possessing housing 70, thus the acoustic pressure of low frequency can be improved.
[embodiment]
Then, the concrete example of piezo-activator of the present invention is described.
Make piezo-activator in the following manner.
Piezoelectric element is set to the strip of length 23.5mm, width 3.3mm, thickness 0.5mm.In addition, piezoelectric element has piezoelectric body layer and the alternately laminated structure obtained of internal electrode that thickness is 30 μm, and the sum of piezoelectric body layer is set to 16 layers.Piezoelectric body layer is formed by lead titanate-zirconate, and this lead titanate-zirconate Sb has replaced a part of Zr.Internal electrode employs the alloy of silver-colored palladium.
Stacked be printed with the ceramic green sheet of the conductive paste be made up of silver-colored palladium after, carry out pressurization contiguity, after carrying out degreasing with the temperature specified, fire with 1000 DEG C, obtain stacked sintered body.
Then, use the conductive paste be made up of silver, with surface electrode at the two ends of Width the mode print surface electrode than internal electrode long 1mm respectively, thus obtain surface electrode.
Via surface electrode, internally between electrode, (between the 1st electrode, between the 2nd electrode) applies electric field strength is the voltage of 2kV/mm, has carried out split pole to piezoelectric element.
In addition, flexible base, board has been made in the following manner.First, as be arranged with multiple basement membrane sheet material (basement membrane with many in flakes material), on polyimide film, use adhesive to paste Copper Foil as wiring conductor on the two sides of basement membrane.Then, the conductive pattern of wiring conductor is formed by photoetching method.The end of the wiring conductor of the engaging zones with piezoelectric element is set to the shape of comb teeth-shaped.In the region that flexible base, board is overlapping with piezoelectric element, Drilling operation is utilized to define the through hole of via conductors.Then, by utilizing plating copper facing simultaneously on wiring conductor and through hole inwall, thus make via conductors, and via conductors is engaged with wiring conductor.In order to carry out insulating and protect wiring conductor, Thermocurable adhesive is utilized to be pasted onto the two sides of basement membrane the polyimide film as coverlay.In addition, for the via conductors that formed in the engaging zones of piezoelectric element, in order to cover, also pasted coverlay.Then, with on the engaging zones of piezoelectric element and for carrying out that the wiring conductor portion that is connected carries out nickel plating with the mainboard of portable terminal etc., gold-plated after, utilize hot setting adhesive paste in the position of regulation as reinforcement plate, thickness is the polyimides sheet material (reinforcement plate with many in flakes material) of 150 μm, utilizing metal die pressure processing to get through shape into expecting, thus having made flexible base, board.
In order to be electrically connected with surface electrode by the wiring conductor of flexible base, board, employ the anisotropic conductive material comprising anisotropic conductive particles.Anisotropic conductive particles refers to, is about the conducting particles of 30 μm as particle diameter, and in the particle main body be made up of allyl resin, what implement plating Ni as base coating is coated with gold-plated particle.As the conductive paste of anisotropic conductive material, it is the slurry having disperseed this anisotropic conductive particles and obtain in synthetic rubber class adhesive, by utilize silk screen printing print on surface electrode after carry out drying, thus define anisotropic conductive material.In order to form anisotropic conductive material in the position be separated with the via conductors forming position of flexible base, board, printed patterns is set to the shape being divided into 2 in engaging zones.Under the state making via anisotropic conductive material flexible base, board abut with the engaging zones of piezoelectric element, making the softening flowing of anisotropic conductive material by carrying out heating pressurization, both being engaged, has made piezo-activator.In addition, utilize the compressing tablet being divided into 2 in the same manner as the anisotropic conductive material formed in piezoelectric element, heating pressurization is implemented from the reinforcement plate side of flexible base, board, can not to via conductors stress application, and heating pressurization is carried out to anisotropic conductive material entirety, make the piezo-activator of the embodiment of the present invention.
On the other hand, as a comparison case, use identical flexible base, board and piezoelectric element, the compressing tablet of anisotropic conductive material and heating pressurization is not divided into 2, with via conductors, anisotropic conductive material not being set discretely, having made the piezo-activator when engaging, via conductors being applied with to stress.
For these piezo-activators, the tearing strength of first having carried out each 20 flexible base, boards confirms.Confirm the intensity of the piezo-activator average out to 5N of comparative example, and the intensity of the piezo-activator average out to 10N of the embodiment of the present invention, be about 2 times of comparative example.
Then, implement and drive test, each piezo-activator is pasted onto on oscillating plate by this driving test, and applying virtual value with the frequency of 1kHz is the ± sine wave signal of 10Vrms.Confirm the vibration that displacement that two kinds of piezo-activators all produce oscillating plate is 4 μm.Then, carried out reliability test, this reliability test applied continuously virtual value and is in 168 hours ± noise signal of 10Vrms.After test, for the piezo-activator of comparative example, the value measured by the electrostatic capacitance of flexible base, board is 0nF, and for the piezo-activator of the embodiment of the present invention, confirms the electrostatic capacitance of 2,500nF.The inside analyzing the piezo-activator of comparative example finds, the via conductors of flexible base, board there occurs broken string, does not apply voltage.On the other hand, piezo-activator of the present invention does not find the broken string of via conductors.For the piezo-activator of comparative example, due to via conductors stress application, thus produce small crack in the conductor, by carrying out reliability test, via conductors can be estimated and break completely.
Can confirm that the piezo-activator of the application of the invention can improve the bond strength of flexible base, board and piezoelectric element, even and if when Continuous Drive the via conductors of flexible base, board also can not break, there is higher reliability.
Label declaration
1: piezo-activator
11: piezoelectric element
12: internal electrode
13: piezoelectric body layer
14: duplexer
15: surface electrode
2: flexible base, board
21: basement membrane
22: wiring conductor
23: coverlay
25: via conductors
26: reinforcement plate
3: conductive bonding material
31: conducting particles
32: resin binder
81: oscillating plate
82: attachment
91: display
92: housing
921: housing body
922: oscillating plate
93: grafting material
10: sound generator
20: oscillating plate
30: framework
301: upper ledge parts
302: lower frame parts
40: resin bed
50: electronic equipment
60: electronic circuit
70: housing
80: sound generating apparatus
Claims (20)
1. a piezo-activator, is characterized in that possessing:
Piezoelectric element, it has surface electrode internal electrode and piezoelectric body layer being carried out the stacked and duplexer of the tabular obtained and be electrically connected with described internal electrode on an interarea of this duplexer; Flexible base, board, it has the wiring conductor be electrically connected with described surface electrode; And conductive bonding material, described surface electrode and described wiring conductor are electrically connected by it,
Described flexible base, board has via conductors in the region overlapping with described piezoelectric element, when top perspective, the position be separated with this via conductors around described via conductors, is provided with the engaging zones of described flexible base, board based on described conductive bonding material and described piezoelectric element.
2. piezo-activator according to claim 1, is characterized in that:
Described engaging zones is provided with multiple.
3. piezo-activator according to claim 2, is characterized in that:
An interarea of described duplexer is rectangular shape, and described engaging zones is separated setting on the length direction of a described interarea.
4. piezo-activator according to claim 2, is characterized in that:
An interarea of described duplexer is rectangular shape, described surface electrode comprises the 1st surface electrode, the 2nd surface electrode and the 3rd surface electrode, described 2nd surface electrode and described 3rd surface electrode are separated from each other setting on the Width of a described interarea, described 1st surface electrode is separated setting with described 2nd surface electrode and described 3rd surface electrode on the length direction of a described interarea
Described engaging zones comprises the 1st engaging zones, the 2nd engaging zones and the 3rd engaging zones, described 1st engaging zones is arranged on described 1st surface electrode, described 2nd engaging zones is arranged on described 2nd surface electrode, and described 3rd engaging zones is arranged on described 3rd surface electrode.
5. piezo-activator according to claim 4, is characterized in that:
The wiring conductor of described flexible base, board comprise the 1st wiring conductor that is connected with described via conductors and with unconnected 2nd wiring conductor of described via conductors and the 3rd wiring conductor, described 1st surface electrode is connected with described 1st wiring conductor by described 1st engaging zones, described 2nd surface electrode is connected with described 2nd wiring conductor by described 2nd engaging zones, and described 3rd surface electrode is connected with described 3rd wiring conductor by described 3rd engaging zones.
6. piezo-activator according to claim 2, is characterized in that:
An interarea of described duplexer is rectangular shape, described surface electrode comprises the 1st surface electrode, the 2nd surface electrode and the 3rd surface electrode, described 2nd surface electrode and described 3rd surface electrode are separated from each other setting on the Width of a described interarea, described 1st surface electrode is separated setting with described 2nd surface electrode and described 3rd surface electrode on the length direction of a described interarea
Described engaging zones comprises the 1st engaging zones and the 2nd engaging zones, and described 1st engaging zones is arranged on described 1st surface electrode, and described 2nd engaging zones crosses over setting on described 2nd surface electrode and on described 3rd surface electrode.
7. piezo-activator according to claim 6, is characterized in that:
The wiring conductor of described flexible base, board comprises the 1st wiring conductor and 2nd wiring conductor unconnected with described via conductors that are connected with described via conductors, described 1st surface electrode is connected with described 1st wiring conductor by described 1st engaging zones, and described 2nd surface electrode and described 3rd surface electrode are connected with described 2nd wiring conductor by described 2nd engaging zones.
8. piezo-activator according to claim 2, is characterized in that:
An interarea of described duplexer is rectangular shape, and described engaging zones extends on the Width of a described interarea, when top perspective in banded.
9. piezo-activator according to claim 2, is characterized in that:
An interarea of described duplexer is rectangular shape, and multiple described engaging zones is separated with compartment of terrain spread configuration on the Width of a described interarea.
10. piezo-activator according to any one of claim 1 to 9, is characterized in that:
When top perspective, in the region overlapping with described via conductors of a described interarea, the surface of described piezoelectric body layer is exposed.
11. piezo-activators according to any one of claim 1 to 10, is characterized in that:
By described conductive bonding material from the extended region of stretching out from described piezoelectric element to described flexible base, board of described engaging zones.
12. piezo-activators according to any one of claim 1 to 11, is characterized in that:
The side towards described piezoelectric element of described via conductors is covered by coverlay.
13. piezo-activators according to any one of claim 1 to 12, is characterized in that:
Described conductive bonding material is anisotropic conductive material.
14. piezo-activators according to any one of claim 1 to 13, is characterized in that:
The end of the described wiring conductor engaged with described surface electrode is comb teeth-shaped.
15. 1 kinds of piezoelectric vibrating devices, is characterized in that having: the piezo-activator according to any one of claim 1 to 14 and the oscillating plate engaged with another interarea described in described duplexer.
16. 1 kinds of portable terminals, is characterized in that having: the piezo-activator according to any one of claim 1 to 14, electronic circuit, display and housing, and another interarea of described duplexer engages with described display or described housing.
17. 1 kinds of sound generators, is characterized in that having: the piezo-activator according to any one of claim 1 to 14; This piezo-activator is installed, the oscillating plate vibrated by the vibration of this piezo-activator; And be arranged on the framework of peripheral part of this oscillating plate.
18. sound generators according to claim 17, is characterized in that:
Described sound generator has resin bed, this resin bed be set to the surface covering described oscillating plate at least partially and described piezo-activator.
19. 1 kinds of sound generating apparatus, is characterized in that possessing: the sound generator described in claim 17 or 18 and hold the housing of this sound generator.
20. 1 kinds of electronic equipments, it is characterized in that possessing the sound generator described in claim 17 or 18, the electronic circuit be connected with this sound generator and the housing holding this electronic circuit and described sound generator, described electronic equipment has the function that sound is produced from described sound generator.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-036843 | 2014-02-27 | ||
| JP2014036843 | 2014-02-27 | ||
| PCT/JP2014/066558 WO2015129061A1 (en) | 2014-02-27 | 2014-06-23 | Piezoelectric actuator, and piezoelectric vibration device, portable terminal, acoustic generator, acoustic generation device, and electronic device provided therewith |
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| Publication Number | Publication Date |
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| CN105027581A true CN105027581A (en) | 2015-11-04 |
| CN105027581B CN105027581B (en) | 2018-01-05 |
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| CN201480010150.9A Active CN105027581B (en) | 2014-02-27 | 2014-06-23 | Piezo-activator and piezoelectric vibrating device, portable terminal, sound generator, sound generating apparatus, the electronic equipment for possessing it |
Country Status (2)
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| CN (1) | CN105027581B (en) |
| WO (1) | WO2015129061A1 (en) |
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| CN110139478A (en) * | 2019-04-02 | 2019-08-16 | 苏州诺莱声科技有限公司 | A kind of piezoelectric element that consistency is good and flexible circuit board connection method |
| CN111279498A (en) * | 2017-11-02 | 2020-06-12 | Tdk株式会社 | Vibration device |
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| GB201617171D0 (en) | 2016-10-10 | 2016-11-23 | Universitetet I Troms� - Norges Arktiske Universitet | Piezoelectric films |
| JP7234594B2 (en) * | 2018-11-16 | 2023-03-08 | Tdk株式会社 | Vibration device and electronic equipment |
| JP7259278B2 (en) * | 2018-11-16 | 2023-04-18 | Tdk株式会社 | Vibration device and electronic equipment |
| JP7429506B2 (en) * | 2019-08-29 | 2024-02-08 | 太陽誘電株式会社 | Vibration panels and electronic equipment |
| CN113140669A (en) * | 2020-01-19 | 2021-07-20 | 北京小米移动软件有限公司 | Piezoelectric assembly, manufacturing method, screen component and mobile terminal |
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Also Published As
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| WO2015129061A1 (en) | 2015-09-03 |
| CN105027581B (en) | 2018-01-05 |
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