CN105014236B - A kind of laser processing arbitrary shape glass-chip sweeps limit device - Google Patents
A kind of laser processing arbitrary shape glass-chip sweeps limit device Download PDFInfo
- Publication number
- CN105014236B CN105014236B CN201510292858.4A CN201510292858A CN105014236B CN 105014236 B CN105014236 B CN 105014236B CN 201510292858 A CN201510292858 A CN 201510292858A CN 105014236 B CN105014236 B CN 105014236B
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- China
- Prior art keywords
- shell
- chip
- glass
- arbitrary shape
- floating platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007667 floating Methods 0.000 claims abstract description 25
- 238000007599 discharging Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 238000010408 sweeping Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 8
- 230000033001 locomotion Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 238000004088 simulation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/3568—Modifying rugosity
- B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
A kind of laser processing arbitrary shape glass-chip sweeps limit device, and it relates to solar module manufacture field.The present invention solves that tradition utilizes laser to sweep the limit depth of parallelism during glass-chip is swept limit and cannot accurately control, cause the low precision sweeping limit, the problem affecting crudy.A kind of laser processing arbitrary shape glass-chip sweeps limit device, air floating platform is annular, vacuum cup arranges middle part in the enclosure, the lower end of vacuum cup is arranged on the upper surface of shell bottom face by rotatable support frame, the upper end of vacuum cup is passed by the centre bore of air floating platform, positioner is arranged on the top of air floating platform, two universal pushing hands are affixed with the upper end of the liftable support being arranged on shell right side wall, each length direction of universal pushing hands is vertically arranged with the length direction of liftable support, two universal pushing hands are symmetrical arranged about the center line of the length direction of shell.The present invention is used for processing glass-chip.
Description
Technical field
The present invention relates to a kind of laser and sweep limit device, be specifically related to a kind of laser processing arbitrary shape glass-chip and sweep limit dress
Put.
Background technology
Glass-chip, as the significant components of solar panel, needs the work carrying out sweeping limit before the use, and laser sweeps limit
The advantages such as, speed big with its energy is fast, become the important process of all thin-film solar cells processing.Conventional laser sweeps limit
Design is that laser instrument only point-blank moves, and glass-chip is positioned by positioning cylinder after entering board, laser level to
Lower movement and go out light and sweep minor face before glass, is then being clamped before glass-chip moves to by clip, and at this moment laser instrument is motionless,
But going out light and sweep long limit under glass, then glass-chip is fixed, and laser level moves up the rear minor face sweeping glass-chip,
Last laser instrument motionless go out light clamped glass-chip by clip again and return to sweep long limit on glass-chip in situ.Glass during whole
Glass chip is only positioned by positioning cylinder during minor face before sweeping, and does not the most position when sweeping other three limits, such glass-chip three limit
To sweep limit accuracy error big, affect crudy.
Summary of the invention
The present invention solves that tradition utilizes laser to sweep the limit depth of parallelism during glass-chip is swept limit and cannot accurately control,
Cause the low precision sweeping limit, the problem affecting crudy, and then propose a kind of laser processing arbitrary shape glass-chip
Sweep limit device.
The present invention solves that the problems referred to above adopt the technical scheme that: a kind of laser processing arbitrary shape glass-chip sweeps limit
Device, it includes shell, laser instrument, laser instrument track, air floating platform and at least pillar, and shell is rectangle box body,
Air floating platform arranges middle part in the enclosure by least pillar, and the left side wall of shell is provided with charging aperture, shell
Being provided with discharging opening on right side wall, charging aperture is oppositely arranged with discharging opening, and laser instrument is arranged in laser instrument track, Yi Zhongke
The laser of processing arbitrary shape glass-chip sweep limit device also include vacuum cup, rotatable support frame, positioner, two ten thousand
To pushing hands and two liftable supports, air floating platform is annular, and vacuum cup arranges middle part in the enclosure, vacuum cup
Lower end be arranged on the upper surface of shell bottom face by rotatable support frame, the upper end of vacuum cup is by the center of air floating platform
Hole passes, and positioner is arranged on the top of air floating platform, and laser instrument track is positioned close to the shell bottom face of discharging opening
On upper surface, and the length direction of laser instrument track is consistent with the width of shell arranges, and two liftable supports set respectively
Putting on the left side wall and right side wall of shell, two universal pushing hands are solid with the upper end of the liftable support being arranged on shell right side wall
Connecing, each length direction of universal pushing hands is vertically arranged with the length direction of liftable support, and two universal pushing hands are about shell
The center line of length direction be symmetrical arranged.
The invention has the beneficial effects as follows: the method have the advantages that
1, sweeping limit with traditional laser and can only process compared with the solar components of fixed dimension, the present invention uses the vacuum of uniqueness
The mode of the air floating platform combination of sucker and annular, can process the glass-chip of arbitrary shape.
2, the present invention uses specific universal pushing hands to promote glass-chip rotation fixing, the glass-chip to arbitrary shape
It is fixed and glass-chip will not be damaged.
3, the present invention uses unique benchmark fixed edge so that the precision sweeping limit is greatly improved, and sweeps limit precision and improves
30%～40%, control to sweep the depth of parallelism on limit by vacuum cup, it is ensured that sweep the depth of parallelism on limit.
4, present invention employs universal pushing hands, positioner and the vacuum cup of route-variable, so can basis in time
The size of glass-chip to be processed, is automatically adjusted respective position, it is achieved that processing difformity and the glass-chip of size
Purpose.
5, the present invention is by being accurately controlled the anglec of rotation and the machining accuracy of vacuum cup, and in good time is sweeping limit front simulation
The shape of assembly, safe and reliable.
6, the present invention uses liftable and rotatable vacuum cup so that processing has higher flexibility and variable
Property, the glass-chip of arbitrary shape can be swept limit.
Accompanying drawing explanation
Fig. 1 is the front view of the present invention, and Fig. 2 is the top view of Fig. 1.
Detailed description of the invention
Detailed description of the invention one: combining Fig. 1 and Fig. 2 and present embodiment is described, described in present embodiment, one can be processed arbitrarily
The laser of shape glass-chip sweeps limit device, and it includes shell 1, laser instrument 4, laser instrument track 5, air floating platform 6 and
At least pillar 7, shell 1 is rectangle box body, and air floating platform 6 is arranged in shell 1 by least pillar 7
Middle part, the left side wall of shell 1 is provided with charging aperture 2, the right side wall of shell 1 is provided with discharging opening 3, charging aperture
2 are oppositely arranged with discharging opening 3, and laser instrument 4 is arranged in laser instrument track 5, and one can process arbitrary shape glass-chip
Laser sweep limit device and also include that vacuum cup 8, rotatable support frame 9, positioner, two universal pushing hands 10 and two can
Lifting support 11, air floating platform 6 is annular, and vacuum cup 8 is arranged on the middle part in shell 1, vacuum cup 8
Lower end is arranged on the upper surface of shell 1 bottom face by rotatable support frame 9, and the upper end of vacuum cup 8 is by air floating platform 6
Centre bore pass, positioner is arranged on the top of air floating platform 6, and laser instrument track 5 is positioned close to discharging opening 3
Shell 1 bottom face upper surface on, and the length direction of laser instrument track 5 is consistent with the width of shell 1 arranges,
Two liftable supports 11 are separately positioned on left side wall and the right side wall of shell 1, two universal pushing hands 10 be arranged on outside
The upper end of the liftable support 11 of shell 1 right side wall is affixed, the length direction of each universal pushing hands 10 and liftable support 11
Length direction be vertically arranged, two universal pushing hands 10 are symmetrical arranged about the center line of the length direction of shell 1.
In present embodiment, universal pushing hands 10 can oscilaltion, and Telescopic rotary, thus realize glass-chip
Primary Location, the upper end of vacuum cup 8 holds glass-chip, and the lower end liftable of vacuum cup 8 moves up and down, vacuum
The lower end of sucker 8 is along with rotatable support frame 360 ° rotation so that glass-chip and then rotates, and finds angle accurately
After, the limit that the exit positions of laser instrument 4 is just to be processed to glass-chip, thus complete to sweep the work on limit.Air floating platform 6
It is set to annular, is suitable for the placement of difform glass-chip, owing to air floating platform 6 area of annular is big, and
And there is no corner angle, glass-chip will not be caused scuffing.In present embodiment, accurately calculated glass core by computer software
Sheet sweeps the position on limit, and drives vacuum cup 8 to be adjusted glass-chip, it is ensured that glass-chip sweeps the depth of parallelism on limit.
Detailed description of the invention two: combine Fig. 1 and Fig. 2 and present embodiment is described, positioner described in present embodiment includes folder
Sub-guide rail 14, at least one clip guide supporting post 15 and multiple clip 13, clip guide rail 14 is arranged on air floating platform 6
Top, on the uniform lower surface being arranged on clip guide rail 14 in upper end of at least one clip guide supporting post 15, at least one
On the uniform upper surface being arranged on shell 1 bottom face in lower end of individual clip guide supporting post 15, multiple clips 13 are removable to be set
Put in clip guide rail 14.It is arranged such, clip 13 Telescopic movable, the glass-chip of different angles is positioned,
Then it is clamped.Other compositions are identical with detailed description of the invention one with annexation.
Detailed description of the invention three: combine Fig. 2 and present embodiment is described, the quantity of the plurality of clip of present embodiment 13 is
Four.Being arranged such, glass-chip is quadrangle, and four limits of glass-chip are fixed by four clips 13 respectively,
Make the location of glass-chip more precisely firmly.Other compositions are identical with detailed description of the invention two with annexation.
Detailed description of the invention four: combine Fig. 2 and present embodiment is described, universal pushing hands 10 described in present embodiment includes stretching
Frame 10-1, sliding ball 10-2 and adjustment folder 10-3, expansion bracket 10-1 are connected by sliding ball 10-2 between folder 10-3 with adjusting,
Expansion bracket 10-1 is affixed with the upper end of the liftable support 11 being arranged on shell 1 right side wall.It is arranged such, sliding ball 10-2
360 ° of rotations can be carried out, thus control to adjust the rotational angle of folder 10-3, glass-chip is carried out preliminary rotation location.
Other compositions and annexation and detailed description of the invention one, two or three are identical.
Detailed description of the invention five: combining Fig. 1 and Fig. 2 and present embodiment is described, described in present embodiment, one can be processed arbitrarily
The laser of shape glass-chip is swept limit device and is also included position block 12, position block 12 be arranged on shell 1 left side wall
The upper end of liftable support 11 is affixed.It is arranged such, when glass-chip is after charging aperture 2 enters, and charging aperture 2 is closed,
Liftable support 11 rises, and promotes the position of regulation position block 12 so that position block 12 keeps off the position at charging aperture 2
Put, it is to avoid the scuffing of glass-chip or break.Other compositions are identical with detailed description of the invention four with annexation.
Operation principle
Operationally, the present invention is connected the present invention with computer, by the scanning imagery software in computer with sweep limit software and join
Close control rotatable support frame 9, in time sweeping the shape of limit front simulation glass-chip, glass-chip is entered by charging aperture 2
Entering in shell 1, after charging aperture 2 is closed, the liftable support 11 being positioned on shell 1 left side wall moves up and down, regulation
The position of position block 12 so that position block 12 blocks the position of charging aperture, it is to avoid the scuffing of glass-chip or wound,
Meanwhile, the liftable support 11 being positioned on shell 1 right side wall moves up and down, and regulates the height and position of universal pushing hands 10,
Expansion bracket 10-1 in universal pushing hands 10 is used for regulating the universal pushing hands 10 motion in X-direction, in universal pushing hands 10
Sliding ball 10-2 rotatable movement, drives the anglec of rotation adjusting folder 10-3, thus adjusts the position of glass-chip, and position is true
After Ding, the clip 12 of positioner positioning glass-chip, clip 13 can do X-axis side along clip guide rail 14
To motion, the scalable setting of clip 13 itself, the location of the convenient glass-chip adapting to diverse location and angle, glass
Chip is arranged on the top of air floating platform 6, air floating platform 6 blow afloat, and floats over aerial, will not scratch the following table of glass-chip
Face, at this moment, laser instrument 4 goes out light, and glass-chip is swept the work on limit, process glass-chip after, pass through
Vacuum cup 8 holds glass-chip, along with rotatable support frame 9 rotates, and the angle of regulation glass-chip so that glass-chip
Needing processed limit to be arranged on the top of laser instrument 4, laser instrument 4 can do the movement of fore-and-aft direction along laser instrument track 5,
Go out light and glass-chip is swept limit, each limit of glass-chip is repeated this operation, thus completes glass-chip four
The processing on individual limit, then by position block 12, glass-chip is released from the discharging opening 3 of shell 1, then a piece of glass under processing
Glass chip.
Universal pushing hands 10 in the present invention may also operate as the effect being drawn in by glass-chip in the shell 1 of device, sweeps limit complete
Cheng Hou, universal pushing hands 10 is by the shell 1 of glass-chip ejecting device, and then start next sheet glass chip sweeps limit work.
Claims (5)
1. the laser that can process arbitrary shape glass-chip sweeps a limit device, and it includes shell (1), laser instrument (4), swashs
Light device track (5), air floating platform (6) and at least pillar (7), shell (1) is rectangle box body, air floating platform
(6) be arranged on the middle part in shell (1) by least pillar (7), the left side wall of shell (1) is provided with into
Material mouth (2), the right side wall of shell (1) is provided with discharging opening (3), and charging aperture (2) is oppositely arranged with discharging opening (3),
In laser instrument (4) is arranged on laser instrument track (5), it is characterised in that: a kind of process swashing of arbitrary shape glass-chip
Light is swept limit device and is also included vacuum cup (8), rotatable support frame (9), positioner, two universal pushing hands (10) and two
Individual liftable support (11), air floating platform (6) is annular, and vacuum cup (8) is arranged on the middle part in shell (1),
The lower end of vacuum cup (8) is arranged on the upper surface of shell (1) bottom face by rotatable support frame (9), vacuum cup
(8) upper end is passed by the centre bore of air floating platform (6), and the top of positioner is arranged on the top of air floating platform (6),
Laser instrument track (5) is arranged on the upper surface of shell (1) bottom face, and the length direction of laser instrument track (5) is with outer
The width of shell (1) is unanimously arranged, and the left side wall of shell (1) and right side wall are each provided with a liftable support (11),
Two universal pushing hands (10) are affixed with the upper end of the liftable support (11) being arranged on shell (1) right side wall, each universal
The length direction of pushing hands (10) is vertically arranged with the length direction of liftable support (11), and two universal pushing hands (10) are closed
Center line in the length direction of shell (1) is symmetrical arranged.
A kind of laser processing arbitrary shape glass-chip the most according to claim 1 sweeps limit device, it is characterised in that:
Described positioner includes clip guide rail (14), at least one clip guide supporting post (15) and multiple clip (13), folder
Sub-guide rail (14) is arranged on the top of air floating platform (6), and the upper end of at least one clip guide supporting post (15) is all laid
Putting on the lower surface of clip guide rail (14), the lower end of at least one clip guide supporting post (15) is uniform is arranged on shell
(1), on the upper surface of bottom face, multiple clips (13) are removably set in clip guide rail (14).
A kind of laser processing arbitrary shape glass-chip the most according to claim 2 sweeps limit device, it is characterised in that:
The quantity of multiple clips (13) is four.
4. sweep limit device according to a kind of laser processing arbitrary shape glass-chip described in claim 1,2 or 3, its
It is characterised by: universal pushing hands (10) includes expansion bracket (10-1), sliding ball (10-2) and adjusts folder (10-3), expansion bracket (10-1)
Be connected by sliding ball (10-2) between folder (10-3) with adjusting, expansion bracket (10-1) be arranged on shell (1) right side wall
The upper end of liftable support (11) affixed.
A kind of laser processing arbitrary shape glass-chip the most according to claim 4 sweeps limit device, it is characterised in that:
Described a kind of laser processing arbitrary shape glass-chip is swept limit device and is also included position block (12), position block (12)
Affixed with the upper end of the liftable support (11) being arranged on shell (1) left side wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510292858.4A CN105014236B (en) | 2015-06-01 | 2015-06-01 | A kind of laser processing arbitrary shape glass-chip sweeps limit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510292858.4A CN105014236B (en) | 2015-06-01 | 2015-06-01 | A kind of laser processing arbitrary shape glass-chip sweeps limit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105014236A CN105014236A (en) | 2015-11-04 |
| CN105014236B true CN105014236B (en) | 2016-08-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510292858.4A Expired - Fee Related CN105014236B (en) | 2015-06-01 | 2015-06-01 | A kind of laser processing arbitrary shape glass-chip sweeps limit device |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105345275B (en) * | 2015-11-22 | 2017-07-07 | 苏州光韵达光电科技有限公司 | A kind of laser-processing system of light guide plate |
| CN109227966A (en) * | 2018-08-31 | 2019-01-18 | 惠州星航数控设备有限公司 | CNC automatic assembly line |
| CN108817714B (en) * | 2018-09-06 | 2023-07-28 | 重庆科技学院 | Biochip positioning fixture |
| CN109048074B (en) * | 2018-09-06 | 2023-06-06 | 重庆科技学院 | Rotary chip fixture with inclination angle |
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| CN201702514U (en) * | 2010-05-17 | 2011-01-12 | 苏州天弘激光股份有限公司 | Laser scribing machine used for CCD device assisted positioning type wafer processing |
| CN102049611A (en) * | 2009-10-30 | 2011-05-11 | 技鼎股份有限公司 | Laser processing device applied to fragile material and laser processing and displacement compensating method |
| JP2013219168A (en) * | 2012-04-09 | 2013-10-24 | Panasonic Corp | Laser machining device |
| CN204094319U (en) * | 2014-08-18 | 2015-01-14 | 深圳市韵腾激光科技有限公司 | Laser scribing means |
| CN204144234U (en) * | 2014-09-29 | 2015-02-04 | 四川汉能光伏有限公司 | To play a minor role for laser the bogey based on pallet of equipment |
-
2015
- 2015-06-01 CN CN201510292858.4A patent/CN105014236B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102049611A (en) * | 2009-10-30 | 2011-05-11 | 技鼎股份有限公司 | Laser processing device applied to fragile material and laser processing and displacement compensating method |
| CN201702514U (en) * | 2010-05-17 | 2011-01-12 | 苏州天弘激光股份有限公司 | Laser scribing machine used for CCD device assisted positioning type wafer processing |
| JP2013219168A (en) * | 2012-04-09 | 2013-10-24 | Panasonic Corp | Laser machining device |
| CN204094319U (en) * | 2014-08-18 | 2015-01-14 | 深圳市韵腾激光科技有限公司 | Laser scribing means |
| CN204144234U (en) * | 2014-09-29 | 2015-02-04 | 四川汉能光伏有限公司 | To play a minor role for laser the bogey based on pallet of equipment |
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| Publication number | Publication date |
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| CN105014236A (en) | 2015-11-04 |
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