CN105551981A - Diode glue applying device - Google Patents
Diode glue applying device Download PDFInfo
- Publication number
- CN105551981A CN105551981A CN201510915832.0A CN201510915832A CN105551981A CN 105551981 A CN105551981 A CN 105551981A CN 201510915832 A CN201510915832 A CN 201510915832A CN 105551981 A CN105551981 A CN 105551981A
- Authority
- CN
- China
- Prior art keywords
- base
- diode
- glue
- control unit
- slide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
- B05C3/02—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
- B05C3/09—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating separate articles
Abstract
The invention belongs to the diode manufacturing field and discloses a diode glue applying device. The diode glue applying device comprises a base, a control unit and a glue injection unit; the base is a rectangular box body; the control unit is located in the base; the front side of the base is provided with a control panel electrically connected with the control unit; an n-shaped supporting frame is fixed to the base; the upper end of the base is provided with a longitudinal sliding rail; the sliding rail is slidingly connected with a fixing seat; the sliding rail and the fixing seat are located below the supporting frame; the glue injection unit is slidingly connected with the top end of the supporting frame; the glue injection unit includes a sliding seat which can slide on the supporting frame; a vertically-mounted air cylinder is arranged in the sliding seat; the bottom end of the sliding seat is provided with a glue barrel and a hold clamp used for fixing the glue barrel; and the output end of the air cylinder is connected with the top end of the glue barrel. The operation of the device provided by the invention is simpler. With the device adopted, the labor intensity of workers can be reduced, glue applying efficiency can be improved, positioning and glue applying can be accurately performed on diodes arranged on the glue applying mold in a batched manner, and glue applying operation on the batched diodes can be completed fast.
Description
Technical field
The present invention relates to diode and manufacture field, be specifically related to a kind of diode sizer.
Background technology
Diode is in the middle of electronic component, a kind of device with two electrodes, only allows electric current to be flow through by single direction.The most general function of diode is exactly only allow an electric current by single direction by (being called forward bias voltage drop), blocks (being called reverse bias) time reverse.Therefore, diode can be thought of as the non-return valve of electronic edition.
In the production technology of existing axial diode, its technological process is: lead is to-cDNA microarray-chip filling-welding, and----------plastic packaging-----------examine outward--and pack Post RDBMS in plating by lettering test in baking in gluing in pickling.Wherein going up glue process refers to after pickling, and the die surfaces through hyperthermia drying moisture is coated with one deck silicon rubber makes tube core P-N junction and external environment keep apart, and to avoid surrounding impurities on the impact of device performance, can play protection tube core, stablize die surfaces.Diode gluing mode of the prior art is by diode arrangement in upper adhesive tape, by manually carrying out gluing one by one to diode, after gluing, diode being delivered to oven dry place and carrying out glue curing.Its defect is: gluing efficiency is low, can not carry out batch gluing to diode, and labor strength is large, easily produces the underproof diode of gluing.
Summary of the invention
The invention is intended to provide a kind of diode sizer, to facilitate, batch gluing is carried out to diode, improve gluing efficiency, reduce labour intensity.
For achieving the above object, basic technology scheme of the present invention is as follows: diode sizer, comprises base, control unit and glue injection units.Described base is rectangular box, and described control unit is positioned at the inside of base, and the front side of base is provided with the control board be electrically connected with control unit.Described base is fixed with the bracing frame of " door " shape, the upper end of base is provided with longitudinal slide rail, and slide rail slidably connects holder, and described slide rail and fixed seating are in the below of bracing frame.Described glue injection units is slidably connected at the top of bracing frame, described glue injection units comprises the slide that can slide on bracing frame, the inside of described slide is provided with the vertical cylinder installed, the bottom of slide is provided with packing element and presss from both sides for embracing of fixing packing element, and the output of described cylinder is connected with the top of packing element.
Principle and the advantage of this programme are: during operation, after arranging, are fixed on needing the diode of gluing on holder by graphite boat on graphite boat.Make holder drive graphite boat vertically moving by control board and control unit, make slide transverse shifting on bracing frame, by the position adjustment of vertical and horizontal, the glue discharging mouth of packing element is alignd with the gluing point of diode on graphite boat like this.Cylinder drives packing element in vertical movement, glue is dripped on the diode from the glue discharging mouth of packing element, completes the gluing of diode.Movement that is longitudinal, horizontal and vertical three directions can be realized by arranging slide rail, bracing frame and cylinder, feeding control is carried out by control unit, compared to traditional mode of production by manually carrying out gluing one by one to diode, operate simpler, reduce labor strength, improve gluing efficiency, more convenient to batch the diode be arranged on upper sealing rubber die accurately locate gluing, can complete fast and the gluing of batch diode is operated.
Preferred version one, based on scheme one improve, described holder is the aluminium sheet of rectangle.The holder light quality of aluminum, with low cost, there is alumina layer on surface, and glue is not easily bonded on holder, easy cleaning.
Preferred version two, preferably the one of is improved, and one-body molded on holder have four reference columns, and described four reference columns are in the rectangular distribution in the upper end of holder.Be arranged through reference column like this to position upper sealing rubber die, on when avoiding holder to move on slide rail, sealing rubber die generation skew causes to carry out accurate gluing to diode.
Preferred version three, preferably two one improve, the sidewall of support frame as described above upper end is provided with illuminating lamp, described illuminating lamp by connection by metal hose on bracing frame.Arrange illuminating lamp conveniently to observe in time diode gluing situation, metal hose enables illuminating lamp throw light on from each angle, and making does not have dead angle during observation, makes monitoring in time more comprehensive.
Accompanying drawing explanation
Fig. 1 is the structural representation of the embodiment of the present invention.
Embodiment
Below by embodiment, the present invention is further detailed explanation:
Reference numeral in Figure of description comprises: base 1, bracing frame 2, slide rail 3, slide 4, packing element 5, reference column 6, electricity-saving lamp 7, control board 8, holder 9.
Embodiment is substantially as shown in Figure 1: diode sizer, comprises base 1, control unit and glue injection units.Described base 1 is rectangular box, and described control unit is positioned at the inside of base 1, and the front side of base 1 is provided with the control board 8 be electrically connected with control unit.Described base 1 is fixed with the bracing frame 2 of " door " shape, the upper end of base 1 is provided with longitudinal slide rail 3, slide rail 3 slidably connects holder 9, and described slide rail 3 and holder 9 are positioned at the below of bracing frame 2.Described holder 9 is the aluminium sheet of rectangle, and one-body molded on holder 9 have four reference columns 6, the described rectangular upper end being distributed in holder 9 of four reference columns 6.Described glue injection units is slidably connected at the top of bracing frame 2, described glue injection units comprises the slide 4 that can slide on bracing frame 2, the inside of described slide 4 is provided with the vertical cylinder installed, the bottom of slide 4 is provided with packing element 5 and presss from both sides for embracing of fixing packing element 5, and the output of described cylinder is connected with the top of packing element 5.The top of slide 4 is provided with the flat cable be connected with bracing frame 2 top, and the sidewall of support frame as described above 2 upper end is provided with electricity-saving lamp 7, described electricity-saving lamp 7 by connection by metal hose on bracing frame 2.
In the present embodiment, during operation, after arranging needing the diode of gluing on graphite boat, graphite boat is fixed on holder 9.Make holder 9 drive graphite boat vertically moving by control board 8 and control unit, make slide 4 transverse shifting on bracing frame 2, by the position adjustment of vertical and horizontal, the glue discharging mouth of packing element 5 is alignd with the gluing point of diode on graphite boat like this.Cylinder drives packing element 5 in vertical movement, glue is dripped on the diode from the glue discharging mouth of packing element 5, completes the gluing of diode.Holder 9 light quality of aluminum, with low cost, there is alumina layer on surface, and glue is not easily bonded on holder 9, easy cleaning.Positioned upper sealing rubber die by reference column 6, on when avoiding holder 9 to move on slide rail 3, sealing rubber die generation skew causes to carry out accurate gluing to diode.Arrange electricity-saving lamp 7 conveniently to observe in time diode gluing situation, metal hose makes electricity-saving lamp 7 can throw light on from each angle, makes do not have dead angle during observation, makes monitoring in time more comprehensive.Movement that is longitudinal, horizontal and vertical three directions can be realized by arranging slide rail 3, bracing frame 2 and cylinder, feeding control is carried out by control unit, compared to traditional mode of production by manually carrying out gluing one by one to diode, operate simpler, reduce labor strength, improve gluing efficiency, more convenient to batch the diode be arranged on upper sealing rubber die accurately locate gluing, can complete fast and the gluing of batch diode is operated.
Above-described is only embodiments of the invention, and in scheme, the general knowledge such as known concrete structure and/or characteristic does not do too much description at this.Should be understood that; for a person skilled in the art, under the prerequisite not departing from structure of the present invention, some distortion and improvement can also be made; these also should be considered as protection scope of the present invention, and these all can not affect effect of the invention process and practical applicability.The protection range that this application claims should be as the criterion with the content of its claim, and the embodiment in specification etc. record the content that may be used for explaining claim.
Claims (4)
1. diode sizer, comprises base, control unit and glue injection units; It is characterized in that, described base is rectangular box, and described control unit is positioned at the inside of base, and the front side of base is provided with the control board be electrically connected with control unit; Described base is fixed with the bracing frame of " door " shape, the upper end of base is provided with longitudinal slide rail, and slide rail slidably connects holder, and described slide rail and fixed seating are in the below of bracing frame; Described glue injection units is slidably connected at the top of bracing frame, described glue injection units comprises the slide that can slide on bracing frame, the inside of described slide is provided with the vertical cylinder installed, the bottom of slide is provided with packing element and presss from both sides for embracing of fixing packing element, and the output of described cylinder is connected with the top of packing element.
2. diode sizer according to claim 1, is characterized in that: described holder is the aluminium sheet of rectangle.
3. diode sizer according to claim 2, is characterized in that: one-body molded on holder have four reference columns, and described four reference columns are in the rectangular distribution in the upper end of holder.
4. diode sizer according to claim 3, is characterized in that: the sidewall of support frame as described above upper end is provided with illuminating lamp, described illuminating lamp by connection by metal hose on bracing frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510915832.0A CN105551981B (en) | 2015-12-10 | 2015-12-10 | A kind of diode sizer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510915832.0A CN105551981B (en) | 2015-12-10 | 2015-12-10 | A kind of diode sizer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105551981A true CN105551981A (en) | 2016-05-04 |
| CN105551981B CN105551981B (en) | 2018-02-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510915832.0A Active CN105551981B (en) | 2015-12-10 | 2015-12-10 | A kind of diode sizer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105551981B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105810617A (en) * | 2016-05-12 | 2016-07-27 | 常州市武进恒辉通信设备有限公司 | Sizing die used in diode manufacturing |
| CN106391404A (en) * | 2016-11-17 | 2017-02-15 | 无锡市伟丰印刷机械厂 | High-reliability gluing device used for temperature controller machining |
| CN106670054A (en) * | 2016-12-30 | 2017-05-17 | 平湖市科苑技术服务有限公司 | Finger-pressed type waterproof glue spray film device |
| CN109018547A (en) * | 2018-07-18 | 2018-12-18 | 广州市凯安消防科技有限公司 | A kind of canister automation glue injection equipment of fire-fighting life-saving head-shield |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201143480Y (en) * | 2007-09-17 | 2008-11-05 | 黄清文 | Three-dimensional automatic glue dropping machine |
| CN203061350U (en) * | 2012-12-20 | 2013-07-17 | 广州铁路职业技术学院 | Automatic gluing system stable in gluing |
| CN203917073U (en) * | 2014-05-28 | 2014-11-05 | 深圳华海达科技有限公司 | A kind of vision positioning dispensing mechanism |
| CN204052031U (en) * | 2014-07-02 | 2014-12-31 | 昆山希盟自动化科技有限公司 | A kind of three axle robert location CCD point gum machine |
| CN204148087U (en) * | 2014-09-03 | 2015-02-11 | 昆山卓勋精密机械模具有限公司 | Accurate four axle full-automatic glue-dropping machines |
| CN204583606U (en) * | 2015-04-27 | 2015-08-26 | 深圳市合赢智拓光电技术有限公司 | A kind of LCDs circuit board processing point gum machine |
| CN204583599U (en) * | 2015-01-06 | 2015-08-26 | 谢俊 | A kind of double four axle point gum machine |
| CN205335227U (en) * | 2015-12-10 | 2016-06-22 | 重庆凯西驿电子科技有限公司 | Diode rubberizing device |
-
2015
- 2015-12-10 CN CN201510915832.0A patent/CN105551981B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201143480Y (en) * | 2007-09-17 | 2008-11-05 | 黄清文 | Three-dimensional automatic glue dropping machine |
| CN203061350U (en) * | 2012-12-20 | 2013-07-17 | 广州铁路职业技术学院 | Automatic gluing system stable in gluing |
| CN203917073U (en) * | 2014-05-28 | 2014-11-05 | 深圳华海达科技有限公司 | A kind of vision positioning dispensing mechanism |
| CN204052031U (en) * | 2014-07-02 | 2014-12-31 | 昆山希盟自动化科技有限公司 | A kind of three axle robert location CCD point gum machine |
| CN204148087U (en) * | 2014-09-03 | 2015-02-11 | 昆山卓勋精密机械模具有限公司 | Accurate four axle full-automatic glue-dropping machines |
| CN204583599U (en) * | 2015-01-06 | 2015-08-26 | 谢俊 | A kind of double four axle point gum machine |
| CN204583606U (en) * | 2015-04-27 | 2015-08-26 | 深圳市合赢智拓光电技术有限公司 | A kind of LCDs circuit board processing point gum machine |
| CN205335227U (en) * | 2015-12-10 | 2016-06-22 | 重庆凯西驿电子科技有限公司 | Diode rubberizing device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105810617A (en) * | 2016-05-12 | 2016-07-27 | 常州市武进恒辉通信设备有限公司 | Sizing die used in diode manufacturing |
| CN106391404A (en) * | 2016-11-17 | 2017-02-15 | 无锡市伟丰印刷机械厂 | High-reliability gluing device used for temperature controller machining |
| CN106670054A (en) * | 2016-12-30 | 2017-05-17 | 平湖市科苑技术服务有限公司 | Finger-pressed type waterproof glue spray film device |
| CN109018547A (en) * | 2018-07-18 | 2018-12-18 | 广州市凯安消防科技有限公司 | A kind of canister automation glue injection equipment of fire-fighting life-saving head-shield |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105551981B (en) | 2018-02-13 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181221 Address after: 225744 No. 251, Xizhang Five Groups, Samsung Village, Yongfeng Town, Xinghua City, Jiangsu Province Patentee after: Lei Kai Address before: 401147 Building 23-3, No. 228 Honghuang Road, Longxi Street, Yubei District, Chongqing Patentee before: CHONGQING KAIXIYI ELECTRONIC TECHNOLOGY CO., LTD. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200619 Address after: 225700 Yubao Road, Chenbao Town, Xinghua City, Taizhou City, Jiangsu Province Patentee after: Xinghua Huasheng Electronic Co., Ltd Address before: 225744 No. 251, Xizhang Five Groups, Samsung Village, Yongfeng Town, Xinghua City, Jiangsu Province Patentee before: Lei Kai |
|
| TR01 | Transfer of patent right |