CN104985709A - 调整单晶棒晶向的方法及测量方法 - Google Patents
调整单晶棒晶向的方法及测量方法 Download PDFInfo
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- CN104985709A CN104985709A CN201510330222.4A CN201510330222A CN104985709A CN 104985709 A CN104985709 A CN 104985709A CN 201510330222 A CN201510330222 A CN 201510330222A CN 104985709 A CN104985709 A CN 104985709A
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- crystal orientation
- monocrystal rod
- monocrystalline
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- crystal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
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Priority Applications (1)
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CN201510330222.4A CN104985709B (zh) | 2015-06-16 | 2015-06-16 | 调整单晶棒晶向的方法及测量方法 |
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CN201510330222.4A CN104985709B (zh) | 2015-06-16 | 2015-06-16 | 调整单晶棒晶向的方法及测量方法 |
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Publication Number | Publication Date |
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CN104985709A true CN104985709A (zh) | 2015-10-21 |
CN104985709B CN104985709B (zh) | 2017-01-11 |
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CN201510330222.4A Active CN104985709B (zh) | 2015-06-16 | 2015-06-16 | 调整单晶棒晶向的方法及测量方法 |
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CN (1) | CN104985709B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108312370A (zh) * | 2017-12-20 | 2018-07-24 | 天通控股股份有限公司 | 一种基于水平传感器定位晶体的定向加工方法 |
CN109203266A (zh) * | 2018-10-31 | 2019-01-15 | 福建北电新材料科技有限公司 | 一种碳化硅晶体快速定向方法 |
CN111251483A (zh) * | 2020-03-12 | 2020-06-09 | 常州时创能源股份有限公司 | 硅棒的切割方法 |
CN113787636A (zh) * | 2021-07-09 | 2021-12-14 | 麦斯克电子材料股份有限公司 | 一种用于12寸半导体晶圆的手动粘棒方法 |
CN114952458A (zh) * | 2022-05-19 | 2022-08-30 | 宁夏中晶半导体材料有限公司 | 一种调整晶棒正晶向滚磨加工的装置和方法 |
Citations (10)
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US5839424A (en) * | 1996-04-16 | 1998-11-24 | Hct Shaping System Sa | Process for the orientation of several single crystals disposed side by side on a cutting support for their simultaneous cutting in a cutting machine and device for practicing this process |
JP2001246617A (ja) * | 2000-03-07 | 2001-09-11 | Canon Inc | 結晶の切断方法およびその装置 |
CN1439495A (zh) * | 2003-04-02 | 2003-09-03 | 南开大学 | 准确定向切割晶体的方法 |
CN1529647A (zh) * | 2001-06-13 | 2004-09-15 | 用于确定晶面相对于晶体表面定向的设备和方法以及用于在切割机内切割单晶体的设备和方法 | |
JP2004262179A (ja) * | 2003-03-04 | 2004-09-24 | Sumitomo Electric Ind Ltd | ワイヤソー切断方法とそのための設備 |
CN201257719Y (zh) * | 2008-07-30 | 2009-06-17 | 常州松晶电子有限公司 | X射线定向仪粘胶机 |
CN102152410A (zh) * | 2010-12-23 | 2011-08-17 | 万向硅峰电子股份有限公司 | 一种旋转单晶棒调整晶向偏移的切割方法 |
CN102490279A (zh) * | 2011-11-30 | 2012-06-13 | 东方电气集团峨嵋半导体材料有限公司 | 线切割晶体x射线衍射定向切割方法 |
CN103171059A (zh) * | 2013-03-07 | 2013-06-26 | 贵阳嘉瑜光电科技咨询中心 | 一种用于蓝宝石加工晶向实时测量的夹具及其测量方法 |
CN103592322A (zh) * | 2013-12-02 | 2014-02-19 | 长春理工大学 | 单晶晶面偏角及偏向测算方法 |
-
2015
- 2015-06-16 CN CN201510330222.4A patent/CN104985709B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5839424A (en) * | 1996-04-16 | 1998-11-24 | Hct Shaping System Sa | Process for the orientation of several single crystals disposed side by side on a cutting support for their simultaneous cutting in a cutting machine and device for practicing this process |
JP2001246617A (ja) * | 2000-03-07 | 2001-09-11 | Canon Inc | 結晶の切断方法およびその装置 |
CN1529647A (zh) * | 2001-06-13 | 2004-09-15 | 用于确定晶面相对于晶体表面定向的设备和方法以及用于在切割机内切割单晶体的设备和方法 | |
JP2004262179A (ja) * | 2003-03-04 | 2004-09-24 | Sumitomo Electric Ind Ltd | ワイヤソー切断方法とそのための設備 |
CN1439495A (zh) * | 2003-04-02 | 2003-09-03 | 南开大学 | 准确定向切割晶体的方法 |
CN201257719Y (zh) * | 2008-07-30 | 2009-06-17 | 常州松晶电子有限公司 | X射线定向仪粘胶机 |
CN102152410A (zh) * | 2010-12-23 | 2011-08-17 | 万向硅峰电子股份有限公司 | 一种旋转单晶棒调整晶向偏移的切割方法 |
CN102490279A (zh) * | 2011-11-30 | 2012-06-13 | 东方电气集团峨嵋半导体材料有限公司 | 线切割晶体x射线衍射定向切割方法 |
CN103171059A (zh) * | 2013-03-07 | 2013-06-26 | 贵阳嘉瑜光电科技咨询中心 | 一种用于蓝宝石加工晶向实时测量的夹具及其测量方法 |
CN103592322A (zh) * | 2013-12-02 | 2014-02-19 | 长春理工大学 | 单晶晶面偏角及偏向测算方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108312370A (zh) * | 2017-12-20 | 2018-07-24 | 天通控股股份有限公司 | 一种基于水平传感器定位晶体的定向加工方法 |
CN109203266A (zh) * | 2018-10-31 | 2019-01-15 | 福建北电新材料科技有限公司 | 一种碳化硅晶体快速定向方法 |
CN111251483A (zh) * | 2020-03-12 | 2020-06-09 | 常州时创能源股份有限公司 | 硅棒的切割方法 |
CN113787636A (zh) * | 2021-07-09 | 2021-12-14 | 麦斯克电子材料股份有限公司 | 一种用于12寸半导体晶圆的手动粘棒方法 |
CN113787636B (zh) * | 2021-07-09 | 2022-05-27 | 麦斯克电子材料股份有限公司 | 一种用于12寸半导体晶圆的手动粘棒方法 |
CN114952458A (zh) * | 2022-05-19 | 2022-08-30 | 宁夏中晶半导体材料有限公司 | 一种调整晶棒正晶向滚磨加工的装置和方法 |
CN114952458B (zh) * | 2022-05-19 | 2024-04-26 | 宁夏中晶半导体材料有限公司 | 一种调整晶棒正晶向滚磨加工的装置和方法 |
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CN104985709B (zh) | 2017-01-11 |
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Address after: 310052 No. 99 Xincheng Road, Ningbo, Zhejiang, Binjiang District Applicant after: ZHEJIANG HAINA SEMICONDUCTOR Co.,Ltd. Address before: 310052 No. 99 Xincheng Road, Ningbo, Zhejiang, Binjiang District Applicant before: Hangzhou Haina Semiconductor Co.,Ltd. |
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Address after: 324300 Wanyuan Road 5, Hua Bu Town, Kaihua County, Quzhou, Zhejiang Patentee after: Zhejiang Haina Semiconductor Co.,Ltd. Address before: No. 99, Xincheng Road, Binjiang District, Ningbo City, Zhejiang Province, 310052 Patentee before: ZHEJIANG HAINA SEMICONDUCTOR Co.,Ltd. |
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