CN104985708A - Cutting device special for high voltage silicon stack - Google Patents
Cutting device special for high voltage silicon stack Download PDFInfo
- Publication number
- CN104985708A CN104985708A CN201510281196.0A CN201510281196A CN104985708A CN 104985708 A CN104985708 A CN 104985708A CN 201510281196 A CN201510281196 A CN 201510281196A CN 104985708 A CN104985708 A CN 104985708A
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- China
- Prior art keywords
- frock
- tool
- high voltage
- screw hole
- voltage silicon
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Silicon Compounds (AREA)
Abstract
The invention provides a cutting device special for a high voltage silicon stack, and relates to the technical field of cutting devices for a high voltage silicon stack. The cutting device is composed of a first tool, a second tool, positioning pins, a block, a buffer plate, a carrier plate and a protective plate. The upper surface of the second tool is provided with a positioning pin and the first tool, the second tool is provided with two positioning pins, the middle portion of the first tool is provided with an anti-fall threaded hole, and the periphery of the anti-fall threaded hole is provided with fastening threaded holes. The first tool is inserted into the anti-fall threaded hole and the fastening threaded holes through threads to connect the first tool and the second tool. One side of the first tool is provided with the block, the block is arranged between two positioning pins on the second tool, the upper surface of the first tool is provided with the buffer plate, the buffer plate is provided with the carrier plate, and the carrier plate is provided with the protective plate. The cutting device special for the high voltage silicon stack is good in practicality, high in cutting precision and very high in yield, so the silicon material can be greatly saved, the work efficiency can be greatly raised, and development of an enterprise can be promoted.
Description
[technical field]
The present invention relates to high voltage silicon rectifier stack splitting equipment technical field, especially relate to a kind of special segmenting device of high voltage silicon rectifier stack.
[background technology]
Known, existing high voltage silicon rectifier stack segmentation has following several method:
The first, mechanical scribing segmentation, this is more original silicon chip dividing method, maximum fractionation thickness 1.2mm, when splitting single silicon chip, effect can manage it, but yield rate is about 85%, just not too easily split for thicker high voltage silicon rectifier stack disk, the silicon stack split exactly, edge is very irregular, easily collides with out and collapses limit, and affecting follow-up encapsulation, yield rate also only has 65-70%; The second, cylindrical blade cuts, although the thickness of cutting can reach 2cm, efficiency comparison is low, and cutter seam loss (2-3mm) is larger, every sheet circular high voltage silicon stack effectively utilizes area to decrease about 30%, and yield rate omits height than scribing machine can reach about 85%; Three, laser cutting, efficiency increases, but P or the N face of high temperature to the two ends at high voltage silicon rectifier stack edge of laser easily causes sintering hole in cutting process, and to the metal level in silicon stack sintering process cause fusing and silicon stack edge formed short circuit, make silicon stack withstand voltage not or punctured by electric leakage, therefore have impact on the production of enterprise greatly.
[summary of the invention]
In order to overcome the deficiency in background technology; the invention discloses a kind of special segmenting device of high voltage silicon rectifier stack; the present invention by arranging alignment pin and the first frock in the second frock; first frock arranges block, buffer board, carrier board and baffle; again by being fixed between baffle and carrier board by silicon stack disk, reach the object of high efficiency cutting silicon stack disk with this.
In order to realize described goal of the invention, the present invention adopts following technical scheme:
A kind of special segmenting device of high voltage silicon rectifier stack, comprise the first frock, second frock, alignment pin, block, buffer board, carrier board and baffle, second frock upper side is provided with alignment pin and the first frock, second frock is provided with two alignment pins, the middle part of described first frock is provided with prevents falling screw hole, anti-surrounding of falling screw hole is provided with holding screw hole, first frock is inserted by screw and is prevented that falling screw hole makes the first frock be connected with the second frock with holding screw hole, the side of the first frock is provided with block, block is placed between two alignment pins of the second frock, the upper side of the first frock is provided with buffer board, buffer board is provided with carrier board, carrier board is provided with baffle.
Described buffer board is that resin material is made.
Described first frock is cylindrical structure, prevents falling the central part that screw hole is arranged on cylinder, along preventing that falling screw hole surrounding is equidistantly provided with at least three holding screw holes.
Described alignment pin is cylindrical structure, and alignment pin is arranged on the lateral surface of the first frock, and alignment pin and the second frock are connected to a fixed.
Owing to have employed technique scheme, the present invention has following beneficial effect:
The special segmenting device of a kind of high voltage silicon rectifier stack of the present invention, comprise the first frock, the second frock, alignment pin, block, buffer board, carrier board and baffle, by arranging alignment pin and the first frock in the second frock, first frock arranges block, buffer board, carrier board and baffle, again by being fixed between baffle and carrier board by silicon stack disk, reach the object of high efficiency cutting silicon stack disk with this; The present invention is practical, and segmentation precision is high, has not only significantly saved silicon material, and yield rate height very, therefore greatly improves operating efficiency, facilitates the development of enterprise.
[accompanying drawing explanation]
Fig. 1 is perspective view of the present invention;
In figure: 1, baffle; 2, silicon stack disk; 3, carrier board; 4, buffer board; 5, the first frock; 6, the second frock; 7, alignment pin; 8, prevent falling screw hole; 9, holding screw hole; 10, block.
[detailed description of the invention]
By explanation the present invention that the following examples can be detailed, disclose object of the present invention and be intended to protect all technological improvements in the scope of the invention.
A kind of silicon rod crystal orientation adjusting device by reference to the accompanying drawings described in 1, comprise the first frock 5, second frock 6, alignment pin 7, block 10, buffer board 4, carrier board 3 and baffle 1, second frock 6 upper side is provided with alignment pin 7 and the first frock 5, second frock 6 is provided with two alignment pins 7, the middle part of described first frock 5 is provided with prevents falling screw hole 8, anti-surrounding of falling screw hole 8 is provided with holding screw hole 9, first frock 5 is inserted by screw and is prevented that falling screw hole 8 makes the first frock 5 be connected with the second frock 6 with holding screw hole 9, the side of the first frock 5 is provided with block 10, block 10 is placed between two alignment pins 7 of the second frock 6, the upper side of the first frock 5 is provided with buffer board 4, buffer board 4 is provided with carrier board 3, carrier board 3 is provided with baffle 1, described buffer board 4 is made for resin material, described first frock 5 is cylindrical structure, prevents falling the central part that screw hole 8 is arranged on cylinder, along preventing that falling screw hole 8 surrounding is equidistantly provided with at least three holding screw holes 9, described alignment pin 7 is cylindrical structure, and alignment pin 7 is arranged on the lateral surface of the first frock 5, and alignment pin 7 and the second frock 6 are connected to a fixed.
Implement a kind of silicon rod crystal orientation of the present invention adjusting device, in use, first directly put silicon stack disk 2 at baffle 1 and carrier board 3, then by glue by baffle 1, silicon stack disk 2, carrier board 3, buffer board 4 and the first frock 5 are bonded together composition workpiece, and then workpiece is placed in the second frock 6, and by screw, workpiece is fixed in the second frock 6, then just the second frock 6 can be fixed together with the dovetail holder of multi-line cutting machine and be installed on multi-line cutting machine, according to the dimensional requirement of high voltage silicon rectifier stack, the resin diamond wire of the home roll and suitable dimension that install multi-line cutting machine just can cut high voltage silicon rectifier stack, workpiece is pulled down after having cut, then make workpiece half-twist be screwed in again the second frock 6 once cuts again just passable, finally take off the second frock 6, second frock 6 is put into ultrasonic wave cleaning 15 to 40 minutes, be put in degumming liquid again and come unstuck, carry out degumming cleaning after coming unstuck and just can proceed to next process.
Part not in the detailed description of the invention is prior art.
Claims (4)
1. the special segmenting device of a high voltage silicon rectifier stack, comprise the first frock, second frock, alignment pin, block, buffer board, carrier board and baffle, it is characterized in that: in the second frock upper side, be provided with alignment pin and the first frock, second frock is provided with two alignment pins, the middle part of described first frock is provided with prevents falling screw hole, anti-surrounding of falling screw hole is provided with holding screw hole, first frock is inserted by screw and is prevented that falling screw hole makes the first frock be connected with the second frock with holding screw hole, the side of the first frock is provided with block, block is placed between two alignment pins of the second frock, the upper side of the first frock is provided with buffer board, buffer board is provided with carrier board, carrier board is provided with baffle.
2. the special segmenting device of a kind of high voltage silicon rectifier stack according to claim 1, is characterized in that: described buffer board is that resin material is made.
3. the special segmenting device of a kind of high voltage silicon rectifier stack according to claim 1, is characterized in that: described first frock is cylindrical structure, prevents falling the central part that screw hole is arranged on cylinder, along preventing that falling screw hole surrounding is equidistantly provided with at least three holding screw holes.
4. the special segmenting device of a kind of high voltage silicon rectifier stack according to claim 1, is characterized in that: described alignment pin is cylindrical structure, and alignment pin is arranged on the lateral surface of the first frock, and alignment pin and the second frock are connected to a fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510281196.0A CN104985708A (en) | 2015-05-28 | 2015-05-28 | Cutting device special for high voltage silicon stack |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510281196.0A CN104985708A (en) | 2015-05-28 | 2015-05-28 | Cutting device special for high voltage silicon stack |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104985708A true CN104985708A (en) | 2015-10-21 |
Family
ID=54297659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510281196.0A Pending CN104985708A (en) | 2015-05-28 | 2015-05-28 | Cutting device special for high voltage silicon stack |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104985708A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07153724A (en) * | 1993-11-29 | 1995-06-16 | Sharp Corp | Method of slicing silicon ingot |
| JPH1044143A (en) * | 1996-08-08 | 1998-02-17 | Mimasu Handotai Kogyo Kk | Workpiece mounting jig, device and method |
| CN201456253U (en) * | 2009-06-16 | 2010-05-12 | 宁晋赛美港龙电子材料有限公司 | Special fixture for use in cutting of monocrystalline silicon for making seed crystals |
| CN102059748A (en) * | 2010-12-13 | 2011-05-18 | 天津市环欧半导体材料技术有限公司 | Process for cutting silicon chip by using steel wire with diameter of 0.11 millimeter |
| CN102363328A (en) * | 2011-06-27 | 2012-02-29 | 镇江市港南电子有限公司 | A silicon wafer cutting device |
| CN203527674U (en) * | 2013-11-20 | 2014-04-09 | 河北同光晶体有限公司 | Crystal swinging device on single-wire cutting machine |
| CN204673817U (en) * | 2015-05-28 | 2015-09-30 | 洛阳鸿泰半导体有限公司 | A kind of special segmenting device of high voltage silicon rectifier stack |
-
2015
- 2015-05-28 CN CN201510281196.0A patent/CN104985708A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07153724A (en) * | 1993-11-29 | 1995-06-16 | Sharp Corp | Method of slicing silicon ingot |
| JPH1044143A (en) * | 1996-08-08 | 1998-02-17 | Mimasu Handotai Kogyo Kk | Workpiece mounting jig, device and method |
| CN201456253U (en) * | 2009-06-16 | 2010-05-12 | 宁晋赛美港龙电子材料有限公司 | Special fixture for use in cutting of monocrystalline silicon for making seed crystals |
| CN102059748A (en) * | 2010-12-13 | 2011-05-18 | 天津市环欧半导体材料技术有限公司 | Process for cutting silicon chip by using steel wire with diameter of 0.11 millimeter |
| CN102363328A (en) * | 2011-06-27 | 2012-02-29 | 镇江市港南电子有限公司 | A silicon wafer cutting device |
| CN203527674U (en) * | 2013-11-20 | 2014-04-09 | 河北同光晶体有限公司 | Crystal swinging device on single-wire cutting machine |
| CN204673817U (en) * | 2015-05-28 | 2015-09-30 | 洛阳鸿泰半导体有限公司 | A kind of special segmenting device of high voltage silicon rectifier stack |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151021 |