CN104952711A - 一种有机/无机杂化锡铅混合钙钛矿材料及其制备方法 - Google Patents
一种有机/无机杂化锡铅混合钙钛矿材料及其制备方法 Download PDFInfo
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- CN104952711A CN104952711A CN201510369063.9A CN201510369063A CN104952711A CN 104952711 A CN104952711 A CN 104952711A CN 201510369063 A CN201510369063 A CN 201510369063A CN 104952711 A CN104952711 A CN 104952711A
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- 239000000463 material Substances 0.000 title claims abstract description 39
- 238000002360 preparation method Methods 0.000 title claims abstract description 24
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 title claims abstract description 20
- 238000004528 spin coating Methods 0.000 claims abstract description 58
- 238000006243 chemical reaction Methods 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 239000007787 solid Substances 0.000 claims abstract description 22
- 239000011521 glass Substances 0.000 claims abstract description 19
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000001291 vacuum drying Methods 0.000 claims abstract description 13
- 230000005672 electromagnetic field Effects 0.000 claims abstract description 11
- 239000002904 solvent Substances 0.000 claims abstract description 3
- 239000010408 film Substances 0.000 claims description 19
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 18
- 238000002156 mixing Methods 0.000 claims description 18
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 11
- 239000010409 thin film Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 8
- 238000000137 annealing Methods 0.000 claims description 7
- 239000008367 deionised water Substances 0.000 claims description 7
- 229910021641 deionized water Inorganic materials 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 7
- ISWNAMNOYHCTSB-UHFFFAOYSA-N methanamine;hydrobromide Chemical compound [Br-].[NH3+]C ISWNAMNOYHCTSB-UHFFFAOYSA-N 0.000 claims description 7
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 6
- HRHBQGBPZWNGHV-UHFFFAOYSA-N azane;bromomethane Chemical compound N.BrC HRHBQGBPZWNGHV-UHFFFAOYSA-N 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- ZSUXOVNWDZTCFN-UHFFFAOYSA-L tin(ii) bromide Chemical compound Br[Sn]Br ZSUXOVNWDZTCFN-UHFFFAOYSA-L 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000009396 hybridization Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 2
- 238000003756 stirring Methods 0.000 claims description 2
- 230000031700 light absorption Effects 0.000 abstract description 3
- ZASWJUOMEGBQCQ-UHFFFAOYSA-L dibromolead Chemical compound Br[Pb]Br ZASWJUOMEGBQCQ-UHFFFAOYSA-L 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- FFJMLWSZNCJCSZ-UHFFFAOYSA-N n-methylmethanamine;hydrobromide Chemical compound Br.CNC FFJMLWSZNCJCSZ-UHFFFAOYSA-N 0.000 abstract 1
- LTSUHJWLSNQKIP-UHFFFAOYSA-J tin(iv) bromide Chemical compound Br[Sn](Br)(Br)Br LTSUHJWLSNQKIP-UHFFFAOYSA-J 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 description 11
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 10
- 241000500881 Lepisma Species 0.000 description 5
- 230000031709 bromination Effects 0.000 description 5
- 238000005893 bromination reaction Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 229910052745 lead Inorganic materials 0.000 description 3
- 238000010183 spectrum analysis Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000001757 thermogravimetry curve Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000039 congener Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001699 photocatalysis Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
- H01L21/208—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy using liquid deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/02168—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells the coatings being antireflective or having enhancing optical properties for the solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Chemically Coating (AREA)
- Manufacturing & Machinery (AREA)
- Sustainable Energy (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510369063.9A CN104952711B (zh) | 2015-06-29 | 2015-06-29 | 一种有机/无机杂化锡铅混合钙钛矿材料及其制备方法 |
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CN201510369063.9A CN104952711B (zh) | 2015-06-29 | 2015-06-29 | 一种有机/无机杂化锡铅混合钙钛矿材料及其制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN104952711A true CN104952711A (zh) | 2015-09-30 |
CN104952711B CN104952711B (zh) | 2017-10-24 |
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CN201510369063.9A Expired - Fee Related CN104952711B (zh) | 2015-06-29 | 2015-06-29 | 一种有机/无机杂化锡铅混合钙钛矿材料及其制备方法 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105576133A (zh) * | 2015-12-21 | 2016-05-11 | 成都新柯力化工科技有限公司 | 一种可喷涂的钙钛矿结构的光伏材料及其制备方法 |
CN107482121A (zh) * | 2017-08-01 | 2017-12-15 | 厦门大学 | 一种基于磁场调控的钙钛矿薄膜的制备方法 |
CN108183170A (zh) * | 2018-01-03 | 2018-06-19 | 苏州大学 | 一种钙钛矿材料及其在太阳能电池应用和太阳能电池的制备方法 |
CN109037459A (zh) * | 2018-08-03 | 2018-12-18 | 辽宁工业大学 | 一种高纯度钙钛矿薄膜制备方法 |
CN109065722A (zh) * | 2018-07-12 | 2018-12-21 | 西南大学 | 一种基于热载流子的太阳能电池及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103956394A (zh) * | 2014-05-13 | 2014-07-30 | 国家纳米科学中心 | 一种改善钙钛矿太阳电池吸光层性能的方法 |
CN104157786A (zh) * | 2014-07-31 | 2014-11-19 | 清华大学 | 钙钛矿型太阳能电池及其制备方法 |
CN104393109A (zh) * | 2014-10-28 | 2015-03-04 | 合肥工业大学 | 一种钙钛矿太阳能电池的化学气相沉积制备方法 |
-
2015
- 2015-06-29 CN CN201510369063.9A patent/CN104952711B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103956394A (zh) * | 2014-05-13 | 2014-07-30 | 国家纳米科学中心 | 一种改善钙钛矿太阳电池吸光层性能的方法 |
CN104157786A (zh) * | 2014-07-31 | 2014-11-19 | 清华大学 | 钙钛矿型太阳能电池及其制备方法 |
CN104393109A (zh) * | 2014-10-28 | 2015-03-04 | 合肥工业大学 | 一种钙钛矿太阳能电池的化学气相沉积制备方法 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105576133A (zh) * | 2015-12-21 | 2016-05-11 | 成都新柯力化工科技有限公司 | 一种可喷涂的钙钛矿结构的光伏材料及其制备方法 |
CN105576133B (zh) * | 2015-12-21 | 2017-11-28 | 重庆盛瓒科技有限公司 | 一种可喷涂的钙钛矿结构的光伏材料及其制备方法 |
CN107482121A (zh) * | 2017-08-01 | 2017-12-15 | 厦门大学 | 一种基于磁场调控的钙钛矿薄膜的制备方法 |
CN107482121B (zh) * | 2017-08-01 | 2019-09-17 | 厦门大学 | 一种基于磁场调控的钙钛矿薄膜的制备方法 |
CN108183170A (zh) * | 2018-01-03 | 2018-06-19 | 苏州大学 | 一种钙钛矿材料及其在太阳能电池应用和太阳能电池的制备方法 |
CN108183170B (zh) * | 2018-01-03 | 2022-08-16 | 苏州大学 | 一种钙钛矿材料及其在太阳能电池应用和太阳能电池的制备方法 |
CN109065722A (zh) * | 2018-07-12 | 2018-12-21 | 西南大学 | 一种基于热载流子的太阳能电池及其制备方法 |
CN109037459A (zh) * | 2018-08-03 | 2018-12-18 | 辽宁工业大学 | 一种高纯度钙钛矿薄膜制备方法 |
CN109037459B (zh) * | 2018-08-03 | 2022-03-11 | 辽宁工业大学 | 一种高纯度钙钛矿薄膜制备方法 |
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Inventor after: Peng Shujing Inventor after: Tang Lidan Inventor after: Mei Hailin Inventor after: Wang Bing Inventor after: Qi Jingang Inventor after: Wang Jianzhong Inventor before: Tang Lidan Inventor before: Mei Hailin Inventor before: Wang Bing Inventor before: Peng Shujing Inventor before: Qi Jingang Inventor before: Wang Jianzhong |
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