CN104903409B

CN104903409B - Heat resistance decoration coloured composition, the manufacture method of capacitive input device and capacitive input device and possesses this image display device

Info

Publication number: CN104903409B
Application number: CN201480004092.9A
Authority: CN
Inventors: 后藤英范; 有富隆志
Original assignee: Fujifilm Corp
Current assignee: Fujifilm Corp
Priority date: 2013-01-15
Filing date: 2014-01-10
Publication date: 2017-08-11
Anticipated expiration: 2034-01-10
Also published as: WO2014112429A1; JP2014137617A; JP5860419B2; CN104903409A

Abstract

The heat resistance decoration coloured composition of the present invention is characterised by comprising at least (A) white inorganic pigment and (B) siloxane-based resin.In the manufacture method of capacitive input device, the capacitive input device has a front panel, and the surface side in the surface of the front panel at least has following important document：(1) decorative layer；(3) multiple first transparent electrode patterns, multiple pad portions are extended in a first direction and formed via coupling part；(4) multiple second electrode patterns, are electrically insulated with the first transparent electrode pattern, and by being constituted along multiple pad portions formed by the direction extension intersected with the first direction；And (5) insulating barrier, the first transparent electrode pattern and the second electrode pattern is electrically insulated, the manufacture method of the capacitive input device is characterised by, including following process：The heat resistance decoration coloured composition is applied in a surface side of the front panel and (1) decorative layer is at least formed.

Description

Heat resistance decoration coloured composition, the manufacture method of capacitive input device And capacitive input device and possess this image display device

Technical field

It is used to manufacture what the contact position of finger can be detected as the change of electrostatic capacitance the present invention relates to a kind of The heat resistance of capacitive input device is decorated with coloured composition, the manufacture method of capacitive input device and led to Cross capacitive input device that the manufacture method obtains and using the capacitive input device as constitutive requirements and The image display device possessed.

Background technology

In recent years, in the electronic equipment such as mobile phone, automobile navigation instrument, personal computer, ticket machine, banking terminal, The surface configuration of liquid-crystal apparatus etc. has plate input unit, by one side with reference to the image display area for being shown in liquid-crystal apparatus Instruction image, show the position of the instruction image while being contacted with finger or stylus etc., can carry out and indicate image The input of corresponding information.

This input unit (contact panel) has resistive film type, capacitance type etc..But, resistive film type input device is Make its short-circuit structure by 2 chip architectures of film and glass to press film, therefore with operating temperature range relatively narrower And the poor shortcoming that changes with time.

In contrast, capacitive input device has only forms light transmitting conductive film on a plate base Advantage.As this capacitive input device, for example, there is following kind of capacitive input device：Make electrode pattern Extend along cross one another direction, it is defeated to detect by sensing the change of interelectrode electrostatic capacitance when finger etc. is contacted Enter position (for example, with reference to following patent documents 1).

Also, it is used as capacitive input device, also following kind of capacitive input device：To translucency The two ends of conducting film apply same phase, idiostatic alternating current, finger contact or close to and flowed when sensing to form capacitor The weak current crossed, so as to detect input position.As this capacitive input device, following capacitance type is disclosed Input unit, it possesses：Multiple first transparent electrode patterns, multiple pad portions are extended in a first direction via coupling part And formed；And multiple second transparency electrode patterns, it is electrically insulated via interlayer insulating film with the first transparent electrode pattern, and By being constituted (for example, with reference to following patent documents 2) along multiple pad portions formed by the direction extension intersected with first direction. But, because the capacitive input device is in made capacitive input device upper strata prestack panel, therefore deposit Capacitive input device it is thickening and become weight the problem of.

In addition, disclosing shielding layer, sensing circuit, layer insulation are integrally formed with the surface of a surface side of front panel The capacitance type contact panel (for example, with reference to following patent documents 3) of layer.Capacitance type described in the patent document 3 Contact panel is integrally formed due to front panel with capacitive input device, therefore, it is possible to realize thin layer and lightweight, and And by shielding layer covering and hidden sensing circuit, so that device appearance is improved.

Conventional art document

Patent document

Patent document 1：Japanese Patent Publication 2007-122326 publications

Patent document 2：No. 4506785 publications of Japanese Patent No.

Patent document 3：Japanese Patent Publication 2009-193587 publications

Patent document 4：Japanese Patent Publication 2011-218561 publications

Patent document 5：Japanese Patent Publication 2008-169237 publications

The summary of invention

The invention technical task to be solved

Shielding layer can be formed by the resin of black or other opaque coating materials by only being recorded in patent document 3, But the dress of various tones (black, white, Neutral colour, metallochrome etc.) can be set between the shielding layer and front panel as needed Layer is adornd, in recent years, especially white decorative layer therein is required to improve brightness and whiteness.

As the method for setting the decorative layer, it is to be coated with based on liquid resist or screen painting etc. to account in the past leading Method.

On the other hand, possess the smart mobile phone or flat board of capacitance type contact panel on liquid crystal or organic el display In PC, develop and be published in front panel (the directly one side of contact finger) use with Corning Incorporated's Gorilla glass is the smart mobile phone or tablet PC of the strengthened glass of representative.

The present inventor etc. is studied, and is as a result learnt, if decorative layer formation to be used is printed with liquid resist or half tone Brush ink forms white decorative layer on the hardened glass substrate, then is printed using the less liquid resist of hidden power or half tone , it is necessary to carry out the coating of liquid resist and screen painting several times during brush ink formation white decorative layer, exist and produce therefrom Bubble, inequality and because caused by process number is more yield reduce etc. cost reduction be not easy to the problem of.If in addition, in reinforcing Formed on glass after decorative layer, heated in the process for making the circuits such as transparency conducting layer, then there is whiteness decline The problem of point.

This is directed to, the higher white film of heat resistance is used as, it is proposed that a kind of plural layers, the feature of the plural layers It is, the heat cure at least containing substantially no silicon in intramolecular by (A) is provided with least one side in Kapton Property the layer that constitutes of white hot curing resin composition containing white color agents of resin and (B) (for example, referenced patent document 4).But, the plural layers described in patent document 4, which similarly exist to make in the processes of circuit such as transparency conducting layer, to be heated to The problem of whiteness declines during high temperature point.

Similarly, as the higher film of heat resistance, it is proposed that one kind make polyimide precursor film imidizate and Obtained white Kapton, wherein, the polyimide precursor film is by making diamines and aromatic tetracarboxylic acid Mixture of white pigment forms (for example, referenced patent document 5) in polyamic acid obtained from reaction.But, patent document 5 is remembered The white Kapton of load is similarly in the presence of white when being heated at high temperature in the processes of circuit such as making transparency conducting layer Degree declines the problem of point.

As above, the present inventor etc. is studied, and is as a result learnt, when forming white using the method described in these documents During decorative layer, it is impossible to be met brightness, whiteness, reticulate pattern (レチキュレーショ Application) and adhesiveness institute after transfer There is the decorative layer of the performance of these characteristics.Also, learn the white dress for also being difficult to that above-mentioned characteristic is met with higher yield Adorn layer.

Problem to be solved by this invention, which is that offer is a kind of, to obtain brightness, whiteness, net with higher yield The heat resistance decoration coloured composition of the white decorative layer of line and good adhesion.

At the same time the heat-resisting of above-mentioned characteristic is met there is provided a kind of can be used by simple process with high-quality manufacture Property decoration coloured composition, can realize that the capacitance type of thin layer and light-weighted capacitive input device is defeated Enter the manufacture method of device and the capacitive input device that is obtained by the manufacture method and use the capacitance type The image display device of input unit.

Means for solving technical task

In this regard, the present inventor etc. has further carried out repeating to study to the whiteness of white decorative layer, as a result so that hair It is now as follows：After white decorative layer is formed, need to carry out under high temperature when forming the transparent electrode pattern being made up of ITO etc. Heating, as a result, the whiteness of white decorative layer is remarkably decreased during high-temperature heating.Thus, it is found that being used by being decorated in heat resistance Siloxane-based resin is used in coloured composition, brightness, whiteness, reticulate pattern and adhesiveness can be obtained with higher yield good Good white decorative layer, until completing the present invention.

It is as follows as the present invention of the specific means for solving above-mentioned problem.

[1] a kind of heat resistance decoration coloured composition, it is characterised in that the heat resistance decoration with coloured composition extremely It is few to include (A) white inorganic pigment and (B) siloxane-based resin.

[2] the heat resistance decoration described in [1] is preferably with coloured composition, the heat resistance decoration coloured composition Also include (C) antioxidant.

[3] the heat resistance decoration described in [1] or [2] is preferably with coloured composition, and (B) siloxane-based resin is comprising changing Property silicone resin or in intramolecular at least containing the pure siloxane resin (ス of siloxane structure represented with following formulas (1) トレートシリコーンレジン)。

[changing 1]

In formula (1), R¹Independently represent straight-chain, branched or ring-type that hydrogen atom, halogen atom, carbon number are 1~20 Alkoxy, carbon number be 1~20 straight-chain, branched or ring-type alkyl, carbon number be 1~20 straight-chain, branched or Aryl or carbon number that alkenyl, the carbon number of straight-chain, branched or ring-type that substitution alkyl, the carbon number of ring-type are 2~20 are 6~20 For 7~20 aralkyl.

[4] the heat resistance decoration described in [3] is preferably with coloured composition, in formula (1), R¹Independently represent that hydrogen is former Straight-chain, branched or the ring-type that alkyl, the carbon number of straight-chain, branched or ring-type that son, carbon number are 1~20 are 1~6 take Substituted alkyl or the aryl that carbon number is 6~9.

[5] the heat resistance decoration described in [3] or [4] is preferably with coloured composition, in formula (1), R¹Independent earth's surface Show hydrogen atom, methyl or tolyl.

[6] the heat resistance decoration described in any one of [1]~[5] is preferably with coloured composition, white inorganic face The containing ratio for expecting the total solid content relative to heat resistance decoration coloured composition is 20~75 mass %.

[7] the heat resistance decoration described in any one of [1]~[6] is preferably with coloured composition, white inorganic face Expect for the rutile titanium dioxide after being handled with mineral surfaces.

[8] the heat resistance decoration described in [7] is preferably with coloured composition, the rutile after being handled with mineral surfaces Type titanium dioxide is at least with the rutile-type titanium dioxide after any one mineral surfaces processing in aluminum oxide, zirconium oxide Titanium.

[9] the heat resistance decoration described in any one of [1]~[8] is preferably that heat resistance is decorated with coloured composition It is capacitive input device front panel decoration composition with coloured composition.

[10] a kind of manufacture method of capacitive input device, the capacitive input device has above Plate, and important document of the surface side at least with following (1) and (3)~(5) in the surface of front panel：

(1) decorative layer；

(3) multiple first transparent electrode patterns, multiple pad portions are extended in a first direction and formed via coupling part；

(4) multiple second electrode patterns, are electrically insulated with the first transparent electrode pattern, and by edge and the first direction Multiple pad portions formed by the direction extension of intersection are constituted；And

(5) insulating barrier, makes the first transparent electrode pattern and the second electrode pattern be electrically insulated,

The manufacture method is characterised by that the manufacture method of the capacitive input device includes following process： Apply the heat resistance decoration coloured composition described in any one of [1]~[9] and at least shape in one surface side of front panel Into (1) decorative layer.

[11] manufacture method of the capacitive input device described in [10] is preferably, capacitive input device Also there is (6) another electric conductivity important document, another electric conductivity important document is electrically connected to first transparent electrode pattern and second electrode figure At least one of case, and it is different from first transparent electrode pattern and second electrode pattern.

[12] manufacture method of the capacitive input device described in [10] or [11] is preferably, second electrode pattern For transparent electrode pattern.

[13] manufacture method of the capacitive input device described in any one of [10]~[12] is preferably, (1) thickness of decorative layer is 1~40 μm.

[14] manufacture method of the capacitive input device described in any one of [10]~[13] is preferably, A surface side in the surface of front panel is applied after heat resistance decoration coloured composition, is added in the environment of 0.08~1.2atm Heat forms (1) decorative layer to 180~300 DEG C.

[15] manufacture method of the capacitive input device described in [14] is preferably and added under air ambient Heat.

[16] manufacture method of the capacitive input device described in any one of [10]~[15] is preferably, It is by printing heat resistance decoration coloured composition with coloured composition that the heat resistance decoration is applied in one surface side of front panel Come carry out.

[17] manufacture method of the capacitive input device described in any one of [10]~[16] is preferably, (1) in the surface of decorative layer with and the face of the opposed one side opposite side of front panel on also form (2) shielding layer.

[18] manufacture method of the capacitive input device described in [17] is preferably, across front panel one side and (2) in the surface of shielding layer with and opposed the two regions of the face of one side opposite side of front panel and set (3) first transparent At least one of electrode pattern and (4) second electrode pattern.

[19] manufacture method of the capacitive input device described in [17] or [18] is preferably, the electrostatic capacitance Type input unit also has (6) another electric conductivity important document, and another electric conductivity important document is electrically connected to the first transparency electrode figure At least one of case and the second electrode pattern, and with the first transparent electrode pattern and the second electrode pattern not Together, at least in the surface of (2) shielding layer with and the surface side of the opposed one side opposite side of the front panel have (6) another One electric conductivity important document.

[20] manufacture method of the capacitive input device described in any one of [10]~[19] is preferably, with The all or part of mode for covering the important document of (1) and (3)~(5) also forms protective clear layer.

[21] manufacture method of the capacitive input device described in [20] is preferably and combined using curable resin Thing formation protective clear layer.

[22] manufacture method of the capacitive input device described in any one of [10]~[21] is preferably, quiet Electric capacitor type input unit also has (6) another electric conductivity important document, and another electric conductivity important document is electrically connected to first transparency electrode At least one of pattern and second electrode pattern, and it is different from first transparent electrode pattern and second electrode pattern, (4) second Electrode pattern is transparent electrode pattern, by using the etched pattern formed by hardening resin composition to transparent conductive material It is etched to form (3) first transparent electrode pattern, (4) second electrode pattern and (6) another electric conductivity important document.

[23] manufacture method of the capacitive input device described in any one of [10]~[21] is preferably, quiet Electric capacitor type input unit also has (6) another electric conductivity important document, and another electric conductivity important document is electrically connected to first transparency electrode At least one of pattern and second electrode pattern, and it is different from first transparent electrode pattern and second electrode pattern, (4) second Electrode pattern is transparent electrode pattern, uses electric conductivity hardening resin composition formation (3) first transparent electrode pattern, second At least one of transparent electrode pattern and (6) another electric conductivity important document.

[24] manufacture method of the capacitive input device described in any one of [10]~[23] is preferably, The one side of front panel is surface-treated, and curable resin is applied in the one side of surface treatment for having been carried out front panel and is combined Thing.

[25] manufacture method of the capacitive input device described in [24] is preferably, in the surface treatment of front panel Middle use silane compound.

[26] manufacture method of the capacitive input device described in any one of [10]~[25] is preferably, preceding Panel has opening portion at least a portion.

[27] a kind of capacitive input device, wherein, the capacitive input device passes through [10]~[26] Any one of described in the manufacture method of capacitive input device manufacture.

[28] a kind of image display device, wherein, described image display device possesses the capacitance type described in [27] Input unit is used as constitutive requirements.

Invention effect

According to the present invention it is possible to which provide a kind of can obtain brightness, whiteness, reticulate pattern and adhesiveness with higher yield The heat resistance decoration coloured composition of good white decorative layer.

According to the present invention, while can provide one kind can have been used in satisfaction by simple process with high-quality manufacture State characteristic it is heat resistance decoration coloured composition, thin layer and light-weighted capacitive input device can be realized The manufacture method of capacitive input device and the capacitive input device obtained by the manufacture method and use The image display device of the capacitive input device.

Brief description of the drawings

Fig. 1 is the sectional view for the structure for representing the capacitive input device of the present invention.

Fig. 2 is the explanation figure of one for representing the front panel in the present invention.

Fig. 3 is the explanation figure of one for representing first transparent electrode pattern and second transparency electrode pattern in the present invention.

Fig. 4 is to represent to be formed with the top view of one of the intensive treatment glass of opening portion.

Fig. 5 is the top view of one for representing to be formed with decorative layer, the front panel of shielding layer.

Fig. 6 is to represent to be formed with the top view of one of the front panel of first transparent electrode pattern.

Fig. 7 is to represent to be formed with the top view of one of the front panel of first and second transparent electrode pattern.

Fig. 8 is the front panel for representing to be formed with another electric conductivity important documents different from first and second transparent electrode pattern The top view of one.

Fig. 9 is the explanation figure for representing metal nanometer line section.

Figure 10 is the schematic diagram of antifouling board.

Figure 11 is the schematic diagram of antifouling bolt.

Embodiment

Hereinafter, to the present invention it is heat resistance decoration coloured composition, the manufacture method of capacitive input device, quiet Electric capacitor type input unit and image display device are illustrated.

The explanation for the constitutive requirements recorded below is carried out according to the representative embodiments of the present invention, but the present invention It is not limited to this embodiment.In addition, in present specification, "~" using the numerical value including will be recorded before and after it as The implication of lower limit and higher limit is used.

[heat resistance decoration coloured composition]

The heat resistance decoration coloured composition of the present invention, wherein, the heat resistance decoration is at least wrapped with coloured composition Containing (A) white inorganic pigment and (B) siloxane-based resin.

- (A) white inorganic pigments-

As (A) white inorganic pigment, 0019 section of Japanese Patent Publication 2009-191118 publications can be used With the Chinese white described in 0109 section of Japanese Patent Publication 2000-175718 publications.

Specifically, in the present invention, the white inorganic pigment, preferably titanium dioxide (rutile-type), dioxy are used as Change titanium (Detitanium-ore-type), zinc oxide, lithopone, precipitated calcium carbonate, silica, aluminum oxide, aluminium hydroxide, barium sulfate, it is more excellent Elect titanium dioxide (rutile-type), titanium dioxide (Detitanium-ore-type), more preferably zinc oxide, titanium dioxide (rutile as Type), titanium dioxide (Detitanium-ore-type), be still more preferably rutile titanium dioxide.

As the concrete example of titanium dioxide, can enumerate JR, JRNC, JR-301,403,405,600A, 605,600E, 603、701、800、805、806、JA-1、C、3、4、5、MT-01、02、03、04、05、100AQ、100SA、100SAK、100SAS、 100TV、100Z、100ZR、150W、500B、500H、500SA、500SAK、500SAS、500T、SMT-100SAM、100SAS、 500SAM, 500SAS (TAYCA Corporation systems), CR-50,50-2,57,58,58-2,60,60-2,63,67,80,85, 90、90-2、93、95、97、953、Super70、PC-3、PF-690、691、711、736、737、739、740、742、R-550、 580、630、670、680、780、780-2、820、830、850、855、930、980、S-305、UT771、TTO-51(A)、51 (C)、55(A)、55(B)、55(C)、55(D)、S-1、S-2、S-3、S-4、V-3、V-4、MPT-136、FTL-100、110、200、 300 (Ishihara Sangyo Kaisha, Ltd. systems), KA-10,15,20,30, KR-310,380, KV-200, STT- 30EHJ, 65C-S, 455,485SA15,495M, 495MC (Titan Kogyo, Ltd. system), TA-100,200,300,400, 500th, TR-600,700,750,840,900 (Fuji Titanium Industry Co., Ltd.s system) etc., can be by these lists Solely or be used in mixed way.

In the present invention, the surface of the white inorganic pigment (especially titanium dioxide) can implement silica-treated, Alumina treatment, titanium dioxide treatment, zirconium oxide processing, organic matter handle and carried out simultaneously these processing.

Thereby, it is possible to suppress the catalytic activity of the white inorganic pigment (especially titanium dioxide), so as to improve Heat resistance, delustering etc..

From the viewpoint of the whiteness of the decorative layer after heating, in the present invention, the Chinese white is preferably with inorganic At least one of rutile titanium dioxide after thing surface treatment, more preferably handled by alumina treatment and zirconium oxide The rutile titanium dioxide after being surface-treated is handled, especially preferably by simultaneously using the place of aluminum oxide and zirconium oxide Manage the rutile titanium dioxide after being surface-treated.

From formed with good brightness and whiteness and meet simultaneously characteristic required by other decorative layer sight Point considers that preferably described white inorganic pigment contains relative to the total solid content of the heat resistance decoration coloured composition Rate is 20~75 mass %.Also, it is described later of the invention quiet when the heat resistance decoration of the present invention is used for coloured composition During the manufacture method of electric capacitor type input unit, from the viewpoint of abundant shortening developing time, it is also preferred that the white inorganic Pigment is 20~75 mass % relative to the containing ratio of the total solid content of the decorative layer.

More preferably described white inorganic pigment is relative to the total solid content of the heat resistance decoration coloured composition Containing ratio is 25~60 mass %, more preferably 30~50 mass %.

Described total solid content refers to from the heat resistance decoration with removing solvent in coloured composition in this specification The gross mass of nonvolatile component Deng after.

It is preferred that the white inorganic pigment (in addition, for also identical for other colouring agents in aftermentioned shielding layer) is used as Dispersion liquid.The dispersion liquid can composition obtained from by the way that the white inorganic pigment and pigment dispersing agent will be pre-mixed add It is added on organic solvent described later (or vehicle (vehicle)) and makes it scattered and prepare.The vehicle refers to that coating is in Make the media fraction that pigment is scattered during liquid condition, comprising in liquid and the composition that is combined with the pigment and form film (glues Mixture) and by the composition (organic solvent) of its dissolved dilution.

It is not particularly limited, for example, can enumerates as used dispersion machine when making the white inorganic pigment scattered Towards storehouse nation make work, " pigment topical reference book ", the first edition, the kneader towards described in storehouse bookstore, page 438 in 2000, roller mill, grind Dispersion machine known to machine (Attritor), super grinding machine (Super mill), dissolvers, mixer for well-distribution, sand mill etc..Separately Outside, it can also be ground by the machinery described in the document page 310, utilize frictional force to carry out Crushing of Ultrafine.

From the viewpoint of dispersion stabilization and hidden power, preferably as the white inorganic pigment used in the present invention White inorganic pigment be that the average grain diameter of primary particle is 0.16 μm~0.3 μm of white inorganic pigment, more preferably 0.18 μ The white inorganic pigment of m~0.27 μm.In addition, especially preferably 0.19 μm~0.25 μm of white inorganic pigment.If once grain The average grain diameter of son is less than 0.16 μm, then hidden power drastically declines, so as to be sometimes prone to observe the substrate of shielding layer or draw Viscosity is played to rise.On the other hand, if more than 0.3 μm, hidden power drastically declines while whiteness declines sometimes, and is coated with When planar be deteriorated.

In addition, " average grain diameter of primary particle " said here refers to the electron micrograph image of particle being set to The diameter of bowlder of the same area, also, " number average bead diameter " refer to obtain the particle diameter and any therefrom for multiple particles The average value of 100 particle diameters of selection.

On the other hand, when the average grain diameter in dispersion liquid, coating fluid is determined, laser light scattering HORIBA H can be used (HORIBA Advanced Techno, Co., Ltd. system).

- (B) siloxane-based resins-

As the siloxane-based resin, known resin can be used.

Siloxane-based resin can be categorized as modified siloxane resin and pure siloxane (ストレートシリコー Application), change Property silicone resin is that a part of modification of resin is endowed into the siloxanes tree after multifrequency nature with following silane compounds Fat, pure siloxane is to make the silane compound dehydrating condensation with alkoxy or silanol group and utilize the original property of siloxanes Silicone resin.The heat resistance decoration of the present invention includes modified siloxane with the coloured composition preferably siloxane-based resin Resin or the pure siloxane resin in intramolecular at least containing the siloxane structure represented with following formulas (1).

As modified siloxane resin, the reaction of the acrylic monomers such as silane compound and acrylic acid can be used and obtained Arrive monomer polymerization or with acrylic resin modified siloxane resin obtained from other acrylic monomer combined polymerizations Obtained from the reaction such as (Shin-Etsu Chemical Co., Ltd. KR-9706), the hydroxyl for making silane compound and polyester Polyester resin modified siloxane resin, make compound containing epoxy radicals silicone hydride and the amino residue of resin etc. react obtained from epoxy Resin modified silicone resin, made with reactive silicon hydride compounds alkyd resin be modified obtained from alkyd resin modified siloxane Silicone resin of resin and rubber series obtained from directly forming covalent bond using oxime series initiators and resin etc..

As pure siloxane, it can use in intramolecular at least containing the siloxane structure represented with following formulas (1) Siloxanes.

[changing 2]

In formula (1), R¹It independently is straight-chain, branched or ring-type that hydrogen atom, halogen atom, carbon number are 1~20 Straight-chain, branched or ring that alkyl, the carbon number of straight-chain, branched or ring-type that alkoxy, carbon number are 1~20 are 1~20 The aryl or carbon number that alkenyl, the carbon number of straight-chain, branched or ring-type that substitution alkyl, the carbon number of shape are 2~20 are 6~20 be 7~20 aralkyl, multiple R¹Can it is identical can also be different.That is, with the pure of the siloxane structure represented with the formula (1) Siloxanes can be the condensation product of identical siloxane structure or the cocondensation of different combination.

It is used as R¹Represented halogen atom, can enumerate fluorine atom, chlorine atom etc..

It is used as R¹Represented carbon number is the alkoxy of 1~20 straight-chain, branched or ring-type, for example, can enumerate first Epoxide, ethyoxyl, positive propoxy, isopropoxy, n-butoxy, isobutoxy, sec-butoxy, tert-butoxy, n-pentyloxy, just Hexyloxy, cyclopentyloxy, cyclohexyloxy etc..

It is used as R¹Represented carbon number is the alkyl of 1~20 straight-chain, branched or ring-type, for example, can enumerate first Base, ethyl, n-propyl, isopropyl, normal-butyl, isobutyl group, sec-butyl, the tert-butyl group, n-pentyl, n-hexyl, cyclopenta, cyclohexyl Deng.

R¹In alkyl of the represented carbon number for 1~20 straight-chain, branched or ring-type, preferably carbon number is 1~3 alkane Base, more preferably methyl.

Also, it is used as R¹Represented carbon number is the substitution alkyl of 1~20 straight-chain, branched or ring-type, for example may be used To enumerate aralkyl, fluoroalkyl, chlorine alkyl, hydroxyalkyl, (methyl) acryloxyalkyl and mercapto alkyl.It is used as the specific of them Example, can for example enumerate phenyl methyl (benzyl), diphenyl methyl, 1- phenylethyls, 2- phenylethyls, 1- phenyl-n-propyl, 2- phenyl -2- propyl group (cumenyl), 3- phenyl-n-propyl, 1- phenyl butyls, 2- phenyl butyls, 3- phenyl butyls, 4- phenyl Butyl, 1- phenylpentyls, 2- phenylpentyls, 3- phenylpentyls, 4- phenylpentyls, 5- phenylpentyls, 1- Phenylhexyls, 2- phenyl Hexyl, 3- Phenylhexyls, 4- Phenylhexyls, 5- Phenylhexyls, 6- Phenylhexyls, 1- phenylcyclohexyls, 2- phenylcyclohexyls, 3- Phenylcyclohexyl, 1- phenylheptyls, 2- phenylheptyls, 3- phenylheptyls, 4- phenylheptyls, 5- phenylheptyls, 6- phenylheptyls, 1- phenyl octyl group, 2- phenyl octyl group, 3- phenyl octyl group, 4- phenyl octyl group, 5- phenyl octyl group, 6- phenyl octyl group, 1- naphtylethyl groups, 2- naphtylethyl groups, 1- naphthyls-n-propyl, 2- naphthyl -2- propyl group, 3- naphthyls-n-propyl, 1- naphthyls butyl, 2- naphthyls butyl, 3- Naphthyl butyl, 4- naphthyls butyl, 1- naphthyls amyl group, 2- naphthyls amyl group, 3- naphthyls amyl group, 4- naphthyls amyl group, 5- naphthyls amyl group, 1- Naphthyl hexyl, 2- naphthyls hexyl, 3- naphthyls hexyl, 4- naphthyls hexyl, 5- naphthyls hexyl, 6- naphthyls hexyl, 1- naphthyls cyclohexyl, 2- naphthyls cyclohexyl, 3- naphthyls cyclohexyl, 1- naphthyls heptyl, 2- naphthyls heptyl, 3- naphthyls heptyl, 4- naphthyls heptyl, 5- naphthyls Heptyl, 6- naphthyls heptyl, 1- naphthyls octyl group, 2- naphthyls octyl group, 3- naphthyls octyl group, 4- naphthyls octyl group, 5- naphthyls octyl group, 6- naphthyls The aralkyl such as octyl group；Methyl fluoride, trifluoromethyl, 2- fluoro ethyls, (trifluoromethyl) methyl, pentafluoroethyl group, the fluoro- n-propyls of 3-, 2- (trifluoromethyl) ethyl, (pentafluoroethyl group) methyl, seven fluoro- n-propyls, the fluoro- normal-butyls of 4-, 3- (trifluoromethyl)-n-propyl, 2- (pentafluoroethyl group) ethyl, (seven fluoro- n-propyls) methyl, nine fluoro- normal-butyls, the fluoro- n-pentyls of 5-, 4- (trifluoromethyl)-normal-butyl, 3- (pentafluoroethyl group)-n-propyl, 2- (seven fluoro- n-propyls) ethyl, (nine fluoro- normal-butyls) methyl, perfluor-n-pentyl, 6- are fluoro- just Hexyl, 5- (trifluoromethyl)-n-pentyl, 4- (pentafluoroethyl group)-normal-butyl, 3- (seven fluoro- n-propyls)-n-propyl, (nine is fluoro- by 2- Normal-butyl) ethyl, (perfluor-n-pentyl) methyl, perfluor-n-hexyl, 7- (trifluoromethyl)-n-heptyl, 6- (pentafluoroethyl group)-just Hexyl, 5- (seven fluoro- n-propyls)-n-pentyl, 4- (nine fluoro- normal-butyls)-normal-butyl, 3- (perfluor-n-pentyl)-n-propyl, 2- (perfluor-n-hexyl) ethyl, (perfluor-n-heptyl) methyl, perfluor-n-octyl, 9- (trifluoromethyl)-n-nonyl, 8- (five fluorine second Base)-n-octyl, 7- (seven fluoro- n-propyls)-n-heptyl, 6- (nine fluoro- normal-butyls)-n-hexyl, 5- (perfluor-n-pentyl)-positive penta Base, 4- (perfluor-n-hexyl)-normal-butyl, 3- (perfluor-n-heptyl)-n-propyl, 2- (perfluor-n-octyl) ethyl, (perfluor-just Nonyl) fluoroalkyl such as methyl, perfluor-positive decyl, 4- fluorine cyclopenta, 4- fluorine cyclohexyl；And chloromethyl, 2- chloroethyls, 3- are chloro- The chloro- normal-butyl of n-propyl, 4-, 3- chlorine cyclopenta, 4- chlorine cyclohexyl, methylol, 2- ethoxys, 3- hydroxycyclopents base, 4- hydroxyls Cyclohexyl, 3- (methyl) acryloxypropyl, 3- mercaptopropyis etc..

Also, it is used as R¹Represented carbon number is the alkenyl of 2~20 straight-chain, branched or ring-type, for example, can lift Go out vinyl, 1- methyl ethylenes, 1- acrylic, pi-allyl (2- acrylic), 2- methyl -2- acrylic, 1- cyclobutenyls, 2- fourths Alkenyl, 3- cyclobutenyls, 3- cyclopentenyls, 3- cyclohexenyl groups etc..R¹Represented carbon number for 1~20 straight-chain, branched or In the substitution alkyl of ring-type, preferably aralkyl, more preferably cumenyl.

Also, it is used as R¹Represented carbon number is 6~20 aryl, for example, can enumerate phenyl, o-tolyl, a toluene Base, p-methylphenyl, 2,3 xylidine base, 2,4- xylyls, 2,5- xylyls, 2,6- xylyls, 3,4- xylyls, 3,5- xylyls, 1- naphthyls etc..R¹Represented carbon number is in 6~20 aryl, from being not likely to produce the viewpoint of benzene during heating Consider, be preferably group in addition to unsubstituted phenyl be o-tolyl, a tolyl, p-methylphenyl, 2,3- xylyls, 2,4- xylyls, 2,5- xylyls, 2,6- xylyls, 3,4- xylyls, 3,5- xylyls, 1- naphthyls, it is more excellent Elect o-tolyl, a tolyl, p-methylphenyl as.

Also, it is used as R¹Represented carbon number is 7~20 aralkyl, such as can enumerate benzyl, phenethyl.

In the formula (1), preferably R¹It independently is straight-chain, branched or ring-type that hydrogen atom, carbon number are 1~20 Aryl that the substitution alkyl or carbon number for straight-chain, branched or the ring-type that alkyl, carbon number are 1~6 are 6~9 is (in aryl, from adding It is not likely to produce when hot from the viewpoint of benzene, the group beyond preferably unsubstituted phenyl), more preferably represent hydrogen atom, methyl Or tolyl.

It is preferred with the siloxane structure that the formula (1) is represented from the viewpoint of the L values for enabling in particular to improve decorative layer R is used as comprising methyl¹。

It is also preferred that pure siloxane is with R¹The siloxanes knot that the mutually different two or more formulas (1) are represented The copolymer of structure.At this point it is possible to it is preferred that enumerate with R¹For alkyl the formula (1) represent siloxane structure and with R¹For hydrogen The copolymer for the siloxane structure that atom, the formula (1) of substitution alkyl or aryl are represented.As combined polymerization than not having spy Do not limit, but preferably with R¹The siloxane structure represented for the formula (1) of alkyl is represented with the formula (1) all It is 50~100 moles of %, more preferably 60~100 moles %, especially preferably 70~100 moles % in siloxane structure.

As the pure siloxane of the heat resistance decoration coloured composition for the present invention, it can also preferably use following pure Siloxanes：The pure siloxane in intramolecular in addition to the siloxane structure represented with the formula (1), also containing by with it is following State the siloxane structure that the cocondensation of the siloxane structure of formula (2) expression is constituted.

[changing 3]

In formula (2), R²The R with above-mentioned formula (1) can be used¹Identical substituent, preferred scope also with R¹Phase Together.

As the concrete example of pure siloxane, it can use by with the alkyl that carbon number is 1~20 and the silanization of alkoxy The alkylaryl system pure silicon oxygen such as alkyl system pure siloxane (methyl system pure siloxane etc.), aminomethyl phenyl prepared by the condensation of compound The hydrogen system pure siloxanes such as the aryl such as alkane, phenyl system pure siloxane, methyl hydrogen.

More preferably methyl system pure siloxane resin, methyl toluene base system pure siloxane resin, methylbenzene base system pure silicon oxygen Alkane resin, acrylic resin modified siloxane resin, methyl hydrogen system pure siloxane resin, hydrogen toluene base system pure siloxane tree Fat, from the viewpoint of benzene and suppression brightness decline are not produced during heating, particularly preferred methyl system pure siloxane resin, methyl Toluene base system pure siloxane resin, methyl hydrogen system pure siloxane resin, hydrogen toluene base system pure siloxane resin.

These siloxane-based resins can be used alone, can also simultaneously using two or more, by by these with any Ratio is mixed, and can suppress film physical property.

The generation of benzene can be quantitative by gaschromatographic mass spectrometric analysis (GC-MS).Capacitance type by the present invention is defeated Enter decoration obtained from the decorative layer of the manufacture method formation of device or the heat resistance decoration coloured composition of the coating present invention The content of the benzene of catabolite when layer is preferably as heating is less, and benzene is not contained more preferably.It is used as the heating of the decorative layer When catabolite, the content of benzene is preferably in every 100cm of decorative layer²In be less than 29mg, more preferably less than 19mg, particularly preferably Less than 9.2mg, more specifically preferably smaller than 0.01mg.

It is preferred that the weight average molecular weight of pure siloxane is 1000~1000000, more preferably 2000~800000, particularly preferably For 2500~500000.

As the silane compound for preparing modified siloxane resin and pure siloxane resin, tetramethyl can be enumerated respectively TMOS, tetraethoxysilane, four positive propoxy silane, tetraisopropoxysilan, four n-butoxy silanes, four isobutoxies Silane, MTMS, MTES, methyl triacetoxysilane, the butoxy silane of methyl three, second Base trimethoxy silane, ethyl triethoxysilane, trimethoxysilane, propyl trimethoxy silicane, vinyl three Methoxy silane, VTES, vinyl trimethoxy Ethoxysilane, phenyltrimethoxysila,e, phenyl Triethoxysilane, phenyl triacetoxysilane, cumenyl trimethoxy silane, tolyl trimethoxy silane, 3,3, 3- trifluoro propyls trimethoxy silane, γ-methacryloxypropyl trimethoxy silane, gamma-amino propyl trimethoxy Silane, γ aminopropyltriethoxy silane, γ mercaptopropyitrimethoxy silane, γ-Mercaptopropyltriethoxysilane, N- β (amino-ethyl)-gamma-amino propyl trimethoxy silicane, N- β (amino-ethyl)-γ aminopropyltriethoxy silane, Beta-cyano ethyl triethoxysilane, methyl triple phenoxyl silane, glycidyl oxy methyl trimethoxy silane, glycidoxy MTES, α-glycidoxyethyl trimethoxy silane, α-glycidoxyethyl triethoxysilane, β- Glycidoxyethyl trimethoxy silane, beta epoxide Among triethoxysilane, α-glycidoxypropyl group front three TMOS, α-glycidoxypropyl group triethoxysilane, beta epoxide propoxypropyl trimethoxy silane, the oxygen of beta epoxide third Base propyl-triethoxysilicane, γ-glycidoxypropyltrime,hoxysilane, γ-glycidoxypropyl group triethoxysilicane Alkane, γ-glycidoxypropyl group tripropoxy silane, the butoxy silane of γ-glycidoxypropyl group three, γ-glycidoxy Propyl trimethoxy Ethoxysilane, γ-glycidoxypropyl group triple phenoxyl silane, α-glycidoxy butyl trimethoxy Silane, α-glycidoxy butyl triethoxysilane, beta epoxide propyloxybutyl trimethoxy silane, beta epoxide propoxyl group fourth Ethyl triethoxy silicane alkane, γ-glycidoxy butyl trimethoxy silane, γ-glycidoxy butyl triethoxysilane, δ- Glycidoxy butyl trimethoxy silane, δ-glycidoxy butyl triethoxysilane, (3,4- epoxycyclohexyls) methyl Trimethoxy silane, (3,4- epoxycyclohexyls) MTES, β-(3,4- epoxycyclohexyls) ethyl trimethoxy Silane, β-(3,4- epoxycyclohexyls) ethyl triethoxysilane, β-(3,4- epoxycyclohexyls) ethyl tripropoxy silane, β- The butoxy silane of (3,4- epoxycyclohexyls) ethyl three, β-(3,4- epoxycyclohexyls) ethyl trimethoxy silane, β-(3,4- rings Oxygen cyclohexyl) ethyl triple phenoxyl silane, γ-(3,4- epoxycyclohexyls) propyl trimethoxy silicane, γ-(3,4- epoxide rings Hexyl) trialkoxy silane, three acyl-oxygens such as propyl-triethoxysilicane, δ-(3,4- epoxycyclohexyls) butyl triethoxysilane Base silane or triple phenoxyl silanes, phenyl methyl dimethoxysilane, phenyl methyl diethoxy silane, dimethyl diacetyl TMOS, γ-methacryloyloxypropyl methyl dimethoxysilane, γ-methacryloyloxypropyl methyl diethyl TMOS, γ-mercaptopropyi methyl dimethoxy base dimethoxysilane, γ-mercaptopropyi diethoxy silane, gamma-amino third Ylmethyl dimethoxysilane, gamma-amino hydroxypropyl methyl diethoxy silane, vinyl methyl dimethoxysilane, vinyl Methyldiethoxysilane, glycidyl oxy methyl dimethoxysilane, glycidyl oxy methyl diethoxy silane, α-epoxy Among methyl dimethoxysilane, α-glycidoxyethyl diethoxy silane, beta epoxide Among methyl Dimethoxysilane, beta epoxide Among methyldiethoxysilane, α-glycidoxypropyl dimethoxy silicon Alkane, α-glycidoxypropyl diethoxy silane, beta epoxide propoxypropyl methyl dimethoxysilane, beta epoxide third Epoxide hydroxypropyl methyl diethoxy silane, γ-glycidoxypropyl dimethoxysilane, γ-glycidoxypropyl group Methyldiethoxysilane, γ-glycidoxypropyl dipropoxy silane, the fourth of γ-glycidoxypropyl two TMOS, γ-glycidoxypropyl dimethoxyethoxy silane, γ-glycidoxypropyl hexichol oxygen Base silane, γ-glycidoxypropyl group ethyldimethoxysilane, γ-glycidoxypropyl group ethyl diethoxy silane, γ-glycidoxypropyl group ethyl dipropoxy silane, γ-glycidoxypropyl group vinyl dimethoxysilane, γ-epoxy Propoxypropylvinyl base diethoxy silane, γ-glycidoxypropyl group phenyidimethoxysilane, γ-glycidoxy The alkoxy silanes such as propyl group phenyl diethoxy silane or two acyloxy silane classes, dimethoxymethylsilane, trimethoxy silicon Alkane, dimethylethoxysilane, diacetoxy methyl-monosilane, diethoxymethylsilane, phenyldimethylsilane, triethyl group Silane, butyldimethylsilane, dimethylphenylsilaneand, methyl phenyl vinyl silane, diphenylmethylsilane, tripropyl silicon Alkane, three amyl group TMOSs, tri-phenyl-silane, three hexyl silanes, diethylsilane, allyl dimethyl base silane, aminomethyl phenyl Double (dimethylsilyl) benzene of silane, diphenyl silane, phenyl silane, octyl group silane, 1,4- and the silicon of 1,1,3,3- tetramethyls two Oxygen alkane, dimethyl methyl phenyl silane, methyl toluene base vinyl silanes, xylyl methyl-monosilane, trimethylphenyl silane, diformazan Base benzyl silane, methyl-benzyl vinyl silanes, dibenzylmethyl silane, tribenzyl silane, diphenyl silane, 2- chloroethyl silicon Alkane, double [(to dimethylsilyl) phenyl] ethers, 1,4- dimethyldisilane bases ethane, 1,3,5- tri- (dimethylsilyl) Benzene, the silane of 1,3,5- trimethyls -1,3,5- three, poly- (methyl silylene) phenylene silane and poly- (methyl silylene) methylene Base silane, tetrachloro silicane, trichlorosilane, triethoxysilane, three positive propoxy silane, three isopropoxy silane, three positive fourth oxygen Base silane, three sec-butoxy silanes, fluorine trichlorosilane, fluorine trimethoxy silane, fluorine triethoxysilane, the positive propoxy silicon of fluorine three Alkane, the isopropoxy silane of fluorine three, the n-butoxy silane of fluorine three, the sec-butoxy silane of fluorine three, methyl trichlorosilane, methyl three positive third TMOS, the isopropoxy silane of methyl three, the n-butoxy silane of methyl three, the sec-butoxy silane of methyl three, 2- (fluoroforms Base) ethyl trichlorosilane, 2- (trifluoromethyl) ethyl trimethoxy silane, 2- (trifluoromethyl) ethyl triethoxysilane, 2- The positive propoxy silane of (trifluoromethyl) ethyl three, the isopropoxy silane of 2- (trifluoromethyl) ethyl three, 2- (trifluoromethyl) ethyl Three n-butoxy silanes, the sec-butoxy silane of 2- (trifluoromethyl) ethyl three, 2- (perfluor-n-hexyl) ethyl trichlorosilane, 2- (perfluor-n-hexyl) ethyl trimethoxy silane, 2- (perfluor-n-hexyl) ethyl triethoxysilane, 2- (perfluor-n-hexyl) The positive propoxy silane of ethyl three, the isopropoxy silane of 2- (perfluor-n-hexyl) ethyl three, ethyl three is just by 2- (perfluor-n-hexyl) Butoxy silane, the sec-butoxy silane of 2- (perfluor-n-hexyl) ethyl three, 2- (perfluor-n-octyl) ethyl trichlorosilane, 2- (perfluor-n-octyl) ethyl trimethoxy silane, 2- (perfluor-n-octyl) ethyl triethoxysilane, 2- (perfluor-n-octyl) The positive propoxy silane of ethyl three, the isopropoxy silane of 2- (perfluor-n-octyl) ethyl three, ethyl three is just by 2- (perfluor-n-octyl) Butoxy silane, the sec-butoxy silane of 2- (perfluor-n-octyl) ethyl three, hydroxymethyl trichlorosilane, hydroxymethyl trimethoxy Base silane, hydroxyethyl trimethoxy silane, the positive propoxy silane of hydroxymethyl three, the isopropoxy silane of hydroxymethyl three, hydroxyl The n-butoxy silane of ylmethyl three, the sec-butoxy silane of hydroxymethyl three, 3- (methyl) acryloxypropyls trichlorosilane, 3- (methyl) acryloxypropyl trimethoxy silane, 3- (methyl) acryloxypropyls triethoxysilane, 3- (methyl) The positive propoxy silane of acryloxypropyl three, the isopropoxy silane of 3- (methyl) acryloxypropyl three, 3- (methyl) third The n-butoxy silane of alkene acryloxypropylethoxysilane three, the sec-butoxy silane of 3- (methyl) acryloxypropyl three, 3- mercaptopropyis three Chlorosilane, 3-mercaptopropyi trimethoxy silane, 3- Mercaptopropyltriethoxysilanes, the positive propoxy silicon of 3- mercaptopropyis three Alkane, the isopropoxy silane of 3- mercaptopropyis three, the n-butoxy silane of 3- mercaptopropyis three, the sec-butoxy silicon of 3- mercaptopropyis three Alkane, vinyl trichlorosilane, the positive propoxy silane of vinyl three, vinyl silane triisopropoxide, the n-butoxy of vinyl three Silane, the sec-butoxy silane of vinyl three, allyltrichlorosilane, allyltrimethoxysilanis, allyl ethyl triethoxy silicane Alkane, the positive propoxy silane of pi-allyl three, the isopropoxy silane of pi-allyl three, the n-butoxy silane of pi-allyl three, pi-allyl three are secondary Butoxy silane, phenyl trichlorosilane, the positive propoxy silane of phenyl three, the isopropoxy silane of phenyl three, the n-butoxy of phenyl three Silane, the sec-butoxy silane of phenyl three, dimethyl dichlorosilane (DMCS), methyldiethoxysilane, two-positive propoxy of methyl silane, first Two-isopropoxy of base silane, two-n-butoxy silane of methyl, two-sec-butoxy silane of methyl, dimethyldichlorosilane, diformazan Base dimethoxysilane, dimethyldiethoxysilane, two-positive propoxy of dimethyl silane, dimethyl two-isopropoxy silicon Alkane, two-n-butoxy silane of dimethyl, two-sec-butoxy silane of dimethyl, (methyl) (2- (perfluor-n-octyl) ethyl) two Chlorosilane, (methyl) (2- (perfluor-n-octyl) ethyl) dimethoxysilane, (methyl) (2- (perfluor-n-octyl) ethyl) two Ethoxysilane, (methyl) (2- (perfluor-n-octyl) ethyl) two positive propoxy silane, (methyl) (2- (perfluor-n-octyl) second Base) diisopropoxy silane, (methyl) (2- (perfluor-n-octyl) ethyl) two n-butoxy silanes, (methyl) (2- (perfluors-just Octyl group) ethyl) two sec-butoxy silanes, (methyl) (γ-glycidoxypropyl group) dichlorosilane, (methyl) (oxygen of γ-epoxy third Base propyl group) dimethoxysilane, (methyl) (γ-glycidoxypropyl group) diethoxy silane, (methyl) (oxygen of γ-epoxy third Base propyl group) two positive propoxy silane, (methyl) (γ-glycidoxypropyl group) diisopropoxy silane, (methyl) (γ-epoxy Propoxypropyl) two n-butoxy silanes, (methyl) (γ-glycidoxypropyl group) two sec-butoxy silanes, (methyl) (3- mercaptos Base propyl group) dichlorosilane, (methyl) (3- mercaptopropyis) dimethoxysilane, (methyl) (3- mercaptopropyis) diethoxy silicon Alkane, (methyl) (3- mercaptopropyis) two positive propoxy silane, (methyl) (3- mercaptopropyis) diisopropoxy silane, (methyl) (3- mercaptopropyis) two n-butoxy silanes, (methyl) (3- mercaptopropyis) two sec-butoxy silanes, (methyl) (vinyl) two Chlorosilane, (methyl) (vinyl) dimethoxysilane, (methyl) (vinyl) diethoxy silane, (methyl) (vinyl) two Positive propoxy silane, (methyl) (vinyl) diisopropoxy silane, (methyl) (vinyl) two n-butoxy silane, (methyl) (vinyl) two sec-butoxy silane, divinyldichlorosilane, divinyl dimethoxysilane, divinyl diethoxy Silane, the positive propoxy silane of divinyl two, divinyl diisopropoxy silane, the n-butoxy silane of divinyl two, two The sec-butoxy silane of vinyl two, diphenyl dichlorosilane, dimethoxydiphenylsilane, diphenyl diethoxy silane, two The positive propoxy silane of phenyl two, diphenyl diisopropoxy silane, the n-butoxy silane of diphenyl two, the sec-butoxy of diphenyl two Silane, chlorodimethylsilane, methoxyl group dimethylsilane, ethyoxyl dimethylsilane, chlorine trimethyl silane, trimethylammonium bromide silicon Alkane, iodine trimethyl silane, methoxytrimethylsilane, ethoxytrimethylsilane, positive propoxy trimethyl silane, isopropoxy Trimethyl silane, n-butoxy trimethyl silane, sec-butoxy trimethyl silane, tert-butoxy trimethyl silane, (chlorine) (ethene Base) dimethylsilane, (methoxyl group) (vinyl) dimethylsilane, (ethyoxyl) (vinyl) dimethylsilane, (chlorine) (first Base) diphenyl silane, (methoxyl group) (methyl) diphenyl silane, (ethyoxyl) (methyl) diphenyl silane etc..But, the present invention It is not limited to these concrete examples.

As the siloxane-based resin such as modified siloxane resin and pure siloxane resin, commercially available product can be used.Business The name of an article can for example be enumerated：

KC-89、KC-89S、X-21-3153、X-21-5841、X-21-5842、X-21-5843、X-21-5844、X-21- 5845、X-21-5846、X-21-5847、X-21-5848、X-22-160AS、X-22-170B、X-22-170BX、X-22-170D、 X-22-170DX、X-22-176B、X-22-176D、X-22-176DX、X-22-176F、X-40-2308、X-40-2651、X-40- 2655A、X-40-2671、X-40-2672、X-40-9220、X-40-9225、X-40-9226、X-40-9227、X-40-9246、 X-40-9247、X-40-9250、X-40-9323、X-40-2460M、X-41-1053、X-41-1056、X-41-1805、X-41- 1810、KF6001、KF6002、KF6003、KR-212、KR-213、KR-217、KR-220L、KR-242A、KR-271、KR-282、 KR-300、KR-311、KR-400、KR-251、KR-255、KR-401N、KR-500、KR-510、KR-5206、KR-5230、KR- 5235th, KR-9218, KR-9706, KR-165 (being above Shin-Etsu Chemical Co., Ltd.)；

SH804、SH805、SH806A、SH840、SR2400、SR2402、SR2405、SR2406、SR2410、SR2411、 SR2416, SR2420 (being above Dow Corning Toray Co., Ltd.)；

FZ3711, FZ3722 (being above NUC Corporation)；

DMS-S12、DMS-S15、DMS-S21、DMS-S27、DMS-S31、DMS-S32、DMS-S33、DMS-S35、DMS- S38, DMS-S42, DMS-S45, DMS-S51, DMS-227, PSD-0332, PDS-1615, PDS-9931, XMS-5025 (more than For CISSO Corporation)；

Methyl silicate MS51, methyl silicate MS56 (being above Mitsubishi Chemical Corporation)；

Silester 28, ethyl silicate 40, silester 48 (being above COLCOAT Co., Ltd.)；

The partial condensates such as glass resin GR100, GR650, GR908, GR950 (being above SHOWA DENKO K.K.). But, the present invention is not limited to these concrete examples.

Here, (1) decorative layer that the heat resistance decoration for applying the present invention is formed with coloured composition can not be by making Heat resistance decoration coloured composition photocuring comprising light-cured resin and Photoepolymerizationinitiater initiater and formed, of the invention is resistance to Hot decoration coloured composition can include light-cured resin or Photoepolymerizationinitiater initiater, can also not include.Wherein, institute is worked as When stating heat resistance decoration coloured composition comprising antioxidant described later, consider preferably not comprising photopolymerization to draw from following viewpoint Send out agent：The function of the antioxidant will not be obstructed free radical when exposure generated in Photoepolymerizationinitiater initiater, and fill Divide and improve the whiteness after baking.It is therefore preferable that (B) siloxane-based resin is Thermocurable.

- (C) antioxidants-

The heat resistance decoration of the present invention is applied for a surface side of the front panel in capacitive input device described later Be filmed with coloured composition and after being toasted obtained by decorative layer, improve the whiteness after baking, seen from this Point considers that the heat resistance decoration of the preferred present invention includes antioxidant with coloured composition.Here, when in capacitance type input , can, it is necessary to be toasted at high temperature when forming ITO etc. transparent electrode pattern on device, but by adding antioxidant Improve the whiteness after baking.

Known antioxidant can be used as the antioxidant.It is, for example, possible to use hindered phenol series antioxidant, Semi-hindered phenol series antioxidant, phosphate antioxidant, intramolecular have the mixed type inhibitorses (phosphorus of phosphoric acid and hindered phenol Acid/hindered phenol series antioxidant).

Preferably phosphate antioxidant；Phosphate antioxidant and hindered phenol series antioxidant or semi-hindered phenol series antioxygen Used while agent；Or there are the mixed type inhibitorses of phosphoric acid and hindered phenol in intramolecular.

As the antioxidant, commercially available antioxidant can also be used.For example, as phosphate antioxidant, can To enumerate IRGAFOS168, IRGAFOS38 (being BASF Japan Ltd. systems).As phosphoric acid/hindered phenol series antioxidant, IRGAMOD295 (BASF Japan Ltd. systems) can be enumerated, it is anti-as the mixed type in intramolecular with phosphoric acid and hindered phenol Oxidant, can enumerate Sumilizer GP (Sumitomo Chemical Co., Ltd.s system).

From the viewpoint of preventing that whiteness from declining, more preferably described antioxidant is phosphate antioxidant, especially excellent Elect IRGAFOS168 as.

The addition of total solid content as the antioxidant relative to the heat resistance decoration coloured composition It is not particularly limited, but preferably 0.001~10 mass %, more preferably 0.01~1 mass %, especially preferably 0.05~ 0.2 mass %.

- solvent-

Also, as solvent during manufacture heat resistance decoration coloured composition of the invention, Japan Patent can be used Solvent described in 0043~0044 section of open 2011-95716 publications.

- catalyst-

Obtained from improving by solidifying the heat resistance decoration coloured composition comprising the siloxane-based resin From the viewpoint of the fragility of the decorative layer arrived, preferably heat resistance decoration of the invention includes catalyst with coloured composition.When making During with two or more siloxane-based resins, particularly preferably used to promote the crosslinking based on dehydration/dealcoholization condensation reaction.

Known catalyst can be used as the catalyst.

As preferred catalyst, can enumerate as metal ingredient be selected from tin (Sn), zinc (Zn), iron (Fe), titanium (Ti), At least one of zirconium (Zr), bismuth (Bi), hafnium (Hf), yttrium (Y), aluminium (Al), boron (B) and gallium (Ga) organic complex of metal or The Organometal compound catalysts such as acylate.

Among these, from the aspect of reactivity is higher, preferably Sn, Ti, Zn, Zr, Hf, Ga, from preventing baking When crackle from the viewpoint of, more preferably Zn or Ti, from improve working life from the viewpoint of, especially preferably Zn.

As the Organometal compound catalyst containing zinc (Zn), praseodynium zinc can be enumerated, zinc stearate, double (acetylacetone,2,4-pentanedione) zinc (II) (monohydrate) etc..

As containing tin (Sn), titanium (Ti), zirconium (Zr), hafnium (Hf), the Organometal compound catalyst of gallium (Ga) example Son, for example, can preferably use the catalyst described in Japanese Patent Publication 2012-238636 publications.

As the catalyst, commercially available catalyst can also be used.For example, zinc system condensation catalyst D-15 can be enumerated (Shin-Etsu Chemical Co., Ltd. system) etc..

In the present invention, the catalyst can be used alone one kind, and can also in any combination and ratio uses two More than kind.Also, can also simultaneously it be used with reaction promoter or reaction suppressor.

From crackle when preventing baking and from the viewpoint of raising storage period, the content of preferably described catalyst is relative to institute Siloxane-based resin is stated for 0.01~10 mass %, more preferably 0.03~5.0 mass %.

- additive-

Furthermore it is possible to use other additives in the heat resistance decoration coloured composition.As the additive, 0017 section of No. 4502784 publications of Japanese Patent No., Japanese Patent Publication 2009-237362 publications can for example be enumerated Hot polymerization described in 0018 section of No. 4502784 publications of surfactant and Japanese Patent No. described in 0060~0071 section Close other additives described in 0058~0071 section of preventing agent and Japanese Patent Publication 2000-310706 publications.

More than, heat resistance decoration in the present invention has been stressed with the situation that coloured composition is non-photosensitive material, But the heat resistance decoration coloured composition can also be minus material or eurymeric material as needed.

(thickness)

The heat resistance decoration of the present invention is used as to the decorative layer of capacitive input device from raising with coloured composition When decorative layer hidden power from the viewpoint of, preferably apply the heat resistance decoration coloured composition when thickness be 1~ 40μm。

The thickness of more preferably described decorative layer is 1.5~38 μm, especially preferably 1.8~36 μm.

[manufacture method of capacitive input device]

The manufacture method (manufacture method of the following also known as present invention) of the capacitive input device of the present invention is tool There is front panel and at least there is the capacitance type input of the important document of following (1) and (3)~(5) in a surface side of the front panel The manufacture method of device：

(1) decorative layer；

Wherein, the manufacture method of the capacitive input device is characterised by including following process：Before described Apply the heat resistance decoration coloured composition of the present invention and at least (1) decorative layer described in formation in one surface side of panel.

In addition, the capacitive input device of the present invention can also have following (6)：

(6) another electric conductivity important document, another electric conductivity important document is electrically connected to the first transparent electrode pattern and described At least one of second electrode pattern, and it is different from the first transparent electrode pattern and the second electrode pattern.

Also, in the capacitive input device of the present invention, second electrode pattern can be transparent electrode pattern.Separately Outside, in this specification, second transparency electrode pattern is illustrated instead of second electrode pattern sometimes, but second electrode pattern Preferred embodiment it is also identical with the preferred embodiment of second transparency electrode pattern.

In addition, the manufacture method of capacitive input device of the present invention is preferably, be configured at before described (2) shielding layer is also formed on the face of the opposed one side opposite side of the front panel of (1) decorative layer of one surface side of plate.

The structure ＞ of ＜ capacitive input devices

First, the structure to the capacitive input device of the manufacture method formation by the present invention is illustrated.Fig. 1 Be represent the present invention capacitive input device in preferred structure sectional view.In Fig. 1, capacitive input device 10 by front panel 1, decorative layer 2a, shielding layer 2b, first transparent electrode pattern 3, second transparency electrode pattern 4, insulating barrier 5, lead Electrical important document 6 and protective clear layer 7 are constituted.

Front panel 1 is made up of light-transmitting substrates such as glass substrates, can be used with Corning Incorporated's Gorilla glass is strengthened glass of representative etc..In this specification, before the capacitive input device 10 for constituting the present invention In the surface of panel 1, the face referred to as contact surface that contact such as finger etc. will be made and inputted, by front panel 1 and contact surface phase The face of anti-side is referred to as noncontact face 1a.Hereinafter, front panel is referred to as " base material " sometimes.

Also, decorative layer 2a is provided with shielding layer 2b in the one side of front panel 1.Shielding layer 2b is in contact panel The pattern for the border shape around viewing area that one surface side of front panel is formed, in order to avoid observing arrangement distribution etc. and shape Into.

It is that dress is formed with decorative purpose between a surface side of contact panel front panel and shielding layer 2b on shielding layer 2b Adorn layer 2a.

In the capacitive input device 10 of the present invention, as shown in Fig. 2 it is preferred that a part of area to cover front panel 1 The mode in domain (being the region beyond input face in Fig. 2) sets decorative layer 2a, shielding layer 2b.In addition, on front panel 1, such as Fig. 2 Shown, a part of in the front panel can set opening portion 8.The mechanical switch of push type can be set in opening portion 8.With Make the strengthened glass of base material because intensity is higher and processing difficulties, therefore when forming the opening portion 8, typically in intensive treatment Intensive treatment is carried out after preceding formation opening portion 8.But, if making on substrate after the intensive treatment with the opening portion 8 Decorative layer 2a is disposably formed with decorative layer formation with liquid resist or screen painting ink, then produces resist composition from opening The leakage of oral area or be arranged at need the shielding layer that forms light-shielding pattern untill directly over the boundary line of front panel with The spilling (leakage) of resist composition from glass end in decorative layer between front panel, causes pollution front panel dorsal part sometimes The problem of.When forming decorative layer 2a several times with coloured composition with heat resistance decoration on the base material with opening portion 8, also It can solve the problem that this problem.

It is formed with the one side of front panel 1：Multiple first transparent electrode patterns 3, multiple pad portions are via coupling part Extend in a first direction and formed；Multiple second transparency electrode patterns 4, are electrically insulated with first transparent electrode pattern 3, and by along with Multiple pad portions formed by the direction extension that first direction intersects are constituted；And insulating barrier 5, make first transparent electrode pattern 3 It is electrically insulated with second transparency electrode pattern 4.The first transparent electrode pattern 3, second transparency electrode pattern 4 and conduction described later Property important document 6 is such as the conduction for being capable of the translucency as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide) Property metal oxide film make.As this metal film, ito film can be enumerated；The metal films such as Al, Zn, Cu, Fe, Ni, Cr, Mo； SiO₂Deng metal oxide film etc..Now, the thickness of each important document can be set to 10~200nm.Also, due to by burning till amorphous Ito film be made polycrystalline ito film, therefore resistance can also be reduced.Also, the first transparent electrode pattern 3, second is transparent Electrode pattern 4 and electric conductivity important document 6 described later can also use the electric conductivity curable resin group using aftermentioned conducting fibre Compound is manufactured.In addition, when forming first transparent electrode pattern etc. by ITO etc., may be referred to Japanese Patent No. 4506785 0014~0016 section etc. of number publication.

Also, at least one of first transparent electrode pattern 3 and second transparency electrode pattern 4 can be across front panels 1 One side and the two regions of the shielding layer 2b face of the face opposite side opposed with front panel 1 be configured.In Fig. 1, show Go out second transparency electrode pattern across front panel 1 and shielding layer 2b the while opposite side opposed with front panel 1 The two regions of face and the figure that sets.In this way, requiring certain thickness shielding layer and above back even in being across In the case of, print or be coated with several times by using the heat resistance decoration coloured composition of the present invention, also can be by simple Process formation and the continuous film in shaded portions border.

First transparent electrode pattern 3 and second transparency electrode pattern 4 are illustrated using Fig. 3.Fig. 3 is to represent the present invention In first transparent electrode pattern and second transparency electrode pattern the explanation figure of one.As shown in figure 3, first transparency electrode figure Case 3 is pad portion 3a extend in a first direction via coupling part 3b formed by.Also, second transparency electrode pattern 4 leads to Cross insulating barrier 5 and be electrically insulated with first transparent electrode pattern 3, and the direction (second party in Fig. 3 intersected by edge with first direction To) multiple pad portions compositions formed by extension.Here, when forming first transparent electrode pattern 3, can integratedly make The pad portion 3a and coupling part 3b, can also only make and (pattern is formed) welding disk is integratedly made after the 3b of coupling part Divide 3a and second transparency electrode pattern 4.When integratedly making (pattern is formed) pad portion 3a and second transparency electrode pattern 4 When, as shown in figure 3, being linked and first transparent electrode pattern 3 with a coupling part 3b part and pad portion 3a a part With second transparency electrode pattern 4 each layer is formed by way of insulating barrier 5 is electrically insulated.

In Fig. 1, conductive important document is set in the surface side of the shielding layer 2b one side opposite side opposed with front panel 1 6.Electric conductivity important document 6 is electrically connected at least one of first transparent electrode pattern 3 and second transparency electrode pattern 4 and with One transparent electrode pattern 3 and the different another electric conductivity important document of second transparency electrode pattern 4.In Fig. 1, show that another electric conductivity will Part 6 is connected to the figure of second transparency electrode pattern 4.

Also, in Fig. 1, the mode that each constitutive requirements are all covered is provided with protective clear layer 7.Protective clear layer 7 A part for each constitutive requirements can also be configured to only cover.Insulating barrier 5 and protective clear layer 7 can be identical materials, also may be used To be different materials.It is used as the material for constituting insulating barrier 5 and protective clear layer 7, the preferably higher material of case hardness, heat resistance Material, can use known photo-sensitive siloxane resin material, acrylic resin material etc..

Hereinafter, the manufacture method on the present invention, each layer is described in detail.

As the mode example formed during the manufacture method of the present invention, the mode of Fig. 4~8 can be enumerated.Fig. 4 is Expression is formed with the top view of one of the intensive treatment glass 11 of opening portion 8.Fig. 5 is to represent to be formed with decorative layer 2a, masking The top view of one of layer 2b front panel.Fig. 6 is to represent to be formed with one of the front panel of first transparent electrode pattern 3 to bow View.Fig. 7 is to represent to be formed with the vertical view of one of the front panel of first transparent electrode pattern 3 and second transparency electrode pattern 4 Figure.Fig. 8 is represent to be formed with the front panel of another electric conductivity important documents 6 different from first and second transparent electrode pattern one Top view.These are the figures of example for representing to embody described above, and the scope of the present invention is not limited by these accompanying drawings Property explain.

＜ (1) decorative layer ＞

In the manufacture method of the present invention, (1) decorative layer (below also known as " dyed layer ") uses the present invention at least by described in Heat resistance decoration formed with coloured composition.

In the capacitive input device of the opening portion 8 of structure with Fig. 2, if being decorated using the heat resistance of the present invention With coloured composition and Photocurable resin composition described later or with light-cured resin layer transfer film form Fig. 1 institutes The described decorative layer 2a and shielding layer described later etc. recorded, then on the substrate (front panel) with opening portion resist into Dividing will not also leak from opening portion, especially in the dress for needing to form light-shielding pattern untill directly over the boundary line of front panel Adorn in layer and shielding layer, coloring components will not overflow (leakage) from glass end, therefore will not pollute front panel dorsal part, can pass through Simple process manufactures thin layer and light-weighted contact panel.

The method that heat resistance decoration using the present invention forms the decorative layer with coloured composition is illustrated.One As, during using heat resistance decoration coloured composition, if comprising light-cured resin, can by common photolithography method come Formed.Here, the heat resistance decoration coloured composition of the present invention can include light-cured resin, it can also not include, It can be decorated under either case by applying and (such as printing or be coated with) in the method on substrate using the heat resistance of the present invention Decorative layer is formed with coloured composition.It is preferred that by printing the heat resistance decoration with coloured composition come in the front panel A surface side apply the heat resistance decoration coloured composition, more preferably screen painting.

As needed, can also developing apparatus known to Assembled brush and high-pressure injector etc..After development, as needed Post-exposure, rear baking can be carried out, is toasted after preferably carrying out.

Also, after applying and (such as printing or be coated with) the heat resistance decoration coloured composition of the present invention, in order to carry The adhesiveness of decorative layer in high drying process, can implement surface treatment in advance in the one side of base material (front panel).As institute Surface treatment is stated, the surface treatment (silane coupled processing) using silane compound (silane coupler) is preferable to carry out.It is used as silicon Alkane coupling agent, the preferably coupling agent with the functional group interacted with photoresist.For example, will be silane coupled by spray Liquid (the mass % aqueous solution of N- β (amino-ethyl) gamma-aminos propyl trimethoxy silicane 0.3, trade name：KBM603, Shin- Etsu Chemical Co., Ltd. system) 20 seconds are blown to carry out pure water cleaning showers.Afterwards, brought it about by heating anti- Should.Heating tank can be used, is preheated by the substrate of laminating machine, can also promote reaction.

(post-bake process)

It is preferred that applying and (such as printing or be coated with) the heat resistance decoration coloring compositions in a surface side of the front panel After thing, post-bake process is included after drying process.

In the manufacture method of the present invention, from the viewpoint of whiteness and productivity ratio is realized simultaneously, preferably before described One surface side of plate is applied after the heat resistance decoration coloured composition of the present invention, is heated in the environment of 0.08~1.2atm 180~300 DEG C and formed described in (1) decorative layer.

The heating of more preferably described rear baking is carried out in the environment of more than 0.5atm.On the other hand, more preferably exist Carry out, carried out particularly preferably under below 1.0atm environment under below 1.1atm environment.In addition, from without using special Decompressor and from the viewpoint of can reducing manufacturing cost, carried out more specifically preferably in the environment of about 1atm (atmospheric pressure). Here, when (1) decorative layer by described in is solidified to be formed by heating, entered under the reduced pressure atmosphere of low-down pressure in the past OK, and by reducing oxygen concentration the whiteness after baking is maintained, but colour cell is used by using the heat resistance decoration of the present invention Compound, the whiteness of decorative layer can be also improved after being toasted in the range of above-mentioned pressure.

The temperature of baking is more preferably 200~280 DEG C, especially preferably 220~260 DEG C after described.

The time of baking is more preferably 20~150 minutes, especially preferably 30~100 minutes after described.

It is described after baking can be carried out under air ambient, can also nitrogen substitution environment under progress, but from without using Special decompressor and from the viewpoint of can reducing manufacturing cost, carried out particularly preferably under air ambient.

(other processes)

The manufacture method of the present invention can have other processes such as post-exposure process.

When the heat resistance decoration coloured composition has light-cured resin layer, preferably the decorative layer is being formed When include post-exposure process.The post-exposure process can be opposed with the front panel from the surface of the decorative layer surface side Exposure, also, can also be exposed from the surface side of the one side opposite side opposed with the front panel, can also be from the decoration Two surface sides exposure of layer.

＜ (2) shielding layer ＞

In the manufacture method of the present invention, hardening resin composition formation shielding layer 2b, first transparency electrode are preferably used At least one in pattern 3, second transparency electrode pattern 4, insulating barrier 5, electric conductivity important document 6 and protective clear layer 7 as needed Individual important document.Also, preferably include following process：By transferring with the curable resin using hardening resin composition formation The transfer film of layer forms shielding layer 2b, first transparent electrode pattern 3, second transparency electrode pattern 4, insulating barrier 5, electric conductivity At least one important document in important document 6 and protective clear layer 7 as needed.In addition, " curable resin layer " is included the present invention Heat resistance decoration be film-made with coloured composition obtained from layer (decorative layer) and be made up of Photocurable resin composition " light-cured resin layer ".

Shielding layer 2b, first transparent electrode pattern 3, second transparency electrode pattern 4, insulating barrier 5, electric conductivity important document 6 and root At least one of protective clear layer 7 according to needs important document more preferably forms light-cured resin layer to make, and particularly preferably makes Formed with Photocurable resin composition.

For example, when forming black shielding layer 2b, as the decorative layer, Black coloring compositions or black can be used Have light-cured resin layer Photocurable resin composition, form the black cosmetic on the surface of the front panel 1 Layer.

In addition, by using Photocurable resin composition in the shielding layer 2b formation of light-proofness is required, being capable of shape Into shielding layer 2b of high-quality leaked in the absence of the light as caused by uneven, depression, bubble etc. etc..

When the photocuring constituted using the dyed layer that is made up of coloured composition or by the Photocurable resin composition When property resin bed is as shielding layer, colouring agent can be used.As the colouring agent used in the present invention, it can be adapted to using known Colouring agent (organic pigment, inorganic pigment, dyestuff etc.).In addition, in the present invention, can use white, black, red, blueness, Mixture of the pigment such as green etc..

Especially, when using the shielding layer as black shielding layer, from the viewpoint of optical concentration, preferably use black Chromatic colorant agent.As black colorant, such as can enumerate carbon black, titanium carbide, iron oxide, titanium dioxide, graphite, wherein, Preferably carbon black.

For the shielding layer as other colors, can be used in mixed way No. 4546276 publications of Japanese Patent No. 0183~ Pigment or dyestuff described in 0185 section of grade.Specifically, it can be adapted to use Japanese Patent Publication 2005-17716 publications 0038~0054 section described in pigment and dyestuff, 0068~0072 section of Japanese Patent Publication 2004-361447 publications Described pigment, colouring agent described in 0080~0088 section of Japanese Patent Publication 2005-17521 publications etc..

From the viewpoint of dispersion stabilization, number is preferably used for the colouring agent beyond the decorative layer that is used in the present invention The colouring agent of equal 0.001 μm~0.1 μm of particle diameter, more preferably 0.01 μm~0.08 μm of colouring agent.In addition, described herein " particle diameter " refer to the diameter that the electron micrograph image of particle is set to bowlder of the same area, also, " equal grains of number Footpath " refers to obtain the particle diameter for multiple particles, refers to this average value of 100.

It is preferred that light-cured resin layer is following structure.

As the monomer for light-cured resin layer, as long as without special without violating spirit of the invention Limitation, can use known polymerizable compound.

As the polymerizable compound, described in 0023~0024 section that Japanese Patent No. 4098550 can be used Polymerizable compound.

As the described adhesive for light-cured resin layer, as long as without spy without violating spirit of the invention Do not limit, known polymerizable compound can be used.

It is solvable comprising alkali preferably in Photocurable resin composition when Photocurable resin composition is minus material Property resin, polymerizable compound, polymerization initiator.Colouring agent, additive etc. can also be used, but is not limited to this.

As alkali soluble resin, can use 0025 section of Japanese Patent Publication 2011-95716 publications, Japan specially Polymer described in 0033~0052 section of the open 2010-237589 publications of profit.

When Photocurable resin composition is eurymeric material, preferably in light-cured resin layer using such as Japan specially Material that the open 2005-221726 of profit is recorded etc., but it is not limited to this.

As the Photoepolymerizationinitiater initiater for light-cured resin layer, Japanese Patent Publication can be used Polymerizable compound described in 0031~0042 section of 2011-95716 publications.

- additive-

In addition, additive can be used in the light-cured resin layer.As the additive, for example, it can use day 0017 section, 0060~0071 section of Japanese Patent Publication 2009-237362 publications of No. 4502784 publication of this patent is remembered Thermal polymerization inhibitor described in 0018 section of No. 4502784 publications of surfactant or Japanese Patent No. of load, in addition, can To enumerate other additives described in 0058~0071 section of Japanese Patent Publication 2000-310706 publications.

- solvent-

Also, as the solvent of Photocurable resin composition, Japanese Patent Publication 2011-95716 public affairs can be used Solvent described in 0043~0044 section of report.

More than, stress the situation that Photocurable resin composition is minus material, but the light-cured resin Composition can also be eurymeric material.

＜ (3) multiple pad portions via coupling part extend in a first direction formed by multiple first transparency electrode figures Case ＞

In the manufacture method of the capacitive input device of the present invention, preferably combined by using by light-cured resin The etched pattern of thing formation forms transparent conductive material etching process the first transparent electrode pattern, described second transparent At least one of electrode pattern and the electric conductivity important document.

On the other hand, in the manufacture method of capacitive input device of the invention, it is preferably formed as electric conductivity curability Resin bed makes at least one in the first transparent electrode pattern, the second electrode pattern and the electric conductivity important document Person, is more preferably formed using electric conductivity hardening resin composition.

That is, etching process or electric conductivity hardening resin composition is preferably used to form the first transparent electrode pattern 3。

(etching process)

When forming the first transparent electrode pattern 3 by etching process, the method for etching process does not have special limit System, the saturating of ITO etc. is formed for example, can enumerate and be formed with first by sputtering in the one side of shielding layer 2b etc. front panel 1 Prescribed electrode layer, then uses after the composition film with etching light-cured resin on the transparent electrode layer, leads to Cross mask exposure/development and form etched pattern, afterwards, etching transparent electrode layer forms transparent electrode pattern, by removing Etched pattern is come the method that forms the grade of first transparent electrode pattern 3.

, preferably will above before the composition with etching light-cured resin is film-made on the transparent electrode layer Plate is inserted into the antifouling board 13 described in Figure 10, and when substrate has opening portion 8 as shown in Figure 2, Figure 11 is inserted in the opening portion Described antifouling bolt 14.It is preferred that the antifouling board and the antifouling bolt are siloxanes system.

When using the transfer film with light-cured resin layer as etching resist (etched pattern), also may be used To obtain Resist patterns in the same manner as methods described.The etching can utilize Japanese Patent Publication 2010-152155 publications 0048~0054 section of grade described in known method come apply etching, resist peel off.

For example, as engraving method, the wet etching being impregnated in etching solution typically carried out can be enumerated.For wet Formula etching solution for etching properly selects acid type or the etching solution of alkaline type according to etch target.It is used as acid class The etching solution of type, can exemplify the aqueous solution, acid ingredient and the chlorination of the independent acid ingredient such as hydrochloric acid, sulfuric acid, fluoric acid, phosphoric acid Mixed aqueous solution of the salt such as iron, ammonium chloride, potassium permanganate etc..Acid ingredient can also use the multiple acid ingredients of combination Material.Also, as the etching solution of alkaline type, sodium hydroxide, potassium hydroxide, ammonia, organic amine, tetramethyl hydrogen can be exemplified The mixed aqueous solution of the salt such as the aqueous solution, alkali composition and potassium permanganate of the independent alkali composition such as salt of the organic amine of amine-oxides etc Deng.Alkali composition can also use the material for combining a variety of alkali compositions.

The temperature of etching solution is not particularly limited, but preferably less than 45 DEG C.In the present invention, used up using above-mentioned etching Curable resin layer forms the resin pattern as etching mask (etched pattern) with coating fluid, thus to this temperature province In acidity and alkaline etching liquid play especially excellent patience.Therefore, the stripping of resin pattern can be prevented in etching work procedure From, can with selective etch be not present resin pattern part.

After the etching, in order to prevent producing line pollution, matting/drying process can be carried out as needed.Close In matting, for example, base material can be cleaned with pure water at normal temperatures 10~300 seconds, it is suitable using blowing on drying process Locality adjustment blow gas pressure (0.1~5kg/cm²Left and right).

Then, be not particularly limited as the stripping means of resin pattern, can for example enumerate 30~80 DEG C, preferably The immersed substrate method of 5~30 minutes in stripper at 50~80 DEG C in stirring.As described above, being used as erosion in the present invention Show excellent chemical resistance when carving the resin pattern of mask below 45 DEG C, if but temperature of chemical liquid reaches more than 50 DEG C, Show the property of logical peralkaline stripper swelling.Due to this property, if carrying out stripping work using 50~80 DEG C of stripper Sequence, then with shortening activity time, and the advantage that tails off of stripping residue of resin pattern.That is, by the etching work procedure with It is poor to temperature of chemical liquid design temperature between stripping process, it is used as the resin pattern of etching mask in etching work procedure in the present invention Good chemical resistance is played, on the other hand, good fissility is showed in stripping process, chemical resistance can be met simultaneously Both opposite characteristics with fissility.

As stripper, the inorganic alkali composition such as can enumerate sodium hydroxide, potassium hydroxide and by tertiary amine, quaternary ammonium salt The stripping in water, dimethyl sulfoxide (DMSO), 1-METHYLPYRROLIDONE or their mixed solution is dissolved in etc. organic base composition Liquid.The stripper can also be used, is peeled off by spray-on process, spray process, sheathed immersion method etc..

(using the method for electric conductivity curable resin layer)

Also, curable resin layer can also be used as peeling off material forming first transparency electrode layer, second transparency electrode Layer and other electroconductive components.Now, using Photocurable resin composition the photo-curable in coating or temporary support body The transfer of resin is come after forming curable resin layer and carrying out pattern formation, in base material entire surface formation transparency conducting layer, it The dissolving for carrying out light-cured resin layer to transparency conducting layer of each accumulation afterwards is removed, desired thus, it is possible to obtain Pattern for transparent conductive layer (stripping method).

Contain conducting fibre etc. in the electric conductivity curable resin layer.

~electric conductivity curable resin layer (conducting fibre)~

When in the formation in transparent electrode pattern or another electric conductivity important document use by the electric conductivity curable resin layer During the transfer film being laminated, following conducting fibre etc. can be used for electric conductivity curable resin layer.

It is not particularly limited, can be properly selected according to purpose as the structure of conducting fibre, but is preferably real Any one in core structure and hollow-core construction.

Here, the fiber of solid construction is referred to as into " line (wire) " sometimes, the fiber of hollow-core construction is referred to as " pipe (tube)”.Also, sometimes by average minor axis length is 1nm~1000nm, average major axis length is 1 μm~100 μm electric conductivity Fiber is referred to as " nano wire ".

Also, it is sometimes that 1nm~1000nm, average major axis length are 0.1 μm~1000 μm and tool by average minor axis length The conducting fibre for having hollow-core construction is referred to as " nanotube ".

As the material of the conducting fibre, as long as conductive, it is not particularly limited, can be with according to purpose Properly select, but preferably in metal and carbon at least any one, among those, the particularly preferred conducting fibre For in metal nanometer line, metal nano-tube and CNT at least any one.

- metal nanometer line-

-- metal --

It is not particularly limited as the material of the metal nanometer line, for example, is preferably selected from long period table (IUPAC1991) at least one of the 4th cycle, the 5th cycle and the 6th cycle metal, more preferably selected from the 2nd race~14th At least one of race metal, more preferably selected from the 2nd race, the 8th race, the 9th race, the 10th race, the 11st race, the 12nd race, At least one of 13 races and the 14th race metal, are particularly preferably used as principal component comprising above-mentioned metal.

As the metal, can for example enumerate copper, silver, gold, platinum, palladium, nickel, tin, cobalt, rhodium, iridium, iron, ruthenium, osmium, manganese, Molybdenum, tungsten, niobium, tantalum, titanium, bismuth, antimony, lead and their alloy etc..Among those, it is excellent from the aspect of excellent electric conductivity Elect as mainly contain silver metal or containing silver and silver beyond metal alloy metal.

The silver is mainly contained to refer to, in metal nanometer line containing more than 50 mass %, preferably comprise 90 mass % with On silver.

As in the metal with being used in the silver-colored alloy, platinum, osmium, palladium and iridium etc. can be enumerated.These can be independent , can also be simultaneously using two or more using one kind.

-- shape --

It is not particularly limited as the shape of the metal nanometer line, can be properly selected, for example may be used according to purpose To use cylindric, cubic, section as arbitrary shapes such as polygonal columns, but requiring higher transparent purposes In, the round and smooth section shape in preferably cylindric, section polygonal angle.

The section shape of the metal nanometer line can be by the coating metal nano wire aqueous dispersions on base material, and utilize Transmission electron microscope (TEM) observes section to check.

The angle of the section of the metal nanometer line refer to extend section it is each while when with from it is adjacent while the vertical line phase that hangs down The periphery of the point of friendship.Also, " each side of section " refers to the straight line for linking these adjacent angles and angle.Now, " cutd open by described in The peripheral length in face " is set to sharpness relative to the ratio of the total length on " each side of section ".For example as shown in Figure 9 Metal nanometer line section in, sharpness can be with the peripheral length of section indicated by the solid line and the pentagon being indicated by a dotted line The ratio of peripheral length represent.The sharpness is defined as fillet section shape for less than 75% section shape.It is described sharp Sharp degree is preferably less than 60%, and more preferably less than 50%.If the sharpness is more than 75%, the angle locally lies in electronics, Increase because plasmon absorbs, remain yellow etc. sometimes and cause transparent variation.Also, the edge part of pattern sometimes Linearity declines, and produces loosening.The lower limit of the sharpness is preferably 30%, and more preferably 40%.

-- average minor axis length and average major axis length --

It is excellent as the average minor axis length (sometimes referred to as " average short axis diameter ", " average diameter ") of the metal nanometer line Elect below 150nm, especially preferably more preferably 1nm~40nm, more preferably 10nm~40nm, 15nm~35nm as.

If the average minor axis length is less than 1nm, oxidative resistance is deteriorated, and durability is deteriorated sometimes, if more than 150nm, Scattering is then produced because of metal nanometer line, the sufficient transparency can not be obtained sometimes.

On the average minor axis length of the metal nanometer line, transmission electron microscope (TEM is used；JEOL Ltd. System, JEM-2000FX) 300 metal nanometer lines of observation, the average minor axis length of metal nanometer line is obtained by its average value.Separately Outside, on the metal nanometer line and it is non-circular when minor axis length, most long minor axis length is set to minor axis length.

As the average major axis length (sometimes referred to as " average length ") of the metal nanometer line, preferably 1 μm~40 μm, More preferably 3 μm~35 μm, more preferably 5 μm~30 μm.

If the average major axis length is less than 1 μm, it is difficult to the mesh to form densification, can not be sufficiently led sometimes Electrically, if more than 40 μm, metal nanometer line is long and winds during fabrication, produces cohesion in the fabrication process sometimes Thing.

On the average major axis length of the metal nanometer line, such as using transmission electron microscope (TEM；JEOL Ltd. make, JEM-2000FX) 300 metal nanometer lines of observation, the average major axis length of metal nanometer line is obtained by its average value. In addition, when the metal nanometer line bending, it is considered to as the circle of arc, using the value calculated by its radius and flexometer as Long axis length.

From the sight of the technique adaptabilities such as developing time when drying when stability and the coating of coating fluid and pattern formation Point considers that the thickness of electric conductivity curable resin layer is preferably 0.1~20 μm, more preferably 0.5~18 μm, especially preferably 1 ~15 μm.From the viewpoint of electric conductivity and the stability of coating fluid, the conducting fibre solidifies relative to the electric conductivity The content of the total solid content of property resin bed is preferably 0.01~50 mass %, more preferably 0.05~30 mass %, especially It is preferably 0.1~20 mass %.

＜ (4) and the first transparent electrode pattern are electrically insulated and by along extending with the direction that the first direction intersects Multiple second electrode pattern ＞ that the multiple pad portions formed are constituted

It is preferred that second electrode pattern is transparent electrode pattern.The second transparency electrode pattern 4 can utilize the etching Processing or transfer film with electric conductivity curable resin layer are formed.Preferred embodiment now and described first transparent The forming method of electrode pattern 3 is identical.

＜ (5) makes the insulating barrier ＞ that the first transparent electrode pattern and the second transparency electrode pattern are electrically insulated

When forming insulating barrier 5, the dyed layer with insulating properties can be used as the transfer film of the dyed layer or The coloured composition of insulating properties or with insulating properties light-cured resin layer as the light-cured resin layer transfer Film or Photocurable resin composition, form described on the surface for the front panel 1 for being formed with first transparent electrode pattern Dyed layer or the light-cured resin layer of insulating properties.

In addition, when forming insulating barrier, from the viewpoint of insulating properties is maintained, preferably the thickness of insulating barrier is 0.1~5 μ M, especially preferably more preferably 0.3~3 μm, 0.5~2 μm.

＜ (6) be electrically connected at least one of the first transparent electrode pattern and the second transparency electrode pattern and Another electric conductivity important document ＞ different from the first transparent electrode pattern and the second transparency electrode pattern

The etching process or transfer film or electric conductivity with electric conductivity curable resin layer can be utilized to consolidate The property changed resin combination forms another electric conductivity important document 6.

＜ (7) protective clear layer ＞

When forming protective clear layer 7, it can consolidate by using with transparent light-cured resin layer as the light The transfer film or Photocurable resin composition of the property changed resin bed, turn on the surface for being formed with the front panel 1 of each important document The transparent dyed layer or transparent light-cured resin layer is printed to be formed.

It is excellent from the viewpoint of sufficient surface protecting function is played when using transfer film formation protective clear layer The thickness for selecting protective clear layer is 0.5~10 μm, especially preferably more preferably 0.8~5 μm, 1~3 μm.

《Capacitive input device and possess capacitive input device as constitutive requirements image show fill Put》

By the obtained capacitive input device of manufacture method of the present invention and possesses capacitance type input dress Putting can apply as the image display device of constitutive requirements《Newest contact panel technology》(on July 6th, 2009 is by Techno Times Co.Ltd. are issued), the chief editor of three paddy hero two, " technology of contact panel and exploitation ", CMC publish (2004.12), FPD International2009Forum T-11 speeches teaching material, Cypress Semiconductor Corporation application notes Structure disclosed in AN2292 etc..

Embodiment

Hereinafter, more specific description is carried out to the present invention by embodiment.

Material, usage amount, ratio, process content, processing sequence shown in following examples etc. are without departing from the present invention Objective, it is possible to suitably change.Therefore, the scope of the present invention should not by concrete example as shown below limited explanation. In addition, as long as no special declaration, then " % " and " part " is quality criteria.

[synthesis example 1]

The synthesis ＞ of ＜ tolyls trimethoxy silane ((4- aminomethyl phenyls) trimethoxy silane)

Magnesium is added in the four-hole boiling flask for the 500mL for possessing mixer, reflux cooler, dropping funel and thermometer 19.0g (0.784 mole) and tetrahydrofuran 300mL, then, adds the crystalline flake of iodine wherein.A small amount of tolyl chloride is added dropwise wherein Proceed by after reaction, the tolyl chloride for amounting to 94.4g (0.746 mole) is added dropwise at 5~10 DEG C, RMgBr is prepared.

Then, added in the four-hole boiling flask for the 1000mL for possessing mixer, reflux cooler, dropping funel and thermometer Methyl silicate 568g (3.73 moles), previously prepared RMgBr was added dropwise at a temperature of 60~70 DEG C through 2 hours.Afterwards Cooled down, filter separated out magnesium salts.Then, distillation removes solvent, also carries out rectifying and reclaims.Evaporating obtained by confirming The GC analysis results divided, GC purity is the result that 98.8%, NMR is analyzed and IR is analyzed, and has obtained tolyl trimethoxy silane (b.p.74~75 DEG C).

(synthesis of tolyl trimethoxy silane/MTMS 30mol%/70mol% condensation products)

25% 4 is added in the four-hole boiling flask for the 500mL for possessing mixer, reflux cooler, dropping funel and thermometer Ammonium hydroxide aqueous solution 2.1g and water 7.5g, then, adds 2- propyl alcohol 60mL and toluene 30mL.Wherein by methyl trimethoxy TMOS 26.6g (0.195 mole) and tolyl trimethoxy silane 17.8g (0.084 mole) toluene solution 30mL dresses Enter dropping funel, stir while being added dropwise at a temperature of 35~45 DEG C.The post curing of completion of dropwise addition 2 hours, is cooled to room After temperature, toluene 90mL and water 90mL is added in solution after the cooling period, product is extracted.Load separatory funnel, discharge aqueous phase it Afterwards, cleaned with dilute acetic acid aqueous solution after organic phase, discharge aqueous phase, 4 organic phases are then cleaned with water.Afterwards, with 0.5 μm Concentrated after PTFE filters filtering organic phase, the mass % of toluene 50 solution is prepared into, so as to obtain tolyl front three The toluene solution of TMOS/MTMS 30mol%/70mol% condensation products.

[synthesis example 2]

The synthesis ＞ of ＜ benzyl trimethoxy silanes

In synthesis example 1, equimolar benzyl chloride is used instead of tolyl chloride, in addition, in the same manner as synthesis example 1 Prepare benzyl trimethoxy silane.

(synthesis of benzyl trimethoxy silane/MTMS 30mol%/70mol% condensation products)

In the tolyl trimethoxy silane/MTMS 30mol%/70mol% condensations of synthesis example 1 In the synthesis of thing, equimolar benzyl trimethoxy silane is used instead of tolyl trimethoxy silane, in addition, with first The synthesis of phenyltrimethoxysila,e/MTMS 30mol%/70mol% condensation products is similarly carried out and obtained The toluene solution of benzyl trimethoxy silane/MTMS 30mol%/70mol% condensation products.

[synthesis example 3]

The synthesis ＞ of ＜ cumenyl trimethoxy silanes

In synthesis example 1, equimolar cumenyl chlorine is used instead of tolyl chloride, it is in addition, same with synthesis example 1 Prepare cumenyl trimethoxy silane sample.

(synthesis of cumenyl trimethoxy silane/MTMS 30mol%/70mol% condensation products)

In the tolyl trimethoxy silane/MTMS 30mol%/70mol% condensations of synthesis example 1 In the synthesis of thing, equimolar cumenyl trimethoxy silane is used instead of tolyl trimethoxy silane, in addition, Carried out in the same manner as synthesis with tolyl trimethoxy silane/MTMS 30mol%/70mol% condensation products and Obtain the toluene solution of cumenyl trimethoxy silane/MTMS 30mol%/70mol% condensation products.

[synthesis example 4]

(synthesis of tolyl trimethoxy silane/ethyl trimethoxy silane 30mol%/70mol% condensation products)

In synthesis example 1, instead of MTMS use equimolar ethyl trimethoxy silane, except this with Outside, carried out in the same manner as synthesis example 1 and obtain tolyl trimethoxy silane/ethyl trimethoxy silane 30mol%/ The toluene solution of 70mol% condensation products.

[synthesis example 5]

(synthesis of tolyl trimethoxy silane/propyl trimethoxy silicane 30mol%/70mol% condensation products)

In synthesis example 1, equimolar propyl trimethoxy silicane (synthesis example is used instead of MTMS 5), in addition, carried out in the same manner as synthesis example 1 and obtain tolyl trimethoxy silane/propyl trimethoxy silicane The toluene solution of 30mol%/70mol% condensation products.

[synthesis example 6]

(synthesis of MTMS/methyl dimethoxysilane 90mol%/10mol% condensation products)

In the tolyl trimethoxy silane/MTMS 30mol%/70mol% condensations of synthesis example 1 It is certain in the total molal quantity for the addition for keeping tolyl trimethoxy silane/MTMS in the synthesis of thing In the state of, 90mol%/10mol% side is reached with the mol ratio of MTMS and methyl dimethoxysilane Formula is added, in addition, is condensed with tolyl trimethoxy silane/MTMS 30mol%/70mol% The synthesis of thing similarly carries out and obtains MTMS/methyl dimethoxysilane 90mol%/10mol% condensations The toluene solution of thing (methyl-Hydrogen silicone resin).

[embodiment 1]

The preparation of the heat resistance decoration coloured composition of~present invention~

Formula as below L1 heat resistance decoration coloured composition is prepared, is coloured as the heat resistance decoration of embodiment 1 Composition.

(heat resistance decoration coloured composition：It is formulated L1)

- composition of white pigment dispersion 1-

Titanium dioxide (Ishihara Sangyo Kaisha, Ltd. CR-97；Alumina-zirconia handles rutile Type, 0.25 μm of primary particle size)：70.0 quality %

The random copolymer of the mol ratio of benzyl methacrylate/methacrylic acid=72/28, weight average molecular weight 3.7 Ten thousand)：3.5 mass %

Methyl ethyl ketone (Tonen Chemical Corporation. systems)：26.5 quality %

《The formation of decorative layer》

While by spraying to the intensive treatment glass (glass baseplate for being formed with opening portion (15mm Φ)：300mm× 400mm × 0.7mm) injection is adjusted to 25 DEG C of glass cleaning agent solution 20 seconds, while being entered with the rotation brush with nylon mao Row cleaning, and after carrying out pure water cleaning showers, pass through and spray injection silane coupling solution (N- β (amino-ethyl) gamma-amino propyl group The mass % aqueous solution of trimethoxy silane 0.3, trade name：KBM603, Shin-Etsu Chemical Co., Ltd.s system) 20 seconds Clock, and carry out pure water cleaning showers.Using base material preheating apparatus, after the glass baseplate is heated 10 minutes at 110 DEG C, Naturally cool to room temperature.On resulting silane coupled processing glass baseplate, above-mentioned heat resistance decoration coloring compositions are used Thing (formula L1), utilizes screen printer (MISHIMA Corporation systems；UDF-5L, 250 μm of mesh size), it will print With ink screen painting into frame pattern shape, and dried 10 minutes at 100 DEG C, thus obtain inviscid color white layer. The thickness of color white layer after ink setting is 6 μm.Will print in addition, being repeated as described above on color white layer The process that brush dries 10 minutes with ink screen painting into frame pattern shape and at 100 DEG C, carries out 6 printings and dries altogether Process.In addition, being dried 30 minutes at 150 DEG C, color white layer L1 is obtained.

Afterwards, using the baking oven for possessing exhaust equipment, under atmospheric pressure (1atm), 240 DEG C, 60 minutes are carried out in atmosphere Rear baking processing, color white layer L1 is made decorative layer, and determine the thickness of decorative layer by the following method, as a result, To the front panel for the decorative layer for being formed with 36 μm of thickness.

By the following method, brightness is determined from the one side for not forming decorative layer of front panel, as a result, L values are 84.6.And And, naked eyes judge the whiteness of the decorative layer of front panel by the following method, as a result, have no problem.In addition, passing through following methods Every 100cm of benzene yield when handling in decorative layer is toasted after progress²In be 19.1mg, be realistic scale.

(measure of thickness)

Determined using surface roughness measurement device P-10 (TENCOR Corporation systems) in intensive treatment glass The thickness for the decorative layer being formed with the front panel of decorative layer.By its result note in table 1 below.In addition, in table 1 below, " μ " table Show " μm ".

《It is formed with the evaluation of the front panel of decorative layer》

(evaluation of brightness)

It is formed with intensive treatment glass on the front panel of decorative layer, from the face opposite side with being formed with decorative layer Face is using black paper as pad, and using X-Rite, the Spectrodensitometer of Incorporated systems 938 determines L values, and Brightness is evaluated according to following metewands.Realistic scale is more than D, preferably more than C.

＜ metewands ＞

AA：L values are more than 87.

A：L values are 85 less than 87.

B：L values are 83 less than 85.

C：L values are 81 less than 83.

D：L values are 77 less than 81.

E：L values are less than 77.

By evaluation result note in table 1 below.

(evaluation of whiteness)

For as described above in intensive treatment glass formed decorative layer after under atmospheric pressure (1atm), enter in atmosphere Front panel formed by the rear baking processing that 240 DEG C, 60 minutes of row, from 60 are carried out from surface and the back side, and according to following Metewand is evaluated whiteness.Realistic scale is more than C.

＜ metewands ＞

A：Yellowy number is identified as 0~1

B：Yellowy number is identified as 2~3

C：Yellowy number is identified as 4~5

D：Yellowy number is identified as 6~10

E：Yellowy number is identified as more than 11

Color white layer L1 evaluation result is remembered in table 1 below.

(reticulate pattern evaluation)

In the environment of 23 DEG C, relative humidity 50%, the front panel that decorative layer is formed with intensive treatment glass is put After putting 24 hours, using reflected light and transmitted light, by microscope to the surface of the decorative layer of front panel and with being formed with dress The one side that the face of decorations layer is opposite is observed, and reticulate pattern is evaluated according to following benchmark.More than C is realistic scale.

＜ metewands ＞

A：Do not observe the generation of slight " fold " and extremely shallow " fold " completely on the decoration layer pattern surface of front panel, To be extremely good.

B：Only observed in a part for the central portion (central portion of width) on the decoration layer pattern surface of front panel The generation of extremely shallow " fold ", is good from then None- identified " fold " when opposite with being formed with decorative layer.

C：Front panel decoration layer pattern surface observation to a small amount of slight " fold " etc. generation, and from front panel Then None- identified " fold " when opposite with being formed with decorative layer, is the level being had no problem in practicality, is common.

D：Front panel decoration layer pattern surface observation to substantial amounts of slight " fold " etc. generation, and from front panel It is lighter uneven with being formed with also observing when opposite for decorative layer, it is poor level.

E：Entire surface on the decoration layer pattern surface of front panel observes the generation of slightly " fold " etc., from front panel It is uneven with being formed with also observing when opposite for decorative layer, it is the level of extreme difference.

The evaluation result of front panel is remembered in table 1 below.

(evaluation of yield)

Make 500 front panels that decorative layer is formed with intensive treatment glass, the receipts of the workable front panel of investigation Rate.

＜ metewands ＞

A：Yield, more than 94%, is unusual good level.

B：Yield, less than 94, is good level for 91%.

C：Yield, less than 91%, is common level for 88%.

D：Yield, less than 88%, is poor level for 83%.

E：Yield is less than 83%, is excessively poor level.

The evaluation result of front panel is remembered in table 1 below.

(evaluation of decorative layer adhesiveness)

According to JIS K 5600-5-6：ISO2409 (cross-section method), is formed with before decorative layer in intensive treatment glass On the decorative layer of plate, with 1mm width formation otch, grid is formed.Using adhesive tape (adhesive tape department of botany CT-18, Nichiban Co., Ltd.s system) carry out decorative layer peel test, see whether peeling and the pin hole that there is decor surface.C It is realistic scale above.

＜ metewands ＞

A：Decorative layer composition is not peeled off completely, is adhesiveness very good level.

B：Only there is the peeling of slight decorative layer composition in the marginal portion of otch, but grid part is completely without decorative layer The peeling of composition, is the level of good adhesion.

C：It is the common water of adhesiveness in peeling of the grid partially observable 0% less than 2% decorative layer composition It is flat.

D：It is the poor water of adhesiveness in peeling of the grid partially observable 2% less than 5% decorative layer composition It is flat.

E：It is the excessively poor level of adhesiveness in the peeling of the decorative layer composition of grid partially observable more than 5%.

The evaluation result of front panel is remembered in table 1 below.

(evaluation of opening portion dirt)

The opening portion perimeter that the front panel of decorative layer is formed with intensive treatment glass is carried out using microscope Whether observation, observation decorative layer composition exists as pollution.More than C is realistic scale.

＜ metewands ＞

A：It is extremely good in the dirt of opening portion edge unattached decorative layer composition completely.

B：Only in the slight dirt of opening portion viewed edge to decorative layer composition, but it is good for degree can be used.

C：Along the dirt that decorative layer composition is observed untill thickness direction number μm of glass or so from the edge of opening portion, but It can be used in practicality, be common.

D：The dirt of decorative layer composition is observed untill the center of thickness of glass from opening portion edge, is poor.

E：The dirt of decorative layer composition is observed untill the dorsal part of glass from opening portion edge, is excessively poor.

The evaluation result of front panel is remembered in table 1 below.

(evaluation of opening portion defect)

The opening portion perimeter that the front panel of decorative layer is formed with intensive treatment glass is carried out using microscope Observation, sees whether peeling and the pin hole that there is decorative layer composition.

＜ metewands ＞

A：The decorative layer composition of substrate near opening portion is not peeled off completely, is very good level.

B：Only there is the slight peeling of decorative layer composition at opening portion edge, but other parts do not have completely, are good water It is flat.

C：The peeling of decorative layer composition is observed in several μm of width ranges of opening portion perimeter, but can be made in practicality With being common.

D：The peeling of decorative layer composition is observed in the number mm width ranges of opening portion perimeter, is poor.

E：The peeling of decorative layer composition is observed in the number cm width ranges of opening portion perimeter, is excessively poor.

The evaluation result of front panel is remembered in table 1 below.

(benzene yield)

Heat resistance decoration is coated with intensive treatment glass with coloured composition (formula L1).Then, in 105 DEG C of baking oven Middle drying 30 minutes, obtains the intensive treatment glass with decorative layer.The decorative layer for taking certain area is cut from intensive treatment glass, is filled Enter in sample cell, using heating desorption apparatus, 280 DEG C, 15 minutes of heating condition (is included from during the heating of room temperature under He gas Between) under directly heat after, carry out GC-MS measure.

In calibration curve use commercially available benzene (reagent), be captured in by existing method after TENAX adsorption tubes, carry out with Sample identical heating desorption is determined.

GC tubing strings use Agilent Technologies DB-5MS, after being kept for 3 minutes at 40 DEG C, are risen Temperature is determined.MS detections, the quantitative middle chromatographic peak area using benzene are carried out with EI ionizations.

Heat desorption apparatus

Exabyte Japan Analytical Industry Co., Ltd. systems

Device name heats desorption apparatus

Model JTD-505III

·GC-MS

Exabyte Shimadzu Corporation systems

Device name gas chromatography mass spectrometer

Model QP2010Ultra

＜ metewands ＞

AA：Benzene yield is less than 0.01mg/100cm², it is extremely good.

A：Benzene yield is 0.01mg/100cm²Less than 9.2mg/100cm², it is good.

B：Benzene yield is 9.2mg/100cm²Less than 19mg/100cm², it is common.

C：Benzene yield is 19mg/100cm²Less than 29mg/100cm², can be used in practicality, be common.

D：Benzene yield is 29mg/100cm²More than, it is poor.

The evaluation result of front panel is remembered in table 1 below.

《The formation of shielding layer》

The preparation ＞ of ＜ shielding layer formation coating fluids

Prepare following shown shielding layer formation coating fluids：It is formulated K1.

(shielding layer formation coating fluid：It is formulated K1)

- composition of K pigment dispersion 1-

[changing 4]

- composition of R pigment dispersion 1-

Pigment (C.I. paratoneres 177)：18 mass %

(random copolymer of the mol ratio of benzyl methacrylate/methacrylic acid=72/28, divides equally adhesive 1 again Son amount 3.7 is ten thousand)：12 mass %

Propylene glycol monomethyl ether：70 mass %

The formation ＞ of ＜ shielding layers

Clean and be formed with before decorative layer in the same manner as the cleaning of the intensive treatment glass substrate in the formation of decorative layer Plate.

Use above-mentioned shielding layer formation coating fluid：K1 is formulated, screen printer (MISHIMA Corporation are utilized System；UDF-5L, 250 μm of mesh size) printing ink screen painting is dry 10 points into frame pattern shape, and at 100 DEG C Clock, thus obtains inviscid shielding layer.The thickness of shielding layer after ink setting is 2.2 μm.Afterwards, using with super-pressure The proximity type exposure machine (Hitachi High-Tech Electronics Engineering Co., Ltd.s system) of mercury vapor lamp, no Via exposed mask with light exposure 1000mJ/cm²(i rays) is exposed.

In addition, carry out 240 DEG C, 80 minutes rear baking processing, obtain optical concentration 4.0,2.0 μm of thickness shielding layer with And decorative layer is with the front panel sequentially formed of front panel, decorative layer and shielding layer.

《The formation of first transparent electrode pattern》

The formation ＞ of ＜ transparent electrode layers

The front panel for being formed with decorative layer and shielding layer is imported in vacuum chamber, SnO is used₂Containing ratio is 10 mass % ITO target (indiums:Tin=95:5 (mol ratios)), pass through DC magnetron sputtering (conditions：250 DEG C of temperature, the Ar Pressure of base material 0.13Pa, oxygen pressure 0.01Pa) thickness 40nm ito thin film is formed, obtain being formed with the front panel of transparent electrode layer.Ito thin film Sheet resistance be 80 Ω/.

The preparation ＞ of ＜ etching light-cured resin layer coating fluids

Prepare following shown etching light-cured resin layer coating fluids：It is formulated E1.

(etching light-cured resin layer coating fluid：It is formulated E1)

The formation ＞ of ＜ first transparent electrode patterns

Cleaning is formed with decorative layer, shielding layer, the front panel of transparent electrode layer and progress in the same manner as the formation of shielding layer Dry.Front panel is inserted into the silicone resin antifouling board 13 described in Figure 10, and in the opening portion (15mm of front panel Φ) the antifouling bolt 14 of the silicone resin described in insertion Figure 11.Then, prevent pollution front panel edge and antifouling board, with And opening portion edge and prevent inside bolt.Also, it is adjusted so that the surface of front panel and the surface of antifouling board 13 and antifouling The surface of bolt 14 becomes flat.

Pass through the glass baseplate with slit-shaped nozzle coating machine (FAS Japan systems, trade name：MH-1600), will be upper State etching light-cured resin layer coating fluid：Formula E1 is coated in intensive treatment glass (base material).Then, VCD is utilized (Minton dryer, TOKO OHKA KOGYO., Ltd. system), a part for solvent is dried 30 seconds and coating layer is eliminated After mobility, the unnecessary painting of substrates perimeter is removed by EBR (edge bead removes (Edge Bead Removal)) Cloth liquid, and 120 DEG C, the prebake conditions of 3 minutes are carried out, the etching that 2.0 μm of thickness is obtained in the intensive treatment glass is used up admittedly The property changed resin bed (liquid method against corrosion).

Utilize proximity type exposure machine (the Hitachi High-Tech Electronics with extra-high-pressure mercury vapour lamp Engineering Co., Ltd.s system) so that base material and exposed mask (the quartzy exposed mask with frame pattern) are vertical perpendicular Vertical state, 200 μm are set as by the distance between exposed mask face and etching light-cured resin layer, are used up from etching solid The property changed resin bed side is with light exposure 200mJ/cm²Carry out pattern exposure.

Front panel is unloaded from antifouling board 13, and unloads from the opening portion (15mm Φ) of substrate the antifouling bolt of silicone resin 14。

Then, using triethanolamine system developer solution (containing the mass % of triethanolamine 30, with pure water by trade name：T-PD2 (Fujifilm Corporation systems) dilutes 10 times of liquid), carry out 100 seconds development treatments at 25 DEG C, and using containing Surfactant washing liquid is (with pure water by trade name：T-SD3 (Fujifilm Corporation systems) dilutes 10 times of liquid), 20 seconds cleaning treatments are carried out at 33 DEG C.Then, using rotate brush wipe front panel, and from super-pressure washer jet injection Pure water, thus removes residue.In addition, carry out 130 DEG C, 30 minutes of rear baking processing, obtain being formed with decorative layer, shielding layer, The front panel of transparent electrode layer and etching light-cured resin layer pattern.

The front panel for being formed with decorative layer, shielding layer, transparent electrode layer and etching light-cured resin layer pattern is soaked Stain carries out processing (erosion in 100 seconds in the etching groove for being put into ITO etchants (hydrochloric acid, potassium chloride solution, 30 DEG C of liquid temperature) Quarter is handled), dissolving removes the transparent electrode layer for not being etched the exposed area with light-cured resin layer covering, obtains band decoration The front panel with transparency electrode layer pattern of layer, shielding layer and etching light-cured resin layer pattern.

Then, it will be impregnated in and be put into the front panel with transparency electrode layer pattern of light-cured resin layer pattern with etching Anticorrosive additive stripping liquid controlling (METHYLPYRROLIDONE, MEA, surfactant (trade name：Surfynol465, Air Products and Chemicals, Inc. system), 45 DEG C of liquid temperature) resist peel groove in, carry out 200 seconds processing (peel off Processing), etching light-cured resin layer is removed, obtains being formed with before decorative layer, shielding layer and first transparent electrode pattern Panel, the first transparent electrode pattern across the front panel one side and the shielding layer it is opposed with the front panel The two regions of the face of one side opposite side and be arranged to such as Fig. 1.

《The formation of insulating barrier》

The preparation ＞ of ＜ insulating barrier formation coating fluids

Prepare following shown insulating barrier formation coating fluids：It is formulated W1.

(insulating barrier formation coating fluid：It is formulated W1)

In addition, insulating barrier formation coating fluid：It is 4000Pa to be formulated 100 DEG C of viscosity after W1 solvent is removed sec。

Used up with the insulating barrier that etching forms 1.4 μ m thicks in the same manner as the formation of light-cured resin layer on front panel Curable resin layer.

Then, the distance between exposed mask the quartzy exposed mask of insulating barrier pattern (have) face and insulating barrier are set Determine into 100 μm, and with light exposure 150mJ/cm²(i rays) carries out pattern exposure.

Then, using sodium carbonate/bicarbonate system developer solution (with pure water by trade name：T-CD1(Fujifilm Corporation systems) 5 times of liquid of dilution), 50 seconds development treatments are carried out at 25 DEG C, and using containing surfactant Cleaning fluid is (with pure water by trade name：T-SD3 (Fujifilm Corporation systems) dilutes 10 times of liquid), enter at 33 DEG C 20 seconds cleaning treatments of row.Then, using rotate brush wipe front panel, and from super-pressure washer jet spray pure water, thus Remove residue.In addition, carrying out 230 DEG C, 60 minutes of rear baking processing, obtain being formed with decorative layer, shielding layer, the first transparent electricity The front panel of pole figure case and insulating layer pattern.

《The formation of second transparency electrode pattern》

The formation ＞ of ＜ transparent electrode layers

To being formed with decorative layer, shielding layer, first transparency electrode in the same manner as formation with the first transparent electrode pattern The front panel of pattern and insulating layer pattern carries out DC magnetron sputtering processing (conditions：The temperature 50 C of base material, Ar Pressure 0.13Pa, Oxygen presses 0.01Pa), thickness 80nm ito thin film is formed, so as to obtain being formed with decorative layer, shielding layer, first transparency electrode figure The front panel of case, insulating layer pattern and transparent electrode layer.The sheet resistance of ito thin film is 110 Ω/.

Etching light-cured resin layer coating fluid is used in the same manner as the formation of first transparent electrode pattern：It is formulated E1 Obtain being formed with decorative layer, shielding layer, first transparent electrode pattern, insulating layer pattern, transparent electrode layer and etching photocuring Property resin layer pattern front panel (rear baking processing；130 DEG C, 30 minutes).

In addition, (30 DEG C, 50 seconds) are etched in the same manner as the formation of first transparent electrode pattern removing (45 DEG C, 200 seconds) etching light-cured resin layer, thus obtain being formed with decorative layer, shielding layer, first transparent electrode pattern, absolutely The front panel of edge layer pattern and second transparency electrode pattern, the second transparency electrode pattern across the front panel one side and The two regions of the face of the one side opposite side opposed with the front panel of the shielding layer and be arranged to such as Fig. 1.

《The formation of another electric conductivity important document different from first and second transparent electrode pattern》

In the same manner as formation with first and second transparent electrode pattern to being formed with decorative layer, it is shielding layer, first saturating The front panel of prescribed electrode pattern, insulating layer pattern and second transparency electrode pattern carries out DC magnetron sputtering processing, is formed with The front panel of thickness 200nm aluminium (Al) film.

Light-cured resin layer coating fluid is used in the same manner as formation with first and second transparent electrode pattern：Match somebody with somebody Square E1 obtains being formed with decorative layer, shielding layer, first transparent electrode pattern, insulating layer pattern, second transparency electrode pattern, aluminium thin (rear baking is handled with the front panel of light-cured resin layer pattern for film and etching；130 DEG C, 30 minutes).

In addition, (30 DEG C, 50 seconds) are etched in the same manner as the formation of first transparent electrode pattern removing (45 DEG C, 200 seconds) etching light-cured resin layer, thus obtain being formed with decorative layer, shielding layer, first transparent electrode pattern, absolutely Edge layer pattern, second transparency electrode pattern and another electric conductivity important document different from first and second transparent electrode pattern Front panel.

《The formation of protective clear layer》

Formed in the same manner as being formed of insulating barrier to different with first and second described transparent electrode pattern another Layer of cloth formation coating fluid is applied on the front panel of electric conductivity important document：Formula W1 is simultaneously dried, not via exposed mask With light exposure 200mJ/cm²The exposure of (i rays) whole face, and developed, post-exposure (1000mJ/cm²), rear baking processing, obtain With cover decorative layer, shielding layer, first transparent electrode pattern, insulating layer pattern, second transparency electrode pattern and with first and Whole modes of the different another electric conductivity important document of second transparency electrode pattern are laminated with insulating barrier (transparent guarantor as shown in Figure 1 Sheath) front panel 1.Using resulting front panel 1 as embodiment 1 capacitive input device.

《The making of image display device (contact panel)》

Fitted on the liquid crystal display cells manufactured by the method described in Japanese Patent Publication 2009-47936 publications Previously fabricated front panel 1 (capacitive input device of embodiment 1), and made by known method by electrostatic capacitance The image display device 1 for the embodiment 1 that type input unit possesses as constitutive requirements.

《The overall evaluation of front panel 1 and image display device 1》

Decorative layer is formed in above-mentioned each operation, it is shielding layer, first transparent electrode pattern, insulating layer pattern, second transparent The front panel 1 of electrode pattern and another electric conductivity important document different from first and second transparent electrode pattern be (embodiment 1 Capacitive input device) at opening portion and the back side without dirt, cleaning is easy, and miscellaneous part does not have pollution problem.

Also, it is pin-free in decorative layer, whiteness, uneven also have no problem.Shielding layer is equally pin-free, and light-proofness It is excellent.

Also, first transparent electrode pattern, second transparency electrode pattern and another electric conductivity important document different from them Respective electric conductivity has no problem, on the other hand, has insulation between first transparent electrode pattern and second transparency electrode pattern Property.

In addition, protective clear layer has obtained the excellent image display device of display characteristic also without defects such as bubbles.

[embodiment 2]

The preparation ＞ of ＜ electric conductivity decorative layer formation coating fluids

(preparation of nano silver wire dispersion (1))

Prepare the silver nitrate solution that silver nitrate powder 0.51g is dissolved in pure water 50mL.Afterwards, in the silver nitrate solution Middle addition 1N ammoniacal liquor adds pure water so that total amount reaches 100mL to prepare annex solution A up to bleach.

Also, dissolve glucose powder 0.5g to prepare annex solution G with 140mL pure water.

In addition, dissolving HTAB (cetyl-trimethylammonium bromide) powder 0.5g to prepare addition with 27.5mL pure water Liquid H.

Then, the annex solution A20.6mL is loaded in three-necked flask, be stirred at room temperature.By funnel, at this Pure water 41mL, annex solution H20.6mL and annex solution G16.5mL are added in liquid successively, at 90 DEG C through 5 hours one side with 200rpm is stirred while heating, thus obtains nano silver wire water dispersion (1).

After nano silver wire water dispersion (1) obtained by cooling, stir while adding the silver relative to 1 mass and being 0.05 polyvinylpyrrolidone (trade name：K-30, Wako Pure Chemical Industries, Ltd. system).Afterwards, Resulting solution centrifugal is separated, conductivity is purified to and reaches below 50 μ S/cm.In addition, addition propylene glycol monomethyl ether is gone forward side by side Row is centrifuged.Then, water is removed, propylene glycol monomethyl ether is finally added, prepares nano silver wire solvent dispersion (1) (silver nanoparticle Line dispersion (1)).

(preparation of electric conductivity decorative layer formation coating fluid)

The following compositions of stirring, and mixed with nano silver wire dispersion (1) so that final silver concentration reaches 1.0 mass % to make Coating fluid C1 is used in standby electric conductivity decorative layer formation.

- electric conductivity decorative layer formation use coating fluid C1 composition-

《The formation of transparent electrode pattern and insulating barrier etc.》

Obtain being formed with after the front panel of decorative layer and shielding layer similarly to Example 1, instead of etching photocuring Property resin bed coating fluid：It is formulated E1 and uses the formation of electric conductivity decorative layer to use coating fluid C1, in the following sequence laminated conductive Decorative layer forms first transparent electrode pattern.

First, cleaning is formed with the front panel of decorative layer and shielding layer, has slit by the shielding layer side in front panel The glass baseplate of shape nozzle coating machine (FAS Japan systems, trade name：MH-1600) formation of applying conductive decorative layer is applied Cloth liquid C1 is simultaneously dried, and obtains the electric conductivity decorative layer of 2.0 μm of thickness.Exposed mask (had into the stone of transparent electrode pattern English exposed mask) the distance between face and the electric conductivity decorative layer be set to 100 μm, with light exposure 100mJ/cm²(i rays) enters Row pattern exposure.

Then, using sodium carbonate/bicarbonate system developer solution (with pure water by trade name：T-CD1(Fujifilm Corporation systems) 5 times of liquid of dilution), 60 seconds development treatments are carried out at 25 DEG C, and using containing surfactant Cleaning fluid is (with pure water by trade name：T-SD3 (Fujifilm Corporation systems) dilutes 10 times of liquid), enter at 33 DEG C 20 seconds cleaning treatments of row.Then, using rotate brush wipe front panel, and from super-pressure washer jet spray pure water, thus Remove residue.In addition, carrying out 230 DEG C, 60 minutes of rear baking processing, obtain being formed with shielding layer, first transparent electrode pattern Front panel.

Then, insulating barrier is formed similarly to Example 1.Then, with the first transparency electrode figure in the present embodiment 2 Similarly laminated conductive decorative layer forms second transparency electrode pattern for the formation of case.In addition, being formed similarly to Example 1 Another electric conductivity important document different from first and second transparent electrode pattern and protective clear layer obtain front panel 2.By this It is used as the capacitive input device of embodiment 2.Also, the image display device of embodiment 2 is made similarly to Example 1 2。

《The evaluation of front panel 2 and image display device 2》

Decorative layer is formed in above-mentioned each operation, it is shielding layer, first transparent electrode pattern, insulating layer pattern, second transparent The front panel 2 of electrode pattern and another electric conductivity important document different from first and second transparent electrode pattern in opening portion and The back side is without dirt, and cleaning is easy, and miscellaneous part does not have pollution problem.

Also, it is pin-free in shielding layer, and light-proofness is excellent.

Also, first transparent electrode pattern, second transparency electrode pattern and another electric conductivity important document different from these Respective electric conductivity has no problem, on the other hand, has insulation between first transparent electrode pattern and second transparency electrode pattern Property.

In addition, also having obtained the excellent image display device of display characteristic without defects such as bubbles in protective clear layer.

[embodiment 3~10]

In preparation of the heat resistance decoration with coloured composition (formula L1) of embodiment 1, instead of silicone resin KR- 311 and use silicone resin KR-300 (embodiment 3), silicone resin KR-282 (embodiment 4), silicone resin KR-300 With silicone resin KR-282 solid constituent equal amount of mixture (embodiment 5), silicone resin KR-271 (embodiment 6), silicon Oxygen alkane resin KR-255 (embodiment 7), silicone resin KR-212 (embodiment 8), silicone resin KR-9706 (embodiment 9), Silicone resin KR-5230 (embodiment 10), in addition, the heat resistance decoration coloured composition (formula with embodiment 1 L1 preparation) similarly (solid constituent addition is identical) prepare embodiment 3~10 heat resistance decoration with coloured composition (point It is not set to be formulated L3~L10).

The heat resistance of embodiment 3~10 is used to fill instead of the heat resistance decoration coloured composition used in embodiment 1 Decorations coloured composition, i.e. using the adhesive shown in table 1 below, in addition, make be formed with similarly to Example 1 The front panel of decorative layer.The evaluation result of resulting front panel is remembered in table 1 below.Afterwards, make similarly to Example 1 Be formed with decorative layer, shielding layer, first transparent electrode pattern, insulating layer pattern, second transparency electrode pattern and first and second The capacitance type input of the embodiment 3~10 of the different another electric conductivity important document of transparent electrode pattern and protective clear layer Device is front panel 3~10, the image display device 3~10 for possessing capacitive input device as constitutive requirements.

The brightness of front panel 3~10, whiteness, reticulate pattern, yield, decorative layer adhesiveness, opening portion dirt, opening portion lack Damage as realistic scale.

Also, shielding layer is pin-free, and light-proofness is excellent.

[embodiment 11~13]

Instead of system of the heat resistance decoration for embodiment 5 with the white pigment dispersion 1 of coloured composition (formula L5) Used titanium dioxide (Ishihara Sangyo Kaisha, Ltd. CR-97) (alumina-zirconia processing gold when standby Red stone-type, 0.25 μm of primary particle size) and Ishihara Sangyo Kaisha are used respectively, Ltd. CR-60 is (at aluminum oxide Manage rutile-type, 0.21 μm of primary particle size, embodiment 11), Ishihara Sangyo Kaisha, Ltd. CR-50 (oxidation Aluminium handle rutile-type, 0.25 μm of primary particle size, embodiment 12), Ishihara Sangyo Kaisha, Ltd. CR-58 (alumina treatment rutile-type, 0.28 μm of primary particle size, embodiment 13), in addition, decorates with the heat resistance of embodiment 5 and uses The heat resistance decoration coloured composition that the preparation of coloured composition is prepared as embodiment 11~13 (is set to formula L11~L13).

The heat resistance of embodiment 11~13 is used to fill instead of the heat resistance decoration coloured composition used in embodiment 5 Decorations coloured composition, in addition, makes the front panel for being formed with decorative layer similarly to Example 5.Before resulting The evaluation result of panel is remembered in table 1 below.Afterwards, make similarly to Example 5 and be formed with decorative layer, it is shielding layer, first saturating Prescribed electrode pattern, insulating layer pattern, second transparency electrode pattern, another conduction different from first and second transparent electrode pattern The capacitive input device of the embodiment 11~13 of property important document and protective clear layer is front panel 11~13, by electrostatic The image display device 11~13 that capacitor type input unit possesses as constitutive requirements.

Front panel 11~13 does not have fouling problem in opening portion and the back side, and cleaning is easy, and miscellaneous part does not pollute and asked Topic.

Also, it is pin-free in shielding layer, and light-proofness is excellent.

[embodiment 14~19]

Instead of by relative to total solid content mass parts of the heat resistance decoration of embodiment 5 with coloured composition (formula L5) Content of titanium dioxide be set to 44 mass parts and be changed to respectively 20 mass parts (embodiment 14), 26 mass parts (embodiment 15), 32 mass parts (embodiment 16), 36 mass parts (embodiment 17), 60 mass parts (embodiment 18), 75 mass parts (embodiment 19), In addition, the preparation with the heat resistance decoration coloured composition of embodiment 5 is prepared as the heat-resisting of embodiment 14~19 Property decoration coloured composition (being set to be formulated L14~L19).

The heat resistance of embodiment 14~19 is used to fill instead of the heat resistance decoration coloured composition used in embodiment 5 Decorations coloured composition, in addition, makes the front panel for being formed with decorative layer similarly to Example 5.Before resulting The evaluation result of panel is remembered in table 1 below.Afterwards, make similarly to Example 5 and be formed with decorative layer, it is shielding layer, first saturating Prescribed electrode pattern, insulating layer pattern, second transparency electrode pattern, another conduction different from first and second transparent electrode pattern The capacitive input device of the embodiment 14~19 of property important document and protective clear layer is front panel 14~19, by electrostatic The image display device 14~19 that capacitor type input unit possesses as constitutive requirements.

It is all to be evaluated as realistic scale in the range of 20 mass parts to 75 mass parts from the result of table 1 below. It is described in more detail, as titanium dioxide containing ratio from 20 mass parts increases to 75 mass parts, yield, decorative layer adhesiveness, opening Portion's defect somewhat declines, but is realistic scale, and the tendency for becoming good is presented in whiteness, reticulate pattern, opening portion dirt.On light Degree, the mass parts of 38 mass parts~60 are most good region.

Also, it is pin-free in shielding layer, and light-proofness is excellent.

[embodiment 20~22]

It is anti-instead of phosphoric acid/hindered phenol series in preparation of the heat resistance decoration with coloured composition (formula L5) of embodiment 5 Oxidant Sumilizer GP and respectively use phosphate antioxidant IRGAFOS168 (BASF Japan Ltd. systems, embodiment 20), phosphate antioxidant IRGAFOS38 (BASF Japan Ltd. systems, embodiment 21), phosphoric acid/hindered phenol series antioxidant IRGAMOD295 (BASF Japan Ltd. systems, embodiment 22), in addition, colour cell is used with the heat resistance decoration of embodiment 5 The heat resistance decoration coloured composition that the preparation of compound (formula L5) is prepared as embodiment 20~22 (is set to formula L20~L22).

The heat resistance of embodiment 20~22 is used to fill instead of the heat resistance decoration coloured composition used in embodiment 5 Decorations coloured composition, in addition, makes the front panel for being formed with decorative layer similarly to Example 5.Before resulting The evaluation result of panel is remembered in table 2 below.Afterwards, make similarly to Example 5 and be formed with decorative layer, it is shielding layer, first saturating Prescribed electrode pattern, insulating layer pattern, second transparency electrode pattern, another conduction different from first and second transparent electrode pattern The capacitive input device of the embodiment 20~22 of property important document and protective clear layer is front panel 20~22, by electrostatic The image display device 20~22 that capacitor type input unit possesses as constitutive requirements.

The whiteness for front panel 5 of front panel 20 and 21 somewhat becomes good, and other are identical, are realistic scale.

The evaluation result for front panel 5 of front panel 22 do not change, identical, is realistic scale.

[embodiment 23 and 24]

Instead of the thickness of the decorative layer formed in embodiment 5 is set into 36 μm of (embodiments 5；6 printing coatings) and be set to 18 μm of (embodiments 23；3 printing coatings) or 42 μm of (embodiments 24；7 printing coatings) form the dress of embodiment 23 and 24 Layer is adornd, in addition, the front panel for being formed with decorative layer is made similarly to Example 5.By the evaluation of resulting front panel As a result remember in table 2 below.Afterwards, similarly to Example 5 make be formed with decorative layer, shielding layer, first transparent electrode pattern, Insulating layer pattern, second transparency electrode pattern, another electric conductivity important document different from first and second transparent electrode pattern and The capacitive input device of the embodiment 23 and 24 of protective clear layer is front panel 23 and 24 and capacitance type is defeated Enter the image display device 23 that device possesses as constitutive requirements.

Front panel 23 and 24 for front panel 5 brightness, whiteness, yield, reticulate pattern, decorative layer adhesiveness, open Oral area dirt and opening portion defect are realistic scale.

Front panel 23 and 24 does not have fouling problem in opening portion and the back side, and cleaning is easy, and miscellaneous part does not pollute and asked Topic.

Also, it is pin-free in shielding layer, and light-proofness is excellent.

[embodiment 25]

In preparation of the heat resistance decoration with coloured composition (formula L20) of embodiment 20, instead of silicone resin KR- 300 add with silicone resin KR-282 solid constituent equal amount of mixture in the total solid content for not changing silicone resin The equal amount of mixture of solid constituent 1/1 in the state of amount using silicone resin KR-300 and silicone resin KR-311 is (real Apply example 25), in addition, it is prepared as with the heat resistance decoration of embodiment 20 with the preparation of coloured composition (formula L20) Heat resistance decoration coloured composition (is set to be formulated L25), is used as the heat resistance decoration coloured composition of embodiment 25.

Using embodiment 25 heat resistance decoration with coloured composition (formula L25) be change into it is viscous shown in table 2 below Mixture, in addition, makes the front panel for being formed with decorative layer similarly to Example 20.By the evaluation of resulting front panel As a result remember in table 2 below.Afterwards, make similarly to Example 20 and be formed with decorative layer, shielding layer, first transparency electrode figure Case, insulating layer pattern, second transparency electrode pattern, another electric conductivity important document different from first and second transparent electrode pattern, And the capacitive input device of the embodiment 25 of protective clear layer is front panel 25, makees capacitive input device The image display device 25 possessed for constitutive requirements.

Front panel 25 whiteness, decorative layer adhesiveness, opening portion dirt, opening portion defect for front panel 20 have Declined, but be realistic scale, in addition, the evaluation result of brightness, yield, reticulate pattern is identical, it is realistic scale.

Front panel 25 does not have fouling problem in opening portion and the back side, and cleaning is easy, and miscellaneous part does not have pollution problem.

Also, it is pin-free in shielding layer, and light-proofness is excellent.

[embodiment 26]

In preparation of the heat resistance decoration with coloured composition (formula L25) of embodiment 25, used in heat resistance decoration Addition is condensed relative to the total solid content addition of silicone resin for 4 mass % zinc system in colour cell compound (formula L25) Catalyst D-15 (Shin-Etsu Chemical Co., Ltd. system) prepares the heat resistance decoration coloring compositions of embodiment 26 Thing (is set to be formulated L26).

The resistance to of embodiment 26 is used instead of the heat resistance decoration coloured composition (formula L25) used in embodiment 25 Hot decoration coloured composition, in addition, makes the front panel for being formed with decorative layer similarly to Example 25.By gained The evaluation result of the front panel arrived is remembered in table 2 below.Afterwards, similarly to Example 25 make be formed with decorative layer, shielding layer, It is first transparent electrode pattern, insulating layer pattern, second transparency electrode pattern, different from first and second transparent electrode pattern another The capacitive input device of the embodiment 26 of one electric conductivity important document and protective clear layer be front panel 26, by electrostatic electricity The image display device 26 that appearance type input unit possesses as constitutive requirements.

Front panel 26 whiteness, decorative layer adhesiveness, opening portion dirt, opening portion defect for front panel 25 have Declined, but be realistic scale, in addition, the evaluation result of brightness, yield, reticulate pattern is identical, it is realistic scale.

Also, it is pin-free in shielding layer, and light-proofness is excellent.

[embodiment 27 and 28]

In preparation of the heat resistance decoration with coloured composition (formula L26) of embodiment 26, instead of by silicone resin KR-300 and silicone resin KR-311 solid constituent ratio is set to 1/1 (embodiment 26) and is set to 3/7 (embodiment 27), 7/3 (embodiment 28), in addition, the preparation with heat resistance decoration coloured composition (the formula L26) of embodiment 26 The heat resistance decoration for being prepared as (the total solid content addition of silicone resin is identical) embodiment 27 and 28 uses colour cell Compound (is set to be formulated L27 and L28).

The heat resistance of embodiment 27 and 28 is used instead of the heat resistance decoration coloured composition used in embodiment 26 Decoration coloured composition, in addition, makes the front panel for being formed with decorative layer similarly to Example 26.Will be resulting The evaluation result of front panel is remembered in table 2 below.Afterwards, make similarly to Example 26 and be formed with decorative layer, shielding layer, first Transparent electrode pattern, insulating layer pattern, second transparency electrode pattern, different from first and second transparent electrode pattern another lead The capacitive input device of the embodiment 27 and 28 of electrical important document and protective clear layer is front panel 27 and 28, will be quiet The image display device 27 and 28 that electric capacitor type input unit possesses as constitutive requirements.

The brightness of front panel 27 and 28, whiteness, reticulate pattern, yield, decorative layer adhesiveness, opening portion dirt, opening portion Defect is realistic scale.

Also, it is pin-free in shielding layer, and light-proofness is excellent.

[embodiment 29~33]

In preparation of the heat resistance decoration with coloured composition (formula L26) of embodiment 26, instead of silicone resin KR- 300 with the equal amount of mixture of silicone resin KR-311 solid constituent 1/1 and (implemented using silicone resin KR-400 respectively Example 29), silicone resin KR-500 (embodiment 30), silicone resin KR-400 and silicone resin KR-500 solid constituent (the embodiment of solid constituent ratio than=3/7 (embodiment 31), silicone resin KR-400 and silicone resin KR-500=7/3 32), silicone resin KR-400, silicone resin KR-500 and silicone alkoxy oligomer X-40-9225 solid constituent Than=70/30/2.5 (embodiment 33), in addition, (the total solid content addition of silicone resin similarly to Example 26 Amount is identical) prepare the heat resistance decoration coloured composition (be set to formula L29~L33) of embodiment 29~33.

The resistance to of embodiment 29~33 is used respectively instead of the heat resistance decoration coloured composition used in embodiment 26 Hot decoration coloured composition, in addition, makes the front panel for being formed with decorative layer similarly to Example 26.By gained The evaluation result of the front panel arrived is remembered in table 2 below.Afterwards, similarly to Example 26 make be formed with decorative layer, shielding layer, It is first transparent electrode pattern, insulating layer pattern, second transparency electrode pattern, different from first and second transparent electrode pattern another The capacitive input device of the embodiment 29~33 of one electric conductivity important document and protective clear layer be front panel 29~33, The image display device 29~33 that capacitive input device is possessed as constitutive requirements.

The brightness of front panel 29~33, whiteness, reticulate pattern, yield, decorative layer adhesiveness, opening portion dirt, opening portion Defect is realistic scale.

Also, it is pin-free in shielding layer, and light-proofness is excellent.

[embodiment 34~39]

In preparation of the heat resistance decoration with coloured composition (formula L26) of embodiment 26, instead of silicone resin KR- 300 with the equal amount of mixture of silicone resin KR-311 solid constituent 1/1 respectively using synthesis example 1 condensation product toluene Solution (embodiment 34：Methyl-toluene fundamental mode silicone resin), the toluene solution (embodiment 35 of the condensation product of synthesis example 2：First Base-phenyl type silicone resin), the toluene solution (embodiment 36 of the condensation product of synthesis example 3：Methyl-isopropylbenzene fundamental mode siloxanes Resin), the toluene solution (embodiment 37 of the condensation product of synthesis example 4：Ethyl-toluene fundamental mode silicone resin), the contracting of synthesis example 5 Toluene solution (the embodiment 38 of compound：Propyl group-toluene fundamental mode silicone resin), the toluene solution of the condensation product of synthesis example 6 it is (real Apply example 39：Methyl-Hydrogen silicone resin) as the species of silicone resin, in addition, (silicon similarly to Example 26 The total solid content addition of oxygen alkane resin is identical) prepare the heat resistance decoration coloured composition of embodiment 34~39 (respectively It is set to be formulated L34~L39).

The resistance to of embodiment 34~39 is used respectively instead of the heat resistance decoration coloured composition used in embodiment 26 Hot decoration coloured composition, in addition, makes the front panel for being formed with decorative layer similarly to Example 26.By gained The evaluation result of the front panel arrived is remembered in table 2 below.Afterwards, similarly to Example 26 make be formed with decorative layer, shielding layer, It is first transparent electrode pattern, insulating layer pattern, second transparency electrode pattern, different from first and second transparent electrode pattern another The capacitive input device of the embodiment 34~39 of one electric conductivity important document and protective clear layer be front panel 34~39, The image display device 34~39 that capacitive input device is possessed as constitutive requirements.

The brightness of front panel 34~39, whiteness, reticulate pattern, yield, decorative layer adhesiveness, opening portion dirt, opening portion Defect is realistic scale.

Also, it is pin-free in shielding layer, and light-proofness is excellent.

[embodiment 40 and 41]

In preparation of the heat resistance decoration with coloured composition (formula L1) of embodiment 1, using changing into silica respectively Alkane resin KR-251 (embodiment 40), the mixture of silicone resin KR-251 and X-40-9246 solid constituent 9/1 (are implemented Example 41) heat resistance decoration with coloured composition (be formulated L40 and L41) be to change into the adhesive shown in table 2 below, except this with Outside, (the total solid content addition of silicone resin is identical) prepares the heat resistance of embodiment 40 and 41 similarly to Example 1 Decoration coloured composition (is set to be formulated L40 and L41).

Heat resistance instead of the heat resistance decoration coloured composition of embodiment 1 respectively using embodiment 40 and 41 is decorated With coloured composition, in addition, the front panel for being formed with decorative layer is made similarly to Example 1.Before resulting The evaluation result of plate is remembered in table 2 below.Afterwards, make similarly to Example 1 and be formed with decorative layer, it is shielding layer, first transparent Electrode pattern, insulating layer pattern, second transparency electrode pattern, another electric conductivity different from first and second transparent electrode pattern The capacitive input device of the embodiment 40 and 41 of important document and protective clear layer be front panel 40 and 41, by electrostatic electricity The image display device 40 and 41 that appearance type input unit possesses as constitutive requirements.

The brightness of front panel 40 and 41 is greatly improved for front panel 1, whiteness, reticulate pattern, yield, dress It is realistic scale to adorn layer adhesiveness, opening portion dirt, opening portion defect.

Also, it is pin-free in shielding layer, and light-proofness is excellent.

[comparative example 1]

In preparation of the heat resistance decoration with coloured composition (formula L1) of embodiment 1, instead of silicone resin KR- 311 and following polyamic acids (in table 2 below, being designated as polyimides) of same solid content are added to use, in addition, Heat resistance decoration coloured composition (formula is prepared as with the preparation of coloured composition with the heat resistance decoration of embodiment 1 L51).Using resulting heat resistance decoration with coloured composition as comparative example 1 heat resistance decoration coloured composition.

(polymerization of the polyamic acid of polyimide precursor)

Load the mass parts of 4,4 '-di-2-ethylhexylphosphine oxide (cyclohexylamine) 210 in reaction vessel, and be dissolved in N- methyl -2- pyrroles After the mass parts of alkanone 2860, stir under nitrogen flowing while being slowly added to the powder of pyromellitic acid anhydride wherein 218 mass parts, and reacted 8 hours at 35 DEG C, thus obtain transparent and sticky polyamic acid solution.

Use the heat resistance of comparative example 1 to decorate instead of the heat resistance decoration coloured composition used in embodiment 1 to use Coloured composition (formula L51), in addition, forms decorative layer is formed with intensive treatment glass similarly to Example 1 Front panel 51.After being carried out to the front panel 51 for being formed with decorative layer after baking processing, 350 DEG C were warming up to through about 20 seconds, Carry out being heat-treated for 7 minutes at 350 DEG C, so as to complete the imidizate of polyamic acid.

Afterwards, make similarly to Example 1 and be formed with decorative layer, shielding layer, first transparent electrode pattern, insulating barrier figure Case, second transparency electrode pattern, another electric conductivity important document different from first and second transparent electrode pattern and transparency protected The capacitive input device of the comparative example 1 of layer is front panel 51 and will using capacitive input device as composition Part and the image display device 51 possessed.The evaluation result of the front panel 51 of resulting comparative example 1 is remembered in table 2 below.

Front panel 51 whiteness, decorative layer adhesiveness, opening portion defect, yield for front panel 1 are remarkably decreased, For NG levels.Opening portion and the back side do not have fouling problem, and cleaning is easy, and miscellaneous part does not have pollution problem.

Also, front panel 51 is pin-free in shielding layer, and light-proofness is excellent.

[comparative example 2]

In preparation of the heat resistance decoration with coloured composition (formula L1) of embodiment 1, instead of silicone resin KR- 311 and the acrylic adhesives 1 that add same solid content (rub benzyl methacrylate/methacrylic acid=72/28 In the random copolymer of your ratio, weight average molecular weight 3.7 ten thousand, table 2 below it is designated as acrylic acid) use, in addition, with embodiment The preparation of 1 heat resistance decoration coloured composition is prepared as the heat resistance decoration coloured composition (formula of comparative example 2 L52)。

Use the heat resistance of comparative example 2 to decorate instead of the heat resistance decoration coloured composition used in embodiment 1 to use Coloured composition (formula L52), in addition, makes be formed with decorative layer similarly to Example 1, shielding layer, first transparent Electrode pattern, insulating layer pattern, second transparency electrode pattern, another electric conductivity different from first and second transparent electrode pattern The capacitive input device of the comparative example 2 of important document and protective clear layer is front panel 52 and inputs capacitance type The image display device 52 that device possesses as constitutive requirements.By the evaluation result of the front panel 52 of resulting comparative example 2 Note is in table 2 below.

Front panel 52 whiteness, decorative layer adhesiveness, opening portion defect, yield for front panel 1 are remarkably decreased, For NG levels.Opening portion and the back side do not have fouling problem, and cleaning is easy, and miscellaneous part does not have pollution problem.

Also, front panel 52 is pin-free in shielding layer, and light-proofness is excellent.

, can be with higher by using the heat resistance decoration coloured composition of the present invention from above-mentioned table 1 and table 2 Yield transferred after brightness, whiteness, the white decorative layer of reticulate pattern and good adhesion.

Also, as described above, according to the electrostatic electricity of the invention of the heat resistance decoration coloured composition using the present invention The manufacture method of appearance type input unit, can be manufactured by simple process with high-quality has thin layer and light-weighted advantage Capacitive input device.Therefore, it is known that by the present invention manufacture method manufacture capacitive input device and The use of the image display device of the input unit is high-quality.

In addition, according to the preferred mode of the manufacture method of the capacitive input device of the present invention, it is known that even if In the case where using the substrate with opening portion, the dirt of the spilling (leakage) and front panel dorsal part (noncontact surface side) of resist Dye is also less.

Symbol description

1- front panels, the noncontact face of 1a- front panels, 2a- decorative layers, 2b- shielding layers, 3- first transparent electrode patterns, 3a- pad portions, 3b- coupling parts, 4- second transparency electrode patterns, 5- insulating barriers, 6- electric conductivity important documents, 7- is transparency protected Layer, 8- opening portions, 10- capacitive input devices, 11- intensive treatment glass, another key element of electrical conductivities of 12-, 13- is antifouling Plate, the antifouling bolts of 14-, the directions of C- the 1st, the directions of D- the 2nd.

Claims

1. a kind of manufacture method of capacitive input device, the capacitive input device has a front panel, and A surface side in the surface of the front panel at least has the important document of following (1) and (3)~(5)：

(1) decorative layer；

(3) multiple first transparent electrode patterns, the plurality of first transparent electrode pattern is multiple pad portions via coupling part Formed by extending in a first direction；

(4) multiple second electrode patterns, the plurality of second electrode pattern is electrically insulated with the first transparent electrode pattern, and by edge Multiple pad portions formed by the direction extension intersected with the first direction are constituted；And

(5) insulating barrier, the insulating barrier makes the first transparent electrode pattern and the second electrode pattern be electrically insulated,

The manufacture method of the capacitive input device is characterised by, including following process：

Heat resistance decoration coloured composition is applied in a surface side of the front panel and (1) decorative layer is at least formed,

The heat resistance decoration comprises at least (A) white inorganic pigment, (B) siloxane-based resin and (C) with coloured composition Antioxidant,

The heat resistance decoration is the ornamental composition of capacitive input device front panel with coloured composition,

(B) siloxane-based resin includes pure siloxane resin, and the pure siloxane resin at least contains with following in intramolecular The siloxane structure that formula (1) is represented：

[changing 1]

In formula (1), R¹Independently represent the alcoxyl of hydrogen atom, halogen atom, carbon number for 1~20 straight-chain, branched or ring-type Straight-chain, branched or ring-type that alkyl, the carbon number of straight-chain, branched or ring-type that base, carbon number are 1~20 are 1~20 The aryl or carbon number that alkenyl, the carbon number of straight-chain, branched or ring-type that substitution alkyl, carbon number are 2~20 are 6~20 be 7~ 20 aralkyl.

2. the manufacture method of capacitive input device according to claim 1, it is characterised in that

The capacitive input device also has (6) another electric conductivity important document, and another electric conductivity important document is electrically connected to institute State at least one of first transparent electrode pattern and the second electrode pattern, and with the first transparent electrode pattern and institute State second electrode pattern different.

3. the manufacture method of capacitive input device according to claim 1 or 2, it is characterised in that

The second electrode pattern is transparent electrode pattern.

4. the manufacture method of capacitive input device according to claim 1 or 2, it is characterised in that

The thickness of (1) decorative layer is 1~40 μm.

5. the manufacture method of capacitive input device according to claim 1 or 2, it is characterised in that

A surface side in the surface of the front panel is applied after the heat resistance decoration coloured composition, 0.08~ It is heated to 180~300 DEG C in the environment of 1.2atm and (1) decorative layer described in being formed.

6. the manufacture method of capacitive input device according to claim 5, it is characterised in that

The heating is carried out under air ambient.

7. the manufacture method of capacitive input device according to claim 1 or 2, it is characterised in that

The process of (1) decorative layer is carried out by printing the heat resistance decoration with coloured composition described in formation.

8. the manufacture method of capacitive input device according to claim 1 or 2, it is characterised in that

In the surface of (1) decorative layer with and the face of the opposed face opposite side of the front panel on also form (2) masking Layer.

9. the manufacture method of capacitive input device according to claim 8, it is characterised in that

In the one side of the front panel and the surface of (2) shielding layer with and the opposed face opposite side of the front panel The two regions of face and at least one of (3) first transparent electrode pattern and (4) second electrode pattern are set.

10. the manufacture method of capacitive input device according to claim 8, it is characterised in that

The capacitive input device also has (6) another electric conductivity important document, and another electric conductivity important document is electrically connected to institute State at least one of first transparent electrode pattern and the second electrode pattern, and with the first transparent electrode pattern and institute State second electrode pattern different,

(6) another electric conductivity important document at least provided with the surface of (2) shielding layer with and the front panel it is opposed The surface side of face opposite side.

11. the manufacture method of capacitive input device according to claim 1 or 2, it is characterised in that

Protective clear layer is also formed in all or part of mode of the important document of (1) described in covering and (3)~(5).

12. the manufacture method of capacitive input device according to claim 11, it is characterised in that

The protective clear layer is formed using hardening resin composition.

13. the manufacture method of capacitive input device according to claim 1 or 2, it is characterised in that

(4) second electrode pattern is transparent electrode pattern,

Transparent conductive material is etched by using the etched pattern formed by hardening resin composition to be formed (3) first transparent electrode pattern, (4) second electrode pattern and (6) another electric conductivity important document.

14. the manufacture method of capacitive input device according to claim 1 or 2, it is characterised in that

(4) second electrode pattern is transparent electrode pattern,

(3) first transparent electrode pattern, (4) second electrode pattern are formed using electric conductivity hardening resin composition At least one of and (6) another electric conductivity important document.

15. the manufacture method of capacitive input device according to claim 1 or 2, it is characterised in that

It is surface-treated in the one side of the front panel,

Hardening resin composition is applied in the one side of the front panel for having been carried out the surface treatment.

16. the manufacture method of capacitive input device according to claim 15, it is characterised in that

Silane compound is used in the surface treatment of the front panel.

17. the manufacture method of capacitive input device according to claim 1 or 2, it is characterised in that

The front panel has opening portion at least a portion.

18. the manufacture method of capacitive input device according to claim 1 or 2, it is characterised in that

In the formula (1), R¹It is 1~20 straight-chain, the alkyl of branched or ring-type, carbon independently to represent hydrogen atom, carbon number The aryl that the substitution alkyl or carbon number for straight-chain, branched or the ring-type that number is 1~6 are 6~9.

19. the manufacture method of capacitive input device according to claim 1 or 2, it is characterised in that

In the formula (1), R¹Independently represent hydrogen atom, methyl or tolyl.

20. the manufacture method of capacitive input device according to claim 1 or 2, it is characterised in that

The white inorganic pigment is 20 relative to the containing ratio of the total solid content of the heat resistance decoration coloured composition ~75 mass %.

21. the manufacture method of capacitive input device according to claim 1 or 2, it is characterised in that

The white inorganic pigment is the rutile titanium dioxide after being handled with mineral surfaces.

22. the manufacture method of capacitive input device according to claim 21, it is characterised in that

Rutile titanium dioxide after being handled with the mineral surfaces is at least to use any one in aluminum oxide, zirconium oxide Rutile titanium dioxide after mineral surfaces processing.

23. a kind of capacitive input device, it is characterised in that

The capacitive input device passes through the capacitive input device any one of claim 1 to 22 Manufacture method is manufactured.

24. a kind of image display device, it is characterised in that

Described image display device possesses capacitive input device described in claim 23 as constitutive requirements.