CN104508608A - Method for manufacturing capacitive input device, capacitive input device, as well as image display device provided with same - Google Patents
Method for manufacturing capacitive input device, capacitive input device, as well as image display device provided with same Download PDFInfo
- Publication number
- CN104508608A CN104508608A CN201380035907.5A CN201380035907A CN104508608A CN 104508608 A CN104508608 A CN 104508608A CN 201380035907 A CN201380035907 A CN 201380035907A CN 104508608 A CN104508608 A CN 104508608A
- Authority
- CN
- China
- Prior art keywords
- layer
- mentioned
- electrode pattern
- transparent electrode
- input device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
Abstract
The present invention provides a method for manufacturing a capacitive input device which: can acquire, with a high yield, a decorative layer that, although being thin, is of superior brightness and whiteness; can resolve the concern for shorting metal wiring; and can manufacture a capacitive input device that has been made to be thin and light, using simple steps, so as to be of high quality. The invention is a method of manufacturing a capacitive input device which has a front plate and at least the following elements (1) to (3) on a non-contact side of the front plate, wherein the method of manufacturing the capacitive input device is characterized in stacking, on the non-contact side of the front plate, the elements (1), (2), and (3) in the order mentioned. (1) a decorative layer that includes inorganic white pigment and a binder, and that is of thickness greater than or equal to 1 mum and less than 30 mum (2) a reflective layer comprising an inorganic laminate or metal (3) a mask layer
Description
Technical field
The present invention relates to and a kind ofly the contact position of finger can be detected as the decoration transfer film of the capacitive input device of the change of electrostatic capacitance, the manufacture method of capacitive input device and the capacitive input device of gained and comprise the image display device of described capacitive input device as inscape by described manufacture method in order to manufacture.
Background technology
In the electronic equipments such as mobile phone, auto navigation, personal computer, ticket machine, banking terminal, in recent years at the input media of surface configuration flat board (tablet) type of liquid-crystal apparatus etc., the place of the described indicating images of touching display such as the finger of the indicating image one side shown by image display area of one side reference liquid-crystal apparatus or pointer, carries out the information input corresponding with indicating image thus.
There is resistive film type, capacitance type etc. in this kind of input media (touch-screen).But resistive film type input device is 2 pieces of structures of film and glass, is the structure pressed film and make its short circuit, therefore there is operating temperature range narrow or change the shortcoming weakened in time.
In contrast, capacitive input device has the advantage only forming light transmitting conductive film at one piece of substrate.In described capacitive input device, such as have the device as Types Below: on cross one another direction, electrode pattern is extended, detect interelectrode electrostatic capacitance change when finger etc. contacts and detect input position (such as with reference to following patent documentation 1).
And, as capacitive input device, also the device as Types Below is had: homophase, idiostatic alternating current are applied to the two ends of light transmitting conductive film, detect finger contact or close to and form capacitor (capacitor) time the weak current that flows, thus detect input position.As this kind of capacitive input device, disclose and have the capacitive input device comprising following person: make multiple pad part extend formed multiple first transparent electrode patterns in a first direction via coupling part, via interlayer insulating film with above-mentioned first transparent electrode pattern electrical isolation, and multiple second transparent electrode patterns (such as with reference to following patent documentation 2) comprising multiple pad part extending in the direction intersected with first direction and formed.But at made capacitive input device upper strata prestack panel, therefore there is capacitive input device thickening and become heavy problem in described capacitive input device.
In addition, the capacitance type touch-screen (such as with reference to following patent documentation 3) being integrally formed with mask layer, sensing circuit, interlayer insulating film at the noncontact side surface of front panel is disclosed.In described patent documentation 3, capacitance type touch-screen due to front panel integrated with capacitive input device, therefore becoming can thin layer/lightweight, and cover sensing circuit by mask layer in addition, therefore device appearance improves.
[prior art document]
[patent documentation]
[patent documentation 1] Japanese Patent Laid-Open 2007-122326 publication
[patent documentation 2] Jap.P. No. 4506785 publication
[patent documentation 3] Japanese Patent Laid-Open 2009-193587 publication
[patent documentation 4] Japanese Patent Laid-Open 2011-218561 publication
[patent documentation 5] Japanese Patent Laid-Open 2008-169237 publication
[patent documentation 6] Japanese Patent Laid-Open 2011-197220 publication
Summary of the invention
The problem that invention will solve
In patent documentation 3, only there is the record that can be formed mask layer by black resin or other opaque coating materials, but if necessary in the decorative layer arranging various tone (black, white, Neutral colour (pastel color), metallic luster etc.) between above-mentioned mask layer and front panel, can particularly require the brightness and the whiteness that improve white in finish layer in recent years wherein.
As the method arranging described decorative layer, present main flow is the method utilizing coating liquid resist or screen printing etc.
On the other hand, at liquid crystal or organic electric-excitation luminescent (electroluminescence, EL) display have smart mobile phone (smartphone) or tablet personal computer (the personal computer of capacitance type touch-screen, PC) in, develop, issue and to use in the front panel (face of direct finger contact) with the gorilla glass of healthy and free from worry (Corning) company (gorilla glass) (registered trademark) tempered glass that is representative.
The people such as the present inventor are studied, if result is known for using decorative layer formation liquid resist or screen printing ink and form white in finish layer on described hardened glass substrate, then form white in finish layer in order to the liquid resist that uses screening capacity little or screen printing ink, must divide and carry out the coating of liquid resist and screen printing for several times, thus there are the following problems: produce the bubble, the inequality that cause therefrom, cause because number of steps the costs such as productive rate minimizing lower and be not easy more.In addition, there is following problem points after tempered glass arranges decorative layer: if heat in the step in order to make the circuit such as transparency conducting layer, then whiteness reduces.
Relative to this, as the white films that thermotolerance is high, propose following multilayer film, the feature of above-mentioned multilayer film is: the layer comprising the white heat-hardening resin composition of at least not siliceous in fact in molecule containing (A) thermoset resin and (B) white color agents is located at least one side (such as with reference to patent documentation 4) of polyimide film.But it exists following problem points similarly: if carry out high-temperature heating in the step in order to make the circuit such as transparency conducting layer, then whiteness reduces.
Similarly, as the film that thermotolerance is high, propose following white polyimide film, above-mentioned white polyimide film can make the polyimide precursor film being mixed with Chinese white making diamines and aromatic tetracarboxylic acid react in the polyamic acid of gained carry out imidizate and obtain (such as with reference to patent documentation 5).But it exists following problem points similarly: if carry out high-temperature heating in the step in order to make the circuit such as transparency conducting layer, then whiteness reduces.
As the mechanism effectively utilizing diffusion light, propose following light diffusive reflective film, above-mentioned smooth diffusive reflective film is at least sequentially formed at the one side of plastic foil: the light diffusion layer containing resin and transparent particle and metallic reflector (such as with reference to patent documentation 6).
But, the resin used in described smooth diffusive reflective film and the thermotolerance of transparent particle low, similarly there is following problem points: when carrying out the situation of high-temperature heating in the step in order to make the circuit such as transparency conducting layer, whiteness reduce.
As mentioned above, present inventor has performed research, result is known when utilizing the situation of the lamellar white in finish layer of method shape described in these documents, cannot obtain the white in finish layer of the performance of the brightness after meeting transfer printing and whiteness.And known being also difficult to obtains with high yield the white in finish layer meeting above-mentioned characteristic.
The present invention for solve problem be to provide: even if can with high yield obtain thin layer, the white in finish layer that brightness and whiteness are also good, can with easy step high-quality manufacture can thin layer/light-weighted capacitive input device capacitive input device manufacture method and utilize described manufacture method and the capacitive input device of gained and use the image display device of described capacitive input device.
The technological means of dealing with problems
To this, the whiteness of the present inventor to white decorative layer is studied repeatedly further, found that the reflection horizon by arranging specific composition at decorative layer, even if thin layer can be obtained with high yield, the decorative layer that brightness and whiteness are also good, and, the worry of the short circuit of metal wiring during the reflection horizon importing specific composition is eliminated by arranging insulativity mask layer, can with easy step high-quality manufacture can thin layer/light-weighted capacitive input device, thus complete the present invention.
The present invention as the concrete means in order to solve above-mentioned problem is as described below.
[1] manufacture method for capacitive input device, above-mentioned capacitive input device comprises front panel, at least comprises the key element of following (1) ~ (3) in the noncontact side of above-mentioned front panel,
The feature of the manufacture method of above-mentioned capacitive input device is: sequentially stacked above-mentioned (1), above-mentioned (2) and above-mentioned (3) in the noncontact side of above-mentioned front panel:
(1) comprise inorganic white pigment and bonding agent, thickness is more than 1 μm and decorative layer less than 30 μm
(2) duplexer of inorganics or the reflection horizon of metal is comprised
(3) mask layer.
The manufacture method of the capacitive input device [2] as described in [1], wherein,
Above-mentioned reflection horizon preferably comprises metal.
The manufacture method of the capacitive input device [3] as described in [1] or [2], wherein,
The thickness in above-mentioned reflection horizon is preferably more than 100nm.
The manufacture method of the capacitive input device [4] according to any one of [1] ~ [3], wherein,
Be preferably use contain the transfer film of chromatograph and at least formed above-mentioned (1).
The manufacture method of the capacitive input device [5] according to any one of [1] ~ [4], wherein,
Preferably comprise: after stacked above-mentioned (1) decorative layer, under the environment of 0.08atm ~ 1.2atm, be heated to the step of 110 DEG C ~ 300 DEG C.
The manufacture method of the capacitive input device [6] according to any one of [1] ~ [5], wherein,
Be preferably stacked transparent electrode pattern in the key element of above-mentioned (3).
The manufacture method of the capacitive input device [7] according to any one of [1] ~ [5], wherein,
Be preferably the key element of stacked following (4) ~ (6) in the key element of above-mentioned (3):
(4) multiple pad part extends in a first direction via coupling part and multiple first transparent electrode patterns formed
(5) with above-mentioned first transparent electrode pattern electrical isolation, the direction intersected with above-mentioned first direction extends and multiple second electrode patterns comprising multiple pad part that formed
(6) insulation course of above-mentioned first transparent electrode pattern and above-mentioned second electrode pattern electrical isolation is made.
The manufacture method of the capacitive input device [8] as described in [7], wherein,
Be preferably at least one of above-mentioned first transparent electrode pattern and above-mentioned second electrode pattern be arranged to across the noncontact face of above-mentioned front panel and aforementioned mask layer with the both sides region in the face of opposition side, above-mentioned front panel side.
The manufacture method of the capacitive input device [9] as described in [7] or [8], wherein,
Being preferably above-mentioned second electrode pattern is transparent electrode pattern.
The manufacture method of the capacitive input device [10] according to any one of [7] ~ [9], wherein,
Above-mentioned capacitive input device preferably comprise (7) and above-mentioned first transparent electrode pattern and above-mentioned second electrode pattern further at least one be electrically connected, the electric conductivity key element different from above-mentioned first transparent electrode pattern and above-mentioned second electrode pattern.
The manufacture method of the capacitive input device [11] as described in [10], wherein,
Be preferably, at least at above-mentioned mask layer, above-mentioned (7) other electric conductivity key elements be set with the side, face of front panel opposition side.
The manufacture method of the capacitive input device [12] as described in [10] or [11], wherein,
Preferably further (8) protective clear layer is set in all or part of mode of the key element covering above-mentioned (1) ~ (7).
The manufacture method of the capacitive input device [13] as described in [12], wherein,
Be preferably to use and sequentially comprise the transfer film of temporary support, thermoplastic resin, ray hardening resin layer, the ray hardening resin layer of the above-mentioned transfer film of transfer printing and form above-mentioned protective clear layer.
The manufacture method of the capacitive input device [14] according to any one of [10] ~ [13], wherein,
Be preferably use by sequentially comprise temporary support, thermoplastic resin, ray hardening resin layer transfer film and the etched pattern that formed carries out etch processes to transparent conductive material, form above-mentioned first transparent electrode pattern, above-mentioned second electrode pattern and above-mentioned electric conductivity key element at least one thus.
The manufacture method of the capacitive input device [15] according to any one of [10] ~ [14], wherein,
Be preferably to use and sequentially comprise the transfer film of temporary support, thermoplastic resin, electric conductivity ray hardening resin layer, the electric conductivity ray hardening resin layer of the above-mentioned transfer film of transfer printing and form at least one of above-mentioned first transparent electrode pattern, above-mentioned second electrode pattern and above-mentioned electric conductivity key element.
The manufacture method of the capacitive input device [16] according to any one of [1] ~ [15], wherein,
Preferably surface treatment is carried out to the noncontact face of above-mentioned front panel, the noncontact face implementing the above-mentioned front panel of above-mentioned surface-treated arranges decorative layer.
The manufacture method of the capacitive input device [17] as described in [16], wherein,
Preferably in the surface treatment of above-mentioned front panel, use silane compound.
The manufacture method of the capacitive input device [18] according to any one of [1] ~ [17], wherein,
Be preferably above-mentioned front panel and at least partially there is peristome.
[19] capacitive input device, is characterized in that:
The manufacture method manufacture as the capacitive input device according to any one of [1] ~ [18] is utilized to form.
[20] image display device, is characterized in that:
Comprise capacitive input device as described in [19] as inscape.
The effect of invention
Can provide according to the present invention: the manufacture method of capacitive input device, it is by arranging the duplexer of metal or inorganic layer at decorative layer, even if thin layer can be obtained with high yield, the decorative layer that brightness and whiteness are also good, and, the worry of the short circuit of metal wiring when eliminating the duplexer importing metal or inorganic layer by arranging insulativity mask layer, thin layer/light-weighted capacitive input device can be manufactured with easy step high-quality, and utilize the capacitive input device of described manufacture method and gained, and use the image display device of described capacitive input device.
Accompanying drawing explanation
Fig. 1 is the sectional view of the formation representing capacitive input device of the present invention.
Fig. 2 is the key diagram of the example representing front panel of the present invention.
Fig. 3 is the key diagram of the example representing the first transparent electrode pattern of the present invention and the second transparent electrode pattern.
Fig. 4 is the vertical view of the example representing the intensive treatment glass being formed with peristome.
Fig. 5 represents the vertical view of an example of front panel being formed with decorative layer, reflection horizon and mask layer.
Fig. 6 is the vertical view of the example representing the front panel being formed with the first transparent electrode pattern.
Fig. 7 is the vertical view of the example representing the front panel being formed with first and second transparent electrode pattern.
Fig. 8 is the vertical view of the example representing the front panel being formed with the electric conductivity key element different from first and second transparent electrode pattern.
Fig. 9 is the key diagram representing metal nanometer line section.
Figure 10 represents to form decorative layer at the X-X ' section of front panel and the key diagram of the method for the hemisect of transfer film that uses.
Figure 11 represents to form decorative layer at the Y-Y ' section of front panel and the key diagram of the method for the hemisect of transfer film that uses.
Figure 12 is the key diagram of the method for the hemisect represented in the evaluation of pre-cut.
Embodiment
Below, the manufacture method of capacitive input device of the present invention, capacitive input device and image display device are illustrated.
The explanation of constitutive requirements described is below carried out based on representative embodiments of the present invention sometimes, but the present invention is not limited thereto kind of an embodiment.In addition, in present specification, so-called " ~ " comprises numerical value described before and after it to use as the implication of lower limit and higher limit.
[manufacture method of capacitive input device]
The manufacture method (hereinafter also referred to manufacture method of the present invention) of capacitive input device of the present invention is the manufacture method comprising front panel, at least comprise the capacitive input device of the key element of following (1) ~ (3) in the noncontact side of above-mentioned front panel, it is characterized in that: sequentially stacked above-mentioned (1), above-mentioned (2) and above-mentioned (3) in the noncontact side of above-mentioned front panel.
(1) comprise inorganic white pigment and bonding agent, thickness is more than 1 μm and decorative layer less than 30 μm
(2) duplexer of inorganic layer or the reflection horizon of metal is comprised
(3) mask layer
The manufacture method of capacitive input device of the present invention by the above-mentioned decorative layer of the noncontact side of above-mentioned front panel with the face of front panel opposition side on the reflection horizon (duplexer hereinafter also referred to metal or inorganic layer) of duplexer or the metal comprising inorganic layer is set, even if decorative layer also can obtain sufficient brightness and whiteness for thin layer.And, metal or inorganic layer duplexer mask layer is set with the face of above-mentioned decorative layer opposition side, the short circuit of the circuit caused by the duplexer of metal or inorganic layer can be prevented thus.
In addition, consider from conservatory viewpoint, preferably arrange to touch between the duplexer and decorative layer of metal or inorganic layer and give layer, arrange to touch at the duplexer of metal or inorganic layer and mask layer side and give layer and barrier layer.
The formation > of < capacitive input device
First, the formation of the capacitive input device formed utilizing manufacture method of the present invention is illustrated.Fig. 1 represents the preferred sectional view formed in capacitive input device of the present invention.In FIG, capacitive input device 10 comprises: front panel 1, decorative layer 2a, the reflection horizon duplexer of the inorganic layer (or wrap metallic duplexer) 2b, mask layer 2c, the first transparent electrode pattern 3, second transparent electrode pattern 4, insulation course 5, electric conductivity key element 6, protective clear layer 7.
Front panel 1 comprises the light-transmitting substrates such as glass substrate, the tempered glass etc. that can to use with the gorilla glass of Corning Incorporated be representative.And, in FIG, the side being provided with each key element of front layer 1 is called noncontact face 1a.In capacitive input device 10 of the present invention, with finger etc., contact etc. carried out to the surface of contact (opposing face in 1a noncontact face) of front panel 1 and input.Below, sometimes front panel is called " base material ".
And, on the noncontact face of front panel 1, be provided with reflection horizon 2b, the mask layer 2c of duplexer or the metal comprising inorganic layer via decorative layer 2a.Combinationally using by making to comprise the duplexer of inorganic layer or the reflection horizon 2b of metal and above-mentioned decorative layer 2a, brightness and the whiteness of decorative layer 2a can be met.Mask layer 2c is the frame shape pattern around the viewing area that formed, the noncontact side of panel in front of the touch screen, is formed to make wiring lead etc. cannot see.
Decorative layer 2a be for the purpose of decorating, be formed at duplexer or the metal comprising inorganic layer reflection horizon 2b on that is between the noncontact side of touch-screen front panel and reflection horizon 2b.
In capacitive input device 10 of the present invention, preferably as shown in Figure 2, decorative layer 2a is set in the mode in a part of region (in fig. 2 for the region beyond input face) covering front panel 1, comprises the reflection horizon 2b of the duplexer of inorganic layer or metal, mask layer 2c.In addition, on front panel 1, as shown in Figure 2 peristome 8 can be set in a part for above-mentioned front panel.The mechanical switch utilizing pressing can be set at peristome 8.Intensity as the tempered glass of base material is high, be difficult to processing, therefore in order to form above-mentioned peristome 8, being generally form peristome 8 before intensive treatment, then carrying out intensive treatment.But, if on the substrate after the intensive treatment with described peristome 8, decorative layer 2a is formed for use decorative layer formation liquid resist or screen printing ink, then sometimes produce following problem: produce resist composition and spill from peristome, or light-shielding pattern must be formed to front panel most border and be located at resist composition in the decorative layer between mask layer and front panel and ooze out from glass end, thus pollute substrate back side, but when using above-mentioned transfer film and form the situation of decorative layer 2a on the base material with peristome 8, also this kind of problem can be solved.
Be formed in the noncontact face of front panel 1: multiple first transparent electrode patterns 3 that multiple pad part extends in a first direction via coupling part and formed, with the first transparent electrode pattern 3 electrical isolation, extend and multiple second transparent electrode patterns 4 comprising multiple pad part formed on the direction intersected with first direction, make the insulation course 5 of the first transparent electrode pattern 3 and the second transparent electrode pattern 4 electrical isolation.Above-mentioned first transparent electrode pattern 3, second transparent electrode pattern 4, electric conductivity key element 6 described later such as can utilize tin indium oxide (Indium Tin Oxide, or the transparent conductive metal oxide film such as indium zinc oxide (Indium Zinc Oxide, IZO) and making ITO).This kind of metal film can be enumerated: the metal film of ito film, Al, Zn, Cu, Fe, Ni, Cr, Mo etc., SiO
2deng metal oxide film etc.Now, the thickness of each key element can be set to 10 nm ~ 200 nm.And, make due to calcining the ito film of noncrystal (amorphous) become the ito film of polycrystalline, therefore also can lower resistance (resistance).And, above-mentioned first transparent electrode pattern 3, second transparent electrode pattern 4, electric conductivity key element 6 described later also can use the transfer film with the electric conductivity ray hardening resin layer using conductive fiber described later, the electric conductivity ray hardening resin layer of the above-mentioned transfer film of transfer printing and manufacturing.In addition, when utilizing ITO etc. to form the situation of the first transparent electrode pattern etc., can with reference to the paragraph [0014] of Jap.P. No. 4506785 publication ~ paragraph [0016] etc.
And, at least one of the first transparent electrode pattern 3 and the second transparent electrode pattern 4 can be arranged to across the noncontact face of front panel 1 and mask layer 2c with the both sides region in the face of front panel 1 opposition side.Represent in FIG the second transparent electrode pattern be arranged to across the noncontact face of front panel 1 and mask layer 2c with the figure in the both sides region in the face of front panel 1 opposition side.Like this, even if transfer film to be laminated into the situation across required certain thickness mask layer and the front panel back side, by using the transfer film that there is specific layer and form, even if do not use the equipment of the costlinesses such as vacuum laminated machine, also can utilize simple step and carry out while bubble can not be produced on Mask portion border stacked.
Fig. 3 is used to be illustrated the first transparent electrode pattern 3 and the second transparent electrode pattern 4.Fig. 3 is the key diagram of the example representing the first transparent electrode pattern of the present invention and the second transparent electrode pattern.As shown in Figure 3, the first transparent electrode pattern 3 pad part 3a extends in a first direction via coupling part 3b and is formed.And, the second transparent electrode pattern 4 be utilize insulation course 5 and with the first transparent electrode pattern 3 electrical isolation, be made up of multiple the pad partly formed upper extension the in the direction (second direction in Fig. 3) intersected with first direction.Herein, when the situation of formation first transparent electrode pattern 3, above-mentioned pad part 3a and coupling part 3b can be made to become make integratedly, also can only make coupling part 3b, make pad part 3a be integrated with the second transparent electrode pattern 4 one-tenth and make (patterning).When making the situation of (patterning) making pad part 3a be integrated with the second transparent electrode pattern 4 one-tenth, as shown in Figure 3 the part of a part of coupling part 3b with pad part 3a is linked, and to be made the mode of the first transparent electrode pattern 3 and the second transparent electrode pattern 4 electrical isolation form each layer by insulation course 5.
In FIG, at mask layer 2c, the side, face of front panel 1 opposition side is provided with electric conductivity key element 6.Electric conductivity key element 6 be electrically connected from least one of the first transparent electrode pattern 3 and the second transparent electrode pattern 4 and with the first transparent electrode pattern 3 and the different key element of the second transparent electrode pattern 4.Represent the figure that electric conductivity key element 6 is connected with the second transparent electrode pattern 4 in FIG.
And, in FIG, protective clear layer 7 is set in the whole mode covering each inscape.Also protective clear layer 7 can be formed in the mode of the part only covering each inscape.Insulation course 5 can be identical material with protective clear layer 7, also can be different materials.The material forming insulation course 5 and protective clear layer 7 is skin hardness, material that thermotolerance is high preferably, can use known photo-sensitive siloxane resin material, acrylic materials etc.
Below, about manufacture method of the present invention, the details of each layer is illustrated.
The form example formed in process as manufacture method of the present invention, can enumerate the form of Fig. 4 ~ Fig. 8.Fig. 4 is the vertical view of the example representing the intensive treatment glass 11 being formed with peristome 8.Fig. 5 be represent be formed with decorative layer 2a, comprise the reflection horizon 2b of the duplexer of inorganic layer or metal, the vertical view of an example of the front panel of mask layer 2c.Fig. 6 is the vertical view of the example representing the front panel being formed with the first transparent electrode pattern 3.Fig. 7 represents the vertical view of an example of the front panel being formed with the first transparent electrode pattern 3 and the second transparent electrode pattern 4.Fig. 8 is the vertical view of the example representing the front panel being formed with the electric conductivity key element 6 different from first and second transparent electrode pattern.These represent the example above-mentioned explanation specialized, and scope of the present invention also can't help these accompanying drawings and restrictively explaining.
< (1) decorative layer >
The noncontact side that manufacture method of the present invention is included in above-mentioned front panel forms that above-mentioned (1) comprises inorganic white pigment and bonding agent, thickness is more than 1 μm and the step of decorative layer less than 30 μm.
Consider from thin layer viewpoint, as the thickness of above-mentioned decorative layer, preferably more than 1 μm and less than 30 μm, consider from the viewpoint of the screening capacity improving decorative layer, more preferably 1 μm ~ 25 μm, particularly preferably be 1.5 μm ~ 20 μm, particularly preferably be 1.8 μm ~ 18 μm further, particularly further preferably be 1.8 μm ~ 13 μm.
Utilize manufacture method of the present invention and the decorative layer formed can use coloring composition and make, preferably at least comprise white inorganic pigment and bonding agent.As the formation method of above-mentioned (1) decorative layer, there is no particular restriction, such as coloring composition directly can be coated on substrate, also can use transfer film (dyed layer that above-mentioned transfer film comprises coating coloring composition and formed) and be formed, also can utilize the printings such as screen printing and be formed.
As above-mentioned screen printing, can there is no particular restriction that ground uses known method, such as can to use in No. 4021925, Jap.P. described method etc.And, by carrying out repeatedly screen printing, even screen printing also can make thickness thickening.
Manufacture method of the present invention preferably uses transfer film at least to form above-mentioned (1) decorative layer.Carry out transfer printing about use transfer film and form the method for above-mentioned (1) decorative layer, as described later.
And above-mentioned (1) decorative layer can make transfer film and screen printing combine and be formed.
And when arbitrary situation, the thickness of the what is called in the present invention above-mentioned (1) decorative layer is all the totals of the thickness representing holostrome.
Fig. 2 formation have in the capacitive input device of peristome 8, if use described later contain chromatograph transfer film or described laterly comprise the transfer film of ray hardening resin layer and form above-mentioned decorative layer 2a described in Fig. 1 or mask layer 2c described later etc., even if then do not produce resist composition at the substrate (front panel) with peristome to spill from opening portion yet, particularly in the decorative layer on most border that light-shielding pattern must be formed to front panel or mask layer, resist composition does not ooze out from glass end, therefore substrate back side can not be polluted, become the touch-screen can with thin layer/light-weighted advantage.
(formation of transfer film)
In manufacture method of the present invention, spendable transfer film preferably comprises temporary support and dyed layer, and above-mentioned dyed layer at least comprises white inorganic pigment and bonding agent.
There is transfer film that this kind form by using and forming above-mentioned decorative layer, and by arranging with reflecting layer combination described later, the brightness after transfer printing and the good white in finish layer of whiteness, reticulate pattern and adhesion can be obtained with high yield.
The transfer film that can use in manufacture method of the present invention preferably comprises temporary support and dyed layer.And, between temporary support and dyed layer, also can comprise thermoplastic resin.
-temporary support-
Temporary support can use has pliability, under elevated pressure or pressurization and the lower material that can not produce significant distortion, contraction or extension of heating.The example of this kind of supporter can enumerate polyethylene terephthalate film, tri cellulose acetate membrane, polystyrene film, polycarbonate membrane etc., particularly wherein preferably is twin shaft and extends polyethylene terephthalate film.
There is no particular restriction for the thickness of temporary support, is generally the scope of 5 μm ~ 200 μm, with regard to the aspect such as handling easiness, versatility, particularly preferably is the scope of 10 μm ~ 150 μm.
And temporary support can be transparent, also dyestuff SiClx, alumina sol, chromic salts, zirconates etc. can be contained.
And, described method etc. can be utilized in Japanese Patent Laid-Open 2005-221726 publication and gives electric conductivity to temporary support.
-dyed layer-
--white inorganic pigment--
As the above-mentioned white inorganic pigment used in above-mentioned dyed layer, Chinese white described in the paragraph [0019] of Japanese Patent Laid-Open 2009-191118 publication or the paragraph [0109] of Japanese Patent Laid-Open 2000-175718 publication can be used.
Specifically, in the present invention, above-mentioned white inorganic pigment is titanium dioxide (rutile-type), titanium dioxide (Detitanium-ore-type), zinc paste, lithopone, precipitated calcium carbonate, white carbon (white carbon), aluminium oxide, aluminium hydroxide, barium sulphate preferably, more preferably titanium dioxide (rutile-type), titanium dioxide (Detitanium-ore-type), zinc paste, more preferably titanium dioxide (rutile-type), titanium dioxide (Detitanium-ore-type) further, further more preferably Titanium Dioxide Rutile Top grade.
The concrete example of titania can enumerate JR, JRNC, JR-301, 403, 405, 600A, 605, 600E, 603, 701, 800, 805, 806, JA-1, C, 3, 4, 5, MT-01, 02, 03, 04, 05, 100AQ, 100SA, 100SAK, 100SAS, 100TV, 100Z, 100ZR, 150W, 500B, 500H, 500SA, 500SAK, 500SAS, 500T, SMT-100SAM, 100SAS, 500SAM, 500SAS (manufacture of kingdom's chemical industry (Tayca) company), CR-50, 50-2, 57, 58, 58-2, 60, 60-2, 63, 67, 80, 85, 90, 90-2, 93, 95, 97, 953, Super70, PC-3, PF-690, 691, 711, 736, 737, 739, 740, 742, R-550, 580, 630, 670, 680, 780, 780-2, 820, 830, 850, 855, 930, 980, S-305, UT771, TTO-51 (A), 51 (C), 55 (A), 55 (B), 55 (C), 55 (D), S-1, S-2, S-3, S-4, V-3, V-4, MPT-136, FTL-100, 110, 200, 300 (stone originates in industry company and manufactures), KA-10, 15, 20, 30, KR-310, 380, KV-200, STT-30EHJ, 65C-S, 455, 485SA15, 495M, 495MC (manufacture of Ti industry company), TA-100, 200, 300, 400, 500, TR-600, 700, 750, 840, 900 (Fuji Titanium Industry's manufactures) etc., these can be used alone or as a mixture.
In the present invention, the surface of above-mentioned white inorganic pigment (particularly titanium dioxide) can be carried out silica-treated, alumina treatment, titania process, zirconia process, organism process and and process with these.
The catalyst activity of above-mentioned white inorganic pigment (particularly titanium dioxide) can be suppressed thus, can thermotolerance, delustering etc. be improved.
The viewpoint of the whiteness of the decorative layer after heating is considered, above-mentioned Chinese white has preferably carried out surface-treated Titanium Dioxide Rutile Top grade through inorganics in the present invention, at least one more preferably utilizing in alumina treatment and zirconia process has carried out surface-treated Titanium Dioxide Rutile Top grade, particularly preferably is by and has carried out surface-treated Titanium Dioxide Rutile Top grade with the process of alumina-zirconia.
Good and the viewpoint simultaneously meeting the decorative layer of the characteristic that other require of self-forming brightness and whiteness is considered, preferably above-mentioned white inorganic pigment is 20 quality % ~ 75 quality % relative to the containing ratio of all solids composition of above-mentioned dyed layer.And, when using above-mentioned transfer film in the manufacture method of capacitive input device of the present invention described later, consider from the viewpoint of abundant reducing developing time, also preferably above-mentioned white inorganic pigment is 20 quality % ~ 75 quality % relative to the containing ratio of all solids composition of above-mentioned decorative layer.
Above-mentioned white inorganic pigment relative to the containing ratio more preferably 25 quality % ~ 60 quality % of all solids composition of above-mentioned dyed layer, more preferably 30 quality % ~ 50 quality % further.
In this instructions, so-called all solids composition represents from the gross mass of above-mentioned dyed layer except the nonvolatile component of desolventizing etc.
Above-mentioned white inorganic pigment (in addition, about other colorants used in mask layer described later too) it is desirable to use as dispersion liquid.Described dispersion liquid is prepared by such as under type: above-mentioned white inorganic pigment and pigment dispersing agent are pre-mixed and the composition of gained makes an addition in organic solvent described later (or vehicle (vehicle)) and makes it disperse.Above-mentioned vehicle refers to the part of the medium that coating makes pigment disperse when being in liquid condition, is included as aqueous and is combined with above-mentioned pigment and forms the composition (bonding agent) of film, it carried out to the composition (organic solvent) of dissolved dilution.
The dispersion machine used when disperseing as making above-mentioned white inorganic pigment, there is no particular restriction, include, for example and make outstanding " pigment topical reference book ", first published, towards storehouse bookstore, the known dispersion machine such as kneader (kneader), roller mill, masher, super grinding machine, dissolver, homogeneous mixer, sand mill described in 2000, the 438th towards storehouse nation.In addition, also can utilize mechanical attrition described in the 310th page, described document, utilize friction force and carry out Crushing of Ultrafine.
As the white inorganic pigment of the above-mentioned white inorganic pigment used in the present invention (decorative layer formation colorant), consider from the viewpoint of dispersion stabilization and screening capacity, preferably the mean grain size of primary particle is 0.16 μm ~ 0.3 μm, and more preferably the mean grain size of primary particle is 0.18 μm ~ 0.27 μm.The mean grain size particularly preferably being primary particle is further 0.19 μm ~ 0.25 μm.If the mean grain size of primary particle is 0.16 μm, then there is the rapid reduction of screening capacity and become the substrate easily seeing mask layer, or producing the phenomenon of viscosity rising.On the other hand, if the mean grain size of primary particle is more than 0.3 μm, then whiteness reduces, simultaneously the rapid reduction of screening capacity, and surface texture during coating worsens.
In addition, so-called " mean grain size of primary particle " refers to the diameter of the bowlder electron micrograph image of particle being set to same area herein, and so-called " number average particle size " refers to and obtain above-mentioned particle diameter to multiple particle, its mean value of 100.
On the other hand, when utilizing the mean grain size in dispersion liquid, coating fluid to carry out the situation measured, laser light scattering hole field (HORIBA) H (manufacture of Ku Chang advanced technology incorporated company) can be used.
--bonding agent--
In the present invention in the spendable transfer materials of institute, known bonding agent can be used as the bonding agent of above-mentioned dyed layer.Such as preferably be selected from saponified, the vinyltoluene of saponified, the styrene of ethene and acrylate copolymer and (methyl) acrylate copolymer and saponified etc. at least a kind such as saponified, poly-(methyl) acrylate of (methyl) acrylate copolymer and (methyl) acrylate copolymer of (methyl) butyl acrylate and vinyl acetate etc.In addition, also can use and dissolve in alkaline aqueous solution in the organic polymer of " plastics performance brief guide " (Japan Plastics Industry Federation, all Japan plastics forming industrial combination can be write, the census of manufacturing can be issued, distribution on nineteen sixty-eight October 25).These can be used alone a kind, also can and use two or more.And preferably softening point is less than 80 DEG C in these thermoplastic resins.In addition, in the present invention, so-called " (methyl) acrylic acid " is general name acrylic acid and methacrylic acid, and the situation of its derivant too.
When dyed layer utilizes alkaline development and forms the situation of pattern, effectively alkali soluble resin, can use polymkeric substance described in paragraph [the 0033] ~ paragraph [0052] of the paragraph [0025] of Japanese Patent Laid-Open 2011-95716 publication, Japanese Patent Laid-Open 2010-237589 publication.
And, do not need alkaline development when forming pattern, when dyed layer needs the situation of thermotolerance, preferably fluorine punishment resin and silicone-based resin.
Above-mentioned silicone-based resin can use known silicone-based resin.Such as can use methyl anchor line (string) silicone resin, aminomethyl phenyl anchor line (string) silicone resin, acryl resin modified silicone resin, vibrin modified silicone resin, epoxy resin modification silicone resin, alkyd resin, modified silicone resin and rubber series silicone resin etc.
Herein, as above-mentioned transfer film, above-mentioned dyed layer does not need the photo-hardening of the combination utilizing ray hardening resin and Photoepolymerizationinitiater initiater, and above-mentioned dyed layer can comprise ray hardening resin or Photoepolymerizationinitiater initiater can be free of ray hardening resin or Photoepolymerizationinitiater initiater.Wherein, when above-mentioned dyed layer comprises the situation of antioxidant described later, from can not owing to exposing Photoepolymerizationinitiater initiater time the free radical that generates and hinder the function of above-mentioned antioxidant, and the viewpoint fully improving the whiteness after baking is considered, preferably not containing Photoepolymerizationinitiater initiater.Therefore, above-mentioned (B) silicone-based resin preferably thermosetting.
More preferably methyl anchor line (string) silicone resin, aminomethyl phenyl anchor line (string) silicone resin, acryl resin modified silicone resin, particularly preferably is methyl anchor line (string) silicone resin, aminomethyl phenyl anchor line (string) silicone resin.These silicone-based resins can be used alone also can and with two or more, preferably methyl anchor line (string) silicone resin and aminomethyl phenyl anchor line (string) silicone resin and use, by with arbitrary ratio by these mixing controlling diaphragm physical property.
As the above-mentioned bonding agent used in above-mentioned dyed layer, only otherwise violate aim of the present invention then there is no particular restriction, known polymerizable compound can be used.
When above-mentioned transfer film is the situation of minus material, in above-mentioned dyed layer, preferably comprise alkali soluble resin, polymerizable compound, polymerization initiator or polymerization starter system.Further use colorant, adjuvant etc., but be not limited thereto.
--Photoepolymerizationinitiater initiater--
As the above-mentioned Photoepolymerizationinitiater initiater used in above-mentioned dyed layer, polymerizable compound described in [0031] ~ [0042] described in Japanese Patent Laid-Open 2011-95716 publication can be used.
--monomer--
As the above-mentioned monomer used in above-mentioned dyed layer, only otherwise violate aim of the present invention, then there is no particular restriction, can use known polymerizable compound.
As above-mentioned polymerizable compound, polymerizable compound described in paragraph [the 0023] ~ paragraph [0024] of No. 4098550th, Jap.P. can be used.
When above-mentioned photosensitive film is the situation of positive shaped material, in dyed layer, uses material etc. described in such as Japanese Patent Laid-Open 2005-221726, but be not limited thereto.
--antioxidant--
As above-mentioned transfer film, from the decorative layer to gained during dyed layer above-mentioned by transfer film transfer printing, the viewpoint improving the whiteness after baking is considered, preferably above-mentioned dyed layer comprises antioxidant.Herein, when forming the situation of the transparent electrode pattern of ITO etc. in capacitive input device, become and must at high temperature toast, but the whiteness after baking can be improved by adding antioxidant.
Above-mentioned antioxidant can use known antioxidant.Such as can use hindered phenol system, (semi hindered) phenol system of being partly obstructed, phosphoric acid system, there is in molecule the mixed type inhibitors of phosphoric acid/hindered phenol.
The preferably mixed type inhibitors also using or have in molecule phosphoric acid/hindered phenol of phosphoric acid system, phosphoric acid system and hindered phenol system or half hindered phenol system.
Above-mentioned antioxidant relative to above-mentioned dyed layer all solids composition relative to above-mentioned addition, there is no particular restriction, preferably 0.001 quality % ~ 10 quality %, more preferably 0.01 quality % ~ 1 quality %, particularly preferably is 0.05 quality % ~ 0.2 quality %.
--solvent--
And, manufacturing solvent during the above-mentioned dyed layer of transfer film as utilizing coating, solvent described in paragraph [the 0043] ~ paragraph [0044] of Japanese Patent Laid-Open 2011-95716 publication can be used.
--adjuvant--
In addition, in above-mentioned dyed layer, also other adjuvants can be used.Above-mentioned adjuvant include, for example other adjuvants described in paragraph [the 0058] ~ paragraph [0071] of thermal polymerization inhibitor described in the paragraph [0018] of surfactant described in paragraph [the 0060] ~ paragraph [0071] of the paragraph [0017] of Jap.P. No. 4502784 publication, Japanese Patent Laid-Open 2009-237362 publication or Jap.P. No. 4502784 publication and Japanese Patent Laid-Open 2000-310706 publication.
Above, be illustrated centered by the situation of above-mentioned transfer film for non-photosensitive material, but above-mentioned transfer film also can be optionally minus material or positive shaped material.
--thickness--
The thickness of above-mentioned dyed layer preferably more than 1 μm and less than 30 μm, consider from the viewpoint of the screening capacity in order to improve decorative layer when the above-mentioned transfer film that contain chromatograph being used as the decorative layer of capacitive input device, more preferably 1 μm ~ 25 μm.
The thickness of above-mentioned dyed layer particularly preferably is 1.5 μm ~ 20 μm, particularly preferably is 1.8 μm ~ 18 μm further, particularly further preferably is 1.8 μm ~ 13 μm.
--viscosity of dyed layer--
The viscosity that preferably dyed layer measures at 100 DEG C is in the region of 2000Pasec ~ 50000Pasec, and then meets following formula (A).
Formula (A): the viscosity of the viscosity < dyed layer of thermoplastic resin
Herein, the viscosity of each layer can measure as described below.Utilize atmospheric pressure and drying under reduced pressure, in thermoplastic resin or decorative layer coating fluid, make working sample except desolventizing, such as, use vibron (Vibron) (DD-III type; Japan's Baldwin (Baldwin) incorporated company manufactures) as analyzer, measuring, beginning temperature is 50 DEG C, mensuration end temp is 150 DEG C, programming rate measures under being the condition of 5 DEG C/min and vibration frequency 1Hz/deg, can use the measured value of 100 DEG C.
-thermoplastic resin-
Above-mentioned transfer film preferably arranges thermoplastic resin between above-mentioned temporary support and above-mentioned dyed layer.Above-mentioned thermoplastic resin preferably alkali-soluble.Thermoplastic resin plays effect as fender in the mode of concavo-convex (also comprise established image etc. concavo-convex etc.) of Absorbable rod substrate surface, preferably has the character can be out of shape according to the concavo-convex of object surface.
Thermoplastic resin preferably comprises the form of polymer described in Japanese Patent Laid-Open 5-72724 publication as composition, particularly preferably is and comprises the form that the softening point being selected from dimension card (Vicat) method [specifically the polymkeric substance softening point measurement method of U.S. material test method(s) materials association ASTMD1235] is at least one of the polymer of less than about 80 DEG C.
Specifically, tygon can be enumerated, the polyolefin such as polypropylene, ethene and vinyl acetate or its saponified etc. ethylene copolymer, ethene and acrylate or its saponified multipolymer, Polyvinylchloride or vinyl chloride and vinyl acetate or its saponified etc. vinyl chloride copolymer, polyvinylidene chloride, vinylidene chloride copolymer, polystyrene, styrene and (methyl) acrylate or its saponified etc. styrol copolymer, polyvinyl-toluene, vinyltoluene and (methyl) acrylate or its saponified etc. vinyl toluene copolymer, poly-(methyl) acrylate, (methyl) acrylate copolymer of (methyl) butyl acrylate and vinyl acetate etc., vinyl acetate copolymer, nylon, copolymer nylon, the aikoxymethytated nylon of N-, the polyamides such as N-dimethylamino nylon, the organic polymers such as polyester.
And, in thermoplastic resin, preferably add the gas-development agent etc. controlling fissility, can be suitable for using gas-development agent etc. described in paragraph [the 0020] ~ paragraph [0028] of Japanese Patent Laid-Open 2007-225939 publication.
Also preferably in thermoplastic resin, add surfactant, such as, can be suitable for using surfactant described in paragraph [the 0060] ~ paragraph [0071] of the paragraph [0017] of Jap.P. No. 4502784 publication, Japanese Patent Laid-Open 2009-237362 publication.
The thickness of thermoplastic resin preferably 3 μm ~ 30 μm.When the thickness of thermoplastic resin is the situation of more than 3 μm, tracing ability time stacked is abundant, and easily complete absorption base basal surface is concavo-convex.And when thickness is the situation of less than 30 μm, be difficult to bring load to the drying (solvent removing) when forming thermoplastic resin in temporary support, the development of thermoplastic resin can not too expend time in, process adaptability becomes good.The thickness of above-mentioned thermoplastic resin more preferably 4 μm ~ 25 μm, particularly preferably is 5 μm ~ 20 μm.
Thermoplastic resin can be coated with and comprise preparing liquid etc. and being formed of organic thermoplastic polymer, and what use when coating waits prepares liquid and can use solvent and prepare.If solvent solubilized forms the macromolecule component of described layer, then there is no particular restriction, include, for example methyl ethyl ketone, cyclohexanone, propylene glycol methyl ether acetate, n-propanol, 2-propyl alcohol etc.
Preferably the viscosity measured at 100 DEG C of above-mentioned thermoplastic resin is in the region of 1000Pasec ~ 10000Pasec.
-other layers-
In above-mentioned transfer film, middle layer can be set between decorative layer and thermoplastic resin or diaphragm etc. be set further on the surface of decorative layer and form aptly.
In above-mentioned transfer film, being mixed into object of composition during preservation time preferably to prevent coating multiple and after coating and middle layer is set.As middle layer, in Japanese Patent Laid-Open 5-72724 publication, be preferably recited as the oxygen barrier film (oxygen-impermeable film) with oxygen barriers function of " separating layer ", sensitivity during exposure improves, and can lower the time load of exposure machine, and productivity improves.
As above-mentioned middle layer and diaphragm, can be suitable for using in paragraph [the 0083] ~ paragraph [0087] of Japanese Patent Laid-Open 2006-259138 publication and paragraph [0093] described.
(method for making of transfer film)
The transfer film used in the formation of decorative layer in the present invention can make based on the method for making of photosensitive transfer printing material described in the paragraph of Japanese Patent Laid-Open 2006-259138 publication [0094] ~ paragraph [0098].
Specifically, when formation comprises the situation of the transfer film in middle layer, make aptly by such as under type: in temporary support, coating is dissolved with the lysate (thermoplastic resin coating fluid) of organic thermoplastic polymer and adjuvant, make it dry and after thermoplastic resin is set, on described thermoplastic resin, liquid (middle layer coating fluid) is prepared in coating, described liquid of preparing can not add resin or adjuvant in the solvent of heat of solution plastic resin layers and prepare, make it dry and stacked middle layer, on described middle layer, further coating uses the solvent that can not dissolve middle layer and the dyed layer coating fluid prepared, make it dry and stacked dyed layer.
The method forming above-mentioned decorative layer to using transfer film is illustrated.Generally when using the situation of transfer film, if dyed layer comprises ray hardening resin, then can utilize the method for common photoetching and being formed.Herein, as the transfer film used in the formation of decorative layer in the present invention, dyed layer can comprise ray hardening resin and can be free of ray hardening resin, even if when arbitrary situation, all uses transfer film to form decorative layer by utilizing the printing transferring method of following hemisect.
In the printing transferring method utilizing hemisect; first if Figure 10 ~ is as shown in Figure 12 with behind the image portion 32 of the pre-cut decorative layers such as razor and the border in non-image portion 31; utilize adhesive tape by the diaphragm in non-image portion 31, decorative layer and middle layer removing; similarly remove the diaphragm in image portion 32 further, transfer decorative layer pattern on substrate.
Then, utilize development thermoplastic resin and middle layer to be removed, can decoration layer pattern be formed thus.
Also can the optionally known developing apparatus such as combined hair brush or high-pressure injection machine.After development, also can optionally carry out post-exposure, rear baking, preferably carry out rear baking.
And, in order to improve the adhesion utilizing stacked decorative layer in transfer step thereafter, surface treatment can be implemented to the noncontact face of base material (front panel) in advance.As above-mentioned surface treatment, preferably implement the surface treatment (silane coupling process) using silane compound.As silane coupling agent, preferably there is the silane coupling agent of the interactional functional group with photoresist.Such as blow attached silane coupling solution (N-β-0.3 quality % aqueous solution of (amino-ethyl)-gamma-amino propyl trimethoxy silicane, commodity are called KBM603, chemistry incorporated company of SHIN-ETSU HANTOTAI manufactures) 20 seconds by spray, carry out pure water cleaning showers.Thereafter, it is made to react by heating.Also can use heating tank, the basal plate preheating of stacked machine also can promote reaction.
As the method forming above-mentioned decorative layer, be illustrated using the patterning method of above-mentioned transfer film.
The method preferably forming above-mentioned decorative layer comprises: cut out through above-mentioned dyed layer and the step of the otch of the degree of depth of not through above-mentioned temporary support in a part for above-mentioned transfer film; By the step that the above-mentioned dyed layer in the region at least partially in the region surrounded by above-mentioned otch removes; Use the above-mentioned transfer film after the above-mentioned dyed layer in the above-mentioned a part of region of removing and form the step of above-mentioned (1) decorative layer.
A part for above-mentioned transfer film cut out through above-mentioned dyed layer and the step of the otch of the degree of depth of not through above-mentioned temporary support also referred to as the step in the image portion of institute's transfer printing in pre-cut dyed layer in advance.In addition, also the method for the otch cutting out this kind of degree of depth is called hemisect.
Remove the step of the above-mentioned dyed layer in the region at least partially in the region surrounded by above-mentioned otch also referred to as removing and the step of the dyed layer in non-transfer non-image portion.
In addition; when transfer film comprises the situation of diaphragm or middle layer or thermoplastic resin, by the step of the above-mentioned dyed layer removing in the region at least partially in the region that surrounded by above-mentioned otch preferably by the step of the diaphragm removing in the diaphragm in non-image portion and dyed layer and image portion.
Use the above-mentioned transfer film after the above-mentioned dyed layer in the above-mentioned a part of region of removing and form above-mentioned (1) decorative layer step also referred to as the transfer step dyed layer in above-mentioned image portion is transferred on base material.
In addition; when transfer film comprises the situation of diaphragm or middle layer or thermoplastic resin, use the above-mentioned transfer film after the above-mentioned dyed layer in the above-mentioned a part of region of removing and the dyed layer in the above-mentioned image portion eliminating the above-mentioned transfer film of said protection film is preferably needed on the transfer step on base material by the step that forms above-mentioned (1) decorative layer.
When this situation, and then the step using the above-mentioned transfer film after the above-mentioned dyed layer in the above-mentioned a part of region of removing and form above-mentioned (1) decorative layer preferably comprises the step temporary support of institute's transfer printing on base material peeled off.
When this situation, and then the step using the above-mentioned transfer film after the above-mentioned dyed layer in the above-mentioned a part of region of removing and form above-mentioned (1) decorative layer more preferably comprises step thermoplastic resin and middle layer removed.
The method forming above-mentioned decorative layer more preferably comprises the method for following steps: the step in the image portion of institute's transfer printing in the dyed layer of pre-cut transfer film in advance; By the step of the diaphragm in the diaphragm in non-image portion and dyed layer and image portion removing; The dyed layer in the above-mentioned image portion eliminating the above-mentioned transfer film of said protection film is needed on the transfer step on base material; By the step that the temporary support of institute's transfer printing on base material is peeled off; By the step that thermoplastic resin and middle layer remove.
On the other hand, the method forming above-mentioned decorative layer when above-mentioned dyed layer comprises the situation of ray hardening resin layer can enumerate the method comprising following steps: from the diaphragm removing step of above-mentioned transfer film removing said protection film; The above-mentioned ray hardening resin layer eliminating the above-mentioned photosensitive transfer printing material of said protection film is needed on the transfer step on base material.When this situation, preferably after above-mentioned transfer step and then comprise the step of the ray hardening resin layer of institute's transfer printing being carried out to post-exposure.
-pre-cut step-
Forming the method for above-mentioned decorative layer when not forming the situation of image by common photolithographicallpatterned, before transfer printing, image portion must be formed at dyed layer.Cut out through above-mentioned dyed layer about the part at above-mentioned transfer film and the step (pre-cut step) of the otch of the degree of depth of not through above-mentioned temporary support, be illustrated following.
As the above-mentioned method cutting out otch, there is no particular restriction, can utilize any means such as cutter, laser and cut out otch, preferably utilizes cutter to cut out otch.And the structure of cutter is not particularly limited.
As above-mentioned transfer film; such as at sequentially stacked temporary support, thermoplastic resin, middle layer, dyed layer, diaphragm and when being configured; such as can use cutter or laser; self-insurance cuticula cuts out and runs through diaphragm, dyed layer, middle layer; until the otch of a part for thermoplastic resin, the image portion carrying out transfer printing can be separated with between the non-image portion not carrying out transfer printing thus.
-by the dyed layer in non-image portion remove step-
Not transfer printing non-image portion must be managed when being optionally transferred on substrate in the image portion of the dyed layer of pre-cut.Method is by the method that the dyed layer in non-image portion removes before transfer printing, is after removing diaphragm, by the method that the dyed layer in non-image portion and middle layer are peeled off simultaneously.Another kind peels off the diaphragm in non-image portion, then dyed layer and middle layer peeled off simultaneously, peels off the method for the diaphragm in image portion further.From until protect before transfer printing the image portion of chromatograph viewpoint consider, the preferably method of the latter.
-transfer step-
Above-mentioned transfer step is the step be transferred to by the above-mentioned dyed layer of the above-mentioned transfer film eliminating said protection film on base material.
Now, preferably by such as under type and the method for carrying out: after the dyed layer of above-mentioned transfer film is laminated on base material, temporary support is removed.
Dyed layer can be overlapped on substrate surface in the transfer printing (laminating) of substrate surface by dyed layer, carries out pressurizeing, heating to carry out.Stacked machine, vacuum laminated machine can be used and the known stacked machines such as the stacked machine of productive surface trimming can be improved further in laminating.
-by thermoplastic resin remove step, by middle layer remove step-
The step above-mentioned thermoplastic resin and middle layer removed generally can be used in the alkaline-based developer that uses in photolithographicallpatterned and carry out.In present specification, so-called development is not limited to utilize developer solution to the development of implication having carried out the narrow sense that the above-mentioned dyed layer of pattern exposure or ray hardening resin layer etc. develop, and also comprises the step by thermoplastic resin or middle layer removing.As above-mentioned alkaline-based developer, there is no special restriction, the known developer solutions such as described can be used in Japanese Patent Laid-Open 5-72724 publication.In addition, developer solution preferably carries out the developer solution of the development movement of decorative layer lysotype, such as preferably comprise the compound of pKa=7 ~ 13 with the concentration of 0.05mol/L ~ 5mol/L, also can to add a small amount of and glassware for drinking water further has blended organic solvent.There is blended organic solvent as with glassware for drinking water, can enumerate: methyl alcohol, ethanol, 2-propyl alcohol, 1-propyl alcohol, butanols, diacetone alcohol, glycol monoethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-butyl ether, phenmethylol, acetone, methyl ethyl ketone, cyclohexanone, 6-caprolactone, gamma-butyrolacton, dimethyl formamide, dimethyl acetamide, hexamethyl phosphoramide, ethyl lactate, methyl lactate, epsilon-caprolactams, 1-METHYLPYRROLIDONE etc.The concentration preferably 0.1 quality % ~ 30 quality % of described organic solvent.
And, known surfactant can be added further in above-mentioned alkaline-based developer.The concentration preferably 0.01 quality % ~ 10 quality % of surfactant.
As the mode of the step above-mentioned thermoplastic resin and middle layer removed, can be any means covering liquid, spray, spray & spin coating, impregnating.Above-mentioned spray is illustrated herein, blows attached developer solution by spray, thus by thermoplastic resin or middle layer removing.And preferably after development, blow attached clean-out system etc. by spraying, one side utilizes the wipings such as hairbrush, and residue removes by one side.Fluid temperature preferably 20 DEG C ~ 40 DEG C, and its pH preferably 8 ~ 13.
-rear baking procedure-
Baking procedure after preferably comprising after above-mentioned transfer step, preferred be included in the step above-mentioned thermoplastic resin and middle layer removed after carry out the step of rear baking.
As manufacture method of the present invention, certainly take into account whiteness and productive viewpoint is considered, preferably the above-mentioned dyed layer of above-mentioned transfer film be heated under the environment of 0.08atm ~ 1.2atm 110 DEG C ~ 300 DEG C and form above-mentioned (1) decorative layer.
Under the environment of 0.1atm ~ 1.1atm, more preferably carry out the heating of above-mentioned rear baking, the viewpoint lowering manufacturing cost from not using special reliever is considered, particularly preferably is and carries out under about 1atm (atmospheric pressure) environment.Herein, when forming the situation of above-mentioned (1) decorative layer being undertaken hardening by heating now, by carrying out under the reduced pressure atmosphere of low-down pressure, make oxygen concentration step-down and whiteness after maintaining baking, but by using the transfer film comprising above-mentioned dyed layer, even if after toasting in the scope of above-mentioned pressure, the whiteness of decorative layer also can be improved.
The temperature of above-mentioned rear baking more preferably 120 DEG C ~ 280 DEG C, particularly preferably is 140 DEG C ~ 260 DEG C.
More preferably 20 minutes ~ 150 minutes time of above-mentioned rear baking, particularly preferably be 30 minutes ~ 100 minutes.
Above-mentioned rear baking can be carried out under air ambient, also can carry out under nitrogen replaces environment, and the viewpoint lowering manufacturing cost from not using special reliever is considered, particularly preferably is and carries out under air ambient.
-other steps-
The method forming above-mentioned decorative layer also can comprise other steps such as post-exposure step.
When above-mentioned dyed layer comprises the situation of ray hardening resin layer, when forming above-mentioned decorative layer, preferably comprise post-exposure step.As above-mentioned post-exposure step, can carrying out with the surface direction of the side of above-mentioned substrate contact only from above-mentioned dyed layer, also only can carry out from the surface direction of the side that not contact with above-mentioned transparent base, also can carry out from direction, two faces.
In addition, as the example of the step above-mentioned thermoplastic resin and middle layer removed and other steps, method described in numbered paragraphs [the 0035] ~ numbered paragraphs [0051] of Japanese Patent Laid-Open 2006-23696 publication also can be used in the present invention aptly.
< (2) reflection horizon (duplexer of metal or inorganic layer) >
The feature of manufacture method of the present invention is: in the noncontact side of above-mentioned front panel, sequentially stacked above-mentioned (1), above-mentioned (2) comprise the duplexer of inorganic layer or the reflection horizon of metal and above-mentioned (3).
The reflection horizon of the above-mentioned duplexer or metal that comprise inorganics can utilize known method and make.
The material forming above-mentioned reflection horizon can use known metal and inorganics.As forming the material in above-mentioned reflection horizon, the wherein film of preferably metal, the viewpoint of self-reflection rate is considered, more preferably silver or aluminium, particularly preferably is silver.Also can comprise not to the metallic impurity such as gold, copper, nickel, iron, cobalt, tungsten, molybdenum, tantalum, chromium, indium, manganese, titanium, palladium, neodymium of the degree that its performance damages.These materials can use two or more, also can form more than 2 layers.
On the other hand, as the duplexer of above-mentioned inorganics, there is no particular restriction, include, for example the duplexer etc. that interaction cascading has low-refraction dielectric and high refractive index dielectric body, can use duplexer etc. described in Japanese Patent Laid-Open 2012-032454 publication.
Form the method that above-mentioned (2) comprise the duplexer of inorganics or the reflection horizon of metal and have damp process and dry process.
So-called damp process is the general name of plating, is make metal separate out in solution and form the method for film.If enumerate concrete example, then have and use the silver mirror reaction of silver nitrate, or make it reduce by heating the metal complex solution comprising metal complex (by preparations such as silver carbonates) and obtain the method etc. of metal film.
On the other hand, so-called dry process is the general name of vacuum film formation, if illustrate particularly, then has electric resistor heating type vacuum vapour deposition, electron beam heated type vacuum vapour deposition, ion plating method, ion beam-assisted vacuum vapour deposition, sputtering method etc.
In vacuum vapour deposition, utilize electron beam, resistance heated, induction heating etc. to make the starting material melting of metal, make vapour pressure increase, be preferably evaporated to substrate surface at below 13.3mPa (0.1mTorr).Now, also can import the gases such as the argon of more than 13.3mPa, produce the glow discharge of high frequency waves or direct current.
Sputtering method can use direct current (DC) magnetic control sputtering plating method, radio frequency (RF) magnetic control sputtering plating method, ion beam sputter method, microtron (electron cyclotron, ECR) sputtering method, traditional RF sputtering method, traditional DC sputtering method etc.In sputtering method, starting material use the target (target) of metal plate-like, and sputter gas can use helium, neon, argon, krypton, xenon etc., but preferably uses argon.The purity of gas preferably more than 99%, more preferably more than 99.5%.And, preferably use vacuum film formation in the formation of transparent oxide films.Main use sputtering method, sputter gas uses helium, neon, argon, krypton, xenon etc., sometimes also can optionally use oxygen and carry out.
Comprising the thickness in the duplexer of inorganics or the reflection horizon of metal as above-mentioned (2), is consider that transmittance determines less than 1% when making reflective sheet.
Above-mentioned (2) comprise the thickness preferably 70nm ~ 400nm in the duplexer of inorganics or the reflection horizon of metal, more preferably 100nm ~ 300nm, further more preferably 100nm ~ 250nm.When the situation that the Thickness Ratio 70nm of described layer is thin, sufficient metal level cannot be formed, therefore cannot obtain desired reflectivity.And even if thicker than 400nm, its effect does not also change.
The reflection horizon of duplexer or metal that above-mentioned (2) comprise inorganics is formed directly on above-mentioned decorative layer, also the film (the such as silver surface of silver-colored vapor-deposited film, or coating is carried out heating after comprising the solution of silver-colored complex compound and the surface of Ag film that formed on supporter) comprising above-mentioned (2) and comprise the duplexer of inorganics or the reflection horizon of metal can be fitted on decorative layer and be formed.The reflection horizon of duplexer or metal that above-mentioned (2) comprise inorganics is directly formed at the method that above-mentioned decorative layer manufactures and can enumerates: after directly coating on decorative layer by silver-colored complex compound solution, carry out the method heated.Also can arrange to touch with the centre of decorative layer and give layer, barrier layer etc. if necessary in the duplexer of metal or inorganic layer (the such as silver surface of silver-colored vapor-deposited film, or coating is carried out heating after comprising the solution of silver-colored complex compound and the surface of Ag film that formed on supporter).
Give in layer in contiguity and can use known bonding agent.When using bonding agent in contiguity imparting layer, consider from the viewpoint of thermotolerance, preferably silicone resin, fluororesin.Contiguity gives the thickness preferably 0.1 μm ~ 4 μm of layer.If more than 0.1 μm, then obtain and touch power fully.If less than 4 μm, then can prevent from being involved in bubble in the Stacking steps of the mask layer of step thereafter.
Known transparent oxide can be used in barrier layer, particularly preferably can use the transparent oxide such as oxide (ITO), silicon dioxide of zinc paste doped with 0 % by weight ~ 5 % by weight aluminium oxide or indium and tin.These materials can use two or more, also can form more than 2 layers.
The thickness preferably 1nm ~ 20nm during situation of transparent oxide is used, more preferably 5nm ~ 10nm in barrier layer.When the situation that the Thickness Ratio 1nm of described layer is thin, the barrier effect of failing desired by acquisition, produces cohesion sometimes in the metal level based on silver, or produces the corrosion because oxygen, chlorine, sulphur etc. cause.And even if thicker than 20nm, its effect is also unchanged.
When using the situation of metallic film in barrier layer, its thickness preferably 5nm ~ 50nm, more preferably 5nm ~ 30nm.When the situation that the Thickness Ratio 5nm of described layer is thin, desired barrier effect cannot be obtained, produce cohesion at the above-mentioned metal level based on silver.And even if thicker than 50nm, its effect is also unchanged.And, when using the situation of transparent oxide, the thickness preferably 1nm ~ 20nm of described layer, more preferably 5nm ~ 10nm.When the situation that the Thickness Ratio 1nm of described layer is thin, sometimes cannot obtain desired barrier effect, become and easily peel off from the duplexer of metal or inorganic layer.And even if thicker than 10nm, its effect is also unchanged.
< (3) mask layer >
The feature of manufacture method of the present invention is: sequentially stacked above-mentioned (1), above-mentioned (2) and above-mentioned (3) mask layer in the noncontact side of above-mentioned front panel.
The thickness of above-mentioned mask layer preferably 0.2 μm ~ 10 μm, particularly preferably is 0.8 μm ~ 6 μm by more preferably 0.5 μm ~ 8 μm.
In manufacture method of the present invention; preferably use the transfer film sequentially comprising temporary support and ray hardening resin layer, the ray hardening resin layer of the above-mentioned transfer film of transfer printing and form at least one key element of above-mentioned (3) mask layer 2c, the first transparent electrode pattern 3, second transparent electrode pattern 4, insulation course 5, electric conductivity key element 6, protective clear layer 7 optionally.Herein, as the above-mentioned transfer film sequentially comprising temporary support and ray hardening resin layer, the above-mentioned transfer film preferably used in the formation of above-mentioned decorative layer or be laminated with the transfer film comprising ray hardening resin layer of ray hardening resin layer in temporary support.In addition, the above-mentioned transfer film sequentially comprising temporary support and hardening resin layer more preferably comprises the layer that above-mentioned thermoplastic resin comprises as above-mentioned transfer film used in the formation of above-mentioned decorative layer between above-mentioned temporary support and hardening resin layer.In addition, above-mentioned " the hardening resin layer " sequentially comprised in the transfer film of temporary support and hardening resin layer " the ray hardening resin layer " that refer in the formation of above-mentioned decorative layer " dyed layer " in the above-mentioned transfer film used or comprise in the transfer film of ray hardening resin layer.
More preferably use and comprise the transfer film of ray hardening resin layer, the ray hardening resin layer of the above-mentioned transfer film of transfer printing and form at least one key element of above-mentioned (3) mask layer 2c, the first transparent electrode pattern 3, second transparent electrode pattern 4, insulation course 5, electric conductivity key element 6, protective clear layer 7 optionally; Particularly preferably be use sequentially comprise temporary support, thermoplastic resin, ray hardening resin layer the transfer film comprising ray hardening resin layer and formed.
Such as, when forming the situation of mask layer 2c of black, by use comprise black cosmetic layer as above-mentioned decorative layer and comprise above-mentioned dyed layer transfer film or comprise black light hardening resin layer and comprise the transfer film of ray hardening resin layer, formed at the above-mentioned black cosmetic layer of the surface transfer of above-mentioned front panel 1.
In addition, in the formation of the mask layer 2c of required light-proofness, use the transfer film that there is the specific layer that has thermoplastic resin between ray hardening resin layer and temporary support and form, can prevent from thus producing bubble during stacked transfer film, form the mask layer 2b etc. that there is no the high-quality of light leak.
When the dyed layer of above-mentioned transfer film or the above-mentioned above-mentioned ray hardening resin layer comprising the transfer film of ray hardening resin layer are used as the situation of mask layer, colorant can be used at the dyed layer of above-mentioned transfer film or above-mentioned comprising in the ray hardening resin layer of ray hardening resin layer.As above-mentioned colorant, known colorant (organic pigment, inorganic pigment, dyestuff etc.) can be used aptly.In addition, in the present invention, the potpourri etc. of the pigment such as white, black, red, blue, green can be used.
Particularly when above-mentioned mask layer being used as the situation of mask layer of black, considering from the viewpoint of optical density (OD), preferably using black colorant.Black colorant include, for example carbon black, titanium carbon, iron oxide, titanium dioxide, graphite etc., wherein preferably carbon black.
In order to be used as the mask layer of other colors, also described pigment in the paragraph [0183] of Jap.P. No. 4546276 publication ~ paragraph [0185] etc. or dyestuff mixing can be used.Specifically can to use in numbered paragraphs [the 0038] ~ numbered paragraphs [0054] of Japanese Patent Laid-Open 2005-17716 publication colorant etc. described in numbered paragraphs [the 0080] ~ numbered paragraphs [0088] of pigment described in numbered paragraphs [the 0068] ~ numbered paragraphs [0072] of described pigment and dyestuff, Japanese Patent Laid-Open 2004-361447 publication, Japanese Patent Laid-Open 2005-17521 publication aptly.
As the colorant used in beyond above-mentioned decorative layer, consider from the viewpoint of dispersion stabilization, preferably number average particle size is 0.001 μm ~ 0.1 μm, more preferably 0.01 μm ~ 0.08 μm.In addition, so-called " particle diameter " refers to the diameter of the bowlder electron micrograph image of particle being set to same area herein, and so-called " number average particle size " refers to and obtain above-mentioned particle diameter to multiple particle, its mean value of 100.
The above-mentioned transfer film comprising ray hardening resin layer, except above-mentioned ray hardening resin layer, above-mentioned temporary support and above-mentioned thermoplastic resin, also can comprise diaphragm or middle layer.As preferred formation and the lamination order of each layer, except using ray hardening resin layer to replace except dyed layer in above-mentioned transfer film, other are identical.
The formation that the above-mentioned ray hardening resin layer comprising the transfer film of ray hardening resin layer is preferably following.
As the above-mentioned monomer used in above-mentioned ray hardening resin layer, only otherwise violate aim of the present invention then there is no particular restriction, known polymerizable compound can be used.
Above-mentioned polymerizable compound can use polymerizable compound described in paragraph [the 0023] ~ paragraph [0024] of No. 4098550th, Jap.P..
As the above-mentioned bonding agent used in above-mentioned ray hardening resin layer, only otherwise violate aim of the present invention then there is no particular restriction, known polymerizable compound can be used.
When the transfer film comprising ray hardening resin layer is the situation of minus material, in ray hardening resin layer, preferably comprise alkali soluble resin, polymerizable compound, polymerization initiator or polymerization initiating system (Polymerization Initiationsystem).Can colorant, adjuvant etc. be used in addition, but be not limited thereto.
Comprise alkali soluble resin contained in the ray hardening resin layer of ray hardening resin layer as above-mentioned, polymkeric substance described in paragraph [the 0033] ~ paragraph [0052] of the paragraph [0025] of Japanese Patent Laid-Open 2011-95716 publication, Japanese Patent Laid-Open 2010-237589 publication can be used.
When the transfer film comprising ray hardening resin layer is the situation of positive shaped material, uses material etc. described in such as Japanese Patent Laid-Open 2005-221726 at ray hardening resin layer, but be not limited thereto.
As the above-mentioned Photoepolymerizationinitiater initiater used in above-mentioned ray hardening resin layer, polymerizable compound described in [0031] ~ [0042] described in Japanese Patent Laid-Open 2011-95716 publication can be used.
-adjuvant-
In addition, above-mentioned ray hardening resin layer also can use adjuvant.As above-mentioned adjuvant, include, for example surfactant described in paragraph [the 0060] ~ paragraph [0071] of the paragraph [0017] of Jap.P. No. 4502784 publication, Japanese Patent Laid-Open 2009-237362 publication, or described thermal polymerization inhibitor in the paragraph [0018] of Jap.P. No. 4502784 publication, other adjuvants described in paragraph [the 0058] ~ paragraph [0071] of Japanese Patent Laid-Open 2000-310706 publication in addition.
-solvent-
And, as utilizing the solvent being coated with and manufacturing when comprising the transfer film of ray hardening resin layer, solvent described in paragraph [the 0043] ~ paragraph [0044] of Japanese Patent Laid-Open 2011-95716 publication can be used.
Above, be illustrated centered by the situation of the transfer film comprising ray hardening resin layer for minus material, but above-mentioned photosensitive film also can be positive shaped material.
(viscosity of ray hardening resin layer)
Preferably the viscosity measured at 100 DEG C of ray hardening resin layer is in the region of 2000Pasec ~ 50000Pasec, meets following formula in addition.
The viscosity of the viscosity < ray hardening resin layer of thermoplastic resin
Herein, the viscosity of each layer can measure as described below.Utilize atmospheric pressure and drying under reduced pressure, in thermoplastic resin or ray hardening resin layer coating fluid, as working sample, such as, use vibron (Vibron) (DD-III type except desolventizing; Japan's Baldwin (Baldwin) incorporated company manufactures) as analyzer, mensuration start temperature be 50 DEG C, measure that end temp is 150 DEG C, programming rate measures under be 5 DEG C/min and vibration frequency being the condition of 1Hz/deg, can use the measured value at 100 DEG C.
Multiple first transparent electrode pattern > that the multiple pad part of < (4) extends in a first direction via coupling part and formed
The etched pattern that the manufacture method of capacitive input device of the present invention preferably uses the transfer film by sequentially comprising temporary support and hardening resin layer and formed carries out etch processes to transparent conductive material, forms above-mentioned first transparent electrode pattern, above-mentioned second transparent electrode pattern and above-mentioned electric conductivity key element at least one therefrom; More preferably use the transfer film by sequentially comprising temporary support, thermoplastic resin and hardening resin layer and the etched pattern formed carries out etch processes to transparent conductive material and forms at least one of above-mentioned first transparent electrode pattern, above-mentioned second transparent electrode pattern and above-mentioned electric conductivity key element.
In addition, more preferably use by comprise temporary support and ray hardening resin layer and comprise the transfer film of ray hardening resin layer and the etched pattern formed and form at least one of above-mentioned first transparent electrode pattern, above-mentioned second transparent electrode pattern and above-mentioned electric conductivity key element; Particularly preferably be the transfer film comprising ray hardening resin layer and the etched pattern that formed that use by sequentially comprising temporary support, thermoplastic resin and ray hardening resin layer.
On the other hand, the manufacture method of capacitive input device of the present invention preferably uses the transfer film that sequentially comprises temporary support and electric conductivity hardening resin layer and forms at least one of above-mentioned first transparent electrode pattern, above-mentioned second transparent electrode pattern and above-mentioned electric conductivity key element, more preferably uses the transfer film that sequentially comprises temporary support, thermoplastic resin and electric conductivity hardening resin layer and forms at least one of above-mentioned first transparent electrode pattern, above-mentioned second transparent electrode pattern and above-mentioned electric conductivity key element.
That is above-mentioned first transparent electrode pattern 3 preferably uses etch processes or comprises the transfer film of electric conductivity hardening resin layer and formed.
(etch processes)
When being formed the situation of above-mentioned first transparent electrode pattern 3 by etch processes, preferably first utilize sputter on the noncontact face of front panel 1 being formed with mask layer 2b etc., form the transparent electrode layer of ITO etc.Secondly, preferably on above-mentioned transparent electrode layer, use and comprise etching ray hardening resin layer as above-mentioned ray hardening resin layer, transfer film same with the transfer film used in the formation of above-mentioned mask layer in addition, utilize exposure, develop and form etched pattern.Thereafter, by etching transparent electrode layer, patterning is carried out to transparency electrode, etched pattern removing is formed the first transparent electrode pattern 3 etc.
When the above-mentioned transfer film comprising ray hardening resin layer is used as the situation of etching resist (etched pattern), can carries out in the same manner as said method and obtain Resist patterns.Above-mentioned etching can utilize known method described in paragraph [the 0048] ~ paragraph [0054] of Japanese Patent Laid-Open 2010-152155 publication etc. and be suitable for etching, resist is peeled off.
Such as etching method, the wet etching that impregnated in etching solution generally carried out can be enumerated.The etching solution used in Wet-type etching can be suitable for the etching solution selecting acid type or alkaline type according to etch target.The etching solution of acid type can illustrate the independent aqueous solution of the acid ingredients such as hydrochloric acid, sulfuric acid, hydrofluorite, phosphoric acid, the mixed aqueous solution etc. of the salt such as acid ingredient and iron chloride, ammonium fluoride, potassium permanganate.Acid ingredient also can use multiple acid ingredient to combine.And the etching solution of alkaline type can illustrate the independent aqueous solution of the alkali compositions such as the salt of the such organic amine of NaOH, potassium hydroxide, ammonia, organic amine, Tetramethylammonium hydroxide, the mixed aqueous solution etc. of the salt such as alkali composition and potassium permanganate.Alkali composition also can use multiple alkali composition to combine.
The temperature of etching solution is not particularly limited, preferably less than 45 DEG C.The resin pattern used as etching mask (etched pattern) uses above-mentioned decorative layer and is formed, and therefore plays tolerance excellent especially for the acidity of this kind of temperature province and the etching solution of alkalescence.Therefore prevent resin pattern in an etching step from peeling off, make the part that there is not resin pattern by selective etch.
After above-mentioned etching, also optionally can carry out cleaning step, drying steps to prevent line from polluting.About cleaning step, such as, utilize pure water clean 10 seconds ~ 300 seconds base material and carry out at normal temperatures, about drying steps, use blowing (airblow), be suitable for adjusting blow pressure (0.1kg/cm
2~ 5kg/cm
2left and right) and carry out.
Secondly, as the stripping means of resin pattern, be not particularly limited, include, for example 30 DEG C ~ 80 DEG C, preferably 50 DEG C ~ 80 DEG C at, base material be impregnated in the method for in the stripper in stirring 5 minutes ~ 30 minutes.The resin pattern used as etching mask is the resin pattern demonstrating excellent resistance fluidity as described above below 45 DEG C, if fluid temperature becomes more than 50 DEG C, then demonstrates due to alkaline stripper and the character of swelling.Due to this kind of character, use the stripper of 50 DEG C ~ 80 DEG C if having and carry out strip step, then the advantage that tails off of the stripping residue of step time shorten, resin pattern.That is, by arranging the difference of fluid temperature between above-mentioned etching step and strip step, the resin pattern used as etching mask plays good resistance fluidity in an etching step, in strip step, demonstrate good fissility on the other hand, the opposite characteristic of resistance fluidity and fissility can be met simultaneously.
Stripper include, for example and makes the inorganic base such as NaOH, potassium hydroxide composition or the organic base such as tertiary amine, quarternary ammonium salt component dissolves in water, dimethyl sulfoxide (DMSO), 1-METHYLPYRROLIDONE or these mixed solution.Also can use above-mentioned stripper, utilize spray-on process, spray process, cover liquid method etc. and peel off.
(use comprises the method for the transfer film of electric conductivity hardening resin layer)
And, also the transfer film comprising temporary support and hardening resin layer can be used as stripping (lift-off) material, form the first transparent electrode pattern, the second electrode pattern and other electroconductive members, above-mentioned transfer film can enumerate the above-mentioned transfer film or the above-mentioned transfer film comprising ray hardening resin layer that comprise above-mentioned dyed layer.When this situation, also preferably the above-mentioned transfer film comprising temporary support and hardening resin layer comprises above-mentioned thermoplastic resin between above-mentioned temporary support and above-mentioned hardening resin layer.When this situation, use comprise above-mentioned dyed layer above-mentioned transfer film or comprise ray hardening resin layer transfer film and after carrying out patterning, whole of base material forms transparency conducting layer, then dissolve together with piled up transparency conducting layer and remove the dyed layer comprised in the above-mentioned transfer film of above-mentioned dyed layer or the described ray hardening resin layer in the transfer film comprising ray hardening resin layer, desired pattern for transparent conductive layer (stripping method) can be obtained thus.
When use comprises the transfer film of electric conductivity hardening resin layer and forms the situation of above-mentioned first transparent electrode pattern 3, formed by the surface transfer above-mentioned electric conductivity hardening resin layer at above-mentioned front panel 1.
Above-mentionedly comprise the transfer film of electric conductivity hardening resin layer if use and form above-mentioned first transparent electrode pattern 3, even if then there is the substrate (front panel) of peristome, resist composition does not also spill from opening portion, when not polluting substrate back side, the touch-screen with thin layer/light-weighted advantage can be manufactured with simple step.
In addition, in the formation of the first transparent electrode pattern 3, by using the transfer film that there is the specific layer that comprises thermoplastic resin between electric conductivity hardening resin layer and temporary support and form, can prevent from producing bubble during stacked transfer film, formation excellent electric conductivity, the first transparent electrode pattern 3 that resistance is little.
And, when above-mentioned transfer film comprises the situation of electric conductivity hardening resin layer, containing conducting fibre etc. in above-mentioned electric conductivity hardening resin layer.
~ electric conductivity hardening resin layer (conducting fibre) ~
During by the situation of the above-mentioned transfer film being laminated with electric conductivity hardening resin layer for the formation of transparent electrode pattern or other electric conductivity key elements, following conducting fibre etc. can be used in decorative layer.
There is no particular restriction for the structure of conducting fibre, can optionally suitable to select, and preferably solid construction and hollow structure is arbitrary.
, sometimes the fiber of solid construction is called " line " herein, the fiber of hollow structure is called " pipe ".And be 5nm ~ 1 by average minor axis length sometimes, 000nm, average major axis length are that the conducting fibre of 1 μm ~ 100 μm is called " nano wire ".
And be 1nm ~ 1 by average minor axis length sometimes, 000nm, average major axis length are 0.1 μm ~ 1,000 μm and the conducting fibre with hollow structure are called " nanotube ".
As the material of above-mentioned conducting fibre, if have electric conductivity, there is no particular restriction, can optionally be suitable for selecting, preferably metal and carbon is at least arbitrary, in these, above-mentioned conducting fibre particularly preferably is at least arbitrary of metal nanometer line, metal nano-tube and carbon nano-tube.
-metal nanometer line-
--metal--
There is no particular restriction for the material of above-mentioned metal nanometer line, such as preferably be selected from least a kind of metal of the group be made up of the 4th cycle of long period table (IUPAC1991), the 5th cycle and the 6th cycle, more preferably be selected from least a kind of metal of the 2nd race ~ the 14th race, more preferably be selected from least a kind of metal of the 2nd race, the 8th race, the 9th race, the 10th race, the 11st race, the 12nd race, the 13rd race and the 14th race further, particularly preferably be and comprise these metals as major component.
Above-mentioned metal include, for example copper, silver, gold, platinum, palladium, nickel, tin, cobalt, rhodium, iridium, iron, ruthenium, osmium, manganese, molybdenum, tungsten, niobium, tantalum, titanium, bismuth, antimony, lead, these alloy etc.With regard to the aspect of excellent electric conductivity, the material of the material preferably mainly containing silver in these or the alloy containing the metal beyond silver and silver.
It is represent the silver containing more than 50 quality %, preferably more than 90 quality % in metal nanometer line that above-mentioned what is called mainly contains silver.
Above-mentioned with the alloy of silver in the metal that uses can enumerate platinum, osmium, palladium and iridium etc.These metals can be used alone a kind, also can and use two or more.
--shape--
As the shape of above-mentioned metal nanometer line, there is no particular restriction, can optionally be suitable for selecting, cylindric, rectangular-shaped, section such as can be used to be the arbitrary shapes such as polygonal column, in the purposes of required high transparent, the section shape that preferably polygonal angle that is cylindric, section is round and smooth.
The section shape of above-mentioned metal nanometer line, by coating metal nano wire aqueous dispersions on base material, utilizes transmission electron microscope (Transmission Electron Microscope, TEM) observe section and investigate.
The angle of above-mentioned metal nanometer line section represents each limit of section to extend, the periphery of the point crossing with the vertical line fallen from adjacent edge.And " each limit of section " is the straight line that these adjacent angles and angle link.When this situation, using above-mentioned " the periphery length of section " relative to the ratio of the combined length on above-mentioned " each limit of section " as sharpness.As sharpness, such as, in metal nanometer line section as shown in Figure 9, the periphery length that can utilize the section represented with solid line and the ratio of the pentagonal periphery length be represented by dotted lines and represent.By described sharpness be less than 75% section shape be defined as the round and smooth section shape in angle.Above-mentioned sharpness preferably less than 60%, more preferably less than 50%.If above-mentioned sharpness is more than 75%, then sometimes there is electronics in local, described angle place, plasmon (plasmon) absorbs to be increased, therefore remaining yellow hue etc. and cause transparency deterioration.And the rectilinearity of the edge part of pattern reduces sometimes, produces coarse.The lower limit of above-mentioned sharpness preferably 30%, more preferably 40%.
--average minor axis length footpath and average major axis length--
Average minor axis length (sometimes also referred to as " average minor axis footpath ", " mean diameter ") preferably below the 150nm of above-mentioned metal nanometer line, more preferably 1nm ~ 40nm, more preferably 10nm ~ 40nm further, particularly preferably is 15nm ~ 35nm.
If above-mentioned average minor axis curtailment 1nm, then there is oxidative resistance and worsen, the phenomenon that permanance is deteriorated; If more than 150nm, then there is the scattering produced caused by metal nanometer line, the phenomenon of the transparency fully cannot be obtained.
The average minor axis length of above-mentioned metal nanometer line can use transmission electron microscope (TEM; The manufacture of NEC incorporated company, JEM-2000FX), 300 metal nanometer lines are observed, obtains the average minor axis length of metal nanometer line according to its mean value.In addition, the minor axis of above-mentioned metal nanometer line and non-circular situation time minor axis length can using the longest as minor axis length.
The average major axis length (being sometimes referred to as " average length ") preferably 1 μm ~ 40 μm of above-mentioned metal nanometer line, more preferably 3 μm ~ 35 μm, more preferably 5 μm ~ 30 μm further.
If above-mentioned average major axis length is less than 1 μm, then exists and be difficult to form fine and close net (network), the phenomenon of sufficient electric conductivity cannot be obtained; If more than 40 μm, then there is metal nanometer line long and be wound around during fabrication, generate the phenomenon of condensation product in the fabrication process.
The average major axis length of above-mentioned metal nanometer line such as can use transmission electron microscope (TEM; The manufacture of NEC incorporated company, JEM-2000FX), 300 metal nanometer lines are observed, obtains the average major axis length of metal nanometer line according to its mean value.In addition, when the situation that above-mentioned metal nanometer line is bending, consider the circle as arc, using the value that calculates according to its radius and curvature as long axis length.
The viewpoint of the technique adaptabilities such as the development time when drying when stability or the coating of coating fluid or patterning is considered, the thickness of electric conductivity hardening resin layer preferably 0.1 μm ~ 20 μm, more preferably 0.5 μm ~ 18 μm, particularly preferably be 1 μm ~ 15 μm.Consider from the viewpoint of the stability of electric conductivity and coating fluid, above-mentioned conducting fibre is relative to the content preferably 0.01 quality % ~ 50 quality % of all solids composition of above-mentioned electric conductivity hardening resin layer, more preferably 0.05 quality % ~ 30 quality %, particularly preferably is 0.1 quality % ~ 20 quality %.
< (5) and above-mentioned first electrode pattern electrical isolation, the direction intersected with above-mentioned first direction extends and the multiple second electrode pattern > comprising multiple pad part that formed
Second electrode pattern of capacitive input device of the present invention also can be transparent electrode pattern.In addition, in this manual, replace the second electrode pattern with the second transparent electrode pattern and be illustrated, but preferred embodiment identical preferred embodiment also with the second transparent electrode pattern of the second electrode pattern.
Above-mentioned second transparent electrode pattern 4 can use above-mentioned etch processes or above-mentionedly comprises the transfer film of electric conductivity hardening resin layer and formed.Now preferred embodiment identical with the formation method of above-mentioned first transparent electrode pattern 3.
< (6) makes the insulation course > of above-mentioned first transparent electrode pattern and above-mentioned second electrode pattern electrical isolation
When forming the situation of insulation course 5, formed by such as under type: use and comprise insulativity dyed layer as the above-mentioned transfer film of above-mentioned dyed layer or comprise the above-mentioned transfer film that comprises ray hardening resin layer of insulativity ray hardening resin layer as above-mentioned ray hardening resin layer, at the above-mentioned insulativity dyed layer of the surface transfer of the above-mentioned front panel 1 being formed with the first transparent electrode pattern or ray hardening resin layer.
In addition, when using transfer film to form the situation of insulation course, consider from the viewpoint maintaining insulativity, the thickness of insulation course preferably 0.1 μm ~ 5 μm, particularly preferably is 0.5 μm ~ 2 μm by more preferably 0.3 μm ~ 3 μm.
At least one of < (7) and above-mentioned first transparent electrode pattern and above-mentioned second electrode pattern is electrically connected, the electric conductivity key element > different from above-mentioned first transparent electrode pattern and above-mentioned second electrode pattern
Other electric conductivity key elements 6 above-mentioned can use above-mentioned etch processes or above-mentionedly comprise the transfer film of electric conductivity hardening resin layer and formed.
< (8) protective clear layer >
When forming the situation of protective clear layer 7; formed by such as under type: use and comprise transparent dyed layer as the above-mentioned transfer film of above-mentioned dyed layer or comprise the above-mentioned transfer film that comprises ray hardening resin layer of transparent optical hardening resin layer as above-mentioned ray hardening resin layer, at the above-mentioned transparent dyed layer of the surface transfer of the above-mentioned front panel 1 being formed with each key element or transparent optical hardening resin layer.
When using transfer film to form the situation of protective clear layer, consider from the viewpoint playing sufficient surface protection ability, the thickness of protective clear layer preferably 0.5 μm ~ 10 μm, particularly preferably is 1 μm ~ 3 μm by more preferably 0.8 μm ~ 5 μm.
<< capacitive input device and comprise the image display device >> of capacitive input device as inscape
Utilize the capacitive input device of manufacture method of the present invention and gained, and (on July 6th, 2009 issues as the image display device of inscape applicable " up-to-date touch screen technology " to comprise described capacitive input device, Age of Technology incorporated company (Techno Times Co., Ltd)), male two chief editors of three paddy, " technology of touch-screen and exploitation ", CMC publishes (2004, 12), international flat-panel monitor exhibition (FPD International 2009Forum) T-11 lecture teaching material (textbook) in 2009, the formation disclosed in Cypress Semiconductor Co., Ltd (Cypress Semiconductor Corporation) application note AN2292 etc.
[embodiment]
Below, utilize embodiment to the present invention's more specific description in addition.
Material shown in following examples, use amount, ratio, contents processing, processing sequence etc. are only otherwise departing from aim of the present invention then can be suitable for changing.Therefore, scope of the present invention is not restrictively explained due to concrete example shown below.In addition, as long as no special instructions, then " % " and " part " is quality criteria.
[embodiment 1]
< decorative layer forms the preparation > with transfer film L1
Be in the polyethylene terephthalate film temporary support of 75 μm at thickness, use slit (slit) shape nozzle and be coated with the thermoplastic resin coating fluid comprising following formula H1, at 100 DEG C, make it after dry 2 minutes, at 120 DEG C, make its dry 1 minute further, form the thermoplastic resin that dry thickness is 15 μm.Herein, the temperature " 100 DEG C " in drying condition and " 120 DEG C " are the temperature of dry wind.Temperature in following drying condition too.Secondly, coating comprises the middle layer coating fluid of following formula P1, makes them after dry 2 minutes, make its dry 10 minutes further and carry out drying at 120 DEG C at 100 DEG C.Further coating comprises the dyed layer coating fluid of following formula L1 and makes it dry.The color white layer that the middle layer that to arrange as mentioned above dry film thickness in temporary support be thermoplastic resin, the dry film thickness of 15.1 μm is 1.6 μm, dry film thickness are 2.5 μm, finally crimps diaphragm (thickness is the polypropylene screen of 12 μm).Make as mentioned above temporary support, transfer materials that thermoplastic resin, middle layer (oxygen barrier film), dyed layer, diaphragm become to be integrated, sample name is set to decorative layer formation transfer film L1.
(thermoplastic resin coating fluid: formula H1)
Above-mentioned fluorine based polymer is 40 parts of C
6f
13cH
2cH
2oCOCH=CH
2with 55 parts of H (OCH (CH
3) CH
2)
7oCOCH=CH
2with 5 parts of H (OCHCH
2)
7oCOCH=CH
2multipolymer, the solution that weight average molecular weight is 30,000, methyl ethyl ketone is 30 quality %.
In addition, thermoplastic resin coating fluid H1 except the viscosity of 120 DEG C after desolventizing be 1500Pasec.
(middle layer coating fluid: formula P1)
-composition of White Pigment Dispersion thing 1-
The manufacture > of < capacitive input device of the present invention
Use the transfer film of above-mentioned gained as decorative layer formation transfer film, manufactured the capacitive input device of embodiment 1 by following method.
The formation >> of << decorative layer
For the intensive treatment glass (300mm × 400mm × 0.7mm) being formed with peristome (15mm φ), one side blows the attached glass cleaning agent solution 20 seconds being adjusted to 25 DEG C by spray, one side is cleaned with the rotating brushes with nylon hair, after pure water cleaning showers, blow attached silane Coupling Solution (N-β-(amino-ethyl)-gamma-amino propyl trimethoxy silicane is 0.3 quality % aqueous solution, trade name: KBM603, Shin-Estu Chemical Co., Ltd's manufacture) 20 seconds by spray, carry out pure water cleaning showers.Described base material is carried out in base material preheating device at 90 DEG C the preheating of 2 minutes.
From the decorative layer formation of gained diaphragm 25 side with transfer film L1; through diaphragm 25, dyed layer 24, middle layer 23 is cut as described in Figure 10 and Figure 11; until the otch of a part for thermoplastic resin 22, be divided into the non-image portion 31 of the image portion 32 in order to transfer printing dyed layer, not transfer printing dyed layer.Secondly, use adhesive tape and only the diaphragm 25 in non-image portion 31 peeled off, similarly using adhesive tape to be peeled off with these 2 layers, middle layer 23 by the dyed layer 24 in non-image portion 31 simultaneously.Only the diaphragm 25 in the region corresponding with image portion 32 is peeled off further.
With the surface of the dyed layer 24 in the image portion 32 of exposing after diaphragm 25 is peeled off, with above-mentioned at 90 DEG C through preheating and the mode that the surface of having carried out the tempered glass base material of silane coupling process connects is carried out superimposed; use stacked machine (Hitachi's industry (industries) incorporated company manufacture (rummy gram (Lamic) II type)), rubber rollers temperature be 120 DEG C, line pressure is 100N/cm, conveyance speed is carried out stacked under being 2.5m/min.Then on the surface with thermoplastic resin 22, the temporary support 21 of polyethylene terephthalate is peeled off, removing temporary support 21.
To be formed with transfer film L1 at the image portion 32 transfer printing dyed layer 24 of above-mentioned glass baseplate, middle layer 23 and thermoplastic resin 22 by decorative layer thus, formed with transfer film L1 at the non-image portion 31 of above-mentioned glass baseplate only transfer printing thermoplastic resin 22 by decorative layer.
Secondly, with triethanolamine system developer solution (triethanolamine containing 30 quality %, utilize pure water by trade name T-PD2 (Fuji Photo Film Co., Ltd.'s manufacture) the dilution liquid of 10 times) at 30 DEG C, under (flat nozzle) pressure of twitching one's mouth is 0.1MPa, carries out the spray development of 60 seconds, the thermoplastic resin 22 in the image portion 32 of above-mentioned glass baseplate is removed with the thermoplastic resin 22 in middle layer 23 and non-image portion 31.Then, to the attached air of the upper surface blown of described glass baseplate after de-liquid (drainliquid off), blow attached pure water 10 seconds by spray, carry out pure water cleaning showers, next moisture blowing attached air and remove on glass baseplate.
Thereafter, under atmospheric pressure (1atm), in air, at 240 DEG C, carry out the rear baking process of 45 minutes and make dyed layer 24 become decorative layer, obtaining the front panel being formed with decorative layer.
The evaluation >> of << decorative layer
(determining film thickness)
Use surface roughness meter P-10 (manufacture of KLA-Tencor (TENCOR) company) and measure the thickness of the decorative layer of front panel intensive treatment glass being formed with decorative layer.Its result is recorded in following table 1.In addition, in following table 1, " μ " expression " μm ".
(evaluation of transferability)
By as noted above and make decorative layer formation transfer film L1 diaphragm peel off; the dyed layer of decorative layer formation transfer film L1 is superimposed on the surface of the tempered glass of carrying out prepared in the manufacture of capacitive input device of the present invention described later silane coupling process; after fitting with stacked machine; the temporary support of polyethylene terephthalate film is peeled off; observe the film surface of the temporary support peeled off, evaluate according to following benchmark.More than C is practical rank.
< metewand >
A: whole complete transfer printing, transferability is extremely good.
B: the only marginal existence of film transfer residual slightly, transferability is good.
C: there is slight transfer residual in film entirety, transferability is common.
D: transfer residual film existing membranaceous dyed layer (photoresist) everywhere, transferability is poor.
Evaluation result is recorded in following table 1.
(evaluation of pre-cut)
Diaphragm 25 side of Self-decorating layer formation transfer film; through diaphragm 25, dyed layer 24, middle layer 23 is cut as described in Figure 12; until the otch of a part for thermoplastic resin 22 and after carrying out pre-cut; carry out the picture pattern outline portion of formed dyed layer and the observation by light microscope of peripheral part, according to following benchmark evaluation at profile and the whether remaining cutting bits of periphery.Practical rank is more than D, preferably more than C.
< metewand >
A: section is cut off neatly, completely without the dirt of cutter, pre-cut adaptability is extremely good.
B: the only marginal existence of section dirt slightly or peel off, completely without the dirt of cutter, pre-cut adaptability is good.
C: there is dirt or peel off slightly at section, but smooth and no problem after baking, the dirt of cutter is also extremely few, and pre-cut adaptability is common.
D: there is the wide dirt of number mm at section or peel off, even if carrying out toasting also does not recover, practicality needs repair.The dirt of cutter is serious, must every once cleaning for several times, and pre-cut adaptability is poor.
E: fall to being destroyed for starting point and image section with the scarce of section, there is problem in practical use.Or the dirt of cutter is serious, must clean, non-constant at every turn.
Evaluation result is recorded in following table 1.
The formation >> in << reflection horizon
< reflection horizon forms the preparation > with transfer film M1
The polyimide film of 2.0 μm is laid in vacuum cavity, use Ag target (atom ratio Ag/Ga=98.5/1.5), utilize DC magnetic control sputtering plating (end vacuum 0.27 × below mPa, Ar air pressure: 0.27Pa, sputtering power: 200W, anode-cathode distance: 55mm, substrate temperature: room temperature), form the Ag film that thickness is 200nm thereon.
Described Ag evaporation face is coated with following contiguity and gives layer coating fluid, at 100 DEG C, carry out the drying of 2 minutes, make the argentum reflecting layer film giving layer with contiguity of 0.6 μm.
(contiguity gives layer coating fluid: formula P1)
To the described argentum reflecting layer film with protective seam, razor is put in the face of giving layer from contiguity.The mode that time overlapping with front panel with the part that the inner side of the decorative layer with frame shape is overlapping, cone angle (cone angle) becomes about 30 degree cuts otch.
Utilize silane coupling solution to process front panel, carry out pure water cleaning showers.In base material preheating device, described base material is carried out at 90 DEG C the heating of 2 minutes.Then, the mode of giving ply with the contiguity of the decorative layer of front panel and argentum reflecting layer film in the same manner as the formation of the decorative layer of embodiment 1 is carried out stacked.
After the cooling period, make argentum reflecting layer film become downside and move on flat sheet metal by stacked front panel, along the edge contact razor of front panel, the argentum reflecting layer film stretched out is cut.
Measure brightness from the face not forming decorative layer of front panel, result L value is 87.0, b value is 1.62.
And utilize the whiteness of the decorative layer of visual judgement front panel, result is and no problem, is good rank.
The formation >> of << mask layer
< mask layer forms the preparation > with transfer film K1
In the preparation of above-mentioned decorative layer formation transfer film L1; the dyed layer coating fluid comprising above-mentioned formula L1 is replaced by the mask layer formation coating fluid comprising following formula K1, carries out in the same manner as the preparation of decorative layer formation transfer film L1 in addition and obtain the mask layer formation transfer film K1 that temporary support, thermoplastic resin, middle layer (oxygen barrier film), mask layer formation ray hardening resin layer and diaphragm become to be integrated.The thickness of mask layer formation ray hardening resin layer is 2.2 μm.
(mask layer formation coating fluid: formula K1)
-composition of K pigment dispersion 1-
The formation >> of << mask layer
Carry out in the same manner as the cleaning of the intensive treatment glass substrate in the formation of decorative layer, the front panel (front panel hereinafter also referred to decorative layer) being formed with decorative layer is cleaned.
Thereafter, by not hemisect only by diaphragm from the surface of the stacked front panel with decorative layer after cleaning of the mask layer formation transfer film K1 of whole removing of film (base material temperature: 140 DEG C, rubber rollers temperature is 130 DEG C, line pressure is 100N/cm, conveyance speed is 2.2m/min).After temporary support is peeled off, utilize the proximity exposure machine (high-new electronic engineering incorporated company of Hitachi manufactures) with extra-high-pressure mercury vapour lamp, under the state that the front panel with decorative layer and exposed mask (having the quartzy exposed mask of frame pattern) that are laminated with mask layer formation transfer film K1 stand vertically, distance between exposed mask face and described mask layer formation ray hardening resin layer is set as 500 μm, with 100mJ/cm
2the exposure of (i ray) carries out pattern exposure.
Secondly, use triethanolamine system developer solution (triethanolamine containing 30 quality %, utilize pure water that trade name T-PD2 (Fuji Photo Film Co., Ltd.'s manufactures) is diluted the liquid of 10 times), the development of 600 seconds is carried out at 33 DEG C, secondly sodium carbonate/bicarbonate system developer solution (utilizing pure water by the liquid of trade name T-CD1 (Fuji Photo Film Co., Ltd.'s manufacture) dilution 5 times) is used, at 32 DEG C, spray pressure is set as 0.1MPa, carry out the development of 45 seconds, utilize thereafter pure water to be cleaned.
Then, use the cleaning fluid containing surfactant (utilizing pure water by the liquid of trade name T-SD3 (Fuji Photo Film Co., Ltd.'s manufacture) dilution 10 times), at 33 DEG C, pyramid type nozzle pressure is by spray blowout 20 seconds under 0.1MPa, further utilization has the rotating brushes of soft nylon hair, the pattern image that wiping is formed and carry out residue removing.Utilize UHV (ultra-high voltage) washer jet further, under the pressure of 9.8MPa, spray ultrapure water and carry out residue removing.
Secondly, under air from the surface of front panel and the back side respectively with 1300mJ/cm
2exposure carry out post-exposure, at 240 DEG C, carry out the rear baking process of 15 minutes further, obtain that to be formed with thickness with the order of front panel, decorative layer, reflection horizon and mask layer be the mask layer of 2.0 μm, the front panel of reflection horizon and decorative layer.
From being above-mentionedly formed with decorative layer, the opposition side in the face with decorative layer of front panel of reflection horizon and mask layer measures colourity, result is L=87.0, b=1.75, by following method, the whiteness of the decorative layer of visual judgement front panel, reflection horizon and mask layer, result is and no problem, is good rank.Brightness is A, and whiteness is A.
<< is formed with the evaluation >> of front panel of decorative layer, reflection horizon and mask layer
(evaluation of brightness)
Intensive treatment glass is formed in the front panel of decorative layer, reflection horizon and mask layer, from with the contrary face, face being formed with decorative layer, reflection horizon and mask layer, using black paper as pad, 938 spectrodensitometers (Spectrodensitometer) using Ai Seli (X-Rite) company to manufacture measure, and evaluate brightness according to L value.Practical rank is more than D, preferably more than C.
A:L value is more than 85
B:L value is more than 83 and less than 85
C:L value is more than 81 and less than 83
D:L value is more than 77 and less than 81
E:L value is less than 77
Evaluation result is recorded in following table 1.
(evaluation of whiteness)
Allow 60 people after the surface of substrate and the back side are observed carry out transfer printing as described above on intensive treatment glass, under atmospheric pressure (1atm), in air, at 240 DEG C, carry out the rear baking of 30 minutes and be formed with decorative layer and then be formed with the front panel of reflection horizon and mask layer, carrying out the evaluation of whiteness based on following metewand.Practical rank is more than C.
< metewand >
A: the number being identified as band yellow hue is 0 people ~ 1 people
B: the number being identified as band yellow hue is 2 people ~ 3 people
C: the number being identified as band yellow hue is 4 people ~ 5 people
D: the number being identified as band yellow hue is 6 people ~ 10 people
E: the number being identified as band yellow hue is more than 11 people
Evaluation result is recorded in following table 1.
(reticulate pattern evaluation)
The front panel of decorative layer, reflection horizon and mask layer will be formed with on intensive treatment glass, 23 DEG C, relative humidity places after 24 hours under being the environment of 50%, use reflected light and transmitted light, the opposing face in the surface utilizing the decorative layer of microscopic examination front panel and the face being formed with decorative layer, evaluates based on following benchmark.More than C is practical rank.
< metewand >
A: the generation not seeing tiny " gauffer " on decoration layer pattern surface completely, extremely well.
B: only see at the central portion on decoration layer pattern surface and partially producing extremely weak " gauffer ", self-forming has the opposing face None-identified in the face of decorative layer, well.
C: see that decoration layer pattern surface produces tiny " gauffer " etc. slightly, but self-forming has the opposing face None-identified in the face of decorative layer is the rank of practical upper also no problem, common.
D: see generation much tiny " gauffer " etc., self-forming has the opposing face in the face of decorative layer also to observe weak inequality is the rank of difference.
E: see in whole face and producing tiny " gauffer " etc., self-forming has the opposing face in the face of decorative layer also to observe inequality, is the rank of extreme difference.
Evaluation result is recorded in following table 1.
(evaluation of productive rate)
Make the front panel that 500 pieces are formed with decorative layer, reflection horizon and mask layer on intensive treatment glass, investigate the productive rate of spendable front panel.
< metewand >
A: productive rate, more than 94%, is very good rank.
B: productive rate is more than 91% and less than 94, is good rank.
C: productive rate is more than 88% and less than 91%, common.
D: productive rate is more than 83% and less than 88%, poor.
E: productive rate less than 83%, non-constant.
Evaluation result is recorded in following table 1.
(evaluation of decorative layer adhesion)
Based on JIS K 5600-5-6:ISO2409 (cross-cut method), intensive treatment glass is formed decorative layer, reflection horizon and mask layer front panel decorative layer on the width of 1mm incision otch, utilize cellophane tape peel off and observe whether there is peeling off and pin hole (pin hole) of decor surface.More than C is practical rank.
< metewand >
A: decorative layer composition does not peel off completely is the rank that contiguity is very good.
B: the decorative layer composition only existed a little at notching edge peels off, but completely without the part of grid, be good rank.
C: the grid of decorative layer composition peels off and is more than 0% and less than 2%, is practical rank, common.
D: see that the grid of decorative layer composition peels off and be more than 2% and peeling off of grid decorative layer composition less than 5%, practicality needs repair is poor.
E: see peeling off of the grid decorative layer composition of more than 5%, practicality needs repair, non-constant.
Evaluation result is recorded in following table 1.
(evaluation of peristome dirt)
Utilize microscopic examination on intensive treatment glass, be formed with the peristome of front panel of decorative layer, reflection horizon and mask layer, observe decorative layer composition and whether exist as dirt.More than C is practical rank.
< metewand >
A: at peristome completely not with the dirt of decorative layer composition, extremely well.
B: the dirt slightly only seeing decorative layer composition at peristome edge is spendable degree, well.
C: from peristome edge, finds the dirt of decorative layer composition about aperture number μm, can use on practical, common.
D: from peristome edge, at aperture until the centre of the thickness of glass, sees the dirt of decorative layer composition, practicality needs repair, poor.
E: from peristome edge, by aperture until the rear side of glass sees the dirt of decorative layer composition, non-constant.
Evaluation result is recorded in following table 1.
(evaluation of peristome breach)
Utilize microscopic examination on intensive treatment glass, be formed with the peristome periphery of front panel of decorative layer, reflection horizon and mask layer, observe whether there is peeling off and pin hole of decorative layer composition.
< metewand >
A: peeling off of the neighbouring complete decorative layer composition without substrate of peristome is very good rank.
B: only peel off slightly at peristome marginal existence, but other parts are completely without peeling off, and are good ranks.
C: see peeling off of decorative layer composition at peristome perimeter number μm is for using in practicality, common.
D: see peeling off of decorative layer composition in the scope of peristome periphery number mm, practicality needs repair, poor.
E: see peeling off of decorative layer composition in the scope of peristome periphery number cm, practicality needs repair, non-constant.
The formation >> of << first transparent electrode pattern
The formation > of < transparent electrode layer
The front panel being formed with decorative layer and mask layer is directed in vacuum cavity, uses SnO
2containing ratio is the ITO target (indium: tin=95: 5 (mol ratios)) of 10 quality %, utilize DC magnetic control sputtering plating (condition: the temperature of base material is 250 DEG C, argon pressure is 0.13Pa, oxygen pressure is 0.01Pa) to form the ito thin film that thickness is 40nm, obtain the front panel being formed with transparent electrode layer.The surface resistance of ito thin film is 80 Ω/.
The < etching preparation > of transfer film E1
In the preparation of above-mentioned decorative layer formation transfer film L1; the dyed layer coating fluid comprising above-mentioned formula L1 is replaced by the etching ray hardening resin layer coating fluid comprising following formula E1, carries out in the same manner as the preparation of decorative layer formation transfer film L1 in addition and obtain the etching transfer film E1 (thickness of etching ray hardening resin layer is 2.0 μm) that temporary support, thermoplastic resin, middle layer (oxygen barrier film), etching ray hardening resin layer and diaphragm become to be integrated.
(etching ray hardening resin layer coating fluid: formula E1)
The formation > of < first transparent electrode pattern
Carry out in the same manner as the formation of mask layer; to be formed decorative layer, reflection horizon, mask layer, transparent electrode layer front panel clean, the stacked etching transfer film E1 (base material temperature: 130 DEG C, rubber rollers temperature is 120 DEG C, line pressure is 100N/cm, conveyance speed is 2.2m/min) eliminating diaphragm.After temporary support being peeled off, the distance between exposed mask (having the quartzy exposed mask of transparent electrode pattern) face and described etching ray hardening resin layer is set as 200 μm, with 50mJ/cm
2the exposure of (i ray) carries out pattern exposure.
Secondly, use the triethanolamine system developer solution (triethanolamine containing 30 quality %, utilize pure water by the liquid of trade name T-PD2 (Fuji Photo Film Co., Ltd.'s manufacture) dilution 10 times), the process of 100 seconds is carried out at 25 DEG C, secondly the cleaning fluid containing surfactant (utilizing pure water by the liquid of trade name T-SD3 (Fuji Photo Film Co., Ltd.'s manufacture) dilution 10 times) is used, the process of 20 seconds is carried out at 33 DEG C, utilize rotating brushes, UHV (ultra-high voltage) washer jet carries out residue removing, the rear baking process of 30 minutes is carried out further at 130 DEG C, acquisition is formed with decorative layer, reflection horizon, mask layer, transparent electrode layer and the front panel of etching with ray hardening resin layer pattern.
The front panel of decorative layer, reflection horizon, mask layer, transparent electrode layer and etching ray hardening resin layer pattern will be formed, be immersed in and be placed with ITO etchant (hydrochloric acid, potassium chloride solution, liquid temperature is 30 DEG C) etching bath in, carry out the process of 100 seconds, the transparent electrode layer in the region of exposing not covered by etching light hardening resin layer dissolves removing, obtains the front panel with transparency electrode layer pattern with decorative layer, reflection horizon, mask layer, etching ray hardening resin layer pattern.
Secondly, the front panel with transparency electrode layer pattern of etching ray hardening resin layer pattern will be had, be immersed in and be placed with anticorrosive additive stripping liquid controlling (METHYLPYRROLIDONE, monoethanolamine, surfactant (trade name: Sa Fei Nore (Surfynol) 465, Air Prod & Chem manufactures), liquid temperature is 45 DEG C) resist peel groove in, carry out the process of 200 seconds and etching ray hardening resin layer is removed, acquisition is formed with decorative layer, mask layer, first transparent electrode pattern (described first transparent electrode pattern be arranged to as illustrated in fig. 1 across the noncontact face of described front panel and described mask layer with the both sides region in the face of opposition side, described front panel side) front panel.
The formation >> of << insulation course
< insulation course forms the preparation > with transfer film W1
In the preparation of decorative layer formation with transfer film L1; the dyed layer coating fluid comprising above-mentioned formula L1 is replaced by the insulation course formation coating fluid comprising following formula W1, carries out in the same manner as the preparation of decorative layer formation transfer film L1 in addition and obtain the insulation course formation transfer film W1 (thickness of insulation course ray hardening resin layer is 1.4 μm) that temporary support, thermoplastic resin, middle layer (oxygen barrier film), insulation course ray hardening resin layer and diaphragm become to be integrated.
(insulation course formation coating fluid: formula W1)
In addition, insulation course formation coating fluid W1 except the viscosity of 100 DEG C after desolventizing be 4000Pasec.
Carry out in the same manner as the formation of mask layer; front panel with above-mentioned decorative layer, reflection horizon, mask layer, the first transparent electrode pattern is cleaned, silane coupling process, the stacked insulation course formation transfer film W1 (base material temperature: 100 DEG C, rubber rollers temperature is 120 DEG C, line pressure is 100N/cm, conveyance speed is 2.3m/min) eliminating diaphragm.After temporary support being peeled off, the distance between exposed mask (having the quartzy exposed mask of insulation course pattern) face and described etching ray hardening resin layer is set as 100 μm, with 30mJ/cm
2the exposure of (i ray) carries out pattern exposure.
Secondly, use the triethanolamine system developer solution (triethanolamine containing 30 quality %, utilize pure water by the liquid of trade name T-PD2 (Fuji Photo Film Co., Ltd.'s manufacture) dilution 10 times), the process of 60 seconds is carried out at 33 DEG C, secondly the process that sodium carbonate/bicarbonate system developer solution (utilizing pure water by the liquid of trade name T-CD1 (Fuji Photo Film Co., Ltd.'s manufacture) dilution 5 times) carries out 50 seconds at 25 DEG C is used, use the cleaning fluid containing surfactant (utilizing pure water by the liquid of trade name T-SD3 (Fuji Photo Film Co., Ltd.'s manufacture) dilution 10 times), the process of 20 seconds is carried out at 33 DEG C, utilize rotating brushes, UHV (ultra-high voltage) washer jet carries out residue removing, the rear baking process of 60 minutes is carried out further at 230 DEG C, acquisition is formed with decorative layer, reflection horizon, mask layer, first transparent electrode pattern, the front panel of insulating layer pattern.
The formation >> of << second transparent electrode pattern
The formation > of < transparent electrode layer
Carry out in the same manner as the formation of above-mentioned first transparent electrode pattern, to be formed decorative layer, reflection horizon, mask layer, the first transparent electrode pattern, insulating layer pattern front panel carry out DC magnetic control sputtering plating process (condition: the temperature of base material is 50 DEG C, argon pressure is 0.13Pa, oxygen pressure is 0.01Pa), forming thickness is the ito thin film of 80nm, obtains the front panel being formed with decorative layer, reflection horizon, mask layer, the first transparent electrode pattern, insulating layer pattern, transparent electrode layer.The surface resistance of ito thin film is 110 Ω/.
Carry out in the same manner as the formation of the formation of the first transparent electrode pattern, use etching transfer film E1, obtain be formed decorative layer, reflection horizon, mask layer, the first transparent electrode pattern, insulating layer pattern, transparent electrode layer, etching ray hardening resin layer pattern front panel (toast process afterwards; 130 DEG C, 30 minutes).
In addition, carry out in the same manner as the formation of the formation of the first transparent electrode pattern, by carrying out etching (30 DEG C, 50 seconds), etching ray hardening resin layer removing (45 DEG C, 200 seconds) is obtained be formed decorative layer, reflection horizon, mask layer, the first transparent electrode pattern, insulating layer pattern, the second transparent electrode pattern (described second transparent electrode pattern be arranged to as shown in Figure 1 across the noncontact face of described front panel and described mask layer with the both sides region in the face of opposition side, described front panel side) front panel.
The formation >> of the electric conductivity key element that << is different from first and second transparent electrode pattern
Carry out in the same manner as the formation of first and second transparent electrode pattern above-mentioned, to be formed decorative layer, reflection horizon, mask layer, the first transparent electrode pattern, insulating layer pattern, the second transparent electrode pattern front panel carry out the process of DC magnetic control sputtering plating, obtain and be formed with the front panel of aluminium (Al) film that thickness is 200nm.
Carry out in the same manner as the formation of first and second transparent electrode pattern above-mentioned, use etching transfer film E1 and obtaining be formed decorative layer, reflection horizon, mask layer, the first transparent electrode pattern, insulating layer pattern, the second transparent electrode pattern, aluminium film, etching ray hardening resin layer pattern front panel (toast process afterwards; 130 DEG C, 30 minutes).
Carry out in the same manner as the formation of the formation of the first transparent electrode pattern further, by carrying out etching (30 DEG C, 50 seconds), etching ray hardening resin layer removing (45 DEG C, 200 seconds) is obtained the front panel being formed with decorative layer, reflection horizon, mask layer, the first transparent electrode pattern, insulating layer pattern, the second transparent electrode pattern, the electric conductivity key element different from first and second transparent electrode pattern.
The formation >> of << protective clear layer
Carry out in the same manner as the formation of insulation course; the stacked insulation course formation transfer film W1 eliminating diaphragm on the front panel being formed with the electric conductivity key element different from first and second transparent electrode pattern above-mentioned; after temporary support is peeled off, be not situated between every exposed mask with 50mJ/cm
2the exposure of (i ray) carries out preceding exposure, carries out developing, post-exposure (1000mJ/cm
2), rear baking process, obtain as illustrated in fig. 1 with cover decorative layer, reflection horizon, mask layer, the first transparent electrode pattern, insulating layer pattern, the second transparent electrode pattern, the electric conductivity key element different from first and second transparent electrode pattern whole modes be laminated with the front panel 1 of insulation course (protective clear layer).Using the capacitive input device of the front panel 1 of gained as embodiment 1.
The making >> of << image display device (touch-screen)
Front panel 1 (capacitive input device of embodiment 1) manufactured before laminating in the liquid crystal display key element manufactured utilizing method described in Japanese Patent Laid-Open 2009-47936 publication, utilizes known method to make and comprises the image display device 1 of capacitive input device as the embodiment 1 of inscape.
The overall evaluation >> of << front panel 1 and image display device 1
In above steps, be formed decorative layer, reflection horizon, mask layer, the first transparent electrode pattern, insulating layer pattern, the second transparent electrode pattern, the electric conductivity key element different from first and second transparent electrode pattern front panel 1 (capacitive input device of embodiment 1) there is no dirt at peristome and the back side, easy cleaning, and the problem that there is no the pollution of other components.
And, in decorative layer and free of pinholes, whiteness, inequality also no problem.Similarly free of pinholes in mask layer, optical shielding property is excellent.
And the respective electric conductivity of the first transparent electrode pattern, the second transparent electrode pattern and the electric conductivity key element different from these no problem, on the other hand, have insulativity between the first transparent electrode pattern and the second transparent electrode pattern.And reflection horizon does not also produce short circuit between the first transparent electrode pattern, the second transparent electrode pattern and other electric conductivity key elements different with it.
In addition, the also defect such as bubble-free in protective clear layer, obtains the image display device of display characteristic excellence.
[embodiment 2]
<< is laminated with the making >> of the transfer film C1 of electric conductivity decorative layer
In the preparation of decorative layer formation with transfer film L1, the dyed layer coating fluid comprising above-mentioned formula L1 is replaced by the electric conductivity decorative layer formation coating fluid comprising following formula C1, carries out in the same manner as the preparation of decorative layer formation transfer film L1 in addition and obtain the transfer film C1 (thickness of electric conductivity decorative layer is 2.0 μm) being laminated with electric conductivity decorative layer.
The preparation > of < electric conductivity decorative layer formation coating fluid
(preparation of nano silver wire dispersion (1))
Be prepared in the liquor argenti nitratis ophthalmicus being dissolved with silver nitrate powder 0.51g in pure water 50mL.Thereafter, in above-mentioned liquor argenti nitratis ophthalmicus, add the ammoniacal liquor of 1N until become transparent, the mode becoming 100mL with total amount is added pure water and prepares annex solution A.
And, dissolve glucose powder 0.5g with the pure water of 140mL and prepare annex solution G.
Dissolve HTAB (cetyl-trimethylammonium bromide) powder 0.5g with 27.5mL pure water further and prepare annex solution H.
Secondly, above-mentioned annex solution A 20.6mL is put into and at room temperature stirs to there-necked flask.Utilize funnel in described liquid, sequentially add pure water 41mL, annex solution H 20.6mL and annex solution G 16.5mL, one side stirs 5 hours one sides with 200rpm and heats at 90 DEG C, obtains nano silver wire water dispersion (1).
After making nano silver wire water dispersion (1) cooling of gained, stir one side with the mode one side becoming 0.05 for the quality 1 of silver and add polyvinylpyrrolidone (trade name: K-30 and Guang Chun medicine Industries, Inc manufactures), thereafter centrifuging is carried out, carry out purifying until conductance becomes 50 below μ S/cm, utilize propylene glycol monomethyl ether carry out centrifuging further and removed by water, finally add propylene glycol monomethyl ether and prepare nano silver wire solvent dispersion (1).
(electric conductivity decorative layer forms the preparation with coating fluid C1)
Stir following composition, the mode becoming 1.0 quality % with final silver concentration mixes with nano silver wire dispersion (1), and preparation electric conductivity decorative layer is formed uses coating fluid C1.
-electric conductivity decorative layer formed composition with coating fluid C1-
The formation >> of << transparent electrode pattern and insulation course etc.
To carry out similarly to Example 1 and after obtaining the front panel being formed with decorative layer, reflection horizon and mask layer, use the transfer film C1 being laminated with electric conductivity decorative layer and the formation carrying out the first transparent electrode pattern.
First, the front panel being formed with mask layer is cleaned, the stacked transfer film C1 (base material temperature: 120 DEG C, rubber rollers temperature is 120 DEG C, line pressure is 100N/cm, conveyance speed is 1.7m/min) eliminating diaphragm.After temporary support being peeled off, exposed mask (having the quartzy exposed mask of the transparent electrode pattern) distance between face and described electric conductivity decorative layer is set as 100 μm, with 100mJ/cm
2the exposure of (i ray) carries out pattern exposure.
Secondly, use the triethanolamine system developer solution (triethanolamine containing 30 quality %, utilize pure water by the liquid of trade name T-PD2 (Fuji Photo Film Co., Ltd.'s manufacture) dilution 10 times), the process of 60 seconds is carried out at 30 DEG C, secondly sodium carbonate/bicarbonate system developer solution (utilizing pure water by the liquid of trade name T-CD1 (Fuji Photo Film Co., Ltd.'s manufacture) dilution 5 times) is used, the process of 60 seconds is carried out at 25 DEG C, use the cleaning fluid containing surfactant (utilizing pure water by the liquid of trade name T-SD3 (Fuji Photo Film Co., Ltd.'s manufacture) dilution 10 times), the process of 20 seconds is carried out at 33 DEG C, utilize rotating brushes, UHV (ultra-high voltage) washer jet carries out residue removing, the rear baking process of 60 minutes is carried out further at 230 DEG C, acquisition is formed with mask layer, the front panel of the first transparent electrode pattern.
Then, carry out similarly to Example 1 and form insulation course.Secondly, the transfer film C1 being laminated with electric conductivity decorative layer and the formation carrying out the second transparent electrode pattern is used.In addition, carry out similarly to Example 1 and form electric conductivity key element, the protective clear layer different from first and second transparent electrode pattern, obtaining front panel 2.It can be used as the capacitive input device of embodiment 2.
And, carry out similarly to Example 1 and make the image display device 2 of embodiment 2.
The evaluation >> of << front panel 2 and image display device 2
In the manufacture of the image display device 2 of embodiment 2, manufacturing the stage of the front panel with decorative layer, carry out similarly to Example 1 and evaluate with the thickness of the decorative layer in the front panel of decorative layer, transferability and pre-cut, its result is recorded in following table 1.
In the manufacture of the image display device 2 of embodiment 2, manufacturing the stage of the front panel with decorative layer, reflection horizon and mask layer, carry out similarly to Example 1 and evaluate the brightness of the front panel with decorative layer, reflection horizon and mask layer, whiteness, reticulate pattern, productive rate, decorative layer contiguity, peristome dirt and peristome breach, its result is recorded in following table 1.
In above-mentioned each step, be formed decorative layer, reflection horizon, mask layer, the first transparent electrode pattern, insulating layer pattern, the second transparent electrode pattern, the electric conductivity key element different from first and second transparent electrode pattern front panel 2 there is no dirt at peristome and the back side, easy cleaning, and the problem that there is no the pollution of other components.
And in mask layer and free of pinholes, optical shielding property is excellent.
And the respective electric conductivity of the first transparent electrode pattern, the second transparent electrode pattern and the electric conductivity key element different from it no problem, on the other hand, have insulativity between the first transparent electrode pattern and the second transparent electrode pattern.And reflection horizon does not also produce short circuit between the first transparent electrode pattern, the second transparent electrode pattern and the electric conductivity key element different with it.
In addition, the also defect such as bubble-free in protective clear layer, obtains the image display device of display characteristic excellence.
[embodiment 3 ~ embodiment 7]
In embodiment 1, as described in following table 1, the thickness of dyed layer is changed to 5.1 μm (embodiments 3), 8.1 μm (embodiment 4), 11.8 μm (embodiment 5), 14.8 μm (embodiment 6), 22.4 μm (embodiment 7) μm respectively from 2.5 μm, carry out similarly to Example 1 in addition and make embodiment 3 ~ embodiment 7 decorative layer formed transfer film L3 ~ transfer film L7.The transfer film using the decorative layer of made embodiment 3 ~ embodiment 7 to be formed respectively, carries out in addition similarly to Example 1, is recorded in evaluating the result being formed with the front panel of decorative layer in following table 1.Thereafter; carry out similarly to Example 1 and make the front panel 3 ~ front panel 7 as capacitive input device of embodiment 3 ~ embodiment 7 being formed with decorative layer, reflection horizon, mask layer, the first transparent electrode pattern, insulating layer pattern, the second transparent electrode pattern, the electric conductivity key element different from first and second transparent electrode pattern and protective clear layer, comprising the image display device 3 ~ image display device 7 of capacitive input device as inscape.In the manufacture of the image display device of embodiment 3 ~ embodiment 7, manufacturing the stage of the front panel with decorative layer, reflection horizon and mask layer, carry out similarly to Example 1 and evaluate the brightness of the front panel with decorative layer, reflection horizon and mask layer, whiteness, reticulate pattern, productive rate, decorative layer contiguity, peristome dirt and peristome breach, its result is recorded in following table 1.
Front panel 3 ~ front panel 7 there is no dirt at peristome and the back side, easily cleans, and there is no the problem of other components pollution.
And in mask layer and free of pinholes, when the situation overlapping with reflection horizon, optical shielding property is excellent.
And the respective electric conductivity of the first transparent electrode pattern, the second transparent electrode pattern and the electric conductivity key element different from it no problem, on the other hand, have insulativity between the first transparent electrode pattern and the second transparent electrode pattern.And reflection horizon does not also produce short circuit between the first transparent electrode pattern, the second transparent electrode pattern and the electric conductivity key element different with it.
In addition, the also defect such as bubble-free in protective clear layer, obtains the image display device of display characteristic excellence.
As the front panel with decorative layer, reflection horizon and mask layer in each embodiment, L=87.0, b=1.89 and brightness are A, whiteness is A (embodiment 3), L=87.0, b=1.95 and brightness are A, whiteness is A (embodiment 4), L=87.0, b=2.05 and brightness are A, whiteness is A (embodiment 5), L=86.9, b=2.08 and brightness are A, whiteness is A (embodiment 6), and L=86.7, b=2.31 and brightness are A, whiteness is B (embodiment 7).
[embodiment 8 ~ embodiment 10]
In embodiment 1, the thickness of the silver used in reflection horizon is set to 150nm (embodiment 8), 100nm (embodiment 9), 300nm (embodiment 10) respectively from 200nm, carry out similarly to Example 1 in addition and make embodiment 8 ~ embodiment 10 decorative layer formed transfer film.The transfer film using the decorative layer of made embodiment 8 ~ embodiment 10 to be formed respectively, carries out similarly to Example 5 in addition and makes the front panel being formed with decorative layer, evaluation result being recorded in following table 1.Thereafter; carry out similarly to Example 5 and make the front panel 8 ~ front panel 10 as capacitive input device of the embodiment 8 ~ embodiment 10 being formed with decorative layer, mask layer, the first transparent electrode pattern, insulating layer pattern, the second transparent electrode pattern, the electric conductivity key element different from first and second transparent electrode pattern and protective clear layer, comprising the image display device 8 ~ image display device 10 of capacitive input device as inscape.In the manufacture of the image display device of embodiment 8 ~ embodiment 10, carry out similarly to Example 1 with the stage of the front panel of decorative layer, reflection horizon and mask layer and evaluate the brightness of the front panel with decorative layer, reflection horizon and mask layer, whiteness, reticulate pattern, productive rate, decorative layer contiguity, peristome dirt and peristome breach manufacturing, its result is recorded in following table 1.With front panel 1 comparatively speaking, although the thickness of silver reduce front panel 8 and front panel 9 brightness, whiteness reduces be practical rank, on the other hand, the brightness of the front panel 10 that the thickness of silver increases, whiteness are on an equal basis, and unchanged.
The dirt of front panel 8 ~ front panel 10 at peristome and the back side no problem, easily clean, and there is no the problem that other components pollute.
And in mask layer and free of pinholes, optical shielding property is excellent.
And the respective electric conductivity of the first transparent electrode pattern, the second transparent electrode pattern and the electric conductivity key element different from it no problem, on the other hand, have insulativity between the first transparent electrode pattern and the second transparent electrode pattern.And reflection horizon does not also produce short circuit between the first transparent electrode pattern, the second transparent electrode pattern and the electric conductivity key element different with it.
In addition, the also defect such as bubble-free in protective clear layer, obtains the image display device of display characteristic excellence.
[embodiment 11]
Carry out similarly to Example 1 and obtain the front panel being formed with decorative layer.
Thereafter, the front panel being formed with decorative layer is laid in vacuum cavity, use Ag target (atom ratio Ag/Ga=98.5/1.5), utilize DC magnetic control sputtering plating (end vacuum is 0.27 × below mPa, Ar air pressure: 0.27Pa, sputtering power: 200W, anode-cathode distance: 55mm, substrate temperature: room temperature) to form the Ag film that thickness is 200nm thereon.
Thereafter; carry out similarly to Example 1 and make the front panel 11 as capacitive input device of the embodiment 11 being formed with mask layer, the first transparent electrode pattern, insulating layer pattern, the second transparent electrode pattern, the electric conductivity key element different from first and second transparent electrode pattern and protective clear layer, comprising the image display device 11 of capacitive input device as inscape.
In the manufacture of the image display device of embodiment 11, manufacturing the stage of the front panel with decorative layer, carry out similarly to Example 1 and evaluate with the thickness of the decorative layer in the front panel of decorative layer, transferability and pre-cut, its result is recorded in following table 1.
In the manufacture of the image display device of embodiment 11, manufacturing the stage of the front panel with decorative layer, reflection horizon and mask layer, carry out similarly to Example 1 and evaluate the brightness of the front panel with decorative layer, reflection horizon and mask layer, whiteness, reticulate pattern, productive rate, decorative layer contiguity, peristome dirt and peristome breach, its result is recorded in following table 1.
Front panel 11 there is no dirt at peristome and the back side, easily cleans, and there is no the problem of other components pollution.
And in mask layer and free of pinholes, and when the situation overlapping with reflection horizon, optical shielding property is excellent.
And the respective electric conductivity of the first transparent electrode pattern, the second transparent electrode pattern and the electric conductivity key element different from it no problem, on the other hand, have insulativity between the first transparent electrode pattern and the second transparent electrode pattern.And reflection horizon also can not produce short circuit between the first transparent electrode pattern, the second transparent electrode pattern and the electric conductivity key element different with it.
In addition, the also defect such as bubble-free in protective clear layer, obtains the image display device of display characteristic excellence.
[embodiment 12]
Carry out similarly to Example 1 and make the front panel being provided with decorative layer.
Adhesive coating protection sheet material is attached in the mode in the opposing face formation reflection horizon not by silver mirror reaction at the decorative layer of front panel.
35g (205mmol) silver nitrate is made to be dissolved in distilled water, the aqueous solution 2000ml of preparation 0.1mol/L.
The ammoniacal liquor of prior preparation 1mol/L, if add ammoniacal liquor in prepared silver nitrate aqueous solution, then generates the precipitation of brown.Adding ammoniacal liquor further makes precipitation dissolve and stop adding before by complete bleach.Measure and carried out ammonia silver nitrate aqueous solution about 1800mL that 1 μm of micro-strainer filters and moved in plastic containers.
Utilize calibrated pipet (komagome pipette) to be dripped equably in pallet by 18.5% aqueous solution 36mL of formaldehyde, vibratory tray makes it vibrate mixing gently to fall on front panel by it for thirty years of age.Calculate on the glass sheet cleaned in advance, the thickness of dried silver becomes the time of 200nm, takes out after front panel is left standstill the described time, utilizes pure water fully to clean.Then air knife is utilized to dewater.After making its natural drying, the adhesive coating of opposing face protection sheet material is peeled off.
Carry out similarly to Example 1 later and make the front panel 12 as capacitive input device of the embodiment 12 being formed with mask layer, the first transparent electrode pattern, insulating layer pattern, the second transparent electrode pattern, the electric conductivity key element different from first and second transparent electrode pattern and protective clear layer, comprising the image display device 12 of capacitive input device as inscape.
In the manufacture of the image display device of embodiment 12, manufacturing the stage of the front panel with decorative layer, carry out similarly to Example 1 and evaluate with the thickness of the decorative layer in the front panel of decorative layer, transferability and pre-cut, its result is recorded in following table 1.
In the manufacture of the image display device of embodiment 12, manufacturing the stage of the front panel with decorative layer, reflection horizon and mask layer, carry out similarly to Example 1 and evaluate the brightness of the front panel with decorative layer, reflection horizon and mask layer, whiteness, reticulate pattern (reticulation), productive rate, decorative layer contiguity, peristome dirt and peristome breach, its result is recorded in following table 1.
As shown in the result of following table 1, all evaluations are practical rank.
And in mask layer and free of pinholes, optical shielding property is excellent.
And the respective electric conductivity of the first transparent electrode pattern, the second transparent electrode pattern and the electric conductivity key element different from it no problem, on the other hand, have insulativity between the first transparent electrode pattern and the second transparent electrode pattern.And reflection horizon also can not produce short circuit between the first transparent electrode pattern, the second transparent electrode pattern and the electric conductivity key element different with it.
In addition, the also defect such as bubble-free in protective clear layer, obtains the image display device of display characteristic excellence.
[embodiment 13]
The thickness making dyed layer is similarly to Example 3 the transfer film L3 of the decorative layer formation of 5.1 μm.
Then, similarly remove diaphragm from the decorative layer formation transfer film of gained, utilize stacked machine to be layered on silane coupling process glass baseplate.Then, by the temporary support of polyethylene terephthalate at the interface peel with thermoplastic resin, removing temporary support.Carry out similarly to Example 1 and make the front panel 13 ' being formed with decorative layer later.
Secondly, on front panel 13 ', (three islands (MISHIMA) incorporated company manufactures to use above-mentioned formula L1 to utilize screen printer; UDF-5L, size of mesh are 250 μm) carry out screen printing, at 100 DEG C, carry out the drying of 10 minutes and make it not have viscosity (tack-free).Thickness after ink dried is 5 μm.Carry out screen printing further as described above, carry out the drying of 100 DEG C, 10 minutes.Repeatedly carry out amounting to 2 times from described printing to dry step.At 150 DEG C, carry out the drying of 30 minutes, make the front panel being formed with decorative layer, evaluation result is recorded in following table 1.Thereafter, make the front panel 13 as capacitive input device being formed with the embodiment 13 of decorative layer, mask layer, the first transparent electrode pattern, insulating layer pattern, the second transparent electrode pattern, the electric conductivity key element different from first and second transparent electrode pattern and protective clear layer similarly to Example 3 and comprise the image display device 13 of capacitive input device as inscape.
In the manufacture of the image display device of embodiment 13, carry out similarly to Example 1 with the stage of the front panel of decorative layer, reflection horizon and mask layer and evaluate the brightness of the front panel with decorative layer, reflection horizon and mask layer, whiteness, reticulate pattern, productive rate, decorative layer contiguity, peristome dirt and peristome breach manufacturing, its result is recorded in following table 1.
Although for front panel 1, the whiteness of front panel 13 and reticulate pattern reduce, and be practical rank, peristome breach improves, and the evaluation result of brightness in addition, productive rate, decorative layer contiguity, peristome dirt, whiteness is also equal, is practical rank.
Front panel 13 in the dirt at peristome and the back side and no problem, easily cleans, and there is no the problem that other components pollute.
And in mask layer and free of pinholes, optical shielding property is excellent.
And the respective electric conductivity of the first transparent electrode pattern, the second transparent electrode pattern and the electric conductivity key element different from it no problem, on the other hand, have insulativity between the first transparent electrode pattern and the second transparent electrode pattern.And reflection horizon also can not produce short circuit between the first transparent electrode pattern, the second transparent electrode pattern and the electric conductivity key element different with it.
In addition, the also defect such as bubble-free in protective clear layer, obtains the image display device of display characteristic excellence.
[embodiment 14]
In embodiment 13, the step amounting to 15.1 μm of thick decorative layers is formed by using transfer film L3 and 2 time screen printing, change to use 2 screen printings and form the step amounting to 10 μm of thick decorative layers, carry out similarly to Example 13 in addition and make being formed with decorative layer, mask layer, first transparent electrode pattern, insulating layer pattern, second transparent electrode pattern, the electric conductivity key element different from first and second transparent electrode pattern, and the front panel 14 as capacitive input device of the embodiment 14 of protective clear layer and comprise the image display device 14 of capacitive input device as inscape.
In the manufacture of the image display device of embodiment 14, manufacturing the stage of the front panel with decorative layer, reflection horizon and mask layer, carry out similarly to Example 1 and evaluate the brightness of the front panel with decorative layer, reflection horizon and mask layer, whiteness, reticulate pattern, productive rate, decorative layer contiguity, peristome dirt and peristome breach, its result is recorded in following table 1.
Although for front panel 13, the whiteness of front panel 14 reduces, and be practical rank, peristome breach and reticulate pattern improve, and the evaluation result of brightness in addition, productive rate, decorative layer contiguity, peristome dirt, whiteness is equal, is practical rank.
Front panel 14 in the dirt at peristome and the back side and no problem, easily cleans, and there is no the problem that other components pollute.
And in mask layer and free of pinholes, optical shielding property is excellent.
And the respective electric conductivity of the first transparent electrode pattern, the second transparent electrode pattern and the electric conductivity key element different from it no problem, on the other hand, have insulativity between the first transparent electrode pattern and the second transparent electrode pattern.And reflection horizon also can not produce short circuit between the first transparent electrode pattern, the second transparent electrode pattern and the electric conductivity key element different with it.
In addition, the also defect such as bubble-free in protective clear layer, obtains the image display device of display characteristic excellence.
[embodiment 15]
In embodiment 13, the step amounting to 15.1 μm of thick decorative layers is formed by using transfer film L3 and 2 time screen printing, change to use 3 screen printings and form the step amounting to 15 μm of thick decorative layers, carry out similarly to Example 13 in addition and make being formed with decorative layer, mask layer, first transparent electrode pattern, insulating layer pattern, second transparent electrode pattern, the electric conductivity key element different from first and second transparent electrode pattern, and the front panel 15 as capacitive input device of the embodiment 15 of protective clear layer and comprise the image display device 15 of capacitive input device as inscape.
In the manufacture of the image display device of embodiment 15, carry out similarly to Example 1 with stage of front panel of decorative layer and evaluate with the thickness of the decorative layer in the front panel of decorative layer, transferability and pre-cut manufacturing, its result is recorded in following table 1.
In the manufacture of the image display device of embodiment 15, carry out similarly to Example 1 with the stage of the front panel of decorative layer, reflection horizon and mask layer and evaluate the brightness of the front panel with decorative layer, reflection horizon and mask layer, whiteness, reticulate pattern, productive rate, decorative layer contiguity, peristome dirt and peristome breach manufacturing, its result is recorded in following table 1.
Although for front panel 13, the whiteness of front panel 15 reduces, and be practical rank, peristome breach improves, and the evaluation result of brightness in addition, productive rate, decorative layer contiguity, peristome dirt, whiteness and reticulate pattern is equal, is practical rank.
Front panel 15 in the dirt at peristome and the back side and no problem, easily cleans, and there is no the problem that other components pollute.
And in mask layer and free of pinholes, optical shielding property is excellent.
And the respective electric conductivity of the first transparent electrode pattern, the second transparent electrode pattern and the electric conductivity key element different from it no problem, on the other hand, have insulativity between the first transparent electrode pattern and the second transparent electrode pattern.And reflection horizon also can not produce short circuit between the first transparent electrode pattern, the second transparent electrode pattern and the electric conductivity key element different with it.
In addition, the also defect such as bubble-free in protective clear layer, obtains the image display device of display characteristic excellence.
[embodiment 16]
The preparation > of < silver complex compound solution G1
In the Shu Lunke flask of the 250ml with stirrer, make after ammonium bicarbonate 3.4g (43 mM) and isopropylamine 15g (0.25 mole) be dissolved in the methyl alcohol of 50ml, to add silver carbonate 11.88g (43.1 mM).Above-mentioned reaction solution is yellow suspension, carries out and graduate into Transparent color along with reaction, after 6 hours, and the clear solution become colorless completely.After using the membrane filter (membrane filter) of 0.45 μm to be filtered by described solution, under reduced pressure solvent is distilled removing completely, then make it dry until become constant weight under vacuo, obtain the silver-colored complex compound 26.2g of white.Add isopropyl alcohol 473g wherein and dissolved, preparing silver-colored complex compound solution G1.
The formation > in < reflection horizon
Utilize the glass plate cleaned in advance, calculate carry out drying in 2 minutes at 80 DEG C after, the thickness carrying out 1 hour heat treated silver at 150 DEG C becomes the coating weight of 200nm, on the front panel 16 being provided with decorative layer similarly to Example 1, the silver complex solution G1 of coating same coated amount, carry out drying in 2 minutes at 80 DEG C after, at 150 DEG C, carry out the thermal treatment of 1 hour, form as thickness the reflection horizon of the Ag film being 200nm.
Carry out similarly to Example 1 later and make the front panel 16 as capacitive input device of the embodiment 16 being formed with mask layer, the first transparent electrode pattern, insulating layer pattern, the second transparent electrode pattern, the electric conductivity key element different from first and second transparent electrode pattern and protective clear layer, comprising the image display device 16 of capacitive input device as inscape.
In the manufacture of the image display device of embodiment 16, manufacturing the stage of the front panel with decorative layer, carry out similarly to Example 1 and evaluate with the thickness of the decorative layer in the front panel of decorative layer, transferability and pre-cut, its result is recorded in following table 1.
In the manufacture of the image display device of embodiment 16, manufacturing the stage of the front panel with decorative layer, reflection horizon and mask layer, carry out similarly to Example 1 and evaluate the brightness of the front panel with decorative layer, reflection horizon and mask layer, whiteness, reticulate pattern, productive rate, decorative layer contiguity, peristome dirt and peristome breach, its result is recorded in following table 1.
As shown in the result of following table 1, all evaluations are practical rank.
And in mask layer and free of pinholes, optical shielding property is excellent.
And the respective electric conductivity of the first transparent electrode pattern, the second transparent electrode pattern and the electric conductivity key element different from it no problem, on the other hand, have insulativity between the first transparent electrode pattern and the second transparent electrode pattern.And reflection horizon also can not produce short circuit between the first transparent electrode pattern, the second transparent electrode pattern and the electric conductivity key element different with it.
In addition, the also defect such as bubble-free in protective clear layer, obtains the image display device of display characteristic excellence.
[embodiment 17]
The formation >> in << reflection horizon
< reflection horizon forms the preparation > with transfer film M1
On the polyimide film of 2.0 μm, with the coating weight silver coating complex compound solution G1 identical with embodiment 16, carry out the drying of 2 minutes at 80 DEG C after, at 150 DEG C, carry out the thermal treatment of 1 hour, form the Ag film that thickness is 200nm.
The surface of described Ag film is coated with above-mentioned contiguity and gives layer coating fluid (formula P1), at 100 DEG C, carry out the drying of 2 minutes, make the argentum reflecting layer film giving layer with contiguity of 0.6 μm.
To the described argentum reflecting layer film giving layer with contiguity, razor is put in the face of giving layer from contiguity.The mode that time overlapping with front panel with the part that the inner side of the decorative layer with frame shape is overlapping, cone angle becomes about 30 degree cuts otch.
Utilize silane coupling solution to process front panel, carry out pure water cleaning showers.In base material preheating device, described base material is carried out at 90 DEG C the heating of 2 minutes.Then, the mode of giving ply with the contiguity of the decorative layer of front panel and argentum reflecting layer film in the same manner as the formation of the decorative layer of embodiment 1 is carried out stacked.
After the cooling period, make argentum reflecting layer film become downside and move on flat sheet metal by stacked front panel, along the edge contact razor of front panel, the argentum reflecting layer film stretched out is cut, form as thickness the reflection horizon of the Ag film being 200nm.
Measure brightness from the face not forming decorative layer of front panel, and utilize the whiteness of the decorative layer of visual judgement front panel, result is and no problem, is good rank.
Carry out similarly to Example 1 later and make the front panel 17 as capacitive input device of the embodiment 17 being formed with mask layer, the first transparent electrode pattern, insulating layer pattern, the second transparent electrode pattern, the electric conductivity key element different from first and second transparent electrode pattern and protective clear layer, comprising the image display device 17 of capacitive input device as inscape.
In the manufacture of the image display device of embodiment 17, manufacturing the stage of the front panel with decorative layer, carry out similarly to Example 1 and evaluate with the thickness of the decorative layer in the front panel of decorative layer, transferability and pre-cut, its result is recorded in following table 1.
In the manufacture of the image display device of embodiment 17, manufacturing the stage of the front panel with decorative layer, reflection horizon and mask layer, carry out similarly to Example 1 and evaluate the brightness of the front panel with decorative layer, reflection horizon and mask layer, whiteness, reticulate pattern, productive rate, decorative layer contiguity, peristome dirt and peristome breach, its result is recorded in following table 1.
As shown in the result of following table 1, all evaluations are practical rank.
And in mask layer and free of pinholes, optical shielding property is excellent.
And the respective electric conductivity of the first transparent electrode pattern, the second transparent electrode pattern and the electric conductivity key element different from it no problem, on the other hand, have insulativity between the first transparent electrode pattern and the second transparent electrode pattern.And reflection horizon also can not produce short circuit between the first transparent electrode pattern, the second transparent electrode pattern and the electric conductivity key element different with it.
In addition, the also defect such as bubble-free in protective clear layer, obtains the image display device of display characteristic excellence.
[comparative example 1]
In embodiment 14; remove the formation processing of the duplexer of metal or inorganic layer and make; similarly carry out in addition and make the front panel as capacitive input device of the comparative example 1 being formed with mask layer, the first transparent electrode pattern, insulating layer pattern, the second transparent electrode pattern, the electric conductivity key element different from first and second transparent electrode pattern and protective clear layer; comprise the image display device of capacitive input device as the comparative example 1 of inscape; but brightness significantly reduces, do not reach practical rank.
In the manufacture of the image display device of comparative example 1, manufacturing the stage of the front panel with decorative layer, carry out similarly to Example 1 and evaluate with the thickness of the decorative layer in the front panel of decorative layer, transferability and pre-cut, its result is recorded in following table 1.
In the manufacture of the image display device of comparative example 1, manufacturing the stage of the front panel with decorative layer, reflection horizon and mask layer, carry out similarly to Example 1 and evaluate the brightness of the front panel with decorative layer, reflection horizon and mask layer, whiteness, reticulate pattern, productive rate, decorative layer contiguity, peristome dirt and peristome breach, its result is recorded in following table 1.
[comparative example 2]
In embodiment 14, utilize following method to form reflection horizon with the organic film of black, and replace the formation processing of the duplexer of metal or inorganic layer.
Use slit-shaped nozzle, by following black light hardening resin layer coating solution on the polyimide film of 2.0 μm, make it dry.Thereafter, with 1000mJ/cm
2(i ray) expose after the thickness of black reflection layer carrying out baking in 1 hour at 120 DEG C be 200nm.
(black light hardening resin layer coating fluid)
Thereafter; carry out similarly to Example 14 and make the front panel as capacitive input device of the comparative example 2 being formed with mask layer, the first transparent electrode pattern, insulating layer pattern, the second transparent electrode pattern, the electric conductivity key element different from first and second transparent electrode pattern and protective clear layer, comprising the image display device of capacitive input device as the comparative example 2 of inscape.
In the manufacture of the image display device of comparative example 2, manufacturing the stage of the front panel with decorative layer, carry out similarly to Example 1 and evaluate with the thickness of the decorative layer in the front panel of decorative layer, transferability and pre-cut, its result is recorded in following table 1.
In the manufacture of the image display device of comparative example 2, manufacturing the stage of the front panel with decorative layer, reflection horizon and mask layer, carry out similarly to Example 1 and evaluate the brightness of the front panel with decorative layer, reflection horizon and mask layer, whiteness, reticulate pattern, productive rate, decorative layer contiguity, peristome dirt and peristome breach, its result is recorded in following table 1.
Known according to above-mentioned table 1: in the manufacture method of capacitive input device of the present invention, by using the duplexer of metal or inorganic layer as reflection horizon, the brightness after transfer printing and the good white in finish layer of whiteness can be obtained with high yield.
And as mentioned above, the manufacture method of the capacitive input device of the present invention of the transfer film of the application of the invention, can manufacture the capacitive input device with thin layer/light-weighted advantage with simple step high-quality.Therefore knownly manufacture method of the present invention is utilized and the quality of the capacitive input device manufactured and the image display device that uses it is high.
And if utilize the preferred embodiment of the manufacture method of capacitive input device of the present invention, then the reticulate pattern of the decorative layer of the capacitive input device of gained is also good, and decorative layer adhesion is also good.In addition, reflection horizon also can not produce short circuit between the first transparent electrode pattern, the second transparent electrode pattern and the electric conductivity key element different with it.
In addition, the known preferred embodiment utilizing the manufacture method of capacitive input device of the present invention, even if then use there is the situation of the substrate of peristome time, resist ooze out or the pollution of substrate back side also few.
The explanation of symbol
1: front panel
1a: the noncontact side of front panel
2a: decorative layer
2b: reflection horizon (comprising the duplexer of inorganic layer or the reflection horizon of metal)
2c: mask layer
3: the first transparent electrode patterns
3a: pad part
3b: coupling part
4: the second transparent electrode patterns
5: insulation course
6: electric conductivity key element
7: protective clear layer
8: peristome
10: capacitive input device
11: intensive treatment glass
12: other electric conductivity key elements
21: temporary support
22: thermoplastic resin
23: middle layer
24: dyed layer
25: coverlay
31: non-image portion
32: image portion
33: cutter
C: the 1 direction
D: the 2 direction
Claims (20)
1. a manufacture method for capacitive input device, described capacitive input device comprises front panel, at least comprises the key element of following (1) ~ (3) in the noncontact side of described front panel,
The feature of the manufacture method of described capacitive input device is: sequentially stacked described (1), described (2) and described (3) in the noncontact side of described front panel,
(1) comprise inorganic white pigment and bonding agent, thickness is more than 1 μm and decorative layer less than 30 μm;
(2) duplexer of inorganics or the reflection horizon of metal is comprised;
(3) mask layer.
2. the manufacture method of capacitive input device according to claim 1, is characterized in that:
Described reflection horizon comprises metal.
3. the manufacture method of capacitive input device according to claim 1 and 2, is characterized in that:
The thickness in described reflection horizon is more than 100nm.
4. the manufacture method of capacitive input device according to any one of claim 1 to 3, is characterized in that:
Use contains the transfer film of chromatograph and is at least formed described (1).
5. the manufacture method of capacitive input device according to any one of claim 1 to 4, is characterized in that:
After being included in stacked described (1) decorative layer, under the environment of 0.08atm ~ 1.2atm, be heated to the step of 110 DEG C ~ 300 DEG C.
6. the manufacture method of capacitive input device according to any one of claim 1 to 5, is characterized in that:
Stacked transparent electrode pattern in the key element of described (3).
7. the manufacture method of capacitive input device according to any one of claim 1 to 5, is characterized in that:
The key element of stacked following (4) ~ (6) in the key element of described (3):
(4) multiple pad part extends in a first direction via coupling part and multiple first transparent electrode patterns formed
(5) with described first transparent electrode pattern electrical isolation, the direction intersected with described first direction extends and multiple second electrode patterns comprising described multiple pad part that formed
(6) insulation course of described first transparent electrode pattern and described second electrode pattern electrical isolation is made.
8. the manufacture method of capacitive input device according to claim 7, is characterized in that:
At least one of described first transparent electrode pattern and described second electrode pattern is arranged to across the noncontact face of described front panel and described mask layer with the both sides region in the face of opposition side, described front panel side.
9. the manufacture method of the capacitive input device according to claim 7 or 8, is characterized in that:
Described second electrode pattern is transparent electrode pattern.
10. the manufacture method of the capacitive input device according to any one of claim 7 to 9, is characterized in that:
Described capacitive input device comprise (7) and described first transparent electrode pattern and described second electrode pattern further at least one be electrically connected, with described first transparent electrode pattern and the different electric conductivity key element of described second electrode pattern.
11. the manufacture method of capacitive input device according to claim 10, is characterized in that:
At least at described mask layer, described (7) other electric conductivity key elements are set with the side, face of front panel opposition side.
The manufacture method of 12. capacitive input devices according to claim 10 or 11, is characterized in that:
Further (8) protective clear layer is set in all or part of mode of the key element covering described (1) ~ (7).
13. the manufacture method of capacitive input device according to claim 12, is characterized in that:
Use and sequentially comprise the transfer film of temporary support, thermoplastic resin, ray hardening resin layer, the ray hardening resin layer of transfer film described in transfer printing and form described protective clear layer.
14., according to claim 10 to the manufacture method of the capacitive input device according to any one of 13, is characterized in that:
Use by sequentially comprise temporary support, thermoplastic resin, ray hardening resin layer transfer film and the etched pattern that formed carries out etch processes to transparent conductive material, form described first transparent electrode pattern, described second electrode pattern and described electric conductivity key element at least one thus.
15., according to claim 10 to the manufacture method of the capacitive input device according to any one of 14, is characterized in that:
Use and sequentially comprise the transfer film of temporary support, thermoplastic resin, electric conductivity ray hardening resin layer, the electric conductivity ray hardening resin layer of transfer film described in transfer printing and form at least one of described first transparent electrode pattern, described second electrode pattern and described electric conductivity key element.
The manufacture method of 16. capacitive input devices according to any one of claim 1 to 15, is characterized in that:
Surface treatment is carried out to the noncontact face of described front panel,
The noncontact face implementing front panel described in described surface-treated arranges decorative layer.
17. the manufacture method of capacitive input device according to claim 16, is characterized in that:
Silane compound is used in the surface treatment of described front panel.
The manufacture method of 18. capacitive input devices according to any one of claim 1 to 17, is characterized in that:
Described front panel has peristome at least partially.
19. 1 kinds of capacitive input devices, is characterized in that:
The manufacture method manufacture of the capacitive input device according to any one of claim 1 to 18 is utilized to form.
20. 1 kinds of image display devices, is characterized in that:
Comprise capacitive input device according to claim 19 as inscape.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012205459 | 2012-09-19 | ||
| JP2012-205459 | 2012-09-19 | ||
| PCT/JP2013/073412 WO2014045846A1 (en) | 2012-09-19 | 2013-08-30 | Method for manufacturing capacitive input device, capacitive input device, as well as image display device provided with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104508608A true CN104508608A (en) | 2015-04-08 |
Family
ID=50341165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380035907.5A Pending CN104508608A (en) | 2012-09-19 | 2013-08-30 | Method for manufacturing capacitive input device, capacitive input device, as well as image display device provided with same |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5887314B2 (en) |
| CN (1) | CN104508608A (en) |
| TW (1) | TWI595398B (en) |
| WO (1) | WO2014045846A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106022261A (en) * | 2016-05-19 | 2016-10-12 | 信利光电股份有限公司 | Application of cover plate to recognition sensor, recognition module and cover plate |
| US10437406B2 (en) | 2016-09-26 | 2019-10-08 | Fujitsu Component Limited | Touch panel |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140057836A (en) * | 2012-11-05 | 2014-05-14 | 삼성전기주식회사 | Touch panel and method for manufacturing the same |
| JP5860419B2 (en) * | 2013-01-15 | 2016-02-16 | 富士フイルム株式会社 | Coloring composition for heat-resistant decoration, method for manufacturing capacitive input device, capacitive input device, and image display device including the same |
| JPWO2016060202A1 (en) * | 2014-10-17 | 2017-08-31 | 旭硝子株式会社 | Cover member |
| KR102542864B1 (en) | 2015-01-19 | 2023-06-14 | 도레이 카부시키가이샤 | Laminated base material, cover glass, touch panel, and method for manufacturing laminated base material |
| KR102419615B1 (en) * | 2015-03-20 | 2022-07-12 | 삼성디스플레이 주식회사 | Display device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010020264A (en) * | 2007-08-09 | 2010-01-28 | Nichigo Morton Co Ltd | Solder resist film, resist pattern forming method and luminescent device |
| CN202285071U (en) * | 2011-10-21 | 2012-06-27 | 比亚迪股份有限公司 | Liquid crystal display module with capacitive touch screen |
| CN102662537A (en) * | 2012-03-07 | 2012-09-12 | 友达光电股份有限公司 | Method used for increasing optical density of shielding layer of touch panel |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS637535A (en) * | 1986-06-27 | 1988-01-13 | Dainippon Printing Co Ltd | Optical card |
| JP2003075971A (en) * | 2001-09-04 | 2003-03-12 | Fuji Photo Film Co Ltd | Instant film |
| JP2008287670A (en) * | 2007-05-21 | 2008-11-27 | Nissha Printing Co Ltd | Protection panel with touch input function for electronic apparatus display window |
| JP5101179B2 (en) * | 2007-06-13 | 2012-12-19 | 日東電工株式会社 | Double-sided adhesive sheet for decoration |
| JP5373296B2 (en) * | 2008-02-21 | 2013-12-18 | 日東電工株式会社 | Double-sided adhesive tape and liquid crystal display device having reflection and light shielding functions |
| JP5083692B2 (en) * | 2008-10-08 | 2012-11-28 | 住友電工プリントサーキット株式会社 | Wiring module, manufacturing method thereof, and electronic device |
| TW201025092A (en) * | 2008-12-30 | 2010-07-01 | Mildex Optical Inc | Touch panel |
| CN201402457Y (en) * | 2009-03-30 | 2010-02-10 | 深圳欧菲光科技股份有限公司 | Mutual capacitance type touch screen |
| JP5370944B2 (en) * | 2010-03-17 | 2013-12-18 | 株式会社ジャパンディスプレイ | Touch panel and manufacturing method thereof |
| TW201213949A (en) * | 2010-09-29 | 2012-04-01 | Catcher Technology Co Ltd | Touch panel |
| JP5794809B2 (en) * | 2010-10-29 | 2015-10-14 | ミネベア株式会社 | Input device |
| JP2012226688A (en) * | 2011-04-22 | 2012-11-15 | Toppan Printing Co Ltd | Decorative cover glass integrated type touch panel sensor |
| CN102929454A (en) * | 2011-08-12 | 2013-02-13 | 宸鸿科技(厦门)有限公司 | Capacitive touch panel and method for reducing visibility of metal conductors thereof |
| JP6016051B2 (en) * | 2012-01-25 | 2016-10-26 | 大日本印刷株式会社 | Front protective plate for display device and display device |
| TWI451374B (en) * | 2012-02-17 | 2014-09-01 | Innocom Tech Shenzhen Co Ltd | Display screen apparatus and method for making the same, touch screen |
| JP6415798B2 (en) * | 2012-04-05 | 2018-10-31 | 大日本印刷株式会社 | Front protective plate for display device and display device |
-
2013
- 2013-08-28 JP JP2013176636A patent/JP5887314B2/en active Active
- 2013-08-30 WO PCT/JP2013/073412 patent/WO2014045846A1/en active Application Filing
- 2013-08-30 CN CN201380035907.5A patent/CN104508608A/en active Pending
- 2013-09-06 TW TW102132099A patent/TWI595398B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010020264A (en) * | 2007-08-09 | 2010-01-28 | Nichigo Morton Co Ltd | Solder resist film, resist pattern forming method and luminescent device |
| CN202285071U (en) * | 2011-10-21 | 2012-06-27 | 比亚迪股份有限公司 | Liquid crystal display module with capacitive touch screen |
| CN102662537A (en) * | 2012-03-07 | 2012-09-12 | 友达光电股份有限公司 | Method used for increasing optical density of shielding layer of touch panel |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106022261A (en) * | 2016-05-19 | 2016-10-12 | 信利光电股份有限公司 | Application of cover plate to recognition sensor, recognition module and cover plate |
| US10437406B2 (en) | 2016-09-26 | 2019-10-08 | Fujitsu Component Limited | Touch panel |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI595398B (en) | 2017-08-11 |
| JP2014078218A (en) | 2014-05-01 |
| TW201419109A (en) | 2014-05-16 |
| JP5887314B2 (en) | 2016-03-16 |
| WO2014045846A1 (en) | 2014-03-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104395867B (en) | Sparent laminate, capacitive input device and image display device | |
| CN104508608A (en) | Method for manufacturing capacitive input device, capacitive input device, as well as image display device provided with same | |
| CN104412207B (en) | Transfer materials, capacitive input device and its manufacture method and the image display device for possessing these | |
| CN107031221B (en) | Transfer film, transparent laminate, method for producing transfer film, method for producing transparent laminate, capacitive input device, and image display device | |
| CN104321195B (en) | Capacitive input device and producing method thereof, and image display device provided with same | |
| TWI637671B (en) | Transfer film, producing method of transfer film, transparent laminate, producing method of transparent laminate, capacitive input device and image display device | |
| CN103842948B (en) | Capacitance type input device and its manufacture method and image display device | |
| CN114089600A (en) | Capacitive input device, method of manufacturing the same, and image display device | |
| CN104221098A (en) | Method of manufacturing conductive member, conductive member, and touch panel using same | |
| CN104246611A (en) | Black resin film, capacitive input device, processes for producing said film and device, and image display device equipped therewith | |
| CN104246666A (en) | Conductive substrate comprising conductive pattern and touch panel comprising same | |
| CN101893971A (en) | Projected capacitive touch panel and manufacturing method thereof | |
| CN104795131A (en) | Transparent conductor and touch panel | |
| CN108351716A (en) | Transfer film, the manufacturing method of film sensors, film sensors, the one-piece type sensor of front panel and image display device | |
| CN105653106A (en) | Capacitive touch screen with GF2 structure and manufacturing method therefor | |
| JP2012209030A (en) | Transparent conductive laminate and method for manufacturing the same | |
| CN107861656A (en) | Manufacture method, the display device of touch-screen | |
| KR20170112310A (en) | Transparent electrode structure and method for manufacturing thereof | |
| CN106660334A (en) | Transfer film, method for manufacturing laminate, laminate, capacitance-type input device, and image display device | |
| CN209728707U (en) | Touch panel | |
| WO2021147895A1 (en) | An electrode for an electronic device, a method for fabricating an electrode for an electronic device and a pixelated smartfilm apparatus | |
| KR20140086748A (en) | Patterned transparent conductive film, method for manufacturing the same and optical display apparatus comprising the same | |
| CN106575546A (en) | Aluminum pattern and method for manufacturing same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150408 |