CN104901668B - A kind of static drive device and method of silicon carbide bipolar junction transistor - Google Patents

A kind of static drive device and method of silicon carbide bipolar junction transistor Download PDF

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CN104901668B
CN104901668B CN201510244410.5A CN201510244410A CN104901668B CN 104901668 B CN104901668 B CN 104901668B CN 201510244410 A CN201510244410 A CN 201510244410A CN 104901668 B CN104901668 B CN 104901668B
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high speed
silicon substrate
current
field controller
bipolar junction
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CN104901668A (en
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廖淋圆
唐赛
王俊
帅智康
尹新
沈征
蒋梦轩
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Hunan Guoxin Semiconductor Technology Co., Ltd
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Hunan University
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Abstract

The present invention relates to technical field of semiconductors, and in particular to a kind of static drive device and method of silicon carbide bipolar junction transistor.Connected between the base stage and driving power of silicon carbide bipolar junction transistor a variable resistance unit, the variable resistance unit includes high speed silicon substrate field controller and a current-limiting resistance, described current-limiting resistance one end connects the source electrode of the high speed silicon substrate field controller, and the other end connects the drain electrode of the high speed silicon substrate field controller;The colelctor electrode of the silicon carbide bipolar junction transistor is connected with current sensing device, and the current sensing device is connected with the grid and source electrode of the high speed silicon substrate field controller.Changed by silicon carbide bipolar junction transistor ideal base drive current according to the direct ratio of collector current, largely reduce base drive power consumption, while effectively reduced and realize ideal base drive current variable costs, and essentially eliminate time delay.

Description

A kind of static drive device and method of silicon carbide bipolar junction transistor
Technical field
The present invention relates to technical field of semiconductors, and in particular to a kind of static drive dress of silicon carbide bipolar junction transistor Put and method.
Background technology
Along with the rise of carborundum (SiC) power device, SiC BJT (SiC Bipolar Junction Transistor, silicon carbide bipolar junction transistor) also due to its high current gain, excellent high temperature resistant reliability, making work Skill is simple and the advantages that without gate pole grid oxygen reliability problem, turns into one of most attractive SiC constructions of switch, so as to obtain It is widely applied.Its main feature has:First, traditional silicon BJT, SiC BJT is different from because its mode of operation connects very much Nearly monopole type device and there is relatively stable on state characteristic, overcome switching speed is slow, power consumption is big and safety operation area is small etc. Shortcoming;Second, commercialized 1200V SiC BJT conducting resistance and switching speed all with SiC MOSFET (SiC Metal- Oxide-Semiconductor Field-Effect Transistor, manufacturing silicon carbide semiconductor field-effect transistor) it is very nearly the same, But SiC BJT chip size can but reduce by 50%;3rd, need 13-16 compared to the manufacture craft for playing SiC MOSFET Block mask plate, if SiC BJT manufacture craft process 7-9 block mask plates, therefore with more simple manufacturing process and more Low cost;4th, SiC BJT do not have SiC MOSFET grid oxygen reliability problem.But because SiC BJT are current modes Driving element, its base stage need to provide lasting electric current to ensure the normally of device, and due to SiC BJT devices and Si BJT device properties have very big difference, therefore Si BJT driving can not be entirely applied to SiC BJT, thus driving into For the main bottleneck of limitation SiC BJT applications.
Traditional SiC BJT drive in order to ensure the normally of device and needing provide one it is sufficiently large lasting constant Base current ensure device in the case of maximum conducting electric current also can normally, even if device is operated in less electric current In the case of, the base current is also constant, so causes the waste of larger driving power consumption.Driven for traditional SiC BJT The problem of power wastage, the driving of existing discrete type base current realize base current along with the change of collector current and Direct proportion changes, but due to needing expensive D/A converter, DSP (digital signal processor, data signal Processor) or FPGA (Field-Programmable Gate Array, field programmable gate array), ensure base stage Electric current changes with collector current and needs complicated control method, and the phase delay time of D/A converter also is difficult to make Obtain base current follows collector current to change in real time.
The content of the invention
Base current is realized for existing along with the change of collector current and direct proportion varying cost is higher and adopt The defects of being postponed with D/A converter existence time, the invention provides a kind of static drive of silicon carbide bipolar junction transistor Device and method.
A kind of static drive device of silicon carbide bipolar junction transistor provided by the invention, including:
Connected between the base stage and driving power of silicon carbide bipolar junction transistor a variable resistance unit, it is described can Becoming resistance unit includes high speed silicon substrate field controller and a current-limiting resistance, and described current-limiting resistance one end connects the high speed silicon substrate The source electrode of field controller, the other end connect the drain electrode of the high speed silicon substrate field controller;
The colelctor electrode of the silicon carbide bipolar junction transistor is connected with current sensing device, the current sensing device with The grid of the high speed silicon substrate field controller connects with source electrode.
Further, the threshold voltage of the high speed silicon substrate field controller is 0 volt.
Further, the high speed silicon substrate field controller is adopted as semiconductcor field effect transistor or junction field effect transistor Pipe.
Further, the current sensing device includes Hall sensor and an output resistance, the Hall sensor It is connected in series with the output resistance, and the both ends of the output resistance are parallel to the high speed silicon substrate field controller respectively Grid and source electrode.
On the other hand, the present invention also provides a kind of static drive of the silicon carbide bipolar junction transistor based on said apparatus Method, including:
Current sensing device obtains the current value of the colelctor electrode of silicon carbide bipolar junction transistor in real time;
The gate voltage of high-speed silicon base field controller is worth to according to the electric current of the colelctor electrode;
The resistance value of variable resistance unit is determined according to the gate voltage of the high speed silicon substrate field controller;
Silicon carbide bipolar junction transistor base is determined according to the resistance value of the driving power and the variable resistance unit The driving current of pole.
Further, the current sensing device includes Hall sensor and an output resistance, the Hall sensor It is connected in series with the output resistance, and the both ends of the output resistance are parallel to the high speed silicon substrate field controller respectively Grid and source electrode.
Further, the electric current according to the colelctor electrode is worth to the step of the gate voltage of high-speed silicon base field controller Suddenly, including:
The Hall sensor passes through the output resistance connected with the Hall sensor according to the electric current of the colelctor electrode Export an output voltage;
Gate voltage using the output voltage as the high speed silicon substrate field controller.
A kind of static drive device and method of silicon carbide bipolar junction transistor provided by the invention, it is double by carborundum Pole junction transistor ideal base drive current changes according to the direct ratio of collector current, largely reduces base drive work( Consumption, while effectively reduce and realize ideal base drive current variable costs, and essentially eliminate time delay.
Brief description of the drawings
The features and advantages of the present invention can be more clearly understood by reference to accompanying drawing, accompanying drawing is schematically without that should manage Solve to carry out any restrictions to the present invention, in the accompanying drawings:
Fig. 1 is the structural representation of the drive device of silicon carbide bipolar junction transistor in one embodiment of the invention;
Fig. 2 is one embodiment of the invention high speed silicon substrate MOSFET characteristic curve schematic diagram;
Fig. 3 is the flow signal of the static drive method of silicon carbide bipolar junction transistor in one embodiment of the invention Figure.
Embodiment
Technical solution of the present invention is further elaborated in conjunction with drawings and examples.
A kind of static drive device for silicon carbide bipolar junction transistor that the present embodiment provides, including:
Connected between the base stage and driving power of silicon carbide bipolar junction transistor a variable resistance unit, it is described can Becoming resistance unit includes high speed silicon substrate field controller and a current-limiting resistance, and described current-limiting resistance one end connects the high speed silicon substrate The source electrode of field controller, the other end connect the drain electrode of the high speed silicon substrate field controller;
The colelctor electrode of the silicon carbide bipolar junction transistor is connected with current sensing device, the current sensing device with The grid of the high speed silicon substrate field controller connects with source electrode.
Further, the threshold voltage of the high speed silicon substrate field controller is 0 volt.
Further, the high speed silicon substrate field controller is adopted as semiconductcor field effect transistor MOSFET or junction type field effect Answer transistor JFET.
Further, the current sensing device includes Hall sensor and an output resistance, the Hall sensor It is connected in series with the output resistance, and the both ends of the output resistance are parallel to the high speed silicon substrate field controller respectively Grid and source electrode.
For example, as shown in figure 1, present embodiment discloses a kind of drive device of silicon carbide bipolar junction transistor, Wherein static importation includes:
In the base stage and driving power V of silicon carbide bipolar junction transistorSBetween connect a variable resistance unit, it is described Variable resistance unit includes the high speed silicon substrate MOSFET and a current-limiting resistance R that threshold voltage is 0 volt, described current-limiting resistance one end The source electrode of the high speed silicon substrate MOSFET is connected, the other end connects the drain electrode of the high speed silicon substrate MOSFET.
Wherein, the high speed silicon substrate MOSFET meets:A) threshold voltage of the high speed silicon substrate MOSFET is 0 volt or so. Because when SiC BJT collector current becomes big since 0, Hall sensor detects the electric current and feeds back to silicon substrate field controller Gate voltage be also since 0 change, the resistance of corresponding silicon substrate field controller also begins to change.B) the high speed silicon substrate MOSFET resistance variations are close to linear change.It can so ensure MOSFET resistance variations with high speed silicon substrate MOSFET grids Voltage is as far as possible close to direct proportion.C) high speed silicon substrate MOSFET switching speed is fast.Fast response time can so be ensured.D) it is high Fast silicon substrate MOSFET power is larger, can ensure to bear base current.
The colelctor electrode of the silicon carbide bipolar junction transistor is connected with current sensing device, the current sensing device bag Include Hall sensor and an output resistance ROUT, the Hall sensor and the output resistance ROUTIt is connected in series, and institute State output resistance ROUTBoth ends be parallel to the grid and source electrode of the high speed silicon substrate field controller respectively.
When choosing the output resistance connected with Hall sensor, should ensure that corresponding with the electric current of Hall sensor detection Output voltage range is in the resistance-variable area of the high speed silicon substrate MOSFET.
So, when carrying out ideal base drive current regulation and control, Hall sensor gathers the electric current of SiC BJT colelctor electrodes, then The current signal exported according to the size of current of SiC BJT colelctor electrodes, and pass through output resistance ROUTBe converted to voltage signal VGSPut on high speed silicon substrate MOSFET G-S the two poles of the earth.The size of base current is limited by current-limiting resistance R simultaneously.
When SiC BJT colelctor electrode no current by when, base current limits its size by current-limiting resistance R, and R values are by phase The application scenario answered determines.When colelctor electrode has electric current and electric current declines, the output current after Hall sensor detection Decline in proportion, the voltage on output resistance is VGSAlso decline in proportion, regulation and control high speed silicon substrate MOSFET resistance is near in proportion Rise, base current closely declines in proportion.
High speed silicon substrate MOSFET as shown in Figure 2 transfer characteristic curve and RDS(on)Curve, the curve reflect the high speed silicon substrate MOSFET resistance-variable area is close linear, the R so when grid voltage changesDS(on)Also the change of near-linear therewith.
On the other hand, as shown in figure 3, the present embodiment also provides a kind of silicon carbide bipolar junction type crystal based on said apparatus The static drive method of pipe, including:
S1, current sensing device obtain the current value of the colelctor electrode of silicon carbide bipolar junction transistor in real time;
S2, the gate voltage of high-speed silicon base field controller is worth to according to the electric current of the colelctor electrode;
S3, the resistance value of variable resistance unit is determined according to the gate voltage of the high speed silicon substrate field controller;
S4, silicon carbide bipolar junction transistor is determined according to the resistance value of the driving power and the variable resistance unit The driving current of base stage.
Further, the current sensing device includes Hall sensor and an output resistance, the Hall sensor It is connected in series with the output resistance, and the both ends of the output resistance are parallel to the high speed silicon substrate field controller respectively Grid and source electrode.
Further, the gate voltage of high-speed silicon base field controller is worth in the S2 according to the electric current of the colelctor electrode The step of, including:
The Hall sensor passes through the output resistance connected with the Hall sensor according to the electric current of the colelctor electrode Export an output voltage;
Gate voltage using the output voltage as the high speed silicon substrate field controller.
A kind of static drive device and method for silicon carbide bipolar junction transistor that the present embodiment provides, passes through carborundum Bipolar junction transistor ideal base drive current changes according to the direct ratio of collector current, largely reduces base drive work( Consumption, while effectively reduce and realize ideal base drive current variable costs, and essentially eliminate time delay.
Although being described in conjunction with the accompanying embodiments of the present invention, those skilled in the art can not depart from this hair Various modifications and variations are made in the case of bright spirit and scope, such modifications and variations are each fallen within by appended claims Within limited range.

Claims (7)

1. a kind of static drive device of silicon carbide bipolar junction transistor, it is characterised in that described device includes:
Connected between the base stage and driving power of silicon carbide bipolar junction transistor a variable resistance unit, it is described can power transformation Resistance unit includes high speed silicon substrate field controller and a current-limiting resistance, and described current-limiting resistance one end connects the high speed silicon substrate field control The source electrode of device, the other end connect the drain electrode of the high speed silicon substrate field controller;
The colelctor electrode of the silicon carbide bipolar junction transistor is connected with current sensing device, the current sensing device with it is described The grid of high speed silicon substrate field controller connects with source electrode;
The grounded emitter of the silicon carbide bipolar junction transistor.
2. device according to claim 1, it is characterised in that the threshold voltage of the high speed silicon substrate field controller is 0 volt.
3. device according to claim 1, it is characterised in that the high speed silicon substrate field controller is adopted as semiconductcor field effect Transistor or junction field effect transistor.
4. device according to claim 1, it is characterised in that the current sensing device includes Hall sensor and one Output resistance, the Hall sensor are connected in series with the output resistance, and the both ends of the output resistance are in parallel respectively In the grid and source electrode of the high speed silicon substrate field controller.
5. a kind of static drive method of the silicon carbide bipolar junction transistor based on any one of Claims 1-4 described device, Characterized in that, methods described includes:
Current sensing device obtains the current value of the colelctor electrode of silicon carbide bipolar junction transistor in real time;
The gate voltage of high-speed silicon base field controller is worth to according to the electric current of the colelctor electrode;
The resistance value of variable resistance unit is determined according to the gate voltage of the high speed silicon substrate field controller;
Silicon carbide bipolar junction transistor base stage is determined according to the resistance value of the driving power and the variable resistance unit Driving current.
6. according to the method for claim 5, it is characterised in that the current sensing device includes Hall sensor and one Output resistance, the Hall sensor are connected in series with the output resistance, and the both ends of the output resistance are in parallel respectively In the grid and source electrode of the high speed silicon substrate field controller.
7. according to the method for claim 6, it is characterised in that the electric current according to the colelctor electrode is worth to high-speed silicon The step of gate voltage of base field controller, including:
The Hall sensor passes through the output resistance connected with the Hall sensor according to the electric current of the colelctor electrode and exported One output voltage;
Gate voltage using the output voltage as the high speed silicon substrate field controller.
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CN102356535A (en) * 2009-03-20 2012-02-15 克里公司 Rectifier with sic bipolar junction transistor rectifying elements
US8947154B1 (en) * 2013-10-03 2015-02-03 Avogy, Inc. Method and system for operating gallium nitride electronics

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US8541787B2 (en) * 2009-07-15 2013-09-24 Cree, Inc. High breakdown voltage wide band-gap MOS-gated bipolar junction transistors with avalanche capability
US20140132312A1 (en) * 2012-11-15 2014-05-15 Fairchild Semiconductor Corporation Efficiency optimized driver circuit

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CN102356535A (en) * 2009-03-20 2012-02-15 克里公司 Rectifier with sic bipolar junction transistor rectifying elements
US8947154B1 (en) * 2013-10-03 2015-02-03 Avogy, Inc. Method and system for operating gallium nitride electronics

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