CN104883856A - Heat conduction structure of mobile device and mobile device - Google Patents
Heat conduction structure of mobile device and mobile device Download PDFInfo
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- CN104883856A CN104883856A CN201510205368.6A CN201510205368A CN104883856A CN 104883856 A CN104883856 A CN 104883856A CN 201510205368 A CN201510205368 A CN 201510205368A CN 104883856 A CN104883856 A CN 104883856A
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- conducting strip
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- plot point
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Abstract
The disclosure relates to a heat conduction structure of a mobile device and the mobile device. The heat conduction structure may include: a heat conduction sheet which is in contact with a heating source in the mobile device and performs heat conduction on the heating source, the shape of the heat conduction sheet is matched with a hot stack point in the mobile device, and the heat conduction sheet and the hot stack point are separated. Through the technical scheme of the heat conduction structure, a heat conduction direction and a heat conduction line inside the mobile device can be optimized, thereby avoiding heat accumulation.
Description
Technical field
The disclosure relates to technical field of heat dissipation, particularly relates to conductive structure and the mobile device of mobile device.
Background technology
Growing along with mobile device, the various aspects of performance of mobile device is all more and more stronger.But powerful performance is also along with the continuous increase of the caloric value of chip or functional part, otherwise this meeting affects chip or functional part performance, also reduces the gripping feel of mobile device.
Summary of the invention
The disclosure provides conductive structure and the mobile device of mobile device, to solve the deficiency in correlation technique.
According to the first aspect of disclosure embodiment, a kind of conductive structure of mobile device is provided, comprises:
Conducting strip, described conducting strip contacts with the pyrotoxin in mobile device and carries out heat conduction to described pyrotoxin, and the shape of described conducting strip matches with the thermal reactor plot point in described mobile device, makes to be separated from each other between described conducting strip and described thermal reactor plot point.
Optionally, when described thermal reactor plot point is positioned at the zone line of described conducting strip, described conducting strip is provided with through hole; Wherein, described thermal reactor plot point is positioned at described through hole, and the match specifications of the aperture of described through hole and described thermal reactor plot point.
Optionally, when described thermal reactor plot point is positioned at the border area of described conducting strip, the edge of described conducting strip caves inward, and described edge is surrounded described thermal reactor plot point forming section.
Optionally, described thermal reactor plot point is the metal parts of heat dispersion lower than default capabilities.
Optionally, described thermal reactor plot point is the joint of metal parts and non-metallic component.
Optionally, described conducting strip is graphite heat-conducting fin.
Optionally, described conducting strip is positioned at bottom the LCD display module of described mobile device.
Optionally, described conducting strip is positioned at inside the battery cover board of described mobile device.
Optionally, described conducting strip is positioned at the middle frame structure of described mobile device.
According to the second aspect of disclosure embodiment, a kind of mobile device is provided, comprises: the conductive structure of the mobile device as described in above-mentioned any embodiment.
The technical scheme that embodiment of the present disclosure provides can comprise following beneficial effect:
From above-described embodiment, the disclosure by arranging conducting strip in mobile device, to carrying out heat derivation as pyrotoxins such as process chip in mobile device, can realize heat radiation; Simultaneously, by the Adjusting Shape to conducting strip, thermal reactor plot point in conducting strip and mobile device is separated from each other, thus the continuity disconnected between conducting strip and thermal reactor plot point, avoid heat to the conduction of hot stack point, the accumulation contributing to preventing heat in mobile device, the heat dispersion of lifting mobile equipment and grip feel.
Should be understood that, it is only exemplary and explanatory that above general description and details hereinafter describe, and can not limit the disclosure.
Accompanying drawing explanation
Accompanying drawing to be herein merged in specification and to form the part of this specification, shows and meets embodiment of the present disclosure, and is used from specification one and explains principle of the present disclosure.
Fig. 1 is the structural representation of the mobile device in correlation technique.
Fig. 2 is conducting strip in correlation technique and the structural relation schematic diagram between pyrotoxin.
Fig. 3 is the schematic diagram of the conductive structure of a kind of mobile device according to the disclosure one exemplary embodiment.
Fig. 4 is the structural representation of the conductive structure of another kind of mobile device according to the disclosure one exemplary embodiment.
Fig. 5 is the structural representation of the conductive structure of another mobile device according to the disclosure one exemplary embodiment.
Embodiment
Here will be described exemplary embodiment in detail, its sample table shows in the accompanying drawings.When description below relates to accompanying drawing, unless otherwise indicated, the same numbers in different accompanying drawing represents same or analogous key element.Execution mode described in following exemplary embodiment does not represent all execution modes consistent with the disclosure.On the contrary, they only with as in appended claims describe in detail, the example of apparatus and method that aspects more of the present disclosure are consistent.
Fig. 1 is the structural representation of the mobile device in correlation technique, as shown in Figure 1, in order to solve the heating problem of mobile device in correlation technique, with the addition of conducting strip and dispelling the heat in mobile device.Such as the process chip etc. on mainboard 2A, on mainboard 2A surface (in FIG, conducting strip 1 is positioned at below mainboard) be provided with conducting strip 1A, this conducting strip 1A can conduct to more large-area heat dissipation region by the even heat that given out by mainboard 2A, thus the heat avoiding process chip etc. to produce cannot be eliminated and cause local problems of excessive heat.Similarly, for the heat radiation to battery 2B, by arranging conducting strip 1B at the back side of cell phone rear cover 3, the heat that battery 2B produces can be conducted equally, thus realizing heat radiation.
In the related, the shape of conducting strip is almost consistent with the shape of pyrotoxin, is in thinking: 1) by covering the whole surface of pyrotoxin, avoid any heating position of this pyrotoxin to be missed; 2) by the basis of internal structure not affecting mobile device, increase conducting strip as much as possible, thus increase corresponding area of dissipation.Such as in FIG, for pyrotoxin " mainboard 2A ", the shape of conducting strip 1A is consistent with mainboard 2A shape, and both are all in L-type; And for pyrotoxin " battery 2B ", the shape of conducting strip 1B is consistent with the shape of battery 2B, both are all rectangular.
But, pay close attention to pyrotoxin itself too much, make conducting strip may cause other technologies problem.As shown in Figure 2, because the shape of conducting strip 1A is consistent with mainboard 2A, make mobile device in running, conducting strip 1A may contact with the button 41 of metal material on center 4 ratio, thus is conducted in a large number by the heat on conducting strip 1 on this button 41; And in overall structure due to this button 41, be actually and formed by metal and nonmetal structure common combination, the heat that conducting strip 1 is conducted on this button 41 cannot be derived by continuation, thus is deposited in this button 41 place, thus has a strong impact on feel when user uses.
Therefore, the disclosure by improving the conductive structure in mobile device, to solve the above-mentioned technical problem existed in correlation technique.
Fig. 3 is the schematic diagram of the conductive structure of a kind of mobile device according to the disclosure one exemplary embodiment, and as shown in Figure 3, this conductive structure can comprise:
Conducting strip 1, described conducting strip 1 contacts with the pyrotoxin 2 in mobile device and carries out heat conduction to described pyrotoxin 2, and the shape of described conducting strip 1 matches with the thermal reactor plot point in described mobile device, make to be separated from each other between described conducting strip 1 and described thermal reactor plot point.
In the present embodiment, pyrotoxin 2 refers to that self can produce the parts of heat, is the source of heat, than the process chip in mainboard as shown in Figure 3.And thermal reactor plot point refers to and itself do not produce heat, but based on the technical scheme in correlation technique, heat can be caused in relevant position the parts piled up to occur, than the button 41 of the metal material on center 4 as shown in Figure 3.
From above-described embodiment, the disclosure by arranging conducting strip 1 in mobile device, to carrying out heat derivation as the pyrotoxins such as process chip 2 in mobile device, can realize heat radiation; Simultaneously, by the Adjusting Shape to conducting strip 1, conducting strip 1 is separated from each other with the thermal reactor plot point in mobile device, thus the continuity disconnected between conducting strip 1 and thermal reactor plot point, avoid heat to the conduction of hot stack point, the accumulation contributing to preventing heat in mobile device, the heat dispersion of lifting mobile equipment and grip feel.
1, thermal reactor plot point
As an exemplary embodiment, similar to the button 41 in Fig. 3, thermal reactor plot point can be the joint of metal parts and non-metallic component.So, due to the good heat conductivity of metal parts, when metal parts contacts with conducting strip 1, heat on conducting strip 1 can import metal parts into easily, but the heat conductivility of non-metallic component is poor, thus the heat on metal parts cannot be conducted by non-metallic component, thus heat can be piled up in the joint of metal parts and non-metallic component, forms thermal reactor plot point.
As another exemplary embodiment, thermal reactor plot point can be the metal parts of heat dispersion lower than default capabilities.If the volume of metal parts or area of dissipation are enough large, namely heat dispersion is strong, the heat conducted on metal parts can be left very soon, then, when metal parts contacts with conducting strip, metal parts can not be caused to become thermal reactor plot point; On the contrary, if the volume of metal parts or area of dissipation little, namely heat dispersion is weak, and the heat conducted on metal parts cannot be left very soon, then, when metal parts contacts with conducting strip, heat will be caused to pile up on metal parts, become thermal reactor plot point.Than as shown in Figure 4, for the screw 31 be installed on Mobile equipment shell, because its small volume, heat dispersion are lower than default capabilities, thus can cause heat build-up when thermal contact conductance sheet 1, thus form thermal reactor plot point.
By carrying out test of heating value to mobile device, the heat condition of each position on mobile device can be understood, thus identify thermal reactor plot point; For the form of test of heating value, the disclosure does not limit.
2, with the coordinating of thermal reactor plot point
According to the spacing at each position on conducting strip 1 and its edge, zones of different can be marked off on conducting strip 1; Such as the spacing with edge is less than or equal to the position of predeterminable range, can border area be divided into, and the spacing with edge be greater than to the position of predeterminable range, can zone line be divided into.Correspondingly, for the area type that thermal reactor plot point is corresponding, conducting strip 1 can adopt different fit forms.
As an exemplary embodiment, when thermal reactor plot point is positioned at the border area of conducting strip 1, by being caved inward at the edge of conducting strip 1, this edge is surrounded to thermal reactor plot point forming section.As shown in Figure 3, because button 41 is positioned at the right edge edge of conducting strip 1, thus by inside for the part edge of conducting strip 1 relevant position (i.e. left side) is formed sunk area 11, thus the part of structure paired keys 41 surrounds shape, and be separated from each other between the edge of conducting strip 1 and button 41, thus the material continuity be disconnected between conducting strip 1 and button 41, avoid the heat on conducting strip 1 to conduct to button 41, make button 41 no longer form thermal reactor plot point.
Similarly, in the embodiment shown in fig. 4, corresponding to the screw 31 arranged around battery 2B, can by forming the sunk area 11 corresponding respectively to each screw 31 at the edge of conducting strip 1, thus avoid conducting strip 1 by heat conduction to screw 31, make screw 31 no longer form thermal reactor plot point.
As another exemplary embodiment, when thermal reactor plot point is positioned at the zone line of conducting strip 1, conducting strip 1 is provided with through hole; Wherein, thermal reactor plot point is positioned at this through hole, and the match specifications of the aperture of this through hole and thermal reactor plot point.As shown in Figure 5, for the thermal reactor plot point 21 being positioned at zone line, because corresponding parts are rectangular, then through hole 12A conducting strip 1 arranged is also rectangular, and the length of side of rectangle is slightly larger than the rectangle length of side of thermal reactor plot point 21, thus thermal reactor plot point 21 is avoided to come in contact with the edge of through hole 12A; And for being positioned at the thermal reactor plot point 22 of zone line, because corresponding parts are rounded, the through hole 12B then conducting strip 1 arranged is also rounded, and the diameter of circle is slightly larger than the round diameter of thermal reactor plot point 21, thus avoids thermal reactor plot point 22 to come in contact with the edge of through hole 12B.
In embodiment of the present disclosure, conducting strip 1 can adopt any materials; Such as an exemplary embodiment, conducting strip 1 can be graphite heat-conducting fin.In addition, conducting strip 1 can be arranged at the optional position in mobile device, is such as positioned at middle frame structure, thus dispels the heat to the mainboard of middle frame structure inside; Or conducting strip 1 can be arranged at inside battery cover board, for dispelling the heat to battery; Or the LCD that conducting strip 1 can be arranged at mobile device shows bottom module, dispel the heat for showing module to LCD.
Those skilled in the art, at consideration specification and after putting into practice disclosed herein disclosing, will easily expect other embodiment of the present disclosure.The application is intended to contain any modification of the present disclosure, purposes or adaptations, and these modification, purposes or adaptations are followed general principle of the present disclosure and comprised the undocumented common practise in the art of the disclosure or conventional techniques means.Specification and embodiment are only regarded as exemplary, and true scope of the present disclosure and spirit are pointed out by claim below.
Should be understood that, the disclosure is not limited to precision architecture described above and illustrated in the accompanying drawings, and can carry out various amendment and change not departing from its scope.The scope of the present disclosure is only limited by appended claim.
Claims (10)
1. a conductive structure for mobile device, is characterized in that, comprising:
Conducting strip, described conducting strip contacts with the pyrotoxin in mobile device and carries out heat conduction to described pyrotoxin, and the shape of described conducting strip matches with the thermal reactor plot point in described mobile device, makes to be separated from each other between described conducting strip and described thermal reactor plot point.
2. structure according to claim 1, is characterized in that, when described thermal reactor plot point is positioned at the zone line of described conducting strip, described conducting strip is provided with through hole; Wherein, described thermal reactor plot point is positioned at described through hole, and the match specifications of the aperture of described through hole and described thermal reactor plot point.
3. structure according to claim 1, is characterized in that, when described thermal reactor plot point is positioned at the border area of described conducting strip, the edge of described conducting strip caves inward, and described edge is surrounded described thermal reactor plot point forming section.
4. structure according to claim 1, is characterized in that, described thermal reactor plot point is the metal parts of heat dispersion lower than default capabilities.
5. structure according to claim 1, is characterized in that, described thermal reactor plot point is the joint of metal parts and non-metallic component.
6. structure according to any one of claim 1 to 5, is characterized in that, described conducting strip is graphite heat-conducting fin.
7. structure according to any one of claim 1 to 5, is characterized in that, the LCD that described conducting strip is positioned at described mobile device shows bottom module.
8. structure according to any one of claim 1 to 5, is characterized in that, described conducting strip is positioned at inside the battery cover board of described mobile device.
9. structure according to any one of claim 1 to 5, is characterized in that, described conducting strip is positioned at the middle frame structure of described mobile device.
10. a mobile device, is characterized in that, comprising: the conductive structure of mobile device as claimed in any one of claims 1-9 wherein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510205368.6A CN104883856B (en) | 2015-04-27 | 2015-04-27 | The conductive structure and mobile device of mobile device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510205368.6A CN104883856B (en) | 2015-04-27 | 2015-04-27 | The conductive structure and mobile device of mobile device |
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| CN104883856A true CN104883856A (en) | 2015-09-02 |
| CN104883856B CN104883856B (en) | 2017-08-01 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105208831A (en) * | 2015-09-24 | 2015-12-30 | 小米科技有限责任公司 | Composite heat conduction structure and mobile device |
| CN107683067A (en) * | 2017-09-06 | 2018-02-09 | 北京小米移动软件有限公司 | Mobile terminal |
| CN109526190A (en) * | 2018-12-21 | 2019-03-26 | 深圳航天东方红海特卫星有限公司 | A kind of heat-conducting mechanism of controllable on-off |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1889820A (en) * | 2005-06-27 | 2007-01-03 | 宏达国际电子股份有限公司 | Portable electronic device and radiating module thereof |
| CN103828499A (en) * | 2011-08-30 | 2014-05-28 | 苹果公司 | Electronic device enclosures and heatsink structures with thermal management features |
| US20140347811A1 (en) * | 2013-05-23 | 2014-11-27 | Chaun-Choung Technology Corp. | Portable electronic device with exposed heat dissipating mechanism |
-
2015
- 2015-04-27 CN CN201510205368.6A patent/CN104883856B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1889820A (en) * | 2005-06-27 | 2007-01-03 | 宏达国际电子股份有限公司 | Portable electronic device and radiating module thereof |
| CN103828499A (en) * | 2011-08-30 | 2014-05-28 | 苹果公司 | Electronic device enclosures and heatsink structures with thermal management features |
| US20140347811A1 (en) * | 2013-05-23 | 2014-11-27 | Chaun-Choung Technology Corp. | Portable electronic device with exposed heat dissipating mechanism |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105208831A (en) * | 2015-09-24 | 2015-12-30 | 小米科技有限责任公司 | Composite heat conduction structure and mobile device |
| CN105208831B (en) * | 2015-09-24 | 2019-03-01 | 小米科技有限责任公司 | Composite heat-conducting structure and mobile device |
| CN107683067A (en) * | 2017-09-06 | 2018-02-09 | 北京小米移动软件有限公司 | Mobile terminal |
| CN107683067B (en) * | 2017-09-06 | 2020-06-02 | 北京小米移动软件有限公司 | Mobile terminal |
| CN109526190A (en) * | 2018-12-21 | 2019-03-26 | 深圳航天东方红海特卫星有限公司 | A kind of heat-conducting mechanism of controllable on-off |
| CN109526190B (en) * | 2018-12-21 | 2020-05-22 | 深圳航天东方红海特卫星有限公司 | Heat conduction mechanism capable of controlling on-off |
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| CN104883856B (en) | 2017-08-01 |
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