CN104883856B - The conductive structure and mobile device of mobile device - Google Patents
The conductive structure and mobile device of mobile device Download PDFInfo
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- CN104883856B CN104883856B CN201510205368.6A CN201510205368A CN104883856B CN 104883856 B CN104883856 B CN 104883856B CN 201510205368 A CN201510205368 A CN 201510205368A CN 104883856 B CN104883856 B CN 104883856B
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- thermally conductive
- conductive sheet
- mobile device
- thermal reactor
- plot point
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Abstract
The disclosure is directed to the conductive structure of mobile device and mobile device, the conductive structure can include：Thermally conductive sheet, the thermally conductive sheet is contacted with the pyrotoxin in mobile device and carries out heat conduction to the pyrotoxin, and the shape of the thermally conductive sheet is engaged with the thermal reactor plot point in the mobile device, makes to be separated from each other between the thermally conductive sheet and the thermal reactor plot point.By the technical scheme of the disclosure, heat conduction orientation and the circuit inside mobile device can be optimized, it is to avoid heat build-up.
Description
Technical field
This disclosure relates to technical field of heat dissipation, more particularly to mobile device conductive structure and mobile device.
Background technology
Growing with mobile device, the various aspects of performance of mobile device is more and more stronger.However, powerful performance
Also be continuously increased along with the caloric value of chip or functional part, this can on the contrary influence chip or functional part performance, also drop
The low gripping feel of mobile device.
The content of the invention
The disclosure provides the conductive structure and mobile device of mobile device, to solve the deficiency in correlation technique.
According to the first aspect of the embodiment of the present disclosure there is provided a kind of conductive structure of mobile device, including：
Thermally conductive sheet, the thermally conductive sheet contacts with the pyrotoxin in mobile device and heat conduction, and institute is carried out to the pyrotoxin
State the shape of thermally conductive sheet to be engaged with the thermal reactor plot point in the mobile device, make between the thermally conductive sheet and the thermal reactor plot point
It is separated from each other.
Optionally, when the thermal reactor plot point is located at the intermediate region of the thermally conductive sheet, it is provided with the thermally conductive sheet logical
Hole；Wherein, the thermal reactor plot point is located in the through hole, and the aperture of the through hole and the specification phase of the thermal reactor plot point
Match somebody with somebody.
Optionally, when the thermal reactor plot point is located at the border area of the thermally conductive sheet, the edge of the thermally conductive sheet is inside
Depression, makes the edge enclose the thermal reactor plot point forming portion subpackage.
Optionally, the thermal reactor plot point is the metal parts that heat dispersion is less than default capabilities.
Optionally, the thermal reactor plot point is the joint of metal parts and non-metallic component.
Optionally, the thermally conductive sheet is graphite heat-conducting fin.
Optionally, the thermally conductive sheet is located at the LCD display modules bottom of the mobile device.
Optionally, the thermally conductive sheet is located on the inside of the battery cover board of the mobile device.
Optionally, the thermally conductive sheet is located in the middle frame structure of the mobile device.
According to the second aspect of the embodiment of the present disclosure there is provided a kind of mobile device, including：As described in above-mentioned any embodiment
Mobile device conductive structure.
The technical scheme provided by this disclosed embodiment can include the following benefits：
From above-described embodiment, the disclosure, can be in mobile device by setting thermally conductive sheet in mobile device
Such as process chip pyrotoxin carries out heat derives, realizes radiating；Meanwhile, pass through the Adjusting Shape to thermally conductive sheet so that heat conduction
Piece is separated from each other with the thermal reactor plot point in mobile device, so as to disconnect the continuity between thermally conductive sheet and thermal reactor plot point, it is to avoid heat
Measure and conducted to thermal reactor plot point, contribute to the accumulation for preventing heat in mobile device, lift the heat dispersion of mobile device and hold
Hold feel.
It should be appreciated that the general description of the above and detailed description hereinafter are only exemplary and explanatory, not
The disclosure can be limited.
Brief description of the drawings
Accompanying drawing herein is merged in specification and constitutes the part of this specification, shows the implementation for meeting the disclosure
Example, and be used to together with specification to explain the principle of the disclosure.
Fig. 1 is the structural representation of the mobile device in correlation technique.
Fig. 2 is the structural relation schematic diagram between thermally conductive sheet and pyrotoxin in correlation technique.
Fig. 3 is a kind of schematic diagram of the conductive structure of mobile device according to the exemplary embodiment of the disclosure one.
Fig. 4 is the structural representation of the conductive structure of another mobile device according to the exemplary embodiment of the disclosure one
Figure.
Fig. 5 is the structural representation of the conductive structure of another mobile device according to the exemplary embodiment of the disclosure one
Figure.
Embodiment
Here exemplary embodiment will be illustrated in detail, its example is illustrated in the accompanying drawings.Following description is related to
During accompanying drawing, unless otherwise indicated, the same numbers in different accompanying drawings represent same or analogous key element.Following exemplary embodiment
Described in embodiment do not represent all embodiments consistent with the disclosure.On the contrary, they be only with it is such as appended
The example of the consistent apparatus and method of some aspects be described in detail in claims, the disclosure.
Fig. 1 is the structural representation of the mobile device in correlation technique, as shown in figure 1, in order to solve to move in correlation technique
The heating problem of equipment is moved, with the addition of thermally conductive sheet in mobile device is radiated.Such as the process chip on mainboard 2A
Deng on mainboard 2A surfaces (in Fig. 1, thermally conductive sheet 1A is located at below mainboard) there is provided thermally conductive sheet 1A, thermally conductive sheet 1A can lead to
Cross and conduct the mainboard 2A even heats given out to greater area of heat dissipation region, so as to avoid the generations such as process chip
Heat can not be eliminated and cause local problems of excessive heat.Similarly, for the radiating to battery 2B, by cell phone rear cover 3
The back side sets thermally conductive sheet 1B, equally the battery 2B heats produced can be conducted, so as to realize radiating.
In the related art, the shape of thermally conductive sheet and the shape of pyrotoxin are almost consistent, are in thinking：1) covering is passed through
The whole surface of pyrotoxin, it is to avoid any heating position of the pyrotoxin is missed；2) by not influenceing in mobile device
On the basis of portion's structure, increase thermally conductive sheet as much as possible, so as to increase corresponding area of dissipation.Such as in Fig. 1, for heating
" mainboard 2A ", thermally conductive sheet 1A shape are consistent with mainboard 2A shapes, and both of which is L-shaped in source；And for pyrotoxin, " battery 2B " is led
Backing 1B shape is consistent with battery 2B shape, and both of which is rectangular.
However, paying close attention to pyrotoxin in itself too much so that thermally conductive sheet may cause other technologies problem.Than as shown in Fig. 2
Because thermally conductive sheet 1A shape is consistent with mainboard 2A so that mobile device in the process of running, thermally conductive sheet 1A may with center 4
The button 41 of metal material is contacted, so that by the heat on thermally conductive sheet 1A largely conduction to the button 41；And due to the button
It is actually to be formed by metal with nonmetal structure common combination so that thermally conductive sheet 1A, which is conducted to this, to be pressed in 41 overall structure
Heat on key 41 can not continue export, so as to be deposited at the button 41, so as to have a strong impact on feel when user uses.
Therefore, the disclosure to the conductive structure in mobile device by being improved, to solve present in correlation technique
Above-mentioned technical problem.
Fig. 3 is a kind of schematic diagram of the conductive structure of mobile device according to the exemplary embodiment of the disclosure one, such as
Shown in Fig. 3, the conductive structure can include：
Thermally conductive sheet 1, the thermally conductive sheet 1 contacts with the pyrotoxin 2 in mobile device and carries out heat conduction to the pyrotoxin 2,
And the shape of the thermally conductive sheet 1 is engaged with the thermal reactor plot point in the mobile device, make the thermally conductive sheet 1 and the hot stack
It is separated from each other between point.
In the present embodiment, pyrotoxin 2 refers to that itself can produce the part of heat, is the source of heat, such as Fig. 3 institutes
Process chip in the mainboard shown.And thermal reactor plot point refers to itself not produce heat, but based on the technology in correlation technique
Scheme, the part that heat can be caused to be accumulated in relevant position, than the button of the metal material on center 4 as shown in Figure 3
41。
From above-described embodiment, the disclosure, can be in mobile device by setting thermally conductive sheet 1 in mobile device
Such as process chip pyrotoxin 2 carries out heat derives, realizes radiating；Meanwhile, pass through the Adjusting Shape to thermally conductive sheet 1 so that lead
Backing 1 is separated from each other with the thermal reactor plot point in mobile device, so as to disconnect the continuity between thermally conductive sheet 1 and thermal reactor plot point, is kept away
Exempt from heat to conduct to thermal reactor plot point, contribute to the accumulation for preventing heat in mobile device, lift the heat dispersion of mobile device
With gripping feel.
1st, thermal reactor plot point
Similar to the button 41 in Fig. 3 as an exemplary embodiment, thermal reactor plot point can be metal parts and non-gold
Belong to the joint of part.So, due to the good heat conductivity of metal parts, when metal parts is contacted with thermally conductive sheet 1, thermally conductive sheet
Heat on 1 being capable of incoming metal parts, but the heat conductivility of non-metallic component is poor easily, thus the heat on metal parts
It can not be conducted by non-metallic component, so that heat can be accumulated in the joint of metal parts and non-metallic component,
Form thermal reactor plot point.
As another exemplary embodiment, thermal reactor plot point can be less than the metal parts of default capabilities for heat dispersion.Such as
The volume or area of dissipation of fruit metal parts are sufficiently large, i.e., heat dispersion is strong so that conduction to the heat on metal parts can
Disperse quickly, then when metal parts is in contact with thermally conductive sheet, metal parts will not be caused to turn into thermal reactor plot point；If on the contrary,
The volume or area of dissipation of metal parts are small, i.e., heat dispersion is weak so that conduction to the heat on metal parts can not dissipate quickly
Go, then when metal parts is in contact with thermally conductive sheet, heat will be caused to be accumulated on metal parts, as thermal reactor plot point.Such as Fig. 4
It is shown, for the screw 31 being installed on Mobile equipment shell, because its small volume, heat dispersion are less than default capabilities, because
And heat build-up can be caused when thermal contact conductance piece 1, so as to form thermal reactor plot point.
By carrying out test of heating value to mobile device, you can understand the heat condition of each position on mobile device, from
And identify thermal reactor plot point；For the form of test of heating value, the disclosure is simultaneously not limited.
2nd, with the cooperation of thermal reactor plot point
According to the spacing of each position on thermally conductive sheet 1 and its edge, different zones can be marked off on thermally conductive sheet 1；
Such as being smaller than or equal to the position of pre-determined distance with edge, border area can be divided into, and for edge
Spacing be more than pre-determined distance position, intermediate region can be divided into.Correspondingly, for the corresponding region class of thermal reactor plot point
Type, thermally conductive sheet 1 can use different fit forms.
As an exemplary embodiment, when thermal reactor plot point is located at the border area of thermally conductive sheet 1, by by thermally conductive sheet 1
Edge caves inward, and the edge is enclosed thermal reactor plot point forming portion subpackage.As shown in figure 3, because button 41 is located at thermally conductive sheet 1
Right edge, thus by the way that by the part edge of the relevant position of thermally conductive sheet 1, inwardly (i.e. left side) forms sunk area 11, so that structure
The part of paired keys 41 is surrounded to be separated from each other between shape, and the edge and button 41 of thermally conductive sheet 1, so as to be disconnected thermally conductive sheet 1
Material continuity between button 41, it is to avoid the heat on thermally conductive sheet 1 is conducted to button 41, makes button 41 not re-form
Thermal reactor plot point.
Similarly, in the embodiment shown in fig. 4, can be by leading corresponding to the screw 31 set around battery 2B
The edge formation of backing 1 corresponds respectively to the sunk area 11 of each screw 31, so as to avoid thermally conductive sheet 1 that heat is conducted into spiral shell
Nail 31, makes screw 31 not re-form hot stack point.
As another exemplary embodiment, when thermal reactor plot point is located at the intermediate region of thermally conductive sheet 1, set on thermally conductive sheet 1
There is through hole；Wherein, thermal reactor plot point is located in the through hole, and aperture and the match specifications of thermal reactor plot point of the through hole.Such as Fig. 5 institutes
Show, for the thermal reactor plot point 21 in intermediate region, because corresponding part is rectangular, the then through hole set on thermally conductive sheet 1
12A is also rectangular, and the rectangle length of side of the length of side slightly larger than thermal reactor plot point 21 of rectangle, so as to avoid thermal reactor plot point 21 and through hole
12A edge comes in contact；And for being located at the thermal reactor plot point 22 in intermediate region, because corresponding part is rounded, then lead
The through hole 12B set on backing 1 is also rounded, and circular diameter is slightly larger than the round diameter of thermal reactor plot point 21, so as to avoid
Thermal reactor plot point 22 and through hole 12B edge come in contact.
In embodiment of the disclosure, thermally conductive sheet 1 can use any materials；For example as an exemplary embodiment, lead
Backing 1 can be graphite heat-conducting fin.In addition, thermally conductive sheet 1 can be arranged at the optional position in mobile device, such as positioned at center
In structure, so as to be radiated to the mainboard inside middle frame structure；Or, thermally conductive sheet 1 can be arranged on the inside of battery cover board, used
Radiated in battery；Or, thermally conductive sheet 1 can be arranged at the LCD display modules bottom of mobile device, for aobvious to LCD
Show that module is radiated.
Those skilled in the art will readily occur to its of the disclosure after considering specification and putting into practice disclosure disclosed herein
Its embodiment.The application is intended to any modification, purposes or the adaptations of the disclosure, these modifications, purposes or
Person's adaptations follow the general principle of the disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.Description and embodiments are considered only as exemplary, and the true scope of the disclosure and spirit are by following
Claim is pointed out.
It should be appreciated that the precision architecture that the disclosure is not limited to be described above and is shown in the drawings, and
And various modifications and changes can be being carried out without departing from the scope.The scope of the present disclosure is only limited by appended claim.
Claims (8)
1. a kind of conductive structure of mobile device, it is characterised in that including：
Thermally conductive sheet, the thermally conductive sheet contacts with the pyrotoxin in mobile device and carries out heat conduction to the pyrotoxin, and described leads
The shape of backing is engaged with the thermal reactor plot point in the mobile device, is made between the thermally conductive sheet and the thermal reactor plot point mutually
Separation；
Wherein, the thermal reactor plot point is following any：Metal parts, metal parts and non-gold of the heat dispersion less than default capabilities
Belong to the joint of part.
2. structure according to claim 1, it is characterised in that when the thermal reactor plot point is located at the middle area of the thermally conductive sheet
During domain, through hole is provided with the thermally conductive sheet；Wherein, the thermal reactor plot point is located in the through hole, and the aperture of the through hole
With the match specifications of the thermal reactor plot point.
3. structure according to claim 1, it is characterised in that when the thermal reactor plot point is located at the edge area of the thermally conductive sheet
During domain, the edge of the thermally conductive sheet caves inward, and the edge is enclosed the thermal reactor plot point forming portion subpackage.
4. structure according to any one of claim 1 to 3, it is characterised in that the thermally conductive sheet is graphite heat-conducting fin.
5. structure according to any one of claim 1 to 3, it is characterised in that the thermally conductive sheet is set positioned at the movement
Standby LCD display modules bottom.
6. structure according to any one of claim 1 to 3, it is characterised in that the thermally conductive sheet is set positioned at the movement
On the inside of standby battery cover board.
7. structure according to any one of claim 1 to 3, it is characterised in that the thermally conductive sheet is set positioned at the movement
In standby middle frame structure.
8. a kind of mobile device, it is characterised in that including：The heat conduction of mobile device as any one of claim 1-7
Structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510205368.6A CN104883856B (en) | 2015-04-27 | 2015-04-27 | The conductive structure and mobile device of mobile device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510205368.6A CN104883856B (en) | 2015-04-27 | 2015-04-27 | The conductive structure and mobile device of mobile device |
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| CN104883856A CN104883856A (en) | 2015-09-02 |
| CN104883856B true CN104883856B (en) | 2017-08-01 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105208831B (en) * | 2015-09-24 | 2019-03-01 | 小米科技有限责任公司 | Composite heat-conducting structure and mobile device |
| CN107683067B (en) * | 2017-09-06 | 2020-06-02 | 北京小米移动软件有限公司 | Mobile terminal |
| CN109526190B (en) * | 2018-12-21 | 2020-05-22 | 深圳航天东方红海特卫星有限公司 | Heat conduction mechanism capable of controlling on-off |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1889820A (en) * | 2005-06-27 | 2007-01-03 | 宏达国际电子股份有限公司 | Portable electronic device and radiating module thereof |
| CN103828499A (en) * | 2011-08-30 | 2014-05-28 | 苹果公司 | Electronic device enclosures and heatsink structures with thermal management features |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI626523B (en) * | 2013-05-23 | 2018-06-11 | 超眾科技股份有限公司 | Portable electronic device with exposed heat dissipation structure |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1889820A (en) * | 2005-06-27 | 2007-01-03 | 宏达国际电子股份有限公司 | Portable electronic device and radiating module thereof |
| CN103828499A (en) * | 2011-08-30 | 2014-05-28 | 苹果公司 | Electronic device enclosures and heatsink structures with thermal management features |
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