CN104882403A - Collet for boding semiconductor die - Google Patents
Collet for boding semiconductor die Download PDFInfo
- Publication number
- CN104882403A CN104882403A CN201410413623.1A CN201410413623A CN104882403A CN 104882403 A CN104882403 A CN 104882403A CN 201410413623 A CN201410413623 A CN 201410413623A CN 104882403 A CN104882403 A CN 104882403A
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- China
- Prior art keywords
- chuck
- holder
- plate
- clamper plate
- vacuum
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Abstract
The invention provides a collet for bonding a semiconductor die. The collet herein comprises: a collet holder which includes a plurality of holder vacuum apertures which penetrate the collet holder from the upper surface of the collet holder to the lower surface of the collet holder, and a collet plate which is coupled to the collet holder and includes at least one plate vacuum aperture, the number of the plate vacuum apertures being less than the number of the plurality of holder vacuum apertures, in which the plate vacuum apertures are communicated with the plurality of holder vacuum apertures.
Description
The cross reference of related application
Subject application advocates the rights and interests of the 10-2014-0023702 korean patent application case that on February 27th, 2014 applies in Korean Intellectual Property Office, and the disclosure of described application case is all incorporated herein by reference at this.
Technical field
Of the present inventionly relate to a kind of chuck for bond semiconductor nude film (die), particularly relate to a kind of chuck comprising clamper plate for bond semiconductor nude film, the chuck holder that described clamper plate can be applied to the holder vacuum hole with various shape optionally can be coupled on absorption rubber equably.
Background technology
In the current area of assembling semiconductor, the chuck with more pinpoint accuracy has been that the quality for improving semiconductor packages in semiconductor die engaging process is necessary.Therefore, have developed the chuck of various kind, and have recently been developed magnetic chuck.Magnetic chuck is conducive to preventing from and misalignment, because magnetic chuck uses magnetic force and vacuum characteristics.
In general, magnetic chuck comprises clamper plate and the chuck holder that is coupled on clamper plate and comprise multiple holder vacuum hole.
In addition, chuck holder comprises the magnet being attached to handle portions, and handle portions is connected on the device of loading semiconductor die.
Due to the position of the plate formed in clamper plate vacuum hole and structure are determined according to the holder vacuum hole formed in chuck holder, be therefore necessary with the multiple design forming of the design according to the holder vacuum hole formed in chuck holder to be formed on the plate vacuum hole in clamper plate.Therefore, according to the magnetic chuck of routine, if the position of the holder vacuum hole in chuck holder and structural change, the position of the plate vacuum hole so in clamper plate and structure must change according to the above change of holder vacuum hole.Therefore, owing to must manufacture new clamper plate, therefore manufacturing cost increases, and is difficult to the deadline meeting product payment.
Flexible absorption rubber is coupled on the bottom surface of clamper plate.But, when being coupled on clamper plate by absorption rubber, in the coupling unit between absorption rubber and clamper plate, minimum gap may be produced.In addition, when chuck employs longer a period of time, the flatness of absorption rubber may reduce because of gap, and in addition, absorption rubber and clamper plate may be separated from one another.That is, may product defects be there is and life-span of product may be reduced.
Summary of the invention
One or more embodiment of the present invention comprises the chuck for bond semiconductor nude film, and described chuck comprises clamper plate, and described clamper plate can be applied on the chuck holder of the holder vacuum hole with various design.
One or more embodiment of the present invention comprises the chuck for bond semiconductor nude film, and described chuck enables absorption rubber be coupled equably each other with clamper plate.
Other aspect will partly be elaborated in the following description, and partly will be apparent from description, or can by putting into practice acquistion to presented embodiment.
According to one or more embodiment of the present invention, the chuck for bond semiconductor nude film comprises: chuck holder, and described chuck holder comprises the multiple holder vacuum holes from the upper surface of chuck holder to lower surface through chuck holder; And clamper plate, described clamper plate is coupled on chuck holder, and comprise at least one plate vacuum hole, the quantity of plate vacuum hole is less than the quantity of described multiple holder vacuum hole, and at least one plate vacuum hole wherein said is communicated with all described multiple holder vacuum holes.
The quantity of plate vacuum hole can be one or two.
At least one plate vacuum hole can have the border of single closed-curve shape.
Chuck holder can comprise the first ledge further, the first ledge be arranged at least one plate vacuum hole described at least partially.
Chuck can comprise the first adhesive layer between lower surface and the upper surface of clamper plate being placed in chuck holder further.
At least one in chuck holder and clamper plate can comprise shared vacuum section further, and serves as the single channel for being communicated with at least one plate vacuum hole described by all described multiple holder vacuum holes under sharing the state that vacuum section can be coupled on chuck holder at clamper plate.
Shared vacuum section can be formed as the recess in bottom it with at least one hole.
Shared vacuum section can have the border of single closed-curve shape.
Clamper plate can comprise further be arranged in shared vacuum section border in multiple barriers, and described multiple barrier gives prominence to towards chuck holder the lower surface supporting chuck holder from the virtual extension plane of the bottom surface of shared vacuum section.
Described multiple barrier can through settle make described multiple barrier at least one contacting end portions described in the border of at least one plate vacuum hole.
Described multiple barrier can make at least one contacting end portions of described multiple barrier share the border of vacuum section through arranging.
Clamper plate can be made up of metal material.
Clamper plate can comprise the multiple coupling apertures be formed on the excircle of clamper plate further, and chuck holder can comprise further towards outstanding multiple second ledges of clamper plate, and multiple second ledge will be coupled on described multiple coupling aperture of clamper plate correspondingly.
Chuck holder can comprise coupling recess further, and clamper plate is arranged in coupling recess.
Chuck can comprise absorption rubber further, and described absorption rubber is placed on the side of clamper plate; And second adhesive layer, described second adhesive layer is placed between clamper plate and absorption rubber, for make clamper plate and absorption rubber coupled to each other.
Clamper plate and absorption rubber can be coupled to each other by hot compression, and during hot compression, the second adhesive layer is melted and the bonding force between clamper plate and absorption rubber is increased.
Chuck can be included in the multiple air discharge ducts be formed in the surface of clamper plate further, and wherein air discharge duct is emitted on clamper plate and the absorption bubble that produces in the second adhesive layer of rubber period coupled to each other.
According to one or more embodiment of the present invention, the chuck for bond semiconductor nude film comprises: chuck holder, and described chuck holder comprises a holder vacuum hole through chuck holder from upper surface to lower surface; And clamper plate, described clamper plate is coupled on chuck holder, and comprise a plate vacuum hole, wherein clamper plate comprises the shared vacuum section be formed between a holder vacuum hole and a plate vacuum hole further, and shared vacuum section is communicated with both a holder vacuum hole and a plate vacuum hole.
According to one or more embodiment of the present invention, the chuck for bond semiconductor nude film comprises: chuck holder, and described chuck holder comprises at least one the holder vacuum hole through chuck holder from upper surface to lower surface; And clamper plate, described clamper plate is coupled on chuck holder, and do not comprise plate vacuum hole, wherein chuck holder comprises ledge further, all at least one holder vacuum holes described are through described ledge, and clamper plate comprises coupling aperture further, the ledge of chuck holder is inserted in described coupling aperture.
According to one or more embodiment of the present invention, the chuck for bond semiconductor nude film comprises: chuck holder, and described chuck holder comprises at least one the holder vacuum hole through chuck holder from upper surface to lower surface; Clamper plate, described clamper plate is coupled on chuck holder, and comprises at least one plate vacuum hole; Absorption rubber, described absorption rubber is placed on the surface of the side of clamper plate; And adhesive layer, described adhesive layer is placed between clamper plate and absorption rubber, for making clamper plate coupled to each other with absorption rubber.
Accompanying drawing explanation
In conjunction with the drawings to the following description that embodiment is carried out, these and/or other side will become apparent and easier to understand, wherein:
Fig. 1 is the plan view of chuck according to an embodiment of the invention.
Fig. 2 is the cross sectional view of the chuck of line A-A ' intercepting along Fig. 1.
Fig. 3 is included in the perspective view of the clamper plate in the chuck of Fig. 1.
Fig. 4 is the plan view of the clamper plate of Fig. 3.
Fig. 5 is the cross sectional view of the clamper plate of line B-B ' intercepting along Fig. 4.
Fig. 6 A to 6D is included in the figure of the amendment example of the clamper plate in the chuck of Fig. 1.
Fig. 7 A to 7D is the figure of the process of the chuck describing shop drawings 1.
Fig. 8 is the plan view of chuck according to another embodiment of the present invention.
Fig. 9 is the cross sectional view of the chuck of line C-C ' intercepting along Fig. 8.
Figure 10 is included in the plan view of the clamper plate in the chuck of Fig. 8.
Figure 11 is the cross sectional view of the clamper plate of line D-D ' intercepting along Figure 10.
Figure 12 A to 12D is the figure of the process of the chuck describing shop drawings 8.
Figure 13 is the plan view of chuck according to another embodiment of the present invention.
Figure 14 A is the cross sectional view of the chuck of line E-E ' intercepting along Figure 13.
Figure 14 B is the figure of the amendment example of the chuck of Figure 14 A.
Figure 15 is included in the plan view of the clamper plate in chuck according to another embodiment of the present invention.
Figure 16 is the cross sectional view of the clamper plate of line F-F ' intercepting along Figure 15.
Figure 17 A to 17E is the figure of the process describing the chuck manufacturing Figure 13.
Figure 18 is the plan view of chuck according to another embodiment of the present invention.
Figure 19 is the cross sectional view of the chuck of line G-G ' intercepting along Figure 18.
Figure 20 is the decomposition diagram of chuck according to another embodiment of the present invention.
Figure 21 is included in the clamper plate in the chuck of Figure 20 and adsorbs the cross sectional view of rubber.
Figure 22 is the cross sectional view of the chuck of Figure 20.And
Figure 23 is the cross sectional view of chuck according to another embodiment of the present invention.
Embodiment
Now with detailed reference to embodiment, the example of described embodiment is shown in the drawings, and wherein identical in the text reference number refers to identical element.Thus, embodiments of the invention can have multi-form and should not be construed as limited to set forth description herein.Therefore, embodiment only describes by reference to graphic each side that this description is described hereinafter.Such as " at least one " etc. be expressed in element list before time can change the whole list of element but the Individual elements do not changed in list.
The chuck for bond semiconductor nude film according to one or more embodiment of the present invention is described in detail hereinafter with reference to accompanying drawing.
Fig. 1 is according to an embodiment of the invention for the plan view of the chuck 100 of bond semiconductor nude film, Fig. 2 is the cross sectional view of the chuck 100 of line A-A ' intercepting along Fig. 1, Fig. 3 is included in the perspective view of the clamper plate 120 in chuck 100 according to an embodiment of the invention, Fig. 4 is the plan view of the clamper plate 120 of Fig. 3, and Fig. 5 is the cross sectional view of the clamper plate 120 of line B-B ' intercepting along Fig. 4.
Referring to figs. 1 to Fig. 5, the chuck 100 according to an embodiment of the invention for bond semiconductor nude film comprises chuck holder 110 and clamper plate 120.
Chuck holder 110 can comprise the multiple holder vacuum holes 111 through chuck holder 110, for vacuum suction semiconductor die (not shown).Such as, holder vacuum hole 111 can be formed as the rectangular tube being divided into multiple part, and can be configured to from the upper surface 110a of chuck holder 110 to lower surface 110b through chuck holder 110.But embodiments of the invention are not limited to this, and holder vacuum hole 111 can be formed as various shape.
The lower surface 110b of chuck holder 110 can form multiple ledge 113.Described multiple ledge 113 is inserted in the multiple coupling apertures 125 be formed in clamper plate 120 respectively correspondingly, and clamper plate 120 can be coupled on chuck holder 110 securely.
Chuck holder 110 can be made by producing the non-, conductive rubber of electrostatic, silicone or amido formate, and can be made up of material that is anlistatig and conduction.
Clamper plate 120 has the region corresponding with the region of the lower surface 110b of chuck holder 110.Formed in the central part office of clamper plate 120 from single plate vacuum hole 121 through lower surface of the upper surface of clamper plate 120.The shared vacuum section 123 being formed as groove is formed in the upper surface of clamper plate 120, and described multiple coupling aperture 125 can be formed on the excircle of clamper plate 120, described multiple ledges 113 of chuck holder 110 are inserted in described multiple coupling aperture 125.
Can form at least one hole at the bottom place of shared vacuum section 123, and plate vacuum hole 121 is communicated with the hole in the bottom being formed at shared vacuum section 123.
Share the border that vacuum section 123 can have single closed-curve shape.Such as, share the groove that vacuum section 123 can be rectangle storage tank shape, there is the hole locating to be formed bottom it.In addition, the lower surface 110b of chuck holder 110 can cover the opening of shared vacuum section 123 to form empty space in chuck 100 inside.In addition, shared vacuum section 123 serves as the single channel for being communicated with plate vacuum hole 121 by all described multiple holder vacuum holes 111 be formed in chuck holder 110, and the quantity of plate vacuum hole 121 is less than the quantity of holder vacuum hole 111.For this reason, the cross-sectional area that shared vacuum section 123 has is greater than the cross-sectional area of all described multiple holder vacuum holes 111, and enough wide region can be run through in addition and form described shared vacuum section 123, to be communicated with all described multiple holder vacuum holes 111 being placed in each position.Thus, share vacuum section 123 and form the shared vacuum pipeline be communicated with all described multiple holder vacuum holes 111, clamper plate 120 according to an embodiment of the invention can be applied to and have on the chuck holder of various structure.Therefore, even if when the structural change of described multiple holder vacuum hole 111, also can not change the structure of clamper plate 120, and therefore can reduce the manufacturing cost of chuck 100 and the time spent for the manufacture of chuck 100 can be reduced.
Clamper plate 120 can be made up of metal material.
Fig. 6 A to Fig. 6 D is the figure of the amendment example that the clamper plate 120 be included in chuck 100 is according to an embodiment of the invention shown.
Clamper plate 120A shown in Fig. 6 A comprise be placed in shared vacuum section 123 border in multiple barrier 127a of (that is, between border and plate vacuum hole 121).Described multiple barrier 127a can be outstanding with the lower surface 110b supporting chuck holder 110 towards chuck holder 110 from the virtual extension plane of the bottom surface of shared vacuum section 123 (123a of Fig. 2).During the molding process for the formation of chuck holder 110 and during the process using chuck 100, described multiple barrier 127a can stop filling molding material to share vacuum section 123.
Clamper plate 120B shown in Fig. 6 B can comprise multiple barrier 127b, and described multiple barrier 127b makes its at least one end section can the border of contact plate vacuum hole 121 through settling.
Clamper plate 120C shown in Fig. 6 C comprises multiple barrier 127c, and described multiple barrier 127c makes its at least one end section can contact the border of shared vacuum section 123 through settling.
Clamper plate 120D shown in Fig. 6 D comprise be formed at shared vacuum section 123 respectively border beyond the coupling aperture 125 ' of four edges (that is, at the side place not forming plate vacuum hole 121).
Fig. 7 A to Fig. 7 D is the figure describing the process manufacturing chuck 100 according to an embodiment of the invention.
First, as shown in Figure 7A, the moulding material 110A (namely elastomeric material) for performing molding process is loaded onto the lower bolster 10 comprising ledge 11.
Then, as shown in fig.7b, use cope match-plate pattern 20 pressure die prepared material 110A thus form chuck holder 110., in chuck holder 110, form described multiple holder vacuum hole 111 by the ledge 11 of lower bolster 10 herein, and on chuck holder 110, form described multiple ledge 113 by the groove 25 be formed in cope match-plate pattern 20.
Then, as shown in fig. 7c, remove cope match-plate pattern 20, and subsequently the ledge 113 of chuck holder 110 is inserted in the coupling aperture 125 of previously prepared clamper plate 120, make chuck holder 110 and clamper plate 120 can be coupled to each other.
Next, as shown in Figure 7 D, lower bolster 10 is removed to complete the forming process of chuck 100 according to an embodiment of the invention.
Fig. 8 is the plan view of chuck 800 according to another embodiment of the present invention, Fig. 9 is the cross sectional view of the chuck 800 of line C-C ' intercepting along Fig. 8, Figure 10 is the plan view of clamper plate 820 according to an embodiment of the invention, and Figure 11 is the cross sectional view of the clamper plate 820 of line D-D ' intercepting along Figure 10.
With reference to figure 8 to Figure 11, chuck 800 comprises chuck holder 810 and clamper plate 820 according to an embodiment of the invention.
Chuck holder 810 can comprise the multiple holder vacuum holes 811 through chuck holder 810, for vacuum suction semiconductor die (not shown).Such as, holder vacuum hole 811 can be formed as the rectangular tube being divided into multiple part, and can be configured to from the upper surface 810a of chuck holder 810 to lower surface 810b through chuck holder 810.But embodiments of the invention are not limited to this, that is, the holder vacuum hole 811 with other various design can be formed.
Shared vacuum section 815 and multiple ledge 813 can be formed on the lower surface 810b of chuck holder 810.
Herein, different from previous embodiment, share vacuum section 815 and can be formed in chuck holder 810, instead of be formed in clamper plate 820.Share the border that vacuum section 815 can have single closed-curve shape.Such as, to share on lower surface 810b that vacuum section 815 is formed at chuck holder 810 and can be the groove of rectangle storage tank shape, this groove bottom it in there is at least one hole.And sharing vacuum section 815 can be communicated with all described multiple holder vacuum holes 811 be formed in chuck holder 810.In addition, shared vacuum section 815 can serve as the single channel for being communicated with single plate vacuum hole 821 by all described multiple holder vacuum holes 811 be formed in chuck holder 810.For this reason, the cross-sectional area that shared vacuum section 815 has is greater than the cross-sectional area of all described multiple holder vacuum holes 811, and enough wide region can be run through and form described shared vacuum section, to be communicated with all described multiple holder vacuum holes 811 being placed in each position.As described above, share vacuum section 815 and form the shared vacuum pipeline be communicated with all described multiple holder vacuum holes 811, clamper plate 820 according to an embodiment of the invention can be applied to and have on the chuck holder 810 of various structure.Therefore, even if when the structural change of holder vacuum hole 811, also without the need to changing the structure of clamper plate 820, and therefore can reduce the manufacturing cost of chuck 800 and the time manufacturing chuck 800 and spend can be reduced.
Described multiple ledge 813 is inserted in the multiple coupling apertures 823 be formed in clamper plate 820 respectively correspondingly, and clamper plate 820 can be coupled on chuck holder 810 securely.
Chuck holder 810 can be made by producing the non-, conductive rubber of electrostatic, silicone or amido formate, and can be made up of material that is anlistatig and conduction.
Clamper plate 820 has the region corresponding with the region of the lower surface 810b of chuck holder 810.Plate vacuum hole 821 from the upper surface of clamper plate 820 to lower surface through clamper plate 820 can be formed at the core of clamper plate 820, and described multiple coupling aperture 823 can be formed on the excircle of clamper plate 820, the ledge 813 of chuck holder 810 is inserted in described multiple coupling aperture 823.
In addition, clamper plate 820 covers the opening of shared vacuum section 815 to form empty space in chuck 800 inside.
Clamper plate 820 can be made up of metal material.
Figure 12 A to Figure 12 D is the figure describing the process manufacturing chuck 800 according to an embodiment of the invention.
First, as shown in figure 12a, the moulding material 810A (namely elastomeric material) for performing molding process is loaded onto the lower bolster 30 comprising ledge 31.
Then, as shown in Figure 12B, use cope match-plate pattern 40 pressure die prepared material 810A thus form chuck holder 810.Herein, in chuck holder 810, form described multiple holder vacuum hole (811 of Figure 12 D) by the ledge 31 of lower bolster 30, and in chuck holder 810, form shared vacuum section (815 of Figure 12 C) by the ledge 41 of cope match-plate pattern 40.
Next, as shown in figure 12 c, remove cope match-plate pattern 40, and the ledge 813 of chuck holder 810 is inserted in the coupling aperture 823 of previously prepared clamper plate 820, make chuck holder 810 and clamper plate 820 coupled to each other.
Afterwards, as seen in fig. 12d, remove lower bolster 30 and complete the shaping of chuck 800 according to an embodiment of the invention subsequently.
Figure 13 is the plan view of chuck 1300 according to another embodiment of the present invention, Figure 14 A is the cross sectional view of the chuck 1300 of line E-E ' intercepting along Figure 13, Figure 14 B is the figure of the amendment example of the chuck 1300 of using Figure 14 A, Figure 15 is included in the plan view of the clamper plate 1320 in the chuck 1300 of Figure 13, and Figure 16 is the cross sectional view of the clamper plate 1320 of line F-F ' intercepting along Figure 15.
Referring to figs. 13 through Figure 16, the chuck 1300 according to an embodiment of the invention for bond semiconductor nude film comprises chuck holder 1310 and clamper plate 1320.
Chuck holder 1310 can comprise the multiple holder vacuum holes 1311 through chuck holder 1310.Such as, holder vacuum hole 1311 can be formed as the rectangular tube being divided into multiple part, and can be configured to from the upper surface 1310a of chuck holder 1310 to lower surface 1310b through chuck holder 1310.But embodiments of the invention are not limited to this, and the holder vacuum hole 1311 with other various design can be formed.
As shown in fig. 14 a, the lower surface 1310b of chuck holder 1310 can be smooth.
In addition, as shown in Figure 14 B, ledge 1313 can be formed on the lower surface 1310b of chuck holder 1310.Ledge 1313 can have smooth end section 1313a.In addition, the end section 1313a of ledge 1313 can be positioned at position high as the lower surface 1320b of clamper plate 1320 or can be positioned at the position of the lower surface 1320b higher or lower than clamper plate 1320.
As described above, the lower surface 1310b of chuck holder 1310 can be smooth or can have ledge 1313.
Chuck holder 1310 can be made by producing the non-, conductive rubber of electrostatic, silicone or amido formate, and can be made up of material that is anlistatig and conduction.
Clamper plate 1320 can have the region corresponding with the region of the lower surface 1310b of clamper plate 1320, and is formed at the central part office of clamper plate 1320 through one or two plate vacuum hole 1321 of clamper plate 1320 from the upper surface 1320a of clamper plate 1320 to lower surface 1320b.
One or two plate vacuum hole 1321 described be formed in chuck 1300 according to an embodiment of the invention can have the border of single closed curve type, similar with the shared vacuum section 123 be formed at according in the chuck 100 of previous embodiment.Such as, one or two plate vacuum hole 1321 described can be formed as the rectangular tube formed in the lower surface 1320b of clamper plate 1320, and the lower surface 1310b of chuck holder 1310 can the opening of overlay vacuum hole 1321, thus forms empty space in chuck 1300.
And plate vacuum hole 1321 can serve as the single channel be communicated with all described multiple holder vacuum holes 1311 be formed in chuck holder 1310, as shown in fig. 14 a.For this reason, the cross-sectional area that plate vacuum hole 1321 has is greater than the cross-sectional area of all described multiple holder vacuum holes 1311, and enough wide region can be run through in addition and form described plate vacuum hole 1321, to be communicated with all described multiple holder vacuum holes 1311 being placed in each position.Thus, plate vacuum hole 1321 forms the shared vacuum pipeline be communicated with all described multiple holder vacuum holes 1311, clamper plate 1320 according to an embodiment of the invention can be applied to and have on the chuck holder 1310 of various structure.Therefore, even if when the structural change of described multiple holder vacuum hole 1311, also without the need to changing the structure of clamper plate 1320, and therefore can reduce the manufacturing cost of chuck 1300 and the time manufacturing chuck 1300 and spend can be reduced.
Herein, if the ledge 1313 of chuck holder 1310 is inserted in plate vacuum hole 1321, so plate vacuum hole 1321 can be split up into the first plate vacuum hole 1321a and the second plate vacuum hole 1321b, as shown in Figure 14 B.Each in first plate vacuum hole 1321a and the second plate vacuum hole 1321b can be communicated with some the holder vacuum holes in described multiple holder vacuum hole 1311, and the first plate vacuum hole 1321a and the second plate vacuum hole 1321b all can be communicated with all described multiple holder vacuum holes 1311.
Clamper plate 1320 can be made up of metal material.
As shown in Figure 14 A and Figure 14 B, adhesive layer 1330 can be placed between the lower surface 1310b of chuck the holder 1310 and upper surface 1320a of clamper plate 1320 in addition, makes chuck holder 1310 and clamper plate 1320 can be coupled to each other.
Figure 17 A to Figure 17 E is the figure of the process describing manufacture chuck 1300 according to another embodiment of the present invention.Herein, be hereafter described to manufacturing the process comprising the chuck 1300 of the chuck holder 1310 with ledge 1313.
First, as shown in figure 17 a, previously prepared clamper plate 1320 is positioned on lower bolster 50.Plate vacuum hole molding part 51 projects upwards from the center of the upper surface of lower bolster 50, and can be formed in the core of plate vacuum hole molding part 51 for the ledge molded aperture 52 of the ledge 1313 of molded clip holder 1310.
Then, as shown in Figure 17 B, adhesive layer 1330 is formed by the upper surface 1320a that adhesive material is coated in clamper plate 1320.
In addition, as shown in fig. 17 c, the moulding material 1310A (namely elastomeric material) for molded clip holder 1310 is loaded onto lower bolster 50.
Subsequently, as shown in Figure 17 D, use cope match-plate pattern 60 pressure die prepared material 1310A thus form chuck holder 1310 according to an embodiment of the invention.Herein, can be coupled to each other via adhesive layer 1330 with the clamper plate 1320 be positioned at below chuck holder 1310 through molded chuck holder 1310.Multiple ledge 61 is formed on cope match-plate pattern 60, to form described multiple holder vacuum hole 1311 on chuck holder 1310.
Afterwards, as shown in Figure 17 E, lower bolster 50 and cope match-plate pattern 60 is removed to complete the manufacture of chuck 1300 according to an embodiment of the invention.Herein, when removing lower bolster 50, plate vacuum hole 1321a and 1321b can be formed in the space residing for first header board vacuum hole molding part 51, and the quantity of plate vacuum hole 1321a and 1321b is less than the quantity of holder vacuum hole 1311.
Figure 18 is the plan view of chuck 1400 according to another embodiment of the present invention, and Figure 19 is the cross sectional view of the chuck 1400 of line G-G ' intercepting along Figure 18.
With reference to Figure 18 and Figure 19, chuck 1400 comprises chuck holder 1410 and clamper plate 1420 according to an embodiment of the invention.
Chuck holder 1410 can comprise through chuck holder 1410 and for multiple holder vacuum holes 1411 of vacuum suction semiconductor die (not shown).Such as, holder vacuum hole 1411 can be formed as the rectangular tube being divided into multiple part, and can pass chuck holder 1410 from the upper surface 1410a of chuck holder 1410 to lower surface 1410b.But embodiments of the invention are not limited to this, that is, holder vacuum hole 1411 can be formed to have other various shape.
Chuck holder 1410 can comprise ledge 1413 further, and all described multiple holder vacuum holes 1411 are through described ledge 1413.
Clamper plate 1420 can not comprise plate vacuum hole.
In addition, clamper plate 1420 can comprise coupling aperture 1425 further, and the ledge 1413 of chuck holder 1410 is inserted in described coupling aperture 1425.
Ledge 1413 is inserted in the coupling aperture 1425 be formed in clamper plate 1420, and clamper plate 1420 can be coupled on chuck holder 1410 securely.
In the chuck 1400 with said structure, chuck holder 1410 only comprises holder vacuum hole 1411, and clamper plate 1420 does not comprise plate vacuum hole, and holder vacuum hole 1411 extends on the end portion of clamper plate 1420.Therefore, clamper plate 1420 can be applied to and has on the chuck holder 1410 of various structure according to an embodiment of the invention.Therefore, even if when the structural change of holder vacuum hole 1411, also without the need to changing the structure of clamper plate 1420.Therefore, the manufacturing cost of chuck 1400 can be reduced and the time manufacturing chuck 1400 and spend can be reduced.
Chuck holder 1410 can be made by producing the non-, conductive rubber of electrostatic, silicone or amido formate, and can be made up of material that is anlistatig and conduction.
Clamper plate 1420 can be made up of metal material.
Figure 20 is the decomposition diagram of chuck 1500 according to another embodiment of the present invention, Figure 21 is the cross sectional view of clamper plate 1520 in the chuck 1500 of Figure 20 and absorption rubber 1530, Figure 22 is the cross sectional view of the chuck 1500 of Figure 20, and Figure 23 is the cross sectional view of chuck 1500 according to another embodiment of the present invention.
With reference to Figure 20 to Figure 23, the chuck 1500 according to an embodiment of the invention for bond semiconductor nude film can comprise chuck holder 1510, clamper plate 1520 and absorption rubber 1530.
For the purpose of describing, when comparing with 1420 with 1410 and clamper plate 120,120A, 120B, 120C, 120D, 820,1320 with the chuck holder 110,810,1310 described in the embodiment above, chuck holder 1510 and clamper plate 1520 represent to have simple structure.But, embodiments of the invention are not limited to this, that is, chuck holder 1510 can be replaced by the one being selected from above-mentioned chuck holder 110,810,1310 and 1410, and clamper plate 1520 can be selected from above-mentioned clamper plate 120,120A, 120B, 120C, 120D, 820, the one of 1320 and 1420 replaces.
Chuck holder 1510 comprises the vacuum applying pipe 1512 given prominence to from the upper part of chuck holder 1510 and the coupling recess 1513 be formed at the lower surface of chuck holder 1510, and vacuum applies pipe 1512 and is connected to loading and transmits on the device of semiconductor die.
Holder vacuum hole 1511 for introducing vacuum from outside is formed at the inside that vacuum applies pipe 1512, and described holder vacuum hole 1511 is formed on the bottom of the coupling recess 1513 of chuck holder 1510.
Chuck holder 1510 can be configured to have magnetic force.In order to make chuck holder 1510 have magnetic force, chuck holder 1510 can be made up of magnetic material.In addition, at chuck holder 1510 internal build magnet 1501 to provide magnetic force to chuck holder 1510, and either type can be selected during manufacture chuck holder 1510.
Clamper plate 1520 is formed as dull and stereotyped and can be configured to be inserted in the coupling recess 1513 in the lower surface being formed at chuck holder 1510.The plate vacuum hole 1521 be communicated with the holder vacuum hole 1511 of chuck holder 1510 can be formed at the central part office of clamper plate 1520.
Clamper plate 1520 can be made up of metal material.Exactly, clamper plate 1520 can be made up of steel etc., has on the chuck holder 1510 of magnetic force to be attached to by magnetic force.Therefore, clamper plate 1520 in the coupling recess 1513 being inserted into chuck holder 1510 after closely can be contacted with chuck holder 1510 by magnetic force.
Adsorb rubber 1530 be formed as having the flat board of predetermined thickness and be coupled on the bottom surface of clamper plate 1520.The rubber vacuum hole 1531 be communicated with the plate vacuum hole 1521 of clamper plate 1520 is formed at the central part office of adsorbing rubber 1530.The diameter in rubber vacuum hole 1531 can be equal to or less than the diameter of plate vacuum hole 1521.
Absorption rubber 1530 can be made up of such as rubber or silicone elastomeric material.Therefore, when adsorbing rubber 1530 and being coupled on clamper plate 1520, the distortion of the absorption rubber 1530 caused due to clamper plate 1520 can be prevented and can keep adsorbing the flatness of rubber 1530.
Chuck 1500 can comprise the adhesive layer 1540 be placed between clamper plate 1520 and absorption rubber 1530 further.Adhesive layer 1540 makes clamper plate 1520 closely be coupled each other with absorption rubber 1530.Exactly, being coupled and can being realized by hot compression between clamper plate 1520 with absorption rubber 1530, and hot compression under high pressure can be carried out after carrying out following steps: to specify to obtain sequence stack absorption rubber 1530, adhesive layer 1540 and the clamper plate 1520 of hierarchy, and hierarchy is located in a mold, and subsequently heat is applied on the clamper plate 1520 of the topmost office being positioned at hierarchy.
During hot press method, the heat be applied on clamper plate 1520 is passed on adhesive layer 1540.Subsequently, the heat fusing adhesive layer 1540 through transmitting by the whole contact-making surface between clamper plate 1520 and absorption rubber 1530 is evenly distributed.Therefore, the adhesive layer 1540 of fusing can apply uniform bonding force to the whole contact-making surface of clamper plate 1520 and absorption rubber 1530, and clamper plate 1520 can closely be coupled each other with absorption rubber 1530.Therefore, can prevent from producing gap between clamper plate 1520 and absorption rubber 1530.
After this, be coupled in the state on clamper plate 1520 at absorption rubber 1530, clamper plate 1520 is coupled on the coupling recess 1513 of chuck holder 1510.Clamper plate 1520 is inserted in coupling recess 1513, and is closely contacted with chuck holder 1510 by the magnetic force of chuck holder 1510 subsequently.Therefore the flatness of adsorbing rubber 1530 can be kept.
In addition, be coupled in the state on chuck holder 1510 at clamper plate 1520 and absorption rubber 1530, the lower surface of absorption rubber 1530 can be given prominence to from the lower surface of chuck holder 1510.When clamper plate 1520 and the absorption rubber 1530 be coupled on clamper plate 1520 are coupled on chuck holder 1510, holder vacuum hole 1511, plate vacuum hole 1521 and rubber vacuum hole 1531 can communicate with each other in vertical direction.Therefore, although obviously do not illustrate in Figure 20 to Figure 23, the hole be communicated with plate vacuum hole 1521 and rubber vacuum hole 1531 can be formed in adhesive layer 1540.
As described above, in the process being made clamper plate 1520 coupled to each other with absorption rubber 1530 by hot compression, because the sticky characteristic of adhesive layer 1540 may produce bubble in adhesive layer 1540.These bubbles may cause the bonding force of adhesive layer 1540 to degenerate, and clamper plate 1520 and absorption rubber 1530 between coupling unit in may produce minimum gap.Therefore the flatness of absorption rubber 1530 may be reduced a little.
Therefore, chuck 1500 can comprise the multiple air discharge ducts 1522 in the lower surface being formed at clamper plate 1520, as shown in Figure 23.Described multiple air discharge duct 1522 can be formed as many straight lines or multiple cross in the lower surface of clamper plate 1520.In the coupling process of clamper plate 1520 with absorption rubber 1530, air discharge duct 1522 can be emitted on the bubble produced in adhesive layer 1540, and improves the bonding force of adhesive layer 1540 thus.
As described above, one or many person according to the embodiments of the present invention can be provided for the chuck of bond semiconductor nude film, described chuck comprises clamper plate, and described clamper plate can be applied on the chuck holder of the holder vacuum hole with various design.
According to the chuck for bond semiconductor nude film of one or more embodiment of the present invention, clamper plate is coupled via adhesive layer each other equably with absorption rubber, even if to prevent from producing gap between clamper plate and absorption rubber and the flatness that also can keep adsorbing rubber when chuck employs longer a period of time.And, when using the chuck being used for bond semiconductor nude film, greatly can improve the quality in the operating characteristics manufactured during semiconductor packages and semiconductor packages, and the life-span of chuck can be increased.
Should be understood that exemplary embodiment described herein should be considered to only have descriptive sense, but not for restriction object.Feature in each embodiment or the description of aspect should be considered to can be used for other similar characteristics in other embodiments or aspect usually.
Although describe one or more embodiment of the present invention with reference to graphic, but those of ordinary skill in the field should understand, when not departing from the spirit and scope of the present invention that above claims define, the various changes in form and details can be carried out wherein.
Claims (18)
1. a chuck, for bond semiconductor nude film, is characterized in that, described chuck comprises:
Chuck holder, described chuck holder comprises the multiple holder vacuum holes from the upper surface of described chuck holder to lower surface through described chuck holder; And
Clamper plate, described clamper plate is coupled on described chuck holder, and comprises at least one plate vacuum hole, and the quantity of described plate vacuum hole is less than the quantity of described multiple holder vacuum hole,
At least one plate vacuum hole wherein said is communicated with all described multiple holder vacuum holes.
2. chuck according to claim 1, is characterized in that, at least one plate vacuum hole described has the border of single closed-curve shape.
3. chuck according to claim 1, is characterized in that, described chuck holder comprises the first ledge further, described first ledge be arranged at least one plate vacuum hole described at least partially.
4. chuck according to claim 1, is characterized in that, comprises the first adhesive layer between lower surface and the upper surface of described clamper plate being placed in described chuck holder further.
5. chuck according to claim 1, it is characterized in that, at least one in described chuck holder and described clamper plate comprises shared vacuum section further, and described shared vacuum section is coupled in the state on described chuck holder the single channel served as being communicated with at least one plate vacuum hole described by all described multiple holder vacuum holes at described clamper plate.
6. chuck according to claim 5, is characterized in that, described shared vacuum section is formed as the recess in bottom it with at least one hole.
7. chuck according to claim 5, is characterized in that, described shared vacuum section has the border of single closed-curve shape.
8. chuck according to claim 7, it is characterized in that, described clamper plate comprises the multiple barriers in the border being arranged in described shared vacuum section further, and described multiple barrier gives prominence to towards described chuck holder the lower surface supporting described chuck holder from the virtual extension plane of the bottom surface of described shared vacuum section.
9. chuck according to claim 8, is characterized in that, described multiple barrier makes the border of at least one plate vacuum hole described at least one contacting end portions of described multiple barrier through arrangement.
10. chuck according to claim 8, is characterized in that, described multiple barrier makes through layout the border sharing vacuum section described at least one contacting end portions of described multiple barrier.
11. chucks according to claim 1, is characterized in that, described clamper plate is made up of metal material.
12. chucks according to claim 1, it is characterized in that, described clamper plate comprise further be formed at described clamper plate excircle on multiple coupling apertures, and described chuck holder comprises further towards outstanding multiple second ledges of described clamper plate, and described multiple second ledge will be coupled on described multiple coupling aperture of described clamper plate correspondingly.
13. chucks according to claim 1, is characterized in that, described chuck holder comprises coupling recess further, and described clamper plate is arranged in described coupling recess.
14. chucks according to claim 1, is characterized in that, comprise further:
Absorption rubber, described absorption rubber is placed on the side of described clamper plate; And
Second adhesive layer, described second adhesive layer is placed between described clamper plate and described absorption rubber, for make described clamper plate and described absorption rubber coupled to each other.
15. chucks according to claim 14, it is characterized in that, it is coupled to each other that described clamper plate and described absorption rubber pass through hot compression, and during described hot compression, described second adhesive layer fusing makes the bonding force between described clamper plate and described absorption rubber increase.
16. chucks according to claim 14, is characterized in that, comprise the multiple air discharge ducts in the surface being formed at described clamper plate further,
Wherein in described clamper plate and described absorption rubber process coupled to each other, described air discharge duct is emitted on the bubble produced in described second adhesive layer.
17. 1 kinds of chucks, for bond semiconductor nude film, is characterized in that, described chuck comprises:
Chuck holder, described chuck holder comprises at least one the holder vacuum hole through described chuck holder from upper surface to lower surface; And
Clamper plate, described clamper plate is coupled on described chuck holder, and does not comprise plate vacuum hole,
Wherein said chuck holder comprises ledge further, all at least one holder vacuum holes described are through described ledge, and described clamper plate comprises coupling aperture further, the described ledge of described chuck holder is inserted in described coupling aperture.
18. 1 kinds of chucks, for bond semiconductor nude film, is characterized in that, described chuck comprises:
Chuck holder, described chuck holder comprises at least one the holder vacuum hole through described chuck holder from upper surface to lower surface;
Clamper plate, described clamper plate is coupled on described chuck holder, and comprises at least one plate vacuum hole;
Absorption rubber, described absorption rubber is placed on the side of described clamper plate; And
Adhesive layer, described adhesive layer is placed between described clamper plate and described absorption rubber, for make described clamper plate and described absorption rubber coupled to each other.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0023702 | 2014-02-27 | ||
| KR1020140023702A KR101570764B1 (en) | 2014-02-27 | 2014-02-27 | Collet for boding semiconductor die |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104882403A true CN104882403A (en) | 2015-09-02 |
| CN104882403B CN104882403B (en) | 2018-01-23 |
Family
ID=53949843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410413623.1A Active CN104882403B (en) | 2014-02-27 | 2014-08-21 | For engaging the chuck of semiconductor die |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101570764B1 (en) |
| CN (1) | CN104882403B (en) |
| TW (1) | TW201533878A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020034143A1 (en) * | 2018-08-16 | 2020-02-20 | 深圳华大智造科技有限公司 | Handle device, positioning device, loading device and gene sequencer |
| EP3926695A4 (en) * | 2019-02-12 | 2022-10-26 | Shin-Etsu Chemical Co., Ltd. | Microstructure transfer device, stamp head unit, stamp component for microstructure transfer, and method for transferring microstructure integrated component |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101749684B1 (en) * | 2017-02-13 | 2017-06-23 | 주식회사 페코텍 | Method of preparing magnetic collet |
| KR101870289B1 (en) | 2017-06-26 | 2018-06-22 | 주식회사 기주테크 | Semiconductor die bonding collet |
| KR102498037B1 (en) * | 2018-04-20 | 2023-02-10 | (주)포인트엔지니어링 | Micro led adsorption body |
| CN110349899A (en) | 2018-04-06 | 2019-10-18 | 普因特工程有限公司 | Micro- light emitting diode adsorbent |
| KR20220046970A (en) * | 2020-10-08 | 2022-04-15 | 에스케이하이닉스 주식회사 | Collet Structure and Semiconductor Fabricating Apparatus Including The Same |
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| CN1802735A (en) * | 2003-09-18 | 2006-07-12 | Nec机械股份有限公司 | Collet, chip bonder and chip pick-up method |
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| KR100360467B1 (en) * | 1999-12-30 | 2002-11-08 | 앰코 테크놀로지 코리아 주식회사 | Device and method for attaching chip |
| KR100769111B1 (en) * | 2006-03-13 | 2007-10-22 | 캐논 머시너리 가부시키가이샤 | Collet, die bonder, and chip pick-up method |
| KR100833597B1 (en) | 2007-03-15 | 2008-05-30 | 주식회사 하이닉스반도체 | Bonding head and semiconductor chip attaching apparatus having the bonding head |
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- 2014-02-27 KR KR1020140023702A patent/KR101570764B1/en active IP Right Grant
- 2014-08-21 CN CN201410413623.1A patent/CN104882403B/en active Active
- 2014-08-22 TW TW103128889A patent/TW201533878A/en unknown
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| CN1802735A (en) * | 2003-09-18 | 2006-07-12 | Nec机械股份有限公司 | Collet, chip bonder and chip pick-up method |
| US20050221582A1 (en) * | 2003-12-31 | 2005-10-06 | Chippac, Inc. | Bonding tool for mounting semiconductor chips |
| CN102881622A (en) * | 2012-01-11 | 2013-01-16 | 日月光半导体制造股份有限公司 | Heater tip used for flip chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2020034143A1 (en) * | 2018-08-16 | 2020-02-20 | 深圳华大智造科技有限公司 | Handle device, positioning device, loading device and gene sequencer |
| EP3926695A4 (en) * | 2019-02-12 | 2022-10-26 | Shin-Etsu Chemical Co., Ltd. | Microstructure transfer device, stamp head unit, stamp component for microstructure transfer, and method for transferring microstructure integrated component |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104882403B (en) | 2018-01-23 |
| KR20150101867A (en) | 2015-09-04 |
| KR101570764B1 (en) | 2015-11-20 |
| TW201533878A (en) | 2015-09-01 |
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