CN104882402A - Substrate carrying device - Google Patents
Substrate carrying device Download PDFInfo
- Publication number
- CN104882402A CN104882402A CN201410070432.XA CN201410070432A CN104882402A CN 104882402 A CN104882402 A CN 104882402A CN 201410070432 A CN201410070432 A CN 201410070432A CN 104882402 A CN104882402 A CN 104882402A
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- Prior art keywords
- substrate
- adapter
- wafer
- supporting platform
- vacuum
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a substrate carrying device which is characterized by comprising the components of a substrate table which is used for carrying a substrate; a vacuum groove which is arranged in the substrate table and is internally provided with a plurality of vacuum channel holes for attracting the substrate; a rotating table which is arranged below the substrate table and is used for driving the substrate table to drive the substrate to rotate; an adapter which comprises an adapter upper part in the substrate table and an adapter lower part in the rotating table; a vacuum channel which is arranged in the adapter, wherein a vacuum source is connected with the vacuum groove through the vacuum channel; a bearing and a bearing seat which are arranged in the rotating table. The outer ring of the bearing is fixed with the substrate table through the bearing seat. The inner ring of the bearing is arranged outside the adapter. The substrate table rotates relative to the adapter through the bearing, so that when the substrate table rotates relative to the adapter, the adapter does not rotate and furthermore torsion of the vacuum channel is prevented.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, especially, relate to a kind of bogey of compatible different specification size substrate.
Background technology
In semiconductor fabrication process, the thickness to the substrate such as silicon chip, sheet glass, grand defect, microdefect etc. is usually needed to detect.Corresponding just has the checkout equipments such as film thickness measuring, grand defects detection and microdefect detection, and no matter be which kind of checkout equipment, all need the carrier for fixed clamp substrate, above-mentioned carrier is called wafer-supporting platform.
Some checkout equipments, as the equipment such as scatterometry, grand defects detection, need to rotate substrate, and require the substrate of compatible multiple different specification size in testing process, and substrate diameter size conventional at present mainly contains 200mm and 300mm.Therefore, how fast, conveniently, reliably in the checkout equipment with substrate rotary motion, switch between the substrate of different specification size, be the problem being necessary very much to solve.
In prior art, US Patent No. 5797317 proposes the wafer-supporting platform adopting the compatible substrates of different size of vacuum suction, by driving adsorbing mechanism to carry out X-Y motion, thus realizes clamping the substrate of different size specification.Its shortcoming needs to add two driving mechanisms and drive motors, increases great amount of cost, and a substrate edge region clamping, clamping deformation accuracy is difficult to ensure; Another shortcoming is, the tracheae of driving mechanism, the cabling of cable are set forth, if when wafer-supporting platform needs to rotate, certainly will produce be wound around and reverse tracheae and cable.
US Patent No. 6164633 proposes and adopts different independent vacuum passages to carry out vacuum suction to different regions, thus the substrate of compatible different specifications.Obviously this mode is only applicable to the occasion not with rotary motion, if substrate needs to be rotated, certainly will produce be wound around and reverse pipeline.
US Patent No. 6954269B2, title is " Ring like suction disc of compatible 200mm and 300mm silicon chip ", but patent is to how compatible two kinds of different size substrates are cooked structure elaboration, one may be: being that different suckers joined by the substrate of two kinds of specifications, when switching, being changed by whole wafer-supporting platform, as everyone knows, the face shape of sucker requires it is all very high, and processing charges is expensive, and this adds great amount of cost undoubtedly and seriously lowers efficiency.
Summary of the invention
The object of the invention is, in the checkout equipment with substrate rotary motion, a kind of bearing structure of compatible different specification size substrate is provided, it can realize Automated condtrol with fairly simple structure, reach quick switching, enable equipment detect the substrate of different specification size, reduce costs, raise the efficiency.
The present invention proposes a kind of substrate bearing device, it is characterized in that, comprising: wafer-supporting platform, for carrying substrates; Vacuum channels, being positioned at described wafer-supporting platform inner, having multiple vacuum channel orifices, for adsorbing described substrate in described vacuum channels; Rotating platform, is positioned at below wafer-supporting platform, drives described substrate to rotate for driving described wafer-supporting platform; Adapter, described adapter comprises the adapter top being positioned at wafer-supporting platform, and is positioned at the adapter bottom of rotating platform inside; Vacuum passage, be positioned at described adapter inner, vacuum source is connected with vacuum channels by described vacuum passage; Bearing and bearing pedestal, be positioned at rotating platform inside, the outer ring of described bearing is fixed by described bearing pedestal and wafer-supporting platform, the inner ring of described bearing is installed on outside adapter, described wafer-supporting platform is rotated relative to described adapter by described bearing, when described wafer-supporting platform is rotated relative to described adapter, described adapter does not rotate and described vacuum passage does not twist.
Wherein, described rotating platform is more than or equal to 360 ° relative to the angle that adapter rotates.
Wherein, described vacuum channels is a series of concentric ring-shaped grooves, and vacuum channel orifices is inner by radial direction through hole formation connection at described wafer-supporting platform.
More preferably, described substrate bearing device also comprises actuator, is fixed on below wafer-supporting platform, and described actuator is less than the radius of max vacuum groove from the distance at wafer-supporting platform center; Annular groove, is positioned at the outside on described adapter top; Adapter pressure fluid channel, is positioned at described adapter inner, and fluid source to be connected with described annular groove by adapter pressure fluid channel and to fill fluid in described annular groove; Wafer-supporting platform pressure fluid channel, is positioned at described wafer-supporting platform inner, and described annular groove is connected with described actuator by wafer-supporting platform pressure fluid channel; Wherein, described fluid source controls described actuator get through or cut off described radial direction through hole by whether filling fluid.
Wherein, the both sides of described annular groove also comprise o-ring groove, described o-ring groove for installing sealing ring, to seal the fluid in annular groove.
Wherein, described adapter pressure fluid channel also comprises vertical passage and radial tubes, and described vertical passage one is connected with fluid source, other end is connected with described annular groove by described radial tubes.
Wherein, also comprise the keyset be positioned at below described rotating platform, the bottom of described adapter is arranged on described keyset.
Wherein, described rotating platform inside also comprises two pipe joints, and it is inner and extend to described keyset outside that described vacuum passage and adapter pressure fluid channel are through to described keyset respectively by two pipe joints from described adapter.
Wherein, described fluid source controls whether to fill fluid by electromagnetically operated valve.
Wherein, described fluid is gas or liquid.
Wherein, also comprise sealing gasket, for preventing the mounting interface place leakage current body of described actuator.
The using method of above-mentioned substrate bearing device, comprises the steps:
A) system is given an order upper substrate, and described substrate comprises the first radius substrate and the second radius substrate, and described first radius is less than described second radius, and described actuator is the first radius apart from the distance at described wafer-supporting platform center;
B) manipulator captures the substrate of the radius size of system requirements and is sent to wafer-supporting platform, starts vacuum source;
C) if described substrate is the first radius substrate, described fluid source does not fill fluid, and described actuator upwards moves and cuts off described radial direction through hole, and described wafer-supporting platform adsorbs the substrate of the first specification and positions;
D) if described substrate is the second radius substrate, described fluid source fills fluid, and pressure fluid promotes described actuator and moves down and get through described radial direction through hole, and described wafer-supporting platform adsorbs the substrate of the second specification and positions.
The bogey single device of the compatible different specification size substrate that the present invention proposes can the substrate of compatible different specification size, is realized the switching automatically controlled between different specification size substrate, improve production efficiency by electromagnetically operated valve.Z-direction rotating platform Rz can do and be greater than 360 ° of rotations simultaneously, can effectively avoid producing pipeline being wound around and reversing.
Accompanying drawing explanation
Can be further understood by following detailed Description Of The Invention and institute's accompanying drawings about the advantages and spirit of the present invention.
Fig. 1 is substrate checkout equipment system configuration schematic diagram;
Fig. 2 is wafer-supporting platform internal mechanism cutaway view of the present invention;
Fig. 3 is that adapter of the present invention controls source of the gas passage enlarged drawing;
Fig. 4 is adapter structure schematic diagram of the present invention;
Fig. 5 is wafer-supporting platform surface texture schematic diagram of the present invention;
Fig. 6 is wafer-supporting platform fundamental diagram of the present invention;
Fig. 7 is wafer-supporting platform workflow diagram of the present invention.
Embodiment
Specific embodiments of the invention are described in detail below in conjunction with accompanying drawing.
Embodiment 1:
Fig. 1 is substrate checkout equipment system configuration schematic diagram, and as shown in Figure 1, gage outfit 106 is installed in mechanical support 107, the structure that mechanical support 107 can have gantry or single arm support etc. different.Wafer-supporting platform 105 is fixed on Z axis rotating platform Rz platform 104, and between Rz platform 104 and gage outfit 106.Rz platform 104 is fixed on keyset 103, and can there be X-Y-Z keyset 103 bottom to certain in adjustment platform 102 or whole.The version of mechanical support 107 and the quantity of X-Y-Z platform 102 do not affect the enforcement of this programme.
As shown in Figures 2 and 3, two tracheaes 208 are connected with pipe joint 207 through keyset 103 the internal mechanism cutaway view of wafer-supporting platform 105 of the present invention, and pipe joint 207 connects with adapter 204; Bearing 201 outer ring is installed on bearing pedestal 202, and inner ring is installed on adapter 204, and bearing pedestal 202 is fixed with wafer-supporting platform 105, and adapter 204 is fixed with keyset 103; Sealing ring 203, for sealing pressure air passage, prevents gas leakage; Cylinder 205 is fixed on wafer-supporting platform 105, and sealing gasket 206 leaks gas for preventing cylinder mounting interface place.
When substrate needs to rotate, wafer-supporting platform 105 drives rotation by Rz platform 104, wafer-supporting platform 105 and bearing pedestal 202 will rotate relative to adapter 204, adapter 204 can not rotate, thus pipe joint on adapter is connected in and tracheae all can not rotate, the Rz platform anglec of rotation can be arbitrary value, and also can not produce winding to pipeline and reverse when being greater than 360 °.
Adapter 204 internal structure as shown in Figure 4, forms primarily of vacuum passage 301, pressure air passage 302, radial hole 303, cannelure 304 and o-ring groove 305.Radial hole 303 exit has cannelure 304, when wafer-supporting platform rotates, ensure all the time to be filled with pressure air in cannelure, therefore, can ensure no matter wafer-supporting platform rotates how many angles, the pressure air passage in wafer-supporting platform all the time with the pressure air channel connection in adapter.O-ring groove 305 designs two sides in cannelure 304, for installing sealing ring 203, seals pressure air.
As shown in Figure 5, wafer-supporting platform 105 upper surface has a series of annular concentric groove to wafer-supporting platform surface texture of the present invention, and trench interiors has vacuum channel orifices, and incorporated by reference to Fig. 2, vacuum channel orifices is formed by radial direction through hole in wafer-supporting platform 105 inside and is communicated with.Vacuum passage 301 pairs of wafer-supporting platform 105 upper surface (i.e. sucker) pump drainage air produce negative-pressure adsorption substrate, control the action of source of the gas passage by control cylinder, realize " the leading to ", " breaking " to different-diameter region, thus pump drainage vacuum is carried out to the different-diameter region of wafer-supporting platform 105 upper surface (i.e. sucker), reach the object of absorption different-diameter substrate.
Wafer-supporting platform operation principle of the present invention as shown in Figure 6, wafer-supporting platform measurement procedure as shown in Figure 7, incorporated by reference to Fig. 6 and 7, system give an order carry out upper slice measure, the specification substrate that manipulator (the present invention is not shown) grasping system requires also is sent to wafer-supporting platform, simultaneously when electromagnetic switch valve 209 is " breaking ", the spherical bar head of cylinder 205 upwards cuts off 200mm with exterior domain vacuum passage, and wafer-supporting platform 105 is for adsorbing clamping 200mm diameter substrate and positioning; When electromagnetic switch valve 209 is "ON", pressure air promotes cylinder rod head and moves down, and beyond 200mm, vacuum passage is opened, and wafer-supporting platform is for adsorbing clamping 300mm diameter substrate and positioning, then substrate checkout equipment system is measured, and measures complete retrogressing sheet.Visible, the control of electromagnetic switch valve and the action of cylinder are synchronously carried out with upper slice, namely when manipulator capture system requirements specification substrate and be sent to wafer-supporting platform during this period of time in, system has had time enough carry out the switching of electromagnetically operated valve and complete the action of cylinder, and the productive rate of equipment is completely unaffected.
Embodiment 2:
Alternative, the cylinder 205 in Fig. 2 also can substitute with hydraulic cylinder, and particularly, except changing into except fluid supply by source of the gas, just the same when its structure and use cylinder, the medium just performed is different, has changed liquid into by gas.
Just preferred embodiment of the present invention described in this specification, above embodiment is only in order to illustrate technical scheme of the present invention but not limitation of the present invention.All those skilled in the art, all should be within the scope of the present invention under this invention's idea by the available technical scheme of logical analysis, reasoning, or a limited experiment.
Claims (12)
1. a substrate bearing device, is characterized in that, comprising:
Wafer-supporting platform, for carrying substrates;
Vacuum channels, being positioned at described wafer-supporting platform inner, having multiple vacuum channel orifices, for adsorbing described substrate in described vacuum channels;
Rotating platform, is positioned at below wafer-supporting platform, drives described substrate to rotate for driving described wafer-supporting platform;
Adapter, described adapter comprises the adapter top being positioned at wafer-supporting platform, and is positioned at rotating platform inside
Adapter bottom;
Vacuum passage, be positioned at described adapter inner, vacuum source is connected with vacuum channels by described vacuum passage;
Bearing and bearing pedestal, be positioned at rotating platform inside, the outer ring of described bearing is fixed by described bearing pedestal and wafer-supporting platform, the inner ring of described bearing is installed on outside adapter, described wafer-supporting platform is rotated relative to described adapter by described bearing, when described wafer-supporting platform is rotated relative to described adapter, described adapter does not rotate and described vacuum passage does not twist.
2. substrate bearing device as claimed in claim 1, is characterized in that: described rotating platform is more than or equal to 360 ° relative to the angle that adapter rotates.
3. substrate bearing device as claimed in claim 1, is characterized in that: described vacuum channels is a series of concentric ring-shaped grooves, and vacuum channel orifices is inner by radial direction through hole formation connection at described wafer-supporting platform.
4. substrate bearing device as claimed in claim 1, is characterized in that: also comprise
Actuator, is fixed on below wafer-supporting platform, and described actuator is less than the radius of max vacuum groove from the distance at wafer-supporting platform center;
Annular groove, is positioned at the outside on described adapter top;
Adapter pressure fluid channel, is positioned at described adapter inner, and fluid source to be connected with described annular groove by adapter pressure fluid channel and to fill fluid in described annular groove;
Wafer-supporting platform pressure fluid channel, is positioned at described wafer-supporting platform inner, and described annular groove is connected with described actuator by wafer-supporting platform pressure fluid channel;
Wherein, described fluid source controls described actuator get through or cut off described radial direction through hole by whether filling fluid.
5. substrate bearing device as claimed in claim 1, is characterized in that: the both sides of described annular groove also comprise o-ring groove, described o-ring groove for installing sealing ring, to seal the fluid in annular groove.
6. substrate bearing device as claimed in claim 1, is characterized in that: described adapter pressure fluid channel also comprises vertical passage and radial tubes, described vertical passage one is connected with fluid source, other end is connected with described annular groove by described radial tubes.
7. substrate bearing device as claimed in claim 1, it is characterized in that: also comprise the keyset be positioned at below described rotating platform, the bottom of described adapter is arranged on described keyset.
8. substrate bearing device as claimed in claim 7, it is characterized in that: described rotating platform inside also comprises two pipe joints, it is inner and extend to described keyset outside that described vacuum passage and adapter pressure fluid channel are through to described keyset respectively by two pipe joints from described adapter.
9. substrate bearing device as claimed in claim 4, is characterized in that: described fluid source controls whether to fill fluid by electromagnetically operated valve.
10. substrate bearing device as claimed in claim 4, is characterized in that: described fluid is gas or liquid.
11. substrate bearing devices as claimed in claim 4, is characterized in that: also comprise sealing gasket, for preventing the mounting interface place leakage current body of described actuator.
The using method of the 12. substrate bearing devices using one of claim 4-11 described, comprises the steps:
A) system is given an order upper substrate, and described substrate comprises the first radius substrate and the second radius substrate, and described first radius is less than described second radius, and described actuator is the first radius apart from the distance at described wafer-supporting platform center;
B) manipulator captures the substrate of the radius size of system requirements and is sent to wafer-supporting platform, starts vacuum source;
C) if described substrate is the first radius substrate, described fluid source does not fill fluid, and described actuator upwards moves and cuts off described radial direction through hole, and described wafer-supporting platform adsorbs the substrate of the first specification and positions;
D) if described substrate is the second radius substrate, described fluid source fills fluid, and pressure fluid promotes described actuator and moves down and get through described radial direction through hole, and described wafer-supporting platform adsorbs the substrate of the second specification and positions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410070432.XA CN104882402B (en) | 2014-02-28 | 2014-02-28 | A kind of substrate bearing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410070432.XA CN104882402B (en) | 2014-02-28 | 2014-02-28 | A kind of substrate bearing device |
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| Publication Number | Publication Date |
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| CN104882402A true CN104882402A (en) | 2015-09-02 |
| CN104882402B CN104882402B (en) | 2018-03-13 |
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| CN201410070432.XA Active CN104882402B (en) | 2014-02-28 | 2014-02-28 | A kind of substrate bearing device |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428296A (en) * | 2015-11-30 | 2016-03-23 | 北京中电科电子装备有限公司 | Adsorption apparatus |
| CN106181766A (en) * | 2016-08-29 | 2016-12-07 | 杭州士兰集成电路有限公司 | Location structure and silicon wafer processing equipment |
| CN107363575A (en) * | 2017-08-16 | 2017-11-21 | 广东长盈精密技术有限公司 | Fixture and process equipment |
| CN108217166A (en) * | 2018-01-15 | 2018-06-29 | 京东方科技集团股份有限公司 | A kind of UV curings transfer approach, system and rotary machine |
| CN114179046A (en) * | 2021-11-30 | 2022-03-15 | 深圳市华腾半导体设备有限公司 | Electric conduction workbench capable of realizing free rotation |
| CN115070615A (en) * | 2022-06-29 | 2022-09-20 | 中国航发动力股份有限公司 | Vacuum chuck device and auxiliary processing method thereof |
| CN115431169A (en) * | 2022-08-24 | 2022-12-06 | 中国电子科技集团公司第十三研究所 | Vacuum connection conversion device, slide polishing method and polishing machine |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| EP4447099A1 (en) * | 2023-04-13 | 2024-10-16 | Scientech Corporation | Wafer transfer device and wafer transfer method of semiconductor manufacturing process |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105428296A (en) * | 2015-11-30 | 2016-03-23 | 北京中电科电子装备有限公司 | Adsorption apparatus |
| CN105428296B (en) * | 2015-11-30 | 2018-06-01 | 北京中电科电子装备有限公司 | A kind of adsorbent equipment |
| CN106181766A (en) * | 2016-08-29 | 2016-12-07 | 杭州士兰集成电路有限公司 | Location structure and silicon wafer processing equipment |
| CN106181766B (en) * | 2016-08-29 | 2018-12-25 | 杭州士兰集成电路有限公司 | Location structure and silicon wafer processing equipment |
| CN107363575A (en) * | 2017-08-16 | 2017-11-21 | 广东长盈精密技术有限公司 | Fixture and process equipment |
| CN108217166A (en) * | 2018-01-15 | 2018-06-29 | 京东方科技集团股份有限公司 | A kind of UV curings transfer approach, system and rotary machine |
| US10946634B2 (en) | 2018-01-15 | 2021-03-16 | Boe Technology Group Co., Ltd. | Transfer device, curing system and curing method |
| CN114179046A (en) * | 2021-11-30 | 2022-03-15 | 深圳市华腾半导体设备有限公司 | Electric conduction workbench capable of realizing free rotation |
| CN115070615A (en) * | 2022-06-29 | 2022-09-20 | 中国航发动力股份有限公司 | Vacuum chuck device and auxiliary processing method thereof |
| CN115431169A (en) * | 2022-08-24 | 2022-12-06 | 中国电子科技集团公司第十三研究所 | Vacuum connection conversion device, slide polishing method and polishing machine |
| CN115431169B (en) * | 2022-08-24 | 2023-09-01 | 中国电子科技集团公司第十三研究所 | Vacuum connection conversion device, slide polishing method and polishing machine |
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Address after: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Applicant after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Applicant before: Shanghai Micro Electronics Equipment Co., Ltd. |
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