CN104849515A - 检查用触头和具备其的检查夹具及检查用触头的制造方法 - Google Patents
检查用触头和具备其的检查夹具及检查用触头的制造方法 Download PDFInfo
- Publication number
- CN104849515A CN104849515A CN201510072846.0A CN201510072846A CN104849515A CN 104849515 A CN104849515 A CN 104849515A CN 201510072846 A CN201510072846 A CN 201510072846A CN 104849515 A CN104849515 A CN 104849515A
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- CN
- China
- Prior art keywords
- inspection
- contact
- checkpoint
- diameter
- mentioned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 title claims abstract description 121
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 24
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims description 23
- 238000000576 coating method Methods 0.000 claims description 23
- 238000012360 testing method Methods 0.000 claims description 19
- 238000000227 grinding Methods 0.000 claims description 12
- 238000009413 insulation Methods 0.000 abstract description 12
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- 230000002950 deficient Effects 0.000 description 11
- 230000000694 effects Effects 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 4
- 230000004323 axial length Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910000997 High-speed steel Inorganic materials 0.000 description 1
- 230000018199 S phase Effects 0.000 description 1
- 230000008485 antagonism Effects 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-025511 | 2014-02-13 | ||
| JP2014025511A JP2015152391A (ja) | 2014-02-13 | 2014-02-13 | 検査用接触子及びそれを備えた検査治具、並びに検査用接触子の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104849515A true CN104849515A (zh) | 2015-08-19 |
Family
ID=53849309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510072846.0A Pending CN104849515A (zh) | 2014-02-13 | 2015-02-11 | 检查用触头和具备其的检查夹具及检查用触头的制造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2015152391A (ja) |
| KR (1) | KR20150095570A (ja) |
| CN (1) | CN104849515A (ja) |
| TW (1) | TWI640781B (ja) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05273237A (ja) * | 1992-03-26 | 1993-10-22 | Tokyo Electron Yamanashi Kk | プローブカード |
| JPH06273484A (ja) * | 1993-03-18 | 1994-09-30 | I C T:Kk | 半導体素子の検査装置 |
| JPH0854447A (ja) * | 1994-04-15 | 1996-02-27 | Schlumberger Technol Inc | 最適プローブ点配置 |
| JP2008196905A (ja) * | 2007-02-09 | 2008-08-28 | Totoku Electric Co Ltd | コンタクトプローブ、その使用方法及びその製造方法 |
| WO2009099183A1 (ja) * | 2008-02-06 | 2009-08-13 | Kabushiki Kaisha Toshiba | プローブ針およびその製造方法 |
| JP2011038831A (ja) * | 2009-08-07 | 2011-02-24 | Dainippon Printing Co Ltd | 基板検査用治具および基板検査方法 |
| CN202599993U (zh) * | 2012-05-25 | 2012-12-12 | 大陆泰密克汽车系统（上海）有限公司 | 用于印刷电路板测试夹具的定位针及印刷电路板测试夹具 |
| CN103348255A (zh) * | 2011-02-10 | 2013-10-09 | 日本电产理德株式会社 | 检查工具 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4901013A (en) * | 1988-08-19 | 1990-02-13 | American Telephone And Telegraph Company, At&T Bell Laboratories | Apparatus having a buckling beam probe assembly |
| JPH09274054A (ja) * | 1996-04-08 | 1997-10-21 | Furukawa Electric Co Ltd:The | プローバー |
| JPH10300781A (ja) * | 1997-04-22 | 1998-11-13 | Toshiba Corp | 半導体試験方法及びこれに使用するプローブカード |
| JP2001203280A (ja) * | 2000-01-19 | 2001-07-27 | Nec Corp | 不揮発性メモリ構造及びその製造方法 |
| JP3690800B2 (ja) * | 2004-11-17 | 2005-08-31 | 株式会社コーヨーテクノス | 検査冶具 |
| TWM451544U (zh) * | 2011-12-08 | 2013-04-21 | Mpi Corp | 探針測試裝置 |
-
2014
- 2014-02-13 JP JP2014025511A patent/JP2015152391A/ja active Pending
-
2015
- 2015-02-03 KR KR1020150016524A patent/KR20150095570A/ko not_active Application Discontinuation
- 2015-02-05 TW TW104103813A patent/TWI640781B/zh active
- 2015-02-11 CN CN201510072846.0A patent/CN104849515A/zh active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05273237A (ja) * | 1992-03-26 | 1993-10-22 | Tokyo Electron Yamanashi Kk | プローブカード |
| JPH06273484A (ja) * | 1993-03-18 | 1994-09-30 | I C T:Kk | 半導体素子の検査装置 |
| JPH0854447A (ja) * | 1994-04-15 | 1996-02-27 | Schlumberger Technol Inc | 最適プローブ点配置 |
| JP2008196905A (ja) * | 2007-02-09 | 2008-08-28 | Totoku Electric Co Ltd | コンタクトプローブ、その使用方法及びその製造方法 |
| WO2009099183A1 (ja) * | 2008-02-06 | 2009-08-13 | Kabushiki Kaisha Toshiba | プローブ針およびその製造方法 |
| JP2011038831A (ja) * | 2009-08-07 | 2011-02-24 | Dainippon Printing Co Ltd | 基板検査用治具および基板検査方法 |
| CN103348255A (zh) * | 2011-02-10 | 2013-10-09 | 日本电产理德株式会社 | 检查工具 |
| CN202599993U (zh) * | 2012-05-25 | 2012-12-12 | 大陆泰密克汽车系统（上海）有限公司 | 用于印刷电路板测试夹具的定位针及印刷电路板测试夹具 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201531711A (zh) | 2015-08-16 |
| JP2015152391A (ja) | 2015-08-24 |
| TWI640781B (zh) | 2018-11-11 |
| KR20150095570A (ko) | 2015-08-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150819 |