CN104821301B - 散热板和半导体装置 - Google Patents

散热板和半导体装置 Download PDF

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Publication number
CN104821301B
CN104821301B CN201410714866.9A CN201410714866A CN104821301B CN 104821301 B CN104821301 B CN 104821301B CN 201410714866 A CN201410714866 A CN 201410714866A CN 104821301 B CN104821301 B CN 104821301B
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China
Prior art keywords
opening
plate
wall
plate portion
frame
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CN201410714866.9A
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English (en)
Chinese (zh)
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CN104821301A (zh
Inventor
米持雅弘
竹内今朝幸
根来修司
关雅文
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Shinko Electric Co Ltd
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Shinko Electric Co Ltd
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Publication of CN104821301A publication Critical patent/CN104821301A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H10W70/027—Mechanical treatments, e.g. deforming, punching or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Resistance Heating (AREA)
CN201410714866.9A 2014-01-30 2014-12-01 散热板和半导体装置 Active CN104821301B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-015834 2014-01-30
JP2014015834A JP6190732B2 (ja) 2014-01-30 2014-01-30 放熱板及び半導体装置

Publications (2)

Publication Number Publication Date
CN104821301A CN104821301A (zh) 2015-08-05
CN104821301B true CN104821301B (zh) 2018-09-04

Family

ID=53679722

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410714866.9A Active CN104821301B (zh) 2014-01-30 2014-12-01 散热板和半导体装置

Country Status (3)

Country Link
US (1) US9184106B2 (https=)
JP (1) JP6190732B2 (https=)
CN (1) CN104821301B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106486430B (zh) * 2015-08-28 2019-01-11 比亚迪股份有限公司 Igbt用散热底板及其制造方法
WO2018123382A1 (ja) * 2016-12-28 2018-07-05 株式会社村田製作所 回路モジュール
CN108630636B (zh) * 2017-03-24 2022-01-14 德昌电机(深圳)有限公司 Mos器件安装结构、控制器及电动助力转向系统
CN114883278A (zh) * 2022-04-27 2022-08-09 超聚变数字技术有限公司 电子设备、集成电路及半导体器件
JP2024130953A (ja) * 2023-03-15 2024-09-30 株式会社東芝 半導体装置およびその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6580611B1 (en) * 2001-12-21 2003-06-17 Intel Corporation Dual-sided heat removal system
CN102543913A (zh) * 2010-10-29 2012-07-04 新光电气工业株式会社 布线衬底、电子装置和制造布线衬底的方法
CN102693963A (zh) * 2011-03-25 2012-09-26 富士通半导体股份有限公司 半导体器件及其制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3220105B2 (ja) * 1998-02-25 2001-10-22 株式会社鈴木 半導体装置用ヒートスプレッダと半導体装置用パッケージ
JP2005034857A (ja) * 2003-07-17 2005-02-10 Aisin Seiki Co Ltd カシメ部材およびカシメ方法
JP2007012928A (ja) * 2005-06-30 2007-01-18 Allied Material Corp 放熱基板とそれを備えた半導体装置
JP4788705B2 (ja) * 2007-11-14 2011-10-05 トヨタ自動車株式会社 リフタのかしめ構造
JP5271886B2 (ja) * 2009-12-08 2013-08-21 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6580611B1 (en) * 2001-12-21 2003-06-17 Intel Corporation Dual-sided heat removal system
CN102543913A (zh) * 2010-10-29 2012-07-04 新光电气工业株式会社 布线衬底、电子装置和制造布线衬底的方法
CN102693963A (zh) * 2011-03-25 2012-09-26 富士通半导体股份有限公司 半导体器件及其制造方法

Also Published As

Publication number Publication date
JP2015142108A (ja) 2015-08-03
JP6190732B2 (ja) 2017-08-30
CN104821301A (zh) 2015-08-05
US20150214131A1 (en) 2015-07-30
US9184106B2 (en) 2015-11-10

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