CN104812920B - 溅射靶用铜合金制热轧板及溅射靶 - Google Patents

溅射靶用铜合金制热轧板及溅射靶 Download PDF

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Publication number
CN104812920B
CN104812920B CN201380061284.9A CN201380061284A CN104812920B CN 104812920 B CN104812920 B CN 104812920B CN 201380061284 A CN201380061284 A CN 201380061284A CN 104812920 B CN104812920 B CN 104812920B
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CN
China
Prior art keywords
hot
sputtering
atomic
copper alloy
sputtering target
Prior art date
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Active
Application number
CN201380061284.9A
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English (en)
Chinese (zh)
Other versions
CN104812920A (zh
Inventor
大久保清之
小出正登
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of CN104812920A publication Critical patent/CN104812920A/zh
Application granted granted Critical
Publication of CN104812920B publication Critical patent/CN104812920B/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H01J37/3429—Plural materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
CN201380061284.9A 2012-12-28 2013-12-03 溅射靶用铜合金制热轧板及溅射靶 Active CN104812920B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-288705 2012-12-28
JP2012288705A JP5842806B2 (ja) 2012-12-28 2012-12-28 スパッタリングターゲット用銅合金製熱間圧延板、およびスパッタリングターゲット
PCT/JP2013/082439 WO2014103626A1 (ja) 2012-12-28 2013-12-03 スパッタリングターゲット用銅合金製熱間圧延板、およびスパッタリングターゲット

Publications (2)

Publication Number Publication Date
CN104812920A CN104812920A (zh) 2015-07-29
CN104812920B true CN104812920B (zh) 2016-11-02

Family

ID=51020720

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380061284.9A Active CN104812920B (zh) 2012-12-28 2013-12-03 溅射靶用铜合金制热轧板及溅射靶

Country Status (7)

Country Link
US (1) US9437405B2 (enExample)
JP (1) JP5842806B2 (enExample)
KR (1) KR101644283B1 (enExample)
CN (1) CN104812920B (enExample)
HK (1) HK1209802A1 (enExample)
TW (1) TWI545210B (enExample)
WO (1) WO2014103626A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6274026B2 (ja) 2013-07-31 2018-02-07 三菱マテリアル株式会社 銅合金スパッタリングターゲット及び銅合金スパッタリングターゲットの製造方法
JP7188480B2 (ja) * 2021-03-02 2022-12-13 三菱マテリアル株式会社 熱延銅合金板およびスパッタリングターゲット

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009215613A (ja) * 2008-03-11 2009-09-24 Mitsubishi Materials Corp 密着性に優れた銅合金複合膜の成膜方法およびこの成膜方法で使用するＣａ含有銅合金ターゲット
CN102203916A (zh) * 2008-10-24 2011-09-28 三菱综合材料株式会社 用于形成薄膜晶体管用布线膜的溅射靶材
CN102652182A (zh) * 2009-12-22 2012-08-29 三菱伸铜株式会社 纯铜板的制造方法及纯铜板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62158841A (ja) * 1986-01-07 1987-07-14 Mitsui Eng & Shipbuild Co Ltd 超伝導材料用合金及びその溶製方法
JP2862727B2 (ja) * 1992-05-12 1999-03-03 同和鉱業株式会社 金属薄膜形成用スパッタリング・ターゲット並びにその製造方法
TW505705B (en) 1996-09-09 2002-10-11 Toto Ltd Copper alloy and method of manufacturing same
JP3975414B2 (ja) 1997-11-28 2007-09-12 日立金属株式会社 スパッタリング用銅ターゲットおよびその製造方法
AT7491U1 (de) * 2004-07-15 2005-04-25 Plansee Ag Werkstoff für leitbahnen aus kupferlegierung
JP5354781B2 (ja) 2009-03-11 2013-11-27 三菱マテリアル株式会社 バリア層を構成層とする薄膜トランジスターおよび前記バリア層のスパッタ成膜に用いられるＣｕ合金スパッタリングターゲット
JP5201109B2 (ja) * 2009-09-16 2013-06-05 住友金属鉱山株式会社 電解コンデンサ用多孔質電極の製造方法
JP5491845B2 (ja) 2009-12-16 2014-05-14 株式会社Ｓｈカッパープロダクツ スパッタリングターゲット材
JP5708315B2 (ja) 2011-07-05 2015-04-30 三菱マテリアル株式会社 銅合金製スパッタリングターゲット
JP2013253309A (ja) * 2012-06-08 2013-12-19 Sh Copper Products Co Ltd Ｃｕ−Ｍｎ合金スパッタリングターゲット材、それを用いた半導体素子の積層配線及び積層配線の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009215613A (ja) * 2008-03-11 2009-09-24 Mitsubishi Materials Corp 密着性に優れた銅合金複合膜の成膜方法およびこの成膜方法で使用するＣａ含有銅合金ターゲット
CN102203916A (zh) * 2008-10-24 2011-09-28 三菱综合材料株式会社 用于形成薄膜晶体管用布线膜的溅射靶材
CN102652182A (zh) * 2009-12-22 2012-08-29 三菱伸铜株式会社 纯铜板的制造方法及纯铜板

Also Published As

Publication number Publication date
KR101644283B1 (ko) 2016-07-29
US9437405B2 (en) 2016-09-06
TW201439343A (zh) 2014-10-16
WO2014103626A1 (ja) 2014-07-03
KR20150099737A (ko) 2015-09-01
JP2014129580A (ja) 2014-07-10
CN104812920A (zh) 2015-07-29
JP5842806B2 (ja) 2016-01-13
TWI545210B (zh) 2016-08-11
HK1209802A1 (en) 2016-04-08
US20150318153A1 (en) 2015-11-05

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