CN104808127A - SMD counting and labeling measurement all-in-one machine and measurement module group - Google Patents
SMD counting and labeling measurement all-in-one machine and measurement module group Download PDFInfo
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- CN104808127A CN104808127A CN201510128158.1A CN201510128158A CN104808127A CN 104808127 A CN104808127 A CN 104808127A CN 201510128158 A CN201510128158 A CN 201510128158A CN 104808127 A CN104808127 A CN 104808127A
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Abstract
The invention discloses an SMD counting and labeling measurement all-in-one machine and a measurement module group. The measurement module group comprises a positioning device which is used for positioning electronic parts and components to be measured, and measurement units. The measurement units comprise a tester which measures element parameters of the electronic parts and components to be measured, two probes which are electrically connected with the two connecting ends of the tester respectively, and a driving device which drives the two probes to move between a non-test position and a test position in a reciprocating way together. The electronic parts and components to be measured are enabled to be accessed to a test loop when the two probes and the electronic parts and components to be measured are contacted. The SMD counting and labeling measurement all-in-one machine comprises a workbench, a printer, a man-machine interface and the measurement module group which are arranged on the workbench, a carrier tape disc bearing device, an equipment system and a client-terminal system. The invention belongs to the technical field of the surface mounting technology and solves the technical problems that measurement of the electronic parts and components is artificially performed and cannot be automatically performed in the prior art so that the SMD counting and labeling measurement all-in-one machine is particularly suitable for automatic measurement of the electronic parts and components, and thus measurement efficiency and accuracy can be enhanced.
Description
Technical field
The invention belongs to surface mount device (SMD) field, particularly a kind of SMD counts labeling and measures all-in-one and measurement module.
Background technology
Carrier band (Carrier Tape) and carrier band dish are mainly used in surface mounting technology field.Carrier band is a kind of band-type product being applied to electronic packaging field, and it has specific thickness, is equally spaced for bearing the hole (also known as pocket) of electronic devices and components and the pilot hole for carrying out index location in their length direction.Described electronic devices and components can be the wherein a kind of of resistance, electric capacity, inductance, transistor and diode etc., the electronic devices and components kind that each carrier band bears is generally single, and can attach the original tag of the information such as specification, quantity of electronic devices and components on reaction carrier band when dispatching from the factory on the carrier band dish of carrying carrier band.Client, before using the electronic devices and components on carrier band, generally needs to measure it and count, and last foundation measurement and count results process generate new label printing and attach on carrier band dish, for reference during use.
Existing measurement process, generally cannot complete on same machine with counting and/or printing label, and measurement process is manually carried out often, namely operating personnel with two conducting rods being electrically connected with tester respectively by electronic devices and components from gripping described carrier band out, by two conducting rods respectively with two end in contact of electronic devices and components, described tester is made to record the numerical value of electronic devices and components, the measurement mode of like this electronic devices and components being taken out, not only inefficiency, also likely make electronic devices and components because of the control of clip position or clamping dynamics etc. improper and damaged, cost is caused to waste.And, described conducting rod is generally to stretch into gap between electronic devices and components and carrier band hole, even if expect described conducting rod to make thin thin shape, its gap can stretched between electronic devices and components with carrier band hole is made directly to contact electronic devices and components two ends, also need operating personnel all to find gap accurately at every turn, and the electronic devices and components held in carrier band are all more small-sized, so each measurement all to find the eyesight demand of the gap between electronic devices and components and carrier band hole to operating personnel accurately very large, inefficiency, also the energy of operating personnel will greatly be consumed, accelerate work fatigue, error rate is made to increase.
Summary of the invention
For this reason, technical matters to be solved by this invention is that existing counting and/or printer-labeler cannot realize auto-measuring, provides a kind of SMD that can realize auto-measuring to count labeling and measures all-in-one and measure module.
For solving the problems of the technologies described above, one of the present invention measures module, comprises
Locating device, positions electronic devices and components to be measured;
Measurement unit, comprise the tester of the component parameters measuring electronic devices and components, two probes be electrically connected with two terminals of described tester respectively, and drive probe one described in two to coexist the drive unit reciprocated between non-test position and test position, and probe described in two is when the driving of described drive unit is displaced downwardly to described test position, probe described in two contacts with described electronic devices and components to be measured and is accessed in test loop by described electronic devices and components to be measured.
One of the present invention measures module, described drive unit comprises holder, the probe base be slidably mounted on described holder can be come and gone to test position direction along described non-test position, and piston rod is connected with described probe base, pull described probe base on described holder, come and go the cylinder slided, probe described in two is arranged in described probe base.
One of the present invention measures module, upper leveling board, lower horizontal board that described probe base comprises vertical plate, is connected with the same face of described vertical plate respectively, one end of described piston rod is connected with described upper leveling board, described probe is installed on described lower horizontal board, and described vertical plate is provided with leveling board dorsad, the one side of lower horizontal board is provided with described slide block; Described holder comprises the first plate in inverted "L" shaped connection and the second plate, wherein said first plate is parallel with described vertical plate, and the guide rail matched with described slide block is being provided with towards the one side of described vertical plate, described piston rod is connected with described upper leveling board through described second plate.
One of the present invention measures module, described electronic devices and components to be measured are arranged on carrier band, described locating device comprises carrier band holder, described carrier band holder offers the elongated slot for accommodating described carrier band, described elongated slot is provided with at least two reference columns positioned carrier band by the pilot hole stretched on described carrier band; Also dismountable on described carrier band holder the carrier band cover plate of gland above described carrier band is installed, described carrier band cover plate forms some through holes along alternate on the length direction of described carrier band, and described through hole is applicable to the electronic devices and components be arranged in the hole of described carrier band stretches out.
A kind of SMD of the present invention counts labeling and measures all-in-one, comprises worktable, is arranged at printer on described worktable and man-machine interface, also comprise
Above-mentioned measurement module, is arranged on described worktable;
Carrier band dish bogey, comprises point the dish load bearing unit to be measured occuping described measurement module both sides and a turntable load bearing unit, and described dish load bearing unit to be measured is for carrying carrier band dish to be measured, and described turntable load bearing unit carries the transfer carrier band dish not placing carrier band;
And device systems, described device systems is all electrically connected with described measurement module, printer, man-machine interface and load plate bogey, and controlling the measurement of described measurement module respectively, described printer Print Label, described load plate bogey orders about the carrier band disc spins on it;
Client, contrasts the original tag information that described device systems feeds back on metric data and carrier band dish to be measured that the described measurement module of coming records, and according to comparing result, feeds back the first newly-generated label information or warning to described device systems.
A kind of SMD of the present invention counts labeling and measures all-in-one, also comprise the electronic devices and components number being arranged at and described worktable measuring on described carrier band, and give the counting module of described device systems by measured data feedback, described device systems is fed back the enumeration data of coming by described client and metric data carries out the newly-generated label information of integration generation second and feeds back to described device systems.
A kind of SMD of the present invention counts labeling and measures all-in-one, also comprise the material separating disc load bearing unit being provided with the sub-material carrier band dish not placing carrier band, and under the cooperation of described transfer carrier band dish, after described band portion on described dish load bearing unit to be measured is transferred to described sub-material carrier band dish, cut off the cutting knife module of described carrier band.
Of the present inventionly a kind ofly apply above-mentioned SMD and count labeling and measure all-in-one and carry out measurements subsides calibration method, comprise following steps:
Step 1: carrier band dish to be measured is positioned over described dish load bearing unit to be measured, and the original tag information obtained on described carrier band dish to be measured feed back to described device systems;
Step 2: by described measurement module, the electronic devices and components in described carrier band to be measured are measured, and metric data is passed to described device systems;
Step 3: described metric data and original tag information feed back are given described client by described device systems, described client is compared to described metric data and described original tag information, if error is between the two within the scope of permissible error, described client can generate a first newly-generated label information and feed back to described device systems, described device systems controls described printer and prints the first newly-generated label, then by described newly-generated label attachment to described carrier band dish; If error is not between the two within the scope of permissible error, described SMD counts labeling and measures all-in-one and can give the alarm, and operating personnel will take away and be measured carrier band and do abnormality processing.
Of the present inventionly a kind ofly apply above-mentioned SMD and count labeling and measure the method that all-in-one carries out measuring counting labeling, comprise following steps:
Step 1: carrier band dish to be measured is positioned over described dish load bearing unit to be measured, and the original tag information obtained on described carrier band dish to be measured feed back to described device systems;
Step 2: by described measurement module, the electronic devices and components in described carrier band to be measured are measured, and metric data is passed to described device systems;
Step 3: described metric data is fed back to described client by described device systems, described client is compared to described metric data and described original tag information, if error is not between the two within the scope of permissible error, described SMD counts labeling and measures all-in-one and can give the alarm, and operator will be taken away and be measured carrier band and do abnormality processing; If error is between the two within the scope of permissible error, described client feeds back to described device systems signal, described device systems is made to control described man-machine interface display metric data normal, and start described carrier band to be transferred to described transfer carrier band dish from described carrier band dish to be measured, in transfer process, start described counting module counting;
Step 4: enumeration data is passed to described device systems by described counting module, described enumeration data is fed back to described client by described device systems, described metric data and enumeration data carry out integrating and generate a second newly-generated label information and feed back to described device systems by described client, and described device systems controls described printer and prints the second newly-generated label;
Step 5: by the carrier band on described transfer carrier band dish again backrush to described carrier band dish to be measured;
Step 6: by described newly-generated label attachment to described carrier band dish to be measured.
Of the present inventionly a kind ofly apply above-mentioned SMD and count labeling and measure all-in-one to carry out the method for sub-material, comprise following steps:
Step 1: carrier band dish to be measured is positioned in dish load bearing unit to be measured, and the original tag information obtained on described carrier band dish to be measured is uploaded to described device systems;
Step 2: input sub-material quantity in described man-machine interface, described device systems generates sub-material label, and the carrier band controlling to preset sub-material quantity is transferred on transfer carrier band dish from carrier band dish to be measured;
Step 3: start cutting knife module and cut off described carrier band;
Step 4: the described device systems carrier band controlled on described transfer carrier band dish is all transferred on described sub-material carrier band dish;
Step 5: described device systems controls described printer and prints described sub-material label;
Step 6: by described sub-material label attachment to described sub-material carrier band dish.
Technique scheme of the present invention has the following advantages compared to existing technology:
(1) one of the present invention measures in module, and comprise locating device and measurement unit, described locating device positions electronic devices and components to be measured; Described measurement unit comprises the tester of the component parameters measuring electronic devices and components, two probes be electrically connected with two terminals of described tester respectively, and drive probe one described in two to coexist the drive unit reciprocated between non-test position and test position, and probe described in two is when the driving of described drive unit is displaced downwardly to described test position, probe described in two contacts with described electronic devices and components to be measured and accesses in test loop by described electronic devices and components to be measured; Achieve the robotization of measurement process, compared to the mode of existing artificial measurement, improve work efficiency, it also avoid and damage electronic devices and components because controlling improper to the clip position of electronic devices and components or clamping dynamics, reduce error rate, save the cost of manpower and components and parts.
(2) one of the present invention measures in module, described carrier band cover plate gland is above described carrier band, described carrier band 10 can be made to keep straight, and coordinate described carrier band holder to make described carrier band obtain good location, to ensure the accuracy measuring efficiency and measurement.
(3) one of the present invention measures in module, comprise worktable, be arranged at printer on described worktable and man-machine interface, also comprise and measure module, carrier band dish bogey, device systems and client, control described measurement module by described device systems to measure, described printer Print Label, described load plate bogey orders about the carrier band disc spins on it, can complete simultaneously measure and printing label process, and achieve the robotization of whole measurement printing label process, improve work efficiency.
(4) one of the present invention measures in module, described measurement module, described counting module, described cutting knife module and described printer are set simultaneously, on a machine, realizing the process such as measurement, counting, sub-material, printing label described in can making simultaneously, improve the usable range of machine and utilization factor and work efficiency, save cost.
Accompanying drawing explanation
In order to make content of the present invention be more likely to be clearly understood, below according to a particular embodiment of the invention and by reference to the accompanying drawings, the present invention is further detailed explanation, wherein
Fig. 1 is the stereographic map that SMD of the present invention counts that labeling measures all-in-one;
Fig. 2 measures the stereographic map that module removes tester part;
Fig. 3 is the stereographic map that measurement unit removes tester part;
Fig. 4 measures the stereographic map that module removes tester and carrier band deck portion;
Fig. 5 is the stereographic map that SMD counts that labeling measurement all-in-one removes upper case portion;
Fig. 6 is the stereographic map that the SMD comprising sub-material carrier band dish of another kind of appearance style counts that labeling measures all-in-one;
Fig. 7 is that SMD sinks the stereographic map of backup plate, SMD base plate and floor.
In figure, Reference numeral is expressed as: 1-measures module, 10-carrier band, 101-pilot hole, 102-hole, 2-locating device, 20-electronic devices and components to be measured, 21-carrier band holder, 211-elongated slot, 212-reference column, 22-carrier band cover plate, 221-through hole, 3-measurement unit, 30-carrier band dish to be measured, 31-tester, 32-probe, 33-drive unit, 34-holder, 341-first plate, 342-second plate, 35-probe base, 351-vertical plate, the upper leveling board of 352-, 353-lower horizontal board, 36-cylinder, 37-piston rod, 38-guide rail, 39-slide block, 4-worktable, 40-transfer carrier band dish, 5-printer, 50-sub-material carrier band dish, 6-man-machine interface, 60-pushbutton switch box, 7-carrier band dish bogey, 70-tri-look warning lamp, 71-dish load bearing unit to be measured, 72-turntable load bearing unit, 73-material separating disc load bearing unit, 8-counts module, 80-SMD sinks backup plate, 81-SMD base plate, 82-floor, 9-cutting knife module.
Embodiment
Below with reference to accompanying drawing, following examples are used to be further elaborated the present invention.
Embodiment 1
Consult Fig. 1 and Fig. 2, described measurement module 1, comprises
Locating device 2, electronic devices and components 20 to be measured are positioned, described electronic devices and components to be measured 20 can be any one of resistance, electric capacity, inductance, potentiometer, transformer, triode, diode, IC etc., and preferred described electronic devices and components 20 are electric capacity or resistance in the present embodiment;
Measurement unit 3, comprise the tester 31 of the component parameters measuring electronic devices and components 20, two probes 32 be electrically connected with two terminals of described tester 31 respectively, and drive probe 32 1 described in two to coexist the drive unit 33 reciprocated between non-test position and test position, and probe 32 described in two is when the driving of described drive unit 33 is displaced downwardly to described test position, probe 32 described in two contacts with described electronic devices and components 20 to be measured and is accessed in test loop by described electronic devices and components 20 to be measured.The concrete form of described tester 31 can be multiple, and as LCR tester, CR tester etc., in the present embodiment, preferred described tester is CR tester.
Measurement module 1 of the present invention, be applicable to measure electronic devices and components 20, by described locating device 2, electronic devices and components 20 to be measured are positioned, then described drive unit 33 drive probe 32 described in two to move to described test position and respectively with two end in contact of electronic devices and components 20 to be measured, make electronic devices and components 20 to be measured access the test loop of described tester 31, described tester 31 measures the parameter value of described electronic devices and components 20.This parameter value can be resistance value or the capacitance of these electronic devices and components 20.
Measurement module 1 of the present invention, achieve the robotization of measurement process, compared to the mode of existing artificial measurement, improve work efficiency, it also avoid and damage electronic devices and components 20 because controlling improper to the clip position of electronic devices and components 20 or clamping dynamics, reduce error rate, save the cost of manpower and components and parts.
The concrete structure of described drive unit 33 has multiple, in the present embodiment, preferred described drive unit 33 comprises holder 34, the probe base 35 be slidably mounted on described holder 34 can be come and gone along described non-test position to test position direction, and piston rod 37 is connected with described probe base 35, pull described probe base 35 on described holder 34, come and go the cylinder 36 slided, probe 32 described in two is arranged in described probe base 35.
Coordinate and consult Fig. 3, described holder 34 is provided with guide rail 38 or slide block 39 in the face of the one side of described probe base 35, and described probe base 35 is provided with slide block 39 or guide rail 38 in the face of the one side correspondence of described holder 34.In the present embodiment, described holder 34 is provided with guide rail 38 in the face of the one side of described probe base 35, and described probe base 35 is provided with slide block 39 in the face of the one side correspondence of described holder 34.
When starting described measurement module 1, the described piston rod 37 of described cylinder 36 moves reciprocatingly, drive the described probe base 35 be connected with described piston rod 37 to be moved back and forth on described guide rail 38 by described slide block 39, the described probe 32 be arranged in described probe base 35 also slides along with coming and going along described non-test position to described test position direction together.
Consult Fig. 3, upper leveling board 352, lower horizontal board 353 that described probe base 35 comprises vertical plate 351, is connected with the same face of described vertical plate 351 respectively, one end of described piston rod 37 is connected with described upper leveling board 352, described probe 32 is installed on described lower horizontal board 353, and described vertical plate 351 is provided with leveling board 352 dorsad, the one side of lower horizontal board 353 is provided with described slide block 39.
Described holder 34 comprises the first plate 341 and the second plate 342 in inverted "L" shaped connection, wherein said first plate 341 is parallel with described vertical plate 351, and the guide rail 38 matched with described slide block 39 is being provided with towards the one side of described vertical plate 351, described piston rod 37 is connected with described upper leveling board 352 through described second plate 342.
Consult Fig. 2 and Fig. 4, described electronic devices and components to be measured 20 are arranged on carrier band 10, described locating device 2 comprises carrier band holder 21, described carrier band holder 21 offers the elongated slot 211 for accommodating described carrier band 10, described elongated slot 211 is provided with at least two reference columns 212 positioned carrier band 10 by the pilot hole 101 stretched on described carrier band 10.Described carrier band holder 21 has the effect of installing the described carrier band 10 in location.
Also dismountable on described carrier band holder 21 the carrier band cover plate 22 of gland above described carrier band 10 is installed, described carrier band cover plate 22 forms some through holes 221 along alternate on the length direction of described carrier band 10, and described through hole 221 is applicable to the electronic devices and components 20 be arranged in the hole 102 of described carrier band 10 stretches out.Described carrier band cover plate 22 gland, above described carrier band 10, can make described carrier band 10 keep straight, and coordinates described carrier band holder 21 to make described carrier band 10 obtain good location, to ensure the accuracy measuring efficiency and measurement.
Consult Fig. 1 and Fig. 5, a kind of SMD counts labeling and measures all-in-one, comprises worktable 4, is arranged at printer 5 on described worktable 4 and man-machine interface 6, also comprise
Above-mentioned measurement module 1, is arranged on described worktable 4;
Carrier band dish bogey 7, comprise point the dish load bearing unit 71 to be measured occuping described measurement module 1 both sides and a turntable load bearing unit 72, described dish load bearing unit 71 to be measured is for carrying carrier band dish 30 to be measured, and described turntable load bearing unit 72 carries the transfer carrier band dish 40 not placing carrier band;
And device systems, described device systems is all electrically connected with described measurement module 1, printer 5, man-machine interface 6 and load plate bogey 7, and control described measurement module 1 respectively and measure, described printer 5 Print Label, described load plate bogey 7 orders about the carrier band disc spins on it;
Client, the original tag information that described device systems feeds back on metric data and carrier band dish 30 to be measured that the described measurement module 1 of coming records is contrasted, and according to comparing result, feed back the first newly-generated label information or warning to described device systems.Described client is specifically unrestricted, such as, can be MES system, and also can be SFIS system, preferred described client be MES system in the present embodiment.
SMD of the present invention counts labeling and measures all-in-one, control described measurement module 1 by described device systems to measure, described printer 5 Print Label, described load plate bogey 7 orders about the carrier band disc spins on it, can complete simultaneously measure and printing label process, and achieve the robotization of whole measurement printing label process, improve work efficiency.Further, SMD of the present invention counts labeling and measures all-in-one, the number being arranged at and described worktable 4 measuring the electronic devices and components 20 on described carrier band 10 can also be comprised, and give the counting module 8 of described device systems by measured data feedback, described device systems is fed back the enumeration data of coming by described client and metric data carries out the newly-generated label information of integration generation second and feeds back to described device systems.Described counting module 8 is electrically connected with described device systems equally, and is subject to the control of described device systems.Described counting module 8 concrete form can be multiple, is preferably parts counter in the present embodiment.
Coordinate and consult Fig. 6, SMD of the present invention counts labeling and measures all-in-one, also can comprise the material separating disc load bearing unit 73 being provided with the sub-material carrier band dish 50 not placing carrier band 10 further, and under the cooperation of described transfer carrier band dish 40, after described carrier band 10 part on described dish load bearing unit 71 to be measured is transferred to described sub-material carrier band dish 50, cut off the cutting knife module 9 of described carrier band 10.Described cutting knife module 9 is electrically connected with described device systems equally, and is subject to the control of described device systems.
In addition, count on labeling measurement all-in-one at described SMD and described measurement module 1, described counting module 8, described cutting knife module 9 and described printer 5 are set simultaneously, can make described carrier band 10 on a machine, realize the process such as measurement, counting, sub-material, printing label simultaneously, improve the usable range of machine and utilization factor and work efficiency, save cost.
Consult Fig. 1 and Fig. 5, SMD of the present invention counts labeling measurement all-in-one and also comprises a pushbutton switch box 60 be installed on described worktable 4, comprise and measure module button, counting module button and cutting knife module button, control the startup of described measurement module, described counting module and described cutting knife module respectively.Therefore, operating personnel both by described man-machine interface 6, also by each button on described pushbutton switch box 60, can realize the startup to described measurement module, described counting module and described cutting knife module and closedown.
SMD of the present invention counts labeling measurement all-in-one and also comprises three look warning lamps 70, and when described SMD counting labeling measurement all-in-one gives the alarm, described three look warning lamps 70 can be bright, has warning function.
SMD of the present invention counts labeling and measures in all-in-one, the concrete set-up mode of described measurement module 1, described counting module 8, described cutting knife module 9 and carrier band dish bogey 7 has multiple, consult Fig. 1, Fig. 5 and Fig. 7, on described worktable 4, be preferably vertically installed with SMD in the present embodiment sink backup plate 80, offer the groove differed in size above, described measurement module 1, described counting module 8 and described cutting knife module 9 are all inserted into described SMD and sink in the groove of backup plate 80.Described dish load bearing unit 71 to be measured and described turntable load bearing unit 72 are separately positioned on described SMD and sink the both sides of backup plate 80, described cutting knife module 9 and described counting module 8 are between described dish load bearing unit 71 to be measured and described turntable load bearing unit 72, and described measurement module 1 is between described cutting knife module 9 and described counting module 8.Described material separating disc load bearing unit 73 is arranged at the position above described counting module 8.Described SMD sinks the setting of backup plate 80, make described measurement module 1, described counting module 8, described cutting knife module 9 and carrier band dish bogey 7 all can be implemented in perpendicular operation, the process such as measurement, counting, sub-material of described carrier band 10 is convenient to observe and monitoring.
Can also be fixedly installed the SMD base plate 81 of level further on described worktable 4, described SMD sinks bottom backup plate 80 and is fixedly connected with described SMD base plate 81, sinks between backup plate 80 and described SMD base plate 81 be connected with two floors 82 at described SMD.The setting of described SMD base plate 81 and described floor 82, makes described SMD sink the installation of backup plate 80 on described worktable more firmly, has ensured the work accuracy of each work module on it.
The above-mentioned SMD of the present invention's one application counts labeling measurement all-in-one and carries out measurement subsides calibration method, comprises following steps:
Step 1: carrier band dish 30 to be measured is positioned over described dish load bearing unit 71 to be measured, and obtains the original tag information on described carrier band dish 30 to be measured by other modes such as either scans or CCD scannings and feed back to described device systems;
Step 2: described carrier band 10 is pulled in the described elongated slot 21 of described carrier band holder 21, and coordinate described carrier band cover plate 22 to position described carrier band 10, then described measurement module 1 measures the electronic devices and components 20 in described carrier band 1 to be measured, and metric data is passed to described device systems;
Step 3: described metric data and original tag information feed back are given described client by described device systems, described client is compared to described metric data and described original tag information, if error is between the two within the scope of permissible error, described client can generate a first newly-generated label information and feed back to described device systems, described device systems controls described printer 5 and prints the first newly-generated label, then by described newly-generated label attachment to described carrier band dish 30 to be measured; If error is not between the two within the scope of permissible error, described SMD counts labeling and measures all-in-one and can give the alarm, and operating personnel will take away and be measured carrier band 10 and do abnormality processing.In the present embodiment, unique identifier is comprised in described first newly-generated label information.
Usually, measure module 1 requirement described in step 2 and survey electronic devices and components 20.
A kind of above-mentioned SMD counting labeling of applying of the present invention measures the method that all-in-one carries out measuring counting labeling, comprises following steps:
Step 1: carrier band dish 30 to be measured is positioned over described dish load bearing unit 71 to be measured, and obtains the original tag information on described carrier band dish 30 to be measured by other modes such as either scans or CCD scannings and feed back to described device systems;
Step 2: described carrier band 10 is pulled in the described elongated slot 21 of described carrier band holder 21, and coordinate described carrier band cover plate 22 to position described carrier band 10, then described measurement module measures the electronic devices and components 20 in described carrier band 10 to be measured, and metric data is passed to described device systems;
Step 3: described metric data is fed back to described client by described device systems, described client is compared to described metric data and described original tag information, if error is not between the two within the scope of permissible error, described SMD counts labeling and measures all-in-one and can give the alarm, and operator will be taken away and be measured carrier band 10 and do abnormality processing; If error is between the two within the scope of permissible error, described client feeds back to described device systems signal, making described device systems control described man-machine interface 6, to show metric data normal, and start described carrier band 10 to be transferred to described transfer carrier band dish 40 from described carrier band dish 30 to be measured, in transfer process, start described counting module 8 count; In the present embodiment, first one end of described carrier band be pulled to described transfer carrier band dish 40 and fix, started the rotation of described dish load bearing unit 71 to be measured and described turntable load bearing unit 72 again by described man-machine interface 6, described carrier band is shifted described transfer carrier band dish 40 gradually from described carrier band dish 30 to be measured;
Step 4: enumeration data is passed to described device systems by described counting module 8, described enumeration data is fed back to described client by described device systems, described metric data and enumeration data carry out integrating and generate a second newly-generated label information and feed back to described device systems by described client, and described device systems controls described printer 5 and prints the second newly-generated label; In the present embodiment, in described second newly-generated label information, comprise unique identifier;
Step 5: the rotation being started described dish load bearing unit 71 to be measured and described turntable load bearing unit 72 by described man-machine interface 6, by the carrier band 10 on described transfer carrier band dish 40 again backrush to described carrier band dish 30 to be measured;
Step 6: by described newly-generated label attachment to described carrier band dish 30 to be measured.
A kind of above-mentioned SMD counting labeling of applying of the present invention measures all-in-one to carry out the method for sub-material, comprises following steps:
Step 1: carrier band dish 30 to be measured is positioned in dish load bearing unit 71 to be measured, and the original tag information obtained on described carrier band dish 30 to be measured is uploaded to described device systems;
Step 2: input sub-material quantity in described man-machine interface 6, described device systems generates sub-material label, and the carrier band 10 controlling to preset sub-material quantity is transferred on transfer carrier band dish 40 from carrier band dish 30 to be measured; In the present embodiment, first one end of described carrier band be pulled to described transfer carrier band dish 40 and fix, started the rotation of described dish load bearing unit 71 to be measured and described turntable load bearing unit 72 again by described man-machine interface 6, the carrier band 10 of default sub-material quantity is shifted described transfer carrier band dish 40 gradually from described carrier band dish 30 to be measured; In the present embodiment, unique identifier is comprised in described sub-material label;
Step 3: start cutting knife module 9 and cut off described carrier band 10;
Step 4: the described device systems carrier band 10 controlled on described transfer carrier band dish 40 is all transferred on described sub-material carrier band dish 50; In the present embodiment, first one end of described carrier band be pulled to described sub-material carrier band dish 50 and fix, started the rotation of described material separating disc load bearing unit 73 and described turntable load bearing unit 72 again by described man-machine interface 6, the carrier band on described transfer carrier band dish 40 is all transferred to described sub-material carrier band dish 50;
Step 5: described device systems controls described printer 5 and prints described sub-material label;
Step 6: by described sub-material label attachment to described sub-material carrier band dish 50.
Embodiment 2
SMD of the present invention counts labeling and measures in all-in-one, and the concrete set-up mode of described measurement module 1, described counting module 8, described cutting knife module 9 and carrier band dish bogey 7 has multiple, provides another set-up mode in the present embodiment.Described worktable 4 fixedly mounts boss (not shown), described measurement module 1, described counting module 8 and described cutting knife module 9 are installed on the upper surface in level of described boss, described dish load bearing unit 71 to be measured and described turntable load bearing unit 72 are arranged on described worktable 4 and described boss both sides of living apart, and described material separating disc load bearing unit 73 to be arranged on described worktable 4 and relative with described boss between described dish load bearing unit 71 to be measured and described turntable load bearing unit 72.The setting of described boss, makes described measurement module 1, described counting module 8, described cutting knife module 9 and carrier band dish bogey 7 all can be implemented in the operation of horizontal plane.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to embodiment.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all embodiments.And thus the apparent change of extending out or variation be still among the protection domain of the invention.
Claims (10)
1. measure a module, it is characterized in that: comprise
Locating device (2), positions electronic devices and components to be measured (20);
Measurement unit (3), comprise the tester (31) of the component parameters measuring electronic devices and components (20), two probes (32) be electrically connected with two terminals of described tester (31) respectively, and drive probe (32) described in two to coexist the drive unit (33) reciprocated between non-test position and test position, and probe described in two (32) is when the driving of described drive unit (33) is displaced downwardly to described test position, probe described in two (32) contacts with described electronic devices and components to be measured (20) and described electronic devices and components to be measured (20) is accessed in test loop.
2. measurement module according to claim 1, it is characterized in that: described drive unit (33) comprises holder (34), the probe base (35) be slidably mounted on described holder (34) can be come and gone along described non-test position to test position direction, and piston rod (37) is connected with described probe base (35), pull described probe base (35) at the upper cylinder (36) coming and going slip of described holder (34), probe described in two (32) is arranged in described probe base (35).
3. measurement module according to claim 2, it is characterized in that: described probe base (35) comprises vertical plate (351), the upper leveling board (352) be connected with the same face of described vertical plate (351) respectively, lower horizontal board (353), one end of described piston rod (37) is connected with described upper leveling board (352), described probe (32) is installed on described lower horizontal board (353), described vertical plate (351) is provided with leveling board (352) dorsad, the one side of lower horizontal board (353) is provided with described slide block (39), described holder (34) comprises the first plate (341) in inverted "L" shaped connection and the second plate (342), wherein said first plate (341) is parallel with described vertical plate (351), and the guide rail (38) matched with described slide block (39) is being provided with towards the one side of described vertical plate (351), described piston rod (37) is connected with described upper leveling board (352) through described second plate (342).
4. according to the arbitrary described measurement module of claim 1-3, it is characterized in that: described electronic devices and components to be measured (20) are arranged on carrier band (10), described locating device (2) comprises carrier band holder (21), described carrier band holder (21) offers the elongated slot (211) for accommodating described carrier band (10), described elongated slot (211) is provided with at least two reference columns (212) positioned carrier band (10) by the pilot hole (101) stretched on described carrier band (10); Described carrier band holder (21) is above also dismountable is provided with the carrier band cover plate (22) of gland in described carrier band (10) top, described carrier band cover plate (22) forms some through holes (221) along alternate on the length direction of described carrier band (10), and described through hole (221) is applicable to the electronic devices and components (20) be arranged in the hole (102) of described carrier band (10) stretches out.
5. SMD counts labeling and measures an all-in-one, comprises worktable (4), is arranged at printer (5) on described worktable (4) and man-machine interface (6), it is characterized in that: also comprise
Measurement module (1) as claimed in claim 4, is arranged on described worktable (4);
Carrier band dish bogey (7), comprise point the dish load bearing unit (71) to be measured occuping described measurement module (1) both sides and a turntable load bearing unit (72), described dish load bearing unit (71) to be measured is for carrying carrier band dish (30) to be measured, and described turntable load bearing unit (72) carries the transfer carrier band dish (40) not placing carrier band (10);
And device systems, described device systems is all electrically connected with described measurement module (1), printer (5), man-machine interface (6) and load plate bogey (7), and control the measurement of described measurement module (1) respectively, described printer (5) Print Label, described load plate bogey (7) orders about the carrier band disc spins on it;
Client, the original tag information that described device systems feeds back on metric data and carrier band dish to be measured (30) that the described measurement module (1) come records is contrasted, and according to comparing result, feed back the first newly-generated label information or warning to described device systems.
6. SMD according to claim 5 counts labeling and measures all-in-one, it is characterized in that: also comprise electronic devices and components (20) number be arranged on described worktable (4) the described carrier band of upper metering (10), and give the counting module (8) of described device systems by measured data feedback, described device systems is fed back the enumeration data of coming by described client and metric data carries out the newly-generated label information of integration generation second and feeds back to described device systems.
7. the SMD according to claim 5 or 6 counts labeling and measures all-in-one, it is characterized in that: also comprise the material separating disc load bearing unit (73) being provided with the sub-material carrier band dish (50) not placing carrier band (10), and under the cooperation of described transfer carrier band dish (40), after described carrier band (10) part on described dish load bearing unit (71) to be measured is transferred to described sub-material carrier band dish (50), cut off the cutting knife module (9) of described carrier band (10).
8. application rights requires that the SMD according to any one of 5-7 counts labeling measurement all-in-one and carries out a measurement subsides calibration method, it is characterized in that comprising following steps:
Step 1: carrier band dish (30) to be measured is positioned over described dish load bearing unit (71) to be measured, and the original tag information obtained on described carrier band dish (30) to be measured feed back to described device systems;
Step 2: by described measurement module (1), the electronic devices and components (20) in described carrier band to be measured (1) are measured, and metric data is passed to described device systems;
Step 3: described metric data and original tag information feed back are given described client by described device systems, described client is compared to described metric data and described original tag information, if error is between the two within the scope of permissible error, described client can generate a first newly-generated label information and feed back to described device systems, described device systems controls described printer (5) and prints the first newly-generated label, then by described newly-generated label attachment to described carrier band dish (30) to be measured; If error is not between the two within the scope of permissible error, described SMD counts labeling and measures all-in-one and can give the alarm, and operating personnel will take away and be measured carrier band (10) and do abnormality processing.
9. application rights requires that the SMD described in 6 or 7 counts labeling and measures the method that all-in-one carries out measuring counting labeling, it is characterized in that comprising following steps:
Step 1: carrier band dish (30) to be measured is positioned over described dish load bearing unit (71) to be measured, and the original tag information obtained on described carrier band dish (30) to be measured feed back to described device systems;
Step 2: by described measurement module, the electronic devices and components (20) in described carrier band to be measured (10) are measured, and metric data is passed to described device systems;
Step 3: described metric data is fed back to described client by described device systems, described client is compared to described metric data and described original tag information, if error is not between the two within the scope of permissible error, described SMD counts labeling and measures all-in-one and can give the alarm, and operator will be taken away and be measured carrier band (10) and do abnormality processing; If error is between the two within the scope of permissible error, described client feeds back to described device systems signal, described device systems is made to control described man-machine interface (6) display metric data normal, and start described carrier band (10) to be transferred to described transfer carrier band dish (40) from described carrier band dish (30) to be measured, in transfer process, start described counting module (8) counting;
Step 4: enumeration data is passed to described device systems by described counting module (8), described enumeration data is fed back to described client by described device systems, described metric data and enumeration data carry out integrating and generate a second newly-generated label information and feed back to described device systems by described client, and described device systems controls described printer (5) and prints the second newly-generated label;
Step 5: by the carrier band (10) on described transfer carrier band dish (40) again backrush to described carrier band dish (30) to be measured;
Step 6: by described newly-generated label attachment to described carrier band dish (30) to be measured.
10. application rights requires that the SMD described in 7 counts labeling and measures the method that all-in-one carries out sub-material, it is characterized in that comprising following steps:
Step 1: carrier band dish (30) to be measured is positioned in dish load bearing unit (71) to be measured, and the original tag information obtained on described carrier band dish (30) to be measured is uploaded to described device systems;
Step 2: input sub-material quantity in described man-machine interface (6), described device systems generates sub-material label, and the carrier band (10) controlling to preset sub-material quantity is transferred on transfer carrier band dish (40) from carrier band dish (30) to be measured;
Step 3: start cutting knife module (9) and cut off described carrier band (10);
Step 4: the described device systems carrier band (10) controlled on described transfer carrier band dish (40) is all transferred on described sub-material carrier band dish (50);
Step 5: described device systems controls described printer (5) and prints described sub-material label;
Step 6: by described sub-material label attachment to described sub-material carrier band dish (50).
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| CN201510128158.1A CN104808127B (en) | 2015-03-23 | 2015-03-23 | SMD counts labeling and measures all-in-one and measure module |
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| CN201510128158.1A CN104808127B (en) | 2015-03-23 | 2015-03-23 | SMD counts labeling and measures all-in-one and measure module |
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| CN111039061A (en) * | 2019-12-27 | 2020-04-21 | 中国电子科技集团公司第十三研究所 | SMD material distributing machine |
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| CN105690995A (en) * | 2016-01-27 | 2016-06-22 | 深圳市宝尔威精密机械有限公司 | An SMT material belt automatic counting code-spraying machine |
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| CN108761301B (en) * | 2018-08-03 | 2024-05-07 | 天津必利优科技发展有限公司 | SMD crystal testing mechanism |
| CN111039061A (en) * | 2019-12-27 | 2020-04-21 | 中国电子科技集团公司第十三研究所 | SMD material distributing machine |
| CN111366811A (en) * | 2020-03-19 | 2020-07-03 | 北京广利核系统工程有限公司 | Integrated automatic inspection device and method for electronic components |
| CN111366811B (en) * | 2020-03-19 | 2022-06-21 | 北京广利核系统工程有限公司 | Integrated automatic inspection device and method for electronic components |
| CN113562263A (en) * | 2021-07-22 | 2021-10-29 | 东莞市川利制鞋机械有限公司 | Full-automatic intelligent scanning packaging production line |
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