CN104797373B - Laser machining device and laser machining method - Google Patents
Laser machining device and laser machining method Download PDFInfo
- Publication number
- CN104797373B CN104797373B CN201380061517.5A CN201380061517A CN104797373B CN 104797373 B CN104797373 B CN 104797373B CN 201380061517 A CN201380061517 A CN 201380061517A CN 104797373 B CN104797373 B CN 104797373B
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- CN
- China
- Prior art keywords
- laser pulse
- laser
- unit
- movement
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention is designed to improve machining quality by eliminating variations in laser pulse pitch and diameter in the acceleration and deceleration regions of laser machining. This laser machining device is characterized in comprising: a laser pulse generation means for generating a laser pulse sequence of a constant period; a light-directing means capable of receiving the laser pulse sequence output from the laser pulse generation means and selectively directing the laser pulses in the laser pulse sequence in the direction to be used for the machining; an optical system for receiving the laser pulses from the light-directing means and irradiating same on the workpiece; a means for driving the table on which the workpiece is loaded; a specified movement amount-detecting means for periodically detecting a specified amount of table movement; and a control means for performing control so that when the specified movement amount-detecting means detects the specified movement amount, laser pulses in the laser pulse sequence output from the laser pulse generation means are directed in the machining direction.
Description
Technical field
Laser Processing the present invention relates to carry out groove processing etc. to machined object as printed base plate using laser beam
Device and laser processing.
Background technology
Always, it is known to be configured to printed base plate radiation pulses output laser beam and make printed base plate with
The orthogonal side of the optical axis of laser beam is moved upward to carry out the laser processing device of groove processing.
In the case of moving printed base plate along processing line in such laser processing device, produced when processing and starting
Accelerate, deceleration is produced in process finishing.Additionally, in the curve part for making the bending section of straight-line bending, curvature big, moving direction
Significantly change, therefore, compared with the small curve part of line part, curvature, the need for there is deceleration.
However, in these acceleration and deceleration regions, there are the following problems：The spacing of laser pulse is not fixation, by laser arteries and veins
Rushing the heat for producing becomes excessive, and the width and depth of groove are not uniform, processing quality is deteriorated.
As the technology for solving such problem, for example, as disclosed in patent document 1,2,3 and 4, existing to quilt
Translational speed of machining object etc. is detected and the output of laser pulse is controlled according to translational speed for being detected etc. regularly
Technology.
Prior art literature
Patent document
Patent document 1：No. 3854822 publications of Japanese Patent Publication No.；
Patent document 2：2003-No. 53563 publications of Japanese Unexamined Patent Publication；
Patent document 3：2010-No. 184289 publications of Japanese Unexamined Patent Publication；
Patent document 4：2012-No. 130959 publications of Japanese Unexamined Patent Publication.
The content of the invention
The invention problem to be solved
However, at these in the prior art, the frequency of laser oscillator is changed in acceleration and deceleration region, because
This, exists and causes energy shift in laser oscillator and beam diameter is changed, well width, groove depth is changed
The shortcoming for still making processing quality be deteriorated.
On the other hand, it is also considered that in order that energy shift diminishes and continuously exports laser and take out laser pulse from it
Method, but, when for which, have the disadvantage that：It is difficult to obtain the laser pulse of high-energy, it is impossible to carry out to being added
Processing the need for work thing and must possess the laser oscillator of bulky capacitor.
Therefore, even if can also be eliminated in laser it is an object of the invention to provide the laser oscillator for not possessing bulky capacitor
The situation that the spacing and diameter of laser pulse change in the acceleration and deceleration region of processing come seek processing quality raising swash
Optical machining device and laser processing.
Scheme for solving problem
In order to solve above-mentioned problem, in the laser processing device described in scheme 1, it is characterised in that include：Laser arteries and veins
Oscillating unit is rushed, the laser pulse train to the fixed cycle vibrates；Light points to unit, can be single to being vibrated from the laser pulse
The laser pulse train of unit's output carries out light-receiving and the laser pulse in the laser pulse train is selectively oriented to for adding
The direction of work；Optical system, the laser pulse to pointing to unit from the light carries out light-receiving and is irradiated to machined object；To carrying
Put the unit that the workbench of the machined object is driven；The mobile amount detection unit of regulation, periodically detects the work
The movement of the ormal weight of platform；And control unit, it is right after the amount of movement that regulation movement amount detection unit detects regulation
The light points to unit and is controlled, so that from the laser pulse in the laser pulse train of laser pulse oscillating unit output
Point to the machine direction.
Additionally, in the laser processing device described in scheme 2, it is characterised in that in the Laser Processing described in scheme 1
In device, described control unit is controlled, so that the light points to unit and avoids being exported from the laser pulse oscillating unit
Laser pulse transitional period portion and point to the machine direction.
Additionally, in the laser processing device described in scheme 3, it is characterised in that remembered in any one of scheme 1 or 2
In the laser processing device of load, the composite value of the amount of movement of the mobile amount detection unit detection two-dimensional directional of regulation.
Additionally, in the laser processing described in scheme 4, being processed laser beam is irradiated into machined object and being added
In the laser processing of work thing, it is characterised in that vibrate the laser pulse train of fixed cycle, the mounting quilt is being detected
After the movable workbench ormal weight of machining object, the laser pulse in the laser pulse train is set to be selectively oriented to for processing
Direction.
Additionally, in the laser processing described in scheme 5, it is characterised in that in the Laser Processing described in scheme 4
In method, in the case of the laser pulse sensing machine direction for making the laser pulse train, the laser pulse is avoided
Transitional period, portion was pointed to.
Additionally, in the laser processing described in scheme 6, it is characterised in that scheme 4 or 5 any one swash
In light processing method, the mobile detection of the workbench is based on the composite value of the amount of movement of two-dimensional directional.
Invention effect
According to the present invention, following laser processing device and laser processing is obtained：Due to using to the fixed cycle
The laser pulse oscillating unit that laser pulse is vibrated, so, even if the laser oscillator for not possessing bulky capacitor can also be obtained
To being high-energy and the laser pulse for being difficult to cause energy shift, even if also, swashing in the acceleration and deceleration region of Laser Processing
The spacing of light pulse will not also be changed with diameter and implement machining area integrally obtain as processing quality.
Brief description of the drawings
Fig. 1 is the block diagram of the laser processing device for turning into one embodiment of the present of invention.
Fig. 2 is the time diagram of the signal in each portion of the laser processing device shown in Fig. 1 etc..
Fig. 3 is the structure chart of the regulation amount of movement test section in Fig. 1.
Fig. 4 is the structure chart of the AOM control signal output circuits in Fig. 1.
Fig. 5 is the figure for illustrating effect of the invention.
Specific embodiment
Embodiment
One embodiment of the present of invention is illustrated.Fig. 1 is the laser processing device for turning into one embodiment of the present of invention
The block diagram put, Fig. 2 is the time diagram of the signal in each portion of the laser processing device shown in Fig. 1 etc..
In Fig. 1,1 is the laser oscillator for producing laser pulse L1, and 2 is to export the fixed cycle to laser oscillator 1
The laser generation control unit of laser generation command signal S1.Laser oscillator 1 is only being provided laser from laser generation control unit 2
Output laser pulse L1 during vibration command signal S1, the laser pulse of the laser pulse train for producing the fixed cycle is constituted using both
Oscillating unit 3.Laser oscillator 1 has laser pulse L1 when in the rising edge of laser generation command signal S1, trailing edge
Carry out the characteristic of curvilinear change.4 is that can optionally carry out being shaken from laser according to each of each laser pulse L1
Swing the acousto-optic modulator of the control in the fork direction of the laser pulse L1 of the output of device 1（It is simply below AOM）, 5 is defeated to AOM4
Go out AOM control signals S2 to control the AOM control units of its work, 6 is the laser pulse diverged from AOM4 to machined object irradiation
The optical system of L2.
AOM4 makes the laser pulse L1 from laser oscillator 1 when AOM control signal S2 are provided to as processing side
To optical system 6 diverge（On-state）, on the other hand, make when AOM control signal S2 are not provided with from laser generation
The laser pulse L1 of device 1 is in the way of not towards optical system 6 to damper (not shown)（damper）Direction fork（Shut-off
State）.
7 is the machined object such as printed base plate, and 8 is the workbench for loading machined object 7, and 9 is in the x-direction and the z-direction
The workbench drive division of workbench 8 is driven, 10 is the X-axis scale of the output pulse when workbench 8 moves ormal weight to X-direction
（scale）, 11 is the Y-axis scale of the output pulse when workbench 8 moves ormal weight to Y-direction.12 is periodically to detect
The regulation amount of movement test section of the movement of the ormal weight of workbench 8, whenever carry out ormal weight it is mobile when by regulation amount of movement inspection
Signal S3 is surveyed to be exported to AOM control units 5.
Fig. 3 is the structure chart of above-mentioned regulation amount of movement test section 12.Regulation amount of movement test section 12 is comprising using from X-axis
The X-axis moving direction in the pulse sensing movement direction of scale 10 is detected circuit 13, is sensed using the pulse from Y-axis scale 11 and moved
The Y-axis moving direction detection circuit 14 in dynamic direction and respectively positive and negative, Y-axis the positive and negative direction pulse to X-axis are counted
Counter 15 ~ 18.
Regulation amount of movement test section 12 also asks for X-axis comprising the count value based on counter 15 ~ 18 according to following formula
With the synthesis counting amount computing circuit 19 of the synthesis counting amount Z of Y-axis and reach setting in synthesis counting amount Z and for example exist
The particular value detection circuit 20 of output regulation amount of movement detection signal S3 after 5 is set in the present embodiment.Here, Xup is counting
The value of device 15, Xdn is the value of counter 16, and Yup is the value of counter 17, and Ydn is the value of counter 18.
（Numerical expression 1）
The laser generation command signal S1 of the fixed cycle from laser generation control unit 2 is input into AOM control units 5,
After exporting regulation amount of movement detection signal S3 from regulation amount of movement test section 12, AOM4 is exported for making from laser generation
The laser pulse L1 of device 1 diverges to optical system 6（On-state）AOM control signals S2.
Fig. 4 is the structure chart of above-mentioned AOM control units 5.When being input into laser generation command signal from laser generation control unit 2
During S1, laser generation command signal S1 time delay t are made by delay circuit 21, moved with from regulation by with circuit 22
The regulation amount of movement detection signal S3 for measuring test section 12 takes logic product.
Output signal with circuit 22 triggers the single-shot trigger circuit 23 of the pulse for producing the stipulated time, and its output signal is
AOM control signals S2.The trailing edge of the output signal of single-shot trigger circuit 23 is lowered by and detects and be to rule along detection circuit 24
Determine the control signal S4 of amount of movement test section 12, reset the count value of counter 15 ~ 18.When the count value quilt of counter 15 ~ 18
During replacement, the synthesis counting amount Z vanishing in synthesis counting amount computing circuit 19.
Here, be the pulse width TA of single-shot trigger circuit 23, but, when by the pulse width of laser generation command signal S1
When being set to TB, to meet TB >=t+TA in the way of set.In the case where making laser pulse be vibrated with the fixed cycle, thereon
Rising edge, the transitional period portion of trailing edge part may not always stablize in each cycle, therefore, if set as described above,
It is then to remove as the unstable region of the laser pulse L1 exported from laser oscillator 1 from the laser pulse L2 of AOM4 outputs
Pulse behind rising edge, trailing edge part.
According to above-mentioned implementation method, it may be difficult to cause energy shift fixed cycle laser pulse via AOM4 according to work
Each the regulation amount of movement for making platform 8 optionally puts on machined object 7, therefore, even if as shown in figure 5, in Laser Processing
Also it is laser pulse the identical spacing P and diameter D with constant speed region B in acceleration region A, decelerating area C, also, they are passed through
Thorough machining area is generally fixed, therefore, it is possible to seek the raising of processing quality.
Additionally, according to above-mentioned implementation method, not using the rising as the unstable region of laser pulse using work in-process
Edge, the mode of trailing edge part are avoided, therefore, and then the raising of processing quality can be sought.
Further, in the above-described embodiment, the fork of the laser pulse L1 from the output of laser oscillator 1 is carried out with AOM, by
This, makes laser pulse L1 point to machine direction, but, it is not limited to this, if it is possible to laser arteries and veins is controlled using electric signal
The pointing direction of punching, then can also use other schemes.
Additionally, in the above-described embodiment, it is stipulated that amount of movement test section 12 is based on from X-axis scale 10, Y-axis scale 11
Pulse detects amount of movement, however, it can be following method：Setting is examined to X-direction, the translational speed of Y direction
The unit of survey, is detected to traveling time and is carried out computing amount of movement, thus, detection X-direction, the amount of movement of Y direction.
The explanation of reference
1 ... laser oscillator, 2 ... laser generation control units, 3 ... laser pulse oscillating units, 4 ... acousto-optic modulators
（AOM）, 5 ... AOM control units, 6 ... optical systems, 7 ... machined objects, 8 ... workbench, 9 ... workbench drive divisions, 10 ... X-axis
Scale, 11 ... Y-axis scales, 12 ... regulation amount of movement test sections, S1 ... laser generations command signal, S2 ... AOM control signals,
S3 ... regulation amount of movements detection signal, L1, L2 ... laser pulse.
Claims (6)
1. a kind of laser processing device, it is characterised in that include：Laser pulse oscillating unit, to the laser pulse of fixed cycle
Vibrated；Light points to unit, by the processing side that each sensing of the laser pulse is used in the processing of machined object
To or the non-processing direction that does not use of work in-process any one；Optical system, it is described to being pointed in light sensing unit
The laser pulse of machine direction carries out light-receiving and is irradiated to machined object；Workbench to loading the machined object drives
Dynamic unit；The mobile amount detection unit of regulation, periodically detects the movement of the ormal weight of the workbench；And control is single
Unit, to the light point to unit be controlled so that the regulation movement amount detection unit detect regulation amount of movement when
Between point, the laser pulse from laser pulse oscillating unit output is pointed to the machine direction, in the regulation amount of movement
During detection unit is not detected by the amount of movement of regulation, point to the laser pulse from laser pulse oscillating unit output
The non-processing direction.
2. laser processing device according to claim 1, it is characterised in that described control unit is controlled, so that
The light comes laser pulse avoids laser pulse transitional period portion in the case of pointing to the machine direction in pointing to unit
Pointed to.
3. the laser processing device described in any one according to claim 1 or 2, it is characterised in that the regulation amount of movement inspection
Survey the composite value of the amount of movement of unit detection two-dimensional directional.
4. a kind of laser processing, is irradiated to machined object to process machined object, it is characterised in that can by laser pulse
Each sensing for the laser pulse exported by the laser pulse oscillating unit vibrated from the laser pulse to the fixed cycle
Any one for the non-processing direction that the machine direction or work in-process used in the processing of machined object are not used, in detection
To the time point of the movable workbench ormal weight for loading the machined object, make swashing from laser pulse oscillating unit vibration
The machine direction is pointed in light pulse, during the movable workbench ormal weight for being not detected by loading the machined object, is made
The non-processing direction is pointed to from the laser pulse of laser pulse oscillating unit vibration.
5. laser processing according to claim 4, it is characterised in that point to the machine direction laser pulse is made
In the case of, the transitional period portion for avoiding the laser pulse is pointed to.
6. the laser processing described in any one according to claim 4 or 5, it is characterised in that the movement of the workbench
The composite value of amount of movement of the detection based on two-dimensional directional.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-257285 | 2012-11-26 | ||
| JP2012257285 | 2012-11-26 | ||
| PCT/JP2013/072796 WO2014080672A1 (en) | 2012-11-26 | 2013-08-27 | Laser machining device and laser machining method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104797373A CN104797373A (en) | 2015-07-22 |
| CN104797373B true CN104797373B (en) | 2017-05-24 |
Family
ID=50775863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380061517.5A Expired - Fee Related CN104797373B (en) | 2012-11-26 | 2013-08-27 | Laser machining device and laser machining method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2014080672A1 (en) |
| KR (1) | KR20150088296A (en) |
| CN (1) | CN104797373B (en) |
| TW (1) | TWI579090B (en) |
| WO (1) | WO2014080672A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6301198B2 (en) * | 2014-05-30 | 2018-03-28 | ビアメカニクス株式会社 | Laser processing apparatus and laser processing method |
| CN106238907A (en) * | 2016-08-22 | 2016-12-21 | 大族激光科技产业集团股份有限公司 | The laser processing of LED wafer |
| JP7386073B2 (en) * | 2019-12-24 | 2023-11-24 | ビアメカニクス株式会社 | Laser processing equipment and laser processing method |
| JP2022098586A (en) * | 2020-12-22 | 2022-07-04 | 大船企業日本株式会社 | Adjusting method of machining point power in aperture mounted on printed circuit board laser processing apparatus, and printed circuit board laser processing apparatus that implements adjusting method of machining point power in aperture mounted on printed circuit board laser processing apparatus |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5627354B2 (en) * | 1973-12-27 | 1981-06-24 | ||
| JP2000210782A (en) * | 1998-02-19 | 2000-08-02 | Ricoh Microelectronics Co Ltd | Machining method and its device |
| JP2002103066A (en) * | 2000-09-25 | 2002-04-09 | Nec Corp | Laser beam machining device |
| JP2005302764A (en) * | 2004-04-06 | 2005-10-27 | Seiko Epson Corp | Wiring board processing method and apparatus thereof |
| US20060191884A1 (en) * | 2005-01-21 | 2006-08-31 | Johnson Shepard D | High-speed, precise, laser-based material processing method and system |
| JP2007054853A (en) * | 2005-08-23 | 2007-03-08 | Sumitomo Heavy Ind Ltd | Laser beam machining device and machining method |
| JP4873578B2 (en) * | 2009-09-07 | 2012-02-08 | 住友重機械工業株式会社 | Laser processing apparatus and method for determining processing conditions |
| JP5756626B2 (en) * | 2010-12-23 | 2015-07-29 | 日本車輌製造株式会社 | Laser processing machine |
| JP5193326B2 (en) * | 2011-02-25 | 2013-05-08 | 三星ダイヤモンド工業株式会社 | Substrate processing apparatus and substrate processing method |
| JP5967913B2 (en) * | 2011-12-08 | 2016-08-10 | キヤノン株式会社 | Laser processing apparatus, laser processing method, and inkjet head substrate |
| KR101384766B1 (en) * | 2012-05-03 | 2014-04-24 | 계명대학교 산학협력단 | machining center for CNC laser machining |
-
2013
- 2013-08-27 KR KR1020157016564A patent/KR20150088296A/en not_active Application Discontinuation
- 2013-08-27 WO PCT/JP2013/072796 patent/WO2014080672A1/en active Application Filing
- 2013-08-27 JP JP2014548479A patent/JPWO2014080672A1/en active Pending
- 2013-08-27 CN CN201380061517.5A patent/CN104797373B/en not_active Expired - Fee Related
- 2013-09-16 TW TW102133460A patent/TWI579090B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014080672A1 (en) | 2014-05-30 |
| TWI579090B (en) | 2017-04-21 |
| JPWO2014080672A1 (en) | 2017-01-05 |
| CN104797373A (en) | 2015-07-22 |
| TW201420244A (en) | 2014-06-01 |
| KR20150088296A (en) | 2015-07-31 |
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Granted publication date: 20170524 Termination date: 20190827 |