WO2014080672A1 - Laser machining device and laser machining method - Google Patents
Laser machining device and laser machining method Download PDFInfo
- Publication number
- WO2014080672A1 WO2014080672A1 PCT/JP2013/072796 JP2013072796W WO2014080672A1 WO 2014080672 A1 WO2014080672 A1 WO 2014080672A1 JP 2013072796 W JP2013072796 W JP 2013072796W WO 2014080672 A1 WO2014080672 A1 WO 2014080672A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- laser
- laser pulse
- movement amount
- processing
- workpiece
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Definitions
- the present invention relates to a laser processing apparatus and a laser processing method for performing groove processing or the like on a workpiece such as a printed board using a laser beam.
- a laser processing apparatus configured to irradiate a printed circuit board with a pulsed laser beam and move the printed circuit board in a direction orthogonal to the optical axis of the laser beam to perform groove processing.
- the present invention eliminates changes in the pitch and diameter of laser pulses in the laser processing acceleration / deceleration region without providing a large-capacity laser oscillator, and can improve the processing quality. It is another object of the present invention to provide a laser processing method.
- a laser pulse oscillating means for oscillating a laser pulse train having a constant period, a laser pulse train outputted from the laser pulse oscillating means,
- An optical directing means capable of selectively directing a laser pulse in a direction used for processing, an optical system for receiving the laser pulse from the light directing means and irradiating the workpiece, and the workpiece.
- predetermined movement amount detection means for periodically detecting a predetermined amount of movement of the table, and when the predetermined movement amount detection means detects a predetermined movement amount, the light directing means Control means for controlling the laser pulses in the laser pulse train output from the laser pulse oscillation means to be directed in the machining direction.
- control unit is configured to change a transient part of the laser pulse output from the laser pulse oscillation unit by the light directing unit. The control is performed so as to avoid the direction of the machining.
- the predetermined movement amount detecting means detects a combined value of movement amounts in a two-dimensional direction.
- a laser pulse train having a constant period is oscillated, and the workpiece is placed.
- the laser pulse in the laser pulse train is selectively directed in the direction used for processing.
- the laser pulse when directing the laser pulse of the laser pulse train in the processing direction, the laser pulse is directed so as to avoid a transitional period of the laser pulse. It is characterized by making it.
- the movement detection of the table is based on a composite value of a movement amount in a two-dimensional direction.
- the laser pulse oscillation means that oscillates a laser pulse with a constant period is used, it is possible to obtain a laser pulse with high energy and less likely to fluctuate without a large-capacity laser oscillator.
- the laser pulse pitch and diameter do not change, and a laser processing apparatus and a laser processing method can be obtained in which uniform processing quality can be obtained throughout the entire processing region.
- FIG. 2 is a timing chart of signals and the like in each unit of the laser processing apparatus shown in FIG. It is a block diagram of the predetermined movement amount detection part in FIG. It is a block diagram of the AOM control signal output circuit in FIG. It is a figure for demonstrating the effect of this invention.
- FIG. 1 is a block diagram of a laser processing apparatus according to an embodiment of the present invention
- FIG. 2 is a timing chart of signals and the like in each part of the laser processing apparatus shown in FIG.
- reference numeral 1 denotes a laser oscillator that generates a laser pulse L1
- reference numeral 2 denotes a laser oscillation control unit that outputs a laser oscillation command signal S1 having a constant period to the laser oscillator 1.
- the laser oscillator 1 outputs the laser pulse L1 only when the laser oscillation command signal S1 is given from the laser oscillation control unit 2, and the laser pulse oscillation means 3 for generating a laser pulse train having a constant cycle by both of them is provided. Composed.
- the laser oscillator 1 has a characteristic that the laser pulse L1 at the rise and fall of the laser oscillation command signal S1 changes in a curve.
- AOM 4 is an acousto-optic modulator (hereinafter abbreviated as AOM) that can selectively control the branch direction of the laser pulse L1 output from the laser oscillator 1 for each laser pulse L1, and 5 is an AOM control signal to the AOM 4.
- An AOM control unit 6 outputs S2 and controls its operation, and 6 is an optical system that irradiates the workpiece with a laser pulse L2 branched from the AOM4.
- the AOM 4 branches the laser pulse L1 from the laser oscillator 1 to the optical system 6 in the processing direction (ON state), while when the AOM control signal S2 is not given, the laser oscillator
- the laser pulse L1 from 1 is branched in the direction of a damper (not shown) so as not to go to the optical system 6 (OFF state).
- a predetermined movement amount detection unit 12 periodically detects a predetermined amount of movement of the table 8 and outputs a predetermined movement amount detection signal S3 to the AOM control unit 5 for every predetermined amount of movement.
- FIG. 3 is a configuration diagram of the predetermined movement amount detection unit 12.
- the predetermined movement amount detection unit 12 includes an X-axis movement direction detection circuit 13 that detects a movement direction by a pulse from the X-axis scale 10, a Y-axis movement direction detection circuit 14 that detects a movement direction by a pulse from the Y-axis scale 11, It includes counters 15 to 18 for counting X-axis positive and negative, Y-axis positive and negative direction pulses, respectively.
- the predetermined movement amount detection unit 12 further includes a combined count amount calculation circuit 19 that obtains a combined count amount Z of the X axis and the Y axis based on the count values of the counters 15 to 18 by the following formula, and the combined count amount Z is a predetermined value For example, it is 5 in this embodiment, and when it reaches this, it includes a specific value detection circuit 20 that outputs a predetermined movement amount detection signal S3.
- Xup is the value of the counter 15
- Xdn is the value of the counter 16
- Yup is the value of the counter 17
- Ydn is the value of the counter 18.
- the AOM control unit 5 is supplied with a laser oscillation command signal S1 with a fixed period from the laser oscillation control unit 2, and when the predetermined movement amount detection signal S3 is output from the predetermined movement amount detection unit 12, An AOM control signal S2 for branching the laser pulse L1 from the laser oscillator 1 to the optical system 6 (ON state) is output to the AOM 4.
- FIG. 4 is a configuration diagram of the AOM control unit 5.
- the laser oscillation command signal S1 is input from the laser oscillation control unit 2
- the laser oscillation command signal S1 is delayed by the delay circuit 21 by time t
- the AND circuit 22 detects the predetermined movement amount from the predetermined movement amount detection unit 12. ANDed with the signal S3.
- the output signal of the AND circuit 22 triggers the one-shot circuit 23 that generates a pulse for a predetermined time, and the output signal becomes the AOM control signal S2.
- the falling edge of the output signal of the one-shot circuit 23 is detected by the falling edge detection circuit 24 and becomes a control signal S4 to the predetermined movement amount detection unit 12, and the count values of the counters 15 to 18 are reset.
- the composite count amount Z in the composite count amount calculation circuit 19 becomes zero.
- the pulse width TA of the one-shot circuit 23 is set to satisfy TB ⁇ t + TA, where TB is the pulse width of the laser oscillation command signal S1.
- TB is the pulse width of the laser oscillation command signal S1.
- a laser pulse having a constant period in which energy fluctuation is unlikely to occur is selectively given to the workpiece 7 for each predetermined movement amount of the table 8 via the AOM 4, and therefore, as shown in FIG.
- the same pitch P and diameter D as the laser pulse in the constant speed region B are obtained, and these are constant throughout the entire processing region, so that the processing quality can be improved. Can do.
- the rising and falling portions which are unstable regions of the laser pulse, are avoided from being used for processing, and therefore the processing quality can be further improved.
- the laser pulse L1 output from the laser oscillator 1 is branched by the AOM, so that the laser pulse L1 is directed in the processing direction.
- Other means may be used as long as it can control the directivity direction.
- the predetermined movement amount detection part 12 detects a movement amount based on the pulse from the X-axis scale 10 and the Y-axis scale 11, it is the X-axis direction and the Y-axis direction.
- a method of detecting the movement amount in the X-axis direction and the Y-axis direction by detecting the movement time and calculating the movement amount may be provided.
- SYMBOLS 1 Laser oscillator, 2 ... Laser oscillation control part, 3 ... Laser pulse oscillation means, 4 ... Acousto-optic modulator (AOM), 5 ... AOM control part, 6 ... Optical System: 7 ... Workpiece, 8 ... Table, 9 ... Table drive unit, 10 ... X-axis scale, 11 ... Y-axis scale, 12 ... Predetermined movement amount detection unit, S1... Laser transmission command signal, S2... AOM control signal, S3... Predetermined movement amount detection signal, L1, L2.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Z=((Xup-Xdn)2+(Yup-Ydn)2)1/2 (Equation 1)
Z = ((Xup−Xdn) 2 + (Yup−Ydn) 2 ) 1/2
DESCRIPTION OF
Claims (6)
- 一定周期のレーザパルス列を発振するレーザパルス発振手段と、当該レーザパルス発振手段から出力されたレーザパルス列を受光し当該レーザパルス列中のレーザパルスを選択的に加工に用いる方向に指向させることができる光指向手段と、当該光指向手段からのレーザパルスを受光し被加工物に照射する光学系と、前記被加工物が載置されるテーブルを駆動する手段と、前記テーブルの所定量の移動を周期的に検出する所定移動量検出手段と、当該所定移動量検出手段が所定の移動量を検出したら、前記光指向手段に対し、前記レーザパルス発振手段から出力されたレーザパルス列中のレーザパルスを前記加工方向に指向させるように制御する制御手段とを含むことを特徴とするレーザ加工装置。 Laser pulse oscillating means for oscillating a laser pulse train having a constant period, and light capable of receiving the laser pulse train output from the laser pulse oscillating means and selectively directing the laser pulses in the laser pulse train in a direction used for processing. A directing means; an optical system for receiving a laser pulse from the light directing means and irradiating the workpiece; a means for driving a table on which the workpiece is placed; and a predetermined amount of movement of the table When the predetermined movement amount detecting means detects the predetermined movement amount and the predetermined movement amount detection means detects the predetermined movement amount, the laser pulse in the laser pulse train output from the laser pulse oscillation means is sent to the light directing means. A laser processing apparatus including control means for controlling the laser beam so as to be directed in a processing direction.
- 請求項1に記載のレーザ加工装置において、前記制御手段は、前記光指向手段が前記レーザパルス発振手段から出力されたレーザパルスの過渡期部を避けて前記加工方向に分岐させるように制御することを特徴とするレーザ加工装置。 2. The laser processing apparatus according to claim 1, wherein the control unit controls the light directing unit to branch in the processing direction while avoiding a transitional period of the laser pulse output from the laser pulse oscillation unit. A laser processing apparatus characterized by the above.
- 請求項1又は2のいずれかのレーザ加工装置において、前記所定移動量検出手段は2次元方向の移動量の合成値を検出することを特徴とするレーザ加工装置。 3. The laser processing apparatus according to claim 1, wherein the predetermined movement amount detecting means detects a combined value of movement amounts in a two-dimensional direction.
- レーザビームを被加工物に照射して被加工物を加工するレーザ加工方法において、一定周期のレーザパルス列を発振させ、前記被加工物が載置されるテーブルが所定量だけ移動したことを検出したら、前記レーザパルス列中のレーザパルスを選択的に加工に用いる方向に指向させることを特徴とするレーザ加工方法。 In a laser processing method for processing a workpiece by irradiating the workpiece with a laser beam, when a laser pulse train having a fixed period is oscillated and it is detected that a table on which the workpiece is placed has moved by a predetermined amount A laser processing method characterized by selectively directing laser pulses in the laser pulse train in a direction used for processing.
- 請求項4に記載のレーザ加工方法において、前記レーザパルス列のレーザパルスを前記加工方向に指向させる場合、当該レーザパルスの過渡期部を避けて指向させることを特徴とするレーザ加工方法。 5. The laser processing method according to claim 4, wherein when directing a laser pulse of the laser pulse train in the processing direction, the laser pulse is directed avoiding a transient part of the laser pulse.
- 請求項4又は5のいずれかのレーザ加工方法において、前記テーブルの移動検出は、2次元方向の移動量の合成値に基づいていることを特徴とするレーザ加工方法。
6. The laser processing method according to claim 4, wherein the movement detection of the table is based on a composite value of a movement amount in a two-dimensional direction.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014548479A JPWO2014080672A1 (en) | 2012-11-26 | 2013-08-27 | Laser processing apparatus and laser processing method |
CN201380061517.5A CN104797373B (en) | 2012-11-26 | 2013-08-27 | Laser machining device and laser machining method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012-257285 | 2012-11-26 | ||
JP2012257285 | 2012-11-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014080672A1 true WO2014080672A1 (en) | 2014-05-30 |
Family
ID=50775863
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2013/072796 WO2014080672A1 (en) | 2012-11-26 | 2013-08-27 | Laser machining device and laser machining method |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2014080672A1 (en) |
KR (1) | KR20150088296A (en) |
CN (1) | CN104797373B (en) |
TW (1) | TWI579090B (en) |
WO (1) | WO2014080672A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015223628A (en) * | 2014-05-30 | 2015-12-14 | ビアメカニクス株式会社 | Laser processor and laser processing method |
CN114654079A (en) * | 2020-12-22 | 2022-06-24 | 达航科技股份有限公司 | Method for adjusting power of machining point and laser machining apparatus for printed circuit board |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106238907A (en) * | 2016-08-22 | 2016-12-21 | 大族激光科技产业集团股份有限公司 | The laser processing of LED wafer |
JP7386073B2 (en) * | 2019-12-24 | 2023-11-24 | ビアメカニクス株式会社 | Laser processing equipment and laser processing method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000210782A (en) * | 1998-02-19 | 2000-08-02 | Ricoh Microelectronics Co Ltd | Machining method and its device |
JP2007054853A (en) * | 2005-08-23 | 2007-03-08 | Sumitomo Heavy Ind Ltd | Laser beam machining device and machining method |
JP2012130959A (en) * | 2010-12-23 | 2012-07-12 | Nippon Sharyo Seizo Kaisha Ltd | Laser processing machine |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5627354B2 (en) * | 1973-12-27 | 1981-06-24 | ||
JP2002103066A (en) * | 2000-09-25 | 2002-04-09 | Nec Corp | Laser beam machining device |
JP2005302764A (en) * | 2004-04-06 | 2005-10-27 | Seiko Epson Corp | Wiring board processing method and apparatus thereof |
US20060191884A1 (en) * | 2005-01-21 | 2006-08-31 | Johnson Shepard D | High-speed, precise, laser-based material processing method and system |
JP4873578B2 (en) * | 2009-09-07 | 2012-02-08 | 住友重機械工業株式会社 | Laser processing apparatus and method for determining processing conditions |
JP5193326B2 (en) * | 2011-02-25 | 2013-05-08 | 三星ダイヤモンド工業株式会社 | Substrate processing apparatus and substrate processing method |
JP5967913B2 (en) * | 2011-12-08 | 2016-08-10 | キヤノン株式会社 | Laser processing apparatus, laser processing method, and inkjet head substrate |
KR101384766B1 (en) * | 2012-05-03 | 2014-04-24 | 계명대학교 산학협력단 | machining center for CNC laser machining |
-
2013
- 2013-08-27 KR KR1020157016564A patent/KR20150088296A/en not_active Application Discontinuation
- 2013-08-27 WO PCT/JP2013/072796 patent/WO2014080672A1/en active Application Filing
- 2013-08-27 JP JP2014548479A patent/JPWO2014080672A1/en active Pending
- 2013-08-27 CN CN201380061517.5A patent/CN104797373B/en not_active Expired - Fee Related
- 2013-09-16 TW TW102133460A patent/TWI579090B/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000210782A (en) * | 1998-02-19 | 2000-08-02 | Ricoh Microelectronics Co Ltd | Machining method and its device |
JP2007054853A (en) * | 2005-08-23 | 2007-03-08 | Sumitomo Heavy Ind Ltd | Laser beam machining device and machining method |
JP2012130959A (en) * | 2010-12-23 | 2012-07-12 | Nippon Sharyo Seizo Kaisha Ltd | Laser processing machine |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015223628A (en) * | 2014-05-30 | 2015-12-14 | ビアメカニクス株式会社 | Laser processor and laser processing method |
CN114654079A (en) * | 2020-12-22 | 2022-06-24 | 达航科技股份有限公司 | Method for adjusting power of machining point and laser machining apparatus for printed circuit board |
CN114654079B (en) * | 2020-12-22 | 2024-06-11 | 达航科技股份有限公司 | Processing point power adjusting method and printed substrate laser processing device |
Also Published As
Publication number | Publication date |
---|---|
KR20150088296A (en) | 2015-07-31 |
JPWO2014080672A1 (en) | 2017-01-05 |
TW201420244A (en) | 2014-06-01 |
TWI579090B (en) | 2017-04-21 |
CN104797373B (en) | 2017-05-24 |
CN104797373A (en) | 2015-07-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6362130B2 (en) | Laser processing method and laser processing apparatus | |
WO2014080672A1 (en) | Laser machining device and laser machining method | |
JP6011598B2 (en) | Laser welding method | |
JP6496340B2 (en) | Scanner control device, robot control device, and remote laser welding robot system | |
TW492901B (en) | Laser processing apparatus | |
JP2010184289A (en) | Laser beam machining method, laser beam machining apparatus and solar panel manufacturing method | |
WO2020036021A1 (en) | Laser processing machine and laser processing method | |
JP2011224618A (en) | Laser beam welding method | |
JP5628524B2 (en) | Processing control device, laser processing device, and processing control method | |
KR101897337B1 (en) | Method and device for laser machining a substrate with multiple deflections of a laser radiation | |
JP6244622B2 (en) | Control device, control program, and control method | |
JP6301198B2 (en) | Laser processing apparatus and laser processing method | |
JP2002273584A (en) | Laser beam machining device | |
KR101392982B1 (en) | Apparatus and method for controlling scanner | |
CN110014236B (en) | Laser processing device, laser processing method, and recording medium for recording program for the same | |
JP2015157312A (en) | Laser processing method and laser processing apparatus of composite material | |
JP5731868B2 (en) | Laser processing method and processing apparatus | |
JP2014111259A (en) | Laser processing method, laser processing device, and laser processing program | |
JP5319175B2 (en) | Pattern drawing method and apparatus | |
KR101154536B1 (en) | Appraratus for mamufacturing pattern on a light guide plate | |
WO2011118909A3 (en) | Apparatus and method for machining light guide plate using laser | |
WO2024057784A1 (en) | Numerical control device and driving system | |
JP2007108605A (en) | Controller and control method for galvano mirror | |
Wetzig | Developments in beam scanning (remote) technologies and smart beam processing | |
TW202114952A (en) | Method for processing end surface of glass substrate and device for processing end surface of glass substrate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13856778 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2014548479 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20157016564 Country of ref document: KR Kind code of ref document: A |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 13856778 Country of ref document: EP Kind code of ref document: A1 |