WO2014080672A1 - Laser machining device and laser machining method - Google Patents
Laser machining device and laser machining method Download PDFInfo
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- WO2014080672A1 WO2014080672A1 PCT/JP2013/072796 JP2013072796W WO2014080672A1 WO 2014080672 A1 WO2014080672 A1 WO 2014080672A1 JP 2013072796 W JP2013072796 W JP 2013072796W WO 2014080672 A1 WO2014080672 A1 WO 2014080672A1
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- laser pulse
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Definitions
- the present invention relates to a laser processing apparatus and a laser processing method for performing groove processing or the like on a workpiece such as a printed board using a laser beam.
- a laser processing apparatus configured to irradiate a printed circuit board with a pulsed laser beam and move the printed circuit board in a direction orthogonal to the optical axis of the laser beam to perform groove processing.
- the present invention eliminates changes in the pitch and diameter of laser pulses in the laser processing acceleration / deceleration region without providing a large-capacity laser oscillator, and can improve the processing quality. It is another object of the present invention to provide a laser processing method.
- a laser pulse oscillating means for oscillating a laser pulse train having a constant period, a laser pulse train outputted from the laser pulse oscillating means,
- An optical directing means capable of selectively directing a laser pulse in a direction used for processing, an optical system for receiving the laser pulse from the light directing means and irradiating the workpiece, and the workpiece.
- predetermined movement amount detection means for periodically detecting a predetermined amount of movement of the table, and when the predetermined movement amount detection means detects a predetermined movement amount, the light directing means Control means for controlling the laser pulses in the laser pulse train output from the laser pulse oscillation means to be directed in the machining direction.
- control unit is configured to change a transient part of the laser pulse output from the laser pulse oscillation unit by the light directing unit. The control is performed so as to avoid the direction of the machining.
- the predetermined movement amount detecting means detects a combined value of movement amounts in a two-dimensional direction.
- a laser pulse train having a constant period is oscillated, and the workpiece is placed.
- the laser pulse in the laser pulse train is selectively directed in the direction used for processing.
- the laser pulse when directing the laser pulse of the laser pulse train in the processing direction, the laser pulse is directed so as to avoid a transitional period of the laser pulse. It is characterized by making it.
- the movement detection of the table is based on a composite value of a movement amount in a two-dimensional direction.
- the laser pulse oscillation means that oscillates a laser pulse with a constant period is used, it is possible to obtain a laser pulse with high energy and less likely to fluctuate without a large-capacity laser oscillator.
- the laser pulse pitch and diameter do not change, and a laser processing apparatus and a laser processing method can be obtained in which uniform processing quality can be obtained throughout the entire processing region.
- FIG. 2 is a timing chart of signals and the like in each unit of the laser processing apparatus shown in FIG. It is a block diagram of the predetermined movement amount detection part in FIG. It is a block diagram of the AOM control signal output circuit in FIG. It is a figure for demonstrating the effect of this invention.
- FIG. 1 is a block diagram of a laser processing apparatus according to an embodiment of the present invention
- FIG. 2 is a timing chart of signals and the like in each part of the laser processing apparatus shown in FIG.
- reference numeral 1 denotes a laser oscillator that generates a laser pulse L1
- reference numeral 2 denotes a laser oscillation control unit that outputs a laser oscillation command signal S1 having a constant period to the laser oscillator 1.
- the laser oscillator 1 outputs the laser pulse L1 only when the laser oscillation command signal S1 is given from the laser oscillation control unit 2, and the laser pulse oscillation means 3 for generating a laser pulse train having a constant cycle by both of them is provided. Composed.
- the laser oscillator 1 has a characteristic that the laser pulse L1 at the rise and fall of the laser oscillation command signal S1 changes in a curve.
- AOM 4 is an acousto-optic modulator (hereinafter abbreviated as AOM) that can selectively control the branch direction of the laser pulse L1 output from the laser oscillator 1 for each laser pulse L1, and 5 is an AOM control signal to the AOM 4.
- An AOM control unit 6 outputs S2 and controls its operation, and 6 is an optical system that irradiates the workpiece with a laser pulse L2 branched from the AOM4.
- the AOM 4 branches the laser pulse L1 from the laser oscillator 1 to the optical system 6 in the processing direction (ON state), while when the AOM control signal S2 is not given, the laser oscillator
- the laser pulse L1 from 1 is branched in the direction of a damper (not shown) so as not to go to the optical system 6 (OFF state).
- a predetermined movement amount detection unit 12 periodically detects a predetermined amount of movement of the table 8 and outputs a predetermined movement amount detection signal S3 to the AOM control unit 5 for every predetermined amount of movement.
- FIG. 3 is a configuration diagram of the predetermined movement amount detection unit 12.
- the predetermined movement amount detection unit 12 includes an X-axis movement direction detection circuit 13 that detects a movement direction by a pulse from the X-axis scale 10, a Y-axis movement direction detection circuit 14 that detects a movement direction by a pulse from the Y-axis scale 11, It includes counters 15 to 18 for counting X-axis positive and negative, Y-axis positive and negative direction pulses, respectively.
- the predetermined movement amount detection unit 12 further includes a combined count amount calculation circuit 19 that obtains a combined count amount Z of the X axis and the Y axis based on the count values of the counters 15 to 18 by the following formula, and the combined count amount Z is a predetermined value For example, it is 5 in this embodiment, and when it reaches this, it includes a specific value detection circuit 20 that outputs a predetermined movement amount detection signal S3.
- Xup is the value of the counter 15
- Xdn is the value of the counter 16
- Yup is the value of the counter 17
- Ydn is the value of the counter 18.
- the AOM control unit 5 is supplied with a laser oscillation command signal S1 with a fixed period from the laser oscillation control unit 2, and when the predetermined movement amount detection signal S3 is output from the predetermined movement amount detection unit 12, An AOM control signal S2 for branching the laser pulse L1 from the laser oscillator 1 to the optical system 6 (ON state) is output to the AOM 4.
- FIG. 4 is a configuration diagram of the AOM control unit 5.
- the laser oscillation command signal S1 is input from the laser oscillation control unit 2
- the laser oscillation command signal S1 is delayed by the delay circuit 21 by time t
- the AND circuit 22 detects the predetermined movement amount from the predetermined movement amount detection unit 12. ANDed with the signal S3.
- the output signal of the AND circuit 22 triggers the one-shot circuit 23 that generates a pulse for a predetermined time, and the output signal becomes the AOM control signal S2.
- the falling edge of the output signal of the one-shot circuit 23 is detected by the falling edge detection circuit 24 and becomes a control signal S4 to the predetermined movement amount detection unit 12, and the count values of the counters 15 to 18 are reset.
- the composite count amount Z in the composite count amount calculation circuit 19 becomes zero.
- the pulse width TA of the one-shot circuit 23 is set to satisfy TB ⁇ t + TA, where TB is the pulse width of the laser oscillation command signal S1.
- TB is the pulse width of the laser oscillation command signal S1.
- a laser pulse having a constant period in which energy fluctuation is unlikely to occur is selectively given to the workpiece 7 for each predetermined movement amount of the table 8 via the AOM 4, and therefore, as shown in FIG.
- the same pitch P and diameter D as the laser pulse in the constant speed region B are obtained, and these are constant throughout the entire processing region, so that the processing quality can be improved. Can do.
- the rising and falling portions which are unstable regions of the laser pulse, are avoided from being used for processing, and therefore the processing quality can be further improved.
- the laser pulse L1 output from the laser oscillator 1 is branched by the AOM, so that the laser pulse L1 is directed in the processing direction.
- Other means may be used as long as it can control the directivity direction.
- the predetermined movement amount detection part 12 detects a movement amount based on the pulse from the X-axis scale 10 and the Y-axis scale 11, it is the X-axis direction and the Y-axis direction.
- a method of detecting the movement amount in the X-axis direction and the Y-axis direction by detecting the movement time and calculating the movement amount may be provided.
- SYMBOLS 1 Laser oscillator, 2 ... Laser oscillation control part, 3 ... Laser pulse oscillation means, 4 ... Acousto-optic modulator (AOM), 5 ... AOM control part, 6 ... Optical System: 7 ... Workpiece, 8 ... Table, 9 ... Table drive unit, 10 ... X-axis scale, 11 ... Y-axis scale, 12 ... Predetermined movement amount detection unit, S1... Laser transmission command signal, S2... AOM control signal, S3... Predetermined movement amount detection signal, L1, L2.
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Abstract
The present invention is designed to improve machining quality by eliminating variations in laser pulse pitch and diameter in the acceleration and deceleration regions of laser machining. This laser machining device is characterized in comprising: a laser pulse generation means for generating a laser pulse sequence of a constant period; a light-directing means capable of receiving the laser pulse sequence output from the laser pulse generation means and selectively directing the laser pulses in the laser pulse sequence in the direction to be used for the machining; an optical system for receiving the laser pulses from the light-directing means and irradiating same on the workpiece; a means for driving the table on which the workpiece is loaded; a specified movement amount-detecting means for periodically detecting a specified amount of table movement; and a control means for performing control so that when the specified movement amount-detecting means detects the specified movement amount, laser pulses in the laser pulse sequence output from the laser pulse generation means are directed in the machining direction.
Description
本発明は、レーザビームを用いてプリント基板のような被加工物に溝加工等を行うレーザ加工装置及びレーザ加工方法に関する。
The present invention relates to a laser processing apparatus and a laser processing method for performing groove processing or the like on a workpiece such as a printed board using a laser beam.
従来より、パルス出力されるレーザビームをプリント基板に照射するとともに、レーザビームの光軸と直交する方向にプリント基板を移動させ、溝加工ができるように構成されたレーザ加工装置が知られている。
2. Description of the Related Art Conventionally, there is known a laser processing apparatus configured to irradiate a printed circuit board with a pulsed laser beam and move the printed circuit board in a direction orthogonal to the optical axis of the laser beam to perform groove processing. .
このようなレーザ加工装置において、加工線に沿ってプリント基板を移動させる場合、加工開始時には加速、加工終了時には減速が生じる。また直線を折り曲げた折曲部や曲率が大きな曲線部では、移動方向が大きく変化するので、直線部や曲率の小さな曲線部に比べて減速する必要がある。
In such a laser processing apparatus, when a printed circuit board is moved along a processing line, acceleration occurs at the start of processing and deceleration occurs at the end of processing. Further, since the moving direction changes greatly in a bent portion obtained by bending a straight line or a curved portion having a large curvature, it is necessary to decelerate compared to a straight portion or a curved portion having a small curvature.
ところが、これら加減速領域では、レーザパルスのピッチが一定にならず、レーザパルスによる熱が過多となって、溝の幅と深さが均一にならず、加工品質が悪くなる問題があった。
However, in these acceleration / deceleration regions, there is a problem that the pitch of the laser pulse is not constant, the heat due to the laser pulse is excessive, the width and depth of the groove are not uniform, and the processing quality is deteriorated.
このような問題を解決するものとして、例えば特許文献１、２、３及び４に開示されるように、被加工物の移動速度等を検出し、検出された移動速度等に応じてレーザパルスの出力タイミングを制御するものがある。
In order to solve such a problem, for example, as disclosed in Patent Documents 1, 2, 3, and 4, the moving speed of the workpiece is detected, and the laser pulse is detected according to the detected moving speed. Some control output timing.
しかしながら、これらの従来技術は、いずれも、加減速領域においてレーザ発振器の周波数を変化させることになるので、レーザ発振器にエネルギー変動が起こってビーム径が変化してしまい、溝幅、溝深さが変わる等、依然として加工品質が悪くなる欠点があった。
However, both of these conventional techniques change the frequency of the laser oscillator in the acceleration / deceleration region, so that energy fluctuation occurs in the laser oscillator and the beam diameter changes, and the groove width and groove depth are reduced. There was a drawback that the processing quality still deteriorated, such as changing.
一方、エネルギー変動を小さくするため、連続的にレーザを出力させておき、そこからレーザパルスを取出す方法も考えられるが、この方式だと、高エネルギーのレーザパルスを得ることが困難で、被加工物への必要な加工ができなくなり、大容量のレーザ発振器を備えなければならない欠点がある。
On the other hand, in order to reduce the energy fluctuation, it is possible to output laser continuously from the laser and take out the laser pulse from it. However, with this method, it is difficult to obtain a high energy laser pulse. There is a disadvantage that a necessary processing to an object cannot be performed and a large-capacity laser oscillator must be provided.
そこで、本発明は、大容量のレーザ発振器を備えなくても、レーザ加工の加減速領域において、レーザパルスのピッチと径が変化することを無くし、加工品質の向上を図ることができるレーザ加工装置及びレーザ加工方法を提供することを目的とするものである。
Therefore, the present invention eliminates changes in the pitch and diameter of laser pulses in the laser processing acceleration / deceleration region without providing a large-capacity laser oscillator, and can improve the processing quality. It is another object of the present invention to provide a laser processing method.
上記課題を解決するため、請求項１に記載のレーザ加工装置においては、一定周期のレーザパルス列を発振するレーザパルス発振手段と、当該レーザパルス発振手段から出力されたレーザパルス列を受光し当該レーザパルス列中のレーザパルスを選択的に加工に用いる方向に指向させることができる光指向手段と、当該光指向手段からのレーザパルスを受光し被加工物に照射する光学系と、前記被加工物が載置されるテーブルを駆動する手段と、前記テーブルの所定量の移動を周期的に検出する所定移動量検出手段と、当該所定移動量検出手段が所定の移動量を検出したら、前記光指向手段に対し、前記レーザパルス発振手段から出力されたレーザパルス列中のレーザパルスを前記加工方向に指向させるように制御する制御手段とを含むことを特徴とする。
In order to solve the above-mentioned problem, in the laser processing apparatus according to claim 1, a laser pulse oscillating means for oscillating a laser pulse train having a constant period, a laser pulse train outputted from the laser pulse oscillating means, An optical directing means capable of selectively directing a laser pulse in a direction used for processing, an optical system for receiving the laser pulse from the light directing means and irradiating the workpiece, and the workpiece. Means for driving a table placed thereon, predetermined movement amount detection means for periodically detecting a predetermined amount of movement of the table, and when the predetermined movement amount detection means detects a predetermined movement amount, the light directing means Control means for controlling the laser pulses in the laser pulse train output from the laser pulse oscillation means to be directed in the machining direction. The features.
また請求項２に記載のレーザ加工装置においては、請求項１に記載のレーザ加工装置において、前記制御手段は、前記光指向手段が前記レーザパルス発振手段から出力されたレーザパルスの過渡期部を避けて前記加工方向に指向させるように制御することを特徴とする。
In the laser processing apparatus according to claim 2, in the laser processing apparatus according to claim 1, the control unit is configured to change a transient part of the laser pulse output from the laser pulse oscillation unit by the light directing unit. The control is performed so as to avoid the direction of the machining.
また請求項３に記載のレーザ加工装置においては、請求項１又は２のいずれかに記載のレーザ加工装置において、前記所定移動量検出手段は２次元方向の移動量の合成値を検出することを特徴とする。
According to a third aspect of the present invention, in the laser processing apparatus according to the first or second aspect, the predetermined movement amount detecting means detects a combined value of movement amounts in a two-dimensional direction. Features.
また請求項４に記載のレーザ加工方法においては、レーザビームを被加工物に照射して被加工物を加工するレーザ加工方法において、一定周期のレーザパルス列を発振させ、前記被加工物が載置されるテーブルが所定量だけ移動したことを検出したら、前記レーザパルス列中のレーザパルスを選択的に加工に用いる方向に指向させることを特徴とする。
Further, in the laser processing method according to claim 4, in the laser processing method for processing a workpiece by irradiating the workpiece with a laser beam, a laser pulse train having a constant period is oscillated, and the workpiece is placed. When it is detected that the table to be moved has moved by a predetermined amount, the laser pulse in the laser pulse train is selectively directed in the direction used for processing.
また請求項５に記載のレーザ加工方法においては、請求項４に記載のレーザ加工方法において、前記レーザパルス列のレーザパルスを前記加工方向に指向させる場合、当該レーザパルスの過渡期部を避けて指向させることを特徴とする。
Further, in the laser processing method according to claim 5, in the laser processing method according to claim 4, when directing the laser pulse of the laser pulse train in the processing direction, the laser pulse is directed so as to avoid a transitional period of the laser pulse. It is characterized by making it.
また請求項６に記載のレーザ加工方法においては、請求項４又は５のいずれかのレーザ加工方法において、前記テーブルの移動検出は、２次元方向の移動量の合成値に基づいていることを特徴とする。
Further, in the laser processing method according to claim 6, in the laser processing method according to claim 4 or 5, the movement detection of the table is based on a composite value of a movement amount in a two-dimensional direction. And
本発明によれば、一定周期のレーザパルスを発振するレーザパルス発振手段を用いるので、大容量のレーザ発振器を備えなくても、高いエネルギーで、しかもエネルギー変動が起こりにくいレーザパルスを得ることができ、レーザ加工の加減速領域においても、レーザパルスのピッチと径が変化しなくなり、加工領域全体を通して一様な加工品質が得られるレーザ加工装置及びレーザ加工方法が得られる。
According to the present invention, since the laser pulse oscillation means that oscillates a laser pulse with a constant period is used, it is possible to obtain a laser pulse with high energy and less likely to fluctuate without a large-capacity laser oscillator. In the laser processing acceleration / deceleration region, the laser pulse pitch and diameter do not change, and a laser processing apparatus and a laser processing method can be obtained in which uniform processing quality can be obtained throughout the entire processing region.
本発明の一実施例について説明する。図１は本発明の一実施例となるレーザ加工装置のブロック図、図２は図１に示したレーザ加工装置の各部における信号等のタイミング図である。
An embodiment of the present invention will be described. FIG. 1 is a block diagram of a laser processing apparatus according to an embodiment of the present invention, and FIG. 2 is a timing chart of signals and the like in each part of the laser processing apparatus shown in FIG.
図１において、１はレーザパルスＬ１を発生するレーザ発振器、２はレーザ発振器１に一定周期のレーザ発振指令信号Ｓ１を出力するレーザ発振制御部である。レーザ発振器１はレーザ発振制御部２からレーザ発振指令信号Ｓ１が与えられた時のみ、レーザパルスＬ１を出力するようになっており、両者によって一定周期のレーザパルス列を発生するレーザパルス発振手段３が構成される。レーザ発振器１は、レーザ発振指令信号Ｓ１の立上がり時、立下がり時におけるレーザパルスＬ１が、曲線状の変化をする特性を持っている。４はレーザ発振器１から出力されたレーザパルスＬ１の分岐方向の制御を個々のレーザパルスＬ１毎に選択的に行うことができる音響光変調器（以下ＡＯＭと略す）、５はＡＯＭ４にＡＯＭ制御信号Ｓ２を出力してその動作を制御するＡＯＭ制御部、６はＡＯＭ４から分岐されたレーザパルスＬ２を被加工物に照射する光学系である。
1, reference numeral 1 denotes a laser oscillator that generates a laser pulse L1, and reference numeral 2 denotes a laser oscillation control unit that outputs a laser oscillation command signal S1 having a constant period to the laser oscillator 1. The laser oscillator 1 outputs the laser pulse L1 only when the laser oscillation command signal S1 is given from the laser oscillation control unit 2, and the laser pulse oscillation means 3 for generating a laser pulse train having a constant cycle by both of them is provided. Composed. The laser oscillator 1 has a characteristic that the laser pulse L1 at the rise and fall of the laser oscillation command signal S1 changes in a curve. 4 is an acousto-optic modulator (hereinafter abbreviated as AOM) that can selectively control the branch direction of the laser pulse L1 output from the laser oscillator 1 for each laser pulse L1, and 5 is an AOM control signal to the AOM 4. An AOM control unit 6 outputs S2 and controls its operation, and 6 is an optical system that irradiates the workpiece with a laser pulse L2 branched from the AOM4.
ＡＯＭ４はＡＯＭ制御信号Ｓ２が与えられた時、レーザ発振器１からのレーザパルスＬ１を加工方向となる光学系６に分岐させ（オン状態）、一方、ＡＯＭ制御信号Ｓ２が与えられない時、レーザ発振器１からのレーザパルスＬ１を光学系６に向かないよう、図示しないダンパーの方向に分岐させる（オフ状態）。
When the AOM control signal S2 is given, the AOM 4 branches the laser pulse L1 from the laser oscillator 1 to the optical system 6 in the processing direction (ON state), while when the AOM control signal S2 is not given, the laser oscillator The laser pulse L1 from 1 is branched in the direction of a damper (not shown) so as not to go to the optical system 6 (OFF state).
７はプリント基板の如き被加工物、８は被加工物７を載置するテーブル、９はテーブル８をＸ方向及びＹ方向に駆動するテーブル駆動部、１０はテーブル８がＸ方向へ所定量だけ移動する毎にパルスを出力するＸ軸スケール、１１はテーブル８がＹ方向へ所定量だけ移動する毎にパルスを出力するＹ軸スケールである。１２はテーブル８の所定量の移動を周期的に検出する所定移動量検出部であり、所定量の移動毎に所定移動量検出信号Ｓ３をＡＯＭ制御部５へ出力する。
7 is a workpiece such as a printed circuit board, 8 is a table on which the workpiece 7 is placed, 9 is a table drive unit that drives the table 8 in the X and Y directions, and 10 is a predetermined amount of the table 8 in the X direction. An X-axis scale that outputs a pulse every time it moves, and 11 is a Y-axis scale that outputs a pulse every time the table 8 moves a predetermined amount in the Y direction. A predetermined movement amount detection unit 12 periodically detects a predetermined amount of movement of the table 8 and outputs a predetermined movement amount detection signal S3 to the AOM control unit 5 for every predetermined amount of movement.
図３は上記所定移動量検出部１２の構成図である。所定移動量検出部１２は、Ｘ軸スケール１０からのパルスにより移動方向を検知するＸ軸移動方向検出回路１３、Ｙ軸スケール１１からのパルスにより移動方向を検知するＹ軸移動方向検出回路１４、Ｘ軸の正、負、Ｙ軸の正、負方向パルスをそれぞれカウントするカウンタ１５～１８を含む。
FIG. 3 is a configuration diagram of the predetermined movement amount detection unit 12. The predetermined movement amount detection unit 12 includes an X-axis movement direction detection circuit 13 that detects a movement direction by a pulse from the X-axis scale 10, a Y-axis movement direction detection circuit 14 that detects a movement direction by a pulse from the Y-axis scale 11, It includes counters 15 to 18 for counting X-axis positive and negative, Y-axis positive and negative direction pulses, respectively.
所定移動量検出部１２は、さらにカウンタ１５～１８のカウント値に基づきＸ軸とＹ軸の合成カウント量Ｚを以下の式により求める合成カウント量演算回路１９と、この合成カウント量Ｚが所定値、例えば本実施例では５とし、これに達したら所定移動量検出信号Ｓ３を出力する特定値検出回路２０とを含む。ここで、Xupはカウンタ１５の値、Xdnはカウンタ１６の値、Yupはカウンタ１７の値、Ydnはカウンタ１８の値である。
The predetermined movement amount detection unit 12 further includes a combined count amount calculation circuit 19 that obtains a combined count amount Z of the X axis and the Y axis based on the count values of the counters 15 to 18 by the following formula, and the combined count amount Z is a predetermined value For example, it is 5 in this embodiment, and when it reaches this, it includes a specific value detection circuit 20 that outputs a predetermined movement amount detection signal S3. Here, Xup is the value of the counter 15, Xdn is the value of the counter 16, Yup is the value of the counter 17, and Ydn is the value of the counter 18.
（数１）
Z＝((Xup－Xdn)2＋(Yup－Ydn)2)1/2 (Equation 1)
Z = ((Xup−Xdn) 2 + (Yup−Ydn) 2 ) 1/2
Z＝((Xup－Xdn)2＋(Yup－Ydn)2)1/2 (Equation 1)
Z = ((Xup−Xdn) 2 + (Yup−Ydn) 2 ) 1/2
ＡＯＭ制御部５には、レーザ発振制御部２からの一定周期のレーザ発振指令信号Ｓ１が入力されるようになっており、所定移動量検出部１２から所定移動量検出信号Ｓ３が出力されたら、ＡＯＭ４に対しレーザ発振器１からのレーザパルスＬ１を光学系６に分岐させる（オン状態）ためのＡＯＭ制御信号Ｓ２を出力する。
The AOM control unit 5 is supplied with a laser oscillation command signal S1 with a fixed period from the laser oscillation control unit 2, and when the predetermined movement amount detection signal S3 is output from the predetermined movement amount detection unit 12, An AOM control signal S2 for branching the laser pulse L1 from the laser oscillator 1 to the optical system 6 (ON state) is output to the AOM 4.
図４は上記ＡＯＭ制御部５の構成図である。レーザ発振制御部２からレーザ発振指令信号Ｓ１が入力されると、当該レーザ発振指令信号Ｓ１を時間ｔだけ遅延回路２１により遅延させ、アンド回路２２により所定移動量検出部１２からの所定移動量検出信号Ｓ３と論理積をとる。
FIG. 4 is a configuration diagram of the AOM control unit 5. When the laser oscillation command signal S1 is input from the laser oscillation control unit 2, the laser oscillation command signal S1 is delayed by the delay circuit 21 by time t, and the AND circuit 22 detects the predetermined movement amount from the predetermined movement amount detection unit 12. ANDed with the signal S3.
アンド回路２２の出力信号は所定時間のパルスを発生するワンショット回路２３をトリガし、その出力信号がＡＯＭ制御信号Ｓ２となる。ワンショット回路２３の出力信号の立下りは、立下り検出回路２４により検出され、所定移動量検出部１２への制御信号Ｓ４となって、カウンタ１５～１８のカウント値をリセットする。カウンタ１５～１８のカウント値がリセットされると、合成カウント量演算回路１９における合成カウント量Ｚはゼロになる。
The output signal of the AND circuit 22 triggers the one-shot circuit 23 that generates a pulse for a predetermined time, and the output signal becomes the AOM control signal S2. The falling edge of the output signal of the one-shot circuit 23 is detected by the falling edge detection circuit 24 and becomes a control signal S4 to the predetermined movement amount detection unit 12, and the count values of the counters 15 to 18 are reset. When the count values of the counters 15 to 18 are reset, the composite count amount Z in the composite count amount calculation circuit 19 becomes zero.
ここで、ワンショット回路２３のパルス幅ＴＡであるが、レーザ発振指令信号Ｓ１のパルス幅をＴＢとすると、ＴＢ≧ｔ＋ＴＡを満たすように設定されている。レーザパルスを一定周期で発振させた場合、その立上がりや立下り部分の過渡期部は、各周期でいつも安定しているとは限らないので、前記のように設定されていれば、ＡＯＭ４から出力されるレーザパルスＬ２は、レーザ発振器１から出力されるレーザパルスＬ１の不安定領域である立上がり、立下り部分が除去されたものとなる。
Here, the pulse width TA of the one-shot circuit 23 is set to satisfy TB ≧ t + TA, where TB is the pulse width of the laser oscillation command signal S1. When the laser pulse is oscillated at a certain period, the transition period at the rising and falling parts is not always stable at each period, so if it is set as described above, the output from the AOM 4 The laser pulse L <b> 2 is obtained by removing rising and falling portions that are unstable regions of the laser pulse L <b> 1 output from the laser oscillator 1.
上記実施形態によれば、エネルギー変動が起こりにくい一定周期のレーザパルスを、ＡＯＭ４を介して、テーブル８の所定移動量毎に選択的に被加工物７に与えるようにしたので、図５に示すように、レーザ加工の加速領域Ａ、減速領域Ｃにおいても、定速領域Ｂのレーザパルスと同じピッチＰと径Ｄとなり、加工領域全体を通してこれらが一定になるので、加工品質の向上を図ることができる。
According to the above-described embodiment, a laser pulse having a constant period in which energy fluctuation is unlikely to occur is selectively given to the workpiece 7 for each predetermined movement amount of the table 8 via the AOM 4, and therefore, as shown in FIG. Thus, in the acceleration region A and the deceleration region C of the laser processing, the same pitch P and diameter D as the laser pulse in the constant speed region B are obtained, and these are constant throughout the entire processing region, so that the processing quality can be improved. Can do.
また上記実施形態によれば、レーザパルスの不安定領域である立上がり、立下り部分が加工に使われないように避けているので、さらに加工品質の向上を図ることができる。
Further, according to the above embodiment, the rising and falling portions, which are unstable regions of the laser pulse, are avoided from being used for processing, and therefore the processing quality can be further improved.
なお、上記実施形態においては、レーザ発振器１から出力されたレーザパルスＬ１の分岐をＡＯＭで行うことで、レーザパルスＬ１を加工方向へ指向させているが、これに限らず、電気信号によりレーザパルスの指向方向を制御できるものなら他の手段を用いても良い。
In the above-described embodiment, the laser pulse L1 output from the laser oscillator 1 is branched by the AOM, so that the laser pulse L1 is directed in the processing direction. Other means may be used as long as it can control the directivity direction.
また、上記実施形態においては、所定移動量検出部１２は、Ｘ軸スケール１０、Ｙ軸スケール１１からのパルスに基づいて移動量を検出するようになっているが、Ｘ軸方向、Ｙ軸方向の移動速度を検出する手段を設け、移動時間を検出して移動量を演算することで、Ｘ軸方向、Ｙ軸方向の移動量を検出する方法でも良い。
Moreover, in the said embodiment, although the predetermined movement amount detection part 12 detects a movement amount based on the pulse from the X-axis scale 10 and the Y-axis scale 11, it is the X-axis direction and the Y-axis direction. A method of detecting the movement amount in the X-axis direction and the Y-axis direction by detecting the movement time and calculating the movement amount may be provided.
１・・・レーザ発振器、２・・・レーザ発振制御部、３・・・レーザパルス発振手段、４・・・音響光学変調器（ＡＯＭ）、５・・・AOM制御部、６・・・光学系、７・・・被加工物、８・・・テーブル、９・・・テーブル駆動部、１０・・・Ｘ軸スケール、１１・・・Ｙ軸スケール、１２・・・所定移動量検出部、Ｓ１・・・レーザ発信指令信号、Ｓ２・・・ＡＯＭ制御信号、Ｓ３・・・所定移動量検出信号、Ｌ１、Ｌ２・・・レーザパルス。
DESCRIPTION OFSYMBOLS 1 ... Laser oscillator, 2 ... Laser oscillation control part, 3 ... Laser pulse oscillation means, 4 ... Acousto-optic modulator (AOM), 5 ... AOM control part, 6 ... Optical System: 7 ... Workpiece, 8 ... Table, 9 ... Table drive unit, 10 ... X-axis scale, 11 ... Y-axis scale, 12 ... Predetermined movement amount detection unit, S1... Laser transmission command signal, S2... AOM control signal, S3... Predetermined movement amount detection signal, L1, L2.
DESCRIPTION OF
Claims (6)
- 一定周期のレーザパルス列を発振するレーザパルス発振手段と、当該レーザパルス発振手段から出力されたレーザパルス列を受光し当該レーザパルス列中のレーザパルスを選択的に加工に用いる方向に指向させることができる光指向手段と、当該光指向手段からのレーザパルスを受光し被加工物に照射する光学系と、前記被加工物が載置されるテーブルを駆動する手段と、前記テーブルの所定量の移動を周期的に検出する所定移動量検出手段と、当該所定移動量検出手段が所定の移動量を検出したら、前記光指向手段に対し、前記レーザパルス発振手段から出力されたレーザパルス列中のレーザパルスを前記加工方向に指向させるように制御する制御手段とを含むことを特徴とするレーザ加工装置。 Laser pulse oscillating means for oscillating a laser pulse train having a constant period, and light capable of receiving the laser pulse train output from the laser pulse oscillating means and selectively directing the laser pulses in the laser pulse train in a direction used for processing. A directing means; an optical system for receiving a laser pulse from the light directing means and irradiating the workpiece; a means for driving a table on which the workpiece is placed; and a predetermined amount of movement of the table When the predetermined movement amount detecting means detects the predetermined movement amount and the predetermined movement amount detection means detects the predetermined movement amount, the laser pulse in the laser pulse train output from the laser pulse oscillation means is sent to the light directing means. A laser processing apparatus including control means for controlling the laser beam so as to be directed in a processing direction.
- 請求項１に記載のレーザ加工装置において、前記制御手段は、前記光指向手段が前記レーザパルス発振手段から出力されたレーザパルスの過渡期部を避けて前記加工方向に分岐させるように制御することを特徴とするレーザ加工装置。 2. The laser processing apparatus according to claim 1, wherein the control unit controls the light directing unit to branch in the processing direction while avoiding a transitional period of the laser pulse output from the laser pulse oscillation unit. A laser processing apparatus characterized by the above.
- 請求項１又は２のいずれかのレーザ加工装置において、前記所定移動量検出手段は２次元方向の移動量の合成値を検出することを特徴とするレーザ加工装置。 3. The laser processing apparatus according to claim 1, wherein the predetermined movement amount detecting means detects a combined value of movement amounts in a two-dimensional direction.
- レーザビームを被加工物に照射して被加工物を加工するレーザ加工方法において、一定周期のレーザパルス列を発振させ、前記被加工物が載置されるテーブルが所定量だけ移動したことを検出したら、前記レーザパルス列中のレーザパルスを選択的に加工に用いる方向に指向させることを特徴とするレーザ加工方法。 In a laser processing method for processing a workpiece by irradiating the workpiece with a laser beam, when a laser pulse train having a fixed period is oscillated and it is detected that a table on which the workpiece is placed has moved by a predetermined amount A laser processing method characterized by selectively directing laser pulses in the laser pulse train in a direction used for processing.
- 請求項４に記載のレーザ加工方法において、前記レーザパルス列のレーザパルスを前記加工方向に指向させる場合、当該レーザパルスの過渡期部を避けて指向させることを特徴とするレーザ加工方法。 5. The laser processing method according to claim 4, wherein when directing a laser pulse of the laser pulse train in the processing direction, the laser pulse is directed avoiding a transient part of the laser pulse.
- 請求項４又は５のいずれかのレーザ加工方法において、前記テーブルの移動検出は、２次元方向の移動量の合成値に基づいていることを特徴とするレーザ加工方法。
6. The laser processing method according to claim 4, wherein the movement detection of the table is based on a composite value of a movement amount in a two-dimensional direction.
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| JP2015223628A (en) * | 2014-05-30 | 2015-12-14 | ビアメカニクス株式会社 | Laser processor and laser processing method |
| CN114654079A (en) * | 2020-12-22 | 2022-06-24 | 达航科技股份有限公司 | Method for adjusting power of machining point and laser machining apparatus for printed circuit board |
| CN114654079B (en) * | 2020-12-22 | 2024-06-11 | 达航科技股份有限公司 | Processing point power adjusting method and printed substrate laser processing device |
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| JP7386073B2 (en) * | 2019-12-24 | 2023-11-24 | ビアメカニクス株式会社 | Laser processing equipment and laser processing method |
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| JP5967913B2 (en) * | 2011-12-08 | 2016-08-10 | キヤノン株式会社 | Laser processing apparatus, laser processing method, and inkjet head substrate |
| KR101384766B1 (en) * | 2012-05-03 | 2014-04-24 | 계명대학교 산학협력단 | machining center for CNC laser machining |
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| JP2000210782A (en) * | 1998-02-19 | 2000-08-02 | Ricoh Microelectronics Co Ltd | Machining method and its device |
| JP2007054853A (en) * | 2005-08-23 | 2007-03-08 | Sumitomo Heavy Ind Ltd | Laser beam machining device and machining method |
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| CN114654079A (en) * | 2020-12-22 | 2022-06-24 | 达航科技股份有限公司 | Method for adjusting power of machining point and laser machining apparatus for printed circuit board |
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