JP2005302764A - Wiring board processing method and apparatus thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress a change in pulse irradiation pitch of a laser beam to be used for processing a wiring board. <P>SOLUTION: The wiring board 10 is scanned along a processing line L containing a straight line and a curved line by pulse irradiation of the laser beam B. The processing line L consists of a plurality of zones L<SB>1</SB>to L<SB>n</SB>. During the pulse irradiation of the laser beam B, the scanning velocity and the scanning position of the laser beam B are detected. The detected scanning velocity V (scanning velocity detected) is compared with a reference scanning velocity V<SB>x</SB>(set scanning velocity in either of the zones L<SB>1</SB>to L<SB>n</SB>which corresponds to the detected scanning position). When the detected scanning velocity V is larger than the reference scanning velocity V<SB>x</SB>, the pulse irradiation pitch P<SB>1</SB>of the laser beam B is reduced. When the detected scanning velocity V is smaller than the reference scanning velocity V<SB>x</SB>, the pulse irradiation pitch P<SB>2</SB>of the laser beam B is increased. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a wiring board processing method and a processing apparatus.

A method of processing a wiring board using a laser is known. In the technique of Patent Document 1, since laser processing is performed using a mask with the same applied power, it is difficult to continuously process a plurality of regions that require different applied powers. In general, a larger applied power is required for the metal portion than for the resin portion. Further, in a region where laser processing is to be performed under the same conditions, it is required to irradiate the laser beam with pulses at a uniform pitch. However, in the technique of Patent Document 2, when the processing speed is changed due to disturbance, the pulse irradiation pitch also changes, and it is difficult to perform laser processing with uniform quality.
JP-A-5-353561 Japanese Patent Laid-Open No. 11-167147

  An object of the present invention is to suppress fluctuations in the pulse irradiation pitch of a laser beam used when processing a wiring board.

(1) A method for processing a wiring board according to the present invention is a processing that includes a laser beam on a wiring board having a resin substrate and a metal wiring pattern formed on the substrate, including a straight line and a curve. A method of processing a wiring board including scanning along a line and irradiating a pulse,
The processing line consists of a plurality of sections,
The set scanning speed of the laser beam in each of the sections is determined in advance to be different from the set scanning speed of at least one other section,
The set pitch of the pulse irradiation of the laser beam in each of the sections is determined in advance to be different from the set pitch in the other at least one of the sections,
Detecting a scanning speed and a scanning position of the laser beam during pulse irradiation of the laser beam;
The reference scanning speed is compared with the detected scanning speed with the set scanning speed in any one of the sections corresponding to the detected scanning position as a reference scanning speed, and the detected scanning speed as a detected scanning speed. And
When the detection scanning speed is faster than the reference scanning speed, the pulse irradiation pitch of the laser beam is reduced, and when the detection scanning speed is slower than the reference scanning speed, the pulse irradiation pitch of the laser beam is increased. ,
including. According to the present invention, even if the scanning speed of the laser beam deviates from the set scanning speed due to disturbance, the pulse irradiation pitch is adjusted, so that fluctuations can be suppressed.
(2) In this wiring board processing method,
The set power of the laser beam in each of the sections may be determined in advance so as to be different from the set power in the other at least one of the sections.
(3) A wiring board processing apparatus according to the present invention is a wiring board processing apparatus having a substrate made of a resin and a wiring pattern made of a metal formed on the substrate,
A laser emitting a laser beam;
A laser driver for driving the laser;
A trigger pulse generator for outputting a trigger pulse for irradiating the laser beam to the laser driver;
A stage that moves relative to the laser so that the laser beam is scanned along a processing line including a plurality of sections including a straight line and a curve, with the wiring board mounted thereon;
Stage operation information including a set scanning speed that is set in advance so as to be different from a set scanning speed of the laser beam in each of the sections of the processing line that is set in the at least one other section. A first memory for storing;
A stage driver for driving to move the stage relative to the laser for scanning the laser beam according to the stage operation information;
A predetermined trigger pulse generation interval for irradiating the laser beam in each section of the processing line, which is different from a generation trigger pulse generation interval in at least one other section. A second memory for storing laser control information including a generation interval of the set trigger pulse;
A detector for detecting a scanning speed and a scanning position of the stage during pulse irradiation of the laser beam;
The reference scanning speed and the detected scanning speed are compared with the set scanning speed in any one of the sections corresponding to the detected scanning position as the reference scanning speed, and the detected scanning speed as the detected scanning speed. A comparator;
When the detection scanning speed is faster than the reference scanning speed, the trigger pulse generator is controlled so that the generation interval of the trigger pulse is smaller than the generation interval of the set trigger pulse, and the detection scanning speed is A control unit that controls the trigger pulse generator so as to make the generation interval of the trigger pulse larger than the generation interval of the set trigger pulse when slower than a reference scanning speed;
Have According to the present invention, even if the scanning speed of the laser beam deviates from the set scanning speed due to disturbance, the generation interval of the trigger pulse is adjusted, so that fluctuations in the pulse irradiation pitch of the laser beam can be suppressed.
(4) In this wiring board processing apparatus,
A power control signal generator for outputting a power control signal of the laser beam to the laser driver;
The laser control information includes a set power value of the laser beam determined in advance so as to be a set power of the laser beam in each section and different from an output in at least one other section. But you can.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a partially enlarged view of a wiring board to be processed by the wiring board processing method according to the present embodiment.

  The wiring substrate 10 includes a substrate 12 made of resin (for example, polyimide resin) and a wiring pattern 20 made of metal (for example, copper) formed on the substrate 12. The wiring pattern 20 includes first, second, and third (that is, plural) wirings 21, 22, and 23, which have different widths, and the width of the first wiring 21 is the narrowest. A plurality of first wirings 21 are arranged so as to be densely packed in parallel. The wiring pattern 20 includes a connecting portion 24 of first, second, and third (ie, plural) wirings 21, 22, and 23. The first, second, and third wirings 21, 22, and 23 are electrically connected to each other through the connecting portion 24.

  In the wiring board processing method according to the present embodiment, the wiring board 10 is cut along the processing line L. The processing line L includes a straight line and a curved line. The processing line L passes through a portion consisting only of the substrate 12, a portion consisting only of the wiring pattern 20, and a portion where both the substrate 12 and the wiring pattern 20 overlap. In a portion where both the substrate 12 and the wiring pattern 20 overlap, both of them may be cut, or only one of them may be cut. When the processing line L encloses a part of the wiring substrate 10 (for example, the connecting portion 24), a hole 26 (see FIG. 2) is formed after processing. When the processing line L reaches from one end of the wiring board 10 to the other end, the wiring board 10 is divided into a plurality of pieces. If an insulating film (resin film) such as a solder resist is formed on the wiring pattern 20, it may be cut together.

  FIG. 2 is a diagram showing the processed wiring board. Holes 26 are formed in the wiring board 10. The hole 26 is formed by cutting the wiring board 10 along the processing line L. In the present embodiment, since the processing line L surrounds the connecting portion 24, the connecting portion 24 is removed by processing, and the first, second, and third wirings 21, 22, and 23 are electrically insulated from each other. The Such a process is performed, for example, after electrolytic plating is performed on the wiring pattern 20.

  3 and 4 are diagrams for explaining a method of processing a wiring board according to the present embodiment. In the present embodiment, as shown in FIG. 3, the laser beam B is scanned along the processing line L and irradiated with pulses. The set pitch P for pulse irradiation is determined in advance.

As shown in FIG. 4, the processing line L includes a plurality of sections L _{1 to} L _n . The set scanning speed of the laser beam B in each of the sections L _{1 to} L _n is determined in advance so as to be different from the set scanning speed in at least one other section L _{1 to} L _n . In each of the sections L _{1 to} L _n , the set scanning speed of the laser beam B is determined in advance so as to be uniform.

The set pitch of pulse irradiation of the laser beam B in each of the sections L _{1 to} L _n is determined in advance so as to be different from the set pitch in at least one other section L _{1 to} L _n . Further, in each of the sections L _{1 to} L _n , the setting pitch of the pulse irradiation of the laser beam B is predetermined so as to be uniform.

Setting power of the laser beam B at each section L ₁ ~L _n is predetermined to be different from the other of the at least one setting the power of the section L ₁ ~L _n. Note that the values of the set scanning speed, the set pitch, and the set power may be determined relatively depending on the material to be processed (at least one of resin and metal) and the processing shape (straight line or curve).

FIG. 5 is a diagram for explaining a partial flow of the method for processing a wiring board according to the present embodiment. In this embodiment, the scanning speed and scanning position of the laser beam B are detected during the pulse irradiation of the laser beam B. Then, the reference scanning speed V _x (set scanning speed in any one of the sections L _{1 to} L _n corresponding to the detected scanning position) is compared with the detected scanning speed V (detected scanning speed). For example, it determines detection scanning velocity V and the reference scanning speed _{V x} is whether the same (S101). Determination result if YES _(V = V _x), again, the flow returns to S101. If the determination result is NO (V ≠ V _x ), it is determined whether or not the reference scanning speed V _x is faster than the detected scanning speed V (S102).

When the result of the determination in step S102 is NO (V _x <V), scanning is performed faster than a preset value, so that the pulse irradiation of the laser beam B is performed as shown in FIG. pitch _{P 1} is larger than the set pitch P (see FIG. 3). Therefore, in this case, to reduce the pulse irradiation pitch P ₁ of the laser beam B. Specifically, the generation interval of the trigger pulse for irradiating the laser beam B with a pulse is reduced (S201).

When the result of determination in step S102 is YES (V <V _x ), scanning is performed later than a preset value, so that the pulse irradiation of the laser beam B is performed as shown in FIG. pitch _{P 2} is smaller than the set pitch P (see FIG. 3). Therefore, in this case, to reduce the pulse irradiation pitch P ₂ of the laser beam B. Specifically, the generation interval of the trigger pulse for irradiating the laser beam B with a pulse is expanded (S202).

According to the present embodiment, even if the scanning speed of the laser beam B deviates from the set scanning speed due to disturbance, the pulse irradiation pitches P ₁ and P ₂ are adjusted, so that fluctuations can be suppressed.

  FIG. 7 is a diagram showing a wiring board processing apparatus according to the present embodiment. This processing apparatus can perform the process described above.

  The processing apparatus includes a laser (for example, a YAG laser) 30 that emits a laser beam. A laser beam having a wavelength in the ultraviolet region (third or fourth harmonic of a YAG laser) may be used for processing. In addition, a short wavelength laser beam is suitable for resin processing (cutting / removing) as in the ultraviolet region, and a long wavelength laser beam is suitable for metal processing (cutting / removing). For processing (cutting / removing) the portion, a laser beam with a short wavelength such as the ultraviolet region is suitable. As the laser 30, a laser capable of emitting a laser beam with a uniform power even when the pulse irradiation pitch is changed (for example, Coherent AVIA-X) is used.

  The laser 30 is driven by a laser driver 32. A trigger pulse for irradiating the laser beam with a pulse is output from the trigger pulse generator 34 to the laser driver 32. When the trigger pulse is input to the laser driver 32, the laser driver 32 drives the laser 30 so that the laser beam is irradiated with pulses.

  Further, a laser beam power control signal is output from the power control signal generator 36 to the laser driver 32. The power control signal determines the power of the laser beam, and the laser driver 32 drives the laser 30 in accordance with the power control signal input to the laser driver 32.

The processing apparatus includes a stage 40 on which the wiring board 10 is placed. As shown in FIG. 4, the stage 40 moves relative to the laser 30 so that the laser beam scans along a processing line L including a plurality of sections L _{1 to} L _n including straight lines and curves. To do. For example, the stage 40 moves in a two-dimensional direction (XY direction). The movement may be performed by the actuators 42 and 44. Note that the optical system of the laser 30 may be placed on the stage 40 instead of placing the wiring substrate 10, and the wiring substrate 10 may be disposed at a fixed position. In this case, the laser beam is scanned for processing.

  The stage 40 (actuators 42 and 44) is driven by a stage driver 46. The stage 40 is driven by the stage driver 46 according to the stage operation information 52.

The stage operation information 52 is stored in the memory 50 (for example, a first memory that is a part thereof). The stage operation information 52 includes a predetermined set scanning speed of the laser beam in each section L _{1 to} L _n of the processing line L (see FIG. 4). The set scanning speed in each of the sections L _{1 to} L _n is determined in advance so as to be different from the set scanning speed in the other at least one section L _{1 to} L _n . In each of the sections L _{1 to} L _n , the set scanning speed of the laser beam is predetermined so as to be uniform.

Laser control information 54 is stored in the memory 50 (for example, a second memory that is a part thereof). The laser control information 54 includes a predetermined generation interval of a set trigger pulse for pulse-irradiating a laser beam in each section L _{1 to} L _n of the processing line L (see FIG. 4). Generation interval setting trigger pulse in each section L ₁ ~L _n is predetermined to be different from the interval of generation of set trigger pulse in at least one other segment L ₁ ~L _n. In each of the sections L _{1 to} L _n , the set trigger pulse generation intervals are determined in advance to be uniform. The laser control information 54 includes the value of the set power of the laser beam in each section L _{1 to} L _n . The set power of the laser beam in each section L _{1 to} L _n is determined in advance so as to be different from the output in at least one other section L _{1 to} L _n .

  The processing apparatus includes detectors 56 and 58 that detect the scanning speed and scanning position of the stage 40 during the pulse irradiation of the laser beam.

The processing apparatus has a comparator 62. The comparator 62 may be a part of the processing unit 60. The comparator 62 receives the scanning speed and scanning position detected by the detectors 56 and 58. Further, the stage operation information 52 (at least the set scanning speed) is input to the comparator 62. Then, in the comparator 62, as shown in FIG. 5, the reference scanning speed V _x (set scanning speed in any one of the sections L _{1 to} L _n corresponding to the detected scanning position) and the detection scanning speed V (detection). Are compared) (refer to S101 and S102).

  The processing apparatus has a control unit 64. The control unit 64 may be a part of the processing unit 60. The control unit 64 receives the comparison result from the comparator 62.

Control unit 64, as shown in step S201 in FIG. 5, if the detected scanning speed V is higher than the reference scanning speed V _x (the state shown in FIG. 6 (A)), sets the generation interval of the trigger pulse trigger pulse The trigger pulse generator 34 is controlled so as to be smaller than the generation interval (outputs a signal for control). As a result, as shown in FIG. 6 (A), it is possible to reduce the pulse irradiation pitch P ₁ of the laser beam B.

Alternatively, the control unit 64, as shown in step S202 of FIG. 5, if the detected scan velocity V is slower than the reference scanning speed V _x (the state shown in FIG. 6 (B)), sets the generation interval of the trigger pulse The trigger pulse generator 34 is controlled so as to be larger than the generation interval of the trigger pulse (a signal for control is output). As a result, as shown in FIG. 6 (B), it is possible to increase the pulse irradiation pitch P ₂ of the laser beam B.

  According to the present embodiment, even if the scanning speed (actual speed) of the laser beam deviates from the set scanning speed (predetermined speed) due to disturbance, the trigger pulse generation interval is adjusted. Variation in irradiation pitch can be suppressed.

  The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, the present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same purposes and results). In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that exhibits the same operational effects as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment. Furthermore, the present invention may be one that excludes any of the technical matters described in the embodiments in a limited manner. Alternatively, the present invention may be one in which known techniques are limitedly excluded from the above-described embodiments.

FIG. 1 is a partially enlarged view of a wiring board to be processed by the wiring board processing method according to the present embodiment. FIG. 2 is a diagram showing the processed wiring board. FIG. 3 is a diagram for explaining a method of processing a wiring board according to the present embodiment. FIG. 4 is a diagram for explaining a method of processing a wiring board according to the present embodiment. FIG. 5 is a diagram for explaining a partial flow of the method for processing a wiring board according to the present embodiment. 6A and 6B are diagrams illustrating a part of the method for processing a wiring board according to this embodiment. FIG. 7 is a diagram showing a wiring board processing apparatus according to the present embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Wiring board 12 ... Board 20 ... Wiring pattern 21 ... 1st wiring 22 ... 2nd wiring 23 ... 3rd wiring 24 ... Connection part 26 ... Hole 30 ... Laser 32 ... Laser driver 34 ... Trigger pulse generator 36 ... Power control signal generator 40 ... Stage 42 ... Actuator 44 ... Actuator 46 ... Stage driver 50 ... Memory 52 ... Stage operation information 54 ... Laser control information 56 ... Detector 58 ... Detector 60 ... Processor 62 ... Comparator 64 ... Control unit

Claims (4)

Wiring including scanning and irradiating a laser beam along a processing line including straight lines and curves onto a wiring board having a substrate made of resin and a wiring pattern made of metal formed on the substrate. A method for processing a substrate,
The processing line consists of a plurality of sections,
The set scanning speed of the laser beam in each of the sections is determined in advance to be different from the set scanning speed of at least one other section,
The set pitch of the pulse irradiation of the laser beam in each of the sections is determined in advance to be different from the set pitch in the other at least one of the sections,
Detecting a scanning speed and a scanning position of the laser beam during pulse irradiation of the laser beam;
The reference scanning speed is compared with the detected scanning speed with the set scanning speed in any one of the sections corresponding to the detected scanning position as a reference scanning speed, and the detected scanning speed as a detected scanning speed. And
When the detection scanning speed is faster than the reference scanning speed, the pulse irradiation pitch of the laser beam is reduced, and when the detection scanning speed is slower than the reference scanning speed, the pulse irradiation pitch of the laser beam is increased. ,
A method for processing a wiring board including: In the processing method of the wiring board according to claim 1,
A method of processing a wiring board, wherein the set power of the laser beam in each of the sections is determined in advance to be different from the set power of at least one other section. A wiring board processing apparatus having a substrate made of resin and a wiring pattern made of metal formed on the substrate,
A laser emitting a laser beam;
A laser driver for driving the laser;
A trigger pulse generator for outputting a trigger pulse for irradiating the laser beam to the laser driver;
A stage that moves relative to the laser so that the laser beam scans along a processing line that includes a plurality of sections including straight lines and curves, with the wiring board mounted thereon;
Stage operation information including a set scanning speed that is set in advance so as to be different from a set scanning speed of the laser beam in each of the sections of the processing line and in the at least one other section. A first memory for storing;
A stage driver for driving to move the stage relative to the laser for scanning the laser beam according to the stage operation information;
A predetermined trigger pulse generation interval for irradiating the laser beam in each section of the processing line, which is different from a generation trigger pulse generation interval in at least one other section. A second memory for storing laser control information including a generation interval of the set trigger pulse;
A detector for detecting a scanning speed and a scanning position of the stage during pulse irradiation of the laser beam;
The reference scanning speed is compared with the detected scanning speed with the set scanning speed in any one of the sections corresponding to the detected scanning position as a reference scanning speed, and the detected scanning speed as a detected scanning speed. A comparator;
When the detected scanning speed is faster than the reference scanning speed, the trigger pulse generator is controlled to make the generation interval of the trigger pulse smaller than the generation interval of the set trigger pulse, and the detected scanning speed is A control unit that controls the trigger pulse generator so as to make the generation interval of the trigger pulse larger than the generation interval of the set trigger pulse when it is slower than a reference scanning speed;
An apparatus for processing a wiring board. In the processing apparatus of the wiring board according to claim 3,
A power control signal generator for outputting a power control signal of the laser beam to the laser driver;
The laser control information includes a set power value of the laser beam that is set in advance so as to be different from the output in the at least one other section, which is the set power of the laser beam in each of the sections. Wiring board processing equipment.

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