JP3137074B2 - Laser processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus used for boring a substrate, trimming wiring, and the like.

[0002]

2. Description of the Related Art Conventionally, when processing such as drilling of a substrate or trimming of wiring is performed by a laser beam, a work W to be processed is, as shown in FIG. Drilling on a board requires drilling corresponding to the contact pitch of the components to be mounted. In circuit switching by trimming wiring such as LSI, trimming wiring is arranged vertically and horizontally at equal pitch. Department.

[0003] In the conventional laser processing of this type of work W, the power of the processing laser is adjusted, focused, and positioned to a predetermined energy for each point to be processed, and the laser is irradiated to perform trimming. Further, as shown by an arrow in FIG. 4, after processing is performed on one row of works W, the scanning direction of the laser beam is reversed to perform processing on another adjacent row of works W. Te In this case, it is necessary to position the laser at all the processing points.If there are many processing points, it takes a long processing time, and it is also necessary to detect that the laser has passed over the processing point during scanning without performing positioning by stopping. In a processing method of emitting light, laser emission is required for the number of processing points.

[0004]

By the way, in such a processing method, it is necessary to emit a laser beam at a high repetition rate as the processing speed is increased. Characteristics of the laser medium,
Due to the first pulse phenomenon in which only the first pulse generates an excessively high output pulse, there are many restrictions on increasing the laser repetition frequency, and there is a problem that high-speed processing cannot be performed.

An object of the present invention is to provide a laser processing apparatus capable of improving a processing speed without being affected by such restrictions.

[0006]

According to a first aspect of the present invention, there is provided a laser processing apparatus for achieving the above object.
A laser oscillator, output adjusting means for adjusting a laser beam output from the laser oscillator to a predetermined output, and a laser beam passed through the output adjusting means being incident, and dividing the laser beam into a plurality. while, with the irradiation pattern forming means for shaping the cross section of each laser beam into a predetermined shape to be divided, and an objective lens for condensing light toward these split laser beam to the workpiece, the radiation path
A turn forming means outputs the laser output from the output adjusting means.
Is located inside the laser beam bundle and has a predetermined shape.
Multiple slits and each of these slits
Opening for opening and closing these slits at high speed
A closing mechanism, and the plurality of slits
Are matched with the arrangement pattern of the workpiece . Also, the laser processing apparatus according to claim 2 of the present invention provides the irradiation pattern forming means according to claim 1.
Are exchangeable . further,
The laser processing apparatus according to the third aspect of the present invention provides the laser processing apparatus according to the first aspect.
Or the movement position control of the workpiece according to claim 2,
A control means for controlling the driving of the irradiation pattern forming means;
A step is provided .

[0007]

[0008]

[0009]

[0010]

[0011]

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The configuration of the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram of an embodiment of a laser processing apparatus according to the present invention. The laser processing apparatus according to the present embodiment includes:
A laser oscillator 1 for generating a laser beam L, an output adjusting means 2 for adjusting the laser beam L output from the laser oscillator 1 to a predetermined output, and a laser beam L passed through the output adjusting means 2 Irradiation pattern forming means 3 for shaping the cross section of each laser beam (L1 · L2) into a predetermined shape while dividing the laser beam L into a plurality of parts; An objective lens 4 for condensing L2) toward a workpiece (workpiece) W;

[0013] Between the irradiation pattern forming means 3 and the objective lens 4, a mirror for changing the path of the laser beams L1 and L2 of the clothes transmitted through the irradiation pattern forming means 3 toward the objective lens 4. 5 are provided.

The workpiece W is mounted on an XY stage 6.
The XY stage 6 allows the XY stage 6 to move in a preset direction.

In the present embodiment, as shown in FIG. 2, the irradiation pattern forming means 3 is positioned within a light beam 56 of a laser beam L and has two circular slits 52 capable of transmitting the laser beam L; Mask rods 51 and 55 for opening and closing these slits 52;
Actuators 53 and 57 for moving the slits 52 at a high speed by opening and closing the slits 52 at high speed and a housing 54 on which these are mounted.
Each slit 52 is opened / closed at a high speed by the forward / backward movement of 55, so that each split laser beam L
The irradiation of 1 · L2 is cut off.

As the actuators 53 and 57, for example, a voice coil motor or a laminated piezoelectric actuator is used.

On the other hand, in the present embodiment, in order to irradiate the laser beams L1 and L2 to a predetermined target position of the workpiece W with high precision, as shown in FIG. Pattern calculating means 60 for setting a processing pattern set by the above, an irradiation pattern control circuit 61 for controlling the driving of the irradiation pattern forming means 3 based on a control signal from the processing pattern calculating means 60; Processing path calculating means 62 for setting the movement mode of the Y stage 6; a stage control circuit 63 for controlling the driving of the XY stage 6 based on a control signal from the processing path calculating means 62; Execution data generation means 64 for outputting control data to the machining path calculation means 62, and system control means 65 for controlling the entire apparatus. Control means is provided.

In the laser processing apparatus according to the present embodiment thus configured, the laser beam L output from the laser oscillator 1 is adjusted to a predetermined output by the external attenuator 2 and the slit 52 of the irradiation pattern forming means 3 is adjusted. And is condensed by the objective lens 4 and guided to the processing surface of the workpiece W.

Here, the laser beam L in the external attenuator 2 is divided into two laser beams L1 and L2 after passing through each slit 52, and is shaped into a predetermined sectional shape determined by each slit 52. After that, the workpiece W is irradiated at a predetermined magnification by the objective lens 4 to perform laser processing.

The irradiation of each of the laser beams L1 and L2 and the cutoff thereof are performed by the slit 52 formed by the mask rods 51.5.
5, the XY stage 6 is driven in synchronism with this, whereby the workpiece W is accurately irradiated.

The workpiece W is, as shown in FIG.
Assuming that two slits are arranged in parallel, each slit 52
Are set in accordance with the intervals between the rows of alignment of the workpieces W, and as shown by the dashed line in FIG. The laser beams L1 and L2 are simultaneously irradiated on the workpieces W in each row, and laser processing on the two workpieces W is performed simultaneously.

As shown in FIG. 3B, by shifting the divided laser beams L1 and L2 in the scanning direction, the laser beams L1
1 · L2 is simultaneously irradiated, and laser processing is performed on these two workpieces W at the same time.

Accordingly, the number of times of positioning of the workpiece W as a whole can be reduced by half or the scanning speed can be doubled as compared with the conventional example shown in FIG. 4, and the processing speed can be greatly improved. Is achieved.

[0024]

As described above, the present laser processing apparatus divides the laser beam into a plurality of beams having a predetermined arrangement and cross-sectional shape by variably controlling the width and pattern of the laser beam by the irradiation pattern forming means. The laser beam can be processed by guiding the split beam to an object to be processed and condensing it.
With these functions, laser processing can be performed simultaneously at multiple points with one laser emission, and as a result, processing time can be reduced.

[Brief description of the drawings]

FIG. 1 is a system configuration diagram showing an embodiment of the present invention.

FIG. 2 is a detailed view of an irradiation pattern forming means used in one embodiment of the present invention, wherein (a) and (c) are plan views and (b) is a longitudinal sectional view.

FIG. 3 is a schematic view showing a processing step in one embodiment of the present invention.

FIG. 4 is a schematic view showing a processing step in a conventional example.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 laser oscillator 2 external attenuator (output adjusting means) 3 irradiation pattern forming means 4 objective lens 5 mirror 6 stage 51/55 mask rod (irradiation pattern forming means) 52 slit (irradiation pattern forming means) 53/57 actuator (irradiation pattern forming) Means 54 Housing (irradiation pattern forming means) 56 Light flux 60 Processing pattern calculation means (control means) 61 Irradiation pattern control circuit (control means) 62 Processing path calculation means (control means) 63 Stage control circuit (control means) 64 Execution data Generation means (control means) 65 System control means (control means) L Laser beam L1 ・ L2 Laser beam W Workpiece (work)

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) B23K 26/00-26/42 H05K 3/00

Claims (3)

(57) [Claims] 1. A laser oscillator, an output adjusting means for adjusting a laser beam output from the laser oscillator to a predetermined output, and a laser beam passed through the output adjusting means is applied to the laser beam. While dividing the laser beam into a plurality of portions, an irradiation pattern forming means for shaping the cross section of each laser beam to be divided into a predetermined shape, and an objective lens for condensing these divided laser beams toward a workpiece , The irradiation pattern forming means is the output adjusting means;
Placed inside the laser beam bundle output from the
In addition, a plurality of slits having a predetermined shape,
These slits are provided for each of the
And an opening / closing mechanism that opens and closes at a high speed.
Multiple slits match the pattern of the workpiece
A laser processing apparatus , characterized in that it is used. 2. The irradiation pattern forming means is exchangeable.
The laser processing apparatus according to claim 1, wherein the laser processing apparatus is used. 3. The method according to claim 1 , further comprising: controlling a moving position of the workpiece;
Control means for controlling driving of the pattern forming means is provided.
Claim 1 or Claim 2
The laser processing apparatus according to the above.