CN104795302B - 具有用于横切应用的过程自动化的图案识别的差分成像 - Google Patents
具有用于横切应用的过程自动化的图案识别的差分成像 Download PDFInfo
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- CN104795302B CN104795302B CN201410583821.2A CN201410583821A CN104795302B CN 104795302 B CN104795302 B CN 104795302B CN 201410583821 A CN201410583821 A CN 201410583821A CN 104795302 B CN104795302 B CN 104795302B
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Classifications
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- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/22—Optical, image processing or photographic arrangements associated with the tube
- H01J37/222—Image processing arrangements associated with the tube
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- H—ELECTRICITY
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
- H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
- H01J37/3056—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching for microworking, e. g. etching of gratings or trimming of electrical components
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
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- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/32—Polishing; Etching
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- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/44—Sample treatment involving radiation, e.g. heat
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- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
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- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
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- H01J2237/317—Processing objects on a microscale
- H01J2237/3174—Etching microareas
- H01J2237/31745—Etching microareas for preparing specimen to be viewed in microscopes or analyzed in microanalysers
Landscapes
- Chemical & Material Sciences (AREA)
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361897052P | 2013-10-29 | 2013-10-29 | |
| US61/897052 | 2013-10-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104795302A CN104795302A (zh) | 2015-07-22 |
| CN104795302B true CN104795302B (zh) | 2018-10-02 |
Family
ID=51945690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410583821.2A Expired - Fee Related CN104795302B (zh) | 2013-10-29 | 2014-10-28 | 具有用于横切应用的过程自动化的图案识别的差分成像 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US9297727B2 (enExample) |
| EP (1) | EP2869328A1 (enExample) |
| JP (1) | JP6556993B2 (enExample) |
| CN (1) | CN104795302B (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6113842B2 (ja) | 2012-07-16 | 2017-04-12 | エフ・イ−・アイ・カンパニー | 集束イオン・ビーム処理の終点決定 |
| CN104795302B (zh) * | 2013-10-29 | 2018-10-02 | Fei 公司 | 具有用于横切应用的过程自动化的图案识别的差分成像 |
| JP2018511036A (ja) * | 2015-01-31 | 2018-04-19 | エフ．ホフマン−ラ ロシュ アーゲーＦ． Ｈｏｆｆｍａｎｎ−Ｌａ Ｒｏｃｈｅ Ａｋｔｉｅｎｇｅｓｅｌｌｓｃｈａｆｔ | メソダイセクションのためのシステムおよび方法 |
| EP3104155A1 (en) * | 2015-06-09 | 2016-12-14 | FEI Company | Method of analyzing surface modification of a specimen in a charged-particle microscope |
| US9576772B1 (en) | 2015-08-31 | 2017-02-21 | Fei Company | CAD-assisted TEM prep recipe creation |
| CZ306807B6 (cs) * | 2016-05-21 | 2017-07-12 | Tescan Brno, S.R.O. | Rastrovací elektronový mikroskop a způsob jeho provozu |
| EP3318862B1 (en) * | 2016-11-04 | 2019-08-21 | FEI Company | Tomography sample preparation systems and methods with improved speed, automation, and reliability |
| DE112016007379B4 (de) * | 2016-11-22 | 2025-06-18 | Hitachi High-Tech Corporation | Ladungsträgerstrahlvorrichtung und Probenbeobachtungsverfahren |
| KR102499036B1 (ko) | 2017-09-22 | 2023-02-13 | 삼성전자주식회사 | 임계 치수 측정 시스템 및 임계 치수 측정 방법 |
| JP6972157B2 (ja) * | 2017-10-16 | 2021-11-24 | 株式会社日立ハイテク | 撮像装置 |
| WO2019108166A1 (en) * | 2017-11-28 | 2019-06-06 | Hewlett-Packard Development Company, L.P. | Digital image analysis and processing for viewing by color-blind |
| CN108181624B (zh) * | 2017-12-12 | 2020-03-17 | 西安交通大学 | 一种差分计算成像装置及方法 |
| DE102018117492B3 (de) * | 2018-07-19 | 2019-10-02 | Carl Zeiss Microscopy Gmbh | Verfahren zum Betreiben einer Mehrzahl von FIB-SEM-Systemen |
| US10811219B2 (en) * | 2018-08-07 | 2020-10-20 | Applied Materials Israel Ltd. | Method for evaluating a region of an object |
| US12165840B2 (en) | 2018-11-21 | 2024-12-10 | Techinsights Inc. | Ion beam delayering system and method, topographically enhanced delayered sample produced thereby, and imaging methods and systems related thereto |
| US11491575B2 (en) | 2019-04-16 | 2022-11-08 | Arcam Ab | Electron beam melting additive manufacturing machine with dynamic energy adjustment |
| JP7360871B2 (ja) * | 2019-09-24 | 2023-10-13 | 株式会社日立ハイテクサイエンス | 荷電粒子ビーム照射装置、及び制御方法 |
| DE102020100565A1 (de) | 2020-01-13 | 2021-07-15 | Aixtron Se | Verfahren zum Abscheiden von Schichten |
| WO2022174187A2 (en) * | 2021-02-15 | 2022-08-18 | E.A. Fischione Instruments, Inc. | System and method for uniform ion milling |
| WO2023053187A1 (ja) * | 2021-09-28 | 2023-04-06 | 株式会社日立ハイテクサイエンス | 加工方法及び荷電粒子ビーム装置 |
| US12249482B2 (en) * | 2021-12-16 | 2025-03-11 | Fei Company | Microscopy feedback for improved milling accuracy |
| US12288668B2 (en) | 2023-05-11 | 2025-04-29 | Applied Materials Israel Ltd. | Entropy based image processing for focused ion beam delayer-edge slices detection |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5436449A (en) * | 1992-10-13 | 1995-07-25 | Hitachi, Ltd. | Transmission electron microscope and method of observing magnetic phenomena using its apparatus |
| CN102207472A (zh) * | 2010-03-31 | 2011-10-05 | Fei公司 | 用于观察特征的自动化片状铣削 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL1022426C2 (nl) | 2003-01-17 | 2004-07-26 | Fei Co | Werkwijze voor het vervaardigen en transmissief bestralen van een preparaat alsmede deeltjes optisch systeem. |
| CA2587747C (en) | 2004-11-15 | 2013-01-08 | Fibics Incorporated | System and method for focused ion beam data analysis |
| US7388218B2 (en) | 2005-04-04 | 2008-06-17 | Fei Company | Subsurface imaging using an electron beam |
| US7535000B2 (en) * | 2006-05-23 | 2009-05-19 | Dcg Systems, Inc. | Method and system for identifying events in FIB |
| EP1890136A1 (en) * | 2006-08-16 | 2008-02-20 | FEI Company | Method for obtaining images from slices of a specimen |
| EP2149897A1 (en) | 2008-07-31 | 2010-02-03 | FEI Company | Method for milling and end-pointing a sample |
| JP5649583B2 (ja) * | 2008-10-31 | 2015-01-07 | エフ イー アイ カンパニＦｅｉ Ｃｏｍｐａｎｙ | 加工終点検出方法及び装置 |
| EP2233907A1 (en) | 2009-03-27 | 2010-09-29 | FEI Company | Forming an image while milling a work piece |
| JP2010271117A (ja) * | 2009-05-20 | 2010-12-02 | Elpida Memory Inc | 試料の加工方法および試料の作製方法 |
| JP5739119B2 (ja) * | 2009-09-15 | 2015-06-24 | 株式会社日立ハイテクサイエンス | 断面加工観察装置 |
| JP5969233B2 (ja) * | 2012-03-22 | 2016-08-17 | 株式会社日立ハイテクサイエンス | 断面加工観察方法及び装置 |
| JP6113842B2 (ja) | 2012-07-16 | 2017-04-12 | エフ・イ−・アイ・カンパニー | 集束イオン・ビーム処理の終点決定 |
| US10465293B2 (en) | 2012-08-31 | 2019-11-05 | Fei Company | Dose-based end-pointing for low-kV FIB milling TEM sample preparation |
| DE102012217761B4 (de) * | 2012-09-28 | 2020-02-06 | Carl Zeiss Microscopy Gmbh | Verfahren zur Vermeidung von Artefakten beim Serial Block Face Imaging |
| CN104795302B (zh) * | 2013-10-29 | 2018-10-02 | Fei 公司 | 具有用于横切应用的过程自动化的图案识别的差分成像 |
-
2014
- 2014-10-28 CN CN201410583821.2A patent/CN104795302B/zh not_active Expired - Fee Related
- 2014-10-28 EP EP20140190567 patent/EP2869328A1/en not_active Withdrawn
- 2014-10-28 JP JP2014218879A patent/JP6556993B2/ja not_active Expired - Fee Related
- 2014-10-29 US US14/526,971 patent/US9297727B2/en active Active
-
2016
- 2016-03-28 US US15/082,848 patent/US9881766B2/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5436449A (en) * | 1992-10-13 | 1995-07-25 | Hitachi, Ltd. | Transmission electron microscope and method of observing magnetic phenomena using its apparatus |
| CN102207472A (zh) * | 2010-03-31 | 2011-10-05 | Fei公司 | 用于观察特征的自动化片状铣削 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104795302A (zh) | 2015-07-22 |
| US9297727B2 (en) | 2016-03-29 |
| US20160211113A1 (en) | 2016-07-21 |
| EP2869328A1 (en) | 2015-05-06 |
| JP2015111108A (ja) | 2015-06-18 |
| JP6556993B2 (ja) | 2019-08-07 |
| US9881766B2 (en) | 2018-01-30 |
| US20150136977A1 (en) | 2015-05-21 |
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Granted publication date: 20181002 Termination date: 20201028 |