CN104789179A - Thermosetting high-polymer adhesive - Google Patents
Thermosetting high-polymer adhesive Download PDFInfo
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- CN104789179A CN104789179A CN201510207360.3A CN201510207360A CN104789179A CN 104789179 A CN104789179 A CN 104789179A CN 201510207360 A CN201510207360 A CN 201510207360A CN 104789179 A CN104789179 A CN 104789179A
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- thermosetting polymer
- polymer glue
- polymer adhesive
- thermosetting
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Abstract
The invention discloses a thermosetting high-polymer adhesive which comprises the following components in parts by mass: 15-20 parts of epoxy resin, 2-4 parts of phenolic resin, 2-4 parts of acrylic resin, 1-3 parts of acetone, 0-3 parts of benzene, 0-3 parts of xylene, 0-3 parts of n-butanol and 0-3 parts of styrene. The thermosetting high-polymer adhesive has the advantages of high temperature resistance, favorable leveling property, wide application range, stable performance, wide sources, high use safety and the like, and has wide market prospects in popularization of thermosetting high-polymer adhesives.
Description
Technical field
The present invention relates to electrophile field, particularly relate to a kind of thermosetting polymer glue.
Background technology
Hot-setting adhesive combines the speciality of hot melt adhesive and structure glue, quick solidifying, and intensity is high, and not containing organic solvent, 100% solid content, according to the difference of viscosity, set time and additive, is applicable to the bonding of different surfaces.
Existing thermosetting polymer glue generally adopts macromolecule resin material and thinner composition, but the hot-setting adhesive of existing composition proportion has levelling property difference, easily be full of cracks, soon aging, is unfavorable for permanent use.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of thermosetting polymer glue, by adopting multiple macromolecule resin material and different mixing diluents, form the thermosetting polymer glue of stable and uniform, be uniformly dispersed, good leveling property, stable performance, wide material sources, use safety, there are market outlook widely popularizing of thermosetting polymer glue, have market outlook widely popularizing of thermosetting polymer glue.
For solving the problems of the technologies described above, the invention provides a kind of thermosetting polymer glue, the quality proportioning of composition comprises:
Epoxy resin 15-20 part,
Resol 2-4 part,
Acrylic resin 2-4 part,
Acetone 1-3 part,
Benzene 0-3 part,
Dimethylbenzene 0-3 part,
Propyl carbinol 0-3 part,
Vinylbenzene 0-3 part.
In a preferred embodiment of the present invention, the working temperature of described thermosetting polymer glue is-60-350 DEG C.
In a preferred embodiment of the present invention, the thickness of described thermosetting polymer glue is less than 1mm.
The invention has the beneficial effects as follows: thermosetting polymer glue of the present invention has the advantages such as high temperature resistant, good leveling property, applied widely, stable performance, wide material sources, use safety, thermosetting polymer glue universal on have market outlook widely.
Embodiment
Be clearly and completely described to the technical scheme in the embodiment of the present invention below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
The embodiment of the present invention comprises:
A kind of thermosetting polymer glue, the quality proportioning of composition comprises:
Epoxy resin 15-20 part,
Resol 2-4 part,
Acrylic resin 2-4 part,
Acetone 1-3 part,
Benzene 0-3 part,
Dimethylbenzene 0-3 part,
Propyl carbinol 0-3 part,
Vinylbenzene 0-3 part.
Wherein acetone, benzene, dimethylbenzene, propyl carbinol, vinylbenzene are thinner, and different performance as required and the different carriers of use can be selected to replace different thinners, applied widely.
Preferably, the working temperature of described thermosetting polymer glue is-60-350 DEG C, low temperature resistant, high temperature resistant, corrosion-resistant, good springiness.
Preferably, the thickness of described thermosetting polymer glue is less than 1mm, effectively reduces the probability of cracking, improves work-ing life and cohesive strength.
The beneficial effect of thermosetting polymer glue of the present invention is:
One, by adopting multiple macromolecule resin material and different mixing diluents, form the thermosetting polymer glue of stable and uniform, be uniformly dispersed, good leveling property, stable performance, wide material sources, use safety;
Two, the coat-thickness by controlling colloid is less than 1mm, effectively reduces the probability of cracking, improves work-ing life and cohesive strength.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (3)
1. a thermosetting polymer glue, is characterized in that, the quality proportioning of composition comprises:
Epoxy resin 15-20 part,
Resol 2-4 part,
Acrylic resin 2-4 part,
Acetone 1-3 part,
Benzene 0-3 part,
Dimethylbenzene 0-3 part,
Propyl carbinol 0-3 part,
Vinylbenzene 0-3 part.
2. thermosetting polymer glue according to claim 1, is characterized in that, the working temperature of described thermosetting polymer glue is-60-350 DEG C.
3. thermosetting polymer glue according to claim 1, is characterized in that, the thickness of described thermosetting polymer glue is less than 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510207360.3A CN104789179A (en) | 2015-04-28 | 2015-04-28 | Thermosetting high-polymer adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510207360.3A CN104789179A (en) | 2015-04-28 | 2015-04-28 | Thermosetting high-polymer adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104789179A true CN104789179A (en) | 2015-07-22 |
Family
ID=53554377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510207360.3A Pending CN104789179A (en) | 2015-04-28 | 2015-04-28 | Thermosetting high-polymer adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104789179A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009203337A (en) * | 2008-02-27 | 2009-09-10 | Lintec Corp | Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet, and method for manufacturing semiconductor device |
| CN102850943A (en) * | 2012-09-06 | 2013-01-02 | 吴江市晴亿纺织有限公司 | High strength fiber reinforced plastic adhesive |
| CN102850984A (en) * | 2012-09-19 | 2013-01-02 | 江苏华海诚科新材料有限公司 | Low-stress epoxy resin composition applicable to packaging small-size surface mounted devices |
| CN103525350A (en) * | 2013-10-22 | 2014-01-22 | 湖州中辰建设有限公司 | High-strength glass reinforced plastic adhesive |
-
2015
- 2015-04-28 CN CN201510207360.3A patent/CN104789179A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009203337A (en) * | 2008-02-27 | 2009-09-10 | Lintec Corp | Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet, and method for manufacturing semiconductor device |
| CN102850943A (en) * | 2012-09-06 | 2013-01-02 | 吴江市晴亿纺织有限公司 | High strength fiber reinforced plastic adhesive |
| CN102850984A (en) * | 2012-09-19 | 2013-01-02 | 江苏华海诚科新材料有限公司 | Low-stress epoxy resin composition applicable to packaging small-size surface mounted devices |
| CN103525350A (en) * | 2013-10-22 | 2014-01-22 | 湖州中辰建设有限公司 | High-strength glass reinforced plastic adhesive |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150722 |
|
| RJ01 | Rejection of invention patent application after publication |