CN104877609A - Phenol-formaldehyde resin adhesive - Google Patents
Phenol-formaldehyde resin adhesive Download PDFInfo
- Publication number
- CN104877609A CN104877609A CN201510255019.5A CN201510255019A CN104877609A CN 104877609 A CN104877609 A CN 104877609A CN 201510255019 A CN201510255019 A CN 201510255019A CN 104877609 A CN104877609 A CN 104877609A
- Authority
- CN
- China
- Prior art keywords
- parts
- resin adhesive
- phenol
- formaldehyde resin
- phenolic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a phenol-formaldehyde resin adhesive which is prepared from the following raw materials in parts by weight: 40-60 parts of phenol-formaldehyde resin, 5-20 parts of fluororubber, 20-30 parts of turpentine, 25-40 parts of toluene, 1-5 parts of curing agent, 5-25 parts of barium sulfate, 5-10 parts of talcum powder, 0.5-2 parts of methyl methacrylate and 0.2-2 parts of polyvinyl alcohol. By using the phenol-formaldehyde resin and fluororubber as bonders and adding the methyl methacrylate, polyvinyl alcohol and other assistants, the phenol-formaldehyde resin adhesive has the advantages of favorable bonding property, favorable tensile strength, favorable water resistance and favorable aging resistance, can be widely used for bonding wood, foam plastics and other porous materials, and can also be used for manufacturing plywoods.
Description
Technical field
The present invention relates to sizing agent technical field, especially a kind of phenolic resin adhesive.
Background technology
Resol by phenol and formaldehyde under catalysts conditions through polycondensation, in and, washing and the resin made, there is into carbon high, the feature that resistance to elevated temperatures is good, but cured glue layer is crisp, need temperature-pressure to solidify, other polymer chemistry things conventional improve its performance, can broadened application, the phenolic resin adhesive of modification is mainly used in bonding timber, porous plastics and other porous materials, also can in order to manufacture glued board.
Summary of the invention
The object of this invention is to provide a kind of phenolic resin adhesive, this phenolic resin adhesive can solve the undesirable problem of phenolic resin adhesive adhesive property.
In order to solve the problem, the technical solution used in the present invention is:
Phenolic resin adhesive of the present invention is prepared from by the raw material of following parts by weight: 40 parts ~ 60 parts, resol, viton 5 parts ~ 20 parts, 20 parts ~ 30 parts, turps, toluene 25 parts ~ 40 parts, 1 part ~ 5 parts, solidifying agent, 5 parts ~ 25 parts, barium sulfate, talcum powder 5 parts ~ 10 parts, methyl methacrylate 0.5 part ~ 2 parts, polyvinyl alcohol 0.2 part ~ 2 parts.
In technique scheme, scheme can also be more specifically: solidifying agent is diethylenetriamine or triethylene tetramine.
Further, the relative molecular mass of resol is 500 ~ 1500.
Owing to have employed technique scheme, the present invention compared with prior art has following beneficial effect:
The present invention by resol and viton as sizing, and add the auxiliary agent such as methyl methacrylate and polyvinyl alcohol, prepared sizing agent adhesive property and tensile strength good, water tolerance, ageing-resistant performance are good, bonding timber, porous plastics and other porous materials can be widely used in, also can in order to manufacture glued board.
Embodiment
Below in conjunction with embodiment, the invention will be further described:
Embodiment 1
The present embodiment phenolic resin adhesive is prepared from by following parts by weight component: 50 parts, resol, viton 5 parts, 20 parts, turps, toluene 25 parts, diethylenetriamine 1 part, 5 parts, barium sulfate, talcum powder 5 parts, methyl methacrylate 0.5 part, polyvinyl alcohol 0.2 part; The relative molecular mass of the present embodiment resol is 500.
Embodiment 2
The present embodiment phenolic resin adhesive is prepared from by following parts by weight component: 40 parts, resol, viton 10 parts, 25 parts, turps, toluene 33 parts, diethylenetriamine 3 parts, 15 parts, barium sulfate, talcum powder 8 parts, methyl methacrylate 1 part, polyvinyl alcohol 1 part; The relative molecular mass of the present embodiment resol is 1000.
Embodiment 3
The present embodiment phenolic resin adhesive is prepared from by following parts by weight component: 60 parts, resol, viton 20 parts, 30 parts, turps, toluene 40 parts, triethylene tetramine 5 parts, 25 parts, barium sulfate, talcum powder 10 parts, methyl methacrylate 2 parts, polyvinyl alcohol 2 parts; The relative molecular mass of the present embodiment resol is 1500.
In order to verify the physicochemical property of above-described embodiment phenolic resin adhesive, measure its tensile strength, water tolerance, ageing resistance, solid content, free phenol content and viscosity respectively, measurement result is in table 1:
Table 1 product performance
As seen from the results in Table 1, phenolic resin adhesive tensile strength of the present invention is higher, water-fast, ageing-resistant performance good, and free phenol content is on the low side.
Claims (3)
1. a phenolic resin adhesive, it is characterized in that being prepared from by the raw material of following parts by weight: 40 parts ~ 60 parts, resol, viton 5 parts ~ 20 parts, 20 parts ~ 30 parts, turps, toluene 25 parts ~ 40 parts, 1 part ~ 5 parts, solidifying agent, 5 parts ~ 25 parts, barium sulfate, talcum powder 5 parts ~ 10 parts, methyl methacrylate 0.5 part ~ 2 parts, polyvinyl alcohol 0.2 part ~ 2 parts.
2. phenolic resin adhesive according to claim 1, is characterized in that described solidifying agent is diethylenetriamine or triethylene tetramine.
3. phenolic resin adhesive according to claim 1, is characterized in that the relative molecular mass of described resol is 500 ~ 1500.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510255019.5A CN104877609A (en) | 2015-05-19 | 2015-05-19 | Phenol-formaldehyde resin adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510255019.5A CN104877609A (en) | 2015-05-19 | 2015-05-19 | Phenol-formaldehyde resin adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104877609A true CN104877609A (en) | 2015-09-02 |
Family
ID=53945295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510255019.5A Pending CN104877609A (en) | 2015-05-19 | 2015-05-19 | Phenol-formaldehyde resin adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104877609A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107841269A (en) * | 2017-11-29 | 2018-03-27 | 柳州市鸿联木业有限公司 | The preparation method of low burst size of methanal adhesive |
| CN107936857A (en) * | 2017-12-05 | 2018-04-20 | 北京军秀咨询有限公司 | A kind of environment-friendly type self curable epoxy resin adhesive and preparation method thereof |
| CN108949045A (en) * | 2018-07-28 | 2018-12-07 | 钱万琦 | A kind of based Wood Adhesives |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3300426A (en) * | 1963-08-05 | 1967-01-24 | Goodyear Tire & Rubber | Adhesive composition comprising mixture of a phenol-formaldehyde resin and a polybutadiene rubber latex |
| CN1771311A (en) * | 2003-04-10 | 2006-05-10 | 3M创新有限公司 | Heat-activatable adhesive |
| CN104371571A (en) * | 2014-10-31 | 2015-02-25 | 青岛昌安达药业有限公司 | High-temperature-resistant metal adhesive |
| CN104449463A (en) * | 2014-11-04 | 2015-03-25 | 张桂华 | Stable rubber adhesive |
-
2015
- 2015-05-19 CN CN201510255019.5A patent/CN104877609A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3300426A (en) * | 1963-08-05 | 1967-01-24 | Goodyear Tire & Rubber | Adhesive composition comprising mixture of a phenol-formaldehyde resin and a polybutadiene rubber latex |
| CN1771311A (en) * | 2003-04-10 | 2006-05-10 | 3M创新有限公司 | Heat-activatable adhesive |
| CN104371571A (en) * | 2014-10-31 | 2015-02-25 | 青岛昌安达药业有限公司 | High-temperature-resistant metal adhesive |
| CN104449463A (en) * | 2014-11-04 | 2015-03-25 | 张桂华 | Stable rubber adhesive |
Non-Patent Citations (2)
| Title |
|---|
| 胡新嵩等: "氟橡胶概述", 《广东化工》 * |
| 黄世强等: "《胶粘剂及其工程应用》", 31 July 2006 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107841269A (en) * | 2017-11-29 | 2018-03-27 | 柳州市鸿联木业有限公司 | The preparation method of low burst size of methanal adhesive |
| CN107936857A (en) * | 2017-12-05 | 2018-04-20 | 北京军秀咨询有限公司 | A kind of environment-friendly type self curable epoxy resin adhesive and preparation method thereof |
| CN108949045A (en) * | 2018-07-28 | 2018-12-07 | 钱万琦 | A kind of based Wood Adhesives |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100582135C (en) | Method for preparing post-crosslinking modified urea-formaldehyde resin adhesive | |
| JP7511485B2 (en) | Process for preparing the binding resin | |
| US11268000B2 (en) | Aqueous adhesive composition comprising a ithermosetting resin | |
| RU2014102888A (en) | ADHESIVE ADDITIVE | |
| EP3510117A1 (en) | Glyoxalated lignin compositions | |
| CN104877609A (en) | Phenol-formaldehyde resin adhesive | |
| CN105593258B (en) | aqueous adhesive composition for bonding | |
| CN102994027B (en) | Phenolic resin adhesive | |
| CN102875960B (en) | Macromolecular composite phenolic aldehyde material filled with glass beads | |
| CN106738179A (en) | A kind of Fibreboard Production additive | |
| CN116419954A (en) | Lignin-based binding resins | |
| Zhang et al. | Urea formaldehyde resin with low formaldehyde content modified by phenol formaldehyde intermediates and properties of its bamboo particleboards | |
| US5459207A (en) | Resorcinol resin adhesive composition | |
| CN103951806A (en) | Low molecular weight phenolic resin impregnation liquid for manufacturing sticky membrane paper and preparation method of low molecular weight phenolic resin impregnation liquid | |
| CN114958298A (en) | High-coating prepressing-property vegetable protein adhesive and preparation method and application thereof | |
| CN104059580A (en) | Formaldehyde-free phenolic resin binder and preparation method thereof | |
| JP2016175970A (en) | Prepreg and laminate sheet using the same | |
| CN102994028A (en) | Phenolic resin adhesive for plywood | |
| CN114008168A (en) | Method for producing adhesive resin | |
| JP2010116440A (en) | Wet type paper frictional material | |
| CN104842434A (en) | Composite fiber board and manufacturing method thereof | |
| CN105400467A (en) | High-bonding-strength low-formaldehyde-emission adhesive for glued boards | |
| KR20150012800A (en) | Reinforcement of fiberboard physical properties by using of TMGU in Super E0 grade amino (UF, UMF) resin | |
| CN107619649A (en) | A kind of phenolic resin adhesive | |
| CN103059771A (en) | Phenolic resin plywood glue and formula thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150902 |
|
| RJ01 | Rejection of invention patent application after publication |